Nanoparticle printing and parallel sintering device and method

Abstract

A nanoparticle printing and parallel sintering device and method comprises a laser sintering mechanism electrically connected to a control mechanism, a nanoparticle generation and printing mechanism, a vacuum deposition chamber, a mobile platform, and a CDD high-resolution camera. The mobile platform is located within the vacuum deposition chamber and is used to place a printing substrate. The laser sintering mechanism and the nanoparticle generation and printing mechanism are located above the mobile platform. The nanoparticle generation and printing mechanism is used to generate nanoparticles and print them onto the printing substrate to form nanoparticle circuits, and the laser sintering mechanism is used to laser sinter the nanoparticle circuits. The present invention can print any conductive or semiconductor material on any substrate, achieving point, line, surface, and patterned printing while simultaneously tracking the sintering and depositing of particles. It has applications in fields such as electrocatalysis, chemistry, optics, or biosensing, as well as battery and microelectronic product packaging and manufacturing.

Description

Technical Field

[0001] The present invention relates to the fields of additive manufacturing technology and nanomaterial technology, and in particular to a device and method for printing and sintering nanoparticles in parallel. Background Art

[0002] In order to achieve ultra-precision electronic circuit manufacturing, break the bottleneck of traditional circuit manufacturing process, print the circuit directly on the surface of the product structure, and realize the integrated printing and sintering process, which has always been a hot topic of research today.

[0003] Although nanoparticle deposition printing technology has been applied, these methods still have many disadvantages, mainly including the following: (1) the ink aerosol jet method uses a nozzle that is easily clogged, has a coffee ring effect, is not precise, and requires a cumbersome process of removing and recovering solvents and surfactants after deposition; (2) the deposited samples of the current dry aerosol nanoparticle printer need to be taken out and transferred to other instruments for the next process, which makes the samples easily contaminated and inefficient; (3) when the laser is fully focused on the nozzle printing point, the continuity of the circuit cannot be guaranteed. In summary, the current circuit printing method cannot achieve high-precision, high-performance and reliable electronic circuits. Summary of the Invention

[0004] In response to the problems raised in the background technology, the purpose of the present invention is to propose a nanoparticle printing and parallel sintering device and method, which solves the problems of low manufacturing efficiency and low electronic circuit precision in the existing deposition printing technology.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] A nanoparticle printing and parallel sintering device, comprising a laser sintering mechanism, a nanoparticle generation and printing mechanism, a vacuum deposition chamber, a moving platform, a CCD high-resolution camera, and a control mechanism;

[0007] The movable platform is provided in the vacuum deposition chamber, and the movable platform is used for placing a printing substrate;

[0008] The laser sintering mechanism and the nanoparticle generation and printing mechanism are arranged above the mobile platform, the nanoparticle generation and printing mechanism is used to generate nanoparticles and print the nanoparticles onto the printing substrate to form nanoparticle circuits, and the laser sintering mechanism is used to laser sinter the nanoparticle circuits;

[0009] The CCD high-resolution camera is used to observe the printed substrate and establish a relative coordinate system of the printed circuit;

[0010] The laser sintering mechanism, the nanoparticle generation and printing mechanism, the vacuum deposition chamber, the moving platform and the CCD high-resolution camera are electrically connected to the control mechanism respectively.

[0011] Preferably, the nanoparticle generation and printing mechanism comprises a dry aerosol printing nozzle, a spark ablation assembly, a carrier gas flow controller and a carrier gas cylinder;

[0012] The dry aerosol printing nozzle is connected to the spark ablation component, and the spark ablation component is connected to the carrier gas cylinder through the carrier gas flow controller.

[0013] Preferably, the laser sintering mechanism includes a micro-motion platform, a mounting bracket and a laser sintering head;

[0014] The laser sintering head is mounted on the micro-motion platform via the mounting bracket, and the micro-motion platform is used to allow the laser sintering head to follow the nanoparticle circuit to complete sintering.

[0015] Preferably, the diameter of the dry aerosol printing nozzle is 1-100 μm;

[0016] The total laser power of the laser sintering mechanism is 100-9000 mW, and the laser wavelength of the laser sintering mechanism is 527-980 nm.

[0017] Preferably, the vacuum deposition chamber comprises a steel deposition chamber, a vacuum pump, a three-way solenoid valve and a sensor;

[0018] The three-way solenoid valve is provided at the air inlet of the steel deposition chamber, and the three-way solenoid valve is used to assist the dry aerosol printing nozzle in printing;

[0019] The vacuum pump is connected to the gas outlet of the steel deposition chamber, and the vacuum pump is used to discharge the gas inside the steel deposition chamber;

[0020] The sensor is arranged inside the steel deposition chamber, and is used to detect the vacuum degree or oxygen concentration inside the steel deposition chamber.

[0021] Preferably, the mobile platform comprises a base, a heating component, an electric-assisted deposition component and a three-degree-of-freedom mobile component;

[0022] The three-degree-of-freedom moving assembly is installed at the bottom of the inner cavity of the steel deposition chamber, the base is installed on the upper surface of the three-degree-of-freedom moving assembly, the heating assembly is used to heat the base, and the upper surface of the base is provided with a clamping assembly;

[0023] The negative pole of the power supply of the electric assisted deposition assembly is connected to the base, and the positive pole of the power supply of the electric assisted deposition assembly is connected to the steel deposition chamber.

[0024] Preferably, the three-degree-of-freedom moving assembly includes an X-axis moving unit, a Y-axis moving unit and a Z-axis moving unit, the effective stroke of the X-axis moving unit is 170 mm, the effective stroke of the Y-axis moving unit is 100 mm, and the effective stroke of the Z-axis moving unit is 30 mm.

[0025] A method for nanoparticle printing and parallel sintering, using the above-mentioned nanoparticle printing and parallel sintering device, comprises the following steps:

[0026] Step 1: Input the printing circuit into the control mechanism, place the substrate to be printed on the mobile platform, and evacuate the air from the vacuum deposition chamber;

[0027] Step 2: Observe the printed substrate through a CCD high-resolution camera and establish a relative coordinate system for the printed circuit; the laser sintering mechanism is adjusted to the initial sintering position according to the printed circuit;

[0028] Step 3: Start printing and sintering: The nanoparticle generation printing mechanism gathers a dry aerosol particle beam through the dry aerosol printing nozzle and deposits it on the printing substrate. The printing platform drives the printing substrate to move according to the printing circuit so that the dry aerosol particle beam forms a nanoparticle circuit. The electrically assisted deposition component assists in the adsorption of the charged dry aerosol particles. The laser sintering head sprays a laser beam to sinter the deposited nanoparticle circuit to form a sintered circuit, realizing deposition and sintering in parallel steps. The heating component assists in sintering the nanoparticle circuit.

[0029] Step 4: After the deposition and sintering work is completed, the printed circuit is cleaned with a carrier gas flow to remove loose nanoparticles, and multiple ventilation and cleaning cycles are carried out by cooperating with a three-way solenoid valve and a vacuum pump to remove the remaining nanoparticles from the vacuum deposition chamber.

[0030] Preferably, the particle size of the nanoparticles printed by the dry aerosol printing nozzle is 1-20 nm;

[0031] The radius of the laser spot of the laser sintering mechanism is 1-3 nm.

[0032] Preferably, the operating pressure of the vacuum deposition chamber is 0.2-1 mbar;

[0033] The maximum operating temperature of the heating component is 400° C., and the maximum heating rate of the heating component is 5° C. / min.

[0034] Compared with the prior art, one of the above technical solutions has the following beneficial effects:

[0035] 1. The nanoparticle printing and parallel sintering device of the present invention utilizes a laser sintering mechanism to generate aerosol jet printing nanoparticles through a nanoparticle generation and printing mechanism, thus avoiding the nozzle clogging that is easily caused by ink printing. It also utilizes a spark ablation component to generate nanoparticles with smaller particle sizes and realizes precise nanoparticle printing through the cooperation of a precise mobile platform.

[0036] 2. The nanoparticle printing and parallel sintering method of the present invention realizes the integration of nanoparticle manufacturing, selective deposition, and sintering functions. Nanoparticles are deposited from the nozzle onto the printing substrate and then sintered using a laser. No post-processing process is required, which greatly improves processing efficiency and ensures that the sample is not contaminated. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a schematic diagram of the printing and sintering working process of the present invention.

[0038] Figure 2 It is a schematic diagram of the overall structure of the present invention.

[0039] Figure 3 This is a schematic diagram of the printing results of Example 1 of the present invention.

[0040] Figure 4 This is a microscopic morphology diagram after printing of Example 4 of the present invention.

[0041] Figure 5 This is a TEM image of nanoparticle printing according to an embodiment of the present invention and a partially enlarged image thereof.

[0042] Among them: laser sintering mechanism 1, laser beam 101, sintering circuit 102, micro-motion platform 11, mounting bracket 12, laser sintering head 13, nanoparticle generation printing mechanism 2, dry aerosol particle beam 201, nanoparticle circuit 202, dry aerosol printing nozzle 21, spark ablation component 22, carrier gas flow controller 23, carrier gas cylinder 24, vacuum deposition chamber 3, steel deposition chamber 31, vacuum pump 32, three-way solenoid valve 33, moving platform 4, base 41, heating component 42, electrically assisted deposition component 43, three-degree-of-freedom moving component 44, CCD high-resolution camera 5 and control mechanism 6. DETAILED DESCRIPTION

[0043] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0044] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0045] Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or to implicitly specify the quantity of the technical features being referred to. Thus, a feature identified as "first," "second," and "third" may explicitly or implicitly include one or more of the features.

[0046] It should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0047] The following is combined with Figures 1 to 5 The technical solution of the present invention is further illustrated through specific implementation methods.

[0048] A nanoparticle printing and parallel sintering device includes a laser sintering mechanism 1, a nanoparticle generation and printing mechanism 2, a vacuum deposition chamber 3, a moving platform 4, a CCD high-resolution camera 5, and a control mechanism 6;

[0049] The movable platform 4 is provided in the vacuum deposition chamber 3 and is used for placing the printing substrate;

[0050] The laser sintering mechanism 1 and the nanoparticle generation and printing mechanism 2 are arranged above the mobile platform 4. The nanoparticle generation and printing mechanism 2 is used to generate nanoparticles and print the nanoparticles onto the printing substrate to form a nanoparticle circuit 202. The laser sintering mechanism 1 is used to laser sinter the nanoparticle circuit 202.

[0051] The CCD high-resolution camera 5 is used to observe the printed substrate and establish a relative coordinate system of the printed circuit;

[0052] The laser sintering mechanism 1 , the nanoparticle generation and printing mechanism 2 , the vacuum deposition chamber 3 , the moving platform 4 and the CCD high-resolution camera 5 are electrically connected to the control mechanism 6 , respectively.

[0053] The present invention integrates a laser sintering mechanism 1 and a nanoparticle generation and printing mechanism 2 to achieve direct generation and printing of nanoparticles, accompanied by laser sintering processing. This parallel processing method not only avoids the problems of nozzle clogging and coffee ring effect in traditional methods, but also can perform instant sintering while the nanoparticles are deposited, thereby ensuring the continuity and high precision of the nanoparticle circuit and improving the performance and reliability of the final electronic circuit.

[0054] This nanoparticle printing and sintering device incorporates a built-in laser sintering function, enabling nanoparticle deposition and sintering to be completed within the same vacuum deposition chamber (3). This eliminates the need to remove the deposited sample to a separate instrument for subsequent processing. This not only simplifies the process but also reduces the risk of sample contamination during transfer, improving production efficiency and product cleanliness.

[0055] A high-resolution CCD camera 5 is used to observe the printed substrate and establish a relative coordinate system for the printed circuit. It also records the printing and sintering conditions on the mobile platform in real time, providing high-precision feedback to the control mechanism 6. This real-time recording mechanism enables the system to adjust printing parameters and sintering conditions in a timely manner, ensuring optimal deposition and sintering of nanoparticles in each layer, further improving product quality and consistency.

[0056] Through the centralized control and management of each component by the control mechanism 6, the entire printing and sintering process is automated. This not only reduces the skill requirements for operators, but also improves production efficiency and stability, making the nanoparticle printing and parallel sintering technology more suitable for large-scale industrial applications.

[0057] The design of the vacuum deposition chamber 3 effectively isolates the external environment from the printing process, reducing the interference of impurities and moisture in the air on nanoparticle deposition, further improving the purity and reliability of the product. This is particularly important for manufacturing high-performance, high-precision electronic circuits.

[0058] Furthermore, the nanoparticle generation and printing mechanism 2 includes a dry aerosol printing nozzle 21, a spark ablation assembly 22, a carrier gas flow controller 23 and a carrier gas cylinder 24;

[0059] The dry aerosol printing nozzle 21 is connected to the spark ablation component 22 , and the spark ablation component 22 is connected to the carrier gas cylinder 24 through the carrier gas flow controller 23 .

[0060] The spark ablation assembly 22 ablates the target material using high-energy sparks, producing high-quality nanoparticles. Compared to other production methods, such as solution-based methods or mechanical grinding, this method is more direct and efficient in obtaining nanoparticles with uniform particle size distribution and high purity. The generated nanoparticles are directly ejected from the print nozzle 21 in the form of a dry aerosol, eliminating the need for solvents and surfactants, simplifying subsequent processing steps, and reducing the introduction of potential contaminants.

[0061] The carrier gas flow controller 23 can accurately control the flow rate and pressure of the carrier gas, thereby adjusting the injection speed and concentration of the nanoparticles. This precise control helps to achieve uniform deposition of nanoparticles on the printed substrate and improve the accuracy and consistency of the printed circuit. The design of the carrier gas cylinder 24 allows the user to replace different types of carrier gases as needed to adapt to different nanoparticle generation and printing conditions, thereby improving the adaptability and flexibility of the equipment. The coordinated work of the spark ablation component 22 and the carrier gas flow controller 23 makes the generation and printing process of nanoparticles more stable and controllable, which helps to cope with different materials and printing requirements. By replacing different target materials for ablation in the spark ablation component, various types of nanoparticles can be flexibly generated to meet the needs of different electronic circuit manufacturing.

[0062] Preferably, the air flow rate of the carrier gas flow controller 23 is 1.2-10 L / min; the inner diameter of the electrode of the spark ablation component 22 is 1-50 mm, and the wall thickness is 1-20 mm; the pulse voltage of the spark ablation component 22 is 0.1-20 kV, and the frequency is 10-200 Hz.

[0063] Preferably, the target material is a single substance or alloy material, including conductive metal materials such as lithium, beryllium, carbon, magnesium, aluminum, calcium, vanadium, chromium, manganese, iron, cobalt, nickel, silver, tin, semiconductor materials such as boron and silicon, and alloy materials such as Au / Pd and Ag / Cu.

[0064] Furthermore, the diameter of the dry aerosol printing nozzle 21 is 1-100 μm, and the particle size of the nanoparticles is 1-20 nm.

[0065] The diameter of the dry aerosol printing nozzle 21 is controlled within the range of 1-100 μm, allowing for more precise control of the ejection direction and flow rate of the nanoparticles, thereby achieving higher-precision printing. This high-precision nozzle design helps form more delicate and uniform nanoparticle circuits on the printed substrate, improving the manufacturing accuracy of electronic circuits.

[0066] Controlling the nanoparticle size within the 1-20nm range gives the nanoparticles a higher specific surface area and surface activity, facilitating their attachment and deposition on the printed substrate. These small-sized nanoparticles can be packed more tightly together, forming dense nanoparticle circuits, which improve their conductivity and stability.

[0067] Small-sized nanoparticles have higher surface energy and shorter diffusion distances during sintering, which allows them to be effectively sintered at lower temperatures. Therefore, the nanoparticle size setting in this technical solution helps to lower the sintering temperature, reduce energy consumption, and improve sintering efficiency.

[0068] Furthermore, the laser sintering mechanism 1 includes a micro-motion platform 11, a mounting bracket 12, and a laser sintering head 13;

[0069] The laser sintering head 13 is mounted on the micro-motion platform 11 through the mounting bracket 12 . The micro-motion platform 11 is used to allow the laser sintering head 13 to follow the nanoparticle circuit to complete sintering.

[0070] The laser sintering head 13 is stably mounted on the micro-motion platform 11 via a mounting bracket 12. This robust structural design reduces vibration and shaking during the sintering process, thereby ensuring the stability of the sintering process and the reliability of the sintering quality. A stable sintering process helps reduce sintering defects and the occurrence of defective products, thereby improving the product qualification rate. By mounting the laser sintering head 13 on the micro-motion platform 11, high-precision movement of the laser sintering head can be achieved. The micro-motion platform 11 has a small stepping capability and high-precision positioning control, ensuring that the laser sintering head 13 accurately follows the nanoparticle circuit 202 during sintering, avoiding deviation and misalignment during the sintering process, thereby improving sintering accuracy and consistency. The introduction of the micro-motion platform 11 enables the laser sintering head 13 to be flexibly adjusted to the different shapes and paths of the nanoparticle circuit 202. This flexibility enables the device to adapt to a variety of complex sintering requirements, including curved, broken lines, and irregularly shaped nanoparticle circuits, thereby broadening the device's application range. Since the laser sintering head 13 can closely follow the nanoparticle circuit 202 for sintering, the generation of ineffective sintering areas is reduced, and the utilization rate of materials and the sintering efficiency are further improved.

[0071] Furthermore, the total laser power of the laser sintering mechanism 1 is 100-9000 mW, the laser wavelength of the laser sintering mechanism 1 is 527-980 nm, and the radius of the laser spot of the laser sintering mechanism 1 is 1-3 nm.

[0072] Laser sintering mechanism 1 utilizes a flat-top laser with a total laser power set between 100 and 9000 mW, providing sufficient energy input for the sintering process. Higher laser power accelerates the melting and consolidation of the nanoparticles, shortening sintering time and improving sintering efficiency. Sufficient energy also ensures a good metallurgical bond between the nanoparticles, enhancing the sintering effect and resulting in higher conductivity and mechanical strength for the sintered nanoparticle circuits.

[0073] The laser wavelength is set in the range of 527-980nm, which matches the absorption characteristics of many materials; metal materials have a high absorption rate for short-wavelength lasers, such as blue light and green light. Selecting the right laser wavelength can ensure that the laser energy is effectively absorbed by the nanoparticles, reducing energy loss and reflection, thereby improving the uniformity and consistency of sintering. In addition, lasers of specific wavelengths may also produce specific physical and chemical effects on certain materials, further optimizing the sintering quality. The radius of the laser spot is set to 1-3nm, achieving an extremely small spot size, which is consistent with the precision of the nanoparticle circuit 202, avoiding repeated sintering that may cause circuit defects and ensuring that the circuit is sintered once. The small spot means that the laser energy can act more concentratedly on the nanoparticles, reducing energy diffusion and thermal effects on adjacent areas. This helps to achieve high-precision sintering control and ensure the precise forming and positioning of the nanoparticle circuit at the micron or even nanometer scale.

[0074] Proper laser parameter settings help ensure stable operation and safety of the device. Excessive laser power or inappropriate wavelength selection can cause equipment damage or safety hazards. Proper parameter settings can mitigate these risks while ensuring sintering results. By adjusting parameters such as total laser power, wavelength, and spot radius, the laser sintering mechanism can adapt to sintering processes for different materials and printing requirements. This flexibility opens up a wide range of applications in ultra-precision electronic circuit manufacturing, micro-nano device processing, and other fields.

[0075] Furthermore, the vacuum deposition chamber 3 includes a steel deposition chamber 31, a vacuum pump 32, a three-way solenoid valve 33 and a sensor;

[0076] The three-way solenoid valve 33 is provided at the air inlet of the steel deposition chamber 31 , and the three-way solenoid valve 33 is used to assist the dry aerosol printing nozzle 21 in printing;

[0077] The vacuum pump 32 is connected to the gas outlet of the steel deposition chamber 31 , and the vacuum pump 32 is used to discharge the gas inside the steel deposition chamber 31 ;

[0078] The sensor is disposed inside the steel deposition chamber 31 , and is used to detect the vacuum degree and / or oxygen concentration inside the steel deposition chamber 31 .

[0079] The introduction of the vacuum deposition chamber 3 provides a low-oxygen, low-impurity deposition environment for nanoparticle printing. By exhausting the gas inside the steel deposition chamber 31 through a vacuum pump 32, the oxygen concentration and impurity content within the chamber can be significantly reduced, reducing the reaction of the nanoparticles with oxygen or other gases during the printing process, thereby improving the purity and quality of the printed nanoparticle circuits. Sintering in a vacuum environment helps reduce oxidation and contamination of the nanoparticles during the sintering process, improving the conductivity and stability of the sintered nanoparticle circuits. Furthermore, the vacuum environment helps lower the sintering temperature and reduces energy consumption.

[0080] The three-way solenoid valve 33 effectively assists the dry aerosol printing nozzle 21 during the printing process. By controlling the on / off state of the three-way solenoid valve 33, the gas flow and pressure entering the steel deposition chamber 31 can be adjusted, thereby optimizing the nanoparticle injection effect and deposition quality. Furthermore, the introduction of sensors enables real-time monitoring of the vacuum level and oxygen concentration within the steel deposition chamber 31, providing accurate data support for adjusting process parameters and further enhancing process controllability.

[0081] The sealed design of the vacuum deposition chamber 3 and the continuous operation of the vacuum pump 32 ensure a constant vacuum level within the chamber, preventing external gases and impurities from interfering with the printing and sintering processes. Furthermore, the sensor's monitoring function promptly detects and addresses abnormalities such as insufficient vacuum or excessive oxygen concentration, thereby ensuring stable operation and safety of the equipment.

[0082] Furthermore, the operating pressure of the vacuum deposition chamber 3 is 0.2-1 mbar.

[0083] At lower pressures, nanoparticles experience less diffusion and collision in the air, allowing them to be more accurately deposited on the printed substrate. This helps improve printing accuracy and resolution, resulting in finer, more uniform nanoparticle circuits. A suitable vacuum environment helps lower sintering temperatures because, under vacuum conditions, nanoparticles come into closer contact, accelerating diffusion and reaction rates. This not only reduces energy consumption but also shortens sintering time, improving production efficiency. Furthermore, lower sintering temperatures help minimize grain growth and deformation of the nanoparticles, preserving their original microstructure and properties.

[0084] By monitoring and adjusting the pressure of the vacuum deposition chamber 3 , it is possible to ensure that each printing and sintering process is performed under optimal conditions, thereby improving the consistency and reliability of the product.

[0085] Furthermore, the mobile platform 4 includes a base 41, a heating component 42, an electric assisted deposition component 43 and a three-degree-of-freedom moving component 44;

[0086] The three-degree-of-freedom moving assembly 44 is installed at the bottom of the inner cavity of the steel deposition chamber 31, and the base 41 is installed on the upper surface of the three-degree-of-freedom moving assembly 44. The heating assembly 42 is used to heat the base 41. The upper surface of the base 41 is provided with a clamping assembly;

[0087] The negative pole of the power supply of the electric-assisted deposition assembly 43 is connected to the base 41 , and the positive pole of the power supply of the electric-assisted deposition assembly 43 is connected to the steel deposition chamber 31 .

[0088] The installation of a three-degree-of-freedom motion assembly 44 (typically a platform capable of movement in the X, Y, and Z directions) enables precise position adjustment and dynamic control of the printing substrate mounted on base 41 according to the desired printing path. This flexibility ensures that nanoparticles are precisely printed and sintered along the desired path and shape, improving product accuracy and consistency.

[0089] The introduction of the heating component 42 provides a controllable heating environment for the base 41. By adjusting the temperature of the heating component 42, the temperature conditions during the sintering process can be precisely controlled to adapt to the sintering requirements of different nanoparticle materials. This helps to reduce defects such as thermal stress and cracks during the sintering process and improve the quality of the sintered body. The addition of the electric-assisted deposition component 43 can promote the deposition and adhesion of nanoparticles on the base 41 by providing an electric field between the base 41 and the steel deposition chamber 31. The action of the electric field can accelerate the migration and aggregation of nanoparticles to the base 41, making the deposition process more uniform and dense. This helps to improve the quality and thickness of the deposited layer and enhance the mechanical properties and conductive properties of the sintered body.

[0090] Furthermore, the three-degree-of-freedom moving assembly 44 includes an X-axis moving unit, a Y-axis moving unit, and a Z-axis moving unit. The effective stroke of the X-axis moving unit is 170 mm, the effective stroke of the Y-axis moving unit is 100 mm, and the effective stroke of the Z-axis moving unit is 30 mm.

[0091] The maximum operating temperature of the heating component 42 is 400° C., and the maximum heating rate of the heating component 42 is 5° C. / min.

[0092] The three-degree-of-freedom moving assembly 44 includes X-axis, Y-axis and Z-axis moving units, and the effective strokes of each axis are 170mm, 100mm and 30mm respectively. These specific stroke parameters provide sufficient movement range and flexibility for the printing and sintering process. The X-axis and Y-axis moving units are equipped with linear motors and piezoelectric ceramic macro-micro composite drives with a positioning accuracy of ±1nm, and the Z-axis moving unit is equipped with a stepper motor with a positioning accuracy of ±10μm. The large strokes of the X-axis and Y-axis allow precise two-dimensional printing in a larger working area, while the stroke of the Z-axis supports fine-tuning in the vertical direction to accommodate the deposition requirements of nanoparticles of different thicknesses and shapes. This flexibility enables the device to handle more complex printing and sintering tasks.

[0093] The maximum operating temperature of the heating assembly 42 is 400°C, which covers the sintering temperature range of a wide range of nanoparticle materials. Precisely controlling the temperature of the heating assembly 42 ensures the sintering process is carried out under optimal conditions, thereby improving the quality and performance of the sintered product. The maximum heating rate of the heating assembly 42 is 5°C / min, which helps achieve a smooth temperature increase and reduces the adverse effects of sudden temperature changes on the nanoparticles and sintered product.

[0094] By precisely controlling the position and speed of the mobile platform 4 and the temperature of the heating assembly 42, equipment failures and safety incidents can be reduced. In addition, these parameters also help achieve automated control and remote monitoring of the equipment, improving production efficiency and safety.

[0095] Clear parameter settings make this nanoparticle printing and sintering device suitable for printing and sintering a wider variety of nanoparticle materials and complex structures. Whether it's microelectronic devices requiring high-precision printing or ceramic materials requiring high-temperature sintering, the device's parameters can be adjusted to meet production needs. This broadens the device's application range and market prospects.

[0096] Reference Figure 1A nanoparticle printing and parallel sintering device includes a laser sintering mechanism 1, a nanoparticle generation and printing mechanism 2, a vacuum deposition chamber 3, a mobile platform 4, a CCD high-resolution camera 5, and a control mechanism 6. The laser sintering head 13 of the laser sintering mechanism 1 is mounted on a micro-motion platform 11 via a mounting bracket 12. The laser sintering head 13 and the micro-motion platform 11 are connected to the control mechanism 6 via a signal transmission line to control their power, switching, etc. The dry aerosol printing nozzle 21 of the nanoparticle generation and printing mechanism 2 is connected to a carrier gas flow controller 23 via an air pipe, and finally to a carrier gas cylinder 24 via an air pipe. The CCD high-resolution camera 5 is connected to the control mechanism 6 via a signal transmission line to establish a relative coordinate system and observe the printing process. The mobile platform 4 is located within the vacuum deposition chamber 3. The base 41 of the mobile platform 4 is equipped with a heating component 42 and an electric-assisted deposition component 43, and the base 41 is mounted on a three-degree-of-freedom mobile component 44.

[0097] Reference Figure 2 Nanoparticles are generated by the spark ablation component 22 and mixed with the carrier gas through the carrier gas flow controller 23 and the carrier gas cylinder 24 to form dry aerosol particles. The dry aerosol particles are ejected into a dry aerosol particle beam 201 through the dry aerosol printing nozzle 21. The control mechanism 6 controls the movement of the movable platform 4 according to the printing circuit (printing pattern). The dry aerosol particle beam 201 is deposited on the printing substrate to form a nanoparticle circuit 202. The electric assisted deposition component 43 assists in the adsorption of the charged dry aerosol particles. While the nanoparticles are being deposited, the laser sintering head 13 emits a laser beam 101 to follow the nanoparticle circuit 202 for sintering, and the heating component 42 is used to assist in the sintering.

[0098] A method for printing and sintering nanoparticles in parallel, comprising the following steps:

[0099] Step 1: Input the printing circuit into the control mechanism 6, place the substrate to be printed on the movable platform 4, and evacuate the air from the vacuum deposition chamber 3;

[0100] Step 2: Observe the printed substrate through the CCD high-resolution camera 5 and establish a relative coordinate system for the printed circuit; the laser sintering mechanism 1 is adjusted to the initial sintering position according to the printed circuit;

[0101] Step 3: Start printing and sintering: The nanoparticle generation printing mechanism 2 gathers a dry aerosol particle beam 201 through the dry aerosol printing nozzle 21 and deposits it on the printing substrate. The printing platform drives the printing substrate to move according to the printing circuit, so that the dry aerosol particle beam 201 forms a nanoparticle circuit 202. The electrically assisted deposition component 43 assists in the adsorption of the charged dry aerosol particles. The laser sintering head 13 ejects a laser beam 101 to sinter the deposited nanoparticle circuit to form a sintered circuit 102, achieving step-by-step deposition and sintering. The heating component 42 assists in sintering the nanoparticle circuit 202.

[0102] Step 4: After the deposition and sintering work is completed, the printed circuit is cleaned with a carrier gas flow to remove loose nanoparticles, and multiple ventilation and cleaning cycles are carried out through the cooperation of the three-way solenoid valve 33 and the vacuum pump 32 to remove the remaining nanoparticles from the vacuum deposition chamber 3.

[0103] Example 1

[0104] Printing copper lines on a copper board, the steps are as follows:

[0105] (1) The target line width is 50 nm and the line thickness is 100 nm. A CAD pattern is designed according to the printing requirements. The CAD pattern is uploaded to the control mechanism 6. The control mechanism 6 sets the moving speed of the mobile platform 4 to 10 nm / s, the deposition mode to single scan, the spacing between the base 41 and the dry aerosol printing nozzle 21 to 110 nm, the aperture of the dry aerosol printing nozzle 21 to 120 nm, the heating rate of the heating component 42 to 5 ° C / min, and the maximum rising temperature to 220 ° C;

[0106] (2) Open the steel deposition chamber 31 and place a 1×1 mm copper plate on the base 41, clamp it with a spring sheet, close the steel deposition chamber 31, turn on the vacuum pump 32, and start evacuating the steel deposition chamber 31 to achieve negative pressure;

[0107] (3) Install a pair of copper electrodes into the spark ablation assembly 22, turn on the spark ablation assembly 22, wait for the voltage and current parameters to stabilize, and then start printing through the control mechanism 6;

[0108] (4) First, the copper plate is observed by the CCD high-resolution camera 5 to establish a relative coordinate system. Printing is performed according to the target line. While printing, the laser sintering head 13 is aligned with the deposited part to sinter. The heating component 42 is heated to the preset temperature during printing. When printing and sintering are completed, the work platform is reset;

[0109] (5) After the circuit is printed, turn off the spark ablation assembly 22, turn off the vacuum pump 32, wait for the chamber to cool down, increase the pressure to room temperature, and take out the sample.

[0110] SEM electron microscopy showed that the nano-copper wire width of the sample was 45nm and the wire thickness was 90nm.

[0111] Example 2

[0112] Print silver wire circuit on PI, the steps are as follows:

[0113] (1) The target line width is 40 nm and the line thickness is 90 nm. A CAD pattern is designed according to the printing requirements. The CAD pattern is uploaded to the control mechanism 6. The control mechanism 6 sets the printing speed to 10 nm / s, the deposition mode to single scan, the spacing between the base 41 and the dry aerosol printing nozzle 21 to 110 nm, the aperture of the dry aerosol printing nozzle 21 to 120 nm, the heating rate of the heating component 42 to 5 ° C / min, and the maximum rising temperature to 150 ° C;

[0114] (2) Open the steel deposition chamber 31 and place the 1×1 mm PI on the substrate, fix it with the spring sheet, close the steel deposition chamber 31, turn on the vacuum pump 32, and start vacuuming to achieve negative pressure in the vacuum chamber;

[0115] (3) Install a pair of silver electrodes into the spark ablation assembly 22, turn on the spark ablation assembly 22, and wait for the voltage and current parameters to stabilize before starting printing through the control mechanism 6;

[0116] (4) First, the PI is observed by the CCD high-resolution camera 5 to establish a relative coordinate system. Printing is performed according to the target line. While printing, the laser sintering head 13 is aligned with the deposited part to sinter. The heating component 42 is heated to the preset temperature during printing. When printing and sintering are completed, the mobile platform 4 is reset.

[0117] (5) After the circuit is printed, turn off the spark ablation assembly 22, turn off the vacuum pump 32, wait for the chamber to cool down, increase the pressure to room temperature, and take out the sample.

[0118] SEM electron microscopy characterization showed that the nanosilver line width of the sample was 40nm and the line thickness was 90nm. The resistivity was measured by four-point probe method and was 10.28μΩ·cm.

[0119] Example 3

[0120] Printing silver lines on PET, the steps are as follows:

[0121] (1) The target line width is 35 nm and the line thickness is 75 nm. A CAD pattern is designed according to the printing requirements. The CAD pattern is uploaded to the control mechanism 6. The control mechanism 6 sets the printing speed to 10 nm / s, the deposition mode to single scan, the spacing between the base 41 and the dry aerosol printing nozzle 21 to 110 nm, the diameter of the dry aerosol printing nozzle 21 to 120 nm, the heating rate of the heating component 42 to 5 ° C / min, and the maximum rising temperature to 180 ° C;

[0122] (2) Open the steel deposition chamber 31 and place the 1×1 mm PET on the substrate, fix it with the spring sheet, close the steel deposition chamber 31, turn on the vacuum pump 32, and start vacuuming to achieve negative pressure in the vacuum chamber;

[0123] (3) Install a pair of silver electrodes into the spark ablation assembly 22, turn on the spark ablation assembly 22, and wait for the voltage and current parameters to stabilize before starting printing through the control mechanism 6;

[0124] (4) First, the PET is observed by the CCD high-resolution camera 5 to establish a relative coordinate system. Printing is performed according to the target line. While printing, the laser sintering head 13 is aligned with the deposited part to sinter it. The heating component 42 is heated to a preset temperature during printing. When printing and sintering are completed, the mobile platform 4 is reset.

[0125] (5) After the circuit is printed, turn off the spark ablation assembly 22, turn off the vacuum pump 32, wait for the chamber to cool down, increase the pressure to room temperature, and take out the sample.

[0126] SEM electron microscopy characterization showed that the nanosilver line width of the sample was 35nm and the line thickness was 75nm. The resistivity was measured by four-point probe method and was 15.46μΩ·cm.

[0127] Example 4

[0128] Print the copper layer on the copper pillars of the daisy chain substrate as follows:

[0129] (1) The target layer thickness is 10 nm, the spacing is 1 μm, and a CAD pattern is designed according to the printing requirements. The CAD pattern is uploaded to the control mechanism 6, and the control mechanism 6 sets the printing speed to 10 nm / s, the deposition mode to single scan, the spacing between the base 41 and the dry aerosol printing nozzle 21 to 110 nm, the diameter of the dry aerosol printing nozzle 21 to 120 nm, the heating rate of the heating component 42 to 5 ° C / min, and the maximum rising temperature to 200 ° C;

[0130] (2) Open the steel deposition chamber 31 and place the 10×10 μm daisy chain on the substrate, fix it with a spring, close the steel deposition chamber 31, turn on the vacuum pump 32, and start evacuating to achieve negative pressure in the vacuum chamber;

[0131] (3) Install a pair of silver electrodes into the spark ablation assembly 22, turn on the spark ablation assembly 22, and wait for the voltage and current parameters to stabilize before starting printing through the control mechanism 6;

[0132] (4) First, the CCD high-resolution camera 5 is used to observe the daisy chain and capture the marker points to establish a relative coordinate system. Printing is performed according to the target circuit. The heating component 42 is heated to the preset temperature during printing. When printing and sintering are completed, the mobile platform 4 is reset.

[0133] (5) After the circuit is printed, turn off the spark ablation assembly 22, turn off the vacuum pump 32, wait for the chamber to cool down, increase the pressure to room temperature, and take out the sample;

[0134] (6) Place the sample on a bonding machine and bond it using a simulated chip.

[0135] SEM electron microscopy characterization showed that the thickness of the sample nano-copper layer was 10 nm, the resistivity was measured by four-point probe method and was 25.5 μΩ·cm, and the shear strength was measured by push-pull machine and was 20 MPa.

[0136] Figure 4 This is a microscopic diagram of the daisy chain substrate after nanoparticle printing is completed in this example. The nano-copper particles are evenly dispersed on the surface of each copper column.

[0137] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and are not to be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will readily conceive of other specific embodiments of the present invention without inventive effort, and such embodiments will fall within the scope of protection of the present invention.

Claims

1. A nanoparticle printing and parallel sintering device, characterized by: It includes a laser sintering mechanism, a nanoparticle generation and printing mechanism, a vacuum deposition chamber, a moving platform, a CCD high-resolution camera, and a control mechanism; The movable platform is provided in the vacuum deposition chamber, and the movable platform is used for placing a printing substrate; The laser sintering mechanism and the nanoparticle generation and printing mechanism are arranged above the mobile platform; The nanoparticle generation and printing mechanism is used to generate nanoparticles and print the nanoparticles onto the printing substrate to form nanoparticle circuits. The nanoparticle generation and printing mechanism includes a dry aerosol printing nozzle, a spark ablation component, a carrier gas flow controller, and a carrier gas cylinder. The dry aerosol printing nozzle is connected to the spark ablation component, and the spark ablation component is connected to the carrier gas cylinder via the carrier gas flow controller. The diameter of the dry aerosol printing nozzle is 1-100 μm. The total laser power of the laser sintering mechanism is 100-9000 mW, and the laser wavelength of the laser sintering mechanism is 527-980 nm. The vacuum deposition chamber includes a steel deposition chamber, a vacuum pump, a three-way solenoid valve and a sensor; the three-way solenoid valve is provided at the air inlet of the steel deposition chamber, and the three-way solenoid valve is used to assist the dry aerosol printing nozzle in printing; the vacuum pump is connected to the air outlet of the steel deposition chamber, and the vacuum pump is used to discharge the gas inside the steel deposition chamber; the sensor is provided inside the steel deposition chamber, and the sensor is used to detect the vacuum degree or oxygen concentration inside the steel deposition chamber; The laser sintering mechanism is used to laser sinter the nanoparticle circuit, and the laser sintering mechanism includes a micro-motion platform, a mounting bracket, and a laser sintering head; the laser sintering head is mounted on the micro-motion platform through the mounting bracket, and the micro-motion platform is used to allow the laser sintering head to follow the nanoparticle circuit to complete sintering; The CCD high-resolution camera is used to observe the printed substrate and establish a relative coordinate system of the printed circuit; The laser sintering mechanism, the nanoparticle generation and printing mechanism, the vacuum deposition chamber, the moving platform and the CCD high-resolution camera are electrically connected to the control mechanism respectively.

2. The nanoparticle printing and parallel sintering device according to claim 1, characterized in that: The mobile platform includes a base, a heating component, an electric assisted deposition component and a three-degree-of-freedom mobile component; The three-degree-of-freedom moving assembly is installed at the bottom of the inner cavity of the steel deposition chamber, the base is installed on the upper surface of the three-degree-of-freedom moving assembly, the heating assembly is used to heat the base, and the upper surface of the base is provided with a clamping assembly; The negative pole of the power supply of the electric assisted deposition assembly is connected to the base, and the positive pole of the power supply of the electric assisted deposition assembly is connected to the steel deposition chamber.

3. The nanoparticle printing and sintering device according to claim 2, characterized in that: The three-degree-of-freedom moving assembly includes an X-axis moving unit, a Y-axis moving unit and a Z-axis moving unit. The effective stroke of the X-axis moving unit is 170 mm, the effective stroke of the Y-axis moving unit is 100 mm, and the effective stroke of the Z-axis moving unit is 30 mm.

4. A method for nanoparticle printing and parallel sintering, using the nanoparticle printing and parallel sintering device according to any one of claims 1 to 3, characterized in that: The following steps are involved: Step 1: Input the printing circuit into the control mechanism, place the substrate to be printed on the mobile platform, and evacuate the air from the vacuum deposition chamber; Step 2: Observe the printed substrate through a CCD high-resolution camera and establish a relative coordinate system for the printed circuit; the laser sintering mechanism is adjusted to the initial sintering position according to the printed circuit; Step 3: Start printing and sintering: The nanoparticle generation printing mechanism gathers a dry aerosol particle beam through the dry aerosol printing nozzle and deposits it on the printing substrate. The printing platform drives the printing substrate to move according to the printing circuit so that the dry aerosol particle beam forms a nanoparticle circuit. The electrically assisted deposition component assists in the adsorption of charged dry aerosol particles. The laser sintering head sprays a laser beam to sinter the deposited nanoparticle circuit to form a sintered circuit, achieving deposition and sintering in parallel steps, and the heating component assists in sintering the nanoparticle circuit; Step 4: After the deposition and sintering work is completed, the printed circuit is cleaned with a carrier gas flow to remove loose nanoparticles, and multiple ventilation and cleaning cycles are carried out by cooperating with a three-way solenoid valve and a vacuum pump to remove the remaining nanoparticles from the vacuum deposition chamber.

5. The method for printing and sintering nanoparticles according to claim 4, characterized in that: The particle size of the nanoparticles printed by the dry aerosol printing nozzle is 1-20 nm; The radius of the laser spot of the laser sintering mechanism is 1-3 nm.

6. The method for printing and sintering nanoparticles according to claim 5, characterized in that: The operating pressure of the vacuum deposition chamber is 0.2-1 mbar; The maximum operating temperature of the heating component is 400° C., and the maximum heating rate of the heating component is 5° C. / min.

Images