Automatic temperature control circuit board reflow equipment

Abstract

The present invention discloses a reflow soldering device for a circuit board with automatic temperature control, which belongs to the technical field of circuit element soldering equipment, and includes: a solder joint mechanism, the solder joint mechanism includes a box body fixed on a bottom plate, the box body is provided with a dispensing syringe connected to a driver, and a first motor is fixedly installed at the bottom end of the inner wall of the box body, the output shaft of the first motor extends to a reciprocating screw, both ends of the reciprocating screw are spirally driven with a first slider that moves in the opposite direction, a moving plate connected to a cylinder is installed at the top of the first slider, and the piston rod on the cylinder extends to a protrusion and an X-axis telescopic rod in turn; wherein both ends of the protrusion are connected to the second slider by a swing rod. The present invention can solve the technical problem that the reflow soldering heating furnace in the prior art does not have the function of soldering special-shaped circuit boards, and the temperature reduction and regulation performance is poor, which is not conducive to improving the quality of reflow soldering and affects the improvement of work efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board welding devices, and in particular relates to reflow soldering equipment for circuit boards with automatic temperature control. Background Art

[0002] Reflow soldering refers to the use of solder paste, a mixture of solder and flux, to connect one or more electronic components to the contact pads, and then melt the solder through controlled heating to achieve permanent bonding. Soldering can be performed using different heating methods such as reflow ovens, infrared heating lamps or hot air guns. Reflow soldering machines are also called reflow soldering machines or "reflow ovens". They provide a heating environment to melt the solder paste so that surface mount components and PCB pads can be reliably combined together through the solder paste alloy. Reflow soldering machines are divided into vapor phase reflow soldering, infrared reflow soldering, far infrared reflow soldering, infrared heated air reflow soldering, full hot air reflow soldering, and water-cooled reflow soldering according to the development of technology.

[0003] Reflow soldering technology is not unfamiliar in the field of electronic manufacturing. The components on various boards used in our computers are soldered to the circuit board through this process. There is a heating circuit inside this equipment, which heats the air or nitrogen to a high enough temperature and blows it toward the circuit board with the components already attached, so that the solder on both sides of the components melts and then bonds to the mainboard. The advantage of this process is that the temperature is easy to control, oxidation can be avoided during the soldering process, and the manufacturing cost is easier to control.

[0004] During the reflow soldering process of the circuit board, the solder paste needs to be effectively adhered to the electronic components to facilitate the subsequent soldering work. The difference between ordinary parts and circuit boards is that they require corresponding clamps to assist in clamping to ensure that they have the corresponding shape when entering the heating furnace. The reflow soldering heating furnace in the prior art does not have the function of soldering special-shaped electronic components, such as rectangular and elliptical circuit boards of different lengths, widths and sizes, which is not conducive to improving the reflow soldering quality and affects the improvement of work efficiency. Summary of the invention

[0005] The purpose of the present invention is to provide a reflow soldering device for a circuit board involving automatic temperature control, so as to solve the technical problems that the reflow soldering heating furnace in the prior art does not have the function of soldering special-shaped circuit boards, and the reflow furnace does not have a corresponding effective temperature reduction and adjustment mechanism, which is not conducive to improving the quality of reflow soldering and affects the improvement of work efficiency.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] Automatic temperature-controlled circuit board reflow equipment, including:

[0008] A solder joint mechanism, the solder joint mechanism comprising a box body fixed on a bottom plate, the box body being provided with a dispensing syringe connected to a driver, and a first motor being fixedly mounted on the bottom end of an inner wall of the box body, the output shaft of the first motor extending to a reciprocating screw, both ends of the reciprocating screw being spirally driven with a first slider moving in the opposite direction, a moving plate connected to a cylinder being mounted on the top of the first slider, and a piston rod on the cylinder extending to a protruding portion and an X-axis telescopic rod in sequence;

[0009] Wherein, both ends of the protruding portion are connected to the second slider via a swing rod, and the second slider is connected with a slide groove along the length direction of the arc-shaped clamping plate, the X-axis telescopic rod and the second slider are connected via a Y-axis telescopic rod, and a contact plate is installed at one end of the Y-axis telescopic rod in a plug-in fixed manner, and as the first motor is started, the arc-shaped clamping plate clamps the circular circuit board in a limited position, and as the cylinder is started, the contact plate extends out or is stored in the arc-shaped groove, and at the same time, the spacing between the contact plates can be adjusted, and rectangular circuit boards of different sizes can be clamped in a limited position;

[0010] The reflow soldering mechanism comprises a first workbench placed inside the cover body, a heater adapted thereto is provided on the first workbench, and the reflow soldering mechanism fuses with the circuit board by heating and melting the solder, and can control and adjust the temperature inside the cover body.

[0011] Furthermore, a second motor is fixedly installed on the top of the cover body, and the output shaft of the second motor is fixedly connected to the first bevel gear and the central rotating tooth extending to the inside of the cover body in sequence. Both ends of the outer wall of the central rotating tooth are engaged with the rotating gear fixed on the movable shaft. One end of the movable shaft is connected to a rolling groove arranged at the top of the inner wall of the cover body, and the other end is connected to the rotating blade.

[0012] Furthermore, the outer wall of the first bevel gear is meshed with a second bevel gear fixed on the first transmission wheel, the first transmission wheel and the second transmission wheel are connected by a conveyor belt transmission, the second transmission wheel and the first transmission wheel are arranged in parallel, and one end of the second transmission wheel extends to the water pump impeller on the pump body, and a water inlet pipe and a water outlet pipe are respectively installed at both ends of the pump body, and one end of the water inlet pipe is connected to a spiral tube placed inside the cover body.

[0013] Furthermore, a heating chamber is formed between the spiral tube and the first workbench, and the spiral tube is connected to both sides of the bottom end of the inner wall of the cover body through column supports, and the column is provided with a guide ring placed on the outer wall of the spiral tube, and the water outlet on one side of the spiral tube and the water outlet pipe are connected through a water tank.

[0014] Furthermore, the first transmission wheel and the second transmission wheel are both placed on a hollow bending rod, and the bending bottom is abutted and connected to the bottom plate.

[0015] Furthermore, both ends of the swing rod are mounted on the protrusion and the second slider by a rotational connection, the bottom end of the arc-shaped clamping plate is fixed to the movable plate by a bracket, and both sides of the bottom end of the arc-shaped clamping plate are integrally connected with fixed blocks, and a storage cavity is formed between the fixed block and the arc-shaped clamping plate.

[0016] Furthermore, both ends of the storage cavity are connected with strip holes placed on an arc-shaped clamping plate, and the movable plate is fixedly connected to the side wall of the box body through a crossbeam.

[0017] Furthermore, a second workbench placed inside the box is provided between the arc-shaped clamping plates, and both sides of the second workbench are supported and connected to the side walls of the box through inclined rods.

[0018] Furthermore, the solder bonding mechanism is connected to the reflow soldering mechanism via a conveyor line, which is mounted on a frame and extends along a preset direction to carry and convey the circuit board.

[0019] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0020] (1) A solder joint mechanism is provided. The solder joint mechanism is essentially to limit and clamp the electronic components on the circuit boards of different shapes, and then attach the solder paste to the electronic components. If it is necessary to limit and clamp the elliptical electronic components of different sizes, after the first motor is started, it can drive the arc clamping plate to limit the center. When it is necessary to clamp and limit the rectangular electronic components of different sizes, the cylinder is started and the piston rod is pushed outward. With the help of the rotating connection setting of the swing rod, the second sliders on both sides can be pushed to limit and move at the same time. At the same time, due to the setting of the X-axis telescopic rod and the Y-axis telescopic rod, the horizontal lateral and vertical movement of the contact plate can be guaranteed. Moreover, when the contact plate moves outward, the spacing can be expanded at the same time, and when it moves inward, it can play a role of contraction and adjustment, thereby being able to adapt to the clamping and fixing of electronic components of different corresponding shapes, effectively improving the quality of subsequent reflow heating soldering, ensuring that the solder paste can be evenly attached to the electronic components, and improving product quality.

[0021] (2) A reflow soldering mechanism is provided. After the reflow furnace is heated, in order to prevent the temperature in the furnace from being too high, the second motor is started. The heat can be quickly dissipated by rotating the blades to dissipate heat. At the same time, the pump body is started through the action of mechanical transmission, so that water circulation is used for cooling. In addition, the spiral tube method is used in the cover body, which can effectively expand the cooling area of ​​water cooling, so that the heat in the cover body can be fully in contact with the water body, and there is no need to use an additional power source to drive the pump body, which effectively saves resources and is beneficial to environmental protection. The design is reasonable and the structural integration performance is strong, which can make the reflow furnace have a good temperature regulation function.

[0022] (3) A conveyor line is set up to carry the solder paste attached to the electronic components and effectively and stably transport it to the reflow oven for heating and soldering. It can serve as a good conveying medium to facilitate good melting and soldering operations between electronic components and circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 It is a structural schematic diagram of the circuit board reflow soldering equipment with automatic temperature control of the present invention;

[0025] Figure 2 It is a front view of the circuit board reflow soldering equipment with automatic temperature control of the present invention;

[0026] Figure 3 It is the internal schematic diagram of the box of the present invention;

[0027] Figure 4 The structure of the solder joint mechanism of the present invention is schematically shown in FIG. Figure 1 ;

[0028] Figure 5 The structure of the solder joint mechanism of the present invention is schematically shown in FIG. Figure 2 ;

[0029] Figure 6 is a schematic diagram of the interior of the cover body of the present invention;

[0030] Figure 7 is a schematic diagram of the connection between the first transmission wheel and the second transmission wheel of the present invention;

[0031] Figure 8 It is a schematic diagram of the meshing transmission of the central rotating tooth and the rotating gear of the present invention.

[0032] 1. The solder joint mechanism; 2. The housing; 3. The glue dispensing syringe; 4. The first motor; 5. The reciprocating screw; 6. The first slider; 7. The cylinder; 8. The moving plate; 9. The X-axis telescopic rod; 10. The second slider; 11. The swing rod; 12. The arc clamping plate; 13. The Y-axis telescopic rod; 14. The resistance plate; 15. The reflow soldering mechanism; 16. The housing; 17. The first workbench; 18. The second motor; 19. The first bevel gear; 20. The center gear; 21. The rotating gear; 22. The rotating blade; 23. The first transmission wheel; 24. The second bevel gear; 25. The second transmission wheel; 26. The conveyor belt; 27. The water pump impeller; 28. The water inlet pipe; 29. ​​The water outlet pipe; 30. The spiral tube; 31. The water tank; 32. The fixed block; 33. The second workbench; 33. The conveyor line. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] Reference Manual Attached Figure 1 and attached Figure 2 As shown, the automatic temperature-controlled circuit board reflow soldering equipment includes:

[0035] The solder bonding mechanism 1 comprises a box body 2 fixed on a bottom plate, a dispensing syringe 3 connected to a driver is provided on the box body 2, and a first motor 4 is fixedly installed at the bottom end of the inner wall of the box body 2, the output shaft of the first motor 4 extends to a reciprocating screw 5, both ends of the reciprocating screw 5 are spirally driven with a first slider 6 that moves in the opposite direction, a moving plate 8 connected to a cylinder 7 is installed at the top end of the first slider 6, and a piston rod on the cylinder 7 extends to a protruding portion and an X-axis telescopic rod 9 in sequence;

[0036] Among them, both ends of the protrusion are connected to the second slider 10 through a swing rod 11, and the second slider 10 is connected with a slide groove along the length direction of the arc-shaped clamping plate 12. The X-axis telescopic rod 9 and the second slider 10 are connected through the Y-axis telescopic rod 13, and a contact plate 14 is installed at one end of the Y-axis telescopic rod 13 by plug-in fixing. As the first motor 4 is started, the arc-shaped clamping plate 12 clamps the circular circuit board in a limited position. As the cylinder 7 is started, the contact plate 14 extends out or is stored in the arc-shaped groove. At the same time, the spacing between the contact plates 14 can be adjusted, and rectangular circuit boards of different sizes are clamped in a limited position.

[0037] Specifically, the main function of the glue dispensing syringe 3 is to store solder paste and attach the solder paste to the electronic components by extrusion and bonding. At the same time, the driver on the glue dispensing syringe 3 is mainly driven in space by the X-axis motor, Y-axis motor and Z-axis motor, and moves with the screw shaft and gear mechanism, so that the glue dispensing syringe 3 can obtain corresponding distance adjustment movement within the spatial range. The above-mentioned transmission components and corresponding working principles are conventional technical means for technical personnel in this field, so no excessive description and explanation of the working principles are given, and no corresponding drawings are shown, but it does not affect the effective implementation of the technical solution of the present invention.

[0038] refer to Figure 1 , Figure 6 , Figure 7 and Figure 8 The reflow soldering mechanism 15 includes a first workbench 17 disposed inside the cover body 16 , on which a heater adapted thereto is disposed, and the reflow soldering mechanism 15 fuses with the circuit board by heating and melting the solder, and can control and adjust the temperature inside the cover body 16 .

[0039] A second motor 18 is fixedly installed on the top of the cover body 16, and the output shaft of the second motor 18 is fixedly connected to the first bevel gear 19 and the central rotating tooth 20 extending to the inside of the cover body 16 in sequence. Both ends of the outer wall of the central rotating tooth 20 are engaged with the rotating gear 21 fixed on the movable shaft. One end of the movable shaft is connected to a rolling groove placed on the top of the inner wall of the cover body 16, and the other end is connected to the rotating blade 22. The rotating blade 22 can be installed on the movable shaft by plugging and fixing. In this way, it is convenient to replace the rotating blades 22 of different sizes according to actual needs, and the ventilation holes that can be opened and closed for adjustment can be used for heat dissipation.

[0040] Specifically, after the second motor 18 is started, it can drive the rotation of the first bevel gear 19 and the center gear 20 at the same time. The center gear 20 can make the rotating blades 22 on the rotating gears 21 at both ends rotate at the same time through the meshing transmission of the gears, thereby achieving the purpose of heat dissipation. When the first bevel gear 19 rotates, it can drive the rotation of the second bevel gear 24 at one end, which can play a role in power reversing regulation and enable the first transmission wheel 23 to rotate. In addition, through the transmission action of the conveyor belt 26, the water pump impeller 27 on the second transmission wheel 25 can be rotated, and then the pump body can be started and the water in the water tank 31 can be transported to the spiral tube 30, thereby playing a role in cooling and regulating the heat in the box body 2, which also utilizes the large specific heat capacity of water.

[0041] A reflow soldering mechanism 15 is provided. After the heating of the reflow furnace is completed, in order to prevent the temperature in the furnace from being too high, the second motor 18 is started, and the heat can be quickly dissipated by rotating the rotating blades 22 to dissipate heat. At the same time, the pump body is started through the action of mechanical transmission, so that cooling is performed by water circulation. In addition, the spiral tube 30 is used in the cover body 16 to effectively expand the cooling area of ​​water cooling, so that the heat in the cover body 16 can be fully in contact with the water body, and there is no need to use an additional power source to drive the pump body, which effectively saves resources and is beneficial to environmental protection. The design is reasonable and the structural integration performance is strong, so that the reflow furnace can have a good temperature regulation function.

[0042] In addition, the outer wall of the first bevel gear 19 is meshed with a second bevel gear 24 fixed on the first transmission wheel 23. The first transmission wheel 23 and the second transmission wheel 25 are connected by a conveyor belt 26. The second transmission wheel 25 and the first transmission wheel 23 are arranged in parallel, and one end of the second transmission wheel 25 extends to the water pump impeller 27 on the pump body. An inlet pipe 28 and an outlet pipe 29 are respectively installed at both ends of the pump body. One end of the inlet pipe 28 is connected to a spiral tube 30 placed inside the cover body 16.

[0043] By extension, corresponding regulating valves are provided on the water inlet pipe 28 and the water outlet pipe 29. On the one hand, the flow rate of the water body can be controlled, and different cooling adjustments can be made through the flow rate. On the other hand, it can play the role of unidirectional flow of water, which can effectively prevent the backflow of liquid and affect the normal transportation of water.

[0044] A heating chamber is formed between the spiral tube 30 and the first workbench 17. The spiral tube 30 is supported and connected to both sides of the bottom end of the inner wall of the cover body 16 through columns, and the columns are provided with guide rings placed on the outer wall of the spiral tube 30. The water outlet on one side of the spiral tube 30 and the water outlet pipe 29 are connected through a water tank 31. The guide ring on the column can support and connect the spiral tube 30. At the same time, the guide ring can be locked and fixed with the spiral tube 30 by a snap-on connection, which can effectively facilitate the installation and disassembly work between structural parts, and can also facilitate personnel operation and improve work efficiency.

[0045] The first transmission wheel 23 and the second transmission wheel 25 are both placed on a hollow bending rod, and the bent bottom is abutted and connected to the bottom plate. Both ends of the swing rod 11 are installed on the protrusion and the second slider 10 by a rotational connection. The bottom end of the arc-shaped clamping plate 12 is fixed to the movable plate 8 through a bracket, and both sides of the bottom end of the arc-shaped clamping plate 12 are integrally formed with a fixed block 32, and a storage cavity is formed between the fixed block 32 and the arc-shaped clamping plate 12.

[0046] The setting of the bending rod provides the first transmission wheel 23 and the second transmission wheel 25 with corresponding supporting activity space, and can also play a role in safety protection for the outside of the transmission member to prevent the external member from colliding with it without corresponding shielding, thereby posing a safety hazard to it. The bending rod itself is set in an inverted L shape, so it can be designed according to the transmission distance and angle of the structural member. The output shaft of the second motor 18 and the rotating shaft of the center gear 20 are fixedly connected by a coupling, so that the output power of the second motor 18 can be effectively and stably transmitted to the center gear 20, and the stability of power transmission can be maintained. At the same time, one end of the first transmission wheel 23 and the second transmission wheel 25 are both provided with bearings placed on the inner wall of the bending rod, so that the first transmission wheel 23 and the second transmission wheel 25 can be ensured to rotate normally while also providing corresponding supporting force.

[0047] refer to Figure 3 , Figure 4 and Figure 5 , strip holes placed on the arc-shaped clamping plate 12 are connected to both ends of the storage cavity, and the movable plate 8 is fixedly connected to the side wall of the box body 2 through a crossbeam. In the initial position, the contact plate 14 is in the storage cavity inside the arc-shaped clamping plate 12. Under the action of the first motor 4, the reciprocating screw 5 rotates, and under the action of the spiral transmission, the first sliders 6 at both ends move in the opposite direction, and drive the arc-shaped clamping plates 12 at both ends to adaptively clamp and fix elliptical electronic components of different sizes to a certain extent, and the contact plate 14 is in the storage cavity, which does not affect the interference of the structural parts during the movement.

[0048] When it is necessary to clamp and limit rectangular electronic components of different sizes, the spacing of the clamping position points needs to be adjusted accordingly as the width increases. Therefore, a resistance limiting mechanism is set in the storage cavity in the arc-shaped clamping plate 12. When the cylinder 7 pushes the piston rod to move outward, the resistance plate 14 moves out of the storage cavity. At the same time, due to the provision of the swing rod 11, the resistance plate 14 on the second slider 10 can move synchronously toward both sides through the rotation connection, thereby playing a role in expanding and adjusting the spacing. In addition, a Y-axis telescopic rod 13 is set on the resistance plate 14 to cooperate with the X-axis telescopic rod 9, so that the resistance plate 14 can ensure normal horizontal movement in the X-axis and Y-axis directions.

[0049] The movable plate 8 is provided with a crossbeam connected to the inner wall of the box body 2. The setting of the crossbeam can prevent the movable plate 8 from deviating from its position when it moves horizontally, and plays a role in conveying and guiding. The crossbeam can also play a certain supporting and connecting role for the movable plate 8, thereby preventing the movable plate 8 from being subjected to excessive force and causing pressure load, thereby affecting the service life of the structural parts.

[0050] Specifically, a second workbench 33 is provided between the arc-shaped clamping plates 12 and is placed inside the box body 2. Both sides of the second workbench 33 are connected to the side walls of the box body 2 through inclined rod supports. The solder joining mechanism 1 and the reflow soldering mechanism 15 are connected through a conveyor line 34. The conveyor line 34 is installed on the frame and extends along a preset direction to carry and convey the circuit board.

[0051] A solder joint mechanism 1 is provided. The solder joint mechanism 1 is essentially to limit and clamp the electronic components on circuit boards of different shapes, and then attach the solder paste to the electronic components. If it is necessary to limit and clamp elliptical electronic components of different sizes, after the first motor 4 is started, it can drive the arc clamping plate 12 to perform centering and limiting. When it is necessary to clamp and limit rectangular electronic components of different sizes, the cylinder 7 is started and pushes the piston rod to move outward. With the help of the rotating connection setting at both ends of the swing rod 11, the second sliders 10 on both sides can be pushed to move at the same time. At the same time, due to the setting of the X-axis telescopic rod 9 and the Y-axis telescopic rod 13, the horizontal lateral and vertical movement of the contact plate 14 can be guaranteed, and the contact plate 14 can simultaneously expand the spacing when moving outward, and can play a role of contraction and adjustment when moving inward, so as to adapt to the clamping and fixing of electronic components of different corresponding shapes, effectively improve the quality of subsequent reflow heating welding, ensure that the solder paste can be evenly attached to the electronic components, and improve product quality.

[0052] The conveyor line 34 is provided to carry the solder paste attached to the electronic components and effectively and stably convey it to the reflow furnace for heating and soldering, and can serve as a good conveying medium to facilitate good melting and soldering operations between the electronic components and the circuit board.

[0053] A positioning hole is provided at the connection between the cylinder 7 and the movable plate 8, and the cylinder 7 and the movable plate 8 are connected by locking and fixing with a stop pin or a bolt assembly. By connecting through the above-mentioned structural parts, they can be quickly installed and fixed, so that the cylinder 7 can move horizontally synchronously with the movable plate 8, thereby facilitating adaptive limit clamping work for different electronic components.

[0054] The above are only preferred specific implementation modes of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

[0055] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. Automatic temperature control circuit board reflow soldering equipment, characterized in that: include: A solder joint mechanism (1), the solder joint mechanism (1) comprising a box (2) fixed on a bottom plate, the box (2) being provided with a dispensing syringe (3) connected to a driver, and a first motor (4) being fixedly mounted at the bottom end of the inner wall of the box (2), the output shaft of the first motor (4) extending to a reciprocating screw (5), both ends of the reciprocating screw (5) being spirally driven with a first slider (6) for reverse movement, a moving plate (8) connected to a cylinder (7) being mounted at the top end of the first slider (6), and a piston rod on the cylinder (7) extending to a protruding portion and an X-axis telescopic rod (9) in sequence; The two ends of the protruding portion are connected to the second slider (10) via a swing rod (11), and the second slider (10) is connected to a slide groove along the length direction of the arc-shaped clamping plate (12). The X-axis telescopic rod (9) and the second slider (10) are connected via a Y-axis telescopic rod (13), and a contact plate (14) is installed at one end of the Y-axis telescopic rod (13) in a plug-in manner. When the first motor (4) is started, the arc-shaped clamping plate (12) clamps the circular circuit board in a limited position. When the cylinder (7) is started, the contact plate (14) extends out or is stored in the arc-shaped groove. At the same time, the spacing between the contact plates (14) can be adjusted, and rectangular circuit boards of different sizes can be clamped in a limited position. A reflow soldering mechanism (15), the reflow soldering mechanism (15) comprising a first workbench (17) disposed inside a cover body (16), a heater adapted thereto being provided on the first workbench (17), and the reflow soldering mechanism (15) being integrated with the circuit board by heating and melting the solder, and being capable of controlling and adjusting the temperature inside the cover body (16).

2. The automatic temperature-controlled circuit board reflow soldering equipment according to claim 1, characterized in that: A second motor (18) is fixedly mounted on the top of the cover body (16); an output shaft of the second motor (18) is fixedly connected in sequence to a first bevel gear (19) and a central rotating tooth (20) extending into the interior of the cover body (16); both ends of an outer wall of the central rotating tooth (20) are meshed with a rotating gear (21) fixed on a movable shaft; one end of the movable shaft is connected to a rolling groove disposed at the top end of the inner wall of the cover body (16); and the other end is connected to a rotating blade (22).

3. The automatic temperature-controlled circuit board reflow soldering equipment according to claim 2, characterized in that: The outer wall of the first bevel gear (19) is meshed with a second bevel gear (24) fixed to the first transmission wheel (23); the first transmission wheel (23) and the second transmission wheel (25) are connected to each other by a conveyor belt (26); the second transmission wheel (25) and the first transmission wheel (23) are arranged parallel to each other, and one end of the second transmission wheel (25) extends to a water pump impeller (27) on a pump body; a water inlet pipe (28) and a water outlet pipe (29) are respectively installed at two ends of the pump body; one end of the water inlet pipe (28) is connected to a spiral pipe (30) arranged inside the cover body (16).

4. The automatic temperature-controlled circuit board reflow soldering equipment according to claim 3, characterized in that: A heating chamber is formed between the spiral tube (30) and the first workbench (17); both sides of the bottom end of the inner wall of the cover body (16) are supported and connected to the spiral tube (30) via columns, and the columns are provided with guide rings placed on the outer wall of the spiral tube (30); the water outlet on one side of the spiral tube (30) and the water outlet pipe (29) are connected via a water tank (31).

5. The automatic temperature-controlled circuit board reflow soldering equipment according to claim 3, characterized in that: The first transmission wheel (23) and the second transmission wheel (25) are both placed on a hollow bending rod, and the bottom of the bending rod is abutted and connected to the bottom plate.

6. The automatic temperature-controlled circuit board reflow soldering equipment according to claim 1, characterized in that: Both ends of the swing rod (11) are mounted on the protruding portion and the second slider (10) by means of a rotational connection, the bottom end of the arc-shaped clamping plate (12) is fixed to the movable plate (8) by means of a bracket, and both sides of the bottom end of the arc-shaped clamping plate (12) are integrally formed with fixed blocks (32), and a storage cavity is formed between the fixed block (32) and the arc-shaped clamping plate (12).

7. The automatic temperature-controlled circuit board reflow soldering equipment according to claim 6, characterized in that: The two ends of the storage cavity are connected with strip holes placed on an arc-shaped clamping plate (12), and the movable plate (8) is fixedly connected to the side wall of the box body (2) via a crossbeam.

8. The automatic temperature-controlled circuit board reflow soldering equipment according to claim 1, characterized in that: A second workbench (33) is provided between the arc-shaped clamping plates (12) and is placed inside the box body (2). Both sides of the second workbench (33) are supported and connected to the side walls of the box body (2) via inclined rods.

9. The automatic temperature-controlled circuit board reflow soldering equipment according to any one of claims 1 to 8, characterized in that: The solder joint mechanism (1) is connected to the reflow soldering mechanism (15) via a conveying line (34); the conveying line (34) is mounted on a frame and extends along a preset direction, and is used to carry and convey a circuit board.

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