Laser cutting and peeling device and method of using the same

Abstract

The present invention discloses a laser cutting and stripping device and a method of using the same, including a laser cutting device and a stripping device; the laser cutting device includes a laser head and a first ingot base; the stripping device includes a second ingot base, a stripping disk located above the second ingot base, and a lifting drive device for driving the stripping disk to move up and down; the stripping disk includes a main disk body and an edge stripping mechanism, a plurality of concentrically arranged stripping plates are provided below the main disk body, and the edge separation mechanism includes a tension device and an edge stripping ring provided below the main disk body, the edge stripping ring corresponds to the edge of the thin slice above the modified layer, and the lower surfaces of the edge stripping ring and the stripping plate are both bonded to the upper surface of the ingot. The present invention forms an annular crack above the modified layer between the thin slice and the ingot through the edge stripping mechanism as a separation breakthrough, so that the crack can be controllably extended inward, reducing the force required for separation, avoiding the fragmentation of the thin slice, improving the yield rate, and reducing economic losses.

Description

Technical Field

[0001] The present invention relates to the field of laser cutting and separation technology, and in particular to a laser cutting and peeling device and a method for using the same. Background Art

[0002] Silicon carbide is a compound semiconductor material composed of silicon and carbon. It has excellent physical and chemical properties, including high hardness, high thermal conductivity, good chemical stability, etc. Thanks to these excellent properties, silicon carbide is widely used in electronic devices, optoelectronic devices and other fields. Among them, in the semiconductor industry, silicon carbide materials are usually used to make wafers.

[0003] In the process of manufacturing wafers, the silicon carbide ingot needs to be cut and peeled off first to obtain thin slices of a certain thickness. After subsequent grinding, polishing and other processes, the wafer is obtained.

[0004] Among them, laser cutting process is a commonly used wafer manufacturing process. This process is to first focus a high-energy laser beam on a plane at a certain depth distance from the surface of the ingot, and form a modified layer in the silicon carbide ingot by moving the laser focus point, and then use the stripping equipment to strip the thin slice above the modified layer from the ingot; when stripping the thin slice, the two bonding sheet racks on the separation equipment are respectively bonded and fixed to the two end surfaces of the ingot by adhesive, and then the two bonding sheet racks move to both sides and apply a pulling force to the ingot, so that the thin slice above the modified layer is separated from the ingot below the modified layer; then the separated thin slice is subjected to grinding, polishing and other processes to obtain a wafer.

[0005] However, the existing stripping method is to separate the thin slice above the modified layer from the ingot at one time by applying a large pulling force. This existing stripping method has the following problems: Silicon carbide is a hard and brittle material. This one-time stripping method makes it difficult to accurately control the direction of crack expansion during the stripping process. The uncontrollable cracks may cause the thin slice to break or break during the stripping process, which may easily lead to partial or complete damage to the thin slice, resulting in large economic losses. Summary of the invention

[0006] The purpose of the present invention is to solve the deficiencies in the prior art and provide a laser cutting and peeling device and a method for using the same.

[0007] The object of the present invention is achieved through the following technical solution: a laser cutting and stripping device, comprising a laser cutting device and a stripping device;

[0008] The laser cutting device includes a laser head and a first ingot base for placing the ingot, and the laser emitted by the laser head forms a modified layer inside the ingot;

[0009] The stripping device includes a second ingot base for placing the ingot, a stripping plate located above the second ingot base, and a lifting drive device for driving the stripping plate to move up and down; the stripping plate includes a main plate body and an edge stripping mechanism, a plurality of concentrically arranged stripping plates are arranged below the main plate body, and the edge separation mechanism includes a tension device and an edge stripping ring arranged below the main plate body, the edge stripping ring corresponds to the edge of the thin sheet above the modified layer, and the lower surfaces of the edge stripping ring and the stripping plate are both bonded to the upper surface of the ingot;

[0010] The tension device applies an upward tension to the edge stripping ring, and the tension application position of the tension device on the edge stripping ring moves along the edge stripping ring; an annular crack is formed between the edge of the thin slice above the modified layer and the ingot below the modified layer through the edge separation mechanism.

[0011] Preferably, a limit pin is provided on the stripping plate, and the stripping plate is connected to the main plate body through the limit pin; of two adjacent stripping plates, the length of the limit pin on the outer stripping plate is smaller than the length of the limit pin on the inner stripping plate.

[0012] Preferably, the main disk body is provided with a through hole corresponding to the limit pin, and the limit pin passes through the through hole; one end of the limit pin is fixedly connected to the stripping plate, and the other end is the limit end, and the diameter of the limit end is larger than the diameter of the through hole.

[0013] Preferably, the tension device comprises a force transmission ring and an annular boss arranged at the upper end of the main disk body, wherein the force transmission ring is arranged on the annular boss; an outer ring is arranged on the outer side of the annular boss, the outer ring is fixedly connected to the main disk body, and an inner ring is rotatably arranged on the inner side of the outer ring; the inner ring comprises an inner ring body, and a movable insert is arranged on the inner side of the inner ring body, and the movable insert is inserted between the force transmission ring and the annular boss; a rotation driving mechanism is arranged between the outer ring and the inner ring, and the inner ring is driven to rotate by the rotation driving mechanism; an avoidance groove is arranged on the force transmission ring; the force transmission ring is located above the edge stripping ring, and the force transmission ring and the edge stripping ring are connected by a plurality of connecting rods;

[0014] When the inner ring rotates, the movable insert is driven to move between the force transmission ring and the annular boss, and a bulge deformation occurs at the contact position between the force transmission ring and the movable insert. When the force transmission ring bulges, an upward pulling force is generated on the edge stripping ring through the connecting rod.

[0015] Preferably, the force transmission ring and the edge stripping ring are both made of spring steel, and the thickness of the force transmission ring and the edge stripping ring is 0.5-0.8 mm.

[0016] Preferably, the rotary drive mechanism comprises a motor arranged on the outer ring and a gear ring arranged on the inner ring body, the motor is connected to a gear, and the gear ring is meshed with the gear.

[0017] Preferably, the upper end surface of the movable insert is an arc surface, and the maximum thickness of the movable insert is 1.5-2 mm.

[0018] Preferably, the first crystal ingot base and the second crystal ingot base have the same structure, and both the first crystal ingot base and the second crystal ingot base include a base body, and the base body is provided with a positioning groove and a clamping cylinder; the bottom of the crystal ingot is bonded and fixed to the base support, and the base support is placed in the positioning groove, and the base support is clamped and fixed to the base body by the clamping cylinder.

[0019] Preferably, there are four stripping plates in total, which are, from the outside to the inside, the first stripping plate, the second stripping plate, the third stripping plate and the fourth stripping plate. The length of the limit pull pin on the second stripping plate is 0.5-1 mm longer than that of the limit pull pin on the first stripping plate, the length of the limit pull pin on the third stripping plate is 0.5-1 mm longer than that of the limit pull pin on the second stripping plate, and the length of the limit pull pin on the fourth stripping plate is 0.5-1 mm longer than that of the limit pull pin on the third stripping plate.

[0020] A method for using a laser cutting and stripping device comprises the following specific steps:

[0021] Step 1: placing the ingot on a first ingot base, and performing laser processing on the ingot by a laser head to form a modified layer;

[0022] Step 2: Place the ingot on the second ingot base, adhere the lower end faces of the edge stripping ring and the stripping plate to the upper end face of the ingot through adhesive, and adhere the edge stripping ring to the edge of the upper end of the ingot; adjust the height of the main plate body through the lifting drive device so that the force transmission ring is in close contact with the upper end face of the annular boss; the movable insert is located in the avoidance groove on the force transmission ring;

[0023] Step 3: After the edge stripping ring and the stripping plate are firmly bonded to the upper end surface of the crystal ingot, the inner ring is first driven to rotate one circle by the rotary drive mechanism. When the inner ring rotates, the movable insert is driven to move between the force transmission ring and the annular boss. The contact position between the force transmission ring and the movable insert is bulged and deformed. When the force transmission ring is bulged, an upward pulling force is generated on the edge stripping ring through the connecting rod. Under the action of the pulling force, the force-bearing position on the edge stripping ring is tilted. The tilted position on the edge stripping ring generates an upward pulling force on the edge of the thin slice above the modified layer, so that a crack is generated between the thin slice and the crystal ingot below the modified layer; during the rotation of the movable insert, the crack spreads along the circumferential direction of the thin slice, so that an annular crack is formed between the thin slice above the modified layer and the crystal ingot below the modified layer;

[0024] Step 4: The lifting drive device drives the stripping plate to move upward, and the stripping plate moves upward to separate the thin slice from the ingot below the modified layer; during the separation process of the thin slice, the annular crack spreads toward the center of the thin slice.

[0025] The beneficial effect of the present invention is as follows: in the present invention, when peeling off the thin slice on the crystal ingot, an annular crack is first formed between the thin slice above the modified layer and the crystal ingot under the modified layer through the edge peeling mechanism, so that in the subsequent process of pulling the thin slice upward to separate it, this annular crack is used as a breakthrough point. As the thin slice is pulled upward, the annular crack will expand and extend along the modified layer toward the center of the thin slice, so that the crack expansion direction of the thin slice during the separation process can be controlled, and with the help of the inward extension of the annular crack, the thin slice and the crystal ingot under the modified layer can be separated more easily, thereby reducing the force required for separating the thin slice, effectively avoiding the problem of thin slice breakage during the separation process, improving the yield of the wafer, and reducing the economic loss in the production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of a laser cutting device when cutting a crystal ingot.

[0027] Figure 2 Schematic diagram of the structure of the stripping device.

[0028] Figure 3 This is a schematic diagram of the crystal ingot being bonded to the base.

[0029] Figure 4 It is a schematic diagram of the structure of the first crystal ingot base.

[0030] Figure 5 This is a schematic diagram of the structure of the stripping disk in one direction.

[0031] Figure 6 This is a schematic diagram of the structure of the stripping disk in another direction.

[0032] Figure 7 for Figure 5 Enlarged view of part A in the middle.

[0033] Figure 8 It is a schematic diagram of the structure of the force transmission ring.

[0034] Fig. 9 This is a schematic diagram of the structure of the inner circle.

[0035] Fig.10 A cross-sectional view of a stripping disc.

[0036] Fig.11 for Fig.10 Enlarged view of part B in the middle.

[0037] In the figure: 1. first crystal ingot base, 1-1. base body, 1-2. positioning groove, 1-3. clamping cylinder, 2. bottom support, 3. crystal ingot, 3-1. modified layer, 3-2. thin sheet, 4. laser head, 5. second crystal ingot base, 6. stripping disk, 6-1. main disk body, 6-1a. annular boss, 6-2. force transmission ring, 6-2a. avoidance groove, 6-3. limit pull pin, 6-4. connecting rod, 6-5. connecting piece, 6-6. inner ring, 6-6a. inner ring body, 6-6b. gear ring, 6-6c. movable insert, 6-7. outer ring, 6-8. motor, 6-9. gear, 6-10. edge stripping ring, 6-11. stripping plate, 6-12. ball, 7. lifting drive device, 8. support seat. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.

[0039] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0040] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0041] like Figures 1 to 11As shown, a laser cutting and stripping device comprises a laser cutting device and a stripping device; the laser cutting device comprises a laser head 4 and a first ingot base 1 for placing an ingot 3, and a modified layer 3-1 is formed inside the ingot 3 by laser emitted by the laser head 4; the stripping device comprises a second ingot base 5 for placing the ingot 3, a stripping plate 6 located above the second ingot base 5, and a lifting drive device 7 for driving the stripping plate 6 to move up and down; the stripping plate 6 comprises a main plate body 6-1 and an edge stripping mechanism, a plurality of concentrically arranged stripping plates 6-11 are arranged below the main plate body 6-1, the edge separation mechanism comprises a tension device and an edge stripping ring 6-10 arranged below the main plate body 6-1, the edge stripping ring 6-10 corresponds to the edge of the thin sheet 3-2 above the modified layer 3-1, and the lower surfaces of the edge stripping ring 6-10 and the stripping plate 6-11 are both bonded to the upper surface of the ingot 3;

[0042] The tension device applies an upward tension to the edge stripping ring 6-10, and the tension application position of the tension device on the edge stripping ring 6-10 moves along the edge stripping ring 6-10; through the edge separation mechanism, an annular crack is formed between the edge of the thin film 3-2 above the modified layer 3-1 and the ingot 3 below the modified layer 3-1.

[0043] In the present invention, when peeling off the thin slice 3-2 on the crystal ingot 3, an annular crack is first formed between the thin slice 3-2 above the modified layer 3-1 and the crystal ingot 3 under the modified layer 3-1 through the edge peeling mechanism, so that in the subsequent process of pulling the thin slice 3-2 upward and separating it, this annular crack is used as a breakthrough point. As the thin slice 3-2 is pulled upward, the annular crack will expand and extend along the modified layer 3-1 toward the center direction of the thin slice 3-2, so that the crack extension direction of the thin slice 3-2 during the separation process can be controlled. With the help of the inward extension of the annular crack, the thin slice 3-2 and the crystal ingot 3 under the modified layer 3-1 can be separated more easily, thereby reducing the force required for separating the thin slice 3-2, effectively avoiding the problem of the thin slice 3-2 being broken during the separation process, improving the yield of the wafer, and reducing the economic loss in the production process.

[0044] Among them, the edge peeling ring 6-10 has a certain deformation ability, and the local position on it can be deformed after being subjected to tension; when the edge peeling mechanism produces an annular crack, the tension of the tension device first acts on one of the positions on the edge peeling ring 6-10. Since the edge peeling ring 6-10 is subjected to an upward tension at this position, the edge peeling ring 6-10 will be deformed upward at this position (that is, it will be warped). The warping of the edge peeling ring 6-10 will also cause the corresponding position on the thin film 3-2 to be subjected to an upward pulling force and warp. The raised position on the sheet 3-2 is separated from the ingot 3, and a smaller initial crack is first formed between the two; as the tensioning position of the tension device on the edge stripping ring 6-10 moves along the edge stripping ring 6-10, the raised position of the edge stripping ring 6-10 also moves accordingly. Similarly, the raised position on the sheet 3-2 will also move, and the moving direction is along the circumferential direction of the sheet 3-2. When the raised position on the sheet 3-2 moves, the initial crack will gradually expand and extend along the moving direction of the raised position until a ring-shaped crack is formed. When forming an annular crack, the tension device of the present invention first applies tension to a position point of the edge peeling ring 6-10 to form a smaller initial crack between the thin slice 3-2 and the crystal ingot 3, and uses the initial crack as a breakthrough point and the movement of the tension action position to gradually expand the crack to finally form an annular crack. In this way, an annular crack can be formed at the edge of the thin slice 3-2 in a relatively stable and controllable manner, and the required force is small, resulting in little damage to the thin slice 3-2 and the crystal ingot 3. During the formation process of the annular crack, no damage is caused to the thin slice 3-2 itself.

[0045] In this embodiment, the lifting drive device 7 is a cylinder, which is installed on a support seat 8. The cylinder is arranged along the vertical direction, the cylinder body of the cylinder is fixedly connected to the support seat 8, and the lower end of the piston rod of the cylinder is connected to the main disk body 6-1.

[0046] The stripping plate 6-11 is provided with a limit pin 6-3, and the stripping plate 6-11 is connected to the main plate body 6-1 through the limit pin 6-3; of the two adjacent stripping plates 6-11, the length of the limit pin on the outer stripping plate 6-11 is smaller than the length of the limit pin 6-3 on the inner stripping plate 6-11. The limit pin 6-3 is slidably matched with the main plate body 6-1, and the limit pin 6-3 is used to limit the distance between the stripping plate 6-11 and the main plate body 6-1. When the main disk body 6-1 moves upward and peels the thin slice 3-2 from the ingot 3, the distance between the outermost stripping plate 6-11 and the main disk body 6-1 will first reach the travel limit of the limit pin 6-3, so the outermost stripping disk 6 will first apply an upward pulling force to the thin slice 3-2; as the main disk body 6-1 continues to move upward, the distance between the stripping plate 6-11 on the inner side of the stripping plate 6-11 and the main disk body 6-1 will then reach the travel limit of the limit pin 6-3 and apply an upward pulling force to the thin slice 3-2; and so on, the stripping plates 6-11 apply pulling force to the thin slice 3-2 in turn from the outside to the inside, which can induce the annular crack to stably expand and extend toward the center of the thin slice 3-2 until the thin slice 3-2 is completely separated from the ingot 3.

[0047] The innermost stripping plate 6 - 11 is circular, and the remaining stripping plates 6 - 11 are ring-shaped.

[0048] Among them, a through hole corresponding to the limit pin 6-3 is provided on the main disk body 6-1, and the limit pin 6-3 passes through the through hole; one end of the limit pin 6-3 is fixedly connected to the stripping plate 6-11, and the other end is the limit end, and the diameter of the limit end is larger than the diameter of the through hole.

[0049] In this embodiment, there are four stripping plates 6-11, which are the first stripping plate, the second stripping plate, the third stripping plate and the fourth stripping plate from the outside to the inside. The length of the limit pull pin 6-3 on the second stripping plate is 0.5-1 mm longer than the length of the limit pull pin 6-3 on the first stripping plate, the length of the limit pull pin 6-3 on the third stripping plate is 0.5-1 mm longer than the length of the limit pull pin 6-3 on the second stripping plate, and the length of the limit pull pin 6-3 on the fourth stripping plate is 0.5-1 mm longer than the length of the limit pull pin 6-3 on the third stripping plate.

[0050] Specifically, the tension device includes a force transmission ring 6-2 and an annular boss 6-1a arranged on the upper end of the main disk body 6-1, and the force transmission ring 6-2 is arranged on the annular boss 6-1a; an outer ring 6-7 is arranged on the outer side of the annular boss 6-1a, and the outer ring 6-7 is fixedly connected to the main disk body 6-1, and an inner ring 6-6 is rotatably arranged on the inner side of the outer ring 6-7; the inner ring 6-6 includes an inner ring body 6-6a, and a movable insert 6-6c is arranged on the inner side of the inner ring body 6-6a, and the movable insert 6-6c is inserted between the force transmission ring 6-2 and the annular boss 6-1a; a rotating The inner ring 6-6 is driven to rotate by the rotary driving mechanism; an avoidance groove 6-2a is provided on the force transmission ring 6-2; the force transmission ring 6-2 is located above the edge stripping ring 6-10, and the force transmission ring 6-2 and the edge stripping ring 6-10 are connected by a plurality of connecting rods 6-4; when the inner ring 6-6 rotates, it drives the movable insert 6-6c to move between the force transmission ring 6-2 and the annular boss 6-1a, and a bulge deformation occurs at the contact position between the force transmission ring 6-2 and the movable insert 6-6c, and when the force transmission ring 6-2 bulges, an upward pulling force is generated on the edge stripping ring 6-10 through the connecting rod 6-4.

[0051] Among them, the upper end of the connecting rod 6-4 is connected to the force transmission ring 6-2 through the connecting piece 6-5, and the lower end of the connecting rod 6-4 is connected to the edge stripping ring 6-10. A guide hole corresponding to the connecting rod 6-4 is provided on the main disk body 6-1, and the connecting rod 6-4 passes through the guide hole on the main disk body.

[0052] The force transmission ring 6-2 has a certain deformation ability. Before the stripping device strips the thin slice 3-2, the edge stripping ring 6-10 is bonded to the edge of the upper end face of the ingot 3, the force transmission ring 6-2 is in close contact with the upper end face of the annular boss, and the movable insert 6-6c is in the initial position. At this time, the movable insert 6-6c is located in the avoidance groove 6-2a on the force transmission ring 6-2. When the annular crack is formed by the edge stripping mechanism, the inner ring 6-6 is driven to rotate one circle by the rotary drive mechanism. When the inner ring 6-6 rotates, it drives the movable insert 6-6c to move between the force transmission ring 6-2 and the annular boss 6-1a. The contact position between the force transmission ring 6-2 and the movable insert 6-6c is bulged and deformed. When the force transmission ring 6-2 is bulged, the connecting rod 6-4 generates an upward pulling force on the edge stripping ring 6-10. Under the action of the pulling force, the force-bearing position on the edge stripping ring 6-10 is tilted, and the edge stripping ring 6-10 is deformed. The raised portion generates an upward pulling force on the edge of the thin sheet 3-2 above the modified layer 3-1, causing a crack between the thin sheet 3-2 and the crystal ingot 3 below the modified layer 3-1; during the rotation of the movable insert 6-6c, the point of action of the pulling force on the edge stripping ring 6-10 also moves accordingly, and the movement is carried out along the circumferential direction of the edge stripping ring 6-10; the crack spreads along the circumferential direction of the thin sheet 3-2, thereby forming an annular crack between the thin sheet 3-2 above the modified layer 3-1 and the crystal ingot 3 below the modified layer 3-1.

[0053] In this embodiment, the force transmission ring 6-2 and the edge stripping ring 6-10 are both made of spring steel, and the thickness of the force transmission ring 6-2 and the edge stripping ring 6-10 is 0.5-0.8 mm.

[0054] The rotation drive mechanism includes a motor 6-8 disposed on the outer ring 6-7, a gear ring 6-6b disposed on the body of the inner ring 6-6, a gear 6-9 connected to the motor 6-8, and the gear ring 6-6b meshes with the gear 6-9. The motor 6-8 drives the gear 6-9 to rotate, and the gear 6-9 drives the gear ring 6-6b to rotate, thereby rotating the inner ring 6-6. A ball 6-12 is disposed between the outer ring 6-7 and the inner ring 6-6, and the outer ring 6-7 and the inner ring 6-6 are kept in rotational cooperation by rolling down.

[0055] The upper end surface of the movable insert 6-6c is an arc surface, and the maximum thickness of the movable insert 6-6c is 1.5-2 mm. The movable insert 6-6c is made of tungsten alloy to improve its wear resistance.

[0056] Among them, the first crystal ingot base 1 and the second crystal ingot base 5 have the same structure, and the first crystal ingot base 1 and the second crystal ingot 3 both include a base body 1-1, and the base body 1-1 is provided with a positioning groove 1-2 and a pressing cylinder 1-3; the bottom of the crystal ingot 3 is bonded and fixed to the base support 2, and the base support 2 is placed in the positioning groove 1-2, and the base support 2 is pressed and fixed to the base body 1-1 by the pressing cylinder 1-3. In the present invention, the crystal ingot 3 is bonded to the base support 2, and the base support 2 facilitates the transfer of the crystal ingot 3 between the first crystal ingot base 1 and the second crystal ingot base 5. When the crystal ingot 3 is installed on the first crystal ingot base 1 or the second crystal ingot base 5, the base support 2 is pressed by the pressing cylinder 1-3, so that the base support 2 and the crystal ingot 3 can be stably placed on the first crystal ingot base 1 or the second crystal ingot base 5.

[0057] A method for using a laser cutting and stripping device comprises the following specific steps:

[0058] Step 1: placing the crystal ingot 3 on the first crystal ingot base 1, and performing laser processing on the crystal ingot 3 by using the laser head 4 to form a modified layer 3-1;

[0059] Step 2: Place the crystal ingot 3 on the second crystal ingot base 5, and bond the lower end faces of the edge stripping ring 6-10 and the stripping plate 6-11 to the upper end face of the crystal ingot 3 through an adhesive, and bond the edge stripping ring 6-10 to the edge of the upper end of the crystal ingot 3; adjust the height of the main plate body 6-1 through the lifting drive device 7, so that the force transmission ring 6-2 is in close contact with the upper end face of the annular boss 6-1a; the movable insert 6-6c is located in the avoidance groove 6-2a on the force transmission ring 6-2;

[0060] Step 3: After the edge stripping ring 6-10 and the stripping plate 6-11 are firmly bonded to the upper end surface of the ingot 3, the inner ring 6-6 is first driven to rotate one circle by the rotary drive mechanism. When the inner ring 6-6 rotates, the movable insert 6-6c is driven to move between the force transmission ring 6-2 and the annular boss 6-1a. The contact position between the force transmission ring 6-2 and the movable insert 6-6c is bulged and deformed. When the force transmission ring 6-2 is bulged, an upward pulling force is generated on the edge stripping ring 6-10 through the connecting rod 6-4. Under the action of the movable insert 6-6c, the force-bearing position on the edge stripping ring 6-10 is tilted, and the tilted position on the edge stripping ring 6-10 generates an upward pulling force on the edge of the thin sheet 3-2 above the modified layer 3-1, so that a crack is generated between the thin sheet 3-2 and the crystal ingot 3 below the modified layer 3-1; during the rotation of the movable insert 6-6c, the crack spreads along the circumferential direction of the thin sheet 3-2, so that an annular crack is formed between the thin sheet 3-2 above the modified layer 3-1 and the crystal ingot 3 below the modified layer 3-1;

[0061] Step 4: The lifting drive device 7 drives the stripping plate 6 to move upward, and the stripping plate 6 moves upward to separate the thin slice from the ingot 3 below the modified layer 3-1; during the separation process of the thin slice 3-2, the annular crack spreads toward the center of the thin slice 3-2.

[0062] After the slices are separated, the surface of the slices is ground, polished and other processes are performed to obtain wafers.

[0063] The present invention is not limited to the above-mentioned optimal implementation mode. Anyone can derive other various forms of products under the inspiration of the present invention. However, no matter what changes are made in the shape or structure, all technical solutions that are the same or similar to those of the present application fall within the protection scope of the present invention.

Claims

1. A laser cutting and peeling device, characterized in that: It includes a laser cutting device and a stripping device; The laser cutting device includes a laser head and a first ingot base for placing the ingot, and the laser emitted by the laser head forms a modified layer inside the ingot; The stripping device includes a second ingot base for placing the ingot, a stripping plate located above the second ingot base, and a lifting drive device for driving the stripping plate to move up and down; the stripping plate includes a main plate body and an edge stripping mechanism, a plurality of concentrically arranged stripping plates are arranged below the main plate body, and the edge separation mechanism includes a tension device and an edge stripping ring arranged below the main plate body, the edge stripping ring corresponds to the edge of the thin sheet above the modified layer, and the lower surfaces of the edge stripping ring and the stripping plate are both bonded to the upper surface of the ingot; The tension device applies an upward tension to the edge stripping ring, and the tension application position of the tension device on the edge stripping ring moves along the edge stripping ring; an annular crack is formed between the edge of the thin slice above the modified layer and the ingot below the modified layer through the edge separation mechanism.

2. The laser cutting and peeling equipment according to claim 1, characterized in that: The stripping plate is provided with a limit pin, and the stripping plate is connected to the main plate body through the limit pin; among the two adjacent stripping plates, the length of the limit pin on the outer stripping plate is shorter than the length of the limit pin on the inner stripping plate.

3. The laser cutting and peeling equipment according to claim 2, characterized in that: The main disk body is provided with a through hole corresponding to the limit pin, and the limit pin passes through the through hole; one end of the limit pin is fixedly connected to the stripping plate, and the other end is a limit end, and the diameter of the limit end is larger than the diameter of the through hole.

4. The laser cutting and stripping equipment according to claim 2, characterized in that: The tension device comprises a force transmission ring and an annular boss arranged at the upper end of the main disk body, wherein the force transmission ring is arranged on the annular boss; an outer ring is arranged on the outer side of the annular boss, the outer ring is fixedly connected to the main disk body, and an inner ring is rotatably arranged on the inner side of the outer ring; the inner ring comprises an inner ring body, and a movable insert is arranged on the inner side of the inner ring body, and the movable insert is inserted between the force transmission ring and the annular boss; a rotation driving mechanism is arranged between the outer ring and the inner ring, and the inner ring is driven to rotate by the rotation driving mechanism; an avoidance groove is arranged on the force transmission ring; the force transmission ring is located above the edge stripping ring, and the force transmission ring and the edge stripping ring are connected by a plurality of connecting rods; When the inner ring rotates, the movable insert is driven to move between the force transmission ring and the annular boss, and a bulge deformation occurs at the contact position between the force transmission ring and the movable insert. When the force transmission ring bulges, an upward pulling force is generated on the edge stripping ring through the connecting rod.

5. The laser cutting and stripping equipment according to claim 4, characterized in that: The force transmission ring and the edge stripping ring are both made of spring steel, and the thickness of the force transmission ring and the edge stripping ring is 0.5-0.8 mm.

6. The laser cutting and stripping equipment according to claim 4, characterized in that: The rotary drive mechanism comprises a motor arranged on the outer ring and a gear ring arranged on the inner ring body. The motor is connected with a gear, and the gear ring is meshed with the gear.

7. The laser cutting and stripping equipment according to claim 4, characterized in that: The upper end surface of the movable insert is an arc surface, and the maximum thickness of the movable insert is 1.5-2 mm.

8. The laser cutting and stripping equipment according to claim 1, characterized in that: The first crystal ingot base and the second crystal ingot base have the same structure. The first crystal ingot base and the second crystal ingot base both include a base body, and the base body is provided with a positioning groove and a clamping cylinder; the bottom of the crystal ingot is bonded and fixed to the base support, and the base support is placed in the positioning groove, and the base support is clamped and fixed to the base body by the clamping cylinder.

9. The laser cutting and stripping equipment according to claim 2, characterized in that: There are four stripping plates in total, which are the first stripping plate, the second stripping plate, the third stripping plate and the fourth stripping plate from the outside to the inside. The length of the limiting pull pin on the second stripping plate is 0.5-1 mm longer than the length of the limiting pull pin on the first stripping plate, the length of the limiting pull pin on the third stripping plate is 0.5-1 mm longer than the length of the limiting pull pin on the second stripping plate, and the length of the limiting pull pin on the fourth stripping plate is 0.5-1 mm longer than the length of the limiting pull pin on the third stripping plate.

10. A method for using a laser cutting and peeling device, based on the laser cutting and peeling device according to claim 4, characterized in that: The specific steps include: Step 1: placing the ingot on a first ingot base, and performing laser processing on the ingot by a laser head to form a modified layer; Step 2: Place the ingot on the second ingot base, adhere the lower end faces of the edge stripping ring and the stripping plate to the upper end face of the ingot through adhesive, and adhere the edge stripping ring to the edge of the upper end of the ingot; adjust the height of the main plate body through the lifting drive device so that the force transmission ring is in close contact with the upper end face of the annular boss; the movable insert is located in the avoidance groove on the force transmission ring; Step 3: After the edge stripping ring and the stripping plate are firmly bonded to the upper end surface of the crystal ingot, the inner ring is first driven to rotate for one circle by the rotary drive mechanism. When the inner ring rotates, the movable insert is driven to move between the force transmission ring and the annular boss. The contact position between the force transmission ring and the movable insert is bulged and deformed. When the force transmission ring is bulged, an upward pulling force is generated on the edge stripping ring through the connecting rod. Under the action of the pulling force, the force-bearing position on the edge stripping ring is tilted. The tilted position on the edge stripping ring generates an upward pulling force on the edge of the thin slice above the modified layer, so that a crack is generated between the thin slice and the crystal ingot below the modified layer. During the rotation of the movable insert, the cracks spread along the circumferential direction of the thin slice, so that an annular crack is formed between the thin slice above the modified layer and the ingot below the modified layer; Step 4: The lifting drive device drives the stripping plate to move upward, and the stripping plate drives the thin slice to separate from the ingot below the modified layer when moving upward; During the separation process of the thin slice, the annular crack spreads toward the center of the thin slice.

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