Cutter coating, preparation method thereof and cutting tool

Abstract

The invention relates to a tool coating, a preparation method thereof and a cutting tool. The cutter coating comprises a base layer, an interface modification layer and a functional layer which are sequentially stacked from inside to outside from the surface of a cutter base body, the base layer is an AMe1N layer, the interface modification layer is an ACrMe1Me2N layer, and the functional layer comprises a CrMe2N layer; the element A in the AMe1N layer accounts for 30%-100% of the atom number of the total element of the A and the Me1; in the ACrMe1Me2N layer, the atom content of the A element is gradually reduced from inside to outside, and the atom content of the Cr element is gradually increased from inside to outside; the element A is selected from Ti or Zr; the Me1 element is selected from at least one of W, Si, La, Ta, Mo and Al; the Me2 element is selected from at least one of W, Si, La, Ta, Mo, Al and B. According to the cutter coating with the structure, the interface effect of the priming layer and the functional layer can be improved, the binding force between the priming layer and the functional layer is improved, the binding force of the coating is further improved, and the phenomena that the coating falls off and is layered under the conditions of high strength and high-frequency impact are reduced.

Description

Technical Field

[0001] The invention relates to the technical field of cutting tools, and in particular to a cutting tool coating and a preparation method thereof, and a cutting tool. Background Art

[0002] With the rapid development of modern industry, the consumption of steel has increased rapidly. At the same time, the performance of steel has also been significantly improved with the development of aerospace, medical, semiconductor, 3C and other fields. The mechanical processing of steel is becoming more and more difficult. In addition, while the market is pursuing high processing quality, the demand for processing efficiency is also rising, which poses a higher challenge to tool technology.

[0003] In order to improve machining efficiency, machining parameters generally use high feed, large cutting depth and large cutting width, which increases cutting force and cutting temperature. In high-speed cutting, the cutting volume, speed and other parameters are large, so the vibration of the workpiece increases accordingly during cutting. During the cutting process, each cutting edge not only experiences the high-frequency impact brought by the workpiece during cutting, but also bears the severe impact brought by the irregular vibration of the workpiece. The deterioration of the above cutting environment makes the tool wear more severe, resulting in a short tool life and frequent tool changes, which affects the machining efficiency.

[0004] Coating technology is an effective means to improve tool processing performance. When processing steel, AlTiN and AlCrN coatings are usually prepared on the surface of the cutting tool to improve the wear resistance of the tool and increase the tool life. However, during high-speed cutting, the coating often breaks, breaks, and falls off due to excessive processing temperature and high-frequency impact during the processing, which reduces the tool life. Summary of the invention

[0005] Based on this, it is necessary to provide a tool coating and a preparation method thereof, as well as a cutting tool having high bonding strength, good wear resistance and not prone to chipping.

[0006] The first aspect of the present invention provides a tool coating, comprising a base layer, an interface modification layer and a functional layer stacked in sequence from the inside to the outside of the tool substrate surface; the base layer is an AMe1N layer, the interface modification layer is an ACrMe1Me2N layer, and the functional layer includes a CrMe2N layer; the number of atoms of the A element in the AMe1N layer accounts for 30% to 100% of the total number of elements A and Me1;

[0007] In the ACrMe1Me2N layer, the atomic content of the A element gradually decreases from the inside to the outside, and the atomic content of the Cr element gradually increases from the inside to the outside;

[0008] The A element is selected from Ti or Zr; the Me1 element is selected from at least one of W, Si, La, Ta, Mo and Al; and the Me2 element is selected from at least one of W, Si, La, Ta, Mo, Al and B.

[0009] The tool coating has an AMe1N layer as a base layer, an ACrMe1Me2N layer as an interface modification layer, and a CrMe2N layer as a functional layer. Among them, the base layer is based on TiN or ZrN, and Me1 can be selectively added. The coating of this system structure has good toughness and strong resistance to high-intensity and high-frequency impact. The functional layer adds a specific element Me2 with high-temperature resistance to the CrN basic system to form a CrMe2N layer, which can improve the high-temperature oxidation resistance and wear resistance of the tool coating. Specifically, the high-temperature resistance can be improved to above 1200°C, and the hardness is maintained above 38GPa at high temperatures. In addition, CrMe2N can act as a thermal barrier, reduce the conduction of surface cutting heat to the base layer, and inhibit fatigue failure of the base layer caused by high temperature. Furthermore, an ACrMe1Me2N layer with gradually changing A and Cr elements is provided in the base layer and the functional layer, so as to realize the element transition between the TiN or ZrN-based system in the base layer and the CrN-based system in the functional layer, improve the interface effect between the base layer and the functional layer, improve the bonding force between the base layer and the functional layer, further improve the bonding force of the coating, and reduce the phenomenon of coating shedding and coating delamination under high-intensity and high-frequency impact conditions. The above tool coating can significantly increase the service life of the cutting tool and improve the working efficiency of the cutting process.

[0010] In some embodiments, the tool coating satisfies at least one of the following conditions:

[0011] (1) The thickness of the primer layer is 0.05 μm to 2 μm;

[0012] (2) The thickness of the interface modification layer is 0.05 μm to 2 μm;

[0013] (3) The thickness of the functional layer is 0.5 μm to 20 μm.

[0014] In some embodiments, the Me1 and the Me2 do not contain the same element;

[0015] The A element in the AMe1N layer is not 100%. In the ACrMe1Me2N layer, the total atomic content of the A element and the Me1 element gradually decreases from the inside to the outside, and the total atomic content of the Cr element and the Me2 element gradually increases from the inside to the outside.

[0016] In some embodiments, in terms of atomic percentage, the atomic ratio of the A element to the Me1 element and the atomic ratio of the Cr element to the Me2 element from the inside to the outside of the ACrMe1Me2N remain unchanged.

[0017] In some embodiments, the atomic number of Cr element in the CrMe2N layer accounts for 30% to 50% of the total number of Cr and Me2 elements.

[0018] In some embodiments, in terms of atomic number percentage, at a position closest to the interface between the AMe1N layer and the ACrMe1Me2N layer, the atomic ratio of the A element to the Me1 element in the AMe1N layer is the same as the atomic ratio of the A element to the Me1 element in the ACrMe1Me2N layer; and / or

[0019] At a position closest to the interface between the ACrMe1Me2N layer and the CrMe2N layer, the atomic ratio of the Cr element to the Me2 element in the ACrMe1Me2N layer is the same as the atomic ratio of the Cr element to the Me2 element in the CrMe2N layer.

[0020] In some embodiments, in terms of atomic percentage, the A element, Me1 element, Me2 element and Cr element in the ACrMe1Me2N layer satisfy the following atomic ratio relationship: (A+Me1):(Cr+Me2) gradually changes from 20:1 to 1:20 from the inside to the outside.

[0021] In some embodiments, the AMe1N layer is a single structure layer, and the atomic contents of the A element and the Me1 element in the AMe1N layer remain unchanged.

[0022] In some embodiments, in the AMe1N layer, the atomic number of the A element accounts for 40% to 95% of the total number of elements A and Me1.

[0023] In some embodiments, the AMe1N layer is an atomic gradient structure layer, in which the content of A atoms in the AMe1N layer gradually decreases from the inside to the outside, and the content of Me1 atoms in the AMe1N layer gradually increases from the inside to the outside.

[0024] In some embodiments, the atomic percentage of the A element in the AMe1N layer to the total number of elements A and Me1 gradually changes from 95% to 30%.

[0025] In some embodiments, the AMe1N layer is an atomic gradient structure layer, in which the atomic content of the A element in the AMe1N layer decreases in a gradient manner from the inside to the outside, and the atomic content of the Me1 element increases in a gradient manner from the inside to the outside.

[0026] In some embodiments, the atomic percentage of the A element in the AMe1N layer to the total number of elements A and Me1 varies from 95% to 80% to 60% in multiple gradients.

[0027] In some embodiments, the functional layer further includes a lubricating layer stacked on a side of the CrMe2N layer away from the interface modification layer, and the lubricating layer includes at least one of a TiB2 layer, a WC layer, a MoS2 layer and a tetrahedral amorphous carbon coating.

[0028] A second aspect of the present invention provides a method for preparing the above-mentioned tool coating, comprising the following steps:

[0029] The primer layer, the interface modification layer and the functional layer are sequentially formed on the surface of the tool substrate.

[0030] In some embodiments, the preparation method satisfies at least one of the following conditions:

[0031] (1) forming the base layer by magnetron sputtering deposition;

[0032] (2) forming the interface modification layer by magnetron sputtering deposition;

[0033] (3) The functional layer is formed by alternating cathode arc deposition and magnetron sputtering.

[0034] In some embodiments, when forming the interface modification layer, the power of the magnetron sputtering target containing the A element is gradually reduced, and the power of the magnetron sputtering target containing the Cr element is gradually increased.

[0035] A third aspect of the present invention provides a cutting tool, comprising a tool substrate and the above-mentioned tool coating provided on the surface of the tool substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are merely embodiments of the present application, and ordinary technicians in this field can obtain other drawings based on the disclosed drawings without paying any creative work.

[0037] Figure 1 It is a schematic diagram of the cross-sectional structure of a tool coating according to one embodiment of the present application.

[0038] Figure 2 This is a picture of the tool head of the cutting tool prepared in Example 4 after machining 316L stainless steel for 60 minutes.

[0039] Figure 3 This is a picture of the tool head of the cutting tool prepared in comparative example 2 after machining 316L stainless steel for 10 minutes.

[0040] Figure 4A schematic diagram is provided for the evaluation criteria for the bonding force between the coating and the tool substrate as specified in the VDI3198 standard.

[0041] Description of reference numerals:

[0042] 100. Tool base;

[0043] 200. Tool coating;

[0044] 210. Lay the base layer;

[0045] 220, interface modification layer;

[0046] 230, functional layer;

[0047] 231, CrMe2N layer;

[0048] 232. Lubricating layer. DETAILED DESCRIPTION

[0049] In order to facilitate the understanding of the present invention, the present invention is described more comprehensively below. And preferred embodiments of the present invention are given. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. It should be understood that the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0050] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0051] In the description of the present invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0052] The weight of the relevant components mentioned in the description of the embodiments of the present invention may not only refer to the specific content of each component, but also indicate the weight ratio between the components. Therefore, as long as the content of the relevant components is proportionally enlarged or reduced according to the description of the embodiments of the present invention, it is within the scope disclosed in the description of the embodiments of the present invention. Specifically, the weight described in the description of the embodiments of the present invention may be a mass unit known in the chemical industry such as μg, mg, g, kg, etc.

[0053] In one embodiment of the present application, a tool coating is provided, comprising a base layer, an interface modification layer and a functional layer stacked in sequence from the inside to the outside of the tool substrate surface; the base layer is an AMe1N layer, the interface modification layer is an ACrMe1Me2N layer, and the functional layer includes a CrMe2N layer;

[0054] The atomic number of A element in the AMe1N layer accounts for 30% to 100% of the total number of elements in A and Me1;

[0055] In the ACrMe1Me2N layer, the atomic content of the A element gradually decreases from the inside to the outside, and the atomic content of the Cr element gradually increases from the inside to the outside;

[0056] The A element is selected from Ti or Zr; the Me1 element is selected from at least one of W, Si, La, Ta, Mo and Al; and the Me2 element is selected from at least one of W, Si, La, Ta, Mo, Al and B.

[0057] The tool coating has an AMe1N layer as a base layer, an ACrMe1Me2N layer as an interface modification layer, and a CrMe2N layer as a functional layer. Among them, the base layer is based on TiN or ZrN, and Me1 can be selectively added. The coating of this basic system structure has good toughness and strong resistance to high-intensity and high-frequency impact. The functional layer adds a specific element Me2 with high-temperature resistance to the CrN basic system to form a CrMe2N layer, which can improve the high-temperature oxidation resistance and wear resistance of the tool coating. Specifically, the high-temperature resistance can be improved to above 1200°C, and the hardness is maintained above 38GPa at high temperatures. In addition, CrMe2N can act as a thermal barrier, reduce the conduction of surface cutting heat to the base layer, and inhibit fatigue failure of the base layer caused by high temperature. Furthermore, an ACrMe1Me2N layer with gradually changing A and Cr elements is provided in the base layer and the functional layer, so as to realize the element transition between the TiN or ZrN-based system in the base layer and the CrN-based system in the functional layer, improve the interface effect between the base layer and the functional layer, improve the bonding force between the base layer and the functional layer, further improve the bonding force of the coating, and reduce the phenomenon of coating shedding and coating delamination under high-intensity and high-frequency impact conditions. The above tool coating can significantly increase the service life of the cutting tool and improve the working efficiency of the cutting process.

[0058] The above-mentioned “the atomic content of the element A gradually decreases from the inside to the outside” means that the atomic content of the element A decreases continuously and uniformly from the inside to the outside.

[0059] The above-mentioned “the atomic content of the Cr element gradually increases from the inside to the outside” means that the atomic content of the Cr element increases continuously and uniformly from the inside to the outside.

[0060] The above “the atomic number ratio of A element in the AMe1N layer to the total number of elements A and Me1 is 40% to 100%” can be understood as that the atomic number ratio of A element in the AMe1N layer to the total number of elements A and Me1 can be 40%, 45%, 50%, 55%, 60%, 70%, 80%, 90% or 100%; further, the atomic number ratio of A element to the total number of elements A and Me1 can be a range value consisting of any two of the above point values ​​as end values. Furthermore, when the atomic number ratio of A element in the AMe1N layer to the total number of elements A and Me1 can be 100%, it means that the above-mentioned base layer is an AN layer. When the base layer is an AN layer, the ACrMe1Me2N layer is actually an ACrMe2N layer.

[0061] The above “Me1 element is selected from at least one of W, Si, La, Ta, Mo and Al” can be understood as the Me1 element can be one of the above elements or multiple elements of the above elements. Further, the Me1 element in the AMe1N layer is one of the elements, and the Me1 element in the ACrMe1Me2N layer is also the same element; the Me1 element in the AMe1N layer is multiple elements of the above elements, and the Me1 element in the ACrMe1Me2N layer is also a combination of multiple elements of the same element.

[0062] The above-mentioned "Me2 element is selected from at least one of W, Si, La, Ta, Mo, Al and B" can be understood as the Me2 element can be one of the above elements or multiple elements of the above elements. Furthermore, the Me2 element in the CrMe2N layer is one of the above elements, and the Me2 element in the ACrMe1Me2N layer is also the same element; the Me2 element in the CrMe2N layer is a combination of multiple elements of the above elements, and the Me1 element in the ACrMe1Me2N layer is also a combination of multiple elements of the same element.

[0063] In some embodiments, in terms of atomic percentage, the sum of the atomic numbers of the A element and the Me1 element in AMe1N accounts for 30% to 80% of the total atomic numbers of the A element, the Me1 element, and the N element.

[0064] In some embodiments, the thickness of the primer layer of the coating is 0.05 μm to 2 μm.

[0065] In some embodiments, the thickness of the interface modification layer is 0.05 μm to 2 μm.

[0066] In some embodiments, the thickness of the functional layer is 0.5 μm to 20 μm.

[0067] In some embodiments, the above-mentioned Me1 and Me2 do not contain the same element, the A element in the AMe1N layer is not 100%, and in the ACrMe1Me2N layer, the total atomic content of the A element and the Me1 element gradually decreases from the inside to the outside, and the total atomic content of the Cr element and the Me2 element gradually increases from the inside to the outside.

[0068] In some embodiments, the atomic ratio of A element to Me1 element and the atomic ratio of Cr element to Me2 element from inside to outside in ACrMe1Me2N remain unchanged. In ACrMe1Me2N, the atomic ratio of A element to Me1 element and the atomic ratio of Cr element to Me2 element from inside to outside remain unchanged, while the total atomic content of A element and Me1 element gradually decreases from inside to outside, and the total atomic content of Cr element and Me2 element gradually increases from inside to outside, which can further improve the uniform change of each element in the interface modification layer, further improve the element transition between the AMe1N layer of the entire base layer and the CrMe2N layer of the functional layer, improve the interface bonding force between the base layer and the functional layer, and prevent the delamination and shedding of the tool coating.

[0069] In some embodiments, the atomic ratio of Cr in the CrMe2N layer to the total atomic ratio of Cr and Me2 is 30% to 50%. It can be understood that the atomic ratio of Cr in the CrMe2N layer to the total atomic ratio of Cr and Me2 can be 30%, 35%, 40%, 45% or 50%. Further, the atomic ratio of Cr in the CrMe2N layer to the total atomic ratio of Cr and Me2 can be a range value consisting of any two of the above point values ​​as end values.

[0070] In some embodiments, measured by atomic number percentage, in some embodiments, measured by atomic number percentage, at the interface between the AMe1N layer and the ACrMe1Me2N layer, the atomic ratio of the A element to the Me1 element in the AMe1N layer is the same as the atomic ratio of the A element to the Me1 element in the ACrMe1Me2N layer.

[0071] As an example, the atomic ratio of A element to Me1 element in the AMe1N layer closest to the interface between the AMe1N layer and the ACrMe1Me2N layer is 90:10, and the atomic ratio of A element to Me1 element in the ACrMe1Me2N layer closest to the interface between the AMe1N layer and the ACrMe1Me2N layer is also 90:10.

[0072] In some embodiments, in terms of atomic percentage, the atomic ratio of Cr to Me2 in the ACrMe1Me2N layer closest to the interface with the CrMe2N layer is the same as the atomic ratio of Cr to Me2 in the CrMe2N layer.

[0073] As an example, the atomic ratio of Cr element to Me2 element in the CrMe2N layer closest to the interface between the CrMe2N layer and the ACrMe1Me2N layer is 50:50, and the atomic ratio of Cr element to Me2 element in the ACrMe1Me2N layer closest to the interface between the CrMe2N layer and the ACrMe1Me2N layer is also 50:50.

[0074] In some embodiments, in terms of atomic percentage, the A element, Me1 element, Me2 element, and Cr element in the ACrMe1Me2N layer satisfy the following atomic ratio relationship: (A+Me1):(Cr+Me2) gradually changes from 20:1 to 1:20 from the inside to the outside. It can be understood that (A+Me1):(Cr+Me2) changes continuously and uniformly from 20:1 to 1:20 from the inside to the outside.

[0075] In some embodiments, the AMe1N layer is a single structure layer, and the atomic contents of the A element and the Me1 element in the AMe1N layer remain unchanged.

[0076] In some embodiments, in the AMe1N layer, the atomic number of the A element accounts for 40% to 95% of the total number of elements A and Me1.

[0077] In some embodiments, the AMe1N layer is an atomic gradient structure layer, in which the content of A atoms in the AMe1N layer gradually decreases from the inside to the outside, and the content of Me1 atoms in the AMe1N layer gradually increases from the inside to the outside. It can be understood that in the AMe1N layer, the content of A atoms decreases continuously and uniformly from the inside to the outside; the content of Me1 atoms increases continuously and uniformly from the inside to the outside.

[0078] In some embodiments, the atomic ratio of the A element to the total number of elements A and Me1 in the AMe1N layer gradually changes from 95% to 40%. It is understood that the atomic ratio of the Me1 element to the total number of elements A and Me1 in the AMe1N layer gradually changes from 5% to 60%. It is also understood that in the AMe1N layer, the atomic ratio of the A element to the Me1 element gradually changes from 95:5 to 40:60.

[0079] In some embodiments, the AMe1N layer is an atomic gradient change structure layer, and the atomic content of the A element in the AMe1N layer decreases in a gradient from the inside to the outside, and the atomic content of the Me1 element increases in a gradient from the inside to the outside. It can be understood that the atomic content of the A element in the AMe1N layer can be uniformly reduced in a gradient from the inside to the outside, wherein the change value between each adjacent two gradients is the same; the atomic content of the Me1 element also increases uniformly in a gradient from the inside to the outside, wherein the change value between each adjacent two gradients is the same. It can also be understood that when the atomic content of the A element in the AMe1N layer decreases in a gradient from the inside to the outside, the change value between each adjacent two gradients can be different, and the atomic content of the Me1 element also increases in a gradient from the inside to the outside, wherein the change value between each adjacent two gradients can also be different.

[0080] In some embodiments, the atomic number ratio of the A element in the AMe1N layer to the total number of elements of A and Me1 changes from 95% to 80% to 60% in multiple gradients. It can be understood that the atomic number ratio of the A element to the total number of elements of A and Me1 on the first gradient close to the tool substrate is 95%, and the atomic number ratio of the A element to the total number of elements of A and Me1 on the last gradient closest to the ACrMe1Me2N layer can be 80%, 75%, 70%, 65% or 60%. Furthermore, the atomic number ratio of the A element to the total number of elements of A and Me1 on the last gradient can be a range value consisting of any two of the above point values.

[0081] As an example, the atomic ratio of the A element in the AMe1N layer to the total number of elements A and Me1 varies from 95%, 90%, 85% to 80% from the first gradient closest to the tool substrate to the last gradient closest to the ACrMe1Me2N layer, or varies from 95%, 90%, 80% to 60%, or varies from 95%, 90%, 80% to 70%. It can also be understood that the atomic ratio of the A element to the Me1 element varies from 95:5, 90:10, 85:15, 80:20, or varies from 95:5, 90:10, 80:20, 60:40, or varies from 95:5, 90:10, 80:20, 70:30 from the first gradient closest to the tool substrate to the last gradient closest to the ACrMe1Me2N layer.

[0082] In some embodiments, Me1 and Me2 contain the same element, and in terms of atomic percentage, the A element and the Cr element in the ACrMe1Me2N layer satisfy the following atomic ratio relationship, A:Cr gradually changes from (2~20):1 to 1:(2~20) from the inside to the outside. It can be understood that A:Cr gradually changes from 20:1 to 1:20, from 18:1 to 1:18, from 15:1 to 1:15, from 10:1 to 1:10, from 2:1 to 1:2 from the inside to the outside, or other gradual changes within the above-mentioned ratio range. Furthermore, the above-mentioned gradual change can be a continuous and uniform change in the ratio of the number of atoms of the A element to the Cr element.

[0083] In some embodiments, the functional layer further includes a lubricating layer stacked on a side of the CrMe2N layer away from the interface modification layer.

[0084] In some embodiments, the lubricating layer includes at least one of a TiB2 layer, a WC layer, a MoS2 layer, and a tetrahedral amorphous carbon coating. Using at least one of a TiB2 layer, a WC layer, a MoS2 layer, and a tetrahedral amorphous carbon coating as a solid lubricant can further reduce the friction coefficient of the coating. In the high-speed cutting process, it plays a role in reducing cutting force, accelerating chip discharge, reducing cutting heat, weakening high-temperature oxidation of the coating, and inhibiting tool sticking.

[0085] In another embodiment of the present application, a method for preparing the above-mentioned tool coating is provided, comprising the following preparation steps:

[0086] A primer layer, an interface modification layer and a functional layer are sequentially formed on the surface of the tool substrate.

[0087] In some embodiments, the primer layer is formed by magnetron sputtering deposition.

[0088] In some embodiments, when the base layer is formed by magnetron sputtering deposition, an adjustable pulse magnetron sputtering device is used for deposition.

[0089] In some embodiments, when the base layer is formed by magnetron sputtering deposition, the target material used is a mosaic target of A and Me1, and Me1 is embedded in the A metal, and the Me1 material occupies 10% to 90% of the entire target area.

[0090] In some embodiments, when the base layer is formed by magnetron sputtering deposition, the target material used is metal A.

[0091] In some embodiments, when the base layer is formed by magnetron sputtering deposition, the pulse frequency of the adjustable pulse magnetron sputtering device is 10 Hz to 10000 Hz, and the pulse opening time is 10 μs to 99 ms.

[0092] In some embodiments, in the process of forming the base layer by magnetron sputtering deposition, the magnetron sputtering power of the adjustable pulse magnetron sputtering device is 500W~50kW. It can be understood that the magnetron sputtering power can be a fixed value when forming the base layer, so that a base layer with a single structure can be formed; it can also be a continuous or intermittent change value, so that an atomic gradient structure layer or an atomic gradient change layer can be formed. When the magnetron sputtering power is a fixed value when forming the base layer, it can be 500W, 1kW, 10kW, 30kW or 50kW. Further, when forming the base layer, the magnetron sputtering power can be a range value composed of any of the above point values ​​as end values. When the magnetron sputtering power is a variable value when forming the base layer, it can be a variable value within the above range of 500W~50kW, or a variable value within the range of 500W~1kW, 1kW~10kW or 30kW~50kW, or other small range variable values ​​within the above range.

[0093] In some embodiments, when the base layer is formed by magnetron sputtering deposition, the working gas pressure is 0.2Pa~5Pa, and the working gas is nitrogen and argon with a partial pressure ratio of (0.1~8):1.

[0094] In some embodiments, when the base layer is formed by magnetron sputtering deposition, the deposition time is 10 min to 500 min.

[0095] In some embodiments, when the base layer is formed by magnetron sputtering deposition, the substrate bias voltage is 20V to 800V.

[0096] In some embodiments, the interface modification layer is formed by magnetron sputtering deposition.

[0097] In some embodiments, when the interface modification layer is formed by magnetron sputtering deposition, an adjustable pulse magnetron sputtering device is used.

[0098] In some embodiments, when the interface modification layer is formed by magnetron sputtering deposition, the adjustable pulse magnetron sputtering device has at least two magnetron sputtering cathodes.

[0099] In some embodiments, when the interface modification layer is formed by magnetron sputtering deposition, the target material of at least one magnetron sputtering cathode configuration used in the adjustable pulse magnetron sputtering equipment is a mosaic target of Cr metal and Me2 metal, and the Me2 metal occupies 10% to 90% of the entire target area.

[0100] In some embodiments, when the interface modification layer is formed by magnetron sputtering deposition, the target material of at least one magnetron sputtering cathode configuration used in the adjustable pulse magnetron sputtering equipment is an inlaid target of A metal and Me1 metal, and the Me1 metal occupies 10% to 90% of the entire target area.

[0101] In some embodiments, when the interface modification layer is formed by magnetron sputtering deposition, the target material of at least one magnetron sputtering cathode configuration used in the adjustable pulse magnetron sputtering device is A metal.

[0102] In some embodiments, when forming the interface modification layer, the power of the magnetron sputtering target containing the A element is gradually reduced, and the power of the magnetron sputtering target containing the Cr element is gradually increased.

[0103] In some embodiments, in the process of forming the interface modification layer by magnetron sputtering deposition, the magnetron sputtering power is 500W~50kW. It is understood that the magnetron sputtering power in the process of forming the interface modification layer is a gradually changing value, so that the atomic content of the A element can be gradually reduced from the inside to the outside, and the atomic content of the Cr element can be gradually increased from the inside to the outside. In the process of forming the interface modification layer, the magnetron sputtering power can be a gradually changing value in the range of 500W~1kW, 1kW~10kW or 30kW~50kW, or it can be a value in any other small range within the above-mentioned 500W~50kW range.

[0104] In some embodiments, when the interface modification layer is formed by magnetron sputtering deposition, the pulse on time is 10 μs to 99 ms.

[0105] In some embodiments, when the interface modification layer is formed by magnetron sputtering deposition, the total working gas pressure is 0.2Pa~5Pa, and the working gas is nitrogen and argon with a partial pressure ratio of (1~8):1.

[0106] In some embodiments, when the interface modification layer is formed by magnetron sputtering deposition, the deposition time is 10 min to 100 min.

[0107] In some embodiments, when the interface modification layer is formed by magnetron sputtering deposition, the substrate bias voltage is 20V-500V.

[0108] In some embodiments, the method of forming the functional layer by alternating cathode arc deposition and magnetron sputtering deposition includes the following steps:

[0109] The CrMe2N layer is formed by alternating cathode arc deposition and magnetron sputtering deposition.

[0110] The coating obtained by using the cathode arc deposition method alone has high stress and is easy to break when subjected to high-intensity and high-frequency impact during the cutting process; the coating obtained by using magnetron sputtering alone has low stress and good toughness, but insufficient wear resistance. The present application adopts the cathode arc deposition and magnetron sputtering deposition methods in an alternating deposition manner, which can reduce the stress of the entire coating and improve its toughness, thereby improving the coating's anti-breakage performance.

[0111] In some embodiments, when the CrMe2N layer is formed by cathode arc deposition, the current of the cathode arc is set to 40A~300A, the working gas pressure is 0.5Pa~10Pa, and the working gas is pure nitrogen.

[0112] In some embodiments, the substrate bias voltage during cathode arc deposition is 30V to 400V.

[0113] In some embodiments, the cathode arc deposition time is 5 min to 200 min.

[0114] In some embodiments, when the CrMe2N layer is formed by magnetron sputtering deposition, the pulse frequency of the magnetron sputtering is 10 Hz to 10000 Hz, and the pulse on time is 10 μs to 99 ms.

[0115] In some embodiments, the magnetron sputtering power is 500W~50kW.

[0116] In some embodiments, the working gas pressure of magnetron sputtering deposition is 0.2Pa~4Pa, and the working gas is nitrogen and argon with a partial pressure ratio of (2.5~8):1.

[0117] In some embodiments, the magnetron sputtering deposition time is 20 min to 300 min.

[0118] In some embodiments, the substrate bias voltage for magnetron sputtering deposition is 40V-600V.

[0119] In some embodiments, when forming the CrMe2N layer, cathode arc deposition and magnetron sputtering deposition are alternated at least once, and the ratio of the thickness of the CrMe2N layer formed by cathode arc deposition to the thickness of the CrMe2N layer formed by magnetron sputtering deposition is (0.1-15):1.

[0120] In some embodiments, after forming the CrMe2N layer, the preparation method further includes the step of forming a lubricating layer on the surface of the CrMe2N layer.

[0121] In some embodiments, the TiB2 layer, the WC layer, and the MoS2 layer may be formed by magnetron sputtering deposition.

[0122] In some embodiments, the tetrahedral amorphous carbon coating is formed by cathode arc deposition.

[0123] In some embodiments, when forming a tetrahedral amorphous carbon coating, the cathode arc current is set to 20A to 300A, and the working gas pressure is 10 -4 Pa~3Pa, the working gas is argon; the substrate bias is 0V~50000V.

[0124] In one embodiment of the present application, a cutting tool is provided, comprising a tool base and the tool coating provided on the surface of the tool base. It is understood that the tool coating can be provided on a part of the surface of the tool base or on the entire outer surface of the tool base.

[0125] See also Figure 1 An exemplary tool is provided with a tool coating 200, the tool comprising a tool substrate 100 and a base layer 210, an interface modification layer 210 and a functional layer 230 stacked sequentially from the inside to the outside of the tool substrate 100 surface, the functional layer 230 comprising a CrMe2N layer 231 and a lubricating layer 232 stacked sequentially on the side of the interface modification layer 210 away from the base layer 210.

[0126] In some embodiments, the tool substrate of the cutting tool is made of cemented carbide material.

[0127] In some embodiments, the mass percentage of Co in the cemented carbide is 9% to 12%.

[0128] In some embodiments, the cemented carbide contains tungsten carbide particles with an average particle size of ≤800 nm.

[0129] In some embodiments, the hardness of the cemented carbide is ≥18 GPa.

[0130] In some embodiments, the cutting tool has a tool edge diameter of 0.01 mm to 20 mm and a length of 3 mm to 200 mm.

[0131] In order to make the purpose, technical solutions and advantages of the present invention more concise and clear, the present invention is described with the following specific embodiments, but the present invention is by no means limited to these embodiments. The embodiments described below are only preferred embodiments of the present invention, which can be used to describe the present invention and cannot be understood as limiting the scope of the present invention. It should be pointed out that any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0132] In order to better illustrate the present invention, the present invention is further described below in conjunction with the embodiments. The following are specific embodiments.

[0133] The blade substrate used in the examples and comparative examples of the present application is a cemented carbide having a cobalt content of 8%.

[0134] Example 1

[0135] (1) Degreasing: Place the tool to be coated with a blade diameter of 10 mm in acetone, distilled water, and alcohol respectively, and use ultrasound to clean the oil mist on its surface. Use each liquid to clean for 40 minutes, and then blow dry with dry air after cleaning.

[0136] (2) Tool clamping: Place the cleaned tool on a fixture dedicated to vacuum coating, and then place it on the planetary turret of the vacuum coating equipment. Set the fixture to a 3x rotation mode. The tool is placed on the fixture with the entire slot length exposed so that it is fully covered by the coating.

[0137] (3) Vacuuming and preheating before coating: Close the hatch of the vacuum coating equipment and use the vacuum system to pump the air pressure in the vacuum chamber of the equipment to 1.0×10 -3 Pa, heat the vacuum chamber to 400℃ and keep it warm for 60min.

[0138] (4) Deposition of base layer: Deposition is carried out using adjustable pulse magnetron sputtering technology. The specific method is: use a mosaic target with Ti and W as the target material, embed W in Ti metal, and the W material occupies 10% of the entire target area. The pulse frequency of adjustable pulse magnetron sputtering is 3000Hz, the pulse opening time is 80μs, and the magnetron sputtering power is 1.2kW. During operation, the overall gas pressure is 1.2Pa, of which the partial pressure ratio of nitrogen and argon is 1:3, the deposition time is 10min, and the substrate bias is 300V.

[0139] The formed base layer is a single-structure TiWN layer with a thickness of 0.2 μm and an atomic ratio of Ti:W=95:5.

[0140] (5) Deposition of interface modification layer: Deposition is carried out by adjustable pulse magnetron sputtering technology. The specific method is as follows: two magnetron sputtering cathodes are turned on, one of which is configured with a Ti and W inlaid target consistent with step (4), and the other cathode is configured with a Cr and Si inlaid target, where Si occupies 30% of the entire target area. The angle between the two cathodes relative to the center of the vacuum chamber is 60 degrees. The pulse frequency of the adjustable pulse magnetron sputtering of the two cathodes is 3000Hz, the pulse opening time is 80μs, and the magnetron sputtering power is gradually and evenly reduced from 1.2kW to 600W (TiW target) and gradually and evenly increased from 900W to 2kW (CrSi target). The gas pressure is 1.8Pa, in which the partial pressure ratio of nitrogen to argon is 1:1, the deposition time is 30min, and the substrate bias is 300V.

[0141] The formed interface modification layer is a TiCrSiWN layer with a thickness of 0.5 μm; the atomic ratio of (Ti+W):(Cr+Si) gradually changes from the inside to the outside and changes from 9:1 to 1:1.

[0142] (6) Deposition of wear-resistant functional layer: cathode arc technology and adjustable pulse magnetron sputtering technology are used for co-deposition, and the two technologies are used to alternately deposit the layers twice. When depositing with cathode arc technology, a CrSi alloy target is used, in which the atomic ratio of Cr to Si is 70:30, the cathode arc current is 150A, the gas pressure is 3Pa, the gas is pure nitrogen, the substrate bias is 150V, and the deposition time is 20min. When depositing with adjustable pulse magnetron sputtering technology, a mosaic target of Cr and Si is used, in which Si accounts for 30% of the entire target area. The pulse frequency of adjustable pulse magnetron sputtering is 3000Hz, the pulse opening time is 80μs, and the magnetron sputtering power is 2kW. During operation, the overall gas pressure is 2.0Pa, in which the partial pressure ratio of nitrogen to argon is 2.5:1, the deposition time is 150min, and the substrate bias is 200V.

[0143] The wear-resistant functional layer formed is a CrSiN layer with a thickness of 1.5 μm and Cr:Si=83:17.

[0144] (7) Deposition of lubricating layer: using adjustable pulse magnetron sputtering technology. The specific method is: using TiB target as target material, the pulse frequency of adjustable pulse magnetron sputtering is 8000Hz, the pulse opening time is 10μs, and the magnetron sputtering power is 6kW. During operation, the overall gas pressure is 1Pa, the deposition time is 100min, and the substrate bias is 200V.

[0145] The lubricating sub-layer formed is a TiB layer with a thickness of 0.8 μm.

[0146] Example 2

[0147] (1) Degreasing: Place the tool to be coated with a blade diameter of 10 mm in acetone, distilled water, and alcohol respectively, and use ultrasound to clean the oil mist on its surface. Use each liquid to clean for 30 minutes. After cleaning, blow dry with dry air.

[0148] (2) Tool clamping: Place the cleaned tool on a fixture dedicated to vacuum coating, and then place it on the planetary turret of the vacuum coating equipment. Set the fixture to a 3x rotation mode. The tool is placed on the fixture with the entire slot length exposed so that it is fully covered by the coating.

[0149] (3) Vacuuming and preheating before coating: Close the hatch of the vacuum coating equipment and use the vacuum system to pump the air pressure in the vacuum chamber of the equipment to 1.0×10 -3 Pa, heat the vacuum chamber to 400℃ and keep it warm for 180min.

[0150] (4) Deposition of base layer: Deposition is carried out using adjustable pulse magnetron sputtering technology. The specific method is: use a mosaic target with Zr and Si as the target material, embed Si in Zr metal, and the Si material occupies 20% of the entire target area. The pulse frequency of adjustable pulse magnetron sputtering is 5000Hz, the pulse opening time is 100μs, and the magnetron sputtering power is 1kW. During operation, the overall gas pressure is 1.5Pa, of which the partial pressure ratio of nitrogen and argon is 1:6, the deposition time is 30min, and the substrate bias is 200V.

[0151] The formed base layer is a single-structure ZrSiN layer with a thickness of 0.3 μm and an atomic ratio of Zr:Si=85:15.

[0152] (5) Deposition of interface modification layer: Deposition is carried out by adjustable pulse magnetron sputtering technology. The specific method is as follows: two magnetron sputtering cathodes are turned on, one of which is configured with a Zr and Si mosaic target consistent with step (4), and the other cathode is configured with a Cr and W mosaic target, where W occupies 10% of the entire target area. The angle between the two cathodes relative to the center of the vacuum chamber is 90 degrees. The pulse frequency of the adjustable pulse magnetron sputtering of the two cathodes is 5000Hz, the pulse opening time is 100μs, and the magnetron sputtering power is gradually and evenly reduced from 1kW to 500W (ZrSi target) and gradually and evenly increased from 1kW to 3kW (CrW target). The working gas pressure is 2.0Pa, in which the partial pressure ratio of nitrogen to argon is 1:1, the deposition time is 20min, and the substrate bias is 200V.

[0153] The interface modification layer formed is a ZrCrSiWN layer with a thickness of 0.5 μm, and the atomic ratio of (Zr+Si):(Cr+W) gradually changes from 7:3 to 1:1 from the inside to the outside.

[0154] (6) Deposition of wear-resistant layer: cathode arc technology and adjustable pulse magnetron sputtering technology are used, and the two technologies are alternately deposited once. When the cathode arc technology is deposited, a CrW alloy target is used, in which the atomic ratio of Cr to W is 90:10, the cathode arc current is 180A, the gas pressure is 2.5Pa, the gas is pure nitrogen, the substrate bias is 40V, and the deposition time is 100min. When the adjustable pulse magnetron sputtering technology is deposited, a mosaic target of Cr and W is used, in which W accounts for 10% of the entire target area. The pulse frequency of adjustable pulse magnetron sputtering is 5000Hz, the pulse opening time is 100μs, and the magnetron sputtering power is 3 kW. During operation, the overall gas pressure is 2.0Pa, in which the partial pressure ratio of nitrogen to argon is 3:1, the deposition time is 200min, and the substrate bias is 200V.

[0155] The wear-resistant layer formed is a CrWN layer with a thickness of 2.4 μm and an atomic ratio of Cr:W=92:8.

[0156] Example 3

[0157] (1) Degreasing: Place the tool to be coated with a blade diameter of 10 mm in acetone, distilled water, and alcohol respectively, and use ultrasound to clean the oil mist on its surface. Use each liquid to clean for 30 minutes. After cleaning, blow dry with dry air.

[0158] (2) Tool clamping: Place the cleaned tool on a fixture dedicated to vacuum coating and on the planetary turret of the vacuum coating equipment. Set the fixture to a 3x rotation mode. The tool is placed on the fixture, with 30% of the area from the tool tip to the end of the groove length exposed, and coating is performed on this area.

[0159] (3) Vacuuming and preheating before coating: Close the hatch of the vacuum coating equipment and use the vacuum system to pump the air pressure in the vacuum chamber of the equipment to 1.0×10 -3 Pa, heat the vacuum chamber to 400℃ and keep it warm for 60min.

[0160] (4) Deposition of base layer: Deposition is carried out using adjustable pulse magnetron sputtering technology. The specific method is: use a mosaic target with Zr and Mo as the target material, embed Mo in Zr metal, and the Mo material occupies 10% of the entire target area. The pulse frequency of adjustable pulse magnetron sputtering is 3500Hz, the pulse opening time is 70μs, and the magnetron sputtering power is 2kW. During operation, the overall gas pressure is 1.8Pa, of which the partial pressure ratio of nitrogen to argon is 1:7, the deposition time is 20min, and the substrate bias is 200V.

[0161] The formed base layer is a single-structure ZrMoN layer with a thickness of 0.2 μm and an atomic ratio of Zr:Mo=93:7.

[0162] (5) Deposition of interface modification layer: Deposition is carried out by adjustable pulse magnetron sputtering technology. The specific method is as follows: two magnetron sputtering cathodes are turned on, one of which is configured with a Zr and Mo inlaid target consistent with step (4), and the other cathode is configured with a Cr and La inlaid target, where La occupies 10% of the entire target area. The angle between the two cathodes relative to the center of the vacuum chamber is 70 degrees. The pulse frequency of the adjustable pulse magnetron sputtering of the two cathodes is 3500Hz, the pulse opening time is 70μs, and the magnetron sputtering power is gradually and evenly reduced from 2kW to 1kW (ZrMo target) and gradually and evenly increased from 500W to 2.2kW (CrLa target). The gas pressure is 2Pa, in which the partial pressure ratio of nitrogen to argon is 1:1, the deposition time is 30min, and the substrate bias is 280V.

[0163] The formed interface modification layer is a ZrCrMoLaN layer with a thickness of 0.6 μm, and the atomic ratio of (Zr+Mo):(Cr+La) gradually changes from the inside to the outside and changes from 8:2 to 3:7.

[0164] (6) Deposition of wear-resistant functional layer: cathode arc technology and adjustable pulse magnetron sputtering technology are used for co-deposition, and the two technologies are used to alternately deposit the layers twice. When the cathode arc technology is deposited, a CrLa alloy target is used, in which the atomic ratio of Cr to La is 90:10, the cathode arc current is 120A, the gas pressure is 3Pa, the gas is pure nitrogen, the substrate bias is 180V, and the deposition time is 20min; when the adjustable pulse magnetron sputtering technology is deposited, a Cr and La mosaic target is used, in which La accounts for 10% of the entire target area. The pulse frequency of the adjustable pulse magnetron sputtering is 3500Hz, the pulse opening time is 70μs, and the magnetron sputtering power is 2.2kW. When working, the overall gas pressure is 2Pa, in which the partial pressure ratio of nitrogen to argon is 5:1, the deposition time is 70min, and the substrate bias is 280V.

[0165] The wear-resistant functional layer formed is a CrLaN layer with a thickness of 1.8 μm and Cr:La=90:10.

[0166] (7) Deposition of lubricating layer: using adjustable pulse magnetron sputtering technology. The specific method is: using WC target as target material, the pulse frequency of adjustable pulse magnetron sputtering is 5000Hz, the pulse opening time is 20μs, and the magnetron sputtering power is 6KW. During operation, the overall gas pressure is 1Pa, the deposition time is 70min, and the substrate bias is 200V.

[0167] The lubricating sub-layer is formed as a WC layer with a thickness of 0.4 μm.

[0168] Example 4

[0169] (1) Degreasing: Place the flat-bottom milling cutter with a blade diameter of 10 mm to be coated in acetone, distilled water, and alcohol respectively, and use ultrasound to clean the oil mist on its surface. Use each liquid to clean for 60 minutes, and then blow dry with dry air after cleaning.

[0170] (2) Tool clamping: Place the cleaned tool on a fixture dedicated to vacuum coating, and then place it on the planetary turret of the vacuum coating equipment. Set the fixture to a 3x rotation mode. The tool is placed on the fixture with the entire slot length exposed so that it is fully covered by the coating.

[0171] (3) Vacuuming and preheating before coating: Close the hatch of the vacuum coating equipment and use the vacuum system to pump the air pressure in the vacuum chamber of the equipment to 1.0×10 -3 Pa, heat the vacuum chamber to 400℃ and keep it warm for 160min.

[0172] (4) Deposition of base layer: Deposition is carried out using adjustable pulse magnetron sputtering technology. The specific method is: use an inlaid target with Ti, Al and Si as the target material, inlay Al and Si in Ti metal, Si and Al materials occupy 20% of the entire target area, and the two elements each occupy 10%. The pulse frequency of adjustable pulse magnetron sputtering is 4000Hz, the pulse opening time is 150μs, and the magnetron sputtering power is 3kW. During operation, the overall gas pressure is 3.0Pa, of which the partial pressure ratio of nitrogen and argon is 1:1, the deposition time is 70min, and the substrate bias is 220V.

[0173] The formed base layer is a TiAlSiN layer of a single structure layer with a thickness of 0.3 μm and Ti:Al:Si=80:10:10.

[0174] (5) Deposition of interface modification layer: Deposition is carried out by adjustable pulse magnetron sputtering technology. The specific method is as follows: two magnetron sputtering cathodes are turned on, one of which is configured with a Ti, Al, and Si inlaid target consistent with step (4), and the other cathode is configured with a Cr, B, and Al inlaid target, where B and Al account for 25% of the entire target area, B accounts for 10%, and Al accounts for 15%. The angle between the two cathodes relative to the center of the vacuum chamber is 80 degrees. The pulse frequency of the adjustable pulse magnetron sputtering of the two cathodes is 4000Hz, the pulse opening time is 150μs, and the magnetron sputtering power is gradually and evenly reduced from 2kW to 1.2kW (TiAlSi target) and gradually and evenly increased from 2kW to 5kW (CrBAl target). The gas pressure is 2.5Pa, where the partial pressure ratio of nitrogen to argon is 2:1, the deposition time is 30min, and the substrate bias is 200V.

[0175] The formed interface modification layer is a TiCrAlSiBN layer with a thickness of 0.9 μm. The atomic ratio of Ti:Cr gradually changes from the base layer to the wear-resistant functional layer and changes from 9:1 to 3:1.

[0176] (6) Deposition of wear-resistant functional layer: cathode arc technology and adjustable pulse magnetron sputtering technology are used for co-deposition, and the two technologies are deposited alternately. When the cathode arc technology is deposited, a CrBAl alloy target is used, in which the atomic ratio of Cr to B and Al is 75:10:15, the cathode arc current is 220A, the gas pressure is 4Pa, the gas is pure nitrogen, the substrate bias is 90V, and the deposition time is 80min. When the adjustable pulse magnetron sputtering technology is deposited, the target is a mosaic of Cr, B, and Al, in which B and Al account for 25% of the entire target area, B accounts for 10%, and Al accounts for 15%. The pulse frequency of the adjustable pulse magnetron sputtering is 4000Hz, the pulse opening time is 150μs, and the magnetron sputtering power is 8kW. When working, the overall gas pressure is 2.5Pa, in which the partial pressure ratio of nitrogen to argon is 4:1, the deposition time is 180min, and the substrate bias is 200V.

[0177] The wear-resistant functional layer formed is a CrBAlN layer with a thickness of 2 μm and Cr:B:Al=78:7:15.

[0178] Example 5

[0179] The preparation method of this embodiment is basically the same as that of Example 2, except that the base layer in the tool coating obtained in this embodiment is a single-structure ZrN layer with a thickness of 0.3 μm, the interface modification layer is a ZrCrWN layer with a thickness of 0.5 μm, and the atomic ratio of Zr: (Cr+W) from the inside to the outside gradually changes from 7:3 to 1:1. Other preparation processes and coating parameters are the same as those in Example 2.

[0180] Example 6

[0181] The preparation method of this embodiment is basically the same as that of embodiment 2, except that the base layer prepared in this embodiment is an atomic gradient structure layer, wherein the specific steps of depositing the base layer are:

[0182] The deposition was carried out by using adjustable pulse magnetron sputtering technology, and the two targets used were Zr target and Si target. The pulse frequency of adjustable pulse magnetron sputtering of Zr target was 5000Hz, the pulse opening time was 100μs, and the magnetron sputtering power was 1kW. The pulse frequency of adjustable pulse magnetron sputtering of Si target was 1000Hz, the pulse opening time was 50μs, and the magnetron sputtering power gradually increased from 0.5kW to 3kW. During operation, the overall gas pressure was 0.8Pa, of which the partial pressure ratio of nitrogen to argon was 1:6, the deposition time was 30min, and the substrate bias was 200V.

[0183] The formed base layer is a ZrSiN layer with a gradient structure and a thickness of 0.3 μm, and the atomic ratio between Zr and Si gradually changes from 90:10 to 85:15.

[0184] Other preparation processes and coating parameters are consistent with those in Example 2.

[0185] Example 7

[0186] The preparation method of this embodiment is consistent with that of embodiment 2, except that, when preparing the deposited wear-resistant functional layer, only one magnetron sputtering method is used to form a CrWN layer with a thickness of 2.4 μm and an atomic ratio of Cr:W=92:8. Other preparation processes and coating parameters are consistent with those of embodiment 1.

[0187] Example 8

[0188] The preparation method of this embodiment is consistent with that of embodiment 2, except that the bottom layer prepared in this embodiment is an atomic gradient change layer, wherein the specific steps of depositing the bottom layer are:

[0189] Deposition was performed using adjustable pulse magnetron sputtering technology, with two targets being Zr and Si. The pulse frequency of adjustable pulse magnetron sputtering for Zr target was 5000Hz, the pulse on time was 100μs, and the magnetron sputtering power was 1kW. The pulse frequency of adjustable pulse magnetron sputtering for Si target was 1000Hz, the pulse on time was 50μs, and the magnetron sputtering power was increased from 0.5kW to 1.5kW first, and then to 3kW. During operation, the overall gas pressure was 0.8Pa, of which the partial pressure ratio of nitrogen to argon was 1:6, the deposition time was 30min, and the substrate bias was 200V.

[0190] The formed base layer is a ZrSiN layer with a gradient structure and a thickness of 0.3 μm. The atomic ratio between Zr and Si first changes from 90:10 to 88:12 and then to 85:15, showing an overall change trend of two gradients.

[0191] Example 9

[0192] The preparation method of this embodiment is consistent with that of embodiment 2, except that the element composition of Me2 is different; wherein the preparation step of depositing the interface modification layer is: depositing by using adjustable pulse magnetron sputtering technology. The specific method is: turning on two magnetron sputtering cathodes, wherein one magnetron sputtering cathode is configured with a Zr and Si mosaic target consistent with step (4), and the other cathode is configured with a Cr and B, Al mosaic target, wherein B and Al account for 25% of the entire target area, B accounts for 10%, and Al accounts for 15%. The angle between the two cathodes relative to the center of the vacuum chamber is 80 degrees. The pulse frequency of the adjustable pulse magnetron sputtering of the two cathodes is 5000 Hz, the pulse opening time is 100 μs, and the magnetron sputtering power is gradually and evenly reduced from 1 kW to 500 W (ZrSi target) and 2 kW is gradually and evenly increased to 5 kW (CrBAl target). The gas pressure is 1.5 Pa, wherein the partial pressure ratio of nitrogen to argon is 2:1, the deposition time is 30 min, and the substrate bias is 200 V.

[0193] The formed interface modification layer is a ZrCrAlSiBN layer with a thickness of 0.5 μm. The atomic ratio of (Zr+Si):(Cr+B+Al) gradually changes from 7:3 to 1:1 from the base layer to the wear-resistant functional layer.

[0194] (6) Deposition of wear-resistant functional layer: cathode arc technology and adjustable pulse magnetron sputtering technology are used for co-deposition, and the two technologies are used to deposit alternate layers alternately. When depositing with cathode arc technology, a CrBAl alloy target is used, in which the atomic ratio of Cr to B and Al is 75:10:15, the cathode arc current is 220A, the gas pressure is 4Pa, the gas is pure nitrogen, the substrate bias is 90V, and the deposition time is 80min. When depositing with adjustable pulse magnetron sputtering technology, a mosaic target of Cr, B, and Al is used, in which B and Al account for 25% of the entire target area, B accounts for 10%, and Al accounts for 15%. The pulse frequency of adjustable pulse magnetron sputtering is 5000Hz, the pulse opening time is 100μs, and the magnetron sputtering power is 5kW. When working, the overall gas pressure is 1.5Pa, in which the partial pressure ratio of nitrogen to argon is 4:1, the deposition time is 180min, and the substrate bias is 200V.

[0195] The wear-resistant functional layer formed is a CrBAlN layer with a thickness of 2 μm and Cr:B:Al=78:7:15.

[0196] Comparative Example 1

[0197] The preparation methods of this comparative example are basically the same as those of Example 4, the main difference being that the thicknesses of the functional layers are different and that no interface modification layer is provided in Comparative Example 1.

[0198] Comparative Example 2

[0199] The preparation method of this comparative example is basically the same as that of Example 4, except that there is only one layer of TiAlN coating on the tool substrate of this comparative example, the atomic ratio of Ti to Al is 50:50, and the coating thickness is 3.2 μm.

[0200] Comparative Example 3

[0201] The preparation method of this comparative example is basically the same as that of Example 2, except that the atomic contents of Zr, Si, Cr and W in the interface modification layer obtained in this comparative example remain unchanged, and the atomic ratio of (Zr+Si):(Cr+W) remains unchanged, (Zr+Si):(Cr+W)=1:1. The specific preparation method is:

[0202] The specific method is as follows: two magnetron sputtering cathodes are turned on, one of which is equipped with an embedded target of Zr and Si, and Si is embedded in Zr metal, with Si material occupying 20% ​​of the entire target area; the other cathode is equipped with an embedded target of Cr and W, and W is embedded in Cr metal, with W occupying 10% of the entire target area. The angle between the two cathodes relative to the center of the vacuum chamber is 90 degrees. The pulse frequency of the adjustable pulse magnetron sputtering of the two cathodes is 5000Hz, the pulse opening time is 100μs, the magnetron sputtering power of the ZrSi target is 0.5kW, and the magnetron sputtering power of the CrW target is 3kW; the working gas pressure is 2.0Pa, in which the partial pressure ratio of nitrogen to argon is 1:1, the deposition time is 20min, and the substrate bias is 200V.

[0203] The coating structures of the embodiments and comparative examples are shown in Tables 1, 2 and 3 below.

[0204] Table 1

[0205]

[0206] Table 2

[0207]

[0208] Table 3

[0209]

[0210] Performance Testing:

[0211] Coating adhesion: Test the adhesion between the coating and the tool substrate according to the method specified in VDI3198-1992. Figure 4 , VDI3198 gives a schematic diagram of the evaluation criteria for the bonding strength between the coating and the tool substrate. Among them, as in the schematic diagram of the evaluation criteria for HF5, the black circle in the middle represents the indentation, the line segments surrounding it represent the cracks that appear, and the irregular gray area represents the coating in the area that has been peeled off. Specifically, HF1 indicates that there are only a few cracks on the edge of the indentation; HF2 indicates that the number of cracks on the edge of the indentation has increased compared to the result of HF1; HF3 indicates that there are not only cracks on the edge of the indentation, but also a small amount of coating has been peeled off; HF4~HF5 indicate that there are not only cracks on the edge of the indentation, but also the peeling area of ​​the coating gradually increases; HF6 indicates that the coating on the edge of the mark is basically all peeled off.

[0212] Coating friction coefficient: According to ASTM G99-23 standard, the friction coefficient of the coating is tested using a ball-on-disc friction and wear testing machine.

[0213] Destructive testing of cutting tools:

[0214] The cutting tools prepared in the embodiments and comparative examples were used to process 316L stainless steel. The processing parameters were: spindle speed 3500 r / min, feed 1000 mm / min, cutting depth 1 mm, cutting width 8 mm, processing 60 min, and the damage of the cutting tool and the coating was observed.

[0215] The performance data of the coatings prepared in various embodiments and comparative examples are shown in Table 4.

[0216] Table 4

[0217]

[0218] It can be seen from Table 4 that the bonding force between the coating and the tool substrate is relatively high, reaching above HF2 level.

[0219] The tool coating prepared in Comparative Example 1 does not have an interface modification layer, and the coating bonding strength is lower than that of Example 4, evaluated as HF2 level, and the coating is easy to fall off during processing and cannot protect the tool body. After 10 minutes of processing, the tool head is completely destroyed.

[0220] The interface modification layer of the tool coating prepared in Comparative Example 3 is a single structural layer. The atomic content of each element remains unchanged from the inside to the outside. There is a sudden change of elements between the base layer and the interface modification layer and between the interface modification layer and the functional layer. There is no element transition effect. The bonding strength of the coating obtained by the indentation method is not much different. However, in the tool processing process, due to the lack of excessive bonding between the layers, interlayer separation is prone to occur. After 10 minutes of processing, the tool head suffers from severe wear and severe collapse.

[0221] The tool coating prepared in Comparative Example 2 has only one layer of TiAlN coating, and its friction coefficient is 0.45. The bonding force between the coating and the tool substrate is HF2, but the coating has poor wear resistance. The head is completely destroyed after 10 minutes of processing. It can be seen that the wear resistance of the tool coating prepared in Comparative Document 2 and the bonding force between it and the tool substrate are not as good as those in Example 4.

[0222] Figure 2 This is a diagram of the tool head of the cutting tool prepared in Example 4 after machining 316L stainless steel for 60 minutes. Figure 3 This is the tool head of the cutting tool prepared in comparative example 2 after processing 316L stainless steel for 10 minutes. As can be seen from the figure, after processing 316L stainless steel for 10 minutes, the conventional TiAlN coated tool head was completely destroyed under the action of high frequency and high strength impact, while the cutting tool prepared in example 4 was only slightly worn.

[0223] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0224] The above-mentioned embodiments only express several implementation methods of the present invention, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be based on the attached claims, and the description can be used to interpret the content of the claims.

Claims

1. A tool coating, It is characterized in that It includes a base layer, an interface modification layer and a functional layer stacked in sequence from the inside to the outside of the tool base surface; the base layer is AMe 1 N layer, the interface modification layer is ACrMe 1 Me 2 N layer, the functional layer includes CrMe 2 N layers; The AMe 1 The A element in the N layer accounts for A and Me 1 The atomic number of the total elements of the two accounts for 30%~100%; The ACrMe 1 Me 2 In the N layer, the atomic content of the A element gradually decreases from the inside to the outside, and the atomic content of the Cr element gradually increases from the inside to the outside; The A element is selected from Ti or Zr; the Me 1 The element is selected from at least one of W, Si, La, Ta, Mo and Al; the Me 2 The element is selected from at least one of W, Si, La, Ta, Mo, Al and B.

2. The tool coating according to claim 1, It is characterized in that The tool coating satisfies at least one of the following conditions: (1) The thickness of the primer layer is 0.05 μm to 2 μm; (2) The thickness of the interface modification layer is 0.05 μm to 2 μm; (3) The thickness of the functional layer is 0.5 μm to 20 μm.

3. The tool coating according to any one of claims 1 to 2, It is characterized in that The Me 1 and the Me 2 Does not contain the same elements; The AMe 1 The A element in the N layer is not 100%, the ACrMe 1 Me 2 In the N layer, the A element and Me 1 The total atomic content of the elements gradually decreases from the inside to the outside, with Cr and Me 2 The total atomic content of the elements gradually increases from the inside to the outside.

4. The tool coating according to claim 3, It is characterized in that According to the atomic number percentage, the ACrMe 1 Me 2 From inside to outside in N, A element and Me 1 Atomic ratio of elements and Cr and Me 2 The atomic proportions of the elements remain unchanged.

5. The tool coating according to any one of claims 1 to 2 and 4, It is characterized in that The CrMe 2 The Cr element in the N layer accounts for Cr and Me 2 The atomic number of the two elements accounts for 30%~50% of the total.

6. The tool coating according to claim 3, It is characterized in that In terms of atomic number percentage, the closest to the AMe 1 N-layer with the ACrMe 1 Me 2 At the N layer interface, the AMe 1 A element and Me in the N layer 1 The atomic ratio of the elements is the ACrMe 1 Me 2 A element and Me in N layer 1 The atomic proportions of the elements are the same; and / or, Closest to the ACrMe 1 Me 2 N and the CrMe 2 At the N layer interface, the ACrMe 1 Me 2 Cr and Me in N layer 2 The atomic ratio of the elements is the CrMe 2 Cr and Me in N layer 2 The atoms of the elements are in the same proportions.

7. The tool coating according to claim 3, It is characterized in that According to the atomic number percentage, the ACrMe 1 Me 2 A element, Me in the N layer 1 Element, Me 2 Elements and Cr elements satisfy the following atomic ratio relationship: (A+Me 1 ):(Cr+Me 2 ) gradually changes from 20:1 to 1:20 from the inside to the outside.

8. The tool coating according to claim 3, It is characterized in that The AMe 1 The N layer is a single structural layer. 1 A element and Me in the N layer 1 The atomic content of the element remains unchanged.

9. The tool coating according to claim 8, It is characterized in that In the AMe 1 In the N layer, the A element accounts for A and Me 1 The atomic number of the two elements accounts for 40%~95% of the total.

10. The tool coating according to claim 3, It is characterized in that The AMe 1 The N layer is an atomic gradient structure layer. 1 The content of A atoms in the N layer gradually decreases from the inside to the outside. 1 The atomic content of elements gradually increases from the inside to the outside.

11. The tool coating according to claim 10, It is characterized in that The AMe 1 The A element in the N layer accounts for A and Me 1 The atomic number ratio of the total elements of the two gradually changed from 95% to 40%.

12. The tool coating according to claim 3, It is characterized in that The AMe 1 The N layer is an atomic gradient structure layer. 1 The atomic content of the A element in the N layer decreases gradually from the inside to the outside. 1 The atomic content of the elements increases gradiently from the inside to the outside.

13. The tool coating according to claim 12, It is characterized in that The AMe 1 The A element in the N layer accounts for A and Me 1 The atomic number ratio of the total elements of the two changes in multiple gradients from 95% to 80%~60%.

14. The tool coating according to any one of claims 1 to 2, 4, 6 to 13, It is characterized in that The functional layer also includes a layer stacked on the CrMe 2 The N layer is away from the lubricating layer on one side of the interface modification layer, and the lubricating layer includes TiB 2 layer, WC layer, MoS 2 At least one of a layer and a tetrahedral amorphous carbon coating.

15. The method for preparing a tool coating according to any one of claims 1 to 14, It is characterized in that The steps include: The primer layer, the interface modification layer and the functional layer are sequentially formed on the surface of the tool substrate.

16. The preparation method according to claim 15, It is characterized in that The preparation method satisfies at least one of the following conditions: (1) forming the base layer by magnetron sputtering deposition; (2) forming the interface modification layer by magnetron sputtering deposition; (3) The functional layer is formed by alternating cathode arc deposition and magnetron sputtering deposition.

17. The preparation method according to claim 16, It is characterized in that When forming the interface modification layer, the power of the magnetron sputtering target containing the A element is gradually reduced, and the power of the magnetron sputtering target containing the Cr element is gradually increased.

18. A cutting tool, It is characterized in that The cutting tool comprises a tool substrate and a tool coating according to any one of claims 1 to 14 arranged on the surface of the tool substrate.

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