Micro-hemisphere lip edge treatment method

Abstract

The invention provides a micro-hemisphere lip edge processing method which comprises the following steps: enabling an opening of a micro-hemisphere to face upwards, fixing the lower part and the middle part of a hemisphere shell of the micro-hemisphere in a mounting hole formed in the upper end surface of a jig through a bonding material, and exposing the skirt edge and the upper part of the hemisphere shell out of the mounting hole; the jig bonded with the micro hemisphere is inverted and then placed on grinding and polishing integrated equipment through a clamping mechanism, the outer circle of the bottom face of the skirt edge of the micro hemisphere makes point contact with a grinding disc by moving the clamping mechanism, and the skirt edge of the micro hemisphere is subjected to point grinding till the outer diameter of the skirt edge is ground to the set size to form a lip edge; plane sheets with different sizes are matched with a height gauge, and the grinding amount of micro-hemisphere grinding is measured and calculated; and by moving the clamping mechanism, the bottom surface of the lip edge of the micro-hemisphere is attached to the grinding disc, and surface grinding is conducted on the surface of the lip edge of the micro-hemisphere according to the grinding amount. The grinding accuracy of the micro hemisphere can be ensured, and the condition that the Q value of the harmonic oscillator is reduced due to improper grinding and polishing of the lip edge can be improved.

Description

Technical Field

[0001] The invention relates to the technical field of hemispherical resonant gyroscope preparation, and in particular to a micro-hemispherical lip processing method. Background Art

[0002] Micro-hemisphere is a hemispherical resonant gyroscope. It is a solid wave gyroscope based on the Coriolis effect. It has the advantage of low cost and is an important direction for the development of gyroscopes in the future. Conventional micro-hemispheres are blown into shape using flat quartz sheets. Before becoming finished products for assembly, Figure 1 As shown, it is necessary to remove the excess skirt after molding, and grind and polish the lip edge of the micro-hemispherical with the skirt removed to remove excess mass and form a smooth, non-chipped, uniform lip edge to ensure a high quality factor Q value.

[0003] The commonly used method for processing the lip edge of a micro-hemispherical ball is to first use laser cutting or laser ablation to remove the skirt edge, and then use mechanical grinding + polishing to process the lip edge of the micro-hemispherical ball with the skirt removed. However, the laser ablation method is prone to produce a jagged lip edge with a depth of about 2-5um, which cannot meet the requirements of low roughness to maintain a high Q value, and the laser cutting edge is prone to microcracks (collapsed edges, etc.), and the residual thermal stress generated by the laser further reduces the Q value of the micro-hemispherical ball. In addition, cutting (or ablation) and polishing are not completed in the same process, and repeated replacement of the fixture cannot guarantee the flatness of the product, and it is necessary to invest in two processing equipment, which has a high investment cost. The inventors of the present invention have attempted to design an integrated grinding and polishing device to process the lip edge of the micro-hemispherical ball, that is, to mechanically grind away the skirt edge, and then polish the micro-hemispherical ball lip edge to remove the skirt edge. However, practice has shown that the traditional mechanical grinding method mostly uses a diamond grinding wheel for grinding. The diamond grinding wheel is diamond sand electroplated on the metal surface, and the sand grains are unevenly distributed. Long-term grinding causes the grinding wheel pattern of the skirt edge of the micro-hemispherical ball to be of varying depths after grinding, and the collapse point is large, which cannot be eliminated by polishing, and will reduce the Q value of the micro-hemispherical ball.

[0004] In addition, during the grinding process of the micro-hemispherical lip edge, the symmetry of the micro-hemispherical needs to be measured to determine whether the grinding effect is good and whether the micro-hemispherical is within the height difference range given by the design. Due to the characteristics of the micro-hemispherical with small size and thin wall thickness, conventional probes can easily generate pressure at the measured position of the micro-hemispherical, causing the micro-hemispherical to collapse or break locally; and the micro-hemispherical is produced by hot forming, and there will be local high points that are difficult to locate at the upper end face of the center pin, affecting the measurement of the maximum value, so that the operator cannot distinguish the actual grinding amount, which is not conducive to the flattening of the upper end face of the center pin, because the upper end face of the center pin is the installation surface, and the unflattened upper end face of the center pin will affect the subsequent installation of the micro-hemispherical; in addition, the grinding error of the grinder will cause the lip edge of the micro-hemispherical after grinding to be non-perpendicular to the central axis, which will deteriorate the symmetry of the micro-hemispherical, thereby reducing the Q value of the finished product and increasing the frequency cracking, making the performance worse. In order to ensure the accuracy of grinding, multi-step measurement feedback is required. The repeated grinding and measurement are prone to cumulative errors, and the error problem of multiple clamping needs to be solved. Summary of the invention

[0005] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a micro-hemispherical lip edge processing method to ensure grinding accuracy and improve the reduction in the Q value of the resonator caused by improper lip grinding.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0007] A method for processing a lip edge of a micro-hemispherical ball, wherein the micro-hemispherical ball comprises a hemispherical shell and a skirt integrally formed on the outer edge of an opening end of the hemispherical shell, and the processing method comprises the following steps:

[0008] 1) The opening of the micro-hemispherical ball is facing upward, and the lower and middle parts of the hemispherical shell are fixed in a mounting hole opened on the upper end surface of a fixture by means of adhesive material, with the skirt and the upper part of the hemispherical shell exposed outside the mounting hole;

[0009] 2) inverting the jig for mounting the micro-hemispherical ball in step 1) and placing it on the grinding and polishing integrated device through a clamping mechanism, rotating and / or lifting the clamping mechanism so that the outer circle of the bottom surface of the skirt of the micro-hemispherical ball contacts the grinding plate of the grinding and polishing integrated device, and starting the grinding and polishing integrated device to perform point grinding on the skirt of the micro-hemispherical ball until the outer diameter of the skirt is ground to a set size to form a lip edge;

[0010] 3) Place the first plane piece and the height gauge on the reference plane of the reference platform, place the fixture for mounting the micro-hemispherical plate on the first plane piece, place the second plane piece on the bottom end of the parallel slider head of the height gauge, move the parallel slider head down to the lower surface of the second plane piece and fit with the upper end surface of the micro-hemispherical plate anchor column, and measure the height h1 of the upper end surface of the micro-hemispherical plate anchor column from the reference plane; place the fixture for mounting the micro-hemispherical plate on the reference plane of the reference platform, and then place the first plane piece on the micro-hemispherical plate until the lower surface of the first plane piece fits with the upper end surface of the micro-hemispherical plate, move the parallel slider head down to the lower surface of the second plane piece and fit with the upper surface of the first plane piece, and measure the height h2 of the second plane piece from the reference plane; calculate the height difference Δh=h2-h1, add Δh to the grinding amount set on the upper surface of the micro-hemispherical plate anchor column, and obtain the grinding amount of the micro-hemispherical surface grinding;

[0011] 4) By rotating and lifting the clamping mechanism, the bottom surface of the lip edge of the micro-hemispherical ball is made to fit with the grinding disk of the grinding and polishing equipment, and the grinding and polishing equipment is started to grind the lip edge surface of the micro-hemispherical ball according to the grinding amount of the micro-hemispherical ball surface obtained in step 3).

[0012] Optionally, the specific process of step 1) is as follows:

[0013] 1.1) Prepare a height column, wherein the height column has a cavity for accommodating a fixture, and the upper end of the height column has a calibration platform, the cavity extends to the lower surface of the calibration platform, and the calibration platform is provided with a through hole having a diameter greater than or equal to the outer diameter of the hemispherical shell but less than the outer diameter of the skirt;

[0014] 1.2) placing the lower and middle parts of the hemispherical shell of the micro-hemispherical ball in the mounting hole of the jig and contacting them with the adhesive material in the mounting hole, and placing the jig and the micro-hemispherical ball on the equal height column until the jig is placed in the cavity of the equal height column, the hemispherical shell of the micro-hemispherical ball passes through the through hole of the equal height column, and the lower surface of the skirt of the micro-hemispherical ball fits with the upper surface of the calibration platform;

[0015] 1.3) After the bonding material is cured, remove the bonded jig and micro-hemisphere from the equal height column;

[0016] Preferably, the equi-height column is formed by enclosing two half-columns, so that the adhered jig and micro-hemisphericity can be placed on or removed from the equi-height column.

[0017] Before grinding the micro-hemisphere, the uncured micro-hemisphere and the fixture are first calibrated for coaxiality on a standard equi-height column so that the height surfaces of the micro-hemisphere and the fixture are parallel, thereby improving the asymmetry of the installation.

[0018] Optionally, between steps 1.2) and 1.3), the method further includes:

[0019] Place the equal-height column containing the jig and the micro-hemisphericity on the reference platform, place the first plane piece horizontally on the bottom end of the parallel slide bar head of the height gauge, move the parallel slide bar head down to the lower surface of the first plane piece and abut against the upper end surface of the micro-hemisphericity skirt, and move the parallel slide bar head up after the adhesive material in the jig mounting hole is cured.

[0020] Furthermore, a height gauge using equal-height columns and a flat plate on the bottom surface is used to calibrate the installation flatness of the micro-hemisphere and the fixture, which can eliminate the asymmetry of the installation.

[0021] Optionally, the clamping mechanism can be rotatably mounted on a three-axis moving mechanism of the integrated grinding and polishing equipment, the jig is fixed to the bottom of the clamping mechanism, and there is an air passage between the clamping mechanism and the jig that is connected to a negative pressure device, and the negative pressure device is used to evacuate the air passage to form negative pressure so that the jig is adsorbed on the clamping mechanism.

[0022] The present invention connects an external air nozzle to the clamping mechanism so that the tension of the fixture with the micro-hemispherical ball can be strengthened under the negative pressure of the clamping mechanism, thereby preventing the fixture from being skewed during the grinding and polishing process, thereby ensuring the symmetry of the lip edge of the micro-hemispherical ball after grinding and polishing.

[0023] Optionally, the bonding material includes a first bonding mixture and a second bonding mixture, the first bonding mixture is filled between the middle of the outer wall of the hemispherical shell and the inner wall of the corresponding mounting hole, the micro-hemispherical shell is also filled with the first bonding mixture, and the second bonding mixture is filled in other positions of the mounting hole, the adhesion of the second bonding mixture is greater than that of the first bonding mixture, and the first bonding mixture and the second bonding mixture are cured to fix the micro-hemispherical shell to the fixture;

[0024] When mechanical grinding and polishing is used to remove the skirt, an adhesive material is required to bond the micro-hemispherical ball to a jig, and the jig is then fixed to the grinding and polishing equipment through fasteners. Since the skirt grinding process takes a long time, the adhesive material must have good rigidity so that the micro-hemispherical ball does not move relative to the jig during the long grinding and polishing process, and must also have good viscosity so that the micro-hemispherical ball does not crack due to the toughness of the adhesive material during the long grinding and polishing process. In addition, the adhesive material must also have good cleaning properties to ensure that it can be thoroughly cleaned. It is currently difficult to find a suitable adhesive material.

[0025] The practice of the present invention shows that by filling the bonding material between the micro-hemispherical ball and the jig, as well as inside the micro-hemispherical ball, the vibration reduction and cushioning effects can be increased compared to only filling the bonding material between the micro-hemispherical ball and the jig. This can not only ensure that the micro-hemispherical ball does not move relative to the jig during long-term grinding and polishing, but also prevent the micro-hemispherical ball from cracking due to the toughness of the bonding material during long-term grinding and polishing.

[0026] The practice of the present invention further shows that improper selection of bonding materials will also affect the grinding quality. For example, when rosin and asphalt are mixed to fill the space between the micro-hemisphere and the fixture, as well as the interior of the micro-hemisphere, the above substances are easy to adhere to the diamond or resin grinding wheel, making the grinding surface sticky and without cutting force, further damaging the skirt of the micro-hemisphere and reducing the grinding efficiency. In addition, the grinding wheel with the bonding material needs to be further deeply cleaned with alcohol, acetone, gasoline, etc., which affects the electroplating layer and is easy to lose sand.

[0027] The present invention adopts a method of filling a second bonding mixture with greater adhesion between the position of the micro-hemispheric near the shoulder and the jig, and filling a first bonding mixture with less adhesion between the position near the lip edge and the jig, and inside the micro-hemispheric. The second bonding mixture can effectively protect the thinner shoulder from damage and achieve better adhesion performance. The first bonding mixture has three functions: first, it isolates the second bonding mixture from the grinding wheel, second, its filling can protect the micro-hemispheric from breaking during the grinding and polishing process, and third, due to its smaller adhesion, it will not adhere to the grinding wheel and is easy to clean. Therefore, the bonding method of the micro-hemispheric and the jig of the present invention can not only ensure that the micro-hemispheric does not move relative to the jig during long-term grinding and polishing, but also ensure grinding efficiency, avoid micro-hemispheric skirt damage, and facilitate the cleaning of the micro-hemispheric and the grinding tool.

[0028] Preferably, the first bonding mixture comprises powder and water, the powder is gypsum powder or dental tray powder, and the mass ratio of the powder to water is 1:1-3:1; the second bonding mixture comprises rosin and asphalt, and the mass ratio of the rosin to asphalt is 2:1-4:1;

[0029] The present invention adopts a method of filling a mixture of rosin and asphalt between the position of the micro-hemispherical near the shoulder and the jig, and filling gypsum powder or tooth tray powder between the position near the lip edge and the jig, and inside the micro-hemispherical. The mixture of rosin and asphalt is a relatively soft medium material, which can effectively protect the thinner shoulder from damage and achieve better adhesion performance. Gypsum powder and tooth tray powder are powdery substances, which can protect the micro-hemispherical from breaking during the grinding and polishing process, and will not adhere to the grinding wheel, and have appropriate hardness and are easy to clean. Therefore, the bonding method of the micro-hemispherical and the jig of the present invention can not only ensure that the micro-hemispherical does not move relative to the jig during the long-term grinding and polishing process, but also ensure grinding efficiency, avoid micro-hemispherical skirt damage, and facilitate the cleaning of the micro-hemispherical and the abrasive tool.

[0030] Preferably, assuming that the overall height of the micro-hemisphere is h, and the bottom surface of the skirt of the micro-hemisphere is taken as a reference plane, the filling boundary line between the first bonding mixture and the second bonding mixture is located 1 / 2h-3 / 5h above the reference plane.

[0031] Optionally, after step 4), step 5) is further included, and step 5) specifically includes:

[0032] 5.1) After the micro-hemispherical surface has been ground to the desired grinding amount, the fixture on which the micro-hemispherical surface is mounted is placed on the reference platform, and the first flat sheet is then placed on the micro-hemispherical surface until the lower surface of the first flat sheet is in contact with the upper end surface of the micro-hemispherical surface.

[0033] 5.2) Align the second flat sheet at the bottom of the parallel slider head with the part of the circumferential direction of the micro-hemispherical lip, move the parallel slider head downward until the lower surface of the second flat sheet fits with the upper surface of the first flat sheet, and measure the height H of the second flat sheet from the reference plane with a height gauge.

[0034] 5.3) changing the relative position of the second planar sheet and the lip edge of the micro-hemispherical along the circumference of the micro-hemispherical, and repeating step 5.2);

[0035] 5.4) Calculate according to multiple heights H and set calculation rules, and judge whether the grinding is qualified according to the calculation results. If the grinding is not qualified, continue grinding until it is qualified.

[0036] The present invention places a flat sheet on the ground micro-hemispherical and jig, and uses a height gauge to measure the circumferential point heights of the lip edge of the micro-hemispherical to obtain the height difference, thereby avoiding the phenomenon of edge collapse and damage of the micro-hemispherical due to compressive stress of the parallel sliding rod head during the measurement process.

[0037] Optionally, after step 5), the method further comprises step 6): by moving the clamping mechanism, the bottom surface of the lip edge of the micro-hemispherical ball is made to fit with the polishing disk of the grinding and polishing integrated device, and the grinding and polishing integrated device is started to perform surface polishing on the lip edge surface of the micro-hemispherical ball;

[0038] Further end face polishing of the lip edge after the skirt is removed and ground can reduce the surface roughness of the lip edge, improve the flatness, and eliminate small chipping points.

[0039] Preferably, the grinding disc is a diamond grinding wheel disc, and the polishing disc is a diamond resin grinding wheel or a cubic boron nitride resin grinding wheel.

[0040] The practice of the present invention shows that polishing with a diamond resin grinding wheel or a cubic boron nitride resin grinding wheel can effectively eliminate the small chipping points generated by grinding the micro-hemispherical lip edge and reduce the surface roughness of the lip edge. In practice, after the skirt edge is generally removed and the surface is ground with a diamond grinding wheel, the micro-hemispherical lip edge is polished with a resin grinding wheel after the height gauge is measured and a processing allowance of 0.2-0.8 mm is reserved.

[0041] Optionally, after step 6), step 7) is further included: softening the first bonding mixture and the second bonding mixture by heating to separate the micro-hemispherical ball from the jig, and cleaning the micro-hemispherical ball to remove the first bonding mixture and the second bonding mixture on the surface of the micro-hemispherical ball.

[0042] After the micro-hemispherical grinding and polishing, it is necessary to clean and remove dirt. Since the shoulder wall thickness of the micro-hemispherical is very thin, the conventional ultrasonic cleaning machine is easy to cause the micro-hemispherical to break during the cleaning process due to the frequency and power. The present invention preferably uses a bubble cleaning machine, and each tank can be filled with different cleaning liquids. During cleaning, the gas is first connected through the air pipe to generate bubbles in the cleaning liquid, resulting in a liquid tumbling effect. The turbulent kinetic energy generated can accelerate the removal of dirt adhered to the micro-hemispherical. The bubble cleaning machine is preferably made of PVC material, and cleaning liquids such as hydrochloric acid, hydrogen peroxide, pure water, and sulfuric acid can be placed in each tank in turn. When cleaning, the micro-hemispherical is transferred to the next cleaning tank for the next step of cleaning. After completing all cleaning steps, it is observed under a microscope. If there is any residue, it is further cleaned.

[0043] Optionally, after step 7), the method further comprises step 8): chemically polishing the surface of the micro-hemispherical lip edge to remove micro-cracks on the surface of the micro-hemispherical lip edge.

[0044] Practice shows that microcracks will appear on the lip edge of the micro-hemispherical ball after grinding. These microcracks are filled with a large number of impurities produced during the mechanical grinding process, which will aggravate the loss of Q value. It is difficult to remove them by mechanical polishing alone. Therefore, chemical treatment is required to remove the damaged layer and impurities on the surface.

[0045] Furthermore, since the shoulder of the micro-hemispherical ball is very thin, the corrosion caused by the acidic substances in the chemical treatment process can easily cause the shoulder and the skirt to fall off from the supporting column as a whole. The present invention raises the micro-hemispherical ball to a suitable height by adding a chemical polishing jig, so that only the lip edge of the micro-hemispherical ball contacts the chemical polishing solution. After the micro-hemispherical ball is left to stand in the chemical polishing solution for 10-30 minutes, the micro-hemispherical ball is taken out for further cleaning to complete the micro-hemispherical ball grinding and polishing treatment.

[0046] Optionally, before step 1), the process further includes: coating the micro-hemisphere as a whole to form a film layer on the inner and outer walls of the micro-hemisphere, wherein the film layer includes one of an aluminum film, a copper film or a silver film, and the thickness of the film layer is 20-400 nm. Between step 7) and step 8), the process further includes: polishing the micro-hemisphere to remove the film layer on the surface of the micro-hemisphere.

[0047] In order to avoid the filling material from leaving residues on the surface of the micro-hemispherical surface after cleaning, the micro-hemispherical surface is first subjected to overall magnetron sputtering coating after the micro-hemispherical surface is hot-formed and before the lip edge is ground and polished. The film layer selected is aluminum film, copper film or silver film, and the film layer is removed after cleaning.

[0048] Compared with the prior art, the advantages of the present invention are:

[0049] The present invention adopts a method of clamping and grinding the skirt edge at a rotating angle to perform point grinding on the skirt edge of the micro-hemispherical ball until the outer diameter of the skirt edge is ground to the size of the lip edge, thus completing the removal of the skirt edge; then the surface of the lip edge of the micro-hemispherical ball is plane ground to complete the grinding process of the lip edge of the micro-hemispherical ball. Since the grinding process time of the skirt edge accounts for more than 80% of the grinding time of the lip edge of the micro-hemispherical ball, the present invention changes the overall grinding of the skirt edge plane to single-point grinding, thereby reducing the contact pressure stress, avoiding the phenomenon of the micro-hemispherical ball generating a collapse point or even breaking during the polishing process, and improving the situation where the resonator Q value is reduced due to improper grinding of the lip edge;

[0050] Furthermore, the present invention utilizes plane sheets of different specifications to design a new micro-hemispherical grinding amount measurement method, so that plane sheets of different specifications can be applied to different measurement occasions, and finally realizes non-destructive and accurate measurement of micro-hemispherical grinding amount;

[0051] In addition, the present invention uses the micro-hemisphere and the fixture as a whole for fixation and calibration measurement during the entire grinding stage, thereby ensuring the consistency of clamping, measurement and grinding and avoiding errors caused by repeated positioning. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 Schematic diagram of the blow-molded micro-hemispherical structure, wherein a) is a longitudinal section diagram and b) is a three-dimensional diagram.

[0053] Figure 2 This is a flow chart of the micro-hemispherical lip edge processing method of Example 1 of the present invention.

[0054] Figure 3 It is a schematic diagram of the three-dimensional structure of the integrated grinding and polishing equipment used in this embodiment.

[0055] Figure 4 This is a schematic diagram of the main structure of the grinding and polishing equipment used in this embodiment.

[0056] Figure 5 for Figure 4 A local enlarged schematic diagram of point A in the middle.

[0057] Figure 6 It is a schematic diagram of the cross-sectional structure of the clamping mechanism.

[0058] Figure 7 Schematic diagram of the three-dimensional structure of equal-height columns.

[0059] Figure 8 This is a schematic diagram of the cross-sectional structure of a micro-hemisphere placed in a fixture through adhesive material.

[0060] Fig. 9 Schematic diagram of the structure in which the micro-hemisphere and the fixture are placed on a half column of equal height.

[0061] Fig.10It is a schematic diagram of the coaxiality calibration structure of the micro-hemisphere solidified in the fixture in the present invention.

[0062] Fig.11 Schematic diagram of the exploded structure of the coaxiality calibration of the micro-hemisphere solidified in the fixture in the present invention.

[0063] Fig.12 Schematic diagram of the coaxiality calibration structure of the micro-hemisphere solidified in the fixture in the present invention (the equal height column shows a half column).

[0064] Fig.13 It is a schematic diagram of the micro-hemispherical grinding amount measurement structure in the present invention.

[0065] Fig.14 Schematic diagram of the flatness calibration structure after the micro-hemispherical lip is polished.

[0066] Legend:

[0067] 1. Height gauge; 11. Vertical pole; 12. Parallel slide bar; 13. Parallel slide bar head; 14. Reference platform; 2. First plane piece; 3. Second plane piece; 4. Third plane piece; 5. Micro hemisphere; 51. Skirt; 52. Center nail; 53. Lip; 6. Equal height column; 61. Cavity; 62. Calibration platform; 63. Through hole; 64. Half column; 7. Fourth plane piece; 8. Fixture; 81. Mounting hole; 82. Through hole; 9. Fifth plane piece; 100. Clamping mechanism; 101. Motor; 102. Rotating shaft; 1021. Center shaft hole; 103. Hexagon socket screw; 104. Vertical plate; 105. Plug; 106. Horizontal plate; 200. Three-axis sliding mechanism; 300. Grinding and polishing disc; 90. First bonding mixture; 80. Second bonding mixture. DETAILED DESCRIPTION

[0068] The present invention is further described below in conjunction with specific preferred embodiments, but the protection scope of the present invention is not limited thereby.

[0069] Embodiment 1:

[0070] like Figure 2 As shown, this embodiment provides a micro-hemispherical lip processing method, comprising the following steps:

[0071] 1) coating the micro-hemispherical body as a whole to form a film layer on the inner and outer walls of the micro-hemispherical body;

[0072] 2) The micro-hemispherical shell of step 1) is placed with its opening facing upward, and the lower and middle parts of its hemispherical shell are fixed in a mounting hole opened on the upper end surface of a fixture by means of adhesive material, with its skirt and the upper part of the hemispherical shell exposed outside the mounting hole;

[0073] 3) inverting the jig for mounting the micro-hemispherical ball in step 2) and placing it on the grinding and polishing integrated device through a clamping mechanism, rotating and / or lifting the clamping mechanism so that the outer circle of the bottom surface of the skirt of the micro-hemispherical ball contacts the grinding plate of the grinding and polishing integrated device, and starting the grinding and polishing integrated device to perform point grinding on the skirt of the micro-hemispherical ball until the outer diameter of the skirt is ground to a set size to form a lip edge;

[0074] 4) Place the first plane piece and the height gauge on the reference plane of the reference platform, place the fixture for mounting the micro-hemispherical plate on the first plane piece, place the second plane piece on the bottom end of the parallel slider head of the height gauge, move the parallel slider head down to the lower surface of the second plane piece and fit with the upper end surface of the micro-hemispherical plate anchor column, and measure the height h1 of the upper end surface of the micro-hemispherical plate anchor column from the reference plane; place the fixture for mounting the micro-hemispherical plate on the reference plane of the reference platform, and then place the first plane piece on the micro-hemispherical plate until the lower surface of the first plane piece fits with the upper end surface of the micro-hemispherical plate, move the parallel slider head down to the lower surface of the second plane piece and fit with the upper surface of the first plane piece, and measure the height h2 of the second plane piece from the reference plane; calculate the height difference Δh=h2-h1, add Δh to the grinding amount set on the upper surface of the micro-hemispherical plate anchor column, and obtain the grinding amount of the micro-hemispherical surface grinding;

[0075] 5) The bottom surface of the lip edge of the micro-hemispherical body is made to fit with the grinding disk of the grinding and polishing device by rotating and lifting the clamping mechanism, and the grinding and polishing device is started to grind the lip edge surface of the micro-hemispherical body according to the grinding amount of the micro-hemispherical surface grinding obtained in step 4);

[0076] 6) Flatness calibration, including:

[0077] 6.1) After the micro-hemispherical surface has been ground to the required grinding amount, the fixture on which the micro-hemispherical surface is mounted is placed on the reference platform, and then the first flat sheet is placed on the micro-hemispherical surface until the lower surface of the first flat sheet is in contact with the upper end surface of the micro-hemispherical surface.

[0078] 6.2) Align the second flat sheet at the bottom of the parallel slider head with the part of the circumferential direction of the micro-hemispherical lip, move the parallel slider head downward until the lower surface of the second flat sheet fits with the upper surface of the first flat sheet, and measure the height H of the second flat sheet from the reference surface with a height gauge.

[0079] 6.3) changing the relative position of the second planar sheet and the lip edge of the micro-hemispherical along the circumference of the micro-hemispherical, and repeating step 6.2);

[0080] 6.4) Calculate according to multiple heights H and set calculation rules, and judge whether the grinding is qualified according to the calculation results. If the grinding is not qualified, continue grinding until it is qualified;

[0081] 7) The bottom surface of the lip edge of the micro-hemispherical ball is made to fit with the polishing disk of the grinding and polishing device by moving the clamping mechanism, and the grinding and polishing device is started to perform surface polishing on the lip edge surface of the micro-hemispherical ball;

[0082] 8) softening the first bonding mixture and the second bonding mixture by heating to separate the micro-hemispherical ball from the jig, and cleaning the micro-hemispherical ball to remove the first bonding mixture and the second bonding mixture on the surface of the micro-hemispherical ball;

[0083] 9) polishing the micro-hemisphere to remove the film layer on the surface of the micro-hemisphere;

[0084] 10) Chemically polish the surface of the micro-hemispherical lip edge to remove micro-cracks on the surface of the micro-hemispherical lip edge.

[0085] In this embodiment, in step 1), the film layer includes one of an aluminum film, a copper film or a silver film, and the thickness of the film layer is 20-400 nm.

[0086] In this embodiment, the specific process of step 2) is as follows:

[0087] 2.1) Prepare a height column, the height column has a cavity for accommodating the fixture, and the upper end of the height column has a calibration platform, the cavity extends to the lower surface of the calibration platform, and the calibration platform is provided with a through hole with a diameter greater than or equal to the outer diameter of the hemispherical shell but less than the outer diameter of the skirt;

[0088] 2.2) Place the lower and middle parts of the hemispherical shell of the micro-hemispherical ball in the mounting hole of the fixture and contact them with the adhesive material in the mounting hole, and place the fixture and the micro-hemispherical ball on the equal height column until the fixture is placed in the cavity of the equal height column, the hemispherical shell of the micro-hemispherical ball passes through the through hole of the equal height column, and the lower surface of the skirt of the micro-hemispherical ball fits with the upper surface of the calibration platform;

[0089] 2.3) Place the equi-height column containing the jig and the micro-hemisphericity on the reference platform, place the first plane piece horizontally on the bottom end of the parallel slide bar head of the height gauge, move the parallel slide bar head down until the lower surface of the first plane piece abuts against the upper end surface of the micro-hemisphericity skirt, and move the parallel slide bar head up after the adhesive material in the jig mounting hole is cured.

[0090] 2.4) After the adhesive material solidifies, remove the bonded jig and micro-hemisphere from the equal-height column.

[0091] In this embodiment, the equal-height column is formed by enclosing two half-columns, so that the adhered jig and micro-hemisphericity can be placed on or removed from the equal-height column.

[0092] In this embodiment, the bonding material includes a first bonding mixture and a second bonding mixture. The first bonding mixture is filled between the middle of the outer wall of the hemispherical shell and the inner wall of the corresponding mounting hole. The micro-hemispherical shell is also filled with the first bonding mixture. The second bonding mixture is filled in other positions of the mounting hole. The adhesion of the second bonding mixture is greater than that of the first bonding mixture. After the first bonding mixture and the second bonding mixture are cured, the micro-hemispherical shell is fixedly connected to the fixture.

[0093] In this embodiment, the first bonding mixture includes powder and water, the powder is gypsum powder or dental tray powder, and the mass ratio of the powder to water is 1:1-3:1; the second bonding mixture includes rosin and asphalt, and the mass ratio of the rosin to asphalt is 2:1-4:1.

[0094] In this embodiment, the overall height of the micro-hemisphere is denoted as h, and the bottom surface of the skirt of the micro-hemisphere is taken as a reference plane. The filling boundary line between the first bonding mixture and the second bonding mixture is located 1 / 2h-3 / 5h above the reference plane.

[0095] In this embodiment, the grinding disc is a diamond grinding wheel disc, and the polishing disc is a diamond resin grinding wheel or a cubic boron nitride resin grinding wheel.

[0096] The grinding and polishing integrated equipment of this embodiment is as follows Figure 3 As shown, it generally includes a three-axis sliding mechanism 200 and a grinding and polishing disc 300. The grinding and polishing disc 300 includes a coaxially arranged grinding disc and a polishing disc. The workpiece to be ground and polished is mounted on the clamping mechanism 100. The clamping mechanism 100 is mounted on the three-axis sliding mechanism 200. The three-axis sliding mechanism 200 drives the clamping mechanism 100 to move up and down, left and right, and front and back, so that the workpiece on the clamping mechanism 100 contacts the grinding disc / polishing disc.

[0097] In this embodiment, Figure 3-5 As shown, the clamping mechanism 100 can be rotatably mounted on the three-axis sliding mechanism 200, and the clamping mechanism 100 can rotate in a vertical plane relative to the three-axis sliding mechanism 200. The clamping mechanism 100 rotates and cooperates with the movement of the three-axis sliding mechanism 200 to make the outer circle of the skirt bottom surface of the micro-hemispherical ball contact with the grinding disk of the grinding and polishing equipment, so that the grinding and polishing equipment can perform point grinding on the skirt of the micro-hemispherical ball; or make the bottom surface of the lip edge of the micro-hemispherical ball fit with the grinding disk / polishing disk of the grinding and polishing equipment, so that the grinding and polishing equipment can perform surface grinding / polishing on the lip edge of the micro-hemispherical ball.

[0098] The clamping mechanism 100 is as follows Figure 6As shown, it includes a horizontal plate 106, a vertical plate 104 and a clamping assembly, the vertical plate 104 is rotatably connected to the three-axis sliding mechanism 200, the horizontal plate 106 is horizontally connected to the lower end of the vertical plate 104, the clamping assembly is installed on the horizontal plate 106, the clamping assembly includes a motor 101 and a rotating shaft 102 connected to the motor 101, the fixture 8 is detachably connected to the lower end of the rotating shaft 102, the motor 101 drives the rotating shaft 102 to rotate, thereby driving the micro-hemispherical circumferential rotation in the fixture 8. In addition, the rotating shaft 102 is provided with a central shaft hole 1021, the upper end of the central shaft hole 1021 is connected to the negative pressure device, and the lower end passes through the bottom surface of the rotating shaft 102 to expose the fixture part, so that the negative pressure device evacuates the central shaft hole 1021 to form a negative pressure, so as to firmly adsorb the fixture 8 on the clamping mechanism 100, avoid the fixture 8 from being skewed during the grinding and polishing process, and thus ensure the symmetry of the lip edge of the micro-hemispherical grinding and polishing.

[0099] Alternatively, a through hole 82 penetrating the jig 8 is provided on the bottom surface of the mounting hole 81 provided on the lower end surface of the jig 8, and a central axis hole 1021 connecting the through hole 82 and the negative pressure device is provided on the rotating shaft 102, so that the negative pressure device evacuates the channel formed by the through hole 82 and the central axis hole 1021 to form a negative pressure to fix the jig 8 on the clamping mechanism 100. A sealing plug 105 is provided between the channel and the second bonding mixture to prevent the second bonding mixture from being sucked into the negative pressure device. The through hole 82 is provided on the jig 8, so that the jig is suitable for the grinding and polishing installation of flat sheets in addition to being used for the grinding and polishing installation of micro-hemispherical sheets.

[0100] The measurement and calibration facilities of this embodiment are prepared as follows:

[0101] Use the height gauge 1 to level various planes of different specifications, including the first plane 2, the second plane 3, the third plane 4, the fourth plane 7 and the fifth plane 9. Among them, the size of the first plane 2 and the third plane 4 is 15-18 mm, and the first plane 2 and the third plane 4 can be the same plane; the size of the second plane 3 and the fifth plane 9 is 2-4 mm, and the second plane 3 and the fifth plane 9 can be the same plane; the size of the fourth plane is 12-15 mm. The material of the above-mentioned planes can be quartz, borosilicate glass or ceramic; the leveled second plane 3, the third plane 4, and the fifth plane 9 are respectively pasted on the three parallel slide rod heads 13 of the same height gauge 1 for standby use, and epoxy glue or asphalt can be used for bonding, wherein the parallel slide rod head 13 can be detachably connected to the parallel slide rod 12 of the height gauge 1, and the parallel slide rod 12 is connected to the vertical rod 11 of the height gauge 1 by threads.

[0102] Prepare a high column 6, such as Figure 7As shown, it has a cavity 61 for accommodating the fixture 8, and a calibration platform 62 at its upper end. The cavity 61 extends to the lower surface of the calibration platform 62. The calibration platform 62 is provided with a through hole 63 with a diameter greater than or equal to the outer diameter of the hemispherical shell but less than the outer diameter of the skirt. In order to facilitate the removal of the cured micro-hemispherical shell and the fixture, the equal height column 6 is formed by two semi-columns 64.

[0103] refer to Figure 2 The implementation process of this embodiment is described in detail as follows:

[0104] Step 1: Micro-hemispherical thermoforming: A fused quartz sheet is used to thermoform the micro-hemispherical 5 on a micro-hemispherical molding device. The micro-hemispherical 5 has a skirt after molding, which needs to be removed.

[0105] Step 2: coating the entire micro-hemisphere: placing the micro-hemisphere in a magnetron sputtering coating machine, coating the entire micro-hemisphere 5, and one of aluminum film, copper film or silver film can be selected, and the thickness can be selected from 20-400nm.

[0106] Step 3: The micro-hemisphere is bonded to a fixture, such as Figure 8 As shown, specifically including:

[0107] The plug 105 is installed on the fixture 8. The plug 105 is used for sealing, which helps the fixture 8 to form a negative pressure with the grinding and polishing equipment, so as to prevent the fixture 8 from being skewed during the grinding and polishing process and improve the symmetry of the micro-hemispherical ball after grinding and polishing. Then, the micro-hemispherical ball is bonded to the set position in the mounting hole 81 of the fixture 8 with a mixture of rosin and asphalt (i.e., the second bonding mixture 80), wherein the mixing ratio of rosin and asphalt is between 2:1 and 4:1.

[0108] The first bonding mixture 90 (a mixture of gypsum powder or dental tray powder and water) is filled in the remaining small gap area between the outer wall of the micro-hemispherical 5 and the fixture 8 to isolate the mixture of rosin and asphalt from the outside world to prevent the above mixture from adhering to the grinding wheel and causing the grinding wheel grinding efficiency to decrease; at the same time, the gypsum powder or dental tray powder is filled into the entire inner spherical surface of the micro-hemispherical 5 to protect the micro-hemispherical 5 from breaking during the grinding and polishing process; in this process, the gypsum powder or dental tray powder needs to be mixed and diluted with water before filling, and the dilution ratio can be selected between 1:1 and 3:1; in the filling process of the outer spherical surface, the filler in step 3 needs to be filled to a height of 1 / 2 to 3 / 5 of the micro-hemispherical from the skirt (that is, with the bottom surface of the micro-hemispherical skirt as the reference plane, the boundary line of the two fillers is located 1 / 2h-3 / 5h above the reference plane, and h is the overall height of the micro-hemispherical), and the remaining area is filled with a mixture of gypsum powder or dental tray powder and water, see for details Figure 8 ;

[0109] Step 4: Correct the coaxiality of the micro-hemisphere and the fixture, including:

[0110] like Figure 7 and Fig. 9 As shown, the semi-cured connected jig 8 and the micro-hemispherical ball 5 are horizontally moved onto one of the semi-pillars 64 of the equal-height column 6, and then the two semi-pillars 64 are enclosed to form the equal-height column 6, so that the jig 8 is placed in the cavity 61 of the equal-height column 6, the hemispherical shell of the micro-hemispherical ball 5 passes through the through hole 63 of the equal-height column 6, and the lower surface of the skirt 51 of the micro-hemispherical ball 5 is in contact with the upper surface of the calibration platform 62;

[0111] like Figure 10-12 As shown, the parallel slide bar head 13 with the third plane sheet 4 is installed on the height gauge 1, and the parallel slide bar 12 is pressed downward, so that the lower surface of the skirt 51 of the micro-hemispherical 5 can be completely fitted with the upper surface of the calibration platform 62 of the standard equal height column 6, so that the micro-hemispherical 5 and the fixture 8 have good symmetry after bonding, and the central axis of the two objects is prevented from being skewed;

[0112] After the adhesive material is cured, the adhered jig 8 and micro-hemispheric ball 5 are removed from the equal-height column 6 .

[0113] Step 5: The fixture for bonding the micro-hemisphere is clamped on the grinding and polishing equipment:

[0114] like Figure 3-6 As shown, the fixture 8 is initially fastened to the rotating shaft 102 of the clamping mechanism 100 by means of the hexagon socket screw 103, and then the clamping mechanism is clamped on the grinding and polishing equipment, and an external air nozzle is used to evacuate air to form a negative pressure between the fixture 8 and the rotating shaft 102, thereby increasing the clamping force of the fixture 8.

[0115] Step 6: Install the diamond grinding wheel on the grinding and polishing equipment, rotate the clamping mechanism 100 to a suitable angle, form the point grinding of the micro-hemispherical 5 skirt and the diamond grinding wheel, start grinding, grind the outer diameter of the skirt to a specified outer diameter size, and form a lip edge 53; the diamond grinding wheel can be selected between 800 mesh and 2000 mesh.

[0116] Step 6: Micro-hemispherical lip grinding amount measurement and calculation, including:

[0117] like Fig.13As shown, the micro-hemispherical ball 5 and the jig 8 after the grinding of the skirt 51 are disassembled and moved to the reference platform 14 of the height gauge 1. The reference platform 14 is made of marble, and its upper surface forms a reference surface. The height from the upper end surface of the center nail 52 of the micro-hemispherical ball 5 to the reference surface of the reference platform 14 is measured. Since the upper end surface of the center nail 52 after thermoforming is a non-planar structure, if the parallel slide bar head of the height gauge 1 is used for measurement directly, two problems will arise: one is that the maximum height cannot be measured, and the other is that the small needle head of the parallel slide bar will cause the upper end surface of the center nail 52 to be damaged by excessive force. Therefore, it is necessary to use the parallel slide bar head with the second plane sheet 3 attached to it for measurement; before measurement, the first plane sheet 2 is horizontally placed on the reference platform 14, and then the jig 8 is placed on the first plane sheet 2 in a manner that the opening of the micro-hemispherical ball 5 faces upward;

[0118] Step 6.1: Replace the parallel slide bar 12 of the height gauge 1 with the parallel slide bar head 13 with the second plane sheet 3 attached thereto;

[0119] Step 6.2: Use a modified height gauge to measure the height h1 between the reference surface and the upper end surface of the center pin 52 of the micro-hemispherical 5;

[0120] Step 6.3: Move the first plane sheet 2 to the top of the micro-hemisphere, see attached Figure 2 , measuring the distance h2 between the upper surface of the first planar sheet 2 and the reference surface of the reference platform 14;

[0121] Step 6.4: Calculate the distance between the upper end surface of the micro-hemispherical center pin 52 and the upper end surface of the lip edge 53 of the micro-hemispherical according to steps 6.2 and 6.3, i.e., h2-h1;

[0122] Step 6.5: Grinding is performed based on the sum of the distance calculated in step 6.4 and the predetermined grinding amount (usually 5 to 8 um) required for the center pin 52 as the removal amount for the next step of grinding.

[0123] Step 7: Adjust the clamping mechanism 100 to be parallel to the Z-axis direction of the grinding and polishing equipment, and further grind the lip edge to a specified height value according to the grinding amount obtained in step 7.

[0124] Step 8: Move the micro-hemisphere 5 and the fixture 8 under a microscope for observation. If there are grinding wheel grinding marks on the entire surface of the upper end surface of the center nail 52, proceed to the next step. Otherwise, put it back into the grinder for micro-grinding (within 10um) until there are grinding wheel grinding marks on the entire surface.

[0125] Step 9: Move the micro-hemisphere 5 and the fixture 8 onto the height gauge 1 for measurement, as shown in the attached Fig.14As shown, a fourth plane sheet 7 is placed on the upper surface of the fixture 8; the height gauge 1 is replaced with a parallel slide rod head 13 with a fifth plane sheet 9 attached thereto, and the height gauge 1 with the fifth plane sheet 9 is used to measure the circumferential position along the lip edge 53 of the micro-hemispherical body, and 4 to 8 points are measured evenly in the circumferential direction; the height difference of the above points is calculated, and if the maximum height difference is less than or equal to 5um, the skirt grinding of the micro-hemispherical body is completed, otherwise the grinding machine needs to be calibrated and the grinding is continued until the above requirements are met.

[0126] Step 10: Replace the diamond grinding wheel with a resin grinding wheel, and further polish the lip edge to a specified height value; the mesh size of the resin grinding wheel is between 2000 mesh and 4000 mesh; the resin grinding wheel used is a diamond resin grinding wheel or a cubic boron nitride resin grinding wheel, which has high toughness and elasticity; this embodiment uses a diamond resin grinding wheel produced by Tengda Abrasives Co., Ltd. as a polishing disc.

[0127] Step 11: Remove the jig 8 with the micro-hemispheres from the grinding and polishing equipment, and observe whether there is edge chipping under a microscope. If there is edge chipping, proceed to step 10. If there is no edge chipping, proceed to the cleaning step.

[0128] Step 12: Separation and cleaning of the micro-hemispheroid and the fixture. First, heat the fixture 8 to separate the micro-hemispheroid 5 from the fixture 8, and then put the micro-hemispheroid 5 into the bubble cleaning machine. Each tank can contain different cleaning liquids, including hydrochloric acid, hydrogen peroxide, pure water, sulfuric acid, etc. When cleaning, first connect the gas into the tank to generate bubbles in the cleaning liquid to produce a liquid tumbling effect. The turbulent kinetic energy generated can accelerate the removal of dirt adhered to the micro-hemispheroid. The bubble cleaning machine is made of PVC material. After cleaning at a rate of about 3-8 minutes per tank, the micro-hemispheroid is transferred to the next cleaning tank for the next cleaning step. After completing all cleaning steps, observe under a microscope. If there is any residue, further clean it.

[0129] Step 13: Removal of metal film layer: Place the cleaned micro-hemisphere into a solution suitable for film removal to remove the metal film layer (such as a strong acid solution). This can be done in a tank in a bubble cleaning machine using a bubble cleaning method.

[0130] Step 14: Chemical solution polishing: The micro-hemispherical is polished with a chemical solution (a mixed solution of 49% hydrofluoric acid + ammonium fluoride + disodium ethylenediaminetetraacetate + sodium tetraborate + deionized water is used in this embodiment, and the mass ratio of the above compounds is 3.5:6.9:0.3:0.3:89). In order to prevent the chemical solution from corroding the thinnest area of ​​the micro-hemispherical shoulder and causing irreversible loss or breakage of the micro-hemispherical, an auxiliary fixture is added to raise the micro-hemispherical to a suitable height of the chemical polishing fixture, so that only the lip edge of the micro-hemispherical is in contact with the chemical polishing solution in the chemical polishing fixture. After the micro-hemispherical is allowed to stand in the chemical polishing solution for 10-30 minutes, the micro-hemispherical is taken out for further cleaning to complete the micro-hemispherical grinding and polishing process.

[0131] It should be noted that, the “front” and “rear” in the front and rear surfaces and the “upper” and “lower” in the upper and lower end surfaces involved in the textual description of this embodiment are used to express the relative relationship of the above-mentioned surfaces or end surfaces, and should not be understood as a description of the absolute position relationship of the above-mentioned surfaces or end surfaces, which may be expressed differently under different azimuth viewing angles.

[0132] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A method for processing the lip edge of a micro-hemispherical ball, wherein the micro-hemispherical ball comprises a hemispherical shell and a skirt integrally formed on the outer edge of the opening end of the hemispherical shell, wherein the processing method The following steps are involved: 1) The opening of the micro-hemispherical ball is facing upward, and the lower and middle parts of the hemispherical shell are fixed in a mounting hole opened on the upper end surface of a fixture by means of adhesive material, with the skirt and the upper part of the hemispherical shell exposed outside the mounting hole; 2) inverting the jig for mounting the micro-hemispherical ball in step 1) and placing it on the grinding and polishing integrated device through a clamping mechanism, rotating and / or lifting the clamping mechanism so that the outer circle of the bottom surface of the skirt of the micro-hemispherical ball contacts the grinding plate of the grinding and polishing integrated device, and starting the grinding and polishing integrated device to perform point grinding on the skirt of the micro-hemispherical ball until the outer diameter of the skirt is ground to a set size to form a lip edge; 3) Place the first plane piece and the height gauge on the reference plane of the reference platform, place the fixture for mounting the micro-hemispherical plate on the first plane piece, place the second plane piece on the bottom end of the parallel slider head of the height gauge, move the parallel slider head down to the lower surface of the second plane piece and fit with the upper end surface of the micro-hemispherical plate anchor column, and measure the height h1 of the upper end surface of the micro-hemispherical plate anchor column from the reference plane; place the fixture for mounting the micro-hemispherical plate on the reference plane of the reference platform, and then place the first plane piece on the micro-hemispherical plate until the lower surface of the first plane piece fits with the upper end surface of the micro-hemispherical plate, move the parallel slider head down to the lower surface of the second plane piece and fit with the upper surface of the first plane piece, and measure the height h2 of the second plane piece from the reference plane; calculate the height difference Δh=h2-h1, add Δh to the grinding amount set on the upper surface of the micro-hemispherical plate anchor column, and obtain the grinding amount of the micro-hemispherical surface grinding; 4) By rotating and lifting the clamping mechanism, the bottom surface of the lip edge of the micro-hemispherical ball is made to fit with the grinding disk of the grinding and polishing equipment, and the grinding and polishing equipment is started to grind the lip edge surface of the micro-hemispherical ball according to the grinding amount of the micro-hemispherical ball surface obtained in step 3).

2. The micro-hemispherical lip processing method according to claim 1, It is characterized in that The specific process of step 1) is as follows: 1.1) Prepare a height column, wherein the height column has a cavity for accommodating a fixture, and the upper end of the height column has a calibration platform, the cavity extends to the lower surface of the calibration platform, and the calibration platform is provided with a through hole having a diameter greater than or equal to the outer diameter of the hemispherical shell but less than the outer diameter of the skirt; 1.2) placing the lower and middle parts of the hemispherical shell of the micro-hemispherical ball in the mounting hole of the jig and contacting them with the adhesive material in the mounting hole, and placing the jig and the micro-hemispherical ball on the equal height column until the jig is placed in the cavity of the equal height column, the hemispherical shell of the micro-hemispherical ball passes through the through hole of the equal height column, and the lower surface of the skirt of the micro-hemispherical ball fits with the upper surface of the calibration platform; 1.3) After the bonding material is cured, remove the bonded jig and micro-hemisphere from the equal height column; Preferably, the equi-height column is formed by enclosing two half-columns, so that the adhered jig and micro-hemisphericity can be placed on or removed from the equi-height column.

3. The micro-hemispherical lip processing method according to claim 2, It is characterized in that Between steps 1.2) and 1.3), it also includes: Place the equal-height column containing the jig and the micro-hemisphericity on the reference platform, place the first plane piece horizontally on the bottom end of the parallel slide bar head of the height gauge, move the parallel slide bar head down to the lower surface of the first plane piece and abut against the upper end surface of the micro-hemisphericity skirt, and move the parallel slide bar head up after the adhesive material in the jig mounting hole is cured.

4. The micro-hemispherical lip processing method according to any one of claims 1 to 3, It is characterized in that The bonding material includes a first bonding mixture and a second bonding mixture, the first bonding mixture is filled between the middle of the outer wall of the hemispherical shell and the inner wall of the corresponding mounting hole, the micro-hemispherical shell is also filled with the first bonding mixture, and the second bonding mixture is filled in other positions of the mounting hole. The adhesion of the second bonding mixture is greater than that of the first bonding mixture. After the first bonding mixture and the second bonding mixture are cured, the micro-hemispherical shell is fixedly connected to the fixture; Preferably, the first bonding mixture comprises powder and water, the powder is gypsum powder or dental tray powder, and the mass ratio of the powder to water is 1:1-3:1; the second bonding mixture comprises rosin and asphalt, and the mass ratio of the rosin to asphalt is 2:1-4:1; Preferably, assuming that the overall height of the micro-hemisphere is h, and the bottom surface of the skirt of the micro-hemisphere is taken as a reference plane, the filling boundary line between the first bonding mixture and the second bonding mixture is located 1 / 2h-3 / 5h above the reference plane.

5. The micro-hemispherical lip processing method according to any one of claims 1 to 3, It is characterized in that The clamping mechanism can be rotatably installed on the three-axis moving mechanism of the grinding and polishing equipment, the jig is fixed to the bottom of the clamping mechanism, and there is an air passage connected to the negative pressure device between the clamping mechanism and the jig. The negative pressure device is used to evacuate the air passage to form negative pressure so that the jig is adsorbed on the clamping mechanism.

6. The micro-hemispherical lip processing method according to any one of claims 1 to 3, It is characterized in that After step (4), the method further comprises step 5), wherein step 5) specifically comprises: 5.1) After the micro-hemispherical surface has been ground to the desired grinding amount, the fixture on which the micro-hemispherical surface is mounted is placed on the reference platform, and the first flat sheet is then placed on the micro-hemispherical surface until the lower surface of the first flat sheet is in contact with the upper end surface of the micro-hemispherical surface. 5.2) Align the second flat sheet at the bottom of the parallel slider head with the part of the circumferential direction of the micro-hemispherical lip, move the parallel slider head downward until the lower surface of the second flat sheet fits with the upper surface of the first flat sheet, and measure the height H of the second flat sheet from the reference plane with a height gauge. 5.3) changing the relative position of the second planar sheet and the lip edge of the micro-hemispherical along the circumference of the micro-hemispherical, and repeating step 5.2); 5.4) Calculate according to multiple heights H and set calculation rules, and judge whether the grinding is qualified according to the calculation results. If the grinding is not qualified, continue grinding until it is qualified.

7. The micro-hemispherical lip processing method according to claim 6, It is characterized in that After step 5), the method further includes step 6): by moving the clamping mechanism, the bottom surface of the lip edge of the micro-hemispherical ball is made to fit with the polishing disk of the grinding and polishing integrated device, and the grinding and polishing integrated device is started to perform surface polishing on the lip edge surface of the micro-hemispherical ball; Preferably, the grinding disc is a diamond grinding wheel disc, and the polishing disc is a diamond resin grinding wheel or a cubic boron nitride resin grinding wheel.

8. The micro-hemispherical lip processing method according to claim 7, It is characterized in that After step 6), the method further includes step 7): softening the first bonding mixture and the second bonding mixture by heating to separate the micro-hemispherical ball from the jig, and cleaning the micro-hemispherical ball to remove the first bonding mixture and the second bonding mixture on the surface of the micro-hemispherical ball.

9. The micro-hemispherical lip processing method according to claim 8, It is characterized in that After step 7), the method further includes step 8): chemically polishing the surface of the micro-hemispherical lip edge to remove micro-cracks on the surface of the micro-hemispherical lip edge.

10. The micro-hemispherical lip processing method according to claim 9, It is characterized in that Before the step 1), the method further includes: coating the micro-hemispherical body as a whole to form a film layer on the inner and outer walls of the micro-hemispherical body; The film layer includes one of an aluminum film, a copper film or a silver film, and the thickness of the film layer is 20-400 nm; The process between step 7) and step 8) further includes: polishing the micro-hemispherical body to remove the film layer on the surface of the micro-hemispherical body.

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