Vehicle semiconductor radiation air conditioning system

Abstract

This invention provides a semiconductor radiant air conditioning system for vehicles, belonging to the field of HVAC technology. By controlling the temperature of the semiconductor's hot and cold ends, this invention can form an integral unit with the vehicle's roof, reducing vehicle load and making more rational use of the vehicle's interior space. It also provides more space for intelligent computing modules and other convenient tools in new energy vehicles under intelligent development. Compared to traditional air conditioning systems that rely on engine operation, semiconductor cooling and heating are rapid, responding quickly with just a power supply, aligning with the development direction of new energy vehicles, reducing vehicle load, and improving energy efficiency. The air conditioning primarily uses radiation to improve the comfort of the vehicle's interior environment, supplemented by a convection mode, which can cope with changes in in-vehicle load under various external environmental conditions and the personalized needs of passengers.

Description

Technical Field

[0001] This invention belongs to the field of heating, ventilation and air conditioning technology, and specifically relates to a semiconductor radiant air conditioning system for vehicles. Background Technology

[0002] Currently, in-vehicle vehicles still use traditional refrigeration and heat pump air conditioning systems to cool, heat, and dehumidify the vehicle interior. However, these traditional convection air conditioning systems have large components, high costs, and poor ability to regulate the thermal comfort of the in-vehicle environment.

[0003] By utilizing the Peltier effect in semiconductors, connecting a P-type semiconductor and an N-type semiconductor in series and then applying an electric current creates hot and cold surfaces on the upper and lower surfaces of the semiconductor. When the current flows in the direction from the P-type to the N-type or vice versa, the hot and cold surfaces of the semiconductor can alternate, allowing the same surface to be used for either cooling or heating. Using this semiconductor component as the core element in a semiconductor radiant air conditioning system for vehicles can create cooling and heating radiant surfaces within the vehicle structure, improving space utilization. It can also replace traditional convection air conditioning systems in vehicles, improving the energy efficiency of new energy electric vehicles and providing more usable space for intelligent onboard devices. Furthermore, radiant air conditioning systems can quickly and effectively raise or lower the temperature of the vehicle's interior surfaces in winter or summer, providing faster radiant treatment of the interior environment and offering a more comfortable environment without drafts or noise.

[0004] After searching for relevant technologies, patents CN105109304B and CN114103590A both designed a semiconductor air conditioning system for automobiles. However, they still rely on air convection for cooling and heating, which cannot effectively improve the comfort of the vehicle. Furthermore, the design structure does not take into account the temperature control of the hot and cold ends of the semiconductor, and the energy utilization efficiency is not optimal. Summary of the Invention

[0005] The purpose of this invention is to provide a semiconductor radiant air conditioning system for use in vehicles, which improves the energy utilization efficiency of new energy electric vehicles, the utilization rate of interior space, and the comfort of passengers.

[0006] The main technical solutions of this invention to achieve the above objectives are as follows:

[0007] A semiconductor radiant air conditioning system for a vehicle includes an air supply duct A1, an interior surface radiant material layer A2, an exterior surface radiant material layer A3, a semiconductor component A4, connecting wires A5, an air outlet A6, a temperature and humidity sensor A7, a surface temperature meter A10, an interior fresh air duct B1, an air filter device B2, an interior air circulation duct B3, a blower B4, a condensate tray B5, a condensate pipe B6, a finned heat-conducting structure B7, an exhaust fan B8, and an exhaust duct B9.

[0008] The air supply duct A1 is tightly fixed at the center line of the vehicle interior surface radiation material layer A2. A temperature and humidity sensor A7 is placed on the outside of the air supply duct A1, and there are multiple spaced air outlets A6 on the side where the air supply duct A1 is tightly connected to the vehicle interior surface radiation material layer A2. The air outlets A6 are directly cut into the side of the air supply duct A1. The vehicle interior surface radiation material layer A2 corresponds to the inside of the vehicle, and the vehicle exterior surface radiation material layer A3 corresponds to the outside of the vehicle. Both are tightly connected to the vehicle body on their inner and outer sides, and are tightly attached to multiple semiconductor components A4 in their internal space. The multiple semiconductor components A4 are connected in series by connecting wires A5, with the beginning and end of the connecting wires A5 being wire connector A8 and wire connector B A9. A surface temperature measuring gauge A10 is attached to the inner surface of the vehicle interior surface radiation material layer A2 (i.e., the surface connected to the semiconductor components A4).

[0009] The fresh air duct B1 is connected to the supply air duct A1. An air filter B2 and a blower B4 are installed in the fresh air duct B1, and it is connected to the exhaust air duct B9 via the upper and lower surfaces of a semiconductor component A4. An exhaust fan B8 is installed in the exhaust air duct B9. A condensate tray B5 is located below the surface of the semiconductor component A4 on the fresh air duct B1 side, and the outlet of the condensate tray B5 is connected to a condensate pipe B6. Finned heat-conducting structures B7 are fitted to the surfaces of the semiconductor component A4 on both the fresh air duct B1 and exhaust air duct B9 sides. An in-vehicle air circulation duct B3 is connected to the fresh air duct B1 between the air filter B2 and the blower B4.

[0010] The semiconductor component A4 includes a thermally conductive insulating material A11, a conductive metal material A12, and a PN junction A13. The PN junctions A13 are interconnected via the conductive metal material A12. The thermally conductive insulating material A11 is in close contact with the outer surfaces of the conductive metal material A12, which are connected vertically to the PN junctions A13, forming a semiconductor component A4. The thermally conductive insulating material A11 is also in close contact with the inner surfaces of the vehicle interior surface radiation material layer A2 and the vehicle exterior surface radiation material layer A3, forming a single unit, or it is in close contact with the inner surface of the finned thermally conductive structure B7.

[0011] The semiconductor radiant air conditioning system can be integrated with the vehicle roof panel and is powered solely by electricity, without a heavy or complex structure. Furthermore, the system offers multiple operating modes, including in-vehicle cooling, in-vehicle heating, radiant cooling and heating, and radiant convection cooling and heating.

[0012] The semiconductor radiant air conditioning system provides cooling and heating via semiconductor component A4. Semiconductor component A4 has a cold end and a hot end, the distribution of which is affected by the direction of current flow. When wire connector A8 is connected to the positive terminal and wire connector B9 is connected to the negative terminal, with the current flowing from P to N, the upper part of semiconductor component A4 is the hot end and the lower part is the cold end. That is, the interior surface radiant material layer A2 acts as the cold surface, and the exterior surface radiant material layer A3 acts as the hot surface. Under this operating condition, the semiconductor radiant air conditioning system can provide cooling to the interior of the vehicle and release heat to the outside, corresponding to the interior cooling operation. When wire connector A8 is connected to the negative terminal and wire connector B9 is connected to the positive terminal, with the current flowing from N to P, the upper part of semiconductor component A4 is the cold end and the lower part is the hot end. That is, the interior surface radiant material layer A2 acts as the hot surface, and the exterior surface radiant material layer A3 acts as the cold surface. Under these operating conditions, the semiconductor radiant air conditioning system can supply heat to the interior of the vehicle and release cooling energy to the outside, corresponding to the vehicle's heating operation. During vehicle cooling and heating operation, the temperature change of the radiant material layer A2 on the vehicle's interior surface can be monitored by the surface temperature measuring meter A10.

[0013] The dehumidification and fresh air supply of the semiconductor radiant air conditioning system are achieved through the in-vehicle fresh air duct B1, the in-vehicle air circulation duct B3, the blower B4, the semiconductor component A4 within the in-vehicle fresh air duct B1, and the finned heat-conducting structure B7. When the blower B4 is turned on, the fresh air and the recirculated air in the vehicle will merge and pass through the semiconductor component A4. By energizing the semiconductor component A4, its surface on the fresh air duct side becomes the cold end, and its surface on the exhaust duct side becomes the hot end, thus achieving cooling and dehumidification of the air in the fresh air duct.

[0014] The semiconductor radiant air conditioning system achieves radiation and convection through the air supply duct A1, semiconductor component A4, air outlet A6, and vehicle interior surface radiant material layer A2. When heating, the vehicle interior surface radiant material layer A2 dissipates heat from its higher-temperature surface into the vehicle interior through radiation; when cooling, it absorbs radiant heat from the vehicle interior surfaces and occupants through its lower-temperature surface. When the air supply duct A1 is ventilating, heat exchange occurs between the side air outlet A6 and the surface of the vehicle interior surface radiant material layer A2, followed by convection to deliver the heat or cold into the vehicle interior.

[0015] The beneficial effects of this invention are:

[0016] ① It can replace the traditional air conditioning system used in transportation vehicles, reduce the vehicle load, make more rational use of the vehicle's interior space, and provide more space for the placement of intelligent computing modules and other convenient tools for new energy vehicles under the development of intelligence;

[0017] ② Compared to traditional air conditioning systems that rely on engine operation, semiconductor cooling and heating are rapid and can respond quickly as long as electricity is supplied, which is in line with the development direction of new energy vehicles, reduces vehicle load, and improves energy utilization efficiency.

[0018] ③ The air conditioning system primarily uses radiation to improve the comfort of the vehicle's interior environment, and is supplemented by a convection operation mode to cope with changes in the vehicle's load under various external environmental conditions and the personalized needs of passengers. Attached Figure Description

[0019] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0020] Figure 1 This is a schematic diagram of the structural principle of a semiconductor radiant air conditioning system for a vehicle according to the present invention.

[0021] Figure 2 This is a view of the inner surface of the in-vehicle radiating terminal of a semiconductor radiating air conditioning system for a vehicle according to the present invention.

[0022] Figure 3 This is a cross-sectional view a of the in-vehicle radiating terminal of a semiconductor radiating air conditioning system for a vehicle according to the present invention.

[0023] Figure 4 This is a structural diagram of a semiconductor component in a semiconductor radiant air conditioning system for a vehicle according to the present invention.

[0024] Among them: A1. Air supply duct, A2. Inner surface radiation material layer, A3. Outer surface radiation material layer, A4. Semiconductor component, A5. Connecting wire, A6. Air outlet, A7. Temperature and humidity sensor, A8. Wire connector A end, A9. Wire connector B end, A10. Surface temperature measuring instrument, A11. Thermally conductive insulating material, A12. Conductive metal material, A13. PN joint, B1. Inner fresh air duct, B2. Air filter device, B3. Inner air circulation duct, B4. Blower, B5. Drain tray, B6. Condensate pipe, B7. Finned thermally conductive structure, B8. Exhaust fan, B9. Exhaust duct. Detailed Implementation

[0025] like Figure 1 As shown, the air supply duct A1 is tightly welded to the centerline of the radiant material layer A2 on the vehicle's interior surface. Serving as the in-vehicle use side of the radiant air conditioner, the air supply duct A1 introduces ambient air from inside the vehicle to achieve internal heat circulation. Figure 2As shown, a temperature and humidity sensor A7 is placed on the outer side of the air supply duct A1. This sensor A7 is mainly used to detect the temperature and humidity of the air inside the vehicle. Multiple spaced air outlets A6 are located on the side of the air supply duct A1 where it is in close contact with the vehicle interior surface radiation material layer A2. The air outlets A6 are directly cut into the duct body of the air supply duct A1. The air supply direction and the exhaust direction of each exhaust outlet are as follows... Figure 2 As indicated by the middle arrow, an air filter B2 and a blower B4 are installed in the fresh air duct B1, and connected to the exhaust duct B9 via the upper and lower surfaces of a semiconductor component A4. An exhaust blower B8 is installed in the exhaust duct B9. A condensate tray B5 is located below the surface of the semiconductor component A4 on the fresh air duct B1 side, and its outlet is connected to a condensate pipe B6. Finned heat-conducting structures B7 are fitted to the surfaces of the semiconductor component A4 on both the fresh air duct B1 and exhaust duct B9 sides. An in-vehicle air circulation duct B3 is connected to the fresh air duct B1 between the air filter B2 and the blower B4.

[0026] like Figure 2 , Figure 3 The interior surface radiant material layer A2 corresponds to the interior of the vehicle, and the exterior surface radiant material layer A3 corresponds to the exterior of the vehicle. Both are tightly connected to the vehicle body on their respective interior and exterior sides, and are tightly attached to multiple semiconductor components A4 within their internal spaces. The multiple semiconductor components A4 are connected in series via connecting wires A5, with the beginning and end of the wires A5 connecting the semiconductor components A4 being wire connector A8 and wire connector B A9, respectively. A surface temperature measuring gauge A10 is installed on the inner surface of the interior surface radiant material layer A2 (i.e., the surface connected to the semiconductor components A4), mainly used to measure the surface temperature of the interior surface radiant material layer A2 to adjust the cooling and heating demand.

[0027] like Figure 4As shown, semiconductor component A4 mainly consists of thermally conductive insulating material A11, conductive metal material A12, and PN junction A13. PN junctions A13 are interconnected through conductive metal material A12. The thermally conductive insulating material A11 is in close contact with the outer surfaces of the conductive metal material A12, which are connected to the top and bottom of the PN junctions A13, forming a semiconductor component A4. The thermally conductive insulating material A11 also needs to be tightly attached to the inner surfaces of the vehicle's inner surface radiation material layer A2 and the outer surface radiation material layer A3, forming a unified whole. According to the Peltier effect, when the lead wire A8 of semiconductor component A4 is connected to the positive terminal and the lead wire B9 is connected to the negative terminal, the current direction is from the P-terminal to the N-terminal, with the upper and lower parts of the PN junction acting as hot terminals. This effect is reversible. When connector A8 is connected to the negative terminal and connector B9 is connected to the positive terminal, the thermally conductive insulating material A11 of the semiconductor component A4 in the fresh air duct needs to be tightly attached to the inner surface of the finned thermally conductive structure B7 to ensure good thermal conductivity in dehumidification and fresh air modes. The in-vehicle air circulation, fresh air, and dehumidification of this semiconductor radiant air conditioning system are all achieved by the blower B4. When in-vehicle air circulation is required, the fresh air valve of the in-vehicle fresh air duct B1 can be closed, and the valve of the in-vehicle air circulation duct B3 can be opened, allowing the blower B3 to deliver air from inside the vehicle to the air supply duct A1. When there is a need for fresh air, the valve of the in-vehicle air circulation duct B3 can be closed, and the fresh air valve of the in-vehicle fresh air duct B1 can be opened. During dehumidification, the semiconductor component A4 in the fresh air duct B1 needs to be turned on to transfer the cold air at the cold end to the air in the fresh air duct B1 through the finned heat conduction structure B7 to achieve cooling and dehumidification, and the heat at the hot end is discharged through the exhaust fan B8 and the exhaust duct B9.

[0028] During summer operation, the current direction of the semiconductor component A4 at the radiant terminal inside the vehicle should be ensured to be from terminal A to terminal B of the wire connector. At this time, the radiant material layer A2 on the vehicle's interior surface, which is attached to the semiconductor component A4, will act as the cooling side, supplying cooling inwards, while the radiant material layer A3 on the exterior surface will act as the heating side, dissipating heat outwards. During radiant cooling, the dew point temperature inside the vehicle should be determined by the measurement results of the temperature and humidity sensor A7, and the radiant surface temperature of the radiant material layer A2 on the vehicle's interior surface should be measured by the surface temperature meter A10 to prevent condensation caused by the radiant surface temperature falling below the dew point temperature. When radiant cooling alone is insufficient to meet the load requirements under overheating conditions, the blower B4 can be activated to introduce recirculated air from inside the vehicle into the air supply duct A1. The parallel airflow discharged through the air outlet A6 will then force convection heat exchange with the radiant material layer A2 on the vehicle's interior surface, thereby enhancing the cooling effect of the semiconductor radiant air conditioning system. Meanwhile, the radiant material layer A3 on the exterior surface can also accelerate heat dissipation through the opposing airflow generated during vehicle movement, thus ensuring the stable operation of the semiconductor radiant air conditioning system.

[0029] During winter operation, ensure the current direction is from wire connector B to wire connector A. In this case, the interior surface radiant material layer A2, which is attached to the semiconductor component A4, will act as the heating side, supplying heat inwards, while the exterior surface radiant material layer A3 will act as the cooling side, discharging cold air outwards. During radiant heating, the air temperature inside the vehicle can be determined by the temperature and humidity sensor A7, and the radiant surface temperature of the interior surface radiant material layer A2 can be measured by the surface temperature meter A10 to prevent overheating. When radiant heating alone is insufficient to meet load requirements under sub-cold conditions, the blower B4 can be activated to introduce recirculated air from inside the vehicle into the air duct A1. The parallel airflow discharged through the air outlet A6 will achieve forced convection heat exchange with the interior surface radiant material layer A2, thereby enhancing the heating effect of the semiconductor radiant air conditioning system. Meanwhile, the exterior surface radiant material layer A3 can also expel cold air through the opposing airflow generated during vehicle movement, thus ensuring stable operation of the semiconductor radiant air conditioning system.

[0030] The cooling and heating capacity of a semiconductor radiant air conditioning system is controlled by current and influenced by the semiconductor connection method. This invention uses a series connection, which, compared to a parallel connection, allows for a larger temperature difference between the cold and hot ends of the semiconductors, thus accommodating larger loads. The cooling and heating capacity of the semiconductor radiant air conditioning system increases with increasing current and decreases with decreasing current. There is a maximum value for cooling and heating capacity, the corresponding current of which can be derived using the principles of the Peltier, Fourier, and Joule effects, and calculated based on the number of semiconductor components and the series / parallel connection configuration, serving as the control and adjustment threshold for the semiconductor radiant air conditioning system.

[0031] The method described above can realize the cooling and heating of semiconductor radiant air conditioning systems in vehicles, expand the application scope of radiant air conditioning systems, and at the same time, compared with traditional air conditioning systems in vehicles, it reduces the load on traditional air conditioning system components in automobiles, improves the utilization of new energy, and is in line with the development direction of new energy vehicles.

[0032] Based on the above description, those skilled in the art can make various changes and modifications without departing from the technical concept of this invention. The technical scope of this invention is not limited to the contents of the specification; it must be determined according to the scope of the claims.

Claims

1. A semiconductor radiant air conditioning system for a vehicle, characterized in that, It includes an air supply duct (A1), an interior surface radiation material layer (A2), an exterior surface radiation material layer (A3), a semiconductor component (A4), connecting wires (A5), an air outlet (A6), a temperature and humidity sensor (A7), a surface temperature measuring instrument (A10), an interior fresh air duct (B1), an air filter (B2), an interior air circulation duct (B3), a blower (B4), a drip tray (B5), a condensate pipe (B6), a finned heat-conducting structure (B7), an exhaust fan (B8), and an exhaust duct (B9); The air supply duct (A1) is tightly fixed at the center line of the vehicle interior surface radiation material layer (A2); a temperature and humidity sensor (A7) is placed on the outside of the air supply duct (A1), and there are multiple spaced air outlets (A6) on the side where the air supply duct (A1) and the vehicle interior surface radiation material layer (A2) are tightly connected. The air outlets (A6) are directly cut into the side of the air supply duct (A1); the vehicle interior surface radiation material layer (A2) corresponds to the inside of the vehicle, and the vehicle exterior surface radiation material layer (A3) corresponds to the outside of the vehicle. The two are tightly connected to the vehicle body on their inner and outer sides, and are tightly attached to multiple semiconductor components (A4) in their internal space; the multiple semiconductor components (A4) are connected in series by connecting wires (A5). The beginning and end of the connecting wires (A5) connecting the semiconductor components (A4) in series are wire connector A (A8) and wire connector B (A9); a surface temperature measuring instrument (A10) is attached to the inner surface of the vehicle interior surface radiation material layer (A2); The in-vehicle fresh air duct (B1) is connected to the air supply duct (A1). An air filter (B2) and a blower (B4) are installed in the in-vehicle fresh air duct (B1), and it is connected to the exhaust duct (B9) through the upper and lower surfaces of the semiconductor component (A4). An exhaust fan (B8) is installed in the exhaust duct (B9). A water collection tray (B5) is located below the surface of the semiconductor component (A4) on the side of the in-vehicle fresh air duct (B1), and the outlet of the water collection tray (B5) is connected to the condensate pipe (B6). Finned heat conduction structures (B7) are installed on the surface of the semiconductor component (A4) on both the side of the in-vehicle fresh air duct (B1) and the side of the exhaust duct (B9). An in-vehicle air circulation duct (B3) is connected to the in-vehicle fresh air duct (B1) between the air filter (B2) and the blower (B4). The semiconductor component (A4) includes a thermally conductive insulating material (A11), a conductive metal material (A12), and a PN junction (A13). The PN junctions (A13) are interconnected through the conductive metal material (A12). The thermally conductive insulating material (A11) is in close contact with the outer surface of the conductive metal material (A12) that is connected to the PN junctions (A13) to form a semiconductor component (A4). The thermally conductive insulating material (A11) is in close contact with the inner surface of the vehicle interior surface radiation material layer (A2) and the vehicle exterior surface radiation material layer (A3) to form a whole, or it is in close contact with the inner surface of the finned thermally conductive structure (B7).

2. The semiconductor radiant air conditioning system for vehicles according to claim 1, characterized in that, The semiconductor radiant air conditioning system is integrated with the vehicle roof and is powered solely by electricity, without a heavy or complex structure. The semiconductor radiant air conditioning system has operating modes including in-vehicle cooling, in-vehicle heating, radiant cooling and heating, and radiant convection cooling and heating.

3. A semiconductor radiant air conditioning system for vehicles according to claim 1, characterized in that, The cooling and heating of the semiconductor radiant air conditioning system is achieved by the semiconductor component (A4); the semiconductor component (A4) is divided into a cold end and a hot end, and the distribution of the cold end and the hot end is affected by the direction of current flow; when the wire connector A end (A8) is connected to the positive terminal and the wire connector B end (A9) is connected to the negative terminal, the current flow direction is from P level to N level, at this time the upper part of the semiconductor component (A4) is the hot end and the lower part is the cold end, that is, the radiation material layer (A2) on the inner surface of the vehicle can be used as the cold surface and the radiation material layer (A3) on the outer surface of the vehicle can be used as the hot surface; Under these operating conditions, the semiconductor radiant air conditioning system can supply cooling to the interior of the vehicle and release heat to the outside, corresponding to the vehicle's cooling operation. When the wire connector A (A8) is connected to the negative terminal and the wire connector B (A9) is connected to the positive terminal, the current flows from the N-level to the P-level. At this time, the upper part of the semiconductor component (A4) is the cold end and the lower part is the hot end. That is, the radiation material layer (A2) on the inner surface of the vehicle can be used as the hot surface and the radiation material layer (A3) on the outer surface of the vehicle can be used as the cold surface. Under these operating conditions, the semiconductor radiant air conditioning system can supply heat to the interior of the vehicle and release cold energy to the outside, corresponding to the vehicle's heating operation. When the vehicle is in cooling and heating mode, the temperature change of the radiation material layer (A2) on the vehicle's interior surface can be monitored by a surface temperature measuring instrument (A10).

4. A semiconductor radiant air conditioning system for vehicles according to claim 1, characterized in that, The dehumidification and fresh air supply of the semiconductor radiant air conditioning system rely on the in-vehicle fresh air duct (B1), the in-vehicle air circulation duct (B3), the blower (B4), the semiconductor component (A4) and the finned heat conduction structure (B7) in the in-vehicle fresh air duct (B1). When the blower (B4) is turned on, the fresh air and the in-vehicle circulating air will merge and pass through the semiconductor component (A4). The semiconductor component (A4) is energized, so that its fresh air duct side surface is the cold end and the exhaust duct side is the hot end, which can achieve cooling and dehumidification of the air in the fresh air duct.

5. A semiconductor radiant air conditioning system for vehicles according to claim 1, characterized in that, The radiation and convection of the semiconductor radiant air conditioning system are achieved by means of the air supply duct (A1), semiconductor component (A4), air outlet (A6), and the radiation material layer on the interior surface (A2). When heating, the radiant material layer (A2) on the interior surface will radiate heat from the higher-temperature surface into the interior space through radiation. When cooling, it will absorb radiant heat from the interior surface and occupants through the lower-temperature surface. When the air supply duct (A1) is ventilated, heat can be exchanged with the surface of the radiant material layer (A2) through the side air supply vent (A6), and then the heat or cold will be delivered into the vehicle interior through convection.

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