Wafer paper collecting and stacking device

Abstract

The invention relates to the technical field of automatic equipment, in particular to a wafer paper collecting and stacking device which comprises a rotary table mechanism, a plurality of wafer paper forming molds, a material taking mechanism, a material collecting mechanism and a material stacking mechanism. The rotary disc mechanism is used for driving the multiple wafer paper forming molds to sequentially pass through the material taking mechanism, and the material taking mechanism is used for grabbing wafer paper on the wafer paper forming molds to the material receiving mechanism for material receiving and stacking the wafer paper towards the material stacking mechanism. When the material taking head is located above the mechanism and prepares to release materials, the resilience force of the elastic floating part automatically generates fine shaking force, smooth falling of wafer paper is promoted, and the material receiving efficiency and accuracy are remarkably improved.

Description

Technical Field

[0001] The invention relates to the technical field of automation equipment, and in particular to a wafer paper collecting and stacking device. Background Art

[0002] Wafer paper, also known as rice paper, is an edible starch product. It is mainly made of a mixture of starch, gelatin and a small amount of lecithin, which is cast into a film and dried. Wafer paper is widely used in the food industry, mainly as the inner packaging material for products such as candies, cakes or medicines to prevent these products from sticking to the outer packaging paper, and also to play a moisture-proof role.

[0003] The automated production of wafer paper is an important technological innovation in the field of food processing. It marks the transformation of traditional manual workshop production to a modern production model that is efficient, precise and hygienic. In the automated production line, precision mechanical equipment replaces manual operation. However, due to the characteristics of wafer paper, it is difficult to achieve automatic material collection and stacking in automated production. Therefore, a new design is needed for the existing automated production of wafer paper. Summary of the invention

[0004] To solve the above problems, when the material taking head is located above the mechanism and is ready to release the material, the resilience of the elastic floating part automatically generates a slight shaking force, which promotes the smooth shedding of the wafer paper and significantly improves the wafer paper collecting and stacking efficiency and accuracy.

[0005] The technical solution adopted by the present invention is: a wafer paper collecting and stacking device, comprising a turntable mechanism, a wafer paper forming mold, a material taking mechanism, a material collecting mechanism and a material stacking mechanism, wherein a plurality of wafer paper forming molds are provided, and the plurality of wafer paper forming molds are evenly distributed on the turntable mechanism in an annular direction, the turntable mechanism is used to drive the plurality of wafer paper forming molds to pass through the material taking mechanism in sequence, and the material taking mechanism is used to grab the wafer paper on the wafer paper forming mold to the material collecting mechanism for collecting, and stack it toward the stacking mechanism.

[0006] A further improvement to the above scheme is that the material picking mechanism includes a material picking bracket, a material picking transmission module, a material picking lifting module and a material picking extension arm, the material picking transmission module is arranged on the material picking bracket, the material picking lifting module is arranged on the material picking lifting module; the material picking extension arm includes a fixed connecting plate, a floating connecting rod and a material picking head, the fixed connecting plate is arranged on the material picking lifting module, the floating connecting rod includes a driving connecting part, an elastic floating part and a material picking connecting part, the driving connecting part and the elastic floating part are connected to the material picking connecting part by an elastic The metal material is integrally formed, the driving connection part is arranged on the fixed connection plate, the material picking head is arranged on the material picking connection part, and the elastic floating part is inclined from the driving connection part toward the material picking connection part. When the material picking head picks up materials, an elastic floating force is generated to drive the wafer paper grabbed by the material picking head to move toward the material receiving mechanism. When it is above the material picking mechanism, a shaking force is generated by the rebound force of the elastic floating part to make the wafer paper fall into the material receiving mechanism. The stacking mechanism is located below the material receiving mechanism to stack the fallen wafer paper.

[0007] A further improvement to the above scheme is that the turntable mechanism includes a frame, a turntable furnace and a disc, the turntable furnace is arranged at the center of the disc, the disc is arranged on the upper surface of the frame, a plurality of fixing seats are arranged on the disc, and the wafer paper forming mold is arranged on the fixing seat.

[0008] A further improvement to the above scheme is that the material picking bracket includes a lower bracket and an upper bracket arranged on the lower bracket, the lower bracket is located on one side of the upper bracket and is provided with a material stacking platform, the material picking transmission module is arranged on the upper bracket, and the material stacking mechanism is arranged on the material stacking platform.

[0009] A further improvement to the above scheme is that the material picking transmission module includes a transmission base plate, a transmission guide rail, a transmission cam assembly, a transmission slide and a transmission motor, the transmission cam assembly includes a transmission cam disc and a transmission cam connecting rod, the transmission guide rail is arranged on the transmission base plate, the transmission slide is slidably arranged on the transmission guide rail, the transmission motor is arranged on the transmission base plate and connected to the transmission cam disc, and the transmission cam disc is connected to the transmission slide via a transmission cam connecting rod.

[0010] A further improvement to the above scheme is that the transmission cam disc is provided with a stroke adjustment groove, a stroke adjustment block is provided on the stroke adjustment groove, and a plurality of mounting holes are provided on the stroke adjustment groove for installing the stroke adjustment block; the transmission cam disc rotates under the driving action of the transmission motor to drive the transmission slide to slide on the transmission guide rail through the transmission cam connecting rod, and the material picking and lifting module is arranged on the transmission slide and moves with the transmission slide.

[0011] A further improvement to the above scheme is that the material picking and lifting module includes a lifting base plate, a lifting guide rail, a lifting cam assembly, a lifting slide and a lifting motor, the lifting cam assembly includes a lifting cam disc and a lifting cam connecting rod, the lifting guide rail is arranged on the lifting base plate, the lifting slide is slidably arranged on the lifting guide rail, the lifting motor is arranged on the lifting base plate and connected to the lifting cam disc, and the lifting cam disc is connected to the lifting slide through a lifting cam connecting rod.

[0012] A further improvement to the above scheme is that the lifting cam plate rotates under the driving action of the lifting motor to drive the lifting slide to slide on the lifting guide rail through the lifting cam connecting rod, and the fixed connecting plate is arranged on the lifting slide and moves with the lifting slide.

[0013] A further improvement to the above solution is that the drive connection part is provided with a fixing gasket, and the drive connection part is mounted on the fixing connection plate through the fixing gasket.

[0014] A further improvement to the above solution is that the material taking head comprises a mounting gasket and a material taking suction head, and the material taking suction head is provided with an adsorption groove and an adsorption hole for adsorbing wafer paper.

[0015] A further improvement to the above scheme is that the material receiving mechanism includes a material receiving mounting frame and a material receiving guide sleeve, a material receiving guide groove is provided on one side of the material receiving guide sleeve, one end of the material receiving guide groove extends toward the turntable mechanism and the other end is inclined toward the stacking mechanism; the material receiving guide sleeve is provided with a material receiving groove, and the material receiving groove is used to connect the material taking mechanism and the stacking mechanism.

[0016] A further improvement to the above scheme is that the stacking mechanism includes a stacking tray located below the receiving mechanism and a stacking pressing assembly located on one side of the stacking tray, the receiving trough is used to guide the wafer paper toward the stacking tray, and the stacking pressing assembly is used to press the wafer paper on the stacking tray in sequence and stack them.

[0017] A further improvement to the above scheme is that a positioning guide plate is provided on the outer periphery of the stacking tray, and the positioning guide plate extends toward the receiving trough; the stacking material clamping assembly includes a clamping bracket, a clamping drive motor, a clamping connecting rod and a clamping plate, the clamping drive motor is arranged on the clamping bracket, two clamping connecting rods are provided and connected to the clamping drive motor, two clamping connecting rods are respectively connected to both sides of the clamping plate, and a plurality of through holes are provided on the clamping plate.

[0018] The beneficial effects of the present invention are:

[0019] Compared with the existing wafer paper collection, the present invention is used for automatic collection and stacking of wafer paper. By adopting a turntable mechanism and a plurality of wafer paper forming molds uniformly distributed in an annular direction, a continuous operation process of wafer paper forming is realized, and the automation degree and production efficiency of the production line are significantly improved. The precise drive of the turntable mechanism ensures that each forming mold can pass through the material taking mechanism in sequence and order, reducing the waiting time and optimizing the production rhythm. The material taking mechanism can accurately grab the wafer paper on the wafer paper forming mold and transfer it to the material collection mechanism. In this process, not only the integrity of the wafer paper is guaranteed, but also the pollution and damage that may be caused by manual operation are avoided, thereby improving the hygiene standard and appearance quality of the product. The collaborative work of the material collection mechanism and the stacking mechanism realizes the automatic collection and neat stacking of wafer paper. This process not only reduces the labor intensity, but also greatly improves the accuracy and stability of stacking, providing convenience for subsequent packaging, transportation and other links. At the same time, automatic stacking also helps to save storage space and improve warehouse utilization.

[0020] The invention significantly improves the overall efficiency and product quality of wafer paper production and reduces labor costs through its high efficiency, precision and automation, and is an important technological innovation in the field of food processing. In addition, the wafer paper collecting and stacking device also has high flexibility and scalability. Its modular design makes it easy to maintain and replace the components. When production needs change, the device can be easily adjusted or upgraded to meet the production needs of wafer papers of different specifications and types.

[0021] The retrieving mechanism integrates the retrieving bracket, retrieving transmission module, retrieving lifting module and innovative retrieving extension arm to build a highly flexible and stable material grabbing system. The retrieving transmission module accurately controls the motion trajectory to ensure the accuracy of the retrieving position; the retrieving lifting module adjusts the height according to actual needs to adapt to the operation requirements in different production scenarios. The design of the retrieving extension arm combines the stability of the fixed connecting plate and the dynamic adaptability of the floating connecting rod. The floating connecting rod is made of elastic metal material in one piece, which not only ensures the compactness and strength of the structure, but also gives the retrieving head an elastic floating force during the retrieving process, effectively reducing the impact caused by direct contact with the material and protecting the integrity of the wafer paper. At the same time, when the retrieving head is located above the mechanism and is ready to release the material, the rebound force of the elastic floating part automatically generates a slight shaking force, which promotes the smooth shedding of the wafer paper and significantly improves the efficiency and accuracy of material collection.

[0022] The stacking mechanism is located below the receiving mechanism, which accurately receives and stacks the wafer paper from the retrieving mechanism, realizing a continuous automated operation process from retrieving to stacking. This design not only reduces manual intervention and labor intensity, but also improves the overall production line throughput and product quality consistency by optimizing the material flow path. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a three-dimensional schematic diagram of the wafer paper collecting and stacking device of the present invention;

[0024] Figure 2 for Figure 1 A three-dimensional schematic diagram of the wafer paper collecting and stacking device from another perspective;

[0025] Figure 3 for Figure 1 A schematic diagram of the front view of a device for collecting and stacking wafer paper;

[0026] Figure 4 for Figure 1 Schematic diagram of the partial structure of the wafer paper collecting and stacking device;

[0027] Figure 5 for Figure 1 A schematic diagram of a partial structure of a wafer paper collecting and stacking device;

[0028] Figure 6 for Figure 1 Schematic diagram of the material taking mechanism of the wafer paper collecting and stacking device;

[0029] Figure 7 for Figure 1 Schematic diagram of the material taking mechanism of the wafer paper collecting and stacking device;

[0030] Figure 8 for Figure 1 A schematic diagram of a collecting mechanism of a wafer paper collecting and stacking device;

[0031] Fig. 9 for Figure 1 Schematic diagram of the stacking mechanism of the wafer paper delivery and stacking device.

[0032] Description of reference numerals: turntable mechanism 1, frame 11, turntable furnace 12, disc 13, fixing seat 131;

[0033] Wafer paper forming mold 2;

[0034] Retrieving mechanism 3, retrieving bracket 31, lower bracket 311, upper bracket 312, stacking platform 313, retrieving transmission module 32, transmission base plate 321, transmission guide rail 322, transmission cam assembly 323, transmission cam disc 3231, transmission cam connecting rod 3232, stroke adjustment groove 3233, stroke adjustment block 3234, transmission slide 324, transmission motor 325, retrieving lifting module 33, lifting base plate 331, lifting guide rail 332, Lifting cam assembly 333, lifting cam disc 3331, lifting cam connecting rod 3332, lifting slide 334, lifting motor 335, material picking extension arm 34, fixed connecting plate 341, floating connecting rod 342, driving connecting part 3421, elastic floating part 3422, material picking connecting part 3423, fixed gasket 3424, material picking head 343, mounting gasket 3431, material picking suction head 3432, adsorption groove 3433, adsorption hole 3434;

[0035] Material receiving mechanism 4, material receiving mounting frame 41, material receiving guide sleeve 42, material receiving groove 421, material receiving guide groove 43;

[0036] The stacking mechanism 5 , the stacking tray 51 , the positioning guide piece 511 , the stacking pressing assembly 52 , the pressing bracket 521 , the pressing driving motor 522 , the pressing connecting rod 523 , the pressing plate 524 , and the through hole 5241 . DETAILED DESCRIPTION

[0037] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0038] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0040] like Figures 1 to 9As shown, in one embodiment of the present invention, a wafer paper collecting and stacking device is involved, including a turntable mechanism 1, a wafer paper forming mold 2, a material taking mechanism 3, a material taking mechanism 4 and a material stacking mechanism 5, wherein the wafer paper forming mold 2 is provided with a plurality of wafer paper forming molds 2, and the plurality of wafer paper forming molds 2 are evenly distributed on the turntable mechanism 1 in an annular direction, and the turntable mechanism 1 is used to drive the plurality of wafer paper forming molds 2 to pass through the material taking mechanism 3 in sequence, and the material taking mechanism 3 is used to grab the wafer paper on the wafer paper forming mold 2 to the material taking mechanism 4 for collecting, and stacking toward the material stacking mechanism 5. This embodiment is used for automatic material collection and stacking of wafer paper, and by adopting the design of the turntable mechanism 1 and the plurality of wafer paper forming molds 2 evenly distributed in an annular direction, a continuous operation process of wafer paper forming is realized, and the automation degree and production efficiency of the production line are significantly improved. The precise drive of the turntable mechanism 1 ensures that each forming mold can pass through the material taking mechanism 3 in sequence and in an orderly manner, which reduces the waiting time and optimizes the production rhythm. The material taking mechanism 3 can accurately grab the wafer paper on the wafer paper forming mold 2 and transfer it to the material receiving mechanism 4. This process not only ensures the integrity of the wafer paper, but also avoids the pollution and damage that may be caused by manual operation, thereby improving the hygiene standard and appearance quality of the product. The collaborative work of the material receiving mechanism 4 and the stacking mechanism 5 realizes the automatic collection and neat stacking of wafer paper. This process not only reduces the labor intensity, but also greatly improves the accuracy and stability of stacking, providing convenience for subsequent packaging, transportation and other links. At the same time, automated stacking also helps save storage space and improve warehouse utilization.

[0041] This embodiment significantly improves the overall efficiency and product quality of wafer paper production and reduces labor costs through the characteristics of high efficiency, precision and automation, and is an important technological innovation in the field of food processing. In addition, the wafer paper collecting and stacking device also has high flexibility and scalability. Its modular design makes it easy to maintain and replace the components. When production needs change, the device can be easily adjusted or upgraded to meet the production needs of wafer papers of different specifications and types.

[0042] The turntable mechanism 1 includes a frame 11, a turntable furnace 12 and a disc 13. The turntable furnace 12 is arranged at the center of the disc 13. The disc 13 is arranged on the upper surface of the frame 11. A plurality of fixed seats 131 are arranged on the disc 13. The wafer paper forming mold 2 is arranged on the fixed seats 131. In this embodiment, the turntable mechanism 1 is adopted to significantly improve the production efficiency and product finishing quality. The mechanism is firmly supported by the frame 11, and the turntable furnace 12 is accurately positioned at the core of the disc 13, which not only ensures the uniformity of heating, but also optimizes the process flow. The design of multiple fixed seats 131 on the disc 13 provides a stable working platform for the wafer paper forming mold 2, ensures the consistent spacing between the molds, and avoids mutual interference between products. This layout accelerates the forming and separation of wafer paper, and then facilitates the automated material collection and stacking system to efficiently and orderly collect and stack finished products, significantly reduces manual intervention, and improves the automation level and production efficiency of the overall production line. The design of the turntable mechanism 1 allows the number and position of the molds to be flexibly adjusted according to production needs, thereby adapting to the production of wafer papers of different sizes and shapes, and improving the flexibility and adaptability of the production line. The disc 13 layout makes the entire turntable mechanism 1 compact, which saves more space than the traditional layout and is conducive to maximizing production capacity in a limited production area.

[0043] See also Figure 4 to Figure 7As shown, the material picking mechanism 3 includes a material picking bracket 31, a material picking transmission module 32, a material picking lifting module 33 and a material picking extension arm 34, wherein the material picking transmission module 32 is arranged on the material picking bracket 31, and the material picking lifting module 33 is arranged on the material picking lifting module 33; the material picking extension arm 34 includes a fixed connecting plate 341, a floating connecting rod 342 and a material picking head 343, wherein the fixed connecting plate 341 is arranged on the material picking lifting module 33, and the floating connecting rod 342 includes a driving connecting part 3421, an elastic floating part 3422 and a material picking connecting part 3423, and the driving connecting part 3421 and the elastic floating part 3422 are connected to the material picking connecting part 3423 The drive connection part 3421 is formed by integral processing of elastic metal materials, and the drive connection part 3421 is arranged on the fixed connection plate 341, and the material taking head 343 is arranged on the material taking connection part 3423. The elastic floating part 3422 is inclined from the drive connection part 3421 toward the material taking connection part 3423. When the material taking head 343 takes materials, an elastic floating force is generated to drive the wafer paper grabbed by the material taking head 343 to move toward the material receiving mechanism 4. When it is above the material taking mechanism 3, a shaking force is generated under the action of the rebound force of the elastic floating part 3422, so that the wafer paper falls into the material receiving mechanism 4. The stacking mechanism 5 is located below the material receiving mechanism 4 to stack the fallen wafer paper. In this embodiment, the material taking mechanism 3 constructs a highly flexible and stable material grabbing system by integrating the material taking bracket 31, the material taking transmission module 32, the material taking lifting module 33 and the innovative material taking extension arm 34. The material picking transmission module 32 accurately controls the motion trajectory to ensure the accuracy of the material picking position; the material picking lifting module 33 adjusts the height according to actual needs to adapt to the operating requirements in different production scenarios. The design of the material picking extension arm 34 combines the stability of the fixed connecting plate 341 and the dynamic adaptability of the floating connecting rod 342. The floating connecting rod 342 is made of elastic metal material in one piece, which not only ensures the compactness and strength of the structure, but also gives the material picking head 343 an elastic floating force during the material picking process, effectively reducing the impact caused by direct contact with the material and protecting the integrity of the wafer paper. At the same time, when the material picking head 343 is located above the mechanism and is ready to release the material, the rebound force of the elastic floating part 3422 automatically generates a slight shaking force, which promotes the smooth shedding of the wafer paper and significantly improves the efficiency and accuracy of material collection.

[0044] The material picking bracket 31 includes a lower bracket 311 and an upper bracket 312 arranged on the lower bracket 311, the lower bracket 311 is provided with a stacking platform 313 on one side of the upper bracket 312, the material picking transmission module 32 is arranged on the upper bracket 312, and the stacking mechanism 5 is arranged on the stacking platform 313. In this embodiment, the above-mentioned material picking bracket 31 design significantly improves the automation efficiency and stacking accuracy. The lower bracket 311 provides stable support, and the upper bracket 312 flexibly arranges the material picking transmission module 32, ensuring the stability and efficiency of the material picking process. The stacking platform 313 arranged on one side cleverly integrates the stacking mechanism 5, realizing the seamless connection of wafer paper from material picking to stacking, reducing manual intervention and improving production efficiency. This structural design optimizes space utilization, makes the stacking process more compact and orderly, avoids confusion and damage to paper, and ensures the consistency of product quality.

[0045] The stacking mechanism 5 is located below the receiving mechanism 4, and accurately receives and stacks the wafer paper from the taking mechanism 3, realizing a continuous automated operation process from taking to stacking. This design not only reduces manual intervention and labor intensity, but also improves the throughput capacity and product quality consistency of the entire production line by optimizing the material flow path.

[0046] The material picking transmission module 32 includes a transmission base plate 321, a transmission guide rail 322, a transmission cam assembly 323, a transmission slide 324 and a transmission motor 325. The transmission cam assembly 323 includes a transmission cam disc 3231 and a transmission cam connecting rod 3232. The transmission guide rail 322 is arranged on the transmission base plate 321. The transmission slide 324 is slidably arranged on the transmission guide rail 322. The transmission motor 325 is arranged on the transmission base plate 321 and connected to the transmission cam disc 3231. The transmission cam disc 3231 is connected to the transmission slide 324 through the transmission cam connecting rod 3232. Specifically, the transmission cam disc 3231 is provided with a stroke adjustment slot 3233, and the stroke adjustment slot 3233 is provided with a stroke adjustment block 3234, and the stroke adjustment slot 3233 is provided with a plurality of mounting holes for mounting the stroke adjustment block 3234; the transmission cam disc 3231 rotates under the driving action of the transmission motor 325, so as to drive the transmission slide 324 to slide on the transmission guide rail 322 through the transmission cam connecting rod 3232, and the material picking lifting module 33 is arranged on the transmission slide 324 and moves with the transmission slide 324. In this embodiment, the transmission bottom plate 321 and the guide rail system are precisely designed to ensure the smooth sliding of the transmission slide 324 in the horizontal direction, laying a solid foundation for accurate material picking. The innovative application of the transmission cam assembly 323, especially the design of its built-in stroke adjustment slot 3233 and adjustable stroke adjustment block 3234, not only facilitates the flexible adjustment of the material picking stroke according to the size of the wafer paper, but also enhances the flexibility and stability of the adjustment through the configuration of multiple mounting holes. The close connection between the transmission motor 325 and the transmission cam disc 3231 realizes efficient power transmission, drives the transmission slide 324 to move precisely along the preset path, and effectively reduces mechanical errors. In this process, the material picking and lifting module 33 moves synchronously with the transmission slide 324, ensuring that the actions of picking, lifting, and stacking are completed in one go, significantly improving the automation level of wafer paper collection and stacking, reducing the need for manual intervention, and at the same time improving the overall operating efficiency of the production line and the stability of product quality. The automated material picking and stacking process greatly shortens the production cycle, reduces the waiting time caused by manual operation, and enables the entire production line to operate continuously and efficiently, thereby improving overall production efficiency.

[0047] The material picking and lifting module 33 includes a lifting base plate 331, a lifting guide rail 332, a lifting cam assembly 333, a lifting slide 334 and a lifting motor 335. The lifting cam assembly 333 includes a lifting cam disc 3331 and a lifting cam connecting rod 3332. The lifting guide rail 332 is arranged on the lifting base plate 331. The lifting slide 334 is slidably arranged on the lifting guide rail 332. The lifting motor 335 is arranged on the lifting base plate 331 and connected with the lifting cam disc 3331. The lifting cam disc 3331 is connected with the lifting slide 334 through the lifting cam connecting rod 3332. Specifically, the lifting cam disc 3331 rotates under the driving action of the lifting motor 335 to drive the lifting slide 334 to slide on the lifting guide rail 332 through the lifting cam connecting rod 3332. The fixed connecting plate 341 is arranged on the lifting slide 334 and moves with the lifting slide 334. In this embodiment, through the precisely designed lifting cam assembly 333, under the precise control of the lifting motor 335, the lifting slide 334 can be lifted and lowered smoothly and accurately. In this process, the efficient cooperation between the lifting cam plate 3331 and the connecting rod ensures the continuity and stability of power transmission, so that the lifting slide 334 moves smoothly along the lifting guide rail 332, reducing mechanical vibration and noise. The fixed connecting plate 341 moves synchronously with the lifting slide 334, accurately controlling the picking and stacking height of the wafer paper, and effectively avoiding the uncertainty and error of manual operation. Overall, the application of this module greatly optimizes the material collection and stacking process, improves production efficiency and product quality, and reduces labor costs.

[0048] The driving connection part 3421 is provided with a fixed gasket 3424, and the driving connection part 3421 is installed on the fixed connection plate 341 through the fixed gasket 3424. Specifically, the material taking head 343 includes a mounting gasket 3431 and a material taking suction head 3432, and the material taking suction head 3432 is provided with an adsorption groove 3433 and an adsorption hole 3434 for adsorbing wafer paper. In this embodiment, a fixed gasket 3424 is cleverly arranged between the driving connection part 3421 and the fixed connection plate 341, which not only ensures the stability of the connection, but also effectively reduces the vibration and noise during the operation of the equipment through the buffering effect of the gasket, thereby improving the stability and comfort of the overall working environment. At the same time, the mounting gasket 3431 designed in the material taking head 343 is combined with the material taking suction head 3432 to form an integrated and efficient material taking unit. The adsorption groove 3433 and the precisely arranged adsorption holes 3434 on the material picking suction head 3432 can accurately and powerfully adsorb the wafer paper, ensuring that the wafer paper can be stably and without omissions in the high-speed and continuous material collection and stacking process, which significantly improves production efficiency and product quality. This structural design shows a high level of integration and intelligence, and is an important technological breakthrough in promoting the automation of wafer paper processing. In addition, the structural design also takes into account ease of maintenance and flexibility. The introduction of the fixed gasket 3424 and the installation gasket 3431 makes it easier to disassemble and install when maintenance or replacement of parts is required, reducing maintenance costs and time.

[0049] See also Figure 8 As shown, the receiving mechanism 4 includes a receiving mounting frame 41 and a receiving guide sleeve 42, one side of the receiving guide sleeve 42 is provided with a receiving guide groove 43, one end of the receiving guide groove 43 extends toward the turntable mechanism 1, and the other end is inclined toward the stacking mechanism 5; the receiving guide sleeve 42 is provided with a receiving groove 421, and the receiving groove 421 is used to connect the material taking mechanism 3 and the stacking mechanism 5. In this embodiment, through the synergistic effect of the receiving mounting frame 41 and the receiving guide sleeve 42, combined with the precise design of the receiving guide groove 43, the smooth transition and precise guidance of the wafer paper between the turntable mechanism 1 and the stacking mechanism 5 are ensured. The inclined design of the guide groove not only promotes the smooth flow of materials, but also effectively prevents the jamming phenomenon during the stacking process, ensuring the neatness of the stacking. At the same time, the ingenious setting of the receiving groove 421, as a bridge between the taking mechanism 3 and the stacking mechanism 5, realizes the continuity and efficiency of material transmission, reduces manual intervention, and improves the overall automation level of the production line.

[0050] See also Fig. 9As shown, the stacking mechanism 5 includes a stacking tray 51 located below the receiving mechanism 4 and a stacking pressing assembly 52 located on one side of the stacking tray 51. The receiving slot 421 is used to guide the wafer paper toward the stacking tray 51, and the stacking pressing assembly 52 is used to press the wafer paper on the stacking tray 51 in sequence for stacking. Specifically, the outer periphery of the stacking tray 51 is provided with a positioning guide piece 511, and the positioning guide piece 511 extends toward the receiving slot 421; the stacking pressing assembly 52 includes a pressing bracket 521, a pressing drive motor 522, a pressing connecting rod 523 and a pressing plate 524, the pressing drive motor 522 is provided on the pressing bracket 521, two pressing connecting rods 523 are provided and connected to the pressing drive motor 522, two pressing connecting rods 523 are connected to the two sides of the pressing plate 524 respectively, and a plurality of through holes 5241 are provided on the pressing plate 524. In this embodiment, the wafer paper is accurately guided to the stacking plate 51 by the ingeniously designed positioning guide piece 511, the deviation phenomenon is reduced, and the stacking accuracy is improved. The integration of the stacking pressing assembly 52, especially the linkage mechanism of the pressing connecting rod 523 and the pressing plate 524 driven by the pressing drive motor 522, realizes the automated pressing process, ensures that each layer of wafer paper fits tightly, and avoids the problem of loose stacking. The design of multiple through holes 5241 on the pressing plate 524 not only reduces the overall weight, but also helps air circulation, reduces resistance during the pressing process, and improves the pressing efficiency and stability. The output force of the pressing drive motor 522 can be fine-tuned according to the thickness and material of the wafer paper, ensuring that wafer paper of different specifications and types can obtain appropriate pressing force, avoiding damage caused by over-tightening or unstable stacking caused by over-loosening. At the same time, the structural design of the pressing connecting rod 523 and the pressing plate 524 allows for quick replacement or adjustment according to actual needs to adapt to different production scenarios and process requirements.

[0051] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the attached claims.

Claims

1. A wafer paper collecting and stacking device, characterized in that: It comprises a turntable mechanism, a wafer paper forming mold, a material taking mechanism, a material collecting mechanism and a material stacking mechanism, wherein a plurality of wafer paper forming molds are provided, and the plurality of wafer paper forming molds are evenly distributed on the turntable mechanism in a circumferential direction, and the turntable mechanism is used to drive the plurality of wafer paper forming molds to pass through the material taking mechanism in sequence, and the material taking mechanism is used to grab the wafer paper on the wafer paper forming mold to the material collecting mechanism for collecting, and stack it toward the material stacking mechanism; The material picking mechanism includes a material picking bracket, a material picking transmission module, a material picking lifting module and a material picking extension arm, the material picking transmission module is arranged on the material picking bracket, and the material picking lifting module is arranged on the material picking lifting module; the material picking extension arm includes a fixed connecting plate, a floating connecting rod and a material picking head, the fixed connecting plate is arranged on the material picking lifting module, the floating connecting rod includes a driving connecting part, an elastic floating part and a material picking connecting part, the driving connecting part and the elastic floating part are integrally formed with the material picking connecting part by elastic metal material, the driving connecting part is arranged on the fixed connecting plate, the material picking head is arranged on the material picking connecting part, the elastic floating part is inclined from the driving connecting part toward the material picking connecting part, when the material picking head is picking up materials, an elastic floating force is generated to drive the wafer paper grabbed by the material picking head to move toward the material receiving mechanism, when it is above the material picking mechanism, a shaking force is generated under the action of the rebound force of the elastic floating part, so that the wafer paper falls into the material receiving mechanism, and the stacking mechanism is located below the material receiving mechanism to stack the wafer paper that falls into it.

2. The wafer paper collecting and stacking device according to claim 1, characterized in that: The turntable mechanism comprises a frame, a turntable furnace and a disc, wherein the turntable furnace is arranged at the center of the disc, the disc is arranged on the upper surface of the frame, a plurality of fixing seats are arranged on the disc, and the wafer paper forming mold is arranged on the fixing seat.

3. The wafer paper collecting and stacking device according to claim 1, characterized in that: The material taking support comprises a lower support and an upper support arranged on the lower support, the lower support is located on one side of the upper support and is provided with a material stacking platform, the material taking transmission module is arranged on the upper support, and the material stacking mechanism is arranged on the material stacking platform.

4. The wafer paper collecting and stacking device according to claim 1, characterized in that: The material picking transmission module includes a transmission base plate, a transmission guide rail, a transmission cam assembly, a transmission slide and a transmission motor. The transmission cam assembly includes a transmission cam disc and a transmission cam connecting rod. The transmission guide rail is arranged on the transmission base plate, and the transmission slide is slidably arranged on the transmission guide rail. The transmission motor is arranged on the transmission base plate and connected to the transmission cam disc, and the transmission cam disc is connected to the transmission slide via the transmission cam connecting rod.

5. The wafer paper collecting and stacking device according to claim 4, characterized in that: The transmission cam disc is provided with a stroke adjustment groove, a stroke adjustment block is provided on the stroke adjustment groove, and a plurality of mounting holes are provided on the stroke adjustment groove for installing the stroke adjustment block; the transmission cam disc rotates under the driving action of the transmission motor to drive the transmission slide to slide on the transmission guide rail through the transmission cam connecting rod, and the material picking and lifting module is arranged on the transmission slide and moves with the transmission slide.

6. The wafer paper collecting and stacking device according to claim 5, characterized in that: The material picking and lifting module comprises a lifting base plate, a lifting guide rail, a lifting cam assembly, a lifting slide and a lifting motor, the lifting cam assembly comprises a lifting cam disc and a lifting cam connecting rod, the lifting guide rail is arranged on the lifting base plate, the lifting slide is slidably arranged on the lifting guide rail, the lifting motor is arranged on the lifting base plate and connected to the lifting cam disc, and the lifting cam disc is connected to the lifting slide through the lifting cam connecting rod; The lifting cam plate rotates under the driving action of the lifting motor to drive the lifting slide to slide on the lifting guide rail through the lifting cam connecting rod. The fixed connecting plate is arranged on the lifting slide and moves with the lifting slide.

7. The wafer paper collecting and stacking device according to claim 1, characterized in that: The drive connection part is provided with a fixing gasket, and the drive connection part is mounted on the fixing connection plate through the fixing gasket; The material taking head comprises a mounting gasket and a material taking suction head, and the material taking suction head is provided with an adsorption groove and an adsorption hole for adsorbing wafer paper.

8. The wafer paper collecting and stacking device according to claim 1, characterized in that: The material receiving mechanism includes a material receiving mounting frame and a material receiving guide sleeve, a material receiving guide groove is provided on one side of the material receiving guide sleeve, one end of the material receiving guide groove extends toward the turntable mechanism and the other end is inclined toward the stacking mechanism; the material receiving guide sleeve is provided with a material receiving groove, and the material receiving groove is used to connect the material taking mechanism and the stacking mechanism.

9. The wafer paper collecting and stacking device according to claim 8, characterized in that: The stacking mechanism includes a stacking tray located below the receiving mechanism and a stacking pressing assembly located on one side of the stacking tray. The receiving trough is used to guide the wafer paper toward the stacking tray, and the stacking pressing assembly is used to press the wafer paper on the stacking tray in sequence for stacking.

10. The wafer paper collecting and stacking device according to claim 9, characterized in that: The outer periphery of the stacking tray is provided with a positioning guide piece, and the positioning guide piece extends toward the receiving trough; the stacking material clamping assembly includes a clamping bracket, a clamping drive motor, a clamping connecting rod and a clamping plate, the clamping drive motor is arranged on the clamping bracket, two clamping connecting rods are provided and connected to the clamping drive motor, two clamping connecting rods are respectively connected to the two sides of the clamping plate, and a plurality of through holes are arranged on the clamping plate.

Images