Method, device, electronic device and storage medium for adjusting ambient temperature

Abstract

The embodiment of the present invention discloses a method, device, electronic device and storage medium for adjusting the ambient temperature, and relates to the field of chip testing technology. The method is applied to a temperature adjustment system, and the system includes: multiple test devices, each test device includes at least one temperature measurement point, each test device is deployed in the same factory building and the installation directions of each test device are different, and the factory building includes multiple air outlets: the method includes: responding to the temperature abnormality instruction of the target temperature measurement point, respectively determining each reference air outlet and each reference temperature measurement point; respectively determining the target distance between each reference air outlet and the target temperature measurement point, and the temperature deviation between the current temperature of each reference temperature measurement point and the warning temperature; adjusting the temperature and / or wind speed of each reference air outlet according to each target distance, each temperature deviation and the installation direction of the target test device. The scheme of the embodiment of the present invention can realize the rapid and accurate adjustment of the ambient temperature.

Description

Technical Field

[0001] The present invention relates to the field of chip testing technology, and in particular to a method, device, electronic equipment and storage medium for adjusting ambient temperature. Background Art

[0002] At present, in the process of testing different integrated circuit chips, due to the different power consumption of different chips, the heat generated during the test is also different, and the sensitivity of different chips to temperature is also different, so the frequency of temperature alarms of different chips is also different.

[0003] At present, the relevant staff mainly fine-tune the air outlets at different points to try to find a suitable combination of temperature and wind speed. This method requires the staff to make multiple attempts, consumes a lot of time and energy, and it is difficult to determine the most accurate combination of temperature and wind speed, making it difficult to achieve precise adjustment of the ambient temperature during the testing of integrated circuit chips. Summary of the invention

[0004] The present invention provides a method, device, electronic device and storage medium for adjusting ambient temperature, so as to solve the problem that it is difficult to adjust ambient temperature quickly and accurately, and can realize the rapid and accurate adjustment of ambient temperature during the testing process of integrated circuit chips.

[0005] According to one aspect of the present invention, a method for adjusting ambient temperature is provided, and the method for adjusting ambient temperature is applied to a temperature adjustment system, and the temperature adjustment system comprises: a plurality of test devices, the test devices are used to test each integrated circuit chip, each test device comprises at least one temperature measurement point, and each temperature measurement point determines at least one temperature result according to the test result of each integrated circuit chip; each of the test devices is deployed in the same factory building and each of the test devices is installed in a different direction, and the factory building comprises a plurality of air outlets: the method for adjusting ambient temperature comprises:

[0006] In response to a temperature anomaly instruction of a target temperature measurement point, each reference air outlet and each reference temperature measurement point associated with the target temperature measurement point are determined respectively; the target temperature measurement point is matched with a target test device;

[0007] Respectively determining the target distance between each reference air outlet and the target temperature measurement point, and the temperature deviation between the current temperature and the warning temperature of each reference temperature measurement point;

[0008] The temperature and / or wind speed of each reference air outlet is adjusted according to each target distance, each temperature deviation and the installation direction of the target test equipment.

[0009] According to another aspect of the present invention, an ambient temperature regulating device is provided, the ambient temperature regulating device is deployed in a temperature regulating system, the temperature regulating system comprises: a plurality of test devices, the test devices are used to test each integrated circuit chip, each test device comprises at least one temperature measurement point, each temperature measurement point determines at least one temperature result according to the test result of each integrated circuit chip; each of the test devices is deployed in the same factory building and each of the test devices is installed in a different direction, the factory building comprises a plurality of air outlets: the ambient temperature regulating device comprises:

[0010] A first determination module is used to respond to a temperature anomaly instruction of a target temperature measurement point and respectively determine each reference air outlet and each reference temperature measurement point associated with the target temperature measurement point; the target temperature measurement point matches a target test device;

[0011] A second determination module is used to respectively determine the target distance between each reference air outlet and the target temperature measurement point, and the temperature deviation between the current temperature of each reference temperature measurement point and the warning temperature;

[0012] The regulating module is used to regulate the temperature and / or wind speed of each reference air outlet according to each target distance, each temperature deviation and the installation direction of the target test equipment.

[0013] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising:

[0014] at least one processor; and

[0015] a memory communicatively connected to the at least one processor; wherein,

[0016] The memory stores a computer program that can be executed by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the method for adjusting the ambient temperature described in any embodiment of the present invention.

[0017] According to another aspect of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the method for adjusting the ambient temperature described in any embodiment of the present invention when executed.

[0018] According to another aspect of the present invention, a computer program product is provided, including a computer program, wherein when the computer program is executed by a processor, the method for adjusting the ambient temperature according to any embodiment of the present invention is implemented.

[0019] The technical solution of the embodiment of the present invention can be applied to a temperature regulation system, which includes: a plurality of test devices, the test devices are used to test each integrated circuit chip, each test device includes at least one temperature measurement point, each temperature measurement point determines at least one temperature result through the test result of each integrated circuit chip; each of the test devices is deployed in the same factory building and the installation directions of each of the test devices are different, and the factory building includes a plurality of air outlets: the technical solution of the embodiment of the present invention specifically includes: in response to the temperature abnormality instruction of the target temperature measurement point, each reference air outlet and each reference temperature measurement point associated with the target temperature measurement point are determined respectively; the target temperature measurement point is matched with the target test device; the target distance between each reference air outlet and the target temperature measurement point, and the temperature deviation between the current temperature of each reference temperature measurement point and the warning temperature are determined respectively; the temperature and / or wind speed of each reference air outlet are adjusted according to each target distance, each temperature deviation and the installation direction of the target test device, so as to solve the problem that it is difficult to adjust the ambient temperature quickly and accurately, and the ambient temperature can be adjusted quickly and accurately during the test process of the integrated circuit chip.

[0020] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 is a flow chart of a method for adjusting ambient temperature provided according to Embodiment 1 of the present invention;

[0023] Figure 2 is a structural schematic diagram of a temperature adjustment system provided according to Embodiment 1 of the present invention;

[0024] Figure 3 is a flow chart of a method for adjusting ambient temperature provided according to Embodiment 2 of the present invention;

[0025] Figure 4 is a schematic structural diagram of an ambient temperature adjustment device provided according to Embodiment 3 of the present invention;

[0026] Figure 5It is a structural schematic diagram of an electronic device for implementing the method for adjusting the ambient temperature of an embodiment of the present invention. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0028] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0029] Embodiment 1

[0030] Figure 1 This is a flow chart of a method for adjusting ambient temperature provided according to Example 1 of the present invention. This embodiment is applicable to the situation where the temperature and wind speed of each air outlet in a factory are adjusted by a temperature adjustment system. The method can be executed by an ambient temperature adjustment device. The ambient temperature adjustment device can be implemented in the form of hardware and / or software. The ambient temperature adjustment device can be configured in electronic devices such as servers or computers equipped with a temperature adjustment system.

[0031] Figure 2 is a schematic diagram of a temperature control system according to the first embodiment of the present invention. Figure 2 As shown, the temperature regulation system includes: a plurality of test devices, for example, 10, 20 or 30, etc., Figure 2 Four test devices are taken as an example for description (respectively denoted as 201, 202, 203 and 204), which is only for the convenience of describing the solution of this embodiment and is not a limitation of this embodiment.

[0032] In this embodiment, the test equipment is used to test each integrated circuit chip, and each test equipment includes at least one temperature measurement point, and each temperature measurement point determines at least one temperature result through the test results of each integrated circuit chip. It can be understood that if the target test equipment is testing an integrated circuit chip, then the test results of the integrated circuit chip can be obtained through the temperature measurement points of the target test equipment, and the internal temperature of the integrated circuit chip can be obtained by analyzing the test results.

[0033] It should be noted that, in this embodiment, the temperature measurement point of the test equipment is not a specific point in the physical sense, and it may not include a specific hardware structure, but is only implemented by a software algorithm. In this embodiment, it is named as a temperature measurement point only for the convenience of description.

[0034] In this embodiment, each of the test devices can be deployed in the same factory building, and the installation directions of each of the test devices can be the same or different. For example, the front of each test device can face any direction, for example, the front of test device 201 and test device 202 faces right, and the front of test device 203 and test device 204 faces left. It should be noted that, in this embodiment, each test device mainly relies on the rear part for air flow, and the front part is close to a closed structure. In this embodiment, the front part of the test device is also referred to as a shielding area; that is, in this embodiment, the shielding area of ​​each test device is determined by the installation direction of the test device.

[0035] It is understandable that different models, sizes and types of test equipment can be installed in the same factory. Therefore, in order to ensure the utilization rate of the factory space, it is necessary to install as many test equipment as possible. This also leads to the installation direction of each test equipment in the factory being random rather than unified.

[0036] Optionally, in this embodiment, the factory building includes a plurality of air outlets. Figure 2 Eight air outlets are shown, namely air outlets 210 to 217; the ambient temperature in the factory can be adjusted by adjusting the wind speed or temperature of each air outlet. For example, if the wind speed of air outlet 210 is increased and the temperature of air outlet 210 is reduced, the temperature of the area to which air outlet 210 belongs can be quickly reduced; it can be understood that when the area to which the air outlet belongs is at a low temperature, the temperature of the area to which the air outlet belongs can be reduced by increasing the wind speed; when the area to which the air outlet belongs is at a high temperature, the temperature of the area to which the air outlet belongs can be increased by increasing the wind speed.

[0037] Specifically, refer to Figure 1 , the methods for adjusting the ambient temperature include:

[0038] Step 110: In response to the temperature abnormality instruction of the target temperature measurement point, each reference air outlet and each reference temperature measurement point associated with the target temperature measurement point are determined respectively.

[0039] The target temperature measurement point matches the target test device, and the target test device can be any test device in the temperature control system, which is not limited in this embodiment. In this embodiment, the temperature anomaly can be too high or too low, which is not limited in this embodiment.

[0040] In this embodiment, during the operation of each test device, that is, during the process of each test device testing each integrated circuit chip, the temperature inside the chip can be determined through the temperature measurement point of each test device (for example, the test results of the chip can be analyzed to obtain the temperature inside the chip) and the temperature deviation from the expected temperature can be determined based on the detected temperature. When the deviation is greater than the temperature threshold, an abnormal alarm can be issued; illustratively, if the target temperature measurement point detects that the current temperature of the chip is 57 degrees Celsius, the expected temperature is 50 degrees Celsius, and the temperature threshold is 5 degrees Celsius, it can be determined that the temperature deviation between the current temperature of the chip and the expected temperature is 7 degrees Celsius, which is greater than the temperature threshold of 5 degrees Celsius. At this time, it can be determined that the temperature of the chip is abnormal and an abnormal alarm is issued.

[0041] Optionally, in this embodiment, after receiving the temperature anomaly instruction of the target temperature measurement point, each reference air outlet associated with the target temperature measurement point and each reference temperature measurement point can be further determined; it can be understood that each reference air outlet associated with the target temperature measurement point is an air outlet that is close to the target temperature measurement point and whose temperature or wind speed will affect the temperature of the target temperature measurement point; illustratively, in Figure 2 In the embodiment, if the target temperature measurement point is the temperature measurement point of the test device 202, then the air outlet 210, the air outlet 211, the air outlet 212 and the air outlet 213 can be the reference air outlets of the target temperature measurement point; the reference temperature measurement point associated with the target temperature measurement point can be the temperature measurement point of the test device that will affect the temperature of the target temperature measurement point during the process of adjusting the temperature or wind speed of the reference air outlet of the target temperature measurement point; illustratively, the temperature measurement point of the test device 201 can be the reference temperature measurement point of the target temperature measurement point (the temperature measurement point of the test device 202).

[0042] Optionally, in this embodiment, respectively determining each reference air outlet associated with the target temperature measurement point and each reference temperature measurement point may include: determining the location information of the target test device, and determining the location area associated with the location information; obtaining each air outlet located within the location area, and determining each air outlet as a reference air outlet; obtaining each reference test device located within the location area, and determining the temperature measurement point of each reference test device as a reference temperature measurement point.

[0043] Among them, the location information of the target test equipment is the location or coordinates of the installation location of the target test equipment in the factory, for example, the 001th position of area A of factory A, or the 001th row and 020th column of area B of factory A, etc., which is not limited in this embodiment.

[0044] In an optional implementation of the present embodiment, after determining the location information of the target test device, the location area associated with the location information can be further determined; illustratively, in the present embodiment, after determining the location information of the target test device, the location information can be taken as the center of a circle, and the length can be set as the radius, and the circular area formed by the center of the circle and the radius is the location area; the location information can also be determined as the center of a rectangle, and the length can be set as the side length of the rectangle, and the resulting rectangular area is the location area.

[0045] Furthermore, each air outlet within the location area can be obtained, and each air outlet within the location area can be determined as each reference air outlet; each reference test device within the location area can also be obtained, and the temperature measurement point of each reference test device can be determined as each reference temperature measurement point.

[0046] Step 120 , respectively determining a target distance between each reference air outlet and the target temperature measurement point, and a temperature deviation between a current temperature and a warning temperature at each reference temperature measurement point.

[0047] In an optional implementation of the present embodiment, after determining each reference air outlet and each reference temperature measurement point, the target distance between each reference air outlet and the target temperature measurement point, as well as the temperature deviation between the current temperature of each reference temperature measurement point and the warning temperature can be further determined.

[0048] It can be understood that, since the target temperature measurement point is inside the target test equipment, the distance between each reference air outlet and the target temperature measurement point is the distance between each reference air outlet and the target test equipment.

[0049] Optionally, in the present embodiment, respectively determining the target distance between each of the reference air outlets and the target temperature measurement point, as well as the temperature deviation between the current temperature of each reference temperature measurement point and the warning temperature, may include: determining the reference position information of each of the reference air outlets, and determining each of the target distances based on the position information of the target test equipment and the reference position information of each of the reference air outlets; determining the current temperature of each of the reference temperature measurement points, and determining each of the temperature deviations based on the current temperature and the warning temperature of each of the reference temperature measurement points.

[0050] In this embodiment, the installation location information of each reference air outlet can be obtained through the factory decoration schematic diagram in the factory system or other files, and the installation location information can be determined as the reference location information of each reference air outlet. Further, the distance between the location information of the target test equipment and each reference location information can be determined respectively, and the distance can be determined as the target distance between each reference air outlet and the target temperature measurement point; further, the current temperature of each reference temperature measurement point can be determined respectively, and the difference between the current temperature and the warning temperature of the reference temperature measurement point can be calculated, and the difference can be determined as the temperature deviation.

[0051] It should be noted that, since different test equipment can test different integrated circuit chips at the same time, the warning temperatures of each reference temperature measurement point may be the same or different. In this embodiment, the specific values ​​of the warning temperatures of each reference temperature measurement point are not limited.

[0052] Step 130: adjusting the temperature and / or wind speed of each reference air outlet according to each target distance, each temperature deviation, and the installation direction of the target test device.

[0053] In an optional implementation of the present embodiment, after obtaining each target distance and each temperature deviation, the temperature adjustment value, wind speed adjustment value, or the adjustment value of both temperature and wind speed for each reference air outlet can be further determined based on each target distance, each temperature deviation and the installation direction of the target test equipment.

[0054] Optionally, in this embodiment, after determining each temperature deviation, it can also include: determining whether each temperature deviation is less than a set threshold; when it is determined that the target temperature deviation is less than the set threshold, determining the reference temperature measurement point corresponding to the target temperature deviation as a close reference temperature measurement point of the target temperature measurement point; when it is determined that the target temperature deviation is greater than or equal to the set threshold, determining the reference temperature measurement point corresponding to the target temperature deviation as a sub-close reference temperature measurement point of the target temperature measurement point.

[0055] The set threshold may be 0.5 degrees Celsius, 1 degree Celsius, or 2 degrees Celsius, etc., which is not limited in this embodiment.

[0056] It can be understood that if the temperature deviation between the current temperature of the first reference temperature measurement point and the warning temperature is less than the set threshold, then the first reference temperature measurement point is about to reach the warning temperature; illustratively, the temperature deviation between the current temperature of the first reference temperature measurement point and the warning temperature is 0.1 degrees Celsius, which is less than the set threshold of 0.5 degrees Celsius, that is, changing the temperature of the air outlet near the first reference measurement point will cause the temperature of the first reference measurement point to rise quickly to the warning temperature; in this embodiment, this type of reference temperature measurement point is referred to as a close reference temperature measurement point of the target temperature measurement point.

[0057] Exemplarily, the temperature deviation between the current temperature of the first reference temperature measurement point and the warning temperature is 10 degrees Celsius, which is greater than the set threshold of 0.5 degrees Celsius, that is, changing the temperature of the air outlet near the first reference measurement point will not cause the temperature of the first reference measurement point to rise quickly to the warning temperature; in this embodiment, this type of reference temperature measurement point is called a sub-close reference temperature measurement point of the target temperature measurement point.

[0058] In this embodiment, by determining the close reference temperature measurement point of the target temperature measurement point, as well as the sub-close reference temperature measurement point, a basis can be provided for determining the temperature or wind speed of each reference air outlet, and excessive influence on the temperature of other reference temperature measurement points can be prevented, thereby causing the temperature of the reference temperature measurement point to exceed the warning temperature.

[0059] Optionally, in the present embodiment, the temperature and / or wind speed of each of the reference air outlets is adjusted according to each of the target distances, each of the temperature deviations and the installation direction of the target test equipment, which may include: in the case of determining a close reference temperature measurement point that does not include the target temperature measurement point among each of the reference temperature measurement points, determining a first air outlet, a second air outlet and a third air outlet from each of the reference air outlets; the first air outlet being the air outlet farthest from the shielding area of ​​the target test equipment corresponding to the target temperature measurement point among each of the reference air outlets; the third air outlet The first air outlet is the air outlet which is closest to the shielding area of ​​the target test device among the reference air outlets; the second air outlet is the air outlet which is between the first air outlet and the third air outlet in the distance to the shielding area of ​​the target test device among the reference air outlets; the shielding area of ​​the target test device is determined by the installation direction of the target test device; the wind speed and / or temperature of the first air outlet and the second air outlet are adjusted simultaneously to quickly heat up or cool down the target temperature measurement point; the adjustment includes: increasing or decreasing the wind speed, increasing or decreasing the temperature.

[0060] In an optional implementation of the present embodiment, if it is determined that the temperature deviations between each reference temperature measurement point and the warning temperature are greater than or equal to a set threshold, it can be determined that each reference temperature measurement point related to the target measurement point does not include a close reference temperature measurement point of the target temperature measurement point. Then, it can be further determined based on the distance between each reference air outlet and the shielding area of ​​the target test device, and the reference air outlet farthest from the shielding area of ​​the target test device is determined as the first air outlet; the reference air outlet closest to the shielding area of ​​the target test device is determined as the first air outlet; and other reference air outlets are determined as second air outlets.

[0061] For example, in Figure 2 In the example, if the target test device is test device 202 and the front of the test device faces the right, the first air outlet corresponding to test device 202 is air outlet 210 , the third air outlet is air outlet 213 , the second air outlet is air outlet 211 and air outlet 212 .

[0062] Furthermore, the wind speed and / or temperature of the first air outlet and the second air outlet can be adjusted simultaneously; illustratively, in the above example, if the deviation between the temperature measured by the temperature measurement point of the test equipment 202 and the expected temperature is "-3", then the temperature of the air outlet 210 can be increased and the wind speed can be decreased (for example, the temperature increases by 1 degree Celsius and the wind speed decreases by one level), and the temperature of the air outlet 211 and the air outlet 212 can be increased slightly (for example, the temperature increases by 0.5 degrees Celsius).

[0063] In another optional implementation of the present embodiment, the temperature and / or wind speed of each of the reference air outlets are adjusted according to each of the target distances, each of the temperature deviations and the installation direction of the target test equipment, and may also include: when determining a target close reference temperature measurement point that includes at least one of the target temperature measurement points among the reference temperature measurement points, determining a fourth air outlet associated with the target close reference temperature measurement point; if the current temperature of the target close reference temperature measurement point is close to the maximum temperature threshold, and the temperature abnormality instruction of the target temperature measurement point is a temperature increase instruction, the wind speed and / or temperature of other reference air outlets except the fourth air outlet are adjusted simultaneously.

[0064] Optionally, in this embodiment, if it is determined that the temperature deviations between each reference temperature measurement point and the warning temperature include one or more values ​​less than a set threshold, that is, when it is determined that each of the reference temperature measurement points includes at least one target close reference temperature measurement point, then the reference air outlet associated with the close reference temperature measurement point can be the fourth air outlet. If the current temperature of the target close reference temperature measurement point is close to the maximum temperature threshold (warning temperature), that is, the fourth air outlet associated with the target close reference temperature measurement point cannot perform the operation of increasing the temperature or increasing the wind speed, once the temperature is increased or the wind speed is increased, the current temperature of the target close reference temperature measurement point may quickly rise to the warning temperature, thereby affecting the test chip of the target close reference temperature measurement point. At this time, the wind speed and / or temperature of other reference air outlets except the fourth air outlet can be adjusted at the same time.

[0065] For example, in the above example, Figure 2 In the embodiment, if the target test device is the test device 202, the front of the test device faces the right side, if the deviation between the temperature measured by the temperature measurement point of the test device 202 and the expected temperature is "-3" (the difference between the expected temperature of the test device 202 and the current temperature), and the deviation between the test device 201 and the warning temperature is 0.2 degrees Celsius, then the air outlet 212 can be determined as the fourth air outlet. At this time, the wind speed and / or temperature of other reference air outlets except the air outlet 212 can be adjusted at the same time. The specific adjustment method will not be repeated in this embodiment.

[0066] It can be understood that in this embodiment, if the difference between the expected temperature and the current temperature is greater than 0 degrees Celsius, the temperature can be increased or the wind speed can be reduced to adjust the temperature; if the difference between the expected temperature and the current temperature is less than 0 degrees Celsius, the temperature can be reduced or the wind speed can be increased to adjust the temperature.

[0067] In a specific example of this embodiment, Tn=expected temperature-current temperature (n=1, 2, 3...), n is the corresponding point, that is, T1 is the temperature measurement point corresponding to the test device 201, T2 is the temperature measurement point corresponding to the test device 202, T3 is the temperature measurement point corresponding to the test device 203, and T4 is the temperature measurement point corresponding to the test device 204; if T1=0, T2=-3, T3=0, T4=0, then the air outlet 211 cools down and increases the wind speed, and the air outlet 213 cools down slightly. Because the distance between the machines is close, the increase in the actual temperature of T2 generally predicts that T1 will also increase slightly, so the air outlet 210 will also cool down / increase the wind speed slightly; if T1=3, T2=-3, T3=0, T4=0, then the air outlet 210 increases the temperature and reduces the wind speed, the air outlet 212 increases the temperature slightly, the air outlet 211 cools down and increases the wind speed, and the air outlet 213 cools down slightly. Because of the influence of the air outlet 211 , the air outlet 212 needs to be heated up slightly.

[0068] The technical solution of the embodiment of the present invention can be applied to a temperature regulation system, which includes: a plurality of test devices, the test devices are used to test each integrated circuit chip, each test device includes at least one temperature measurement point, each temperature measurement point determines at least one temperature result through the test result of each integrated circuit chip; each of the test devices is deployed in the same factory building and the installation directions of each of the test devices are different, and the factory building includes a plurality of air outlets: the technical solution of the embodiment of the present invention specifically includes: in response to the temperature abnormality instruction of the target temperature measurement point, each reference air outlet and each reference temperature measurement point associated with the target temperature measurement point are determined respectively; the target temperature measurement point is matched with the target test device; the target distance between each reference air outlet and the target temperature measurement point, and the temperature deviation between the current temperature of each reference temperature measurement point and the warning temperature are determined respectively; the temperature and / or wind speed of each reference air outlet are adjusted according to each target distance, each temperature deviation and the installation direction of the target test device, so as to solve the problem that it is difficult to adjust the ambient temperature quickly and accurately, and the ambient temperature can be adjusted quickly and accurately during the test process of the integrated circuit chip.

[0069] Embodiment 2

[0070] Figure 3 1 is a flow chart of a method for adjusting the ambient temperature according to the second embodiment of the present invention. This embodiment is a further refinement of the above technical solution. The technical solution in this embodiment can be combined with each optional solution in one or more of the above embodiments. Figure 3 As shown, the method includes:

[0071] Step 310: In response to a temperature anomaly instruction of a target temperature measurement point, each reference air outlet and each reference temperature measurement point associated with the target temperature measurement point are determined respectively.

[0072] Step 320: respectively determine the target distance between each reference air outlet and the target temperature measurement point, and the temperature deviation between the current temperature and the warning temperature of each reference temperature measurement point.

[0073] Step 330: input each of the target distances, each of the temperature deviations, and the installation direction of the target test equipment into a pre-trained ambient temperature adjustment model for prediction, and obtain a temperature adjustment value and / or wind speed adjustment value for each of the reference air outlets.

[0074] Optionally, in this embodiment, after obtaining each target distance, each temperature deviation and the installation direction of the target test equipment, the obtained target distance, each temperature deviation and the installation direction of the target test equipment can be further input into a pre-trained ambient temperature adjustment model for prediction, thereby obtaining the temperature adjustment value and / or wind speed adjustment value of each reference air outlet.

[0075] In an optional implementation of the present embodiment, the adjustment model of the ambient temperature is determined by the following steps: obtaining a training data set; the training data set includes: the current temperature and position information of the first temperature measurement point, the temperature information of the reference temperature point related to the first temperature measurement point, the position information of each reference air outlet related to the first temperature measurement band, and the temperature adjustment value and / or wind speed adjustment value of each reference air outlet corresponding to the first temperature measurement point; inputting each of the training data sets into the target machine learning model for iterative training to obtain the adjustment model of the ambient temperature.

[0076] The first temperature measurement point may be a temperature measurement point of any test equipment in the factory, which is not limited in this embodiment.

[0077] Step 340: adjust each of the air outlets according to the temperature adjustment value and / or wind speed adjustment value.

[0078] The solution of this embodiment, after obtaining each target distance, each temperature deviation and the installation direction of the target test equipment, can further input the obtained target distance, each temperature deviation and the installation direction of the target test equipment into a pre-trained ambient temperature adjustment model for prediction, so as to quickly and accurately determine the temperature adjustment value and / or wind speed adjustment value of each reference air outlet.

[0079] Embodiment 3

[0080] Figure 41 is a schematic diagram of the structure of an ambient temperature adjustment device provided according to the third embodiment of the present invention. The ambient temperature adjustment device is deployed in a temperature adjustment system, and the temperature adjustment system includes: a plurality of test devices, the test devices are used to test each integrated circuit chip, each test device includes at least one temperature measurement point, and each temperature measurement point determines at least one temperature result through the test result of each integrated circuit chip; each of the test devices is deployed in the same factory building and each of the test devices is installed in a different direction, and the factory building includes a plurality of air outlets: Figure 4 As shown, the device for adjusting the ambient temperature includes: a first determining module 410 , a second determining module 420 and an adjusting module 430 .

[0081] The first determination module 410 is used to determine each reference air outlet and each reference temperature measurement point associated with the target temperature measurement point in response to the temperature anomaly instruction of the target temperature measurement point; the target temperature measurement point matches the target test equipment;

[0082] The second determination module 420 is used to respectively determine the target distance between each reference air outlet and the target temperature measurement point, and the temperature deviation between the current temperature of each reference temperature measurement point and the warning temperature;

[0083] The adjustment module 430 is used to adjust the temperature and / or wind speed of each reference air outlet according to each target distance, each temperature deviation and the installation direction of the target test device.

[0084] The solution of this embodiment is to respectively determine each reference air outlet and each reference temperature measurement point associated with the target temperature measurement point in response to the temperature anomaly instruction of the target temperature measurement point through the first determination module; the target temperature measurement point is matched with the target test equipment; respectively determine the target distance between each reference air outlet and the target temperature measurement point, and the temperature deviation between the current temperature of each reference temperature measurement point and the warning temperature through the second determination module; and adjust the temperature and / or wind speed of each reference air outlet according to each target distance, each temperature deviation and the installation direction of the target test equipment through the adjustment module, thereby solving the problem of difficulty in quickly and accurately adjusting the ambient temperature, and realizing quick and accurate adjustment of the ambient temperature during the testing process of the integrated circuit chip.

[0085] In an optional implementation of this embodiment, the first determination module 410 is specifically configured to determine the location information of the target test device and determine a location area associated with the location information;

[0086] Acquire each air outlet located in the location area, and determine each air outlet as a reference air outlet;

[0087] Each reference test device located in the location area is acquired, and a temperature measurement point of each reference test device is determined as a reference temperature measurement point.

[0088] In an optional implementation of this embodiment, the second determination module 420 is specifically used to determine the reference position information of each reference air outlet, and determine each target distance according to the position information of the target test device and the reference position information of each reference air outlet;

[0089] The current temperature of each reference temperature measurement point is determined, and each temperature deviation is determined according to each current temperature and the warning temperature of each reference temperature measurement point.

[0090] In an optional implementation of this embodiment, the device for adjusting the ambient temperature further includes: a third determination module, configured to determine whether each of the temperature deviations is less than a set threshold;

[0091] In the case where it is determined that the target temperature deviation is less than a set threshold, determining a reference temperature measurement point corresponding to the target temperature deviation as a close reference temperature measurement point of the target temperature measurement point;

[0092] When it is determined that the target temperature deviation is greater than or equal to the set threshold, a reference temperature measurement point corresponding to the target temperature deviation is determined as a second closest reference temperature measurement point to the target temperature measurement point.

[0093] In an optional implementation of the present embodiment, the adjustment module 430 is specifically used to determine the first air outlet, the second air outlet and the third air outlet from each of the reference air outlets when it is determined that the close reference temperature measurement point of the target temperature measurement point is not included in each of the reference temperature measurement points; the first air outlet is the air outlet farthest from the shielding area of ​​the target test device corresponding to the target temperature measurement point among the reference air outlets; the third air outlet is the air outlet closest to the shielding area of ​​the target test device among the reference air outlets; the second air outlet is the air outlet whose distance to the shielding area of ​​the target test device among the reference air outlets is between the first air outlet and the third air outlet; the shielding area of ​​the target test device is determined by the installation direction of the target test device;

[0094] The wind speed and / or temperature of the first air outlet and the second air outlet are adjusted simultaneously to quickly heat up or cool down the target temperature measurement point;

[0095] The adjustment includes: increasing or decreasing wind speed, increasing or decreasing temperature.

[0096] In an optional implementation of this embodiment, the adjustment module 430 is further specifically configured to determine a fourth air outlet associated with the target close reference temperature measurement point when determining that each of the reference temperature measurement points includes at least one target temperature measurement point;

[0097] If the current temperature of the target close reference temperature measurement point is close to the maximum temperature threshold, and the temperature abnormality instruction of the target temperature measurement point is a temperature increase instruction, the wind speed and / or temperature of other reference air outlets except the fourth air outlet are adjusted simultaneously.

[0098] In an optional implementation of this embodiment, the adjustment module 430 is further specifically used to input each of the target distances, each of the temperature deviations, and the installation direction of the target test device into a pre-trained adjustment model of the ambient temperature for prediction, so as to obtain a temperature adjustment value and / or a wind speed adjustment value of each of the reference air outlets;

[0099] The adjustment model of the ambient temperature is determined by the following steps:

[0100] Acquire a training data set; the training data set includes: current temperature and position information of a first temperature measurement point, temperature information of a reference temperature point related to the first temperature measurement point, position information of each reference air outlet related to the first temperature measurement zone, and temperature adjustment values ​​and / or wind speed adjustment values ​​of each reference air outlet corresponding to the first temperature measurement point;

[0101] Each of the training data sets is input into the target machine learning model for iterative training to obtain the ambient temperature adjustment model.

[0102] The device for adjusting the ambient temperature provided in the embodiment of the present invention can execute the method for adjusting the ambient temperature provided in any embodiment of the present invention, and has the functional modules and beneficial effects corresponding to the execution method.

[0103] Embodiment 4

[0104] Figure 5 A schematic diagram of the structure of an electronic device 10 that can be used to implement an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0105] like Figure 5 As shown, the electronic device 10 includes at least one processor 11, and a memory connected to the at least one processor 11, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 to the random access memory (RAM) 13. In the RAM 13, various programs and data required for the operation of the electronic device 10 can also be stored. The processor 11, the ROM 12, and the RAM 13 are connected to each other through a bus 14. The input / output (I / O) interface 15 is also connected to the bus 14.

[0106] A number of components in the electronic device 10 are connected to the I / O interface 15, including: an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0107] The processor 11 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 11 executes the various methods and processes described above, such as a method for adjusting the ambient temperature, which is applied to a temperature adjustment system, wherein the temperature adjustment system includes: a plurality of test devices, wherein the test devices are used to test each integrated circuit chip, each test device includes at least one temperature measurement point, and each temperature measurement point determines at least one temperature result through the test result of each integrated circuit chip; each of the test devices is deployed in the same factory building and the installation directions of each of the test devices are different, and the factory building includes a plurality of air outlets: the method includes: in response to a temperature abnormality instruction of a target temperature measurement point, respectively determining each reference air outlet associated with the target temperature measurement point and each reference temperature measurement point; the target temperature measurement point is matched with a target test device; respectively determining a target distance between each reference air outlet and the target temperature measurement point, and a temperature deviation between the current temperature of each reference temperature measurement point and the warning temperature; and adjusting the temperature and / or wind speed of each reference air outlet according to each target distance, each temperature deviation and the installation direction of the target test device.

[0108] In some embodiments, the method for adjusting the ambient temperature may be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 18. In some embodiments, part or all of the computer program may be loaded and / or installed on the electronic device 10 via the ROM 12 and / or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the method for adjusting the ambient temperature described above may be performed. Alternatively, in other embodiments, the processor 11 may be configured to execute the method for adjusting the ambient temperature in any other appropriate manner (e.g., by means of firmware).

[0109] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0110] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer program may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0111] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, device, or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0112] To provide interaction with a user, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0113] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0114] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.

[0115] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0116] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for adjusting ambient temperature, characterized in that: The method for adjusting the ambient temperature is applied to a temperature adjustment system, which includes: a plurality of test devices, the test devices are used to test each integrated circuit chip, each test device includes at least one temperature measurement point, each temperature measurement point determines at least one temperature result through the test result of each integrated circuit chip; each of the test devices is deployed in the same factory building and each of the test devices is installed in a different direction, and the factory building includes a plurality of air outlets: the method for adjusting the ambient temperature includes: In response to a temperature anomaly instruction of a target temperature measurement point, each reference air outlet and each reference temperature measurement point associated with the target temperature measurement point are determined respectively; the target temperature measurement point is matched with a target test device; Respectively determining the target distance between each reference air outlet and the target temperature measurement point, and the temperature deviation between the current temperature and the warning temperature of each reference temperature measurement point; Adjusting the temperature and / or wind speed of each reference air outlet according to each target distance, each temperature deviation, and the installation direction of the target test device; The method of respectively determining each reference air outlet and each reference temperature measurement point associated with the target temperature measurement point includes: determining the location information of the target test device and determining the location area associated with the location information; obtaining each air outlet located in the location area and determining each air outlet as a reference air outlet; obtaining each reference test device located in the location area and determining the temperature measurement point of each reference test device as a reference temperature measurement point; After determining each of the temperature deviations, the method further includes: determining whether each of the temperature deviations is less than a set threshold; if it is determined that the target temperature deviation is less than the set threshold, determining a reference temperature measurement point corresponding to the target temperature deviation as a close reference temperature measurement point of the target temperature measurement point; The temperature and / or wind speed of each reference air outlet is adjusted according to each target distance, each temperature deviation and the installation direction of the target test device, including: when it is determined that a close reference temperature measurement point that does not include the target temperature measurement point is included in each reference temperature measurement point, a first air outlet, a second air outlet and a third air outlet are determined from each reference air outlet; the first air outlet is the air outlet farthest from the shielding area of ​​the target test device corresponding to the target temperature measurement point among each reference air outlet; the third air outlet is the air outlet closest to the shielding area of ​​the target test device among each reference air outlet; the second air outlet is the air outlet whose distance to the shielding area of ​​the target test device among each reference air outlet is between the first air outlet and the third air outlet; the shielding area of ​​the target test device is determined by the installation direction of the target test device; the wind speed and / or temperature of the first air outlet and the second air outlet are adjusted simultaneously to quickly heat up or cool down the target temperature measurement point.

2. The method for adjusting the ambient temperature according to claim 1, characterized in that: The step of respectively determining the target distance between each reference air outlet and the target temperature measurement point, and the temperature deviation between the current temperature of each reference temperature measurement point and the warning temperature, comprises: Determine the reference position information of each reference air outlet, and determine each target distance according to the position information of the target test device and the reference position information of each reference air outlet; The current temperature of each reference temperature measurement point is determined, and each temperature deviation is determined according to each current temperature and the warning temperature of each reference temperature measurement point.

3. The method for adjusting the ambient temperature according to claim 1, characterized in that: Also includes: When it is determined that the target temperature deviation is greater than or equal to the set threshold, a reference temperature measurement point corresponding to the target temperature deviation is determined as a second closest reference temperature measurement point to the target temperature measurement point.

4. The method for adjusting the ambient temperature according to claim 1, characterized in that: The adjustment includes: increasing or decreasing wind speed, increasing or decreasing temperature.

5. The method for adjusting the ambient temperature according to claim 1, characterized in that: The adjusting the temperature and / or wind speed of each reference air outlet according to each target distance, each temperature deviation and the installation direction of the target test device includes: In the case of determining that each of the reference temperature measurement points includes at least one target close reference temperature measurement point of the target temperature measurement point, determining a fourth air outlet associated with the target close reference temperature measurement point; If the current temperature of the target close reference temperature measurement point is close to the maximum temperature threshold, and the temperature abnormality instruction of the target temperature measurement point is a temperature increase instruction, the wind speed and / or temperature of other reference air outlets except the fourth air outlet are adjusted simultaneously.

6. The method for adjusting the ambient temperature according to claim 1, characterized in that: The adjusting the temperature and / or wind speed of each reference air outlet according to each target distance, each temperature deviation and the installation direction of the target test device includes: Input each of the target distances, each of the temperature deviations, and the installation direction of the target test device into a pre-trained ambient temperature adjustment model for prediction, to obtain a temperature adjustment value and / or wind speed adjustment value for each of the reference air outlets; The adjustment model of the ambient temperature is determined by the following steps: Acquire a training data set; the training data set includes: current temperature and position information of a first temperature measurement point, temperature information of a reference temperature point related to the first temperature measurement point, position information of each reference air outlet related to the first temperature measurement zone, and temperature adjustment values ​​and / or wind speed adjustment values ​​of each reference air outlet corresponding to the first temperature measurement point; Each of the training data sets is input into the target machine learning model for iterative training to obtain the ambient temperature adjustment model.

7. A device for adjusting ambient temperature, characterized in that: The ambient temperature regulating device is deployed in a temperature regulating system, and the temperature regulating system includes: a plurality of test devices, the test devices are used to test each integrated circuit chip, each test device includes at least one temperature measurement point, and each temperature measurement point determines at least one temperature result through the test result of each integrated circuit chip; each of the test devices is deployed in the same factory building and each of the test devices is installed in a different direction, and the factory building includes a plurality of air outlets: the ambient temperature regulating device includes: A first determination module is used to respond to a temperature anomaly instruction of a target temperature measurement point and respectively determine each reference air outlet and each reference temperature measurement point associated with the target temperature measurement point; the target temperature measurement point matches a target test device; A second determination module is used to respectively determine the target distance between each reference air outlet and the target temperature measurement point, and the temperature deviation between the current temperature of each reference temperature measurement point and the warning temperature; An adjustment module, used for adjusting the temperature and / or wind speed of each reference air outlet according to each target distance, each temperature deviation and the installation direction of the target test device; The first determination module is specifically used to determine the location information of the target test device and determine the location area associated with the location information; obtain each air outlet located in the location area and determine each air outlet as a reference air outlet; obtain each reference test device located in the location area and determine the temperature measurement point of each reference test device as a reference temperature measurement point; The device for adjusting the ambient temperature further includes: a third determination module, configured to determine whether each of the temperature deviations is less than a set threshold; if it is determined that the target temperature deviation is less than the set threshold, determining a reference temperature measurement point corresponding to the target temperature deviation as a close reference temperature measurement point of the target temperature measurement point; The adjustment module is specifically used to determine the first air outlet, the second air outlet and the third air outlet from each of the reference air outlets when it is determined that a close reference temperature measurement point of the target temperature measurement point is not included in each of the reference temperature measurement points; the first air outlet is the air outlet farthest from the shielding area of ​​the target test device corresponding to the target temperature measurement point among the reference air outlets; the third air outlet is the air outlet closest to the shielding area of ​​the target test device among the reference air outlets; the second air outlet is the air outlet between the first air outlet and the third air outlet at a distance from the shielding area of ​​the target test device among the reference air outlets; the shielding area of ​​the target test device is determined by the installation direction of the target test device; the wind speed and / or temperature of the first air outlet and the second air outlet are adjusted simultaneously to quickly heat up or cool down the target temperature measurement point.

8. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can perform the method for adjusting the ambient temperature according to any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the method for adjusting the ambient temperature according to any one of claims 1 to 6 when executed.

Images