Optical module

Abstract

The invention provides an optical module which comprises a circuit board and a light emitting component electrically connected with the circuit board, the light emitting component comprises a transmitting tube shell, a pin, a grounding piece and a light emitting assembly, the grounding piece and the light emitting assembly are located in the transmitting tube shell, a jack is formed in one side of the transmitting tube shell, one end of the pin is electrically connected with the circuit board, and the other end of the pin is inserted into the jack. The pins are hermetically connected with the jacks through insulating parts, and the pins comprise a grounding pin connected with the transmitting tube shell and a high-speed signal pin inserted into the transmitting tube shell; the grounding piece is attached to the inner wall of the transmitting tube shell, the grounding piece surrounds the high-speed signal pin, and the projection area of the grounding piece on the transmitting tube shell covers part of the insulating piece; a laser set of the light emitting assembly is connected with the high-speed signal pin and the grounding piece through routing so as to generate signal light. The grounding piece is additionally arranged on the periphery of the high-speed signal pin, the distance between the high-speed signal pin and the GND is reduced through the grounding piece, and impedance matching between the high-speed signal pin and the laser set is achieved.

Description

Technical Field

[0001] The present disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0002] With the development of new services and application modes such as cloud computing, mobile Internet, and video, the development and progress of optical communication technology has become increasingly important. In optical communication technology, optical modules are devices that realize the conversion of photoelectric signals and are one of the key components in optical communication equipment. With the development of optical communication technology, the transmission rate of optical modules is constantly increasing, and the requirements for the packaging structure of optical devices in optical modules are also getting higher and higher. Summary of the invention

[0003] The embodiments of the present disclosure provide an optical module to achieve high-speed and low-cost packaging of the optical module.

[0004] The present disclosure provides an optical module, comprising:

[0005] Circuit boards;

[0006] A light emitting component, electrically connected to the circuit board, for generating a light signal;

[0007] Wherein, the light emitting component comprises:

[0008] The transmitting tube shell has a plug hole formed on one side plate and a light window arranged on the other side plate opposite thereto;

[0009] A pin, one end of which is electrically connected to the circuit board and the other end is inserted into the jack, wherein the pin is sealed and connected to the jack through an insulating member; the pin comprises a high-speed signal pin, a ground pin and a power supply pin, wherein the ground pin is connected to the transmitting tube shell, and the high-speed signal pin and the power supply pin are inserted into the transmitting tube shell through the jack;

[0010] A grounding member is mounted on the inner wall of the transmitting tube shell, the grounding member surrounds the high-speed signal pin, air is filled between the grounding member and the high-speed signal pin, and the projection area of ​​the grounding member on the inner wall of the transmitting tube shell covers a part of the insulating member;

[0011] The optical emission component is located in the emission tube shell, and the optical emission component includes a laser group. The laser group is connected to the high-speed signal pin, the power supply pin and the grounding member through bonding to generate signal light, and the signal light is emitted through the light window.

[0012] It can be seen from the above embodiments that the optical module provided by the embodiments of the present disclosure includes a circuit board and an optical emitting component, the optical emitting component is electrically connected to the circuit board, the optical emitting component includes a transmitting tube shell, a pin, a grounding piece and an optical emitting assembly, a socket is formed on one side plate of the transmitting tube shell, a light window is arranged on the other side plate of the transmitting tube shell, and the light window and the socket are arranged opposite to each other; one end of the pin is electrically connected to the circuit board, and the signal on the circuit board is transmitted to the optical emitting component through the pin; the other end of the pin is inserted into the socket, and the pin and the socket are sealed and connected by an insulating piece to realize the airtight packaging of the transmitting tube shell; the pin includes a high-speed signal pin, a grounding pin and a power supply pin, the high-speed signal pin and the power supply pin are respectively inserted into the transmitting tube shell through the socket, and the grounding pin is connected to the transmitting tube shell so that the transmitting tube shell is grounded as a whole; the grounding piece is mounted on the inner wall of the transmitting tube shell so that the grounding piece is grounded as a whole, and the grounding piece is connected to the grounding piece. The grounding piece surrounds the high-speed signal pin, and air is filled between the grounding piece and the high-speed signal pin, so that the high-speed signal pin and GND are transitioned from dielectric coaxiality to air coaxiality through the grounding piece, which is conducive to achieving impedance matching of the high-speed signal pin; the projection area of ​​the grounding piece on the inner wall of the transmitting tube shell covers part of the insulating piece, so that the distance between the high-speed signal pin and GND inside the transmitting tube shell is smaller than the distance between the high-speed signal pin and the grounding pin outside the transmitting tube shell, which can reduce the characteristic impedance of the high-speed signal pin relative to GND, thereby achieving impedance matching between the high-speed signal pin and the laser group in the optical transmitting component; the optical transmitting component is located in the transmitting tube shell, and the optical transmitting component includes a laser group, which is respectively connected to the high-speed signal pin, the power supply pin and the grounding piece by wire bonding, so that the laser group generates signal light, and the signal light is emitted through the light window. The optical module provided by the present invention adds a grounding piece on the periphery of the high-speed signal pin in the transmitting tube shell. The projection area of ​​the grounding piece on the inner wall of the transmitting tube shell covers part of the insulating piece, which can reduce the distance between the high-speed signal pin and the GND in the transmitting tube shell, which is beneficial to achieve impedance matching between the high-speed signal pin and the laser group, so that the transmitting tube shell has a high-speed transmission capability. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not intended to limit the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0014] Figure 1 A partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0015] Figure 2A partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0016] Figure 3 A structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0017] Figure 4 An exploded view of an optical module provided according to some embodiments of the present disclosure;

[0018] Figure 5 An internal structure diagram of an optical module provided according to some embodiments of the present disclosure;

[0019] Figure 6 A structural diagram of a light emitting component in an optical module provided according to some embodiments of the present disclosure;

[0020] Figure 7 An exploded view of a light emitting component in an optical module provided according to some embodiments of the present disclosure;

[0021] Figure 8 An assembly diagram of a transmitting housing and pins in an optical module provided according to some embodiments of the present disclosure;

[0022] Fig. 9 A structure of a transmitting housing in an optical module provided according to some embodiments of the present disclosure Figure 1 ;

[0023] Fig.10 A structure of a transmitting housing in an optical module provided according to some embodiments of the present disclosure Figure 2 ;

[0024] Fig.11 An assembly cross-sectional view of a transmitting housing and pins in an optical module provided according to some embodiments of the present disclosure;

[0025] Fig.12 A structure of a transmitting housing in an optical module provided according to some embodiments of the present disclosure Figure 3 ;

[0026] Fig.13 An assembly diagram of a transmitting housing and pins in an optical module provided according to some embodiments of the present disclosure at another angle;

[0027] Fig.14 A local structure of a light emitting component in an optical module according to some embodiments of the present disclosure Figure 1 ;

[0028] Fig.15 A partial cross-sectional view of a light emitting component in an optical module provided according to some embodiments of the present disclosure;

[0029] Fig.16 A local structure of a light emitting component in an optical module according to some embodiments of the present disclosure Figure 2 ;

[0030] Fig.17 A structural diagram of a first laser chip in an optical module provided according to some embodiments of the present disclosure;

[0031] Fig.18 A structural diagram of a first laser group in an optical module provided according to some embodiments of the present disclosure;

[0032] Fig.19 A structural diagram of a second substrate in an optical module provided according to some embodiments of the present disclosure;

[0033] Fig. 20 A structural diagram of a second laser chip in an optical module provided according to some embodiments of the present disclosure;

[0034] Fig.21 A partial structural diagram of a second laser group in an optical module provided according to some embodiments of the present disclosure;

[0035] Fig. 22 A structural diagram of a second matching resistor in an optical module provided according to some embodiments of the present disclosure;

[0036] Fig.23 An assembly diagram of a second laser group and a second matching resistor in an optical module provided according to some embodiments of the present disclosure;

[0037] Fig.24 A line connection between a second laser group and a second matching resistor at another angle in an optical module provided according to some embodiments of the present disclosure Figure 1 ;

[0038] Fig.25 A circuit connection between a second laser group and a second matching resistor in an optical module provided according to some embodiments of the present disclosure Figure 2 ;

[0039] Fig.26 A structural diagram of a support column in an optical module provided according to some embodiments of the present disclosure;

[0040] Fig. 27 A structural diagram of a second laser group in an optical module provided according to some embodiments of the present disclosure;

[0041] Fig.28 A schematic diagram of electrical connections of a light emitting component in an optical module according to some embodiments of the present disclosure;

[0042] Fig.29A light path diagram of a light emitting component in an optical module provided according to some embodiments of the present disclosure;

[0043] Fig.30 A structural diagram of a light window in an optical module provided according to some embodiments of the present disclosure;

[0044] Fig.31 An assembly cross-sectional view of an emission housing and a light window in an optical module provided according to some embodiments of the present disclosure;

[0045] Fig.32 It is a cross-sectional view of a light emitting component in an optical module provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0046] The following will be combined with the accompanying drawings to clearly and in detail describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0047] In optical communication technology, in order to establish information transmission between information processing devices, it is necessary to load information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When optical signals are transmitted in information transmission equipment, the loss of optical power can be reduced, so high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment usually includes optical network terminals (Optical Network Unit, ONU), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment usually includes optical fibers and optical waveguides.

[0048] The optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the upper computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0049] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an external optical fiber 101 and a network cable 103 .

[0050] One end of the external optical fiber 101 extends toward the remote information processing device 1000, and the other end of the external optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the external optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the external optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0051] The optical communication system may include one or more external optical fibers 101, and the external optical fibers 101 are detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the working state of the optical module 200.

[0052] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0053] The host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the external optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the external optical fiber 101. For example, the first optical signal from the remote information processing device 1000 is transmitted through the external optical fiber 101, and the first optical signal from the external optical fiber 101 is transmitted to the optical module 200, and the optical module 200 converts the first optical signal into a first electrical signal, and the optical module 200 transmits the first electrical signal to the host computer 100, and the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between the optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0054] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0055] Figure 2 1 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2As shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0056] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the host computer 100. In addition, the optical port of the optical module 200 is connected to the external optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the external optical fiber 101.

[0057] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, Figure 4 FIG. 1 is an exploded view of an optical module provided according to some embodiments of the present disclosure. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400 and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0058] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0059] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with respect to the bottom plate 2021; the upper shell 201 includes an upper cover plate 2011, and the upper cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0060] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes an upper cover plate 2011 and two upper side plates located on both sides of the upper cover plate 2011 and vertically arranged with the upper cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0061] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold finger 301 of the circuit board 300 extends from the electrical port and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port, which is configured to access the external optical fiber 101, so that the external optical fiber 101 is connected to the optical components in the optical module 200.

[0062] The upper shell 201 and the lower shell 202 are combined to facilitate the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the above-mentioned shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the above-mentioned components. In addition, when assembling the circuit board 300, the light emitting component 400, the light receiving component 500, etc., the above-mentioned upper shell 201 and the lower shell 202 are combined to facilitate the deployment of the positioning components, heat dissipation components and electromagnetic shielding components of these components, which is conducive to the automated production.

[0063] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0064] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer 100, or to release the fixed connection between the optical module 200 and the host computer 100.

[0065] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0066] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, transistors, metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET). The chip may include a microcontroller unit (Microcontroller Unit, MCU), a laser driver chip, a transimpedance amplifier (Transimpedance Amplifier, TIA), a limiting amplifier (Limiting Amplifier, LA), a clock and data recovery chip (Clock and Data Recovery, CDR), a power management chip, and a digital signal processing (Digital Signal Processing, DSP) chip.

[0067] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0068] The circuit board 300 also includes a gold finger 301 formed on the end surface thereof. The gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be provided on only one side of the circuit board 300 (e.g. Figure 4 The upper surface shown in the figure) can also be set on the upper and lower surfaces of the circuit board 300 to provide more pins, so as to adapt to occasions where the number of pins is large. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0069] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger 301 .

[0070] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0071] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 may be directly disposed on the circuit board 300. For example, at least one of the light emitting component 400 or the light receiving component 500 may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0072] Figure 5 FIG. 1 is an internal structure diagram of an optical module provided according to some embodiments of the present disclosure. Figure 5 As shown, the optical module provided by the embodiment of the present disclosure also includes a first optical fiber adapter 700 and a second optical fiber adapter 800. One end of the light emitting component 400 is electrically connected to the circuit board 300 through a flexible circuit board. The circuit board 300 transmits an electrical signal to the laser chip of the light emitting component 400 through the flexible circuit board to drive the laser chip to generate an optical signal. The other end of the light emitting component 400 is optically connected to the first optical fiber adapter 700. The optical signal generated by the light emitting component 400 is emitted via the first optical fiber adapter 700 to realize light emission.

[0073] One end of the optical receiving component 500 is optically connected to the second optical fiber adapter 800, and the external optical signal is transmitted to the optical receiving component 500 via the second optical fiber adapter 800, and the optical receiving component 500 converts the optical signal into an electrical signal; the other end of the optical receiving component 500 is electrically connected to the circuit board 300 through a flexible circuit board to transmit the electrical signal output by the optical receiving component 500 to the circuit board 300, and the electrical signal is transmitted to the host computer 100 via the gold finger 301 to realize light reception.

[0074] Figure 6 is a structural diagram of a light emitting component in an optical module provided according to some embodiments of the present disclosure, Figure 7 FIG. 1 is an exploded view of a light emitting component in an optical module according to some embodiments of the present disclosure. Figure 6 and Figure 7 As shown, the light emitting component 400 includes a emitting tube shell and a pin 403 . The pin 403 is inserted into the emitting tube shell, and the pin 403 is sealed and connected to the emitting tube shell to achieve airtight packaging of the light emitting component 400 .

[0075] The launch tube shell includes a launch shell 401 and a cover plate 402. The launch shell 401 is designed as a cavity structure with an opening at the top, and the cover plate 402 covers the launch shell 401. A light launch component is arranged in the launch shell 401, and a pin 403 is inserted into the launch shell 401. The light launch component is connected to the pin 403 by bonding, so that the light launch component is electrically connected to the flexible circuit board or the circuit board 300 through the pin 403. In some embodiments, in order to achieve electromagnetic shielding and device heat dissipation, the launch shell 401 and the cover plate 402 are generally made of metal materials.

[0076] In order to protect the optical emission component in the emission shell 401 during the use of the optical module, the emission shell 401, the cover 402 and the pin 403 are airtightly packaged, and the optical emission component in the emission shell 401 is connected to the external circuit board through the pin 403 to achieve airtight packaging of the optical emission component 400.

[0077] Figure 8 This is an assembly diagram of a transmitting housing and pins in an optical module provided according to some embodiments of the present disclosure. Fig. 9 A structure of a transmitting housing in an optical module provided according to some embodiments of the present disclosure Figure 1 .like Figure 8 and Fig. 9 As shown, the launch shell 401 includes a bottom plate 4010, a first side plate 4011, a second side plate 4012, a third side plate 4013 and a fourth side plate 4014, the first side plate 4011, the second side plate 4012, the third side plate 4013 and the fourth side plate 4014 are all vertically connected to the bottom plate 4010, the first side plate 4011 and the third side plate 4013 are arranged opposite to each other, and the second side plate 4012 and the fourth side plate 4014 are arranged opposite to each other, so that the bottom plate 4010, the first side plate 4011, the second side plate 4012, the third side plate 4013 and the fourth side plate 4014 form a shell with a top opening.

[0078] A plurality of insertion holes 4016 are formed on the third side plate 4013 , and the pins 403 are inserted into the launch shell 401 through the insertion holes 4016 , and the pins 403 and the insertion holes 4016 are sealed and connected via an insulating member 4017 to achieve a sealed connection between the pins 403 and the launch shell 401 .

[0079] In some embodiments, since glass PIN packaging is the lowest-cost packaging form in optical devices, the insulating member 4017 is a glass member, and the pin 403 is connected to the transmitting housing 401 through a glass seal.

[0080] In some embodiments, in order to avoid signal crosstalk, the spacing between adjacent sockets 4016 needs to be greater than 0.2 mm. When the optical emission component includes multiple laser groups, multiple laser chips need to be connected to more pins 403. There are a large number of sockets 4016 on the third side panel 4013 of the emission shell 401. In order to ensure the spacing between adjacent sockets 4016, the inner side surface of the third side panel 4013 is arranged in a stepped shape, that is, the inner side surface of the third side panel 4013 includes a first surface and a second surface, and the second surface can protrude from the first surface, so that the distance between the second surface and the first side panel 4011 is smaller than the distance between the first surface and the first side panel 4011, and sockets 4016 are respectively formed on the first surface and the second surface, thereby increasing the spacing between adjacent sockets 4016, so that more sockets 4016 can be arranged on the third side panel 4013.

[0081] After the pin 403 is inserted into the transmitting housing 401 through the jack 4016, the pin 403 is connected to the laser group in the transmitting housing 401 by bonding, and the signal transmitted by the pin 403 drives the laser group to generate signal light.

[0082] In some embodiments, a light hole 4015 is formed on the first side plate 4011 , and the light hole 4015 passes through the first side plate 4011 so that the light hole 4015 is connected to the inner cavity of the emitting shell 401 , and the signal light generated by the laser group is emitted from the emitting shell 401 through the light hole 4015 .

[0083] In some embodiments, the light emitting component 400 further includes a light window 404, which is used to transmit the transmitted light signal and seal the light hole on the transmitting housing 401. Exemplarily, the light window 404 is embedded in the light hole 4015, and the light window 404 is used to relatively seal the light hole 4015, so as to allow the transmitted light signal to pass through and seal the light hole 4015 to ensure the sealing performance of the transmitting housing 401. In some embodiments, the light window 404 is transparent glass.

[0084] In some embodiments, the light window 404 can be tilted in the light hole 4015. By arranging the light window 404 and the light hole 4015 on different axes, the emission light signal reflected by the light window 404 can be reduced from returning to the transmission light path of the emission light signal, thereby avoiding the reflected light affecting the luminescence performance of the laser group.

[0085] In some embodiments, the optical emission component includes at least one laser group, and the laser groups are respectively connected to corresponding pins 403 through wire bonding. The pins 403 transmit electrical signals and data signals to the laser chip to drive the laser chip to generate signal light.

[0086] Reference Figure 8 Pin 403 includes a high-speed signal pin 4030, a ground pin 4031 and a power supply pin 4032. When the laser group in the transmitting shell 401 is connected to the pin 403 inserted into the jack 4016 by bonding, the laser chip is connected to the high-speed signal pin 4030, the power supply pin 4032 and the ground pin 4031 by bonding, and the laser chip is powered by the power supply pin 4032 to enable the laser chip to generate light; the light generated by the laser chip is modulated by the data signal transmitted by the high-speed signal pin 4030, so that the laser chip generates a modulated light signal under the action of the electrical signal and the data signal.

[0087] In some embodiments, when the laser chip in the laser group is wired to the pin 403 , the laser chip has different transmission rates according to the signal transmitted by the pin 403 , such as 1.25G, 10G, 50G, etc. transmission rates.

[0088] When the signal transmitted by pin 403 is a low-speed signal, since the wavelength of the low-frequency signal is very long relative to the transmission line, the transmission line can be regarded as a "short line" and the reflection of the low-speed signal in the transmission line can be ignored. Therefore, when pin 403 transmits a low-speed signal, the impedance matching problem of the transmission line is generally not considered.

[0089] When the signal transmitted by pin 403 is a high-speed signal, the reflection problem of the signal in the transmission line needs to be considered. The reflected signal is easy to overlap with the original signal, affecting the signal quality. In order to ensure the integrity of the high-speed signal transmitted by pin 403, the impedance matching between pin 403 and the laser chip needs to be ensured.

[0090] In some embodiments, ground pins 4031 are respectively provided on both sides of the high-speed signal pin 4030, and the high-speed signal pin 4030 and the two ground pins 4031 form a ground-signal-ground (GSG) structure. The characteristic impedance of the high-speed signal pin 4030 is calculated based on the relevant parameters of the high-speed signal pin 4030 and the ground pin 4031.

[0091] The characteristic impedance of the high-speed signal pin 4030 is determined by parameters such as the outer diameter of the inner conductor, the inner diameter of the outer conductor and the dielectric constant of the insulating material. The impedance of the high-speed signal pin 4030 can be calculated according to formula (1):

[0092]

[0093] Where, Zo-characteristic impedance;

[0094] ε r -Relative dielectric constant of insulator, ε of air r ≈1, ε of glass insulator r =4~7;

[0095] D—inner diameter of the outer conductor. In the optical module provided in the embodiment of the present disclosure, D is the inner diameter between the two ground pins 4031;

[0096] d: outer diameter of the inner conductor. In the optical module provided in the embodiment of the present disclosure, d is the outer diameter of the high-speed signal pin 4030.

[0097] When the pin 403 is sealed with glass and connected to the transmitting shell 401 in an airtight manner, the high-speed signal pin 4030 and the ground pin 4031 are approximately coaxial with air on the outside of the transmitting shell 401; the high-speed signal pin 4030 and the ground pin 4031 are coaxial with glass on the third side plate 4013 of the transmitting shell 401; and the high-speed signal pin 403 and the ground pin 4031 are coaxial with air on the inside of the transmitting shell 401. Referring to formula (1), since the dielectric constant of air is smaller than the dielectric constant of glass, the impedance of the high-speed signal pin 4030 relative to the ground pin 4031 changes from the outside of the transmitting shell 401 to the inside of the transmitting shell 401 as small-large-small.

[0098] In some embodiments, when the pin 403 and the transmitting shell 401 are hermetically sealed with glass, due to the size limitation of the glass to ensure airtightness, the distance between the high-speed signal pin 4030 and the ground pin 4031 is large, that is, D in formula (1) is large, resulting in a large characteristic impedance of the high-speed signal pin 4030, which makes the impedance between the high-speed signal pin 4030 and the laser chip mismatch, affecting the integrity of the high-speed signal, and making it difficult to achieve a high transmission rate (such as 50G) of the laser chip.

[0099] In order to achieve high-speed transmission of the optical module, the optical module provided by the embodiment of the present disclosure is provided with a grounding piece on the inner side of the third side plate 4013. The grounding piece is located on one side of the high-speed signal pin 4030, and the grounding piece is connected to the grounding pin 4031. The distance between the grounding piece and the high-speed signal pin 4030 is smaller than the distance between the grounding pin 4031 and the high-speed signal pin 4030. According to formula (1), the distance between the high-speed signal pin 4030 and GND is reduced by the grounding piece, and the impedance of the high-speed signal pin 4030 inserted into the transmitting shell 401 is reduced, which is conducive to achieving impedance matching between the high-speed signal pin 4030 and the laser chip, so as to achieve complete transmission of high-speed signals.

[0100] Fig.10 A structure of a transmitting housing in an optical module provided according to some embodiments of the present disclosure Figure 2 , Fig.11 FIG. 1 is a cross-sectional view of an assembly of a transmitting housing and pins in an optical module according to some embodiments of the present disclosure. Fig.10 and Fig.11 As shown, the grounding piece on the inner side of the third side plate 4013 may be a grounding column, which includes a first grounding column 4180 and a second grounding column 4181. The first grounding column 4180 and the second grounding column 4181 are respectively fixedly connected to the third side plate 4013 to achieve grounding of the first grounding column 4180 and the second grounding column 4181.

[0101] The first grounding column 4180 and the second grounding column 4181 are respectively located on both sides of the socket 4016. After the high-speed signal pin 4030 is inserted into the launch shell 401 through the socket 4016, the first grounding column 4180 and the second grounding column 4181 are located on both sides of the high-speed signal pin 4030, and the distance between the first grounding column 4180 and the high-speed signal pin 4030 is smaller than the radius size of the insulating member 4017 in the socket 4016, and the distance between the second grounding column 4181 and the high-speed signal pin 4030 is smaller than the radius size of the insulating member 4017 in the socket 4016, so that the projection area of ​​the first grounding column 4180 and the second grounding column 4181 on the third side plate 4013 covers part of the insulating member 4017, so as to reduce the distance between the high-speed signal pin 4030 and GND in the launch shell 401, thereby reducing the impedance of the high-speed signal pin 4030 and the connection end of the laser chip.

[0102] In some embodiments, the first grounding column 4180 and the second grounding column 4181 may be cylinders with consistent diameters, which extend from the inner side of the third side plate 4013 toward the first side plate 4011, and the projection area of ​​the cylinder in the third side plate 4013 covers a portion of the insulating member 4017 and a portion of the third side plate 4013, so that the distance between the first grounding column 4180 and the high-speed signal pin 4030 is smaller than the distance between the grounding pin 4031 and the high-speed signal pin 4030.

[0103] The first grounding column 4180 and the second grounding column 4181 may also be frustums with inconsistent diameter sizes. For example, the diameter size on the right side of the first grounding column 4180 is larger than the diameter size on the left side of the first grounding column 4180, and the left side of the frustum covers part of the insulating member 4017 and part of the third side plate 4013 in the projection area of ​​the third side plate 4013, so that the distance between the wiring area (left side) of the first grounding column 4180 and the high-speed signal pin 4030 is smaller than the distance between the grounding pin 4031 and the high-speed signal pin 4030, and the distance between the wiring area of ​​the second grounding column 4181 and the high-speed signal pin 4030 is smaller than the distance between the grounding pin 4031 and the high-speed signal pin 4030.

[0104] In some embodiments, the first grounding column 4180 and the second grounding column 4181 may also be square columns of the same size, and the square columns cover a portion of the insulating member 4017 and a portion of the third side plate 4013 in the projection area of ​​the third side plate 4013 .

[0105] In some embodiments, the left side surfaces of the first grounding column 4180 and the second grounding column 4181 are flush with the left side surface of the high-speed signal pin 4030, and the laser chip is respectively connected to the high-speed signal pin 4030, the first grounding column 4180 and the second grounding column 4181 by bonding to achieve impedance matching between the high-speed signal pin 4030 and the laser chip.

[0106] Fig.12 A structure of a transmitting housing in an optical module provided according to some embodiments of the present disclosure Figure 3 .like Fig.12 As shown, the grounding piece on the inner side of the third side plate 4013 may also include a plurality of grounding posts, which surround the outer periphery of the insertion hole 4016. After the high-speed signal pin 4030 is inserted into the launch shell 401 through the insertion hole 4016, the plurality of grounding posts surround the outer periphery of the high-speed signal pin 4030.

[0107] In some embodiments, multiple grounding posts cover part of the insulating member 4017 and part of the third side plate 4013 in the projection area of ​​the third side plate 4013, so that the distance between the multiple grounding posts and the high-speed signal pin 4030 is smaller than the distance between the grounding pin 4031 and the high-speed signal pin 4030, thereby reducing the distance between the high-speed signal pin 4030 and GND in the transmitting shell 401, thereby reducing the impedance of the high-speed signal pin 4030 and the connection end of the laser chip.

[0108] Fig.13 FIG. 1 is an assembly diagram of a transmitting housing and pins in an optical module provided according to some embodiments of the present disclosure at another angle. Fig.13 As shown, the grounding member on the inner side of the third side plate 4013 may be a grounding ring 413, one end surface of the grounding ring 413 is fixedly connected to the inner side surface of the third side plate 4013, and the outer side surface of the third side plate 4013 is connected to the grounding pin 4031, so that the transmitting shell 401 and the grounding ring 413 are grounded as a whole. A through hole is formed at the center of the grounding ring 413, and the through hole is arranged opposite to the plug hole 4016. The high-speed signal pin 4030 is inserted into the through hole, and the high-speed signal pin 4030 does not contact the through hole, so that the grounding ring 413 surrounds the high-speed signal pin 4030.

[0109] In some embodiments, the grounding ring 413 may be a circular ring with a uniform diameter, which extends from the inner side of the third side plate 4013 toward the first side plate 4011, and the projection area of ​​the circular ring covers a portion of the insulating member 4017 and a portion of the third side plate 4013 in the third side plate 4013, so that the distance between the high-speed signal pin 4030 and the grounding ring 413 is smaller than the distance between the high-speed signal pin 4030 and the grounding pin 4031, thereby reducing the impedance of the high-speed signal pin 4030 and the connection end of the laser chip.

[0110] Fig.14 A local structure of a light emitting component in an optical module according to some embodiments of the present disclosure Figure 1 , Fig.15 FIG. 1 is a partial cross-sectional view of a light emitting component in an optical module according to some embodiments of the present disclosure. Fig.14 and Fig.15 As shown, in order to facilitate bonding on the grounding ring 413, the left side of the high-speed signal pin 4030 protrudes from the left side of the grounding ring 413, and a first bonding platform 4130 and a second bonding platform 4131 are provided on the left end surface of the grounding ring 413. The first bonding platform 4130 and the second bonding platform 4131 are located on both sides of the high-speed signal pin 4030. The left side of the first bonding platform 4130 and the left side of the second bonding platform 4131 are flush with the left side of the high-speed signal pin 4030. Air is sandwiched between the first bonding platform 4130 and the high-speed signal pin 4030, and between the second bonding platform 4131 and the high-speed signal pin 4030, so that the first bonding platform 4130, the second bonding platform 4131 and the high-speed signal pin 4030 are arranged coaxially with air.

[0111] The upper side surface of the first bonding platform 4130 can be flush with the upper side surface of the second bonding platform 4131, and the upper and lower distances between the upper side surface of the first bonding platform 4130 and the base plate 4010 are smaller than the upper and lower distances between the upper side of the grounding ring 413 and the base plate 4010, so as to reduce the bonding distances between the laser chip and the first bonding platform 4130 and the second bonding platform 4131.

[0112] In some embodiments, the distance between the first bonding platform 4130 and the high-speed signal pin 4030 is smaller than the distance between a ground pin 4031 and the high-speed signal pin 4030, and the distance between the second bonding platform 4131 and the high-speed signal pin 4030 is smaller than the distance between another ground pin 4031 and the high-speed signal pin 4030, thereby reducing the distance between the high-speed signal pin 4030 and GND in the launch shell 401.

[0113] Reference Fig.15 , at the third side plate 4013, the high-speed signal pin 4030 and the ground pin 4031 are glass coaxial; in the launch shell 401, the first wire bonding platform 4130, the second wire bonding platform 4131 and the high-speed signal pin 4030 are air coaxial, and the distance between the first wire bonding platform 4130 and the high-speed signal pin 4030 and the distance between the second wire bonding platform 4131 and the high-speed signal pin 4030 are smaller. Since the dielectric constant of air is smaller than the dielectric constant of the glass insulator, according to formula (1), a grounding ring 413 is added to the periphery of the high-speed signal pin 4030, and the high-speed signal pin 4030 and the ground pin 4031 in the launch shell 401 are transitioned from glass coaxial to air coaxial, which reduces the characteristic impedance of the high-speed signal pin 4030 relative to GND, so that the high-speed signal pin 4030 and the laser chip impedance are matched, which is conducive to ensuring that the impedance is closer to 50Ω.

[0114] When the impedance between the laser group and the high-speed signal pin 4030 is matched, the reflection of the signal in the high-speed signal pin 4030 is small, and the high-speed signal transmitted by the high-speed signal pin 4030 can be transmitted to the laser group, ensuring the integrity of the high-speed signal, so that the high-speed signal pin 4030 has the ability to increase bandwidth and reduce signal reflection, so as to transmit high-speed signals to the laser group through the high-speed signal pin 4030, such as 50G NRZ signals and 100G PAM4 signals, so that the low-cost and low-speed glass PIN packaged transmitting shell 401 has high-speed transmission capability, thereby realizing the high transmission rate of the laser group.

[0115] In some embodiments, since the launch shell 401 is a metal shell, the grounding ring 413 is also a metal block in order to connect and ground the grounding ring 413 to the launch shell 401. The launch shell 401 and the grounding ring 413 are made of the same metal, which avoids pulling the connection between the launch shell 401 and the grounding ring 413 when the launch shell 401 or the grounding ring 413 is deformed, thereby ensuring the sealing effect between the launch shell 401 and the insulating member 4017.

[0116] In some embodiments, the optical transmission component in the transmitting shell 401 includes a gasket and a laser group. The gasket is located on the bottom plate 4010 of the transmitting shell 401, and the laser group is located on the gasket, so that the laser group is supported and fixed by the gasket; the laser group includes a substrate and a laser chip, the substrate is located on the gasket, and the substrate is coated with a conductive metal layer, a signal transmission area is formed on the conductive metal layer, the conductive metal layer is wire-bonded to the bonding platform on the grounding ring 413, and the signal transmission area is wire-bonded to the high-speed signal pin 4030.

[0117] The laser chip is located on the conductive metal layer of the substrate. In order to make the laser chip generate signal light, the laser chip needs to be modulated. For the modulation method of the laser chip, direct modulation can be used, that is, the high-frequency data electrical signal is directly loaded on the laser chip. However, this method has a low dispersion tolerance value and a short transmission distance, generally below 80 kilometers. Therefore, the embodiment of the present disclosure adopts an external modulation method to obtain a larger dispersion tolerance value, and the laser chip is set as an integrated device composed of an electroabsorption modulator (EAM) and a distributed feedback (DFB) laser chip, also known as an electroabsorption modulated laser chip (EML).

[0118] The EML laser chip is a monolithic integrated device, which is composed of a laser chip and a modulator with the same material system integrated on the same substrate. This reduces the manufacturing cost of the device, reduces the size of the device, improves the stability of the light source, and also improves the coupling efficiency between the laser chip and the modulator. In addition, since the continuous light output and signal modulation of the EML are independently generated by the DFB and EAM respectively, the modulation rate and output power of the EML can be adjusted more flexibly and simply.

[0119] In some embodiments, the EML laser chip includes a light emitting region (DFB) and an electro-absorption modulation region (EAM), the light emitting region is wired to a power supply pin 4032, and the electrical signal transmitted by the power supply pin 4032 powers the DFB region, so as to utilize the DFB region to output light that does not carry a signal.

[0120] The electro-absorption modulation area EA is connected to the signal transmission area by wire bonding, so that the electro-absorption modulation area EA is connected to the high-speed signal pin 4030. The high-frequency data signal transmitted by the high-speed signal pin 4030 is transmitted to the EA area, and the continuous output light of the DFB area is amplitude modulated by the EA area to generate a data optical signal.

[0121] When the EML laser chip is connected to the high-speed signal pin 4030, the bonding platform on the grounding ring 413 and the power supply pin 4032 through bonding, the high-speed signal pin 4030 and the grounding pin 4031 are transitioned from glass coaxial to air coaxial through the grounding ring 413, thereby reducing the characteristic impedance of the high-speed signal pin 4030 and achieving impedance matching between the high-speed signal pin 403 and the EML laser chip. High-speed signals can be transmitted to the EML laser chip through the high-speed signal pin 403, thereby improving the transmission rate of the signal light emitted by the EML laser chip and thus improving the transmission rate of the optical module.

[0122] Fig.16 A local structure of a light emitting component in an optical module according to some embodiments of the present disclosure Figure 2 .like Fig.16 As shown, the optical emission component includes a gasket 405, a first laser group and a second laser group. The gasket 405 is located on the bottom plate 4010 of the emission shell 401, and the first laser group and the second laser group are located on the gasket 405. The first laser group and the second laser group are supported and fixed by the gasket 405, so that the first laser group and the second laser group are close to the pin 403, thereby shortening the wire bonding length between the first laser group, the second laser group and the pin 403.

[0123] In some embodiments, when the optical transmission component includes a first laser group and a second laser group, pin 403 includes a first pin group and a second pin group, the first pin group and the second pin group respectively include a high-speed signal pin, a power supply pin and a ground pin, the first laser group is connected to the first pin group by bonding, so that the first laser group generates a first signal light; the second laser group is connected to the second pin group by bonding, so that the second laser group generates a second signal light.

[0124] The first laser group and the second laser group are arranged side by side at one end of the gasket 405, the first laser group emits a light signal of a first wavelength, the second laser group emits a light signal of a second wavelength, and the optical axes of the first wavelength light signal and the second wavelength light signal are parallel to the length extension direction of the emission housing 401. Exemplarily, the wavelength range of the first wavelength light signal is 1575-1580nm, such as the wavelength of the first wavelength light signal is 1577nm; the wavelength range of the second wavelength light signal is 1340-1344nm, such as the wavelength of the second wavelength light signal is 1342nm.

[0125] In some embodiments, the transmission rate of the first laser group is lower than the transmission rate of the second laser group. For example, the transmission rate of the first laser group is 10G, and the transmission rate of the second laser group is 50G.

[0126] When the transmission rate of the first laser group is 10G, the first pin group is inserted into the transmitting shell, and the first laser group can be directly connected to the high-speed signal pin, ground pin and power supply pin of the first pin group by bonding, and the high-speed signal pin transmits a signal with a lower rate (10G NRZ).

[0127] When the transmission rate of the second laser group is 50G, the high-speed signal pin of the second pin group is inserted into the transmitting shell 401, and a grounding ring 413 is added around the periphery of the high-speed signal pin; the grounding pin of the second pin group is fixedly connected to the transmitting shell 401, and the power supply pin of the second pin group is inserted into the transmitting shell 401. The second laser group is connected to the high-speed signal pin, the power supply pin and the bonding platform on the grounding ring 413 of the second pin group through bonding, and the high-speed signal pin transmits a signal with a higher rate (50G NRZ).

[0128] In some embodiments, the light emitting component 400 is not limited to including a first laser group and a second laser group. The light emitting component 400 may include three or more laser groups. The transmission rates of multiple laser groups may be the same or different, which all fall within the protection scope of the embodiments of the present disclosure.

[0129] In some embodiments, since the center wavelength and output power of the EML laser chip are affected by the operating temperature, the temperature of the EML laser chip needs to be controlled to maintain the stability of the center wavelength and output power of the EML laser chip. In order to control the temperature of the EML laser chip, the optical emission assembly further includes a semiconductor cooler (TEC) 414, which is disposed on the bottom plate 4010 of the emission housing 401, and the gasket 405 is located on the TEC414. The TEC414 heats or cools the EML laser chip, thereby adjusting the EML laser chip to a constant operating temperature.

[0130] In some embodiments, in order to enable TEC414 to adjust the working temperature of the EML laser chip, TEC414 includes a first electrode 4140 and a second electrode 4141, the first electrode 4140 and the second electrode 4141 are respectively the positive and negative electrodes of TEC414, the first electrode 4140 and the second electrode 4141 are located on the side of TEC414 protruding from the gasket 405, and the first electrode 4140 and the second electrode 4141 are close to the first laser group. The first electrode 4140 and the second electrode 4141 are respectively connected by wires to the power supply pin 4032 inserted into the emission shell 401, so that TEC414 is heated or cooled.

[0131] In some embodiments, the laser group generates heat when working, and the heat is transferred to TEC414 through gasket 405. The laser group is cooled by TEC414, and TEC414 can also adjust the temperature of the laser group, thereby adjusting the wavelength of the signal light generated by the laser group. Exemplarily, in order to transfer the heat of the laser group to TEC414, gasket 405 can be a ceramic gasket to improve the temperature transfer efficiency.

[0132] In some embodiments, the first laser group and the second laser group adopt chip on carrier (COC), which can also be called chip mounting on ceramic substrate. Therefore, the side contours of the first laser group and the second laser group are relatively regular, such as the side contours of the first laser group and the second laser group are respectively rectangular.

[0133] Fig.17 A structural diagram of a first laser chip in an optical module provided according to some embodiments of the present disclosure; Fig.18 FIG. 1 is a structural diagram of a first laser group in an optical module provided according to some embodiments of the present disclosure. Fig.17 and Fig.18As shown, the first laser group includes a first substrate 406 and a first laser chip 407. The first laser chip 407 is an EML laser chip. The first laser chip 407 includes a first light-emitting electrode 4071, a first electro-absorption modulation electrode 4072 and a first grounding electrode. The first light-emitting electrode 4071 and the first electro-absorption modulation electrode 4072 are both positive electrodes of the first laser chip 407. The first light-emitting electrode 4071 and the first electro-absorption modulation electrode 4072 are located on the upper surface of the first laser chip 407, and the first grounding electrode is located on the lower surface of the first laser chip 407.

[0134] Reference Fig.18 A first grounding metal region 4060, a first high-frequency transmission line 4061, a second grounding metal region 4062 and a first electric transmission line 4063 are formed on the first substrate 406. The first high-frequency transmission line 4061 and the first electric transmission line 4063 are metal layers formed on the first substrate 406. The first grounding metal region 4060, the first high-frequency transmission line 4061, the second grounding metal region 4062 and the first electric transmission line 4063 are arranged along the width direction of the first substrate 406. The first grounding metal region 4060 is located at an edge of one side of the first substrate 406, and the first electric transmission line 4063 is located at an edge of the other side of the first substrate 406. The first high-frequency transmission line 4061 is located between the first grounding metal region 4060 and the first electric transmission line 4063, and the second grounding metal region 4062 is located between the first high-frequency transmission line 4061 and the first electric transmission line 4063.

[0135] In some embodiments, the length dimension of the first grounding metal region 4060, the length dimension of the first high-frequency transmission line 4061, the length dimension of the second grounding metal region 4062, and the length dimension of the first substrate 406 are the same, the length dimension of the first electrical transmission line 4063 is smaller than the length dimension of the first substrate 406, and the first electrical transmission line 4063 extends from the right side of the first substrate 406 to the left side.

[0136] In some embodiments, a third grounding metal region 4067 is further formed on the first substrate 406 . The third grounding metal region 4067 is located between the second signal transmission region 1063 and the left side of the first substrate 406 . The third grounding metal region 4067 is connected to the second grounding metal region 4062 .

[0137] The first laser chip 407 is mounted on the second grounding metal area 4062, the first grounding electrode of the first laser chip 407 is connected to the second grounding metal area 4062, the second grounding metal area 4062 is electrically connected to the ground pin in the first pin group through wire bonding, and the first grounding metal area 4060 is electrically connected to the ground pin in the first pin group through wire bonding.

[0138] The first light emitting electrode 4071 is electrically connected to the first electrical transmission line 4063 by bonding, and the first electrical transmission line 4063 is electrically connected to the power supply pin in the first pin group by bonding to supply power to the DFB region of the first laser chip 407 so that the DFB region generates light without carrying a signal.

[0139] One end of the first electro-absorption modulation electrode 4072 is electrically connected to the first high-frequency transmission line 4061 through bonding wires, the first high-frequency transmission line 4061 is electrically connected to the high-speed signal pin of the first pin group through bonding wires, and the other end of the first electro-absorption modulation electrode 4072 is electrically connected to the second ground metal area 4062 through bonding wires. The electro-absorption modulation area of ​​the first laser chip 407 receives the data signal transmitted by the high-speed signal pin, and the electro-absorption modulation area amplitude modulates the light output by the DFB area to generate a data optical signal.

[0140] In some embodiments, when the optical module sends a signal, the gold finger introduces the electrical signal into the laser driver chip on the circuit board 300, and the laser driver chip transmits the electrical signal to the first laser chip 407 through the pin 403, and then uses the first laser chip 407 to convert the electrical signal into an optical signal, wherein the laser driver chip is connected to the first laser chip 407 through the pin 403, and the pin 403 has a certain characteristic impedance. When the impedance output by the first laser chip 407 does not match the characteristic impedance of the pin 403, the signal transmitted between the laser driver chip and the first laser chip 407 will be lost, thereby reducing the integrity of the signal. Therefore, in order to ensure the integrity of the signal, it is necessary to ensure that the impedance output by the first laser chip 407 matches the characteristic impedance of the pin 403.

[0141] In order to match the impedance output by the first laser chip 407 with the characteristic impedance of the pin 403, a first matching resistor 4064 is provided on the first substrate 406, and a first pad 4065 and a second pad 4066 are provided on both sides of the first matching resistor 4064. The other end of the first electro-absorption modulation electrode 4072 is electrically connected to the first pad 4065 through a bonding wire, and the second pad 4066 is electrically connected to the third grounding metal area 4067 through a bonding wire, so that the first matching resistor 4064 and the first laser chip 407 are connected in parallel in the circuit, and the resistance value of the first matching resistor 4064 is equal to the resistance value of the high-speed signal pin, so as to achieve impedance matching between the first laser chip 407 and the high-speed signal pin.

[0142] In some embodiments, the first matching resistor 4064 is designed to be composed of a first matching resistor and a second matching resistor connected in series, wherein the first end of the first matching resistor is electrically connected to the first electro-absorption modulation electrode 4072, the second end of the first matching resistor is connected to the first end of the second matching resistor, the second end of the second matching resistor is connected to the second grounding metal region 4062, and the resistance values ​​of the first matching resistor and the second matching resistor are both half of the resistance value of the first high-frequency transmission line 4061. In this way, not only can the influence of the resistance value accuracy of the resistor on the impedance matching be reduced, but there is also an important factor that, if the weak resistance parasitics of the resistor are considered, the series design of the first matching resistor and the second matching resistor is equivalent to a distributed parasitic capacitor, which is beneficial to the high-frequency effect in the high-frequency band.

[0143] The first laser chip 407 is mounted on the second grounding metal area 4062 of the first substrate 406, and the first grounding metal area 4060 and the second grounding metal area 4062 are respectively connected to the grounding pin of the first pin group by wire bonding; the first light-emitting electrode 4071 of the first laser chip 407 is connected to the first electric transmission line 4063 by wire bonding, and the first electric transmission line 4063 is connected to the power supply pin of the first pin group by wire bonding; one end of the first electro-absorption modulation electrode 4072 of the first laser chip 407 is connected to the first high-frequency transmission line 4061 by wire bonding, and the first high-frequency transmission line 4061 is connected to the high-speed signal pin of the first pin group by wire bonding; the other end of the first electro-absorption modulation electrode 4072 is connected to the first pad 4065 of the first matching resistor 4064 by wire bonding, and the second pad 4066 of the first matching resistor 4064 is connected to the second grounding metal area 4062 by wire bonding. In this way, the first laser group is connected to the first pin group by wire bonding, so that the first laser group generates an optical signal of the first wavelength.

[0144] Reference Fig.16 In some embodiments, in order to further control the temperature of the first laser chip 407, a thermistor 417 is further provided on the gasket 405. The thermistor 417 is close to the first substrate 406. When the temperature of the first laser chip 407 changes, the thermistor 417 can feed back the temperature change to the TEC driver, and the TEC driver can be used to control the TEC414 to cool or heat, so that the temperature of the first laser chip 407 remains constant, thereby achieving precise temperature control of the first laser chip 407 at the microscopic level.

[0145] In some embodiments, the current resistance value of the thermistor 417 is obtained, and the thermistor temperature corresponding to the current resistance value is obtained according to a pre-stored temperature-resistance mapping relationship of the thermistor, and the thermistor temperature is compared with a pre-set target temperature. When the thermistor temperature is higher than the target temperature, a signal is sent to the TEC driver to cool the TEC 414, thereby reducing the temperature of the first laser chip 410; when the thermistor temperature is lower than the target temperature, a signal is sent to the TEC driver to heat the TEC 414, thereby increasing the temperature of the first laser chip 407, thereby ensuring the stability of the first laser chip 407.

[0146] Fig.19 is a structural diagram of a second substrate in an optical module provided according to some embodiments of the present disclosure, Fig. 20 is a structural diagram of a second laser chip in an optical module provided according to some embodiments of the present disclosure, Fig.21 A partial structural diagram of a second laser group in an optical module provided in some embodiments of the present disclosure. Fig.19 , Fig. 20 and Fig.21 As shown, the second laser group includes a second substrate 409 and a second laser chip 410. The second laser chip 410 is an EML laser chip. The second laser chip 410 includes a second light-emitting electrode 4101, a second electro-absorption modulation electrode 4102 and a second ground electrode. The second light-emitting electrode 4101 and the second electro-absorption modulation electrode 4102 are both positive electrodes of the second laser chip 410. The second light-emitting electrode 4101 and the second electro-absorption modulation electrode 4102 are located on the upper surface of the second laser chip 410, and the second ground electrode is located on the lower surface of the second laser chip 410.

[0147] Due to the increasing demand for optical power, a semiconductor optical amplifier (SOA) is packaged in the second laser chip 410 to increase the optical power of the optical signal emitted by the second laser chip 410. SOA is a semiconductor optoelectronic device with the same material system as EML, so SOA can be monolithically integrated with EML on the same substrate. Using SOA as an amplifier at the end of EML can make the light source device more compact, smaller in size, and more stable, and reduce coupling loss to a certain extent.

[0148] See also Fig.19The front surface of the second substrate 409 is designed to form a gold-plated layer by electron beam evaporation, and a solder layer is formed on the gold-plated layer by electron beam evaporation. The solder layer is a preset solder area 4091. The second laser chip 410 is mounted on the preset solder area 4091. The second laser chip 410 is eutectic-welded with the preset solder area 4091. In some embodiments, the preset solder area 4091 is a grounding metal layer, and the second grounding electrode of the second laser chip 410 is connected to the preset solder area 4091.

[0149] A fourth grounding metal area 4090, a second high-frequency transmission line 4092 and a fifth grounding metal area 4095 are also formed on the second substrate 409. The second high-frequency transmission line 4092 is a signal transmission metal layer formed on the second substrate 409. The fourth grounding metal area 4090 and the fifth grounding metal area 4095 are located on both sides of the second high-frequency transmission line 4092, and the fourth grounding metal area 4090 is connected to the fifth grounding metal area 4095.

[0150] In some embodiments, the second high-frequency transmission line 4092 extends from the right side of the second substrate 409 to the left side, and the length of the second high-frequency transmission line 4092 is smaller than the length of the second substrate 409 so that the second high-frequency transmission line 4092 is close to the pre-set solder area 4091.

[0151] See also Fig. 20 In some embodiments, the second laser chip 410 integrates a DFB region, an EAM modulation region, an SOA amplification region and a waveguide region arranged in sequence along the optical path direction. The SOA amplification region amplifies the signal light output by the EAM modulation region, and the amplified signal light is emitted through the waveguide in the waveguide region. Due to the amplification of the SOA, the emission light power of the second laser chip is relatively high. In order to reduce light reflection, the waveguide in the waveguide region is tilted so that the light emission angle of the light emitted by the second laser chip 410 is set at a preset angle with the second laser chip 410.

[0152] In some embodiments, the inclination angle between the waveguide on the right end face of the second laser chip 410 and the second substrate 409 satisfies the following two conditions: first, the emitted light satisfies the small horizontal angle emission, and after the emitted light beam is reflected by the surface of the optical element on the right side of the second laser chip 410, the reflected light deviates from the waveguide area; second, the angle of the reflected light in the waveguide after returning to the waveguide is greater than the total reflection angle of the waveguide to form a radiation mode. In some embodiments, the preset angle between the emission angle of the emitted light and the second laser chip 410 is 10° to 30°.

[0153] Since the light emission angle of the second laser chip 410 is set at a preset angle to the second laser chip 410, in order to facilitate the light emitted by the second laser chip 410 to be emitted from the emission housing 401 and coupled to the first optical fiber adapter 700, the second laser chip 410 is tilted on the second substrate 409, that is, the second laser chip 410 is tilted at a certain angle and eutectic welded with the preset solder area 4091, so that the light emitted by the second laser chip 410 is emitted horizontally.

[0154] In some embodiments, since the second laser chip 410 is tilted, in order to ensure the compatibility of product packaging design, the second substrate 409 supports multi-angle eutectic and can simultaneously meet the packaging requirements of laser chips at multiple angles.

[0155] After the second laser chip 410 is tiltedly disposed on the pre-set solder area 4091 of the second substrate 409, the second light-emitting electrode 4101 of the second laser chip 410 is wire-bonded to the power supply pin of the second pin group to power the DFB area of ​​the second laser chip 410, so that the DFB area generates light without carrying a signal.

[0156] One end of the second electro-absorption modulation electrode 4102 is wire-connected to the second high-frequency transmission line 4092, which is wire-connected to the high-speed signal pin of the second pin group, and the other end of the second electro-absorption modulation electrode 4102 is wire-connected to the fourth grounding metal area 4090, which is wire-connected to the second wire bonding platform 4131 on the grounding ring 413, and the fifth grounding metal area 4095 is wire-connected to the first wire bonding platform 4130 on the grounding ring 413. The electro-absorption modulation area of ​​the second laser chip 410 receives the data signal transmitted by the high-speed signal pin, and the electro-absorption modulation area modulates the amplitude of the light output by the DFB area to generate a data optical signal.

[0157] When the optical module sends a signal, the gold finger introduces the electrical signal into the laser driver chip on the circuit board 300, and the laser driver chip transmits the electrical signal to the second laser chip 410 through the pin 403, and then uses the second laser chip 410 to convert the electrical signal into an optical signal, wherein the laser driver chip and the second laser chip 410 are connected through the pin 403, and the pin 403 has a certain characteristic impedance. When the impedance output by the second laser chip 410 does not match the characteristic impedance of the pin 403, the signal transmitted between the laser driver chip and the second laser chip 410 will be lost, reducing the integrity of the signal. Therefore, in order to ensure the integrity of the signal, it is necessary to ensure that the impedance output by the second laser chip 410 matches the characteristic impedance of the pin 403.

[0158] Fig. 22 is a structural diagram of a second matching resistor in an optical module provided according to some embodiments of the present disclosure, Fig.23FIG. 1 is an assembly diagram of a second laser group and a second matching resistor in an optical module provided according to some embodiments of the present disclosure. Fig. 22 and Fig.23 As shown, in order to match the impedance output by the second laser chip 410 with the characteristic impedance of the pin 403, a second matching resistor 4080 is further provided in the transmitting shell 401. The second matching resistor 4080 is connected in parallel with the second laser chip 410. At this time, the second matching resistor 4080 has an impedance matching function, so that the impedance output by the second laser chip 410 matches the characteristic impedance of the pin 403.

[0159] A third pad 4081 and a fourth pad 4082 are provided on both sides of the second matching resistor 4080, one end of the second electro-absorption modulation electrode 4102 is wire-connected to the third pad 4081, and the fourth pad 4082 is wire-connected to the fourth grounding metal area 4090, so that the second matching resistor 4080 and the second laser chip 410 are connected in parallel in the circuit, and the resistance value of the second matching resistor 4080 is equal to the resistance value of the high-speed signal pin 4030, so as to achieve impedance matching between the second laser chip 410 and the high-speed signal pin 4030.

[0160] In some embodiments, as the signal transmission rate of the EML laser chip gradually increases, the emission light power of the EML laser chip also increases, and the heat generated by the EML laser chip also gradually increases. The increase in heat causes the signal noise of the EML laser chip to increase, affecting the photoelectric conversion efficiency of the laser chip. The present disclosure places the second matching resistor 4080 on an independent third substrate 408, which can minimize the effect of the heat generated by the second matching resistor 4080 on the second laser chip 410, so as to ensure the light-emitting performance of the second laser chip 410.

[0161] Compared with integrating the second matching resistor 4080 on the second substrate 409, setting the second matching resistor 4080 on an independent third substrate 408 can achieve matching of laser chips with different impedances by replacing the third substrate 408 with integrated different resistance values ​​to ensure the high-frequency performance of the laser chip.

[0162] In some embodiments, the third substrate 408 is independently disposed on one side of the second substrate 409 . When the signal light emitted by the second laser chip 410 is reflected at the end face of the optical device in front of it, the third substrate 408 can isolate the reflected light to a certain extent, so as to reduce the crosstalk caused by the reflected light to the second laser chip 410 .

[0163] In some embodiments, a first capacitor 4093 is further disposed on the second substrate 409 . The first capacitor 4093 is located between the second matching resistor 4080 and the second laser chip 410 . The first capacitor 4093 and the second matching resistor 4080 are connected in series to form an RC circuit. The RC circuit is connected in parallel to the electro-absorption modulation region of the second laser chip 410 .

[0164] The surface of the second substrate 409 has a first circuit area capable of transmitting signals, the first circuit area is a signal line transmission layer formed of a metal material, the positive electrode and the negative electrode of the first capacitor 4093 are arranged on two opposite surfaces, wherein the negative electrode is arranged on the lower surface (bottom surface) of the first capacitor 4093, the positive electrode is arranged on the upper surface (top surface) of the first capacitor 4093, the negative electrode of the first capacitor 4093 is connected to the first circuit area, one end of the positive electrode of the first capacitor 4093 is wired to the third pad 4081 of the second matching resistor 4080, and the other end of the positive electrode of the first capacitor 4093 is wired to the second electro-absorption modulation electrode 4102. In some embodiments, the first capacitor 4093 has the function of isolating the DC from the AC, thereby reducing power consumption.

[0165] Fig.24 A circuit connection between a second laser group and a second matching resistor at another angle in an optical module provided according to some embodiments of the present disclosure Figure 1 , Fig.25 A circuit connection between a second laser group and a second matching resistor in an optical module provided according to some embodiments of the present disclosure Figure 2 .like Fig.24 and Fig.25 As shown, in some embodiments, the position of the first capacitor 4093 on the second substrate 409 is related to the welding angle of the second laser chip 410. When the second laser chip 410 is tilted on the second substrate 409, the first capacitor 4093 is located on the right side of the second electro-absorption modulation electrode 4102, and the bonding wire connecting the first capacitor 4093 and the second electro-absorption modulation electrode 4102 is perpendicular to the second laser chip 410, so that the bonding wire distance between the first capacitor 4093 and the second electro-absorption modulation electrode 4102 is shorter, so as to reduce the resistance of the bonding wire.

[0166] When the second laser chip 410 is horizontally disposed on the second substrate 409, the first capacitor 4093 is located directly above the second electro-absorption modulation electrode 4102, and the bonding wire connecting the first capacitor 4093 and the second electro-absorption modulation electrode 4102 is perpendicular to the second laser chip 410, so that the bonding wire distance between the first capacitor 4093 and the second electro-absorption modulation electrode 4102 is shorter, thereby reducing the resistance of the bonding wire.

[0167] In the disclosed embodiment, the bonding length of the high-frequency input and output part of the multi-angle laser chip (the second laser chip 410 ) is adjusted by adjusting the bonding position of the first capacitor 4093 on the second substrate 409 , so that the bonding length is more appropriate to ensure the high-frequency characteristics of the second laser chip 410 .

[0168] In some embodiments, there is noise in the signal transmitted from the second high-frequency transmission line 4092 to the second laser chip 410. In order to filter out the noise, a second capacitor 4094 is further provided on the second substrate 409. The second capacitor 4094 is located between the second laser chip 410 and the second high-frequency transmission line 4092. The first capacitor 4093 and the second capacitor 4094 are located on both sides of the second laser chip 410.

[0169] The negative electrode of the second capacitor 4094 is located on the bottom surface of the second capacitor 4094, and the positive electrode of the second capacitor 4094 is located on the top surface of the second capacitor 4094. One end of the positive electrode of the second capacitor 4094 is connected to the second electro-absorption modulation electrode 4102 by wire bonding, and the other end of the positive electrode of the second capacitor 4094 is connected to the second high-frequency transmission line 4092 by wire bonding.

[0170] In some embodiments, one end of the positive electrode of the second electro-absorption modulation electrode 4102 is wired to one end of the positive electrode of the first capacitor 4093, the other end of the positive electrode of the first capacitor 4093 is wired to the third pad 4081, the fourth pad 4082 is wired to the fourth grounding metal area 4090, and the fourth grounding metal area 4090 is wired to the wire bonding platform of the grounding ring 413; the other end of the positive electrode of the second electro-absorption modulation electrode 4102 is wired to one end of the positive electrode of the second capacitor 4094, the other end of the positive electrode of the second capacitor 4094 is wired to the second high-frequency transmission line 4092, the second high-frequency transmission line 4092 is wired to the high-speed signal pin of the second pin group, and the second light-emitting electrode 4101 is wired to the power supply pin of the second pin group. In this way, the wire bonding connection between the second laser group and the second pin group is realized, so that the second laser group generates an optical signal of the second wavelength.

[0171] By setting the second substrate 409 and the peripheral matching components of the second laser chip 410, the second laser chip 410 can output high-quality optical signals while working safely. In order to ensure the stability of the optical power of the optical signal output by the second laser chip 410, the power of the optical signal emitted by the second laser chip 410 can be detected by a backlight detector.

[0172] Fig.26 is a structural diagram of a support column in an optical module provided according to some embodiments of the present disclosure, Fig. 27 FIG. 1 is a structural diagram of a second laser group in an optical module provided according to some embodiments of the present disclosure. Fig.26 and Fig. 27As shown, a mounting post 416 is provided on the second substrate 409, and a monitor photo detector (MPD) 415 is provided on the mounting post 416. The photosensitive surface of the MPD 415 is located in the direction opposite to the light emitting direction of the second laser chip 410. Among the optical signals emitted by the second laser chip 410, the high-power optical signal propagates toward the direction of the first optical fiber adapter 700 (propagates forward), and the low-power optical signal propagates toward the direction of the MPD 415 (propagates backward). In some embodiments, the power entering the MPD 415 for power detection is 1 / 10 of the total power emitted by the second laser chip 410.

[0173] See also Fig.26 The mounting column 416 includes a bottom surface, a mounting surface 4160 and a top surface 4161. The bottom surface of the mounting column 416 is adhered to the fourth grounding metal area 4090 of the second substrate 409. A first metal area 4162 and a second metal area 4163 are formed on the mounting surface 4160. The area of ​​the first metal area 4162 is larger than that of the second metal area 4163. A notch is formed at a corner (upper right) of the first metal area 4162, and the second metal area 4163 is located in the notch.

[0174] A third metal region 4164 and a fourth metal region 4165 are formed on the top surface 4161 . The third metal region 4164 is located on the left side of the fourth metal region 4165 . The third metal region 4164 is connected to the first metal region 4162 , and the fourth metal region 4165 is connected to the second metal region 4163 .

[0175] MPD415 is mounted on the first metal region 4162, the positive electrode of MPD415 can be electrically connected to the first metal region 4162, the negative electrode of MPD415 can be electrically connected to the second metal region 4163, the third metal region 4164 is wire-bonded to the power supply pin of the second pin group, and the fourth metal region 4165 is wire-bonded to the wire bonding platform on the ground ring 413, so as to realize the wire bonding connection between MPD415, the mounting column 416 and the second pin group. In this way, the low-power optical signal emitted by the second laser chip 410 is received by MPD415, and MPD415 is used to monitor the power of the low-power optical signal emitted by the second laser chip 410 to monitor the forward optical power of the second laser chip 410.

[0176] Fig.28 FIG. 1 is a schematic diagram of electrical connections of a light emitting component in an optical module according to some embodiments of the present disclosure. Fig.28As shown, the first pin group 430 includes a first high-speed signal pin 4300, a first ground pin 4301 and a first power supply pin 4302, the first light-emitting electrode 4071 of the first laser chip 407 is wire-bonded to the first electrical transmission line 4063, and the first electrical transmission line 4063 is wire-bonded to the first power supply pin 4302, so as to supply power to the DFB region of the first laser chip 407 through the first power supply pin 4302, so that the DFB region generates light that does not carry a signal.

[0177] One end of the first electro-absorption modulation electrode 4072 of the first laser chip 407 is wire-connected to the first high-frequency transmission line 4061, and the first high-frequency transmission line 4061 is wire-connected to the first high-speed signal pin 4300; the other end of the first electro-absorption modulation electrode 4072 is wire-connected to the first pad 4065 of the first matching resistor 4064, the second pad 4066 of the first matching resistor 4064 is wire-connected to the third grounding metal area 4067, the third grounding metal area 4067 is connected to the second grounding metal area 4062, the second grounding metal area 4062 is wire-connected to a first grounding pin 4301, and the first grounding metal area 4060 is wire-connected to another first grounding pin 4301 to form a return flow. The electro-absorption modulation area of ​​the first laser chip 407 receives the data signal transmitted by the first high-speed signal pin 4300, and the electro-absorption modulation area modulates the amplitude of the light output by the DFB area, so that the first laser chip 407 generates an optical signal of the first wavelength.

[0178] The second pin group 420 includes a second high-speed signal pin 4200, a second ground pin 4201 and a second power supply pin 4202. The second ground pin 4201 is connected to the outer side of the transmitting shell 401, and the inner side of the transmitting shell 401 is connected to the ground ring 413, so that the ground ring 413 is grounded.

[0179] The second light emitting electrode 4101 of the second laser chip 410 is wire-bonded to the second power supply pin 4202 to supply power to the DFB region of the second laser chip 410 through the second power supply pin 4202 , so that the DFB region generates light that does not carry a signal.

[0180] One end of the second electro-absorption modulation electrode 4102 of the second laser chip 410 is wired to one end of the positive electrode of the first capacitor 4093, the other end of the positive electrode of the first capacitor 4093 is wired to the third pad 4081 of the second matching resistor 4080, and the fourth pad 4082 is wired to the fourth grounding metal area 4090; the other end of the second electro-absorption modulation electrode 4102 is wired to one end of the positive electrode of the second capacitor 4094, the other end of the positive electrode of the second capacitor 4094 is wired to the second high-frequency transmission line 4092, and the second high-frequency transmission line 4092 is wired to the second high-speed signal pin 4200. The electro-absorption modulation area of ​​the second laser chip 410 receives the data signal transmitted by the second high-speed signal pin 4200, and the electro-absorption modulation area modulates the amplitude of the light output by the DFB area, so that the second laser chip 410 generates an optical signal of a second wavelength.

[0181] In some embodiments, the grounding metal layer on the second substrate 409 is divided into a fourth grounding metal area 4090 and a fifth grounding metal area 4095 by a second high-frequency transmission line 4092. The fourth grounding metal area 4090 is wire-bonded to the second bonding platform 4131 on the grounding ring 413, and the fifth grounding metal area 4095 is wire-bonded to the first bonding platform 4130 on the grounding ring 413 to form a return flow.

[0182] Fig.29 FIG. 1 is a light path diagram of a light emitting component in an optical module according to some embodiments of the present disclosure. Fig.29 As shown, since the optical emitting component 400 includes a first laser group and a second laser group, the first laser group emits an optical signal of a first wavelength λ1, and the second laser group emits an optical signal of a second wavelength λ2, the transmission rate of the first laser group is lower than the transmission rate of the second laser group. In order to reduce the size of the transmitting shell 401, the optical emitting component 400 also includes a light combiner 411, which is disposed on the gasket 405 and is located in the light emitting direction of the first laser chip 407 and the second laser chip 410. The light combiner 411 combines the first wavelength optical signal emitted by the first laser chip 407 and the second wavelength optical signal emitted by the second laser chip 410.

[0183] The light combiner 411 has two input optical waveguides and one output optical waveguide. The first laser chip 407 is arranged corresponding to one input optical waveguide, and the second laser chip 410 is arranged corresponding to the other input optical waveguide. In this way, the optical signal of the first wavelength λ1 emitted by the first laser chip 407 is emitted into the light combiner 411 through one input optical waveguide, and the optical signal of the second wavelength λ2 emitted by the second laser chip 410 is emitted into the light combiner 411 through the other input optical waveguide. The light combiner 411 combines the optical signal of the first wavelength λ1 and the optical signal of the second wavelength λ2 into a composite optical signal, which includes the optical signal of the first wavelength λ1 and the optical signal of the second wavelength λ2.

[0184] In some embodiments, since the transmission rate of the first wavelength optical signal λ1 is lower than the transmission rate of the second wavelength optical signal λ2, the mode fields of the first wavelength optical signal λ1 and the second wavelength optical signal λ2 are inconsistent, which affects the light spot and eye diagram of the optical signal emitted by the optical emitting component 300. In order to achieve the consistency of the mode fields of the optical signals output by different laser groups, the optical combiner 411 adopts a planar lightwave circuit (PLC) optical combiner, which changes the mode field diameter of the input and output of the PLC by design, combines the waves inside the PLC, and outputs light from the same output end to achieve higher coupling efficiency, thereby solving the problem that conventional optical combiner (Multiplexe, MUX) devices or lens combinations cannot achieve the consistency of the mode fields of multiple laser outputs.

[0185] In some embodiments, the optical emitting component 400 also includes a collimating lens 412, which is disposed on the gasket 405. The collimating lens 412 is located in the light output direction of the light combiner 411. The collimating lens 412 is used to collimate the composite signal light output by the light combiner 411. The collimated signal light is emitted through the optical window 404 on the emitting shell 401 and coupled to the first optical fiber adapter 700, thereby realizing single-fiber emission of multi-path light.

[0186] Fig.30 is a structural diagram of a light window in an optical module provided according to some embodiments of the present disclosure, Fig.31 is an assembly cross-sectional view of an emission housing and a light window in an optical module provided according to some embodiments of the present disclosure, Fig.32 FIG. 1 is a cross-sectional view of a light emitting component in an optical module according to some embodiments of the present disclosure. Fig.30 , Fig.31 and Fig.32 As shown, the collimated light emitted by the collimating lens 412 is emitted from the emitting shell 401 through the light window 404. In order to reduce the reflection of the collimated light at the light window 404, the light window 404 is a single-sided inclined glass structure, that is, the light window 404 includes a first side surface 4041 and a second side surface 4042, the first side surface 4041 is a vertical surface, and the second side surface 4042 is an inclined surface.

[0187] The light window 404 is embedded in the light hole 4015 of the first side plate 4011, and the first side surface 4041 and the outer side surface of the first side plate 4011 are located in the same plane, that is, the first side surface 4041 and the outer side surface of the first side plate 4011 are flush, so as to ensure the appearance of the emitting shell 401. The outer side of the first side surface 4041 can support lens bonding, providing diversified options for optical path design.

[0188] The second side surface 4042 faces the collimating lens 412. Since the second side surface 4042 is tilted, most of the collimated light emitted from the collimating lens 412 is refracted at the second side surface 4042. The refracted collimated light is refracted again via the first side surface 4041. The refracted light can be directly coupled to the first optical fiber adapter 700 or coupled to the first optical fiber adapter 700 via the lens structure.

[0189] A small portion of the collimated light emitted from the collimating lens 412 is reflected at the second side surface 4042. Since the second side surface 4042 is tilted, a certain angle is formed between the reflected light and the collimated light emitted to the second side surface 4042. In this way, the reflected light cannot return to the first laser group and the second laser group along the original path, thereby reducing the performance degradation caused by optical crosstalk.

[0190] In some embodiments, the light window 404 adopts a single-sided inclined structure, which can be achieved by cold processing of glass without adding additional costs; the light window 404 has a larger area, which solves the limitation that traditional small light windows can only pass a single light beam, and can support multi-channel light path propagation. The light can be combined inside or outside the transmitting tube shell at will, so that the light emitting component can be packaged in a small volume and airtight.

[0191] In the optical module provided by the embodiment of the present disclosure, a metal grounding column or a grounding ring is added in the transmitting tube shell, and the grounding column or the grounding ring wraps the high-speed signal pin, so that the high-speed signal pin and the GND are transitioned from glass coaxial to air coaxial. The projection area of ​​the grounding column or the grounding ring on the transmitting shell covers part of the insulating member, thereby reducing the distance between the high-speed signal pin and the GND in the transmitting shell, reducing the impedance of the high-speed signal pin and the connection end of the laser chip, and achieving impedance matching between the high-speed signal pin and the laser chip, so that the high-speed signal pin has the ability to increase bandwidth and reduce signal reflection, so that the low-cost and low-speed glass PIN tube shell has high-speed transmission capability; the optical emitting component includes a first laser group with a low transmission rate and a second laser group with a high transmission rate, and a low-cost glass PIN tube shell is used to realize the joint packaging of high-speed products and low-speed products, and realize the packaging of wide wavelength intervals and different laser types, so that the optical module has the advantages of cost, high speed, miniaturization, low reflection and high power, thereby realizing the emission of light of different wavelengths of the optical module, and ensuring that data can be transmitted at a long distance and at a high speed.

[0192] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, characterized in that: include: Circuit boards; A light emitting component, electrically connected to the circuit board, for generating a light signal; Wherein, the light emitting component comprises: The transmitting tube shell has a plug hole formed on one side plate and a light window arranged on the other side plate opposite thereto; A pin, one end of which is electrically connected to the circuit board and the other end is inserted into the jack, wherein the pin is sealed and connected to the jack through an insulating member; the pin comprises a high-speed signal pin, a ground pin and a power supply pin, wherein the ground pin is connected to the transmitting tube shell, and the high-speed signal pin and the power supply pin are inserted into the transmitting tube shell through the jack; A grounding member is mounted on the inner wall of the transmitting tube shell, the grounding member surrounds the high-speed signal pin, air is filled between the grounding member and the high-speed signal pin, and the projection area of ​​the grounding member on the inner wall of the transmitting tube shell covers a part of the insulating member; The optical emission component is located in the emission tube shell, and the optical emission component includes a laser group. The laser group is connected to the high-speed signal pin, the power supply pin and the grounding member through bonding to generate signal light, and the signal light is emitted through the light window.

2. The optical module according to claim 1, characterized in that: The launch tube shell comprises a launch shell and a cover plate, wherein the cover plate is covered on the launch shell; wherein the launch shell comprises: Base plate; A first side plate, vertically connected to the bottom plate, wherein the light window is located on the first side plate; a second side plate connected to the bottom plate and the first side plate; a third side plate, connected to the bottom plate and the second side plate, and arranged opposite to the first side plate, wherein the jack is located on the third side plate, and the grounding member is mounted on the inner side of the third side plate; The fourth side plate is connected to the bottom plate, the first side plate and the third side plate, and is arranged opposite to the second side plate.

3. The optical module according to claim 2, characterized in that: The grounding element comprises: a first grounding column, one end of which is connected to the third side plate, the first grounding column being located at one side of the high-speed signal pin, and a projection area of ​​the first grounding column on the third side plate covering a portion of the insulating member; A second grounding column has one end connected to the third side plate, the second grounding column is located at the other side of the high-speed signal pin, and the projection area of ​​the second grounding column on the third side plate covers a portion of the insulating member.

4. The optical module according to claim 3, characterized in that: The first grounding column and the second grounding column are flush with the side surfaces of the high-speed signal pin.

5. The optical module according to claim 2, characterized in that: The grounding member includes a plurality of grounding posts, and the plurality of grounding posts surround the high-speed signal pins; The insulating member in the insertion hole is a circular member, and the distance between the plurality of grounding posts and the high-speed signal pins is smaller than the radius of the insulating member.

6. The optical module according to claim 2, characterized in that: The grounding member is a grounding ring, one end of which is mounted on the third side plate, a through hole is formed at the center of the grounding ring, and the high-speed signal pin passes through the through hole; The insulating member in the jack is a circular member, and the distance between the high-speed signal pin and the edge of the ground ring is smaller than the radius of the insulating member in the jack.

7. The optical module according to claim 6, characterized in that: One end of the high-speed signal pin protrudes from the ground ring, and a first bonding platform and a second bonding platform are formed on the ground ring. The first bonding platform and the second bonding platform are located on both sides of the high-speed signal pin, and a projection area of ​​the first bonding platform on the third side plate covers a portion of the insulating member, and a projection area of ​​the second bonding platform on the third side plate covers a portion of the insulating member.

8. The optical module according to claim 2, characterized in that: The light emitting assembly comprises: A gasket, located on the bottom plate; A substrate, located on the gasket, the substrate is coated with a conductive metal layer, a signal transmission area is formed on the conductive metal layer, the conductive metal layer is connected to the grounding member by wire bonding, and the signal transmission area is connected to the high-speed signal pin by wire bonding; The laser chip is located on the conductive metal layer, and comprises a light-emitting area and an electro-absorption modulation area. The light-emitting area is connected to the power supply pin by wire bonding, and the electro-absorption modulation area is connected to the signal transmission area by wire bonding.

9. The optical module according to claim 2, characterized in that: The transmitting shell and the grounding member are metal members made of the same material.

10. The optical module according to claim 1, characterized in that: The insulating member is a glass member.

Images