A heating plate structure, semiconductor heating device and method based on the structure

Abstract

The present invention relates to the field of semiconductor technology, and specifically to a heating plate structure, a semiconductor heating device and a method based on the structure, wherein the semiconductor heating device comprises: a casing, a reciprocating assembly is arranged in the casing, the reciprocating assembly comprises a receiving plate slidably arranged in the casing, a semiconductor heating structure is arranged on the receiving plate, the reciprocating assembly can drive the receiving plate to slide relative to the casing, thereby forcing the receiving plate to protrude or sink into the casing; a switch door is also slidably arranged on the casing, the switch door is connected to a lifting assembly arranged in the casing, the lifting assembly can drive the switch door to slide along the vertical direction of the casing, thereby opening and closing the casing; a driving assembly is arranged in the casing, connected to the lifting assembly and the reciprocating assembly, and can drive the reciprocating assembly and the lifting assembly to perform alternating actions.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a heating disk structure, and a semiconductor heating device and method based on the structure. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Most electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors in their core units.

[0003] During the processing and production of semiconductors, they need to be heated. During heating, the semiconductors generally need to be manually placed in a heating device. Currently, when using semiconductor heating equipment to heat semiconductors, the equipment needs to be opened first, and then the semiconductor is placed in a placement tray equipped in the heating equipment. Then the equipment is closed and the semiconductor is heated using electric heating or induction heating. However, there is a lack of positioning structure in the placement tray, so the semiconductor placed in the placement tray will not be at the heating center of the equipment, which will result in a longer time required to heat the semiconductor, and uneven heating will occur when the semiconductor is heated, which will ultimately affect the quality of semiconductor production. Summary of the invention

[0004] The object of the present invention is to provide a heating disk structure, and a semiconductor heating device and method based on the structure, so as to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A semiconductor heating device, comprising: a housing, a reciprocating assembly arranged in the housing, the reciprocating assembly comprising a receiving plate slidably arranged in the housing; a supporting plate fixedly arranged in the housing, the supporting plates being symmetrically arranged in two groups along the length direction of the housing, both groups of the supporting plates being fixedly arranged with T-shaped blocks, the T-shaped blocks being slidably arranged in a clamping groove provided on the back of the receiving plate, and the receiving plate can only slide along the length direction of the housing under the cooperation between the T-shaped blocks and the clamping groove;

[0007] Two sets of telescopic rods are fixedly arranged on the back of the receiving plate, and the telescopic rods are slidably connected with the fixed sleeves arranged in the housing. When the receiving plate is driven by the reciprocating assembly and extends to the outside of the housing, the telescopic rods can support the extended receiving plate;

[0008] The receiving plate is provided with a semiconductor heating structure, and the reciprocating assembly can drive the receiving plate to slide relative to the housing, thereby forcing the receiving plate to protrude or sink into the housing;

[0009] The housing is also provided with a switch door which is slidably mounted thereon. The switch door is connected to a lifting assembly arranged in the housing. The lifting assembly can drive the switch door to slide along the vertical direction of the housing, thereby opening and closing the housing.

[0010] A driving assembly, disposed in the housing, connected to the lifting assembly and the reciprocating assembly, and capable of driving the reciprocating assembly and the lifting assembly to perform alternating actions;

[0011] The reciprocating components are symmetrically arranged in two groups along the width direction of the housing, each group of the reciprocating components includes a pulley rotatably installed in the housing, and the pulleys are arranged in two groups along the length direction of the housing, and a belt is arranged between the two groups of pulleys, and a protruding column is fixedly arranged on the belt, and the protruding column is connected to the receiving plate through a moving member;

[0012] The reciprocating assembly comprises a reciprocating plate fixedly connected to the receiving plate, a moving groove is provided on a side of the reciprocating plate facing the belt, and the protruding column is slidably arranged in the moving groove.

[0013] The semiconductor heating device as described above: the semiconductor heating structure comprises a heating disc body, and the heating disc body is detachably mounted on the receiving plate for heating an object.

[0014] The semiconductor heating device as described above: the receiving plate is also slidably provided with a lifting member, the lifting member includes a lifting ring slidably provided on the receiving plate, a longitudinal member is provided on the side of the lifting ring facing the ground, and two groups of the longitudinal members are symmetrically provided along the width direction of the receiving plate, and the two groups of the longitudinal members cooperate with the guide structure symmetrically provided in the housing to drive the lifting ring to be lifted and lowered relative to the receiving plate;

[0015] A lifting block is fixedly arranged on the other side of the lifting ring. At least three groups of the lifting blocks are equidistantly arranged along the circumferential direction of the lifting ring. The three groups of the lifting blocks can position the material placed on the heating plate body.

[0016] The semiconductor heating device as described above: the guide structure includes a guide plate symmetrically fixedly arranged along the width direction of the receiving plate, and the guide plate is provided with a first horizontal groove, a vertical groove, a second horizontal groove and an oblique groove, and a deflection member is arranged between the first horizontal groove and the oblique groove.

[0017] The semiconductor heating device as described above: the deflection member includes a deflection plate rotatably mounted on the guide plate, and the deflection plate is elastically connected to the guide plate via a spring sheet.

[0018] The semiconductor heating device as described above: the lifting assembly includes a driving rod rotatably installed in the casing, and the driving rod is symmetrically arranged in two groups along the width direction of the supporting plate. The two groups of driving rods are both provided with a sleeve tube, and the inner wall of the sleeve tube is formed with a protrusion, and the protrusion is slidably arranged in an annular groove opened on the outer wall of the driving rod, and the two groups of the sleeve tubes are fixedly connected to the switch door.

[0019] The semiconductor heating device as described above: the driving component includes a Maltese cross movement arranged in the casing, and the Maltese cross movement includes a driving wheel, a first driven wheel and a second driven wheel rotatably installed in the casing, a first interlocking wheel is coaxially fixed on the first driven wheel, a second interlocking wheel is coaxially fixed on the second driven wheel, the second interlocking wheel is connected to the pulley through a second interlocking belt, the first interlocking wheel is connected to a rotating rod installed in the casing through a first interlocking belt, and the rotating rod is connected to the driving rod through a bevel gear set.

[0020] A semiconductor heating method is also proposed, using the semiconductor heating device as described above, comprising the following steps:

[0021] Step 1: In the initial state, the switch door is open, the receiving plate protrudes outside the casing, and the lifting block is not inside the heating plate body. After the material is placed on the heating plate body, the servo motor is started, and the driving component will first combine with the reciprocating component, and then the reciprocating component will move, which will drive the receiving plate to retract into the casing;

[0022] Step 2: During the retraction process, the lifting ring, with the cooperation of the guide joint structure, drives the lifting block to protrude from the heating plate body, thereby positioning the material, until the receiving plate is completely retracted into the casing, and the lifting ring drives the lifting block to return to the initial state;

[0023] Step 3: The driving component is separated from the reciprocating component and then combined with the lifting component. The lifting component then drives the switch door to descend, thereby closing the casing so that the heating plate body can perform heating operations later.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] In the embodiment of the present invention, by arranging a lifting assembly in the casing and utilizing the cooperation between the driving rod and the socket ring, it is possible to control and drive the opening and closing door to lift and lower relative to the casing, thereby opening or closing the casing; turning off the heating can effectively prevent external interference, and can also reduce heat loss during the internal heating process; and even if a dangerous situation caused by overheating occurs during the heating process, because the dangerous situation is sealed in a closed environment, it will not spill over, or prolong the time of risk spillover.

[0026] At the same time, by setting a reciprocating assembly, the cooperation between the belt and the reciprocating plate can force the receiving plate to slide relative to the casing, so that the receiving plate can be immersed in the casing or extended out of the casing, thereby facilitating the operator to load or remove the heating plate body arranged on the supporting plate;

[0027] In addition, during the relative sliding of the receiving plate, the columnar material placed on the heating plate body can be positioned by setting a guide structure and a lifting member, and utilizing the cooperation between the two, so that the columnar material can remain coaxial with the heating plate body. At this time, the material in the coaxial state is just located at the heating center of the heating plate. Therefore, in the subsequent heating process, the material can be heated evenly, and the material at the heating center needs a relatively short time to be heated.

[0028] The above-mentioned actions between the switch door and the receiving plate are controlled by a driving component. Under the drive of the driving component, the switch door and the receiving plate perform alternating actions. Due to the locking and positioning function of the driving component, the receiving plate (or the switch door) will not move when the switch door (or the receiving plate) moves, thereby allowing the entire heating process to proceed stably. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a schematic diagram of the structure of a semiconductor heating device.

[0030] Figure 2 This is a schematic diagram of the structure inside the casing of a semiconductor heating device.

[0031] Figure 3 This is a schematic diagram of the structure of the driving component connecting the lifting component and the reciprocating component in the semiconductor heating equipment.

[0032] Figure 4 It is a schematic diagram of the structure of the reciprocating component in the semiconductor heating device.

[0033] Figure 5 This is a schematic diagram of the structure of the connection between the driving component and the lifting component in the semiconductor heating equipment.

[0034] Figure 6 It is a schematic diagram of the structure of the reciprocating component in the semiconductor heating device.

[0035] Figure 7 This is a schematic diagram of the structure of the switch door in the semiconductor heating equipment.

[0036] Figure 8 It is a schematic diagram of the structure of the connection between the lifting member and the receiving plate in the semiconductor heating equipment.

[0037] Fig. 9 This is a schematic diagram of the structure of the lifting parts in the semiconductor heating equipment.

[0038] Fig.10 This is a schematic diagram of the structure of the cooperation between the guide structure and the lifting member in the semiconductor heating equipment.

[0039] Fig.11 It is a structural schematic diagram of the guide structure in the semiconductor heating device.

[0040] In the figure: 1, housing; 101, supporting plate; 102, T-block; 2, receiving plate; 201, mounting seat; 3, switch door; 301, blocking plate; 4, telescopic rod; 5, heating plate body; 6, fixed sleeve; 7, bevel gear set; 8, driving rod; 801, annular groove; 9, sleeve tube; 901, protrusion; 10, belt; 1001, protrusion; 11, pulley; 12, reciprocating plate; 1201, moving groove; 13, guide plate; 1301 , first horizontal slot; 1302, vertical slot; 1303, second horizontal slot; 1304, inclined slot; 14, rotating rod; 15, first linkage wheel; 16, first driven wheel; 17, driving wheel; 1701, trigger rod; 1702, fixed block; 18, second driven wheel; 19, second linkage wheel; 20, lifting block; 2001, sloped surface; 21, longitudinal member; 2101, sliding rod; 22, lifting ring; 23, spring piece; 24, deflection plate. DETAILED DESCRIPTION

[0041] Various exemplary embodiments, features and aspects of the present application will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless otherwise specified.

[0042] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

[0043] In addition, in order to better illustrate the present application, numerous specific details are provided in the specific embodiments below. It should be understood by those skilled in the art that the present application can also be implemented without certain specific details. In some examples, methods, means, and elements well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present application.

[0044] See also Figure 1-Figure 11 In an embodiment of the present invention, a semiconductor heating device includes:

[0045] A housing 1, wherein a reciprocating assembly is disposed in the housing 1, wherein the reciprocating assembly comprises a receiving plate 2 slidably disposed in the housing 1, wherein a semiconductor heating structure is disposed on the receiving plate 2, and wherein the reciprocating assembly can drive the receiving plate 2 to slide relative to the housing 1, thereby forcing the receiving plate 2 to protrude or sink into the housing 1;

[0046] For details, please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 A supporting plate 101 is fixedly arranged in the housing 1, and the supporting plate 101 is arranged along the length direction of the housing 1 ( Figure 1 Two groups are symmetrically arranged in the middle a0 direction, and T-blocks 102 are fixedly arranged on the two groups of supporting plates 101. The T-blocks 102 are slidably arranged in the clamping grooves provided on the back of the receiving plate 2. Under the cooperation between the T-blocks 102 and the clamping grooves, the receiving plate 2 can only slide along the length direction of the housing 1;

[0047] In particular, two sets of telescopic rods 4 are fixedly arranged on the back side of the receiving plate 2, and the telescopic rods 4 are slidably connected to the fixed sleeve 6 arranged in the casing 1. When the receiving plate 2 is driven by the reciprocating assembly and extends to the outside of the casing 1, the telescopic rods 4 can support the extended receiving plate 2 so that the subsequent operator can place the material to be heated on the heating plate body 5 for heating.

[0048] The semiconductor heating structure comprises a heating disc body 5, which is detachably mounted on the receiving plate 2 and is used to heat an object;

[0049] Preferably, see Figure 2 , Figure 3 , Figure 4 , Figure 8 A mounting seat 201 is fixedly provided on the receiving plate 2. When the heating disc body 5 is mounted on the mounting seat 201, the mounting seat 201 can supply power to the heating disc body 5, so that the heating disc body 5 can perform a material heating operation.

[0050] The reciprocating assembly is arranged along the width direction of the housing 1 ( Figure 1Two groups of reciprocating components are symmetrically arranged in the direction of a1 in the middle, each group of which includes a pulley 11 rotatably installed in the housing 1, and two groups of pulleys 11 are arranged along the length direction of the housing 1, and a belt 10 is arranged between the two groups of pulleys 11, and a protruding column 1001 is fixedly arranged on the belt 10, and the protruding column 1001 is connected to the receiving plate 2 through a moving part;

[0051] The reciprocating assembly includes a reciprocating plate 12 fixedly connected to the receiving plate 2, and a moving groove 1201 is formed on the side of the reciprocating plate 12 facing the belt 10, and the protruding column 1001 is slidably arranged in the moving groove 1201;

[0052] Preferably, see Figure 3 , Figure 4 , Figure 7 The reciprocating plate 12 is fixedly connected to the receiving plate 2. In the initial state, the receiving plate 2 extends out of the housing 1. After the material to be heated is placed on the heating plate body 5, the pulley 11 is driven to rotate continuously counterclockwise (combined with Figure 4 ), the protruding column 1001 will move with the belt 10. During the movement, the contact and compression between the protruding column 1001 and the wall of the movable groove 1201 will force the reciprocating plate 12 to drive the receiving plate 2 to retract toward the inside of the casing 1, until the protruding column 1001 moves to the end of the stroke, and the receiving plate 2 is completely immersed in the casing 1. At this time, the casing 1 can provide a closed environment for the heating plate body 5, so that the heating plate body 5 can heat the material later;

[0053] Subsequently, if the pulley 11 is driven to continue to rotate counterclockwise, the reciprocating plate 12 will drive the receiving plate 2 to extend to the outside of the casing 1 with the cooperation of the protruding column 1001 and the movable groove 1201. At this time, the receiving plate 2 extending outside the casing 1 can facilitate the staff to take out the materials on the heating plate body 5 or load the materials.

[0054] The receiving plate 2 is also provided with a lifting member which is slidably disposed on the receiving plate 2. The lifting member includes a lifting ring 22 which is slidably disposed on the receiving plate 2. A longitudinal member 21 is disposed on the side of the lifting ring 22 which faces the ground. The longitudinal member 21 extends along the width direction of the receiving plate 2 ( Figure 1 Two groups of longitudinal members 21 are symmetrically arranged in the middle b0 direction, and the two groups of longitudinal members 21 cooperate with the guide structure symmetrically arranged in the housing 1 to drive the lifting ring 22 to move up and down relative to the receiving plate 2;

[0055] A lifting block 20 is fixedly disposed on the other side of the lifting ring 22. At least three groups of the lifting blocks 20 are equidistantly disposed along the circumferential direction of the lifting ring 22. The three groups of the lifting blocks 20 can position the material placed on the heating plate body 5.

[0056] In particular, see Fig. 9 The lifting block 20 is provided with a sloped surface 2001 on one side facing the axis of the lifting ring 22. When the lifting ring 22 rises, the sloped surface 2001 can cooperate with the columnar material placed on the heating disk body 5, thereby forcing the columnar material to remain coaxial with the heating disk body 5. At this time, the columnar material in the coaxial state will be at the heating center of the heating disk body 5, so the heating speed of the material will be relatively fast, thereby shortening the use time of material heating.

[0057] The guide structure includes a guide plate 13 symmetrically fixedly arranged along the width direction of the receiving plate 2, and the guide plate 13 is provided with a first horizontal groove 1301, a vertical groove 1302, a second horizontal groove 1303 and an oblique groove 1304, and a deflection member is provided between the first horizontal groove 1301 and the oblique groove 1304;

[0058] The deflection member includes a deflection plate 24 rotatably mounted on the guide plate 13, and the deflection plate 24 is elastically connected to the guide plate 13 via a spring sheet 23;

[0059] Preferably, please combine Figure 3 , Figure 4 , Fig.10 , Fig.11 , the first horizontal groove 1301, the vertical groove 1302, the second horizontal groove 1303 and the inclined groove 1304 constitute a "right-angled trapezoid" structure. In the initial state, the sliding rod 2101 fixedly arranged on the longitudinal member 21 is slidably arranged at the connection between the first horizontal groove 1301 and the inclined groove 1304. At this time, the end of the deflection plate 24 is in contact with the first horizontal groove 1301. In combination with the above, when the receiving plate 2 is driven by the reciprocating assembly to retract into the casing 1, the sliding rod 2101 will drive the lifting ring 22 to rise along the longitudinal direction of the casing 1 under the guidance of the deflection plate 24. At this time, the lifting block 20 fixed on the lifting ring 22 will slowly protrude from the heating plate body 5;

[0060] During the ascending process of the lifting block 20, the sloped surface 2001 cooperates with the columnar material, and pushes the columnar material to remain coaxial with the heating plate body 5, until the slide bar 2101 moves to engage with the second horizontal groove 1303, the lifting block 20 completely protrudes from the heating plate body 5, and the material is also coaxial with the heating plate body 5, and then with the continued movement of the receiving plate 2, the slide bar 2101 slides along the second horizontal groove 1303, during which the position of the lifting block 20 remains unchanged, and the three groups of lifting blocks 20 cooperate with each other to clamp the material, so that when the receiving plate 2 moves, the material will not be displaced on the heating plate body 5;

[0061] After the protruding column 1001 drives the reciprocating plate 12 to move to the end of the stroke, the receiving plate 2 is completely immersed in the casing 1. At this time, the slide bar 2101 moves to the connection between the second horizontal groove 1303 and the vertical groove 1302. Then, the slide bar 2101 will slide along the vertical groove 1302 under the influence of gravity of the lifting ring 22. After the slide bar 2101 slides to the connection between the first horizontal groove 1301 and the vertical groove 1302, the lifting block 20 returns to the initial position to facilitate the subsequent heating plate body 5 to perform heating operations.

[0062] For further information, see Figure 1 , Figure 2 , Figure 3 , Figure 7 The housing 1 is also provided with a switch door 3 which is slidably mounted thereon. The switch door 3 is connected to a lifting assembly disposed in the housing 1. The lifting assembly can drive the switch door 3 to slide along the vertical direction of the housing 1, thereby opening and closing the housing 1.

[0063] Preferably, see Figure 1 , Figure 2 , Figure 3 , Figure 7 A blocking plate 301 is fixedly provided on the switch door 3, and two groups of the blocking plates 301 are symmetrically provided along the width direction of the casing 1. The two groups of the blocking plates 301 cooperate with the switch door 3 to completely block the open end of the casing 1, so that when the receiving plate 2 is completely immersed in the casing 1, the casing 1 can provide a closed space for the heating operation of the heating disk body 5, and the heating disk body 5 in the closed space can heat the material more quickly.

[0064] For details, please refer to Figure 2 , Figure 3 , Figure 5 The lifting assembly includes a driving rod 8 rotatably mounted in the housing 1, and two groups of the driving rods 8 are symmetrically arranged along the width direction of the receiving plate 2. The two groups of driving rods 8 are sleeved with a sleeve 9, and the inner wall of the sleeve 9 is formed with a protrusion 901. The protrusion 901 is slidably arranged in an annular groove 801 provided on the outer wall of the driving rod 8, and the two groups of the sleeve 9 are fixedly connected to the switch door 3;

[0065] Preferably, see Figure 1 , Figure 2 , Figure 3In the initial state, the switch door 3 is in the open state, at which time the sleeve tube 9 is away from the receiving plate 2. When the receiving plate 2 is completely immersed in the casing 1 and is in a stationary state, the driving rod 8 is driven to rotate half a circle. At this time, the contact and extrusion of the groove wall of the annular groove 801 on the protrusion 901 will force the sleeve tube 9 to drive the switch door 3 to descend along the axial direction of the driving rod 8 until the sleeve tube 9 moves to the lowest point. The switch door 3 cooperates with the blocking plate 301 to completely block the casing 1, thereby forming a closed environment for the casing 1.

[0066] For further information, see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , a semiconductor heating device, further comprising a driving component, the driving component is arranged in the housing 1, connected to the lifting component and the reciprocating component, and can drive the reciprocating component and the lifting component to perform alternating actions;

[0067] The driving assembly includes a Maltese cross movement disposed in the housing 1, and the Maltese cross movement includes a driving wheel 17, a first driven wheel 16 and a second driven wheel 18 rotatably mounted in the housing 1;

[0068] Preferably, see Figure 5 The rotating shaft of the driving wheel 17 is coaxially fixedly connected with the output shaft of the servo motor fixedly mounted on the housing 1. A trigger rod 1701 and a fixing block 1702 are fixedly arranged on the side of the driving wheel 17 away from the servo motor, and the first driven wheel 16 and the second driven wheel 18 are equidistantly provided with four groups of grooves adapted to the trigger rod 1701 along the cylindrical direction thereof. When the output shaft of the servo motor drives the driving wheel 17 to rotate counterclockwise for one circle (combined with Figure 5 ), the trigger rod 1701 will successively engage with the grooves on the second driven wheel 18 and the first driven wheel 16, and then drive the second driven wheel 18 and the first driven wheel 16 to keep rotating one quarter of a circle in the opposite direction with the driving wheel 17, and when the driving wheel 17 is engaged with the second driven wheel 18 or the first driven wheel 16, due to the action of the fixing block 1702, the driving wheel 17 can position the first driven wheel 16 or the second driven wheel 18, so that when the driving wheel 17 moves, it can only drive the first driven wheel 16 or the second driven wheel 18 to move.

[0069] A first linkage wheel 15 is coaxially fixedly disposed on the first driven wheel 16, a second linkage wheel 19 is coaxially fixedly disposed on the second driven wheel 18, the second linkage wheel 19 is connected to the pulley 11 via a second linkage belt, the first linkage wheel 15 is connected to a rotating rod 14 installed in the housing 1 via a first linkage belt, and the rotating rod 14 is connected to the driving rod 8 via a bevel gear set 7;

[0070] For details, please refer to Figure 5 The bevel gear set 7 includes a first bevel gear and a second bevel gear, wherein the first bevel gear is coaxially fixedly connected to the rotating rod 14, and the second bevel gear is coaxially fixedly connected to the driving rod 8;

[0071] It should be noted that the radius of the first linkage wheel 15 is twice the radius of the rotating rod 14, and the radius of the second linkage wheel 19 is multiple times the radius of the pulley 11;

[0072] After the material is placed on the heating plate body 5, the driving wheel 17 will first drive the second driven wheel 18 to rotate a quarter of a circle. At this time, the second linkage wheel 19 that follows the second driven wheel 18 to rotate a quarter of a circle clockwise can drive the pulley 11 to rotate multiple circles, causing the belt 10 to rotate half a circle, so as to drive the receiving plate 2 to completely sink into the housing 1, and then the driving wheel 17 is separated from the second driven wheel 18;

[0073] Next, the driving wheel 17 will be combined with the first driven wheel 16, and drive the first driven wheel 16 to rotate a quarter of a turn clockwise. At this time, the first linkage wheel 15, which follows the first driven wheel 16 to rotate a quarter of a turn clockwise, can drive the rotating rod 14 to rotate half a circle. During the process of the rotating rod 14 rotating half a circle, the first bevel gear and the second bevel gear enter into a meshing transmission state, which can force the driving rod 8 to rotate half a circle, and then drive the switch door 3 to block the casing 1, so that the heating plate body 5 can heat the material subsequently.

[0074] After the material heating is completed, the servo motor reverses, and the driving component will first cause the switch door 3 to open, and then drive the reciprocating component to move, pushing the receiving plate 2 out of the casing 1. During this process, the slide bar 2101 will slide along the first horizontal groove 1301. During the sliding process, the slide bar 2101 will contact the deflection plate 24 and push the deflection plate 24 to deflect in the direction away from the first horizontal groove 1301. At this time, the spring piece 23 undergoes elastic deformation until the receiving plate 2 returns to the initial position. The slide bar 2101 slides to the first horizontal groove 1301 and contacts and cooperates with the inclined groove 1304. Then the spring piece 23 releases its elastic potential energy, which will force the deflection plate 24 to return to the initial position, thereby facilitating the next heating operation.

[0075] A semiconductor heating method is also proposed, using the semiconductor heating device as described above, comprising the following steps:

[0076] Step 1: In the initial state, the switch door 3 is opened, the receiving plate 2 protrudes outside the housing 1, and the lifting block 20 is not inside the heating plate body 5. After the material is placed on the heating plate body 5, the servo motor is started, and the driving component will first be combined with the reciprocating component, and then the reciprocating component will move, which will drive the receiving plate 2 to retract into the housing 1;

[0077] Step 2: During the retraction process, the lifting ring 22, with the cooperation of the guide joint structure, drives the lifting block 20 to protrude from the heating plate body 5, thereby positioning the material, until the receiving plate 2 is completely retracted into the housing 1, and the lifting ring 22 drives the lifting block 20 to fall back to the initial state;

[0078] Step 3: The driving assembly is separated from the reciprocating assembly and then combined with the lifting assembly. The lifting assembly then drives the switch door 3 to descend, thereby closing the housing 1 so that the heating plate body 5 can perform heating operations later.

[0079] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0080] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A semiconductor heating device, characterized in that: include: A casing (1), wherein a reciprocating assembly is arranged in the casing (1), and the reciprocating assembly comprises a receiving plate (2) slidably arranged in the casing (1); a supporting plate (101) is fixedly arranged in the casing (1), and two groups of the supporting plates (101) are symmetrically arranged along the length direction of the casing (1), and T-shaped blocks (102) are fixedly arranged on the two groups of supporting plates (101), and the T-shaped blocks (102) are slidably arranged in a clamping groove provided on the back side of the receiving plate (2), and under the cooperation between the T-shaped blocks (102) and the clamping groove, the receiving plate (2) can only slide along the length direction of the casing (1); Two groups of telescopic rods (4) are fixedly arranged on the back of the receiving plate (2), and the telescopic rods (4) are slidably connected to a fixed sleeve (6) arranged in the casing (1). When the receiving plate (2) is driven by the reciprocating assembly to extend to the outside of the casing (1), the telescopic rods (4) can support the extended receiving plate (2); A semiconductor heating structure is provided on the receiving plate (2), and the reciprocating assembly can drive the receiving plate (2) to slide relative to the housing (1), thereby forcing the receiving plate (2) to protrude or sink into the housing (1); The casing (1) is also provided with a switch door (3) which is slidably arranged thereon, the switch door (3) being connected to a lifting assembly arranged in the casing (1), the lifting assembly being capable of driving the switch door (3) to slide along the vertical direction of the casing (1), thereby opening and closing the casing (1); A driving assembly, arranged in the housing (1), connected to the lifting assembly and the reciprocating assembly, and capable of driving the reciprocating assembly and the lifting assembly to perform alternating movements; Two groups of the reciprocating components are symmetrically arranged along the width direction of the housing (1), each group of the reciprocating components comprises a pulley (11) rotatably mounted in the housing (1), two groups of the pulleys (11) are arranged along the length direction of the housing (1), a belt (10) is arranged between the two groups of the pulleys (11), a protruding column (1001) is fixedly arranged on the belt (10), and the protruding column (1001) is connected to the receiving plate (2) via a moving part; The reciprocating assembly comprises a reciprocating plate (12) fixedly connected to the receiving plate (2), a moving groove (1201) being provided on a side of the reciprocating plate (12) facing the belt (10), and the protruding column (1001) being slidably arranged in the moving groove (1201); The semiconductor heating structure comprises a heating disc body (5), the heating disc body (5) being detachably mounted on the receiving plate (2) and being used for heating an object; A lifting member is also slidably arranged on the receiving plate (2), and the lifting member comprises a lifting ring (22) slidably arranged on the receiving plate (2), a longitudinal member (21) is arranged on the side of the lifting ring (22) facing the ground, and two groups of the longitudinal members (21) are symmetrically arranged along the width direction of the receiving plate (2), and the two groups of the longitudinal members (21) cooperate with the guide structure symmetrically arranged in the housing (1) to drive the lifting ring (22) to be lifted and lowered relative to the receiving plate (2); A lifting block (20) is fixedly arranged on the other side of the lifting ring (22), and at least three groups of the lifting blocks (20) are arranged equidistantly along the circumferential direction of the lifting ring (22). The three groups of the lifting blocks (20) can position the material placed on the heating plate body (5).

2. A semiconductor heating device according to claim 1, characterized in that: The guide structure comprises a guide plate (13) symmetrically fixedly arranged along the width direction of the receiving plate (2), the guide plate (13) being provided with a first horizontal groove (1301), a vertical groove (1302), a second horizontal groove (1303) and an oblique groove (1304), and a deflection member being arranged between the first horizontal groove (1301) and the oblique groove (1304).

3. A semiconductor heating device according to claim 2, characterized in that: The deflection member comprises a deflection plate (24) rotatably mounted on the guide plate (13); the deflection plate (24) is elastically connected to the guide plate (13) via a spring sheet (23).

4. A semiconductor heating device according to claim 1, characterized in that: The lifting assembly comprises a driving rod (8) rotatably mounted in the housing (1), and two groups of the driving rods (8) are symmetrically arranged along the width direction of the receiving plate (2), and the two groups of the driving rods (8) are both sleeved with a sleeve tube (9), and the inner wall of the sleeve tube (9) is formed with a protrusion (901), and the protrusion (901) is slidably arranged in an annular groove (801) formed on the outer wall of the driving rod (8), and the two groups of the sleeve tubes (9) are fixedly connected to the switch door (3).

5. A semiconductor heating device according to claim 4, characterized in that: The driving assembly comprises a Maltese cross movement arranged in the housing (1), the Maltese cross movement comprising a driving wheel (17), a first driven wheel (16) and a second driven wheel (18) rotatably mounted in the housing (1), a first linkage wheel (15) being coaxially fixedly mounted on the first driven wheel (16), a second linkage wheel (19) being coaxially fixedly mounted on the second driven wheel (18), the second linkage wheel (19) being connected to the pulley (11) via a second linkage belt, the first linkage wheel (15) being connected to a rotating rod (14) mounted in the housing (1) via a first linkage belt, and the rotating rod (14) being connected to the driving rod (8) via a bevel gear set (7).

6. A semiconductor heating method, comprising a semiconductor heating device as claimed in claim 1, characterized in that: The steps include: Step 1: In the initial state, the switch door (3) is opened, the receiving plate (2) protrudes outside the housing (1), and the lifting block (20) is not inside the heating plate body (5). After the material is placed on the heating plate body (5), the servo motor is started, and the driving component is first coupled with the reciprocating component, and then the reciprocating component moves, which drives the receiving plate (2) to retract into the housing (1); Step 2: During the retraction process, the lifting ring (22) will, with the cooperation of the guide joint structure, drive the lifting block (20) to protrude from the heating plate body (5), thereby positioning the material, until the receiving plate (2) is completely retracted into the housing (1), and the lifting ring (22) drives the lifting block (20) to fall back to the initial state; Step three: the driving component is separated from the reciprocating component and then combined with the lifting component. The lifting component then drives the switch door (3) to descend, thereby closing the housing (1) so that the heating plate body (5) can perform heating operations.

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