Device and method for embedding copper in PCB (Printed Circuit Board)

Abstract

The invention discloses a device and method for embedding copper into a PCB, and relates to the technical field of PCBs, the device for embedding copper into the PCB comprises M copper bins arranged side by side, the two ends of each copper bin are provided with a discharging port and a pushing assembly respectively, and copper blocks are sequentially stacked between the pushing assemblies and the discharging ports; a fixing assembly is arranged on the side, away from the copper stock bin, of the discharging opening. PCBs are placed between the fixing assembly and the discharging ports, target milling grooves in the PCBs correspond to the discharging ports in a one-to-one mode, and M is an integer larger than 0; and when the pushing assembly pushes the copper block in the copper stock bin to move into the target milling groove, the fixing assembly is used for fixing the copper block in the target milling groove. According to the invention, the operation is simple, repeated material taking and direction adjustment are not needed, the copper burying efficiency is improved, and the copper burying qualified rate of the PCB is also improved.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB boards, and in particular to a device and method for embedding copper in a PCB board. Background Art

[0002] With the continuous development of the PCB manufacturing industry, the internal power consumption of PCB boards is getting larger and larger, and the heat dissipation channels are getting more and more crowded, resulting in a sharp increase in the overall heat of the PCB boards. Long-term untimely heat dissipation can easily lead to a decline in the electrical performance of the PCB boards or even damage. In order to meet the heat dissipation requirements of high-frequency and high-speed PCB boards, it is usually necessary to add copper blocks to the PCB boards, that is, the embedded copper process. At present, the general operation method is to manually place the copper blocks into the milled grooves after milling the grooves. However, manual operation requires repeated material removal and adjustment of the direction of the copper blocks, which is extremely inefficient.

[0003] In the prior art, in order to reduce the difficulty of placing the copper block into the installation slot and improve the efficiency of copper embedding, most of the methods directly modify the PCB board, and there are very few tools to assist in the copper embedding operation. A Chinese patent with publication number CN 216700480U discloses a high-speed automatic copper embedding device, which improves the copper embedding efficiency of the PCB board by setting a feeding system, a mounting machine and a blanking machine. However, the device requires a high degree of intelligent control, including a robotic arm, a visual system, a computer control, etc., and the equipment manufacturing cost is high. In addition, the copper blocks are placed on the PCB board one by one by sucking them in, and then a pressing mechanism is required to flatten them, and the steps are too cumbersome. Summary of the invention

[0004] In view of this, the present application aims to solve the problems in the related art to at least a certain extent. One of the purposes of the present application is to provide a device for embedding copper in a PCB board, which can embed copper quickly.

[0005] A device for embedding copper on a PCB board, comprising: M copper silos arranged in parallel, wherein both ends of the copper silos are respectively provided with a discharge port and a pushing assembly, and copper blocks are stacked and placed in sequence between the pushing assembly and the discharge port; a fixing assembly is provided on the side of the discharge port away from the copper silo; a PCB board is placed between the fixing assembly and the discharge port, and a target milling groove in the PCB board corresponds to the discharge port one by one, and M is an integer greater than 0;

[0006] When the pushing component pushes the copper block in the copper bin to move into the target milling groove, the fixing component is used to fix the copper block in the target milling groove.

[0007] The present application is provided with M parallel copper silos, which can be stacked to accommodate a number of copper blocks, reducing the number of times to take materials during copper burying operations and avoiding repeated taking materials. The pushing component can push the copper blocks in the copper silo to move toward the discharge port, and then push the copper blocks into the target milling grooves. The fixing component can fix the copper blocks in the target milling grooves. Through the cooperation of the pushing component and the fixing component, the copper blocks in the copper silo can be pushed into and fixed in the target milling grooves. By rationally arranging the positional relationship among the copper silo, the pushing component, and the fixing component, the copper burying operation can be carried out smoothly and the efficiency of copper burying can be improved.

[0008] In a preferred technical solution of the present application, the fixing component includes a tape, the tape is attached to a side of the PCB board away from the copper material bin, and an adhesive is provided on a side of the tape facing the target milling groove.

[0009] Since the target milling groove is hollow on the PCB board, if the copper block is directly pushed into the target milling groove, the copper block is likely to fall from the other end of the push. For this reason, tape is required to fix the copper block in the target milling groove. The tape is provided with adhesive on the side facing the target milling groove. The copper block can be attached to the copper material bin by the adhesive, which can conveniently, effectively and quickly fix the copper block in the target milling groove.

[0010] In a preferred technical solution of the present application, the fixing assembly further comprises a first pressing platform, the first pressing platform is located on a side of the fixing component away from the discharge port, and the first pressing platform can move towards or away from the discharge port.

[0011] The first pressing platform can achieve abutment and position limiting of the adhesive tape, preventing the copper block from being pushed out of the range of the target milling groove, so that the copper block pushed into the target milling groove does not need additional flattening work.

[0012] In a preferred technical solution of the present application, the fixing assembly also includes a first pressing plate and a first cylinder, the first pressing plate and the first pressing platform are arranged in parallel, and the first pressing plate is located on the side of the first pressing platform away from the copper silo; the first cylinder is fixed in the first pressing plate, and the output end of the first cylinder passes through the first pressing plate to connect to the first pressing platform.

[0013] In a preferred technical solution of the present application, it also includes a accommodating platform, which is located between the PCB board and the copper material bin, and the accommodating platform is provided with accommodating through holes corresponding to the target milling grooves in the PCB board.

[0014] The accommodating platform can facilitate the placement and alignment of the PCB board. During the copper embedding operation, the target milling groove is aligned with the accommodating through hole one by one, and the discharge port is also corresponding to the accommodating through hole one by one, so that the copper block in the copper silo can pass through the discharge port and the accommodating through hole into the target milling groove.

[0015] In a preferred technical solution of the present application, the accommodating platform is provided with a first positioning component, and the PCB board is provided with a second positioning component that is compatible with the first positioning component.

[0016] The accommodating platform is set up to allow the target milling groove to be quickly aligned with the discharge ports of several copper material bins. The cooperation of the first positioning component and the second positioning component can facilitate the accommodating platform to limit and fix the PCB board, so as to realize the rapid alignment of the target milling groove in the PCB board with the discharge ports of M copper material bins, thereby improving the efficiency of copper embedding operations.

[0017] In a preferred technical solution of the present application, the pushing assembly further comprises a servo electric cylinder, a push rod and a second press platform, and the servo electric cylinder is simultaneously connected to the push rods in the M copper silos through the second press platform.

[0018] The pushing component can be pushed manually or with the help of a servo electric cylinder to simultaneously drive M copper bins for copper burying. Specifically, the servo electric cylinder can be controlled by a PLC control system. Since there are M copper bins, each copper bin requires a push rod to push the internal copper block toward the discharge port, so there are M push rods. The servo electric cylinder can act on the M push rods at the same time with the help of the second press table, thereby pushing the copper block in the copper bin toward the discharge port. Finally, the copper block closest to the discharge port is pushed into the target milling slot and fixed in the target milling slot by the fixing component.

[0019] In a preferred technical solution of the present application, a pressure sensor is provided in the pushing assembly, and the pressure sensor is communicatively connected with the servo electric cylinder.

[0020] When performing copper embedding operations, setting up a pressure sensor can control the size of the feedback pressing force and monitor the pressure of the feedback pushing component in real time to avoid confusion caused by the copper blocks stacked in the copper silo due to the up and down movement speed being too fast. It can also prevent the copper blocks from being bent in the target milling groove due to excessive pressure on the pushing component.

[0021] In a preferred technical solution of the present application, it also includes a second pressing plate, which is arranged in parallel with the second pressing platform, and the second pressing plate is located on the side of the second pressing platform away from the copper material bin, the servo electric cylinder is fixed in the second pressing plate, and the output end of the servo electric cylinder passes through the second pressing plate to connect to the second pressing platform.

[0022] The second object of the present application is to provide a method for embedding copper in a PCB board, comprising:

[0023] Align the outlets of M copper silos with the target milling grooves in the PCB board in sequence; push the copper block in the copper silo into the target milling groove in the PCB board by using the pushing component; fix the copper block in the target milling groove in the PCB board by using the fixing component; reset the pushing component and take out the PCB board.

[0024] Furthermore, after taking out the PCB board, the method further includes: replacing the PCB board and repeating the copper embedding process.

[0025] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art:

[0026] After the copper block is loaded into the copper silo, the copper burying operation can be carried out. Align the outlets of the M copper silos with the target milling grooves on the PCB board one by one, use the pushing component to push the copper block in the copper silo into the target milling groove, fix the copper block in the target milling groove, reset the pushing component and take out the PCB board that has completed the copper burying operation, and then carry out the next round of operation until the copper burying operation of all PCB boards is completed. The number of copper silos in this application can be set according to the number of target milling grooves, so that the copper burying task of a whole PCB board can be completed by performing a copper burying operation once. By setting the fixed component, the copper block is fixed in the target milling groove. By cooperating with the pushing component, the fixed component and the copper silo, and setting the size of the copper block to match the target milling groove, the copper block can be accurately filled in the target milling groove, without the need to repeatedly take the material and adjust the direction, thereby reducing the deviation of the copper burying operation. The whole process can be controlled by a computer system or manually operated. The operation process is simple, which greatly improves the efficiency of copper burying of the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0029] In the attached figure:

[0030] Figure 1 A schematic diagram of a device for embedding copper on a PCB provided by an embodiment of the present invention;

[0031] Figure 2 A partial schematic diagram of a pushing mechanism and a accommodating platform provided in an embodiment of the present invention.

[0032] Reference numerals:

[0033] 10. Push rod; 11. Push plate; 12. Second press table; 13. Servo electric cylinder; 14. Second press plate; 15. Guide rod; 16. Linear bearing; 20. Copper silo; 21. Copper block; 30. Accommodating platform; 31. PCB board; 311. Target milling groove; 32. PCB board alignment pin; 33. Copper silo alignment piece; 34. Adhesive tape; 40. First press table; 41. First cylinder; 42. First press plate. DETAILED DESCRIPTION

[0034] In order to have a clearer understanding of the technical features, purposes and effects of the present application, the specific implementation methods of the present application are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "back", "up", "down", "left", "right", "longitudinal", "horizontal", "vertical", "horizontal", "top", "bottom", "inside", "outside", "head", "tail", etc. are based on the directions or positional relationships shown in the accompanying drawings, are constructed and operated in a specific direction, and are only for the convenience of describing the present technical solution, rather than indicating that the mechanism or element referred to must have a specific direction, and therefore cannot be understood as a limitation to the present application.

[0035] It should also be noted that, unless otherwise clearly specified and limited, the terms such as "installed", "connected", "connected", "fixed", "set" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. When an element is referred to as being "on" or "under" another element, the element can be "directly" or "indirectly" located on the other element, or there may be one or more intermediate elements. The terms "first", "second", "third", etc. are only for the convenience of describing the present technical solution, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", "third", etc. can explicitly or implicitly include one or more of the features. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0036] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0037] Example 1

[0038] like Figure 1 As shown, this embodiment provides a device for embedding copper on a PCB board, comprising: M copper silos 20 arranged in parallel, wherein both ends of the copper silos 20 are respectively provided with a discharge port and a pushing component, and copper blocks 21 are stacked and placed in sequence between the pushing component and the discharge port; a fixing component is provided on the side of the discharge port away from the copper silo 20; a PCB board 31 is placed between the fixing component and the discharge port, and a target milling groove in the PCB board 31 corresponds to the discharge port one by one, and M is an integer greater than 0;

[0039] When the pushing component pushes the copper block 21 in the copper bin 20 to move into the target milling groove 311, the fixing component is used to fix the copper block 21 in the target milling groove 311. The device of the present application can be adaptively adjusted according to the size of different PCB boards 31 and the position of the target milling groove 311, such as the number of copper bins 20 and the size and number of other components, so as to flexibly adapt to the copper embedding operation of different types of PCB boards.

[0040] like Figure 1 As shown, this embodiment also provides a method for burying copper on a PCB board, comprising: aligning the outlets of M copper material bins 20 with the target milling groove 311 in the PCB board in sequence; pushing the copper block 21 in the copper material bin 20 into the target milling groove 311 in the PCB board 31 by a pushing component; fixing the copper block 21 in the target milling groove 311 in the PCB board 31 by a fixing component; resetting the pushing component and taking out the PCB board 31.

[0041] Furthermore, the PCB board 31 is replaced and the above copper embedding process is repeated.

[0042] In the present application, in order to improve efficiency, the corresponding number of copper material bins 20 can be set according to the number of target milling grooves 311. When performing copper burying operations, the pushing component is used to push the copper block 21 in the copper material bin 20 into the corresponding target milling groove 311. After the copper block 21 is pushed into the target milling groove 311, the fixing component can limit and fix the buried copper block 21, thereby achieving the purpose of quickly burying copper on the PCB board 31. There is no need to repeatedly take materials and adjust the direction of the copper block 21, which greatly improves the copper burying efficiency.

[0043] Specifically, the fixing component includes an adhesive tape 34 , which is attached to a side of the PCB board 31 away from the copper material bin 20 , and an adhesive is provided on a side of the adhesive tape 34 facing the target milling groove 311 .

[0044] The target milling groove 311 is in a hollow state on the PCB board. When the copper embedding operation is performed, the tape 34 is attached to the side of the PCB board 31 away from the copper material bin 20, and the copper block pushed into the target milling groove 311 by the pushing component will be fixed in the target milling groove 311 by the adhesive.

[0045] Since the resistance of the tape 34 to the pushing component is small, in order to prevent the copper block 21 from being pushed beyond the range of the target milling groove 311, the fixing component also includes a first press platform 40, which is located on the side of the fixing member away from the discharge port, and the first press platform 40 can move in a direction close to or away from the discharge port. During the copper block loading process, the first press platform 40 moves in a direction close to the discharge port and can fit with the PCB board 31. When the copper block 21 is pushed into the target milling groove 311 by the pushing component, due to the presence of the first press platform 40, the first press platform 40 can block the pushing component from moving all the time, thereby preventing the copper block 21 from being pushed beyond the boundary range of the target milling groove 311, and no additional flattening work is required after the copper block 21 is pushed into the target milling groove 311. Specifically, the fixing assembly further includes a first pressing plate 42 and a first cylinder 41. The first pressing plate 42 and the first pressing platform 40 are arranged in parallel, and the first pressing plate 42 is located on the side of the first pressing platform 40 away from the copper silo 20; the first cylinder 41 is fixed in the first pressing plate 42, and the output end of the first cylinder 41 passes through the first pressing plate 42 to connect the first pressing platform 40. The power source for the first pressing platform 40 to move toward or away from the discharge port can come from the first cylinder 41, and the first cylinder 41 can be controlled by the PLC control system. A plurality of parallel guide rods 15 are arranged on the edges of the first pressing plate 42 and the first pressing platform 40, and the first pressing platform 40 is slidably connected to the guide rods 15 through linear bearings 16. The output end of the first cylinder 41 can be connected to the center position of the first pressing platform 40. When the first cylinder 41 is extended or retracted, it can drive the first pressing platform 40 to slide along the guide rods 15 to achieve the pressing or moving away of the PCB board 31. The connection mode of the linear bearing 16 in conjunction with the guide rod 15 can ensure stable sliding at various positions of the first press table 40 and improve the feeding efficiency of the copper block 21 .

[0046] After the copper block 21 is embedded in the target milling groove 311, the first press plate 40 is moved away from the discharge port to remove the copper embedded target milling groove 311. After the copper block 21 is embedded in the target milling groove 311, the first press plate 40 is controlled to move away from the discharge port to remove the copper embedded PCB board 31.

[0047] This embodiment provides a device and method for quickly embedding copper on a PCB board. The M parallel copper material bins 20 are provided to avoid repeated material extraction and do not need to repeatedly adjust the direction of the copper block 21. The combination of the fixing component and the pushing component allows the copper block 21 to be quickly pushed into and fixed in the target milling groove 311, greatly improving the efficiency of embedding copper on the PCB board 31. The copper embedding device of the present application can be manually operated or controlled by automated equipment during the copper embedding operation, and the corresponding device can be manufactured in combination with market demand and user cost requirements.

[0048] Example 2

[0049] like Figure 1 As shown, this embodiment provides a device for embedding copper on a PCB board, comprising: M copper silos 20 arranged in parallel, wherein both ends of the copper silos 20 are respectively provided with a discharge port and a pushing component, and copper blocks 21 are stacked and placed in sequence between the pushing component and the discharge port; a fixing component is provided on the side of the discharge port away from the copper silo; a PCB board 31 is placed between the fixing component and the discharge port, and a target milling groove 311 in the PCB board 31 corresponds to the discharge port one by one, and M is an integer greater than 0;

[0050] When the pushing component pushes the copper block 21 in the copper bin 20 to move into the target milling groove 311 , the fixing component is used to fix the copper block 21 in the target milling groove 311 .

[0051] Optionally, a receiving platform 30 is further included, and the receiving platform 30 is located between the PCB board 31 and the copper material bin 20 , and the receiving platform 30 is provided with receiving through holes corresponding to the target milling grooves 311 in the PCB board 31 .

[0052] When performing the copper embedding operation, the target milling groove 311 in the PCB board 31 needs to correspond one-to-one with the discharge port of the copper material bin 20. For the convenience of operation, the PCB board 31 can be placed on the receiving platform 30. The receiving platform 30 is provided with receiving through holes corresponding one-to-one to the target milling groove 311 in the PCB board 31. Each receiving through hole is also correspondingly connected to the discharge port of the copper material bin 20. When the target milling groove 311 corresponds one-to-one to the receiving through holes, it also corresponds one-to-one to the discharge port of the copper material bin 20.

[0053] Since the purpose of placing the PCB board on the accommodating platform is to make the target milling groove 311 in the PCB board 31 correspond to the discharge port of the copper material bin 20 one by one, in order to facilitate quick alignment, the accommodating platform 30 is provided with a first positioning component, and the PCB board 31 is provided with a second positioning component adapted to the first positioning component. Figure 2As shown, specifically, the first positioning member is a retractable PCB board alignment pin 32, and the second positioning member can be a PCB board alignment hole. The fixing assembly also includes a first press platform, which is located on the side of the fixing member away from the discharge port, and the first press platform can move in a direction close to or away from the discharge port. By passing the PCB board alignment pin 32 through the PCB board alignment hole, the target milling groove 311 can be quickly aligned with the accommodating through hole. When the first press platform 40 and the accommodating platform 30 clamp the PCB board 31, the PCB board alignment pin 32 can be compressed by the first press platform 40, so that the PCB board alignment pin 32 can achieve the positioning function while avoiding the first press platform 40 from clamping the PCB board 31. In order to facilitate the alignment of the discharge port of the copper silo 20 with the accommodating through hole, a copper silo alignment member 33 is provided on the side of the accommodating platform 30 close to the copper silo, and the copper silo alignment member 33 is connected to the accommodating through hole. The copper bin alignment member 33 can be in the shape of a slot, fixing the copper bin 20 on the accommodating platform 30, and allowing the discharge port of the copper bin 20 to communicate with the accommodating through hole. The PCB board alignment pin 32 and the copper bin alignment member 33 facilitate the rapid installation of the PCB board 31 and the copper bin 20 on the accommodating platform 30, and the copper blocks 21 in the M parallel copper bins 20 can sequentially pass through the discharge port and the accommodating through hole into the target milling groove 311, and be fixed in the target milling groove 311 by the fixing assembly.

[0054] This embodiment adds a receiving platform and a positioning assembly to facilitate the rapid installation of a large number of copper silos 20 and the rapid alignment of the discharge port with the target milling groove 311, thereby improving the efficiency of the copper embedding operation.

[0055] Example 3

[0056] like Figure 1 and Figure 2 As shown, this embodiment provides a device for embedding copper on a PCB board, comprising: M copper silos 20 arranged in parallel, wherein both ends of the copper silos 20 are respectively provided with a discharge port and a pushing component, and copper blocks 21 are stacked and placed in sequence between the pushing component and the discharge port; a fixing component is provided on the side of the discharge port away from the copper silo; a PCB board 31 is placed between the fixing component and the discharge port, and a target milling groove 311 in the PCB board 31 corresponds to the discharge port one by one, and M is an integer greater than 0;

[0057] When the pushing component pushes the copper block 21 in the copper bin 20 to move into the target milling groove 311 , the fixing component is used to fix the copper block 21 in the target milling groove 311 .

[0058] Optionally, the pushing assembly includes a servo electric cylinder 13, a push rod 10 and a second press platform 12, and the servo electric cylinder 13 is simultaneously connected to the push rods 10 in M ​​copper silos 20 through the second press platform 12.

[0059] When performing copper embedding operation, the servo electric cylinder 13 is used to act on the push rod 10, and the push rod 10 pushes the copper block 21 in the copper bin 20 to move toward the discharge port until the copper block 21 closest to the discharge port is pushed into the target milling groove 311. In practice, in order to ensure that the force on the copper block 21 is uniform, a push plate 11 is fixedly connected to one end of the push rod 10 close to the copper block 21, and the push plate 11 abuts against the copper block 21. The servo electric cylinder 13 can be controlled by a PLC control system, and the pushing assembly can be moved in a step-by-step manner to ensure that the copper blocks 21 stacked in the copper bin 20 will not be messed up due to up and down movement.

[0060] In order to ensure that the pushing component can apply pressure to the push rod 10 with a constant pressure, the copper block 21 pushed into the target milling groove 311 can be fixed on the fixed component without being bent, thereby improving the quality of copper embedding. A pressure sensor is provided in the pushing component, and the pressure sensor is communicatively connected with the servo electric cylinder 13. In this embodiment, considering the accuracy of measurement, the convenience of installation and the stability of installation, the pressure sensor is arranged at the position where the push rod 10 abuts the push plate 11, so that the pressure sensor can accurately feedback the size of the pressing force, monitor the pressure size of the feedback pushing component in real time, and improve the quality of copper embedding.

[0061] This embodiment provides a device for embedding copper on a PCB board, wherein a push assembly includes a servo electric cylinder 13, a push rod 10, and a second press table 12. The power provided by the servo electric cylinder 13 can simultaneously push the copper blocks 21 in the M parallel copper bins 20 into the corresponding target milling grooves 311, thereby improving the efficiency of embedding copper on the PCB board 32. The addition of a pressure sensor can better facilitate the user to control the push pressure and improve the quality of embedding copper.

[0062] In the present application, a plurality of copper blocks 21 are sequentially placed inside the copper bin 20, such as Figure 1 and Figure 2As shown, multiple copper blocks 21 are stacked in the vertical direction, so that multiple PCB boards 31 can be loaded in sequence, instead of refilling the copper blocks 21 in the copper bin 20 each time the loading is completed. After the PCB board is buried with copper, the servo electric cylinder 13 drives the second pressing plate 14 to reset, so that the copper blocks 21 in the copper bin 20 are separated from the copper blocks adhered to the target milling groove 311. As the number of loading times gradually increases, the number of copper blocks 21 in the copper bin 20 becomes smaller and smaller, so the servo electric cylinder 13 does not need to reset to the original end every time. The present application can limit the path of the servo electric cylinder 13 to gradually decrease each time it is reset, and the reduction value is basically consistent with the thickness of the copper block 21, so that after pressing, the servo electric cylinder 13 drives the push plate 11 and the push rod 10 and the remaining copper blocks 21 in the copper bin 20 to drop a fixed distance, so that the adhered copper blocks and the remaining copper blocks are fully separated, and at the same time, it can also avoid the servo electric cylinder 13 from doing useless work and increasing power consumption.

[0063] It also includes a second pressing plate 14, which is arranged in parallel with the second pressing platform 12, and the second pressing plate 14 is located on the side of the second pressing platform 12 away from the copper material bin 20, the servo electric cylinder 13 is fixed in the second pressing plate 14, and the output end of the servo electric cylinder 13 passes through the second pressing plate 14 to connect to the second pressing platform 12.

[0064] The power source for the second press plate 12 to move toward or away from the discharge port can come from the servo electric cylinder 13, and the servo electric cylinder 13 can be controlled by the PLC control system. The edges of the second press plate 14 and the second press plate 12 are provided with a plurality of parallel guide rods 15, and the second press plate 12 is slidably connected to the guide rods 15 through linear bearings 16. The output end of the servo electric cylinder 13 can be connected to the center position of the second press plate 12. When the servo electric cylinder 13 is extended or retracted, it can drive the second press plate 12 to slide along the guide rods 15, thereby driving the copper bin to rise and press or descend and reset. The linear bearing 16 cooperates with the connection method of the guide rods 15 to ensure stable sliding at various positions of the second press plate 12 and improve the feeding efficiency of the copper block 21.

[0065] In the present application, the first pressing plate 42, the accommodating platform 30 and the second pressing plate 14 are arranged in parallel, so the guide rod connecting the second pressing plate 14 and the second pressing platform 12, and the guide rod connecting the first pressing plate 42 and the first pressing platform 40 can be set to the same guide rod.

[0066] In the present application, the guide rod 15 simultaneously passes through the edges of the first pressing plate 42, the accommodating platform 30, and the second pressing plate 14, and the first pressing plate 42, the accommodating platform 30, and the second pressing plate 14 are parallelly arranged structures, and the first pressing plate 40 can be lifted and lowered relative to the first pressing plate 42 to achieve abutment against the top of the PCB board 31; the second pressing plate 12 can be lifted and lowered relative to the second pressing plate 14 to achieve loading or resetting of the copper block 21 in the copper bin 20. The first pressing plate 42, the accommodating platform 30, and the second pressing plate 14 form the main frame of the device of the present application, and with the installation of the copper bin 20 and the PCB board 31, rapid batch copper embedding of the target milling groove 311 of the PCB board can be achieved.

[0067] It can be understood that the above embodiments only express the preferred implementation methods of the present application, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present application; it should be pointed out that for ordinary technicians in this field, without departing from the concept of the present application, the above-mentioned technical features can be freely combined, and several deformations and improvements can be made, which all belong to the protection scope of the present application; therefore, all equivalent changes and modifications made to the scope of the claims of the present application should belong to the scope covered by the claims of the present application.

Claims

1. A device for embedding copper in a PCB, characterized in that: include: M copper silos are arranged in parallel, and a discharge port and a pushing assembly are respectively arranged at both ends of the copper silos, and copper blocks are stacked and placed in sequence between the pushing assembly and the discharge port; a fixing assembly is arranged on the side of the discharge port away from the copper silo; a PCB board is placed between the fixing assembly and the discharge port, and a target milling groove in the PCB board corresponds to the discharge port one by one, and M is an integer greater than 0; When the pushing component pushes the copper block in the copper bin to move into the target milling groove, the fixing component is used to fix the copper block in the target milling groove.

2. The device for embedding copper in a PCB according to claim 1, characterized in that: The fixing component comprises an adhesive tape, which is attached to a side of the PCB board away from the copper material bin, and an adhesive is arranged on a side of the adhesive tape facing the target milling groove.

3. The device for embedding copper in a PCB board according to claim 2, characterized in that: The fixing assembly further comprises a first pressing platform, which is located on a side of the fixing member away from the material discharge port, and the first pressing platform can move towards or away from the material discharge port.

4. The device for embedding copper in a PCB according to claim 3, characterized in that: The fixing assembly also includes a first pressing plate and a first cylinder. The first pressing plate and the first pressing platform are arranged in parallel, and the first pressing plate is located on a side of the first pressing platform away from the copper silo. The first cylinder is fixed in the first pressing plate, and the output end of the first cylinder passes through the first pressing plate to connect to the first pressing platform.

5. The device for embedding copper in a PCB according to claim 1, characterized in that: It also includes a receiving platform, which is located between the PCB board and the copper material bin, and is provided with receiving through holes corresponding to the target milling grooves in the PCB board.

6. The device for embedding copper in a PCB according to claim 5, characterized in that: The accommodating platform is provided with a first positioning component, and the PCB board is provided with a second positioning component adapted to the first positioning component.

7. The device for embedding copper in a PCB according to claim 1, characterized in that: The pushing assembly includes a servo electric cylinder, a push rod and a second press platform, and the servo electric cylinder is simultaneously connected to the push rods in M ​​copper bins through the second press platform.

8. The device for embedding copper in a PCB according to claim 7, characterized in that: A pressure sensor is provided in the pushing component, and the pressure sensor is communicatively connected with the servo electric cylinder.

9. The device for embedding copper in a PCB according to claim 7, characterized in that: It also includes a second pressing plate, which is arranged in parallel with the second pressing platform, and the second pressing plate is located on the side of the second pressing platform away from the copper material bin. The servo electric cylinder is fixed in the second pressing plate, and the output end of the servo electric cylinder passes through the second pressing plate to connect to the second pressing platform.

10. A method for embedding copper in a PCB board, using the device for embedding copper in a PCB board as claimed in claim 1 to embed copper, characterized in that: include: Align the outlets of the M copper bins with the target milling slots in the PCB board in sequence; The pushing component pushes the copper block in the copper bin into the target milling groove in the PCB board; The fixing component fixes the copper block in the target milling groove in the PCB board; Push the component to reset and take out the PCB; Replace the PCB board and repeat the copper embedding process.

Images