Semiconductor vacuum chamber seal groove repair method

Abstract

The application discloses a semiconductor vacuum cavity sealing groove repairing method, which comprises the following steps: S1, clamping and fixing a workpiece, wherein the workpiece is provided with a necking sealing groove which needs to be repaired; S2, abutting a machining surface of a repairing device to a groove of the sealing groove, wherein the machining surface is in a circular arc structure; and S3, adjusting the height of the repairing device relative to the workpiece, transmitting pressure to the groove through the machining surface, and making the groove shrink under the extrusion of the machining surface. The application provides a semiconductor vacuum cavity sealing groove repairing method, which can repair the sealing groove when the size of the sealing groove is too large to be matched with a sealing ring, reduce the size of the sealing groove, and ensure the sealing effect.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a method for repairing sealing grooves in semiconductor vacuum cavities. Background Technology

[0002] With the continuous innovation of semiconductor technology, the semiconductor vacuum system plays an increasingly prominent role in the semiconductor manufacturing process, becoming more critical and essential. It is mainly composed of several key components, including a vacuum chamber, vacuum pump, vacuum gauge, gas supply system, and control system. These components work together to ensure the precise manufacturing of semiconductor materials and devices. The vacuum chamber, as the core component of the entire system, provides the primary operating space for the manufacturing of semiconductor materials and devices. It must possess excellent sealing performance to effectively isolate external air and other impurities, ensuring the purity of the operating environment; it must also possess excellent sealing performance to maintain a high vacuum level to meet the requirements of the extremely low-pressure environment in semiconductor manufacturing.

[0003] For example, publication number "CN118360582A" discloses a "vacuum chamber mechanism," which includes a vacuum pump; a sealed chamber with a vacuum cavity; an adsorption mechanism disposed within the sealed chamber, the adsorption mechanism including at least three supporting suction tubes for adsorbing and fixing products; and a control pipeline assembly, in which the vacuum pump, the sealed chamber, and the adsorption mechanism are all connected, and the control pipeline assembly is used to evacuate and break the vacuum in the sealed chamber and the adsorption mechanism. However, in practical applications, due to processing errors and wear during use, the sealing groove size may be too large, resulting in the sealing groove being unable to fit the sealing ring, thus reducing the sealing effect. Summary of the Invention

[0004] In view of the problem mentioned in the background art that the sealing groove of the vacuum cavity is too large and cannot be matched with the sealing ring during manufacturing and use, the present invention provides a method for repairing the sealing groove of a semiconductor vacuum cavity. When the sealing groove is too large to be matched with the sealing ring, the sealing groove can be repaired, the size of the sealing groove can be reduced, and the sealing effect can be guaranteed.

[0005] To achieve the above objectives, the present invention adopts the following technical solution.

[0006] A method for repairing a sealing groove in a semiconductor vacuum cavity includes the following steps:

[0007] S1. The workpiece is clamped and fixed, and the workpiece is provided with a constricted sealing groove that needs to be repaired.

[0008] S2. The machined surface of the repair device is brought into contact with the opening of the sealing groove, wherein the machined surface is an arc-shaped structure;

[0009] S3. Adjust the height of the repair device relative to the workpiece, and transmit the pressure to the groove through the machining surface. The groove is squeezed by the machining surface and shrinks.

[0010] The airtightness of the vacuum chamber is crucial for the proper operation of the entire semiconductor vacuum system; it is an indispensable and stringent requirement. Therefore, vacuum chamber sealing grooves mostly employ a dovetail structure with high sealing performance, coupled with a corresponding sealing ring. The width of the sealing groove becomes critical to ensuring the airtightness of the entire vacuum chamber and even the entire semiconductor vacuum system, and must be strictly controlled. However, the dovetail-shaped sealing groove structure is characterized by a wide interior and a narrow opening, making it difficult to manufacture. Furthermore, impacts and wear during operation often lead to sealing grooves exceeding their width, affecting sealing performance and practicality. In severe cases, the sealing groove may even fail to hold the sealing ring, causing it to detach from the groove. Therefore, it is necessary to repair the dimensions of the sealing groove. Currently, there are generally two methods for repairing excessively wide sealing grooves: the first is to add material and weld it in, filling the excess width before remanufacturing; the second is to modify the groove design to use a larger sealing groove size. Both methods are uneconomical, complex, and difficult to implement, and in many cases, neither method can achieve the desired repair.

[0011] Because the sealing groove has a dovetail-shaped structure, which is wider inside and narrower outside, if it is repaired by adding materials in the first way, the difficulty will increase. After welding, the surface will be uneven or even the entire flange will be deformed. It is also easy to produce air holes. It often requires repeated welding to meet the usage requirements. The rework after welding is also a difficult operation, which is often much more expensive than processing a new sealing groove.

[0012] The second method, which involves increasing the size of the primary sealing groove, can meet the usage requirements, but it requires purchasing corresponding sealing rings that match the groove for installation. Furthermore, since the size of the sealing grooves in each vacuum chamber increases differently, it is necessary to purchase sealing rings of various sizes accordingly, which undoubtedly wastes resources and increases time costs.

[0013] Current repair methods are all expensive and difficult, often worsening the seal groove's characteristics or rendering it unusable, forcing it to be scrapped. Alternatively, some vacuum chambers, due to structural limitations, cannot accommodate larger seal grooves and must be scrapped, requiring replacement with a new vacuum chamber.

[0014] Therefore, in this application, a repair method is used, which involves abutting the machined surface of the repair device against the opening of the sealing groove, applying pressure to the repair device, and generating a downward-sloping extrusion force on the opening through the arc-shaped machined surface. Since the opening is a constricted structure (generally a dovetail shape), the opening will move downward under the extrusion force, thereby shrinking the opening and allowing the inclined edge inside the sealing groove to better fit the sealing ring, thereby improving the sealing effect.

[0015] Preferably, the groove includes an upper contact surface that abuts against the machining surface and moves downwards under pressure. It is necessary to control the contact between the machining surface and the upper contact surface of the groove, wherein the upper contact surface is the side of the groove furthest from the bottom of the sealing groove. This ensures that when the machining surface applies pressure to the groove against the upper contact surface, it prevents the groove from being squeezed to the sides, allowing the groove to be squeezed downwards, thereby reducing the size of the groove.

[0016] Preferably, the arc diameter of the processed surface is D, and the groove width is L, where D ≥ 10L. Setting the arc diameter of the processed surface to be more than ten times the groove width avoids the processed surface from exerting pressure on both sides of the groove, thereby preventing the groove from expanding and allowing the groove to deform downwards and shrink.

[0017] Preferably, in step S2, the center of the machined surface is aligned with the center of the groove. Aligning the center of the machined surface with the center of the groove ensures that the machined surface is symmetrically positioned on both sides of the groove. This results in uniform pressure exerted on both sides of the groove by the machined surface, leading to consistent settlement on both sides of the groove and improved tightness of the connection with the sealing ring.

[0018] Preferably, when the overall size of the sealing groove needs to be repaired, the machining surface is moved along the extension direction of the sealing groove in step S3. Specifically, when the overall size of the sealing groove is too large, moving the machining surface along the extension direction of the sealing groove allows for the repair of the sealing groove size in the area traversed by the machining surface. During one complete movement cycle of the machining surface, its vertical position must remain unchanged to ensure uniform repair volume throughout the entire sealing groove repair process.

[0019] Preferably, in step S3, the height between the repair device and the workpiece is progressively reduced. In step S3, the relative height between the repair device and the workpiece is progressively reduced, that is, the pressure generated on the sealing groove is gradually increased, thereby ensuring the stability of the repair process. When the sealing groove needs to be repaired as a whole, the height between the repair device and the workpiece is reduced only after the machining surface has run a complete cycle along the extension trajectory of the sealing groove.

[0020] Preferably, a repair device includes a base, with a mounting groove at its end. A workpiece is rotatably connected within the mounting groove, and the workpiece has a machined surface that abuts against the groove opening. This application provides a repair device in which the base is the main body and can be mounted on a machine tool or machining center. The movement of the repair device is achieved by actuation. The mounting groove at the end of the base (the side closest to the workpiece) allows for rotatable connection of the workpiece. The portion of the workpiece that abuts against the sealing groove is the machined surface. Due to the rotatable connection, the workpiece rolls on the sealing groove as the base moves along its extension direction, reducing frictional wear on the sealing groove and ensuring smoothness during the repair process.

[0021] Preferably, the substrate includes a guide substrate and a processing substrate, wherein the processing substrate is rotatably connected to the guide substrate, and the guide substrate drives the processing substrate to move along the extension direction of the sealing groove. The base is divided into two parts: a guide base for guiding and a machining base for machining the sealing groove. The machining base is rotatably connected to the guide base, and the machining base can rotate around the guide base without being restricted in the direction of rotation. During operation, the guide base pulls the machining base to move. During height adjustment, the machining base adjusts synchronously with the guide base as the guide base moves up and down. Therefore, during operation, the guide base is in front and the machining base is behind. The position of the guide base is limited by the left and right sides of the sealing groove opening. On the bending path, the machining base can adaptively center itself relative to the sealing groove, thereby ensuring the uniformity of pressure applied to the sealing groove from left to right. The guide base moves with the machining path set by the machine tool or machining center. Even if there is an error between the movement trajectory of the guide base and the extension trajectory of the sealing groove, the machining base can adaptively correct itself due to the flexible rotation between the machining base and the guide base.

[0022] Preferably, the machined part and the mounting groove are connected by a universal swivel connection. This universal swivel connection allows the machined part to rotate omnidirectionally relative to the sealing groove, improving flexibility. When the entire sealing groove needs repair, the machined surface needs to move along the extension direction of the sealing groove. Furthermore, when the sealing groove has an irregular shape or contains arc-shaped bends, the universal swivel of the machined part allows for more flexible and stable movement through these areas, ensuring the quality of the repair.

[0023] Preferably, the processed component includes a processed sphere and planetary spheres. The spherical surface of the processed sphere is the processed surface, and the planetary spheres abut against the processed sphere and the mounting groove, respectively. The processed sphere is the part that needs to be compressed into the sealing groove, while the planetary spheres are disposed inside the sealing groove, serving as a component between the processed sphere and the sealing groove. The planetary spheres abut against the sealing groove and the processed sphere, thereby improving the rotational flexibility of the processed sphere. Simultaneously, the substrate transmits pressure to the processed sphere through the planetary spheres, ensuring that the pressure acts on the area where the processed sphere and planetary spheres abut against each other. In the direction of force transmission, this pressure is closer to the contact point between the processed sphere and the sealing groove, ensuring the stability of the compression process and preventing the processed sphere from rotating flexibly under pressure.

[0024] The beneficial effects of this invention are as follows:

[0025] (1) It can shrink the sealing groove without generating additional consumables, can meet the design size, ensure the repair effect, save processing time, and will not cause excessive damage to the vacuum chamber;

[0026] (2) It can perform overall repair of the sealing groove, ensure the uniformity of the repair on the left and right sides of the sealing groove, and maintain the smoothness of the repair process;

[0027] (3) Improved the mobility of the repair device during the repair process, ensuring a more stable force transmission effect;

[0028] (4) It can ensure the adaptability of the repair device to the extended shape of the sealing groove, and ensure that the processing substrate can always adaptively maintain the center position of the sealing groove during the processing. Attached Figure Description

[0029] Figure 1 This is an isometric view of the present invention.

[0030] Figure 2 This is a schematic diagram of the structure of the present invention.

[0031] Figure 3 This is a partial cross-sectional view of the repair device in this invention.

[0032] Figure 4 yes Figure 3 A magnified view of a portion of point A in the middle.

[0033] Figure 5 This is an isometric view of Example 2.

[0034] In the picture:

[0035] 1. Workpiece;

[0036] 2 sealing groove, 21 groove opening, 211 upper contact surface;

[0037] 3. Base body, 31. Mounting groove, 32. Guide base body, 33. Machining base body, 34. Adapter sleeve;

[0038] 4. Machining parts; 41. Machining spheres; 42. Planetary spheres; 421. Machining surfaces;

[0039] 5. Repair device. Detailed Implementation

[0040] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0041] Example 1:

[0042] like Figure 1 , 2 As shown, a method for repairing a sealing groove in a semiconductor vacuum cavity includes the following steps:

[0043] S1. The workpiece 1 is clamped and fixed, and the workpiece 1 is provided with a constricted sealing groove 2 that needs to be repaired.

[0044] S2. The machined surface 421 of the repair device 5 is brought into contact with the groove 21 of the sealing groove 2. The machined surface 421 has an arc-shaped structure.

[0045] S3. Adjust the height of the repair device 5 relative to the workpiece 1, and transmit the pressure to the groove 21 through the processing surface 421. The groove 21 is squeezed by the processing surface 421 and shrinks.

[0046] The airtightness of the vacuum chamber is crucial for the proper operation of the entire semiconductor vacuum system; it is an indispensable and stringent requirement. Therefore, the sealing groove 2 of the vacuum chamber mostly adopts a dovetail-shaped structure with a corresponding sealing ring for high sealing performance. The width of the sealing groove 2 becomes the key to ensuring the airtightness of the entire vacuum chamber and even the entire semiconductor vacuum system, and must be strictly controlled. However, the dovetail-shaped sealing groove 2 structure is characterized by a wide interior and a narrow opening, making it difficult to manufacture. Coupled with bumps and wear during operation, the sealing groove 2 often becomes excessively wide, affecting sealing performance and practicality. In severe cases, the sealing groove 2 may even fail to hold the sealing ring, causing it to detach from the groove. Therefore, it is necessary to repair the dimensions of the sealing groove. Currently, there are generally two methods to repair excessively wide sealing grooves 2: the first is to add material and weld it in, filling the excessively wide portion before remanufacturing; the second is to change the groove design to use a larger sealing groove 2. Both methods are uneconomical, the repair process is complex and difficult, and in many cases, neither method can achieve the desired repair.

[0047] Because the sealing groove 2 has a dovetail-shaped structure, which is wider inside and narrower outside, if it is repaired by adding materials in the first way, the difficulty will increase. After welding, the surface will be uneven or even the entire flange will be deformed. It is also easy to produce air holes. It often requires repeated welding to meet the usage requirements. The rework after welding is also a difficult operation, which is often much more expensive than processing a new sealing groove 2.

[0048] The second method, which involves increasing the size of the primary sealing groove 2, can meet the usage requirements, but it requires purchasing corresponding sealing rings that match the grooves for installation and use. Furthermore, since the size of the sealing groove 2 varies for each vacuum chamber, it is necessary to purchase sealing rings of various sizes accordingly, which undoubtedly wastes resources and increases time costs.

[0049] Current repair methods are all expensive and difficult, often worsening the characteristics of the sealing groove 2 or rendering it unusable and requiring scrapping. Alternatively, some vacuum cavities, due to structural limitations, cannot increase the size of the sealing groove 2 and must be scrapped, requiring replacement with a new vacuum cavity.

[0050] Therefore, in this application, a repair method is used, which involves abutting the machined surface 421 of the repair device 5 against the groove 21 of the sealing groove 2, applying pressure to the repair device 5, and generating a downwardly inclined extrusion force on the groove 21 through the arc-shaped machined surface 421. Since the groove 21 is a constricted structure (generally a dovetail groove shape), the groove 21 will move downward under the extrusion force, thereby shrinking the groove 21, so that the inclined edge inside the sealing groove 2 can better fit the sealing ring, thereby improving the sealing effect.

[0051] like Figure 2 As shown, the groove 21 includes an upper contact surface 211 that abuts against the machining surface 421. The upper contact surface 211 moves downwards under pressure. It is necessary to control the contact between the machining surface 421 and the upper contact surface 211 of the groove 21. The upper contact surface 211 is located on the side of the groove 21 furthest from the bottom of the sealing groove 2. This ensures that when the machining surface 421 applies pressure to the groove 21 against the upper contact surface 211, it prevents the groove 21 from being squeezed to the sides, allowing it to be squeezed downwards, thereby reducing the size of the groove 21.

[0052] like Figure 2 As shown, the arc diameter of the machined surface 421 is D, and the width of the groove 21 is L, where D ≥ 10L. Setting the arc diameter of the machined surface 421 to be more than ten times the width of the groove 21 avoids the machined surface 421 from exerting pressure on both sides of the groove 21, thereby preventing the groove 21 from being enlarged and allowing the groove 21 to deform downwards, thus reducing the size of the groove 21.

[0053] like Figure 2As shown, in step S2, the center of the machining surface 421 is aligned with the center of the groove 21. Aligning the center of the machining surface 421 with the center of the groove 21 ensures that the machining surface 421 is symmetrically positioned on the left and right sides of the groove 21. This results in uniform pressure exerted by the machining surface 421 on the left and right sides of the groove 21, leading to uniform settlement on both sides of the groove 21 and improving the tightness of the connection with the sealing ring.

[0054] When the overall size of the sealing groove 2 needs to be repaired, the machining surface 421 is moved along the extension direction of the sealing groove 2 in step S3. When the overall size of the sealing groove 2 is too large, the machining surface 421 is moved along the extension direction of the sealing groove 2. During the movement of the machining surface 421 along the extension direction of the sealing groove 2, the size of the sealing groove 2 can be repaired in the area traversed by the machining surface 421. During one complete movement cycle of the machining surface 421, its vertical position must remain unchanged to ensure uniform repair volume throughout the entire sealing groove during this repair process.

[0055] In step S3, the height between the repair device 5 and the workpiece 1 is progressively reduced. In step S3, the relative height between the repair device 5 and the workpiece 1 is progressively reduced, that is, the pressure generated on the sealing groove 2 is gradually increased, thereby ensuring the stability of the repair process. When the sealing groove 2 needs to be repaired as a whole, the height between the repair device 5 and the workpiece 1 needs to be reduced after the machining surface 421 runs along the extension trajectory of the sealing groove 2 for a complete cycle.

[0056] Example 2:

[0057] like Figure 3 As shown, a repair device includes a base 3, with a mounting groove 31 at one end of the base 3. A workpiece 4 is rotatably connected within the mounting groove 31, and the workpiece 4 has a machining surface 421 that abuts against the groove 21. This application provides a repair device in which the base 3 is the main body of the repair device and can be mounted on a machine tool or machining center. The movement of the repair device is achieved by driving it. The mounting groove 31 at the end of the base 3 (the side closest to the workpiece 1) allows the workpiece 4 to be rotatably connected. The part of the workpiece 4 that abuts against the sealing groove 2 is the machining surface 421. Due to the rotatable connection, the workpiece 4 rolls on the sealing groove 2 during the movement of the base 3 along the extension direction of the sealing groove 2, thereby reducing frictional wear on the sealing groove 2 and ensuring smoothness during the repair process.

[0058] like Figure 4As shown, the machining part 4 and the mounting groove 31 are connected by a universal swivel connection. This universal swivel connection allows the machining part 4 to rotate omnidirectionally relative to the sealing groove 2, improving flexibility. When the sealing groove 2 needs overall repair, the machining surface 421 needs to move along the extension direction of the sealing groove 2. When the overall shape of the sealing groove 2 is irregular or has arc-shaped bends, the universal swivel of the machining part 4 allows for more flexible and stable movement through this area, thus ensuring the quality of the repair.

[0059] like Figure 4 As shown, the processing component 4 includes a processing sphere 41 and a planetary sphere 42. The spherical surface of the processing sphere 41 is the processing surface 421, and the planetary sphere 42 abuts against the processing sphere 41 and the mounting groove 31 respectively. The processing component 4 includes a processing sphere 41 and a planetary sphere 42, wherein the processing sphere 41 is the part that needs to be compressed into the sealing groove 2, while the planetary sphere 42 is disposed inside the sealing groove 2, serving as a component between the processing sphere 41 and the sealing groove 2. The planetary sphere 42 abuts against the sealing groove 2 and the processing sphere 41, thereby improving the rotational flexibility of the processing sphere 41. At the same time, the base 3 transmits pressure to the processing sphere 41 through the planetary sphere 42, so that the pressure acts on the area where the processing sphere 41 and the planetary sphere 42 abut against each other. In the direction of force transmission, it is closer to the abutment position between the processing sphere 41 and the sealing groove 2, ensuring the stability of the compression, while preventing the processing sphere 41 from still being able to rotate flexibly under pressure.

[0060] The assembly and working process of this embodiment is as follows: In this embodiment, the base 3 of the repair device is held by a machine tool, and the size is reduced by processing the ball 41 to apply pressure and roll along the center line of the sealing groove 2 to squeeze the groove 21 area. Then, the size can be restored to meet the requirements of high-precision sealing by slightly processing the machine tool or simple local manual processing.

[0061] Matrix 3 Structure Description: The shape is designed to fit into a tool holder that can be clamped onto a machine tool. It can be held in fixtures on lathes and machining centers. The lower mounting groove 31 holds the planetary sphere 42 and the central sphere sequentially. The opening is tapered to retain the inserted steel balls within the mounting groove 31. The mounting groove 31 requires quenching treatment to achieve a hardness between HR55 and 62.

[0062] Machining sphere 41 and planetary sphere 42: Ensure their surface roughness is above 1.6Ra and their hardness is between HR60 and HR66. They can be purchased on the market or obtained from discarded bearings.

[0063] First, clamp the base 3 of this device onto the machine tool (if the sealing groove 2 is a complete circle, it can be done on a lathe; if the sealing groove 2 is square or other more complex shapes, it can be done on a machining center). Clamp the workpiece 1 onto the machine tool worktable. Then, align the center of the machining ball 41 with the center line of the sealing groove 2. Adjust the height of the base 3 so that the pressure is transmitted to the machining ball 41 through the planetary ball 42, generating a certain pressure on both sides of the sealing groove 2. The initial pressure does not need to be too high. In this way, the machining ball 41 will squeeze the area on both sides of the sealing groove 2, causing the opening size of the sealing groove 2 to shrink. Then, following the processing program, the machine slowly runs along the centerline of the sealing groove 2. Because there is rolling friction between the planetary sphere 42 and the processing sphere 41, the processing sphere 41 will also roll. As the processing sphere 41 rolls over both sides of the sealing surface for a full revolution, the opening size of the sealing groove 2 will shrink evenly by a certain size. At this time, use a measuring tool to measure the groove width. If the groove opening 21 is still too large, adjust the height of the base 3 again to apply secondary pressure to the sealing groove 2, and run the program again for one revolution. Repeat this process until all dimensions meet the requirements or are slightly smaller. Generally, 2-3 cycles are sufficient to make the groove width meet the requirements.

[0064] After the groove 21 is compressed to the appropriate size, the two sides of the groove width are machined and chamfered according to the method for machining the new sealing groove 2. Then, the burrs are removed manually. The repaired sealing groove 2 has the same performance as the new vacuum chamber, and its appearance is almost identical to that of the new vacuum chamber.

[0065] Example 3:

[0066] like Figure 5As shown, unlike Embodiment 1, in this embodiment, the base 3 includes a guide base 32 and a processing base 33. The processing base 33 is rotatably connected to the guide base 32. The guide base 32 drives the processing base 33 to move along the extension direction of the sealing groove 2. In this embodiment, the guide base and the processing base are connected by an adapter sleeve 34. The adapter sleeve fits onto the guide base, and the connection between the guide base and the processing base can be either rotatable or fixed. The base 3 is configured into two parts: a guide base 32 for guiding and a processing base 33 for processing the sealing groove 2. The processing base 33 is rotatably connected to the guide base 32. The processing base 33 can rotate around the guide base 32 without being restricted in the direction of rotation. During operation, the guide base 32 pulls the processing base 33 to move. During height adjustment, as the guide base 32 moves up and down, the processing base 33 adjusts synchronously with the guide base 32. Therefore, during operation, the guide base 32 is in front, and the processing base 33 is in the front. The machining base 33 is located at the rear, and the position of the guide base 32 is limited by the left and right sides of the groove 21 of the sealing groove 2. On the bending path, the machining base 33 can adaptively center itself relative to the sealing groove 2, thereby ensuring the uniformity of pressure applied to the sealing groove 2 from left to right. The guide base 32 moves with the machining path set by the machine tool or machining center. Even if there is an error between the movement trajectory of the guide base 32 and the extension trajectory of the sealing groove 2, the machining base 33 can also adaptively correct itself due to the flexible rotation between the machining base 33 and the guide base 32.

[0067] The repair device in this embodiment further includes: a base 3, with a mounting groove 31 at its end, and a machined part 4 rotatably connected within the mounting groove 31. The machined part 4 has a machined surface 421 that abuts against the groove 21. This application provides a repair device in which the base 3 is the main body of the repair device and can be mounted on a machine tool or machining center. The movement of the repair device is achieved by driving it. The mounting groove 31 at the end of the base 3 (the side closest to the workpiece 1) rotatably connects to the machined part 4. The part of the machined part 4 that abuts against the sealing groove 2 is the machined surface 421. Due to the rotatable connection, the machined part 4 rolls on the sealing groove 2 during the movement of the base 3 along the extension direction of the sealing groove 2, thereby reducing frictional wear on the sealing groove 2 and ensuring smoothness during the repair process. The machined part 4 and the sealing groove 2 are connected by a universal rotatable connection. The machining component 4 and the sealing groove 2 are connected by a universal joint, allowing the machining component 4 to rotate omnidirectionally relative to the sealing groove 2, thus improving flexibility. When the sealing groove 2 needs to be repaired as a whole, the machining surface 421 needs to move along the extension direction of the sealing groove 2. When the overall shape of the sealing groove 2 is irregular or has arc transitions, the universal rotation of the machining component 4 allows for more flexible and stable movement through this area, thus ensuring the quality of the repair. The machining component 4 includes a machining sphere 41 and a planetary sphere 42. The spherical surface of the machining sphere 41 is the machining surface 421, and the planetary sphere 42 abuts against the machining sphere 41 and the mounting groove 31, respectively. The processing component 4 includes a processing ball 41 and a planetary ball 42. The processing ball 41 is the part that needs to be extruded into the sealing groove 2, while the planetary ball 42 is disposed inside the sealing groove 2 as a component between the processing ball 41 and the sealing groove 2. The planetary ball 42 abuts against the sealing groove 2 and the processing ball 41, thereby improving the rotational flexibility of the processing ball 41. At the same time, the base 3 transmits pressure to the processing ball 41 through the planetary ball 42, so that the pressure acts on the area where the processing ball 41 and the planetary ball 42 abut. In the direction of force transmission, it is closer to the abutment position between the processing ball 41 and the sealing groove 2, ensuring the stability of extrusion, while preventing the processing ball 41 from still being able to rotate flexibly under pressure.

[0068] The assembly and operation process of this embodiment is as follows: The base 3 of this embodiment includes a guide base 32 and a processing base 33, wherein the guide base 32 and the processing base 33 are rotatably connected, the processing base 33 can revolve around the guide base 32, the axis of the processing base 33 is parallel to that of the guide base 32, and the guide base 32 is a cylindrical structure; In this embodiment, the guide base 32 of this repair device is clamped by a machine tool, and the size is reduced by applying pressure by the processing ball 41 and rolling along the center line of the sealing groove 2 to squeeze the groove opening 21 area. Then, the size can be restored to meet the requirements of its high-precision sealing use by slightly processing the machine tool or simply performing local manual processing.

[0069] During the processing, the machine tool clamps the guide base 32 and plans the motion path. The processing base 33 moves with the guide base 32. When moving along the extension direction of the sealing groove 2, the processing base 33 is driven by the guide base 32. However, the left and right positions of the processing base 33 are limited by the abutment areas on both sides of the groove 21. Even if there is a difference between the travel path of the guide base 32 and the extension path of the sealing groove 2, the groove 21 can still limit the processing base 33, so that the processing base 33 can correct its direction relative to the guide base 32, thereby ensuring that the guide base 32 is in the center position.

[0070] Matrix 3 Structure Description: The shape is designed to fit into a tool holder that can be clamped onto a machine tool. It can be held in fixtures on lathes and machining centers. The lower mounting groove 31 holds the planetary sphere 42 and the central sphere sequentially. The opening is tapered to retain the inserted steel balls within the mounting groove 31. The mounting groove 31 requires quenching treatment to achieve a hardness between HR55 and 62.

[0071] Machining sphere 41 and planetary sphere 42: Ensure their surface roughness is above 1.6Ra and their hardness is between HR60 and HR66. They can be purchased on the market or obtained from discarded bearings.

[0072] First, clamp the guide base 32 of this device onto the machine tool (if the sealing groove 2 is a complete circle, it can be done on a lathe; if the sealing groove 2 is square or other more complex shapes, it can be done on a machining center). Then, clamp the workpiece 1 onto the machine tool worktable. Next, align the center of the machining ball 41 on the machining base 33 with the center line of the sealing groove 2. Adjust the height of the guide base 32 (the guide base 32 drives the machining base 33 to move up and down synchronously) so that pressure is transmitted to the machining ball 41 through the planetary ball 42, generating a certain pressure on both sides of the sealing groove 2. The initial pressure does not need to be too high; in this way, the machining ball 41 will apply pressure to the sealing groove 2. The compression on both sides causes the opening of the sealing groove 2 to shrink. Then, following the processing program, it slowly moves along the center line of the sealing groove 2. Because there is rolling friction between the planetary sphere 42 and the processing sphere 41, the processing sphere 41 will also roll. As the processing sphere 41 rolls over both sides of the sealing surface for a full revolution, the opening of the sealing groove 2 will shrink evenly by a certain size. At this time, the groove width is measured with a measuring tool. If the groove opening 21 is still too large, the height of the base 3 is adjusted again to apply secondary pressure to the sealing groove 2, and the program is run again for one revolution. This process is repeated until all dimensions meet the requirements or are slightly smaller. Generally, 2-3 cycles are sufficient to make the groove width meet the requirements.

[0073] After the groove 21 is compressed to the appropriate size, the two sides of the groove width are machined and chamfered according to the method for machining the new sealing groove 2. Then, the burrs are removed manually. The repaired sealing groove 2 has the same performance as the new vacuum chamber, and its appearance is almost identical to that of the new vacuum chamber.

Claims

1. A method for repairing a sealing groove in a semiconductor vacuum cavity, characterized in that, It includes the following steps: S1. The workpiece (1) is clamped and fixed. The workpiece (1) is provided with a constricted sealing groove (2) that needs to be repaired. S2. The machined surface (421) of the repair device (5) is brought into contact with the groove (21) of the sealing groove (2), wherein the machined surface (421) is an arc-shaped structure; S3. Adjust the height of the repair device (5) relative to the workpiece (1), and transmit the pressure to the groove (21) through the processing surface (421). The groove (21) is squeezed by the processing surface (421) and shrinks. The slot (21) includes an upper contact surface (211), which abuts against the processing surface (421), and the upper contact surface (211) moves downward after being pressed. The repair device (5) includes a base (3), and an installation groove (31) is provided at the end of the base (3). A processing part (4) is rolled in the installation groove (31), and the processing part (4) is provided with a processing surface (421) that abuts the groove (21).

2. The method for repairing a semiconductor vacuum cavity sealing groove according to claim 1, characterized in that, The diameter of the arc of the processed surface (421) is D, and the width of the groove (21) is L, where D≥10L.

3. The method for repairing a semiconductor vacuum cavity sealing groove according to claim 1, characterized in that, In step S2, the center of the machined surface (421) is aligned with the center of the groove (21).

4. A method for repairing a semiconductor vacuum cavity sealing groove according to any one of claims 1-3, characterized in that, When the overall dimensions of the sealing groove (2) need to be repaired, the machining surface (421) is moved along the extension direction of the sealing groove (2) in step S3.

5. A method for repairing a semiconductor vacuum cavity sealing groove according to any one of claims 1-3, characterized in that, In step S3, the height between the progressively reduced repair device (5) and the workpiece (1) is adjusted.

6. The method for repairing a semiconductor vacuum cavity sealing groove according to claim 1, characterized in that, The substrate (3) includes a guide substrate (32) and a processing substrate (33). The processing substrate (33) is rotatably connected to the guide substrate (32). The guide substrate (32) drives the processing substrate (33) to move along the extension direction of the sealing groove (2).

7. A method for repairing a semiconductor vacuum cavity sealing groove according to claim 1 or 6, characterized in that, The machining part (4) and the mounting groove (31) are connected by a universal rotatable connection.

8. A method for repairing a semiconductor vacuum cavity sealing groove according to claim 1 or 6, characterized in that, The processed part (4) includes a processed sphere (41) and a planetary sphere (42). The spherical surface of the processed sphere (41) is the processed surface (421), and the planetary sphere (42) abuts against the processed sphere (41) and the mounting groove (31) respectively.

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