A wire electrode workpiece differential synchronous wave micro-electrolytic wire cutting processing method

Abstract

The invention discloses a wire electrode workpiece differential synchronous wave micro-electrolytic wire cutting processing method, comprising synchronous wave and differential movement of the wire electrode and the workpiece at the same time, wherein the synchronous wave is a continuous swing of the wire electrode and the workpiece in which they are synchronously tilted upward and downward, and the synchronous wave of the wire electrode and the workpiece causes the electrolyte in the processing area to flow in the opposite direction of the synchronous wave, so that the processed product is washed out by the electrolyte in the opposite direction of the synchronous wave; the differential movement is a differential movement of the wire electrode and the workpiece in the same direction in the processing direction, so that the wire electrode and the workpiece are in a different speed chasing motion state in the processing direction, so that the real-time position change of the processing area is realized, and the electrolyte in the processing gap is updated; the invention has the advantages of all-round and thorough washing of the processed product in the processing gap, sufficient flow of the electrolyte in the processing gap, improved uniform distribution of conductivity, and improved processing stability, processing accuracy and processing efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of micro electrolytic machining, in particular to a micro electrolytic wire cutting machining method for a wire electrode workpiece with differential synchronous wave. Background Art

[0002] Micro-electrolytic machining is a technology that dissolves workpieces in trace amounts based on the principle of electrochemical ion removal. Theoretically, it can achieve atomic-level machining accuracy and has the advantages of high efficiency, low cost, no relation to material hardness, and no machining stress. It has great development potential in micro-machining. Micro-electrolytic wire cutting is a new type of micro-electrolytic machining technology that combines the electrolytic principle with the wire cutting form. Since the wire electrode has no loss, a micron-diameter metal wire can be used as the electrode to machine a few microns of slit.

[0003] Although the micro-electrolytic wire cutting technology has shown great advantages and broad application prospects in the micro-structure processing of metal materials, there are still some problems in the process of electrolytic wire cutting. During the processing, the bubbles generated by the cathode, the ions generated by the anode and the insoluble processing products accumulate in the processing gap of the micro-slit structure, resulting in poor renewal of fresh electrolyte and decreased conductivity uniformity. If they cannot be discharged in time, the processing speed, accuracy and quality will be reduced, and even short circuits will cause the processing to be unable to continue.

[0004] In order to effectively remove the processing products and ensure the continuous processing, the researchers proposed methods such as axial micro-vibration of the wire electrode, circular wire feeding of the wire electrode, and low-frequency vibration of piezoelectric ceramics. Since the wire electrode is a cylindrical metal wire at the micron level with a smooth outer surface, its drag disturbance ability is limited. When processing high aspect ratio structures, the product discharge effect is weak, resulting in processing short circuits and unstable processing. Therefore, the ability of axial micro-vibration of the wire electrode and circular wire feeding of the wire electrode to increase mass transfer is poor. The low-frequency vibration of piezoelectric ceramics improves the processing gap flow field to a certain extent, but there is still the problem of processing products and bubbles adhering to the electrode wire and the workpiece surface. In addition, the researchers proposed a method of radial reciprocating vibration of the wire electrode to improve mass transfer, but this method is only applicable to simple linear structures. It is difficult to achieve radial reciprocating vibration of the wire electrode when processing complex trajectories.

[0005] Patent publication number CN108788352B discloses a micro-electrolytic wire cutting processing method with a wire electrode and a workpiece having a composite motion at different speeds. Specifically, the wire electrode and the workpiece perform relative cutting motion at different speeds in the processing direction, and the static electrolyte flows in the opposite direction to flush and discharge the products in the gap; the wire electrode and the workpiece perform alternating reciprocating motion perpendicular to the processing direction to assist mass transfer in the gap, but the insoluble products on the surface of the workpiece are far away from the line electrode, and the "drag" force of the workpiece on the insoluble products is weak. The insoluble products that have just been discharged will enter the processing gap again, and the wire electrode and the workpiece only perform relative cutting motion at different speeds in the processing direction, which cannot make the processing products in the processing gap unable to be fully and thoroughly flushed. There are problems such as poor electrolyte fluidity in the processing area, slow electrolyte flow and renewal in the processing gap, slow mass transfer speed, and the processing products cannot be fully and thoroughly flushed. The processing products in the processing gap cannot be quickly discharged, thereby affecting the processing stability, processing accuracy and processing efficiency. Summary of the invention

[0006] The technical problem to be solved by the present invention is to overcome the existing defects and provide a wire electrode workpiece differential synchronous wave micro-electrolytic wire cutting processing method, which forces the static electrolyte in the processing area to flow, greatly increases the fluidity of the electrolyte, accelerates the mass transfer rate in the processing gap, and the electrolyte in the processing gap flows and renews rapidly. The processed products in the processing gap are thoroughly flushed in all directions. The electrolyte in the processing gap flows fully, resulting in faster migration and diffusion of the processed products, further improving the discharge speed of the processed products in the processing gap, improving the uniform distribution of conductivity, and avoiding the occurrence of short circuits, thereby significantly improving processing stability, processing accuracy and processing efficiency, and can effectively solve the problems in the background technology.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a wire electrode workpiece differential synchronous wave micro-electrolytic wire cutting processing method, comprising: the wire electrode and the workpiece simultaneously perform synchronous wave and differential motion, the synchronous wave is a continuous swing of the wire electrode and the workpiece synchronously tilting upward and downward, the synchronous wave of the wire electrode and the workpiece causes the electrolyte in the processing area to flow in the opposite direction of the synchronous wave, so that the processed products in the processing gap are washed out by the electrolyte in the opposite direction of the synchronous wave; the differential motion is the wire electrode and the workpiece moving in the same direction at a differential speed in the processing direction, so that the wire electrode and the workpiece are in a different speed chasing motion state in the processing direction, so as to realize the real-time displacement of the processing area, and abandon the processed products discharged from the processing gap at a position far away from the processing area, thereby renewing the electrolyte in the processing gap; under the composite motion of the synchronous wave and the differential motion of the wire electrode and the workpiece, the processed products flow out from the processing gap in the opposite direction of the feed motion, and the processing area is constantly changed, so that the electrolyte in the processing gap flows and is updated rapidly, and the processed products are discharged rapidly.

[0008] Furthermore, when the wire electrode performs a feeding motion in the differential motion, the wire electrode motion speed V1 is greater than the workpiece motion speed V2, and the speed difference between the wire electrode motion speed V1 and the workpiece motion speed V2 is the feeding speed of the wire electrode.

[0009] Furthermore, when the workpiece performs a feeding motion in the differential motion, the wire electrode movement speed V3 is greater than the workpiece movement speed V4, and the speed difference between the wire electrode movement speed V3 and the workpiece movement speed V4 is the feeding speed of the wire electrode.

[0010] Compared with the prior art, the present invention has the following beneficial effects:

[0011] 1. The wire electrode workpiece differential synchronous wave micro-electrolytic wire cutting processing method of the present invention utilizes the synchronous wave of the wire electrode and the workpiece to accelerate the renewal speed of the electrolyte and the rapid discharge of the product in the processing gap. Compared with the existing circular wire walking or axial vibration of the wire electrode, its movement has little effect on the flow of the electrolyte, which is far less than the effect of the synchronous wave on the flow of the electrolyte. In the present method, the synchronous wave of the wire electrode and the workpiece drives the flow of the static electrolyte, and forces the electrolyte to flow in the direction of the wave. This wave direction is different from the direction of the electrolyte flow in the existing method. The full flow of the electrolyte causes the processing product to migrate and diffuse faster.

[0012] 2. The wire electrode and workpiece differential synchronous wave micro-electrolytic wire cutting processing method of the present invention utilizes the differential movement of the wire electrode and the workpiece to increase the fluidity of the electrolyte. Compared with the existing wire electrode circular wire walking or axial vibration, its movement range is small, the electrolyte mainly flows axially, and the fluidity is weak. In this method, the wire electrode and the workpiece move at the same time at different speeds, forcing the static electrolyte to flow in the opposite direction of the feed, which greatly increases the fluidity of the electrolyte and accelerates the mass transfer rate in the processing gap.

[0013] 3. The wire electrode workpiece differential synchronous wave micro-electrolytic wire cutting processing method of the present invention, in which the synchronous wave of the wire electrode and the workpiece and the differential motion constitute a composite motion, the wire electrode and the workpiece continuously change positions along the composite motion direction, and the electrolyte is forced to flow continuously in the composite motion direction. The processed products in the processing gap are completely flushed in all directions, which accelerates the discharge of the processed products, improves the efficiency of mass transfer, and realizes high-quality processing of micro-electrolytic wire cutting.

[0014] 4. The wire electrode workpiece differential synchronous wave micro-electrolytic wire cutting processing method of the present invention realizes the all-round and thorough flushing and discharge of the processing products in the processing gap, and can ensure the timely renewal of the electrolyte in the processing gap, improve the uniform distribution of conductivity, avoid the occurrence of short circuit, and thus significantly improve the processing stability, processing accuracy and processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the present invention;

[0016] Figure 2 It is a cross-sectional view of the wire electrode and the workpiece of the present invention;

[0017] Figure 3 It is a schematic diagram of the wire electrode and the workpiece oscillating upward synchronously according to the present invention;

[0018] Figure 4 It is a schematic diagram of the wire electrode and the workpiece oscillating downward synchronously according to the present invention;

[0019] Figure 5 It is a schematic diagram of the continuous fluctuation posture of the wire electrode and the workpiece of the present invention;

[0020] Figure 6 This is a schematic diagram of the differential motion of the wire electrode and the workpiece according to the first embodiment of the present invention;

[0021] Figure 7 It is a schematic diagram of the flow field in the machining gap region when the wire electrode and the workpiece are in a composite motion of synchronous upward wave motion and differential motion according to the first embodiment of the present invention;

[0022] Figure 8 It is a schematic diagram of the flow field in the machining gap region when the wire electrode and the workpiece are in a composite motion of synchronous downward wave motion and differential motion according to the first embodiment of the present invention;

[0023] Fig. 9 It is a schematic diagram of the feeding motion process of the wire electrode and the workpiece under the combined motion of synchronous wave motion and differential motion in the first embodiment of the present invention;

[0024] Fig.10 This is a schematic diagram of the differential motion of the wire electrode and the workpiece according to the second embodiment of the present invention;

[0025] Fig.11 It is a schematic diagram of the flow field in the machining gap region when the wire electrode and the workpiece are in a composite motion of synchronous upward wave motion and differential motion according to the second embodiment of the present invention;

[0026] Fig.12 It is a schematic diagram of the flow field in the machining gap region when the wire electrode and the workpiece are in a composite motion of synchronous downward wave motion and differential motion according to the second embodiment of the present invention;

[0027] Fig.13 It is a schematic diagram of the feeding motion process of the wire electrode and the workpiece under the composite motion of synchronous wave motion and differential motion in the second embodiment of the present invention.

[0028] In the figure: 1. wire electrode; 2. workpiece; 3. synchronous downward waving mass transfer route; 4. synchronous upward waving mass transfer route. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Embodiment 1

[0030] See also Figure 1-9 , the present invention provides a technical solution: a wire electrode workpiece differential synchronous wave micro-electrolytic wire cutting processing method, comprising a wire electrode 1 and a workpiece 2 simultaneously performing synchronous wave and differential motion;

[0031] The synchronous oscillation is a continuous swing in which the wire electrode 1 and the workpiece 2 are synchronously tilted upward and downward. The synchronous oscillation of the wire electrode 1 and the workpiece 2 causes the electrolyte in the processing area to flow in the opposite direction of the synchronous oscillation, so that the processed products in the processing gap are washed out by the electrolyte in the opposite direction of the synchronous oscillation.

[0032] like Figure 3 The synchronous downward wave mass transfer path 3 of the wire electrode 1 and the workpiece 2 is shown, and Figure 4 The wire electrode 1 and the workpiece 2 are shown with a synchronous upward wave mass transfer route 4;

[0033] The differential motion is that the wire electrode 1 and the workpiece 2 move in the same direction in the processing direction at a differential speed. In the differential motion, the wire electrode 1 makes a relative feed motion toward the workpiece 2. The wire electrode motion speed V1 is greater than the workpiece motion speed V2, and the speed difference between the wire electrode motion speed V1 and the workpiece motion speed V2 is the feed speed of the wire electrode 1, so that the wire electrode 1 and the workpiece 2 are in a different speed chasing motion state in the processing direction, realizing real-time transposition of the processing area, discarding the processed products discharged from the processing gap at a position far away from the processing area, and then renewing the electrolyte in the processing gap;

[0034] The wire electrode workpiece differential synchronous wave micro-electrolytic wire cutting processing method disclosed in this embodiment, through the synchronous wave of the wire electrode 1 and the workpiece 2, the electrolyte in the processing area flows in the opposite direction of the synchronous wave, so that the processing products in the processing gap are washed out by the electrolyte in the opposite direction of the synchronous wave, and the wire electrode 1 and the workpiece 2 move at a differential speed to achieve real-time displacement of the processing area, and the processing products discharged from the processing gap are discarded at a position far away from the processing area, thereby renewing the electrolyte in the processing gap, and because the angle of the processing gap area being washed by the electrolyte changes continuously when the wire electrode 1 and the workpiece 2 are synchronously and continuously fluctuated, the processing products in the processing gap between the wire electrode 1 and the workpiece 2 are repeatedly and omnidirectionally washed;

[0035] Under the combined motion of synchronous wave and differential motion, the wire electrode 1 and the workpiece 2 continuously change their positions along the direction of the combined motion, forcing the electrolyte to continuously flow in the direction of the combined motion. The processed products in the processing gap are completely flushed in all directions, which speeds up the discharge of the processed products, improves the efficiency of mass transfer, and realizes high-quality processing of micro-electrolytic wire cutting. Embodiment 2

[0036] See also Figure 1-5 and Figure 10-13 , the present invention provides a technical solution: a wire electrode workpiece differential synchronous wave micro-electrolytic wire cutting processing method, comprising a wire electrode 1 and a workpiece 2 simultaneously performing synchronous wave and differential motion;

[0037] The synchronous oscillation is a continuous swing in which the wire electrode 1 and the workpiece 2 are synchronously tilted upward and downward. The synchronous oscillation of the wire electrode 1 and the workpiece 2 causes the electrolyte in the processing area to flow in the opposite direction of the synchronous oscillation, so that the processed products in the processing gap are washed out by the electrolyte in the opposite direction of the synchronous oscillation.

[0038] like Figure 3 The synchronous downward wave mass transfer path 3 of the wire electrode 1 and the workpiece 2 is shown, and Figure 4 The wire electrode 1 and the workpiece 2 are shown with a synchronous upward wave mass transfer route 4;

[0039] The differential motion is that the wire electrode 1 and the workpiece 2 move at a differential speed in the same direction in the processing direction. In the differential motion, the workpiece 2 makes a relative feed motion toward the wire electrode 1. The wire electrode motion speed V3 is less than the workpiece motion speed V4, and the speed difference between the wire electrode motion speed V3 and the workpiece motion speed V4 is the feed speed of the workpiece 2, so that the wire electrode 1 and the workpiece 2 are in a different speed chasing motion state in the processing direction, realizing real-time transposition of the processing area, abandoning the processed products discharged from the processing gap at a position far away from the processing area, and then updating the electrolyte in the processing gap;

[0040] Under the combined action of synchronous wave motion and differential motion, the processing area of ​​the wire electrode 1 and the workpiece 2 is constantly changed, so that the electrolyte in the processing gap flows and renews quickly and the processing products are discharged quickly.

[0041] Compared with the first embodiment, this embodiment provides another differential motion mode and a compound motion mode of the wire electrode 1 and the workpiece 2 .

[0042] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wire electrode workpiece differential synchronous wave micro-electrolytic wire cutting processing method, characterized in that: The invention comprises a wire electrode (1) and a workpiece (2) performing synchronous oscillation and differential motion simultaneously, wherein the synchronous oscillation is a continuous swing of the wire electrode (1) and the workpiece (2) in a synchronous upward tilt and downward tilt, and the synchronous oscillation of the wire electrode (1) and the workpiece (2) causes the electrolyte in the processing area to flow in the opposite direction of the synchronous oscillation, so that the processed products in the processing gap are washed out by the electrolyte in the opposite direction of the synchronous oscillation; the differential motion is a differential motion of the wire electrode (1) and the workpiece (2) in the same direction in the processing direction, so that the wire electrode (1) and the workpiece (2) are in a different speed chasing motion state in the processing direction, so that the processing area is replaced in real time, and the processed products discharged from the processing gap are discarded at a position far away from the processing area, thereby renewing the electrolyte in the processing gap; under the combined motion of the synchronous oscillation and the differential motion of the wire electrode (1) and the workpiece (2), the processed products flow out from the processing gap in the opposite direction of the feed motion, and the processing area is continuously changed, so that the electrolyte in the processing gap flows and is renewed rapidly, and the processed products are discharged rapidly.

2. The wire electrode workpiece differential synchronous wave micro-electrolytic wire cutting processing method according to claim 1, characterized in that: In the differential motion, the wire electrode (1) performs a relative feeding motion toward the workpiece (2), the wire electrode motion speed V1 is greater than the workpiece motion speed V2, and the speed difference between the wire electrode motion speed V1 and the workpiece motion speed V2 is the feeding speed of the wire electrode (1).

3. The wire electrode workpiece differential synchronous wave micro-electrolytic wire cutting processing method according to claim 1, characterized in that: In the differential motion, the workpiece (2) performs a relative feed motion toward the wire electrode (1), the wire electrode motion speed V3 is less than the workpiece motion speed V4, and the speed difference between the wire electrode motion speed V3 and the workpiece motion speed V4 is the feed speed of the workpiece (2).

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