Large size wafer lateral transportation device and method

Abstract

The application relates to a large-size wafer transverse transportation device and method, which comprises a damping cabinet body, a storage box body and a damping seat. The top end of the damping cabinet body is provided with the damping seat. The storage box body is located at the inner side of the damping cabinet body. The storage box body comprises a storage top cover, a storage base, storage units and limiting stop columns. The storage base is stacked with a plurality of storage units. The top end of the uppermost storage unit is provided with the storage top cover. Through the use of the impurity removal component, the heat of the motor can be taken away by the cooling liquid. The cooling liquid reaches the inner side of the storage barrel two through the pipeline one. Since the storage barrel two is rotating, the cooling liquid is thrown out of the storage barrel two through the liquid outlet groove. The cooling liquid cleans the outer periphery of the blade and humidifies the airflow, reduces the generation of static electricity, cools the airflow and improves the cooling capacity of the airflow.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of wafer transportation, in particular to a large-size wafer transverse transportation device and method. BACKGROUND

[0002] With the continuous development of industry, the performance requirements for components are becoming higher and higher. As a new generation of industrial production semiconductor material, silicon carbide is widely used in the field of electronic devices such as high power, high voltage, and high frequency due to its excellent performance.

[0003] At present, 6-inch silicon carbide substrates have been mass-produced in China, and 8-inch substrates are in small-batch production stage internationally. Domestic substrate manufacturers are also conducting research and development on 8-inch substrates. Compared with 6-inch substrates, the number of chips cut from 8-inch substrates will be more, improving production efficiency, and the edge loss of 8-inch substrates is further reduced, effectively reducing production costs. Therefore, large-size substrates are the inevitable trend of future development.

[0004] However, with the continuous optimization of wafer growth and cutting technology, the substrate size is continuously increasing while the wafer thickness remains relatively stable. The existing wafer packaging box often places the substrate vertically in the packaging box for transportation. For larger and thinner wafers, the vibration generated during vertical transportation will increase the stress received by the wafer in the packaging box. The edge of the wafer is prone to breakage, and the overall wafer structure may also be damaged due to the large shear force. In order to ensure the structural stability of the storage device and clamping equipment during transportation, a cooling air cooling component is also needed to ensure that the device is maintained at an appropriate temperature. Dust is easily adsorbed on the blades of the air cooling component, which may damage the dynamic balance of the blades and hinder their operation. Therefore, a large-size wafer transverse transportation device and method are proposed. SUMMARY

[0005] This section aims to summarize some aspects of the embodiments of the present application and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract and title of the specification to avoid obscuring the purpose of this section, abstract and title, and such simplifications or omissions cannot be used to limit the scope of the present application.

[0006] In view of the following technical problems in the prior art: the vibration generated during vertical transportation will increase the stress received by the wafer in the packaging box, the edge of the wafer is prone to breakage, and the overall wafer structure may also be damaged due to the large shear force. In order to ensure the structural stability of the storage device and clamping equipment during transportation, a cooling air cooling component is also needed to ensure that the device is maintained at an appropriate temperature. Dust is easily adsorbed on the blades of the air cooling component, which may damage the dynamic balance of the blades and hinder their operation.

[0007] To solve the above technical problems, the application provides the following technical solutions: a large-size wafer transverse transportation device and method, comprising:

[0008] A damping cabinet body, comprising a damping upper cover and a damping seat, the damping upper cover is arranged at the top end of the damping seat;

[0009] A storage box body is located at the inner side of the damping cabinet body, the storage box body comprises a storage top cover, a storage base, a storage unit and a limiting stop column, a plurality of storage units are stacked on the storage base, the storage top cover is arranged at the top end of the uppermost storage unit, and four limiting stop columns are arranged in a ring array at the top of the storage base and the storage unit;

[0010] The two sides of the storage base are concavely provided with notches, and the notches are matched and corresponded with the temperature guide assembly;

[0011] The front of the storage unit is provided with a storage chamber, the inner bottom wall of the storage chamber is concavely provided with a wafer placing pit, the center axes of the two wafer placing pits coincide, a pressing through hole is concavely provided in the middle of the wafer placing pit, and four stop column through holes are uniformly concavely provided in the circumferential surface of the wafer placing pit; the limiting stop column is correspondingly inserted into the stop column through hole;

[0012] The top of the damping upper cover is provided with a pressure indicating lamp.

[0013] As a preferred technical solution of the large-size wafer transverse transportation device and method, a pressing column is arranged at the middle of the top of the storage unit and the storage base, and the pressing column extends into the pressing through hole above it;

[0014] The wafer is clamped between the top of the pressing column and the inner top wall of the storage chamber, and the pressing column is located in the middle of the four limiting stop columns;

[0015] A vertical connecting rod is arranged at each of the four corners of the storage unit and the storage base, a limiting block two is arranged at the top of the vertical connecting rod, and the vertical connecting rod is correspondingly inserted into the storage unit.

[0016] As a preferred technical solution of the large-size wafer transverse transportation device and method, four limiting blocks one are uniformly arranged on the lower side of the damping upper cover, four limiting holes are concavely arranged on the upper side of the damping seat, and the limiting block one is inserted into the corresponding limiting hole.

[0017] The limiting block one and the limiting hole are used to cooperate and install the damping upper cover and the damping seat.

[0018] As a preferred technical scheme of the large-size wafer transverse transportation device and method, the storage unit is provided with two limiting sharp corners on the side of the storage chamber opening, the storage top cover and the storage base are both provided with an assembly groove, the assembly groove is clamped with the connecting plate, the storage top cover and the storage base are both provided with two limiting grooves, the head and tail of the connecting plate are respectively provided with two limiting blocks three, and the limiting blocks three are correspondingly inserted into the limiting grooves.

[0019] The connecting plate closes the storage chamber opening, so that the storage chamber becomes a closed cavity.

[0020] As a preferred technical scheme of the large-size wafer transverse transportation device and method, the front surface of the damping seat is provided with an air cooling component, and the back surface of the damping seat is reserved with an air outlet hole.

[0021] The air flow enters from the sleeve and then exits from the air outlet hole, during which the heat of the assembly structure is taken away.

[0022] As a preferred technical scheme of the large-size wafer transverse transportation device and method, the air cooling component comprises a sleeve, a structure arm, an inner sleeve, a base, a power component and a liquid cooling component.

[0023] The sleeve is a cylindrical shell, the structure arm is four, and the four structure arms are welded at equal intervals on the inner side of the sleeve, the inner sleeve is arranged on the inner side of the sleeve, one end of the structure arm deviating from the sleeve is connected with the inner sleeve, and the center line of the sleeve is coincided with the center line of the inner sleeve.

[0024] The inner side of the sleeve contains the power component and the liquid cooling component.

[0025] As a preferred technical scheme of the large-size wafer transverse transportation device and method, the power component comprises a blade, a mounting disc, an outer sleeve, a motor and a transmission rod, the outer sleeve is fixedly connected to the inner side of the inner sleeve, the motor is located on the inner side of the outer sleeve, the transmission rod is sleeved on the power head of the motor, the transmission rod is fixedly connected with the mounting disc, the peripheral surface of the mounting disc is provided with a plurality of blades at equal intervals, and the sleeve, the mounting disc and the transmission rod are coaxial.

[0026] As a preferred technical scheme of the large-size wafer transverse transportation device and method, the liquid cooling component comprises a pipeline one, a structure rod, a pipeline two, an outer sleeve and a impurity removing component, the pipeline two is arranged in the structure arm at the bottom of the inner sleeve, the upper side of the pipeline two is communicated with the inner side of the inner sleeve, one end of the pipeline two deviating from the inner sleeve is connected with the water supply pipeline in the outside, the storage barrel two is inserted into the transmission rod, the bottom of the pipeline one is fixedly connected to the storage barrel two, the pipeline one is communicated with the storage barrel two, one end of the pipeline one deviating from the storage barrel two is fixedly connected with the inner sleeve, the pipeline one is communicated with the inner sleeve, the structure rod is arranged between the storage barrel two and the inner sleeve, and the pipeline one and the structure rod are mirror arranged.

[0027] The impurity removal component includes a liquid outlet groove, a rotating ring, a third pipeline and a storage barrel one, the third pipeline is fixedly connected to the storage barrel two at equal intervals, the third pipeline is connected to the storage barrel two, one end of the third pipeline deviating from the storage barrel two is fixedly connected to the rotating ring, the rotating ring is movably connected to the storage barrel one, the third pipeline is connected to the storage barrel one, the storage barrel one is fixedly connected to the inner side of the mounting disc, the number of the blades is half of the number of the liquid outlet grooves, two liquid outlet grooves are reserved on each blade, and the liquid outlet grooves are connected to the storage barrel one.

[0028] A plurality of horizontally arranged flow guide plates are arranged on the two sides of the inner side of the damping seat, a plurality of temperature guide pipes are arranged on the two sides of the storage top cover, a temperature guide pressing block is arranged in the inner side of the storage top cover, heat-conducting liquid is arranged in the temperature guide pipe, and the temperature guide pipe vertically penetrates the corresponding flow guide plate.

[0029] The temperature guide assembly includes the temperature guide pipe, the temperature guide pressing block, a flexible heat-conducting pad and a heat-conducting plate, the temperature guide pipe is an evaporation section at the temperature guide pressing block, and working liquid in the heat pipe evaporates into steam at the evaporation section.

[0030] The temperature guide pipe is a condensation section at a position where the temperature guide pipe contacts the flow guide plate, steam in the heat pipe condenses into liquid and releases heat at the condensation section, and the flow guide plate connects the storage unit and the damping seat, so that the assembled structure is stable and does not shake.

[0031] The inner top wall of the storage chamber is provided with the flexible heat-conducting pad, the adjacent flexible heat-conducting pads are connected through the heat-conducting plate, the heat-conducting plate penetrates the storage unit, the heat-conducting plate transmits heat to the outer side of the storage unit, the temperature guide pressing block includes two blocks, the two temperature guide pressing blocks are clamped at the middle part of the temperature guide pipe, the two parallel parts of the temperature guide pipe are distributed on the two sides of the storage unit, and heat is further transmitted to the flow guide plate for air cooling.

[0032] The temperature guide pipe is provided with a capillary structure, and the capillary structure promotes evaporation and backflow of water liquid.

[0033] When the storage units are tightly attached to each other, the heat-conducting plates arranged in the storage units are attached to each other at the upper and lower connection positions and transmit heat, the flexible heat-conducting material is arranged at the interface to ensure that the adjacent heat-conducting plates in the vertical direction can be tightly attached to each other, the flexible heat-conducting material uses silica gel material as a base material, and the silica gel base material is internally provided with heat-conducting fillers such as aluminum oxide, boron nitride, beryllium oxide or aluminum nitride.

[0034] The damping seat is internally provided with an air duct, the flow guide plate is sealingly arranged on the inner wall of the damping seat, one end of the flow guide plate is located in the air duct region, the other end is located in the assembly region of the damping seat and the storage box body, and the two regions are sealed and do not flow.

[0035] In order to ensure that the left and right ends of the storage box body do not collide with the guide plate during transportation and have a great impact on the box body, a heat-conducting gasket can be arranged at the butt joint opening of the guide plate and the temperature guide pipe to absorb kinetic energy.

[0036] As a preferred technical solution of the large-size wafer transverse transportation device and method, the transportation method is:

[0037] S1: Place the compression column into the wafer placement pit in the storage unit;

[0038] S2: Place the first layer of storage unit on the upper side of the storage base, so that the limiting stop column is aligned with the stop column through hole, and the compression column is aligned with the compression through hole; during the process that the storage unit approaches the storage base, the wafer is lifted by the compression column, until the wafer is clamped by the compression column and the inner top wall of the storage chamber;

[0039] S3: Place other storage units with compression columns on other storage units that have been assembled, so that the limiting stop column is aligned with the stop column through hole, and the compression column is aligned with the compression through hole; during the process that the storage unit approaches the storage unit, the wafer is lifted by the compression column, until the wafer is clamped by the compression column and the inner top wall of the storage chamber;

[0040] S4: Place the storage unit with a pre-set storage top cover on the uppermost layer position;

[0041] S5: Cover the connecting plate in the assembly groove on one side of the storage chamber opening, so that the limiting block three on the connecting plate is inserted into the corresponding limiting groove to form a final assembly structure, so that the storage chamber is closed;

[0042] S6: Place the final assembly structure into the shock-absorbing seat, cover the shock-absorbing upper cover on the shock-absorbing seat, and insert the limiting block one into the corresponding limiting hole.

[0043] The large-size wafer transverse transportation device and method has the following advantages: by inflating the upper air bag and the lower air bag, the storage box body is compressed, the shaking of the storage box body in the space on the inner side of the shock-absorbing cabinet is reduced, the stability is improved, and the transportation loss of the wafer is minimized;

[0044] By using the air cooling component, the device can be maintained at a suitable temperature, and the structure of the storage device and the clamping equipment is stable;

[0045] By using the impurity removal component, the heat of the motor can be removed by the cooling liquid, the cooling liquid reaches the inner side of the storage barrel two through the pipeline one, and since the storage barrel two is rotating, the cooling liquid is thrown out of the storage barrel two through the liquid outlet groove. The cooling liquid cleans the outer periphery of the blade and humidifies the airflow, reduces the generation of static electricity, cools the airflow, and improves the cooling capacity of the airflow. BRIEF DESCRIPTION OF DRAWINGS

[0046] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings. Among them:

[0047] Figure 1 It is a perspective view of the three-dimensional structure of the present application;

[0048] Figure 2 It is the positional relationship between the upper air bag and the lower air bag of the present application;

[0049] Figure 3 It is a perspective view of the three-dimensional structure of the storage box body of the present application Figure 1 ;

[0050] Figure 4 It is a perspective view of the three-dimensional structure of the storage box body of the present application Figure 2 ;

[0051] Figure 5 It is an assembly view of the storage box body and the damping seat of the present application;

[0052] Figure 6 It is a perspective view of the three-dimensional structure of the storage unit of the present application Figure 1 ;

[0053] Figure 7 It is a perspective view of the three-dimensional structure of the storage unit of the present application Figure 2 ;

[0054] Figure 8 It is a bottom view of the storage unit of the present application;

[0055] Figure 9 It is a perspective view of the three-dimensional structure of the connecting plate of the present application;

[0056] Figure 10 It is a top view of the damping seat and the flow guide plate after assembly of the present application;

[0057] Figure 11 It is a perspective view of the three-dimensional structure of the heat conduction system of the present application;

[0058] Figure 12 It is a front view of the heat conduction system of the present application;

[0059] Figure 13 It is a perspective view of the air cooling component of the present application;

[0060] Figure 14 It is a cross-sectional view of the air cooling component of the present application Figure 1 ;

[0061] Figure 15A partial enlarged structural schematic view of the G part in the application Figure 14 A partial enlarged structural schematic view of the G part in the application

[0062] Figure 16 A front structural schematic view of the air-cooled component in the application

[0063] Figure 17 A front structural schematic view of the air-cooled component in the application Figure 1

[0064] Figure 18 A front structural schematic view of the air-cooled component in the application Figure 2

[0065] The figure mark: shock absorbing upper cover 11, limit block one 111, shock absorbing seat 12, limit hole 121, upper air bag 13, lower air bag 14, air inlet interface 15, air outlet interface 16, pressure indicating lamp 17, flow guide plate 18, temperature guide assembly 19, temperature guide pipe 191, temperature guide pressing block 192, flexible temperature guide pad 193, temperature guide plate 194, storage top cover 21, assembly groove 211, limit groove 212, storage base 22, storage unit 23, limit button 231, blocking column through hole 232, compression through hole 233, wafer placement pit 234, storage chamber 235, limit blocking column 24, compression column 25, vertical connecting rod 26, limit block two 261, wafer 3, connecting plate 4, limit block three 41, sleeve 42, blade 43, structural arm 44, liquid outlet groove 45, mounting disc 46, structural plate 47, pipeline one 48, outer sleeve 49, motor 50, inner sleeve 51, transmission rod 52, structural rod 53, pipeline two 54, rotating ring 56, pipeline three 57, storage barrel one 58, storage barrel two 59, rubber ring one 60, rubber ring two 61. DETAILED DESCRIPTION

[0066] In order to make the above-mentioned objectives, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0067] In the following description, a lot of specific details are set forth in order to provide a thorough understanding of the present application, but the present application can also be implemented in other ways different from those described herein, and those skilled in the art can make similar generalizations without departing from the connotation of the present application, therefore the present application is not limited by the specific embodiments disclosed below.

[0068] Secondly, the "one embodiment" or "embodiment" referred to herein means that the specific features, structures or characteristics can be included in at least one implementation of the present application. "In one embodiment" appearing in different places in the specification does not mean the same embodiment, nor is it an embodiment that is independent of or mutually exclusive with other embodiments.

[0069] ​​Thirdly, the present application is described in detail in combination with the schematic diagram. In the detailed description of the embodiments of the present application, the cross-sectional view of the device structure is partially enlarged without the general proportion for the convenience of illustration, and the schematic diagram is only an example which should not limit the scope of protection of the present application. In addition, the three-dimensional spatial dimensions including length, width and depth should be included in the actual manufacture.

[0070] Mode 1:

[0071] As Figure 1-8 indicated, the present application proposes a large-size wafer transverse transportation device and method, which comprises:

[0072] The damping cabinet body comprises a damping upper cover 11 and a damping seat 12, and the damping upper cover 11 is arranged at the top end of the damping seat 12.

[0073] The storage box body is located at the inner side of the damping cabinet body, and comprises a storage top cover 21, a storage base 22, a storage unit 23 and a limiting stop column 24. The storage base 22 is stacked with a plurality of storage units 23, the storage top cover 21 is arranged at the top end of the uppermost storage unit 23, and the top of the storage base 22 and the storage unit 23 is annularly arrayed with four limiting stop columns 24.

[0074] The front of the storage unit 23 is provided with a storage chamber 235, the inner bottom wall of the storage chamber 235 is recessed with a wafer placing pit 234, the center axes of the two wafer placing pits 234 coincide, the middle part of the wafer placing pit 234 is recessed with a pressing through hole 233, and the circumferential surface of the wafer placing pit 234 is uniformly recessed with four stop column through holes 232. The limiting stop column 24 is correspondingly inserted into the stop column through hole 232.

[0075] The top of the damping upper cover 11 is provided with a pressure indicating lamp 17.

[0076] The middle part of the top of the storage unit 23 and the storage base 22 is provided with a pressing column 25, and the pressing column 25 extends into the pressing through hole 233 above it.

[0077] The wafer 3 is clamped between the top of the pressing column 25 and the inner top wall of the storage chamber 235, and the pressing column 25 is located in the middle part of the four limiting stop columns 24.

[0078] The four corners of the storage unit 23 and the storage base 22 are respectively provided with a vertical connecting rod 26, and the top of the vertical connecting rod 26 is provided with a limiting block two 261. The vertical connecting rod 26 is correspondingly inserted into the storage unit 23.

[0079] The lower side of the damping upper cover 11 is uniformly provided with four limiting blocks one 111, the upper side of the damping seat 12 is concavely provided with four limiting holes 121, and the limiting block one 111 is inserted into the corresponding limiting hole 121.

[0080] The limiting block one 111 and the limiting hole 121 are used to cooperate and install the damping upper cover 11 and the damping seat 12.

[0081] The storage unit 23 is located on the side of the storage chamber 235 opening and is provided with two limiting sharp corners 231 in advance, the storage top cover 21 and the storage base 22 are both provided with an assembly groove 211, the assembly groove 211 is clamped with the connecting plate 4, the storage top cover 21 and the storage base 22 are both provided with two limiting grooves 212, the head and tail of the connecting plate 4 are respectively provided with two limiting blocks three 41, and the limiting block three 41 is inserted into the limiting groove 212 in correspondence.

[0082] The connecting plate 4 closes the storage chamber 235 opening, so that the storage chamber 235 becomes a closed cavity.

[0083] The front of the damping seat 12 is provided with a forced air cooling component, and the back of the damping seat 12 is reserved with an air outlet hole.

[0084] The air flow enters from the air outlet hole, and the heat of the assembled structure is taken away during the period.

[0085] Mode 2:

[0086] As Figure 9-18 , the forced air cooling component includes a sleeve 42, a structure arm 44, an inner sleeve 51, a power component and a liquid cooling component;

[0087] The sleeve 42 is a cylindrical shell, the structure arm 44 is four, and is welded at the inner side of the sleeve 42 at equal intervals, the inner sleeve 51 is arranged at the inner side of the sleeve 42, one end of the structure arm 44 deviating from the sleeve 42 is connected with the inner sleeve 51, and the center line of the sleeve 42 coincides with the center line of the inner sleeve 51.

[0088] The inner side of the sleeve 42 contains the power component and the liquid cooling component;

[0089] The power component includes a blade 43, a mounting disc 46, an outer sleeve 49, a motor 50 and a transmission rod 52, the outer sleeve 49 is fixedly connected to the inner side of the inner sleeve 51, the motor 50 is located at the inner side of the outer sleeve 49, the transmission rod 52 is sleeved on the power head of the motor 50, the transmission rod 52 is fixedly connected with the mounting disc 46, the peripheral surface of the mounting disc 46 is uniformly provided with a plurality of blades 43, and the sleeve 42, the mounting disc 46 and the transmission rod 52 are coaxial.

[0090] The liquid cooling component includes pipe one 48, structure stick 53, pipe two 54, outer sleeve 49 and impurity removal component, pipe two 54 is arranged in the structure arm 44 at the bottom of the inner sleeve 51, the upper side of the pipe two 54 and the inside of the inner sleeve 51 are connected, one end of the pipe two 54 deviating from the inner sleeve 51 is connected with the water supply pipe outside, the storage barrel two 59 is inserted with the transmission stick 52, the storage barrel two 59 is screwed with the transmission stick 52, the bottom of the pipe one 48 is fixedly connected on the storage barrel two 59, the pipe one 48 is connected with the storage barrel two 59, one end of the pipe one 48 deviating from the storage barrel two 59 is fixedly connected with the inner sleeve 51, the pipe one 48 and the inner sleeve 51 are connected, the structure stick 53 is arranged between the storage barrel two 59 and the inner sleeve 51, and the pipe one 48 and the structure stick 53 are mirror arranged.

[0091] The impurity removal component includes liquid outlet groove 45, rotating ring 56, pipe three 57 and storage barrel one 58, the pipe three 57 is a plurality of and fixedly connected on the storage barrel two 59 at equal intervals, the pipe three 57 is connected with the storage barrel two 59, one end of the pipe three 57 deviating from the storage barrel two 59 is fixedly connected with the rotating ring 56, the rotating ring 56 is movably connected with the storage barrel one 58, the pipe three 57 is connected with the storage barrel one 58, the storage barrel one 58 is fixedly connected on the inner side of the mounting disc 46, the number of the blades 43 is half of the number of the liquid outlet grooves 45, two liquid outlet grooves 45 are reserved on each blade 43, and the liquid outlet grooves 45 are connected with the storage barrel one 58.

[0092] The liquid outlet grooves 45 on the two opposite surfaces of each blade 43 are staggered, so that the liquid outlet grooves 45 do not cause the local thickness of the blade 43 to be too small, and the storage barrel one 58 is annular.

[0093] The structure plate 47 is arranged at the combination part of the structure arm 44 and the inner sleeve 51, so as to reduce vibration and noise.

[0094] The inner sleeve 51 is wrapped with a vacuum heat insulation layer, so as to reduce heat exchange between the inside and outside of the inner sleeve 51.

[0095] Mode 3: Rubber ring one 60 is arranged between the rotating ring 56 and the pipe three 57, and rubber ring two 61 is arranged between the outer sleeve 49 and the transmission stick 52, so as to increase air tightness.

[0096] Mode 4: Limiting ring is arranged between the transmission stick 52 and the mounting disc 46, the limiting ring is fixedly connected with the transmission stick 52, the limiting ring limits the positions of the pipe three 57 and the storage barrel one 58, so as to avoid that the liquid outlet grooves 45 and the storage barrel one 58 do not correspond.

[0097] The base 55 is fixedly connected to the lower side of the sleeve 42. When the motor 50 is started, the motor 50 drives the transmission rod 52 to rotate, the transmission rod 52 drives the mounting disc 46 to rotate, the mounting disc 46 drives the blade 43 to rotate to generate airflow. During the process, the pipeline two 54 injects the cooling liquid into the rubber ring two 61, and the cooling liquid can take away the heat of the motor 50. The cooling liquid then passes through the pipeline one 48 to the inner side of the storage barrel two 59. Since the storage barrel two 59 is rotating, the cooling liquid is thrown out of the storage barrel two 59 through the liquid outlet channel 45. The cooling liquid cleans the outer periphery of the blade 43 and humidifies the airflow, reduces the generation of static electricity, and cools the airflow, thereby improving the cooling capacity of the airflow.

[0098] The shock-absorbing seat 12 is provided with an upper air bag 13, and the shock-absorbing upper cover 11 is provided with a lower air bag 14. The upper air bag 13 and the lower air bag 14 are inflated, and the upper air bag 13 and the lower air bag 14 are provided with an air inlet interface 15 and an air outlet interface 16. The air outlet interface 16 and the air inlet interface 15 can be extended out of the shock-absorbing upper cover 11, and the air inlet interface 15 can be connected to an air supply pipeline. By inflating the upper air bag 13 and the lower air bag 14, the storage box body is compressed, the storage box body is less likely to shake in the space of the shock-absorbing cabinet, and the wafer 3 is less likely to be damaged during transportation.

[0099] The sleeve 42 is provided with a dustproof assembly outside the shock-absorbing seat 12. The dustproof assembly includes but is not limited to a dustproof cylinder and a filter screen. The dustproof cylinder is connected to the shock-absorbing seat 12, and the dustproof cylinder is provided with a filter screen.

[0100] When the motor 50 is started, the motor 50 drives the transmission rod 52 to rotate, the transmission rod 52 drives the mounting disc 46 to rotate, the mounting disc 46 drives the blade 43 to rotate to generate airflow. The heat in the storage unit 23 is guided out of the storage unit 23 to the guide plate 18 through the temperature guide pipe 191. The guide plate 18 divides the airflow, and the airflow passes through the surface of the guide plate 18 to take away the heat of the guide plate 18 and the temperature guide pipe 191, thereby reducing the temperature of the wafer 3 and the inside and surface of the storage unit 23.

[0101] It should be understood that, in the development of any actual implementation, numerous implementation-specific decisions can be made. Such development efforts might be complex and time-consuming, but would nevertheless be a routine undertaking for those of ordinary skill in the art having the benefit of this disclosure, without undue experimentation.

[0102] It should be noted that the above examples are only used to illustrate the technical solutions of the present application but not limit the present application. Although the present application is described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or equivalently replaced, without departing from the spirit and scope of the technical solutions of the present application, which should be covered in the scope of the claims of the present application.

Claims

1. A large size wafer lateral transportation device, characterized by: Include: The damping cabinet body includes a damping upper cover (11) arranged at the top of the damping seat (12); The storage box body is located on the inner side of the damping cabinet body (1), and the storage box body includes a storage top cover (21), a storage base (22) on which a plurality of storage units (23) are stacked, and a storage top cover (21) arranged at the top of the uppermost storage unit (23). The top of the storage base (22) and the storage unit (23) are annularly arrayed with four limiting stop columns (24); The front of the storage unit (23) is provided with a storage room (235), and the inner bottom wall of the storage room (235) is recessed with a wafer placing pit (234). The middle part of the wafer placing pit (234) is recessed with a pressing through hole (233), and the circumferential surface of the wafer placing pit (234) is uniformly recessed with four stop column through holes (232). The limiting stop column (24) is inserted into the stop column through hole (232) correspondingly; The front of the damping upper cover (11) and the damping seat (12) is recessed with an air inlet (15) and an air outlet (16); The middle part of the top of the storage unit (23) and the storage base (22) is provided with a pressing column (25), and the pressing column (25) extends into the pressing through hole (233) above it; The top of the pressing column (25) and the inner top wall of the storage room (235) hold the wafer (3); The four corners of the storage unit (23) and the storage base (22) are respectively provided with a vertical connecting rod (26), and the top of the vertical connecting rod (26) is provided with a limiting block two (261). The vertical connecting rod (26) is inserted into the storage unit (23) correspondingly; Both sides of the storage base (22) are recessed with notches, and the notches are matched with the temperature guide assembly (19).

2. The large size wafer lateral transportation device according to claim 1, wherein: The lower side of the damping upper cover (11) is uniformly provided with four limiting blocks one (111), and the upper side of the damping seat (12) is recessed with four limiting holes (121). The limiting block one (111) is inserted into the corresponding limiting hole (121).

3. The apparatus of claim 2, wherein: The storage unit (23) is provided with two limiting sharp corners (231) on the side of the opening of the storage room (235), and the storage top cover (21) and the storage base (22) are both provided with two limiting grooves (212). The head and tail of the connecting plate (4) are respectively provided with two limiting blocks three (41), and the limiting block three (41) is inserted into the limiting groove (212) correspondingly.

4. The large-size wafer lateral transport device according to claim 3, characterized in that: The front of the damping seat (12) is provided with a forced air cooling component, and the back of the damping seat (12) is reserved with an air outlet hole.

5. The apparatus of claim 4, wherein: The temperature guide assembly (19) includes a temperature guide pipe (191), a temperature guide pressing block (192), a flexible heat conduction pad (193), and a heat conduction plate (194). The temperature guide pressing block (192) is composed of two blocks, which are clamped in the middle of the temperature guide pipe (191). The two parallel parts of the temperature guide pipe (191) are distributed on both sides of the storage unit (23); The inner top wall of the storage chamber (235) is provided with flexible heat-conducting pads (193), and adjacent flexible heat-conducting pads (193) are connected through heat-conducting plates (194) penetrating the storage unit (23); The temperature guide block (192) is located in the inside of the storage top cover (21), the temperature guide pipe (191) is provided with heat-conducting liquid on the inside, and the temperature guide pipe (191) vertically penetrates the corresponding flow guide plate (18) downward.

6. The method of claim 5, wherein the method further comprises: The transportation method comprises the following steps: S1: placing the compression column (25) into the wafer placing pit (234) in the storage unit (23); S2: placing the first layer of storage unit (23) on the upper side of the storage base (22), so that the limiting stop column (24) is aligned with the stop column through hole (232), the compression column (25) is aligned with the compression through hole (233), and in the process of the storage unit (23) approaching the storage base (22), the wafer is lifted by the compression column (25), until the wafer is clamped by the compression column (25) and the inner top wall of the storage chamber (235); S3: placing other storage units (23) provided with compression columns (25) on other storage units (23) that have been assembled, so that the limiting stop column (24) is aligned with the stop column through hole (232), the compression column (25) is aligned with the compression through hole (233), and in the process of the storage unit (23) approaching the storage unit (23), the wafer is lifted by the compression column (25), until the wafer is clamped by the compression column (25) and the inner top wall of the storage chamber (235); S4: placing the storage unit (23) provided with the storage top cover (21) to the uppermost layer position; S5: connecting the connecting plate (4) on one side of the opening of the storage chamber (235), so that the limiting block three (41) on the connecting plate (4) is inserted into the corresponding limiting groove (212) to form a final assembly structure; S6: placing the final assembly structure into the shock-absorbing seat (12), covering the shock-absorbing upper cover (11) on the shock-absorbing seat (12), and inserting the limiting block one (111) into the corresponding limiting hole (121).

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