Test suite

Abstract

The present invention provides a test set, comprising: an insulating plate shell, having a chip accommodating groove for inserting a power chip; a first conductive electrode piece, which is arranged on the insulating plate shell and has a first conductive surface that abuts and cooperates with the first pole of the power chip and a second conductive surface exposed from the insulating plate shell; a second conductive electrode piece, which is arranged on the insulating plate shell and has a third conductive surface that abuts and cooperates with the second pole of the power chip and a fourth conductive surface exposed from the insulating plate shell. For power chips of different sizes or power chips with changed positions of the first pole and the second pole, it is only necessary to replace the test set without re-customizing specific tooling that is compatible with the power chip, which can greatly reduce the monetary cost and time cost when testing different power chips. Therefore, the technical solution of the present application can effectively solve the problem in the related art that the tooling needs to be customized for different chips, resulting in high monetary cost and time cost.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor chip testing, and in particular to a testing set. Background Art

[0002] The demand for power semiconductor modules is increasing because they can reduce energy waste. Each chip product needs to pass dynamic parameter testing and static parameter testing. The chips used to make power semiconductor modules need to undergo a strict sorting process to ensure the consistency between chips in the same module.

[0003] However, in dynamic parameter testing, static parameter testing and chip sorting testing, the specific chip tooling in the test equipment needs to be customized and replaced according to the different sizes, thicknesses, and gate and source layout characteristics of the chips. Such tooling often costs hundreds of thousands of yuan or even more, and the production cycle is long. In the face of some imported test equipment, such tooling is often restricted by communication protocols to ensure the monopoly of imported equipment tooling. In the process of chip production and research and development, dozens of chips of different sizes or different gate and source layouts are often verified and produced every year. The tooling customization costs and time cycle generated in this process will bring huge costs to the chip development process. In addition, due to the small size of the power chip and the lack of packaging protection in such tests, some high-voltage silicon carbide chips are difficult to test to their rated voltage due to the insulation capacity limitations of the test tooling. Summary of the invention

[0004] The main purpose of the present invention is to provide a test set to solve the problem in the related art that tooling needs to be customized for different chips, resulting in high monetary and time costs.

[0005] In order to achieve the above-mentioned purpose, the present invention provides a test set for a power chip, comprising: an insulating plate shell, having a chip accommodating groove for inserting a power chip; a first conductive electrode piece, which is arranged on the insulating plate shell and has a first conductive surface abutting and matching with the first pole of the power chip and a second conductive surface exposed from the insulating plate shell; a second conductive electrode piece, which is arranged on the insulating plate shell and has a third conductive surface abutting and matching with the second pole of the power chip and a fourth conductive surface exposed from the insulating plate shell.

[0006] Furthermore, the insulating shell has a first surface and a second surface arranged opposite to each other and a plurality of side surfaces located between the first surface and the second surface. The chip accommodating groove is arranged on the first surface, and the chip accommodating groove passes through a side surface of the insulating shell. The first conductive electrode is connected to the first surface and blocks the chip accommodating groove. A first electrode groove is arranged on the second surface. Part of the first electrode groove and part of the chip accommodating groove are overlapped and connected to each other. The second conductive electrode is arranged in the first electrode groove.

[0007] Furthermore, a second pole piece groove is arranged at an interval with the first pole piece groove on the second surface, and the second pole piece groove and the chip receiving groove are overlapped and connected with each other. The test set also includes a third conductive pole piece, which is arranged in the second pole piece groove and is in contact and conductive with the third pole of the power chip.

[0008] Furthermore, the third conductive electrode piece includes an external connection portion and an internal connection portion which are connected to each other, the external connection portion is arranged in the second electrode piece groove, and the internal connection portion extends into the chip receiving groove and contacts and conducts with the third electrode.

[0009] Furthermore, the first conductive electrode piece is a first arc-shaped structure and protrudes toward the power chip; and / or, the second conductive electrode piece is a second arc-shaped structure and protrudes toward the power chip; and / or, the third conductive electrode piece is a third arc-shaped structure and protrudes toward the power chip.

[0010] Furthermore, a first conductive protrusion is arranged on the surface of the first conductive electrode facing the power chip; and / or a second conductive protrusion is arranged on the surface of the second conductive electrode facing the power chip; and / or a third conductive protrusion is arranged on the surface of the third conductive electrode facing the power chip.

[0011] Furthermore, an oil filling hole connected to the chip receiving groove is arranged on the insulating plate shell, and the test sleeve also includes a first sealing member which can be opened and closed at the notch of the chip receiving groove and a second sealing member which is arranged at the oil filling hole.

[0012] Furthermore, the first blocking member includes a blocking cover plate hingedly connected to the insulating plate shell and a sealing strip arranged on a side of the blocking cover plate facing the insulating plate shell.

[0013] Furthermore, a first avoidance recess is provided on one side of the insulating plate shell close to the notch of the chip accommodating groove, and a second avoidance recess corresponding to the first avoidance recess is provided on the first conductive electrode piece.

[0014] Furthermore, a first clamping portion is provided at the free end of the blocking cover plate, and a second clamping portion capable of clamping and cooperating with the first clamping portion is provided on the insulating plate shell.

[0015] Furthermore, the test set also includes an operating part and a first retaining member movably arranged on the insulating plate shell, the second clamping part is connected to the operating part and can move synchronously with the operating part, the second clamping part has a clamping position for clamping with the first clamping part and a separation position separated from the first clamping part, and the first retaining member applies a retaining force to the operating part and / or the second clamping part so that the second clamping part remains in the clamping position.

[0016] Furthermore, the test set also includes a pushing piece and a second retaining piece arranged on the insulating plate shell, the pushing piece has a pushing state of extending into the chip receiving groove and pushing the power chip outward and an avoiding state of exiting the chip receiving groove, the second retaining piece can limit the pushing piece so that the pushing piece remains in the avoiding state, and the operating part cooperates with the pushing piece drive and can switch the pushing piece from the avoiding state to the pushing state.

[0017] Furthermore, when the second clamping portion is in the clamping position, the operating portion and the ejecting member are separately arranged and have a preset distance, and the preset distance is greater than the clamping length of the first clamping portion and the second clamping portion; and / or, the ejecting member includes a pushing spring arm and a pushing spring, and a clamping protrusion is provided on the pushing spring arm, and the second retaining member is a clamping groove provided on the insulating plate shell, and when the ejecting member is in the avoidance state, the clamping protrusion is clamped in the clamping groove, and the pushing spring arm compresses the pushing spring, and the operating portion is driven to cooperate with the clamping protrusion and can drive the clamping protrusion to disengage from the clamping groove, so that the pushing spring arm extends into the chip accommodating groove under the action of the pushing spring and pushes the power chip outward.

[0018] Furthermore, the material of the insulating plate shell is one or more of ceramic, glass, PPS and PPA.

[0019] Furthermore, the material of the first conductive electrode plate and the second conductive electrode plate is one or more of copper, aluminum, gold and silver.

[0020] By applying the technical solution of the present invention, the power chip to be tested can be inserted into the test set, which includes an insulating plate shell, the insulating plate shell has a chip receiving groove for receiving the power chip, and the insulating plate shell is provided with a first conductive electrode piece and a second conductive electrode piece. When the power chip is inserted into the chip receiving groove, the first conductive electrode piece and the first conductive surface are in contact with the first pole of the power chip for conduction, the second conductive surface of the first conductive electrode piece is exposed to the insulating plate shell and can be in contact with the corresponding conductive structure on the tooling or fixture on the test equipment; the third conductive surface of the second conductive electrode piece is in contact with the second pole of the power chip for conduction, the fourth conductive surface of the second conductive electrode piece is exposed to the insulating plate shell and can be in contact with the corresponding conductive structure on the tooling or fixture on the test equipment, thereby enabling the first pole and the second pole on the power chip to be in contact with the tooling or fixture on the test equipment, thereby achieving performance testing of the power chip. In specific implementation, for power chips of different sizes or power chips with changed positions of the first pole and the second pole, multiple test sets can be set to cooperate with the above-mentioned different power chips respectively, wherein the sizes of the multiple test sets are the same and the relative positions with the tooling or fixture on the test equipment remain unchanged, and the conductive positions between the first conductive pole pieces and the second conductive pole pieces of the multiple test sets and the conductive structures of the tooling or fixture on the test equipment also remain unchanged, so that only the test sets need to be replaced without re-customizing the specific tooling adapted to the power chip, which can greatly reduce the money cost and time cost when testing different power chips. Therefore, the technical solution of the present application can effectively solve the problem in the related art that the tooling needs to be customized for different chips, which makes the money cost and time cost high. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0022] Figure 1 It shows a schematic diagram of the three-dimensional structure of the first embodiment of the test set according to the present invention;

[0023] Figure 2 Shows Figure 1 A schematic diagram of the three-dimensional structure of the test set from another angle, wherein the first blocking member is in a state of exposing the notch of the chip receiving groove;

[0024] Figure 3 Shows Figure 1 Schematic diagram of the decomposition structure of the test suite;

[0025] Figure 4 Shows Figure 3 An enlarged view of the A portion of the test set;

[0026] Figure 5 Shows Figure 1 A schematic diagram of the decomposition structure of the test suite from another angle;

[0027] Figure 6 A bottom view schematically shows an insulating plate shell, a first blocking member, a pop-up structure and a clamping structure according to a second embodiment of a test set of the present invention, wherein the first blocking member is in a state of blocking a notch of the chip receiving slot;

[0028] Figure 7 Shows Figure 6 An enlarged view of point B of the test set;

[0029] Figure 8 Shows Figure 6 An enlarged view of the C portion of the test set;

[0030] Fig. 9 Shows Figure 6 A bottom view of the insulating plate shell, the first blocking member, the pop-up structure and the clamping structure of the test set, wherein the first blocking member is in a state of exposing the notch of the chip receiving slot;

[0031] Fig.10 Shows Fig. 9 Magnified view of point D of the test set.

[0032] The above drawings include the following reference numerals:

[0033] 1. Power chip; 101. First pole; 102. Second pole; 103. Third pole; 104. Terminal structure;

[0034] 10. Insulating plate shell; 11. Chip receiving groove; 12. First surface; 13. Second surface; 14. Side surface; 15. First pole piece groove; 16. Second pole piece groove; 17. Oil filling hole; 18. First avoidance recess; 19. Mounting groove;

[0035] 20. first conductive electrode; 21. first conductive surface; 22. second conductive surface; 23. second avoidance recess;

[0036] 30. second conductive electrode; 31. third conductive surface; 32. fourth conductive surface;

[0037] 40. third conductive electrode; 41. external connection portion; 42. internal connection portion;

[0038] 50. first blocking member; 51. blocking cover plate; 511. first clamping portion; 52. sealing strip;

[0039] 60. Second blocking member;

[0040] 71. second clamping portion; 72. operating portion; 73. first retaining member;

[0041] 81, ejection member; 811, ejection spring arm; 8111, engaging protrusion; 812, ejection spring; 82, second retaining member;

[0042] L1, preset distance; L2, clamping length;

[0043] a. First direction; b. Second direction. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0046] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0047] like Figures 1 to 5As shown, the present application provides a test set for a power chip, and the first embodiment of the test set of the present application includes: an insulating plate shell 10, a first conductive electrode piece 20 and a second conductive electrode piece 30. Among them, the insulating plate shell 10 has a chip accommodating groove 11 for inserting the power chip 1; the first conductive electrode piece 20 is arranged on the insulating plate shell 10 and has a first conductive surface 21 abutting and matching with the first pole 101 of the power chip 1 and a second conductive surface 22 exposed to the insulating plate shell 10; the second conductive electrode piece 30 is arranged on the insulating plate shell 10 and has a third conductive surface 31 abutting and matching with the second pole 102 of the power chip 1 and a fourth conductive surface 32 exposed to the insulating plate shell 10.

[0048] By applying the technical solution of this embodiment, the power chip 1 to be tested can be inserted into the test set, which includes an insulating shell 10 having a chip accommodating groove 11 for accommodating the power chip 1, and a first conductive electrode 20 and a second conductive electrode 30 are arranged on the insulating shell 10. When the power chip 1 is inserted into the chip accommodating groove 11, the first conductive electrode 20 and the first conductive surface 21 are in contact with the first pole 101 of the power chip 1 for conduction, and the second conductive surface 22 of the first conductive electrode 20 is exposed on the insulating plate shell 10 and can be conducted with the corresponding conductive structure on the tooling or fixture on the test equipment; the third conductive surface 31 of the second conductive electrode 30 is in contact with the second pole 102 of the power chip 1 for conduction, and the fourth conductive surface 32 of the second conductive electrode 30 is exposed on the insulating plate shell 10 and can be conducted with the corresponding conductive structure on the tooling or fixture on the test equipment, thereby enabling the first pole 101 and the second pole 102 on the power chip 1 to be conducted with the tooling or fixture on the test equipment, thereby achieving performance testing of the power chip 1. In specific implementation, for power chips 1 of different sizes or power chips 1 with changed positions of the first pole 101 and the second pole 102, multiple test sets can be set to cooperate with the above-mentioned different power chips 1, wherein the sizes of the multiple test sets are the same and the relative positions with the tooling or fixtures on the test equipment remain unchanged, and the conductive positions between the first conductive pole pieces 20 and the second conductive pole pieces 30 of the multiple test sets and the conductive structures of the tooling or fixtures on the test equipment also remain unchanged. In this way, only the test sets need to be replaced without re-customizing the specific tooling adapted to the power chip 1, which can greatly reduce the money cost and time cost when testing different power chips 1. Therefore, the technical solution of this embodiment can effectively solve the problem in the related art that the tooling needs to be customized for different chips, which makes the money cost and time cost high.

[0049] It should be noted that the above-mentioned “corresponding conductive structure on the tooling or fixture” refers to a structure that is arranged on the tooling or fixture and can achieve a conductive function, which may be a conductive contact, a conductive needle, and the like.

[0050] like Figure 2 and Figure 5 As shown, the insulating plate shell 10 has a first surface 12 and a second surface 13 arranged opposite to each other and a plurality of side surfaces 14 located between the first surface 12 and the second surface 13, a chip receiving groove 11 is arranged on the first surface 12, the chip receiving groove 11 passes through one side surface 14 of the insulating plate shell 10, a first conductive electrode 20 is connected to the first surface 12 and blocks the chip receiving groove 11, a first electrode groove 15 is arranged on the second surface 13, a part of the first electrode groove 15 and a part of the chip receiving groove 11 are overlapped and connected to each other, and a second conductive electrode 30 is arranged in the first electrode groove 15. The chip receiving groove 11 is formed by directly arranging a sunken groove structure on the first surface 12 of the insulating plate shell 10 and the first conductive electrode 20 is directly arranged on the first surface 12 to block the chip receiving groove 11, which has the advantages of simple structure and easy processing and manufacturing. The chip receiving groove 11 passes through one side surface 14 of the insulating plate shell 10 to form a notch for inserting the power chip 1. Part of the first pole piece groove 15 and part of the chip receiving groove 11 are overlapped and connected to achieve that the second conductive pole piece 30 disposed in the first pole piece groove 15 can directly contact and conduct with the second pole 102 of the power chip 1, which has the advantages of simple structure and easy processing.

[0051] Specifically, in this embodiment, the first pole 101 and the second pole 102 are respectively arranged on the upper surface and the lower surface of the power chip 1. Correspondingly, the first conductive electrode piece 20 and the second conductive electrode piece 30 are respectively arranged on the upper side and the lower side of the insulating plate shell 10, wherein the first conductive electrode piece 20 and the second conductive electrode piece 30 can be connected to the insulating plate shell 10 by bonding, secondary injection molding, clamping, etc.

[0052] like Figure 3 and Figure 5 As shown, the length, width and depth of the chip receiving groove 11 are determined according to the size of the power chip 1 to be tested, and the length and width of the first conductive electrode piece 20 are determined according to the position of the first pole 101 on the power chip 1 and the position of the corresponding conductive structure on the tooling or fixture on the test equipment. In this embodiment, the size (length dimension) of the first electrode piece groove 15 in the first direction a and the size (width dimension) in the second direction b are both greater than the size of the chip receiving groove 11 in the corresponding direction. The first electrode piece groove 15 has a first communication area connected to the chip receiving groove 11 and a first entity area not connected to the chip receiving groove 11. The surface of the first entity area forms the groove bottom wall of the first electrode piece groove 15, wherein the first entity area is an "L"-shaped area, the first conductive electrode piece 20 is connected to the groove bottom wall of the first electrode piece groove 15 to achieve connection with the insulating plate shell 10, and the first conductive electrode piece 20 is connected to the corresponding conductive structure on the tooling or fixture on the test equipment through the part located in the first entity area.

[0053] like Figure 3 and Figure 5 As shown, the second surface 13 is also provided with a second electrode slot 16 spaced from the first electrode slot 15, the second electrode slot 16 is overlapped with the chip receiving slot 11 and is connected to each other, and the test set also includes a third conductive electrode 40, which is arranged in the second electrode slot 16 and is in contact and conduction with the third pole 103 of the power chip 1. The third conductive electrode 40 is arranged in the second electrode slot 16 and can be exposed to the insulating plate shell 10, and the third conductive electrode 40 is in contact with the third pole 103 of the power chip 1 for conduction, so as to realize the conduction connection between the third pole 103 of the power chip 1 and the corresponding conductive structure on the tooling or fixture on the test equipment.

[0054] Specifically, in this embodiment, the power chip 1 has three conductive electrodes (respectively a first electrode 101, a second electrode 102 and a third electrode 103), wherein the first electrode 101 is a drain electrode, the second electrode 102 is a source electrode, and the third electrode 103 is a gate electrode. Figure 2 and Figure 5 As shown, the chip receiving groove 11 has a second connecting area connected to the first pole piece groove 15 and a second solid area not connected to the first pole piece groove 15, and the second solid area is an "L"-shaped area. The second pole piece groove 16 is arranged in the second solid area and passes through the surface of the second solid area and the second surface 13 of the insulating plate shell 10.

[0055] This embodiment changes the size of the bare die and the layout of each conductive electrode at the chip level, thereby achieving compatibility with various chips without changing the tooling of the chip sorting machine and other equipment itself.

[0056] like Figures 3 to 5 As shown, the third conductive electrode piece 40 includes an external connection portion 41 and an internal connection portion 42 connected to each other, the external connection portion 41 is arranged in the second electrode piece groove 16, and the internal connection portion 42 extends into the chip receiving groove 11 and contacts and conducts with the third electrode 103. Among them, the external connection portion 41 can be exposed to the insulating plate shell 10 through the second electrode piece groove 16 to conduct with the corresponding conduction structure on the tooling or fixture on the test equipment, and the internal connection portion 42 extends into the chip receiving groove 11 to conduct with the third electrode 103 of the power chip 1, thereby realizing the conduction connection between the third electrode 103 and the corresponding conduction structure on the tooling or fixture on the test equipment.

[0057] Specifically, the third pole 103 is generally arranged in the middle position of the power chip 1 in the first direction a and has a small area. By setting the internal connection part 42, the conductive connection between the third pole 103 and the external connection part 41 can be achieved; and the internal connection part 42 can be connected and matched with the surface of the second physical area of ​​the chip accommodating groove 11 to limit the third conductive electrode 40 from being separated from the second electrode groove 16, so as to facilitate the connection between the third conductive electrode 40 and the insulating plate shell 10, and ensure the connection stability between the third conductive electrode 40 and the insulating plate shell 10.

[0058] like Figures 1 to 5 As shown, the insulating plate shell 10 is provided with an oil filling hole 17 connected to the chip receiving groove 11, and the test set also includes a first blocking member 50 which can be opened and closed at the notch of the chip receiving groove 11 and a second blocking member 60 which is provided at the oil filling hole 17. After the power chip 1 is inserted into the chip receiving groove 11, the notch of the chip receiving groove 11 can be blocked by the first blocking member 50 to prevent the power chip 1 from withdrawing. The setting of the oil filling hole 17 enables insulating oil to be injected into the chip receiving groove 11 through the oil filling hole 17 when the performance test of the power chip 1 is performed through the test set, and the oil filling hole 17 is blocked by the second blocking member 60 after the operation of injecting the insulating oil is completed. The arrangement of the first blocking member 50 and the second blocking member 60 can enable the chip accommodating groove 11 to form a closed space, and after the insulating oil is injected, the air in the chip accommodating groove 11 can be squeezed out, thereby ensuring the insulation performance between other components except the conductive connection between the first pole 101 and the first conductive electrode piece 20, the conductive connection between the second pole 102 and the second conductive electrode piece 30, and the conductive connection between the third pole 103 and the third conductive electrode piece 40, thereby changing the creepage distance between the conductive electrodes of the power chip 1 from the distance along the outer surface of the power chip 1 to the distance along the outer surface of the test set, that is, when the test set of this embodiment is used to test the power chip 1, the power chip 1 has a larger creepage distance, thereby improving the external insulation performance of the power chip 1 during electrical testing, effectively increasing the test voltage of the power chip 1, and then being able to measure the rated voltage of the power chip 1.

[0059] like Figure 3 and Figure 5As shown, the first blocking member 50 includes a blocking cover plate 51 hingedly connected to the insulating plate shell 10 and a sealing strip 52 arranged on the side of the blocking cover plate 51 facing the insulating plate shell 10. The blocking cover plate 51 is hingedly connected to the insulating plate shell 10, so that when the first blocking member 50 is exposed from the notch of the chip receiving slot 11, the first blocking member 50 is still connected to the insulating plate shell 10, rather than being placed independently, which can prevent the first blocking member 50 from being lost when placed alone. Among them, the sealing strip 52 is arranged on the side of the blocking cover plate 51 facing the insulating plate shell 10 and has a certain elastic deformation ability. When the first blocking member 50 blocks the notch of the chip receiving slot 11, the insulating plate shell 10 and the blocking cover plate 51 respectively squeeze the sealing strip 52 to ensure the sealing performance of the chip receiving slot 11 and prevent leakage of insulating oil.

[0060] like Figure 3 and Figure 5 As shown, a first avoidance recess 18 is provided on one side of the insulating plate shell 10 close to the notch of the chip receiving slot 11, and a second avoidance recess 23 corresponding to the first avoidance recess 18 is provided on the first conductive electrode 20. Specifically, the first avoidance recess 18 and the second avoidance recess 23 are concave structures that are recessed toward the inner side of the chip receiving slot 11, forming a notch structure that can be inserted by an operating tool (for example, a vacuum suction device or tweezers, etc.), so as to facilitate the insertion of the power chip 1 into the chip receiving slot 11 and the removal of the power chip 1 from the chip receiving slot 11.

[0061] Specifically, in the present embodiment, both the first avoidance recess 18 and the second avoidance recess 23 have arc-shaped concave surfaces.

[0062] Correspondingly, if Figure 2 As shown, the sealing strip 52 also has a protrusion matched with the first avoidance recess 18 and the second avoidance recess 23 to ensure the sealing effect of the chip receiving groove 11.

[0063] like Figure 2 , Figure 3 and Figure 5 As shown, the free end of the blocking cover plate 51 is provided with a first clamping portion 511, and the insulating plate shell 10 is provided with a second clamping portion 71 that can be clamped and matched with the first clamping portion 511. The clamping and matching between the first clamping portion 511 and the second clamping portion 71 ensures the blocking stability when the first blocking member 50 blocks the notch of the chip receiving groove 11.

[0064] Specifically, Figure 2As shown, in this embodiment, a connecting plate is provided at the free end of the blocking cover plate 51, the first clamping portion 511 is a first clamping block provided at one end of the connecting plate away from the blocking cover plate 51, and the second clamping portion 71 is a clamping notch provided on the side 14 of the insulating plate shell 10, the clamping notch is adapted to the shape of the first clamping block, and a guiding inclined surface is provided on the first clamping block. When the first blocking member 50 is switched from the state of exposing the notch of the chip receiving slot 11 to the state of blocking the notch of the chip receiving slot 11, the guiding inclined surface on the first clamping block will abut against the side 14 of the insulating plate shell 10, thereby causing the connecting plate to be slightly deformed to avoid the side 14 of the insulating plate shell 10, and when the first clamping block moves to a position corresponding to the clamping notch, the connecting plate rebounds and causes the first clamping block to be inserted into the clamping notch, thereby realizing the clamping fit between the first clamping portion 511 and the second clamping portion 71. An operating protrusion is also provided at one end of the connecting plate away from the blocking cover plate 51. The operating protrusion and the first clamping block are respectively arranged on both sides of the connecting plate. After completing the test of the power chip 1, the operator can use the operating protrusion to drive the first clamping portion 511 to move to a state of disengagement from the second clamping portion 71, thereby allowing the first blocking member 50 to move to a state of avoiding the notch of the chip accommodating groove 11.

[0065] Preferably, a torsion spring structure can be arranged at the hinge position of the sealing cover plate 51 and the insulating plate shell 10, and the torsion spring structure applies a force to the first sealing member 50 so that the first sealing member 50 remains in a state of exposing the notch of the chip receiving groove 11, so that when the first clamping portion 511 moves to a position where it is disengaged from the second clamping portion 71, the first sealing member 50 can automatically pop open under the action of the torsion spring.

[0066] In this embodiment, the insulating plate shell 10 is made of one or more of ceramic, glass, PPS and PPA. These materials are organic insulating materials with high resistance to electrical tracking, high temperature and high voltage, which increase the tolerance of the power chip 1 itself to surface discharge.

[0067] The first conductive electrode 20 , the second conductive electrode 30 and the third conductive electrode 40 are made of one or more of copper, aluminum, gold and silver.

[0068] Specifically, in this embodiment, the first conductive electrode 20, the second conductive electrode 30 and the third conductive electrode 40 are all planar metal sheet structures. A gold, silver or nickel metal plating layer may be provided on the outer surface of the metal sheet structure to prevent oxidation.

[0069] Specifically, in this embodiment, the first conductive electrode 20 is arranged in parallel with the second conductive electrode 30 and the third conductive electrode 40, and the area of ​​the first conductive electrode 20 is as close as possible to the area of ​​the second conductive electrode 30 to reduce parasitic inductance, which helps to increase the accuracy of the test.

[0070] In an embodiment not shown in the figure, the first conductive electrode piece, the second conductive electrode piece and the third conductive electrode piece may be deformed to further ensure the conductive performance between each conductive electrode piece and the corresponding conductive electrode on the power chip.

[0071] For example, the first conductive electrode piece is a first arc-shaped structure and is protruded toward the power chip; the second conductive electrode piece is a second arc-shaped structure and is protruded toward the power chip; and the third conductive electrode piece is a third arc-shaped structure and is protruded toward the power chip.

[0072] Among them, the first conductive electrode piece, the second conductive electrode piece and the third conductive electrode piece are all arc-shaped structures and have a certain elastic deformation ability. When the power chip is not inserted into the chip receiving groove, the distance between the innermost side of the first conductive electrode piece and the innermost side of the second conductive electrode piece in the thickness direction of the test sleeve is less than the thickness of the power chip. When the power chip is inserted into the chip receiving groove, the power chip presses the first conductive electrode piece and the second conductive electrode piece outwardly, so that the first conductive electrode piece and the second conductive electrode piece are pressed tightly against the power chip, which can achieve good electrical connection between the first conductive electrode piece and the second conductive electrode piece and the power chip, and can reduce birth control. parameters and contact resistance, and at the same time, the power chip can be fixed in the test sleeve without displacement and movement; when the power chip is not inserted in the chip receiving groove, the distance between the innermost side of the first conductive electrode piece and the innermost side of the third conductive electrode piece in the thickness direction of the test sleeve is smaller than the thickness of the power chip, and when the power chip is inserted in the chip receiving groove, the power chip presses the first conductive electrode piece and the third conductive electrode piece outwardly, so that the first conductive electrode piece and the third conductive electrode piece are pressed tightly against the power chip, so that good electrical connection between the first conductive electrode piece and the third conductive electrode piece and the power chip can be achieved, and the birth control parameters and contact resistance can be reduced.

[0073] For another example, a first conductive protrusion is arranged on the surface of the first conductive electrode piece facing the power chip; a second conductive protrusion is arranged on the surface of the second conductive electrode piece facing the power chip; and a third conductive protrusion is arranged on the surface of the third conductive electrode piece facing the power chip.

[0074] Among them, when the power chip is not inserted into the chip receiving slot, the distance between the innermost side of the first conductive protrusion and the innermost side of the second conductive protrusion in the thickness direction of the test sleeve is less than the thickness of the power chip. When the power chip is inserted into the chip receiving slot, the power chip presses outward against the first conductive protrusion and the second conductive protrusion, so that the first conductive protrusion and the second conductive protrusion press the power chip; when the power chip is not inserted into the chip receiving slot, the distance between the innermost side of the first conductive protrusion and the innermost side of the third conductive protrusion in the thickness direction of the test sleeve is less than the thickness of the power chip. When the power chip is inserted into the chip receiving slot, the power chip presses outward against the first conductive protrusion and the third conductive protrusion, so that the first conductive protrusion and the third conductive protrusion press the power chip.

[0075] In addition, since the first conductive protrusion, the second conductive protrusion and the third conductive protrusion are provided, during the process of inserting the power chip into the chip receiving groove, the friction between the power chip and the first conductive protrusion, the second conductive protrusion and the third conductive protrusion is small, so that the resistance to the insertion of the power chip is small.

[0076] Specifically, the first conductive protrusion, the second conductive protrusion and the third conductive protrusion can be hemispherical bump structures arranged on the corresponding conductive electrode pieces; or, a mounting port can be set on each conductive electrode piece, and a spring structure can be set at the mounting port, and the conductive protrusion is formed on the inner surface of the spring structure.

[0077] like Figure 3 As shown, the power chip 1 also includes a terminal structure 104 located at the periphery of the second pole 102 and the third pole 103. The power chip 1 can be completely inserted into the test set, and the insulating plate shell 10 completely covers the terminal structure 104. It can isolate the air to the greatest extent, further ensuring that the interface between the terminal structure 104 and the air is not broken down during the high voltage test, and avoiding discharge around the power chip 1 during the high voltage test to the greatest extent.

[0078] The present embodiment provides a high-voltage and low-inductance test set capable of changing the size of a power chip, which can be applied to dynamic parameter testing, static parameter testing, and chip sorting testing of high-voltage semiconductor chips (e.g., IGBT chips, MOSFET chips, diodes, etc.) above 3.3kV. The test set of the present embodiment can be applied to the currently common 0-6.5kV silicon carbide MOSFET, diodes, IGBT and other chips, as well as high voltage, high temperature, high current and other test conditions. The use of insulating oil and compact structural design reduces the loop length, and by making the first conductive electrode piece 20 parallel to the second conductive electrode piece 30 and the third conductive electrode piece 40 and the area of ​​the first conductive electrode piece 20 as close as possible to the area of ​​the second conductive electrode piece 30, while meeting the packaging insulation requirements, the inductance of the test set is reduced, the compatibility problem of chip testing equipment is solved from the chip level, the equipment test tooling requirements for high-voltage power semiconductor chip testing are reduced, and the ordering time and chip testing costs are saved.

[0079] In this embodiment, the power chip 1 is a chip with three conduction poles. In an embodiment not shown in the figure, the test set of the present application can also be used to test a chip with two conduction poles. Specifically, the power chip includes a cathode arranged at the lower side and an anode arranged at the upper side, and the test set includes an insulating plate shell, a first conduction pole piece arranged at the bottom of the insulating plate shell, and a second conduction pole piece arranged at the top of the insulating plate shell. Since the power chip has no gate, the third conduction pole piece is not arranged on the test set.

[0080] Figures 6 to 10 A schematic structural diagram of a second embodiment of the test set according to the present application is shown. The following mainly describes the parts of the second embodiment that are different from the first embodiment in conjunction with the drawings, and the same parts of the two embodiments are not repeated here.

[0081] like Figure 6 , Figure 7 and Fig. 9 As shown, the test set also includes an operating part 72 and a first retaining member 73 movably arranged on the insulating plate shell 10, the second clamping part 71 is connected to the operating part 72 and can move synchronously with the operating part 72, the second clamping part 71 has a clamping position for clamping with the first clamping part 511 and a separation position separated from the first clamping part 511, and the first retaining member 73 applies a retaining force to the operating part 72 and / or the second clamping part 71 so that the second clamping part 71 is maintained in the clamping position.

[0082] Specifically, in this embodiment, a connecting plate is provided at the free end of the blocking cover plate 51, the first clamping portion 511 is a second clamping block provided at one end of the connecting plate away from the blocking cover plate 51, the second clamping portion 71 is a third clamping block movably provided on the insulating plate shell 10, and the second clamping block and the third clamping block can be hooked and matched to keep the first blocking member 50 at the position of blocking the notch of the chip receiving slot 11. The first retaining member 73 is a compression spring structure, which exerts an outward (i.e., toward) pressure on the operating portion 72. Figure 6 The elastic push force of the first retaining member 73 (below the insulating plate 10) keeps the third block in the state of extending out of the side 14 of the insulating plate shell 10. The second block and the third block are both provided with guiding inclined surfaces. When the first blocking member 50 is switched from the state of exposing the notch of the chip receiving slot 11 to the process of blocking the notch of the chip receiving slot 11, the guiding inclined surfaces on the second block and the third block are pressed against each other, and the second block pushes the third block inward and overcomes the elastic push force of the first retaining member 73 so that the third block avoids the second block. After the second block passes over the third block, the third block moves outward under the action of the first retaining member 73 and engages with the second block. After the test of the power chip 1 is completed, the staff can drive the third block to move toward the inner side of the insulating plate shell 10 by pressing the operating part 72, so that the third block is no longer engaged with the second block, so that the first blocking member 50 can be switched from the state of blocking the notch of the chip receiving slot 11 to the state of avoiding the notch of the chip receiving slot 11. Preferably, a torsion spring structure is arranged at the hinged position of the sealing cover plate 51 and the insulating plate shell 10, and the torsion spring structure applies a force to the first sealing member 50 so that the first sealing member 50 remains in a state of exposing the notch of the chip receiving groove 11, so that when the third blocking block moves to a position where it is disengaged from the second blocking block, the first blocking member 50 can automatically pop open under the action of the torsion spring.

[0083] like Figure 6 , Figure 7 , Fig. 9 and Fig.10As shown, the test set also includes a push piece 81 and a second retaining piece 82 arranged on the insulating plate shell 10. The push piece 81 has a push state of extending into the chip receiving groove 11 and pushing the power chip 1 outwards and a evasive state of exiting the chip receiving groove 11. The second retaining piece 82 can limit the push piece 81 so that the push piece 81 remains in the evasive state. The operating part 72 drives and cooperates with the push piece 81 and can switch the push piece 81 from the evasive state to the push state. After the test of the power chip 1 is completed, the power chip 1 can be pushed outwards by the push piece 81, so that the power chip 1 extends a longer distance from the chip receiving groove 11, so that the size of the part that can be clamped by the operator using a tool is larger, which is convenient for the operator to take the power chip 1 out of the chip receiving groove 11. The operating portion 72 can cooperate with the push-out member 81 to switch the push-out member 81 from the avoidance state to the push-out state, that is, the operating portion 72 can be used to drive the second clamping portion 71 to switch states, and can also be used to control the push-out member 81 to switch states, thereby realizing functional integration and simplifying the internal structure of the test set.

[0084] like Figures 6 to 8 As shown, when the second clamping portion 71 is located at the clamping position, the operating portion 72 is separated from the ejecting member 81 and has a preset distance L1, and the preset distance L1 is greater than the clamping length L2 of the first clamping portion 511 and the second clamping portion 71. The clamping length L2 between the first clamping portion 511 and the second clamping portion 71 refers to the overlapping dimension of the first clamping portion 511 and the second clamping portion 71 in the second direction b when the first clamping portion 511 and the second clamping portion 71 are clamped together, that is, when the clamping state between the first clamping portion 511 and the second clamping portion 71 needs to be released, it is only necessary to control the operating portion 72 to move the clamping length L2 toward the inner side of the insulating plate shell 10. When the second engaging portion 71 is in the engaging position, the preset distance L1 between the operating portion 72 and the ejecting member 81 is greater than the engaging length L2, that is, when the operating portion 72 drives the second engaging portion 71 to move to a state of disengaging from the first engaging portion 511, there is still a certain interval between the operating portion 72 and the ejecting member 81. The user continues to control the operating portion 72 to move toward the inner side of the insulating plate shell 10 to enable the ejecting member 81 to switch from the avoiding state to the ejecting state, thereby first releasing the engaging state of the second engaging portion 71 and then pushing the power chip 1 outward. In this process, the operator only needs to control the operating portion 72 to move toward the inside of the insulating plate shell 10, that is, the second engaging portion 71 and the ejecting member 81 are moved successively through one operating action of the operator, thereby simplifying the operation of the operator.

[0085] like Figures 6 to 10As shown, the ejection member 81 includes an ejection spring arm 811 and an ejection spring 812, the ejection spring arm 811 is provided with a clamping protrusion 8111, the second retaining member 82 is a clamping groove provided on the insulating plate shell 10, when the ejection member 81 is in the avoidance state, the clamping protrusion 8111 is clamped in the clamping groove, the ejection spring arm 811 compresses the ejection spring 812, the operating part 72 is driven and cooperated with the clamping protrusion 8111 and can drive the clamping protrusion 8111 to disengage from the clamping groove, so that the ejection spring arm 811 extends into the chip accommodating groove 11 under the action of the ejection spring 812 and pushes the power chip 1 outward. When the ejecting member 81 is in the avoidance state, the engaging protrusion 8111 is engaged in the engaging slot, and the side wall of the engaging slot stops the engaging protrusion 8111 and limits the engaging protrusion 8111 from moving toward the chip receiving slot 11, that is, limits the pushing spring arm 811 from moving toward the chip receiving slot 11 and pushing the power chip 1 outward; when the power chip 1 needs to be taken out, the engaging protrusion 8111 is pushed out by the operating part 72, so that the engaging protrusion 8111 is disengaged from the engaging slot. At this time, the pushing spring arm 811 is slightly deformed and the pushing spring 812 pushes the pushing spring arm 811 toward the chip receiving slot 11. In the process of moving the pushing spring arm 811 toward the chip receiving slot 11, the power chip 1 is exerted with an outward force, thereby causing the power chip 1 to move outward a certain distance, making it convenient for the operator to take out the power chip 1.

[0086] Specifically, Figures 6 to 10 As shown, in order to arrange the ejection member 81, the second clamping portion 71, the operating portion 72 and the first retaining member 73, a mounting groove 19 is provided on the first surface 12 of the insulating plate shell 10. The shape of the mounting groove 19 is adapted to the shape of the ejection member 81, the second clamping portion 71, the operating portion 72 and the first retaining member 73, and can accommodate these components and guide the movement of the ejection member 81, the second clamping portion 71 and the operating portion 72 and limit the position at the extreme position.

[0087] like Figure 6 and Fig. 9 As shown, the operating portion 72 is an "L"-shaped rod-like structure, the operating portion 72 includes a first rod segment extending along the first direction a and a second rod segment extending along the second direction b, the second clamping portion 71 is arranged at the free end of the first rod segment and extends in the second direction b in a direction away from the second rod segment, the free end of the second clamping portion 71 can pass through the side surface 14 of the insulating plate shell 10 and be clamped with the first clamping portion 511, the mounting groove 19 includes a first groove segment for accommodating the first rod segment, the first retaining member 73 is also arranged in the first groove segment, and the first retaining member 73 is a spring structure, the two ends of the first retaining member 73 respectively abut against the side wall of the first rod segment and the side wall of the first groove segment and apply a force along the second direction b to the first rod segment, specifically toward Figure 6The first rod section is pressed against the bottom of the first blocking member 50 so that the second clamping portion 71 remains in a state of extending out of the side surface 14; during the movement of the first blocking member 50 toward the position of blocking the notch of the chip receiving groove 11, the first clamping portion 511 will move toward Figure 6 The second clamping portion 71 is pushed upward in the middle, so that the second clamping portion 71 and the first rod segment overcome the elastic force of the first retaining member 73 and move toward Figure 6 When the first clamping portion 511 moves upward Figure 6 After the second clamping portion 71 is moved to the right side of the rod, the second clamping portion 71 and the first rod segment move to the right side of the rod under the force of the first retaining member 73. Figure 6 Move downward in the middle so that the second clamping portion 71 is clamped and matched with the first clamping portion 511.

[0088] An operating block is provided at the connection position between the first rod segment and the second rod segment. The operating block extends in the second direction b in a direction away from the second rod segment and can be exposed at the side surface 14 of the insulating plate shell 10, that is, the operating block and the second clamping portion extend in the same direction, so that the user can push the operating portion 72 toward the Figure 6 The second engaging portion 71 will also move with it.

[0089] Preferably, an opening structure for exposing the operating block is provided on the side surface 14 of the insulating plate shell 10, but the operating block never extends outward from the side surface 14 of the insulating plate shell 10, so that the operator can operate the operating block only by using tools, thereby preventing the operator from accidentally triggering the operating block.

[0090] The mounting groove 19 further comprises a second groove section for accommodating the second rod section. The second groove section is communicated with the first groove section. The second rod section is movably disposed in the second groove section in the second direction b.

[0091] The mounting groove 19 further includes a third groove section for accommodating the ejector 81, the third groove section is connected to the second groove section and the chip accommodating groove 11, the ejector 81 is movably arranged in the third groove section along the first direction a, and the portion of the second groove section close to the third groove section forms a clamping groove for clamping with the clamping protrusion 8111. Figure 6 and Figure 7 As shown in the figure, when the ejection member 81 is in the avoidance state, the main parts of the ejection spring 812 and the ejection spring arm 811 are located in the third groove section, the engaging protrusion 8111 is located in the engaging groove, and the groove wall of the engaging groove stops the engaging protrusion 8111; when the operator controls the operating part 72 to move toward Figure 6 After the second rod segment moves upward and pushes the clamping protrusion 8111 above, the pushing elastic arm 811 undergoes slight elastic deformation, the clamping protrusion 8111 enters the third slot segment, and the pushing elastic arm 811 moves upward under the action of the pushing spring 812. Figure 6The part of the push-up spring arm 811 moves to the left side of the chip receiving groove 11 and moves to the Figure 6 The left side of the push-up power chip 1, at this time the push-up member 81 is in Fig. 9 and Fig.10 The state shown (i.e. the push-up state).

[0092] When the power chip 1 is inserted into the chip receiving slot 11, the power chip 1 will Fig.10 The right side push-up spring arm 811 in the middle, when the power chip 1 is plugged in place, the clamping protrusion 8111 is pushed to the position corresponding to the second slot section, and the clamping protrusion 8111 enters the second slot section under the elastic restoring force of the push-up spring arm 811 itself and cooperates with the slot wall stopper of the second slot section. At this time, the push-up member 81 is in Figure 6 and Figure 7 The state shown in (i.e., the avoidance state).

[0093] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the devices or elements referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention. The directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0094] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used herein are interpreted accordingly.

[0095] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0096] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A test kit for a power chip, characterized in that: include: An insulating plate shell (10) having a chip receiving slot (11) for inserting a power chip (1); A first conductive electrode piece (20) is arranged on the insulating plate shell (10) and has a first conductive surface (21) abutting against the first electrode (101) of the power chip (1) and a second conductive surface (22) exposed outside the insulating plate shell (10), wherein the second conductive surface (22) is conductively connected to a corresponding conductive structure on a tool or fixture on the test equipment; A second conductive electrode piece (30) is arranged on the insulating plate shell (10) and has a third conductive surface (31) abutting against the second electrode (102) of the power chip (1) and a fourth conductive surface (32) exposed outside the insulating plate shell (10), the fourth conductive surface (32) being conductively connected to a corresponding conductive structure on a tool or fixture on the test equipment; The insulating plate shell (10) has a first surface (12) and a second surface (13) arranged opposite to each other, and a plurality of side surfaces (14) located between the first surface (12) and the second surface (13); the chip receiving groove (11) is arranged on the first surface (12); the chip receiving groove (11) passes through one of the side surfaces (14) of the insulating plate shell (10); the first conductive electrode (20) is connected to the first surface (12) and blocks the chip receiving groove (11); a first electrode groove (15) is arranged on the second surface (13); part of the first electrode groove (15) and part of the chip receiving groove (11) are overlapped and communicated with each other; and the second conductive electrode (30) is arranged in the first electrode groove (15); The second surface (13) is also provided with a second pole piece groove (16) spaced apart from the first pole piece groove (15); the second pole piece groove (16) and the chip receiving groove (11) are overlapped and communicated with each other; the test set further comprises a third conductive pole piece (40); the third conductive pole piece (40) is arranged in the second pole piece groove (16) and is in contact with and conductive to the third pole (103) of the power chip (1); The insulating plate shell (10) is provided with an oil filling hole (17) connected to the chip receiving groove (11), and the test sleeve further comprises a first blocking member (50) which is openably and closably arranged at the notch of the chip receiving groove (11) and a second blocking member (60) which is arranged at the oil filling hole (17).

2. The test set according to claim 1, characterized in that: The third conductive electrode (40) comprises an external connection portion (41) and an internal connection portion (42) which are connected to each other, the external connection portion (41) being arranged in the second electrode slot (16), and the internal connection portion (42) extending into the chip receiving slot (11) and contacting and conducting with the third electrode (103).

3. The test set according to claim 1, characterized in that: The first conductive electrode (20) is a first arc-shaped structure and is arranged to protrude toward the power chip (1); and / or, The second conductive electrode (30) is a second arc-shaped structure and is arranged to protrude toward the power chip (1); and / or, The third conductive electrode (40) is a third arc-shaped structure and is arranged to protrude toward the power chip (1).

4. The test set according to claim 1, characterized in that: A first conducting protrusion is provided on a surface of the first conducting electrode sheet (20) facing the power chip (1); and / or, A second conducting protrusion is provided on the surface of the second conducting electrode sheet (30) facing the power chip (1); and / or, A third conducting protrusion is provided on the surface of the third conducting electrode piece (40) facing the power chip (1).

5. The test set according to claim 1, characterized in that: The first sealing member (50) comprises a sealing cover plate (51) hingedly connected to the insulating plate shell (10) and a sealing strip (52) arranged on a side of the sealing cover plate (51) facing the insulating plate shell (10).

6. The test set according to claim 5, characterized in that: A first avoidance recess (18) is provided on one side of the insulating plate shell (10) close to the notch of the chip receiving groove (11), and a second avoidance recess (23) corresponding to the first avoidance recess (18) is provided on the first conductive electrode (20).

7. The test set according to claim 5, characterized in that: The free end of the blocking cover plate (51) is provided with a first clamping portion (511), and the insulating plate shell (10) is provided with a second clamping portion (71) capable of clamping and cooperating with the first clamping portion (511).

8. The test set according to claim 7, characterized in that: The test kit further comprises an operating portion (72) and a first retaining member (73) movably arranged on the insulating plate shell (10); the second clamping portion (71) is connected to the operating portion (72) and is capable of moving synchronously with the operating portion (72); the second clamping portion (71) has a clamping position for clamping with the first clamping portion (511) and a separation position for separating from the first clamping portion (511); the first retaining member (73) applies a retaining force to the operating portion (72) and / or the second clamping portion (71) so that the second clamping portion (71) is retained in the clamping position.

9. The test set according to claim 8, characterized in that: The test kit further comprises a push-up member (81) and a second retaining member (82) arranged on the insulating plate shell (10); the push-up member (81) has a push-up state in which it extends into the chip receiving slot (11) and pushes the power chip (1) outwardly, and a avoidance state in which it exits the chip receiving slot (11); the second retaining member (82) can limit the push-up member (81) so that the push-up member (81) remains in the avoidance state; the operating portion (72) is driven to cooperate with the push-up member (81) and can switch the push-up member (81) from the avoidance state to the push-up state.

10. The test set according to claim 9, characterized in that: When the second clamping portion (71) is located at the clamping position, the operating portion (72) is separated from the ejecting member (81) and has a preset distance (L1), and the preset distance (L1) is greater than a clamping length (L2) between the first clamping portion (511) and the second clamping portion (71); and / or, The ejection member (81) comprises an ejection spring arm (811) and an ejection spring (812); the ejection spring arm (811) is provided with a locking protrusion (8111); the second retaining member (82) is a locking groove provided on the insulating plate shell (10); when the ejection member (81) is in the avoidance state, the locking protrusion (8111) is locked in the locking groove, the ejection spring arm (811) compresses the ejection spring (812), and the operating part (72) is driven to cooperate with the locking protrusion (8111) and can drive the locking protrusion (8111) to disengage from the locking groove, so that the ejection spring arm (811) extends into the chip accommodating groove (11) under the action of the ejection spring (812) and pushes the power chip (1) outward.

11. The test kit according to any one of claims 1 to 4, characterized in that: The material of the insulating plate shell (10) is one or more of ceramic, glass, PPS and PPA.

12. The test kit according to any one of claims 1 to 4, characterized in that: The material of the first conductive electrode (20) and the second conductive electrode (30) is one or more of copper, aluminum, gold and silver.

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