A special test device for detecting resistance of micro semiconductor chips

Abstract

The present invention relates to the field of semiconductor detection technology, and discloses a special test device for detecting the resistance of a micro-semiconductor wafer. The device comprises a four-probe tester and a power switch, wherein the power switch is mounted on the outer wall of the four-probe tester, the top of the four-probe tester is fixedly connected to a test bench, four-probe probes are plugged into the outer wall of the four-probe tester, a position adjustment pretreatment component for stably adjusting the movement of a slider is arranged above the four-probe tester, and a sleeve isolation and anti-fouling component for protective adjustment of the four-probe probes is arranged above the four-probe tester; the four-probe probe tips are prevented from being affected by distance and force factors caused by manual operation through adjustment, and the outer wall of the semiconductor wafer can be pretreated and clamped and positioned at the same time, and protective measures are taken for the four-probe probes in the non-detection stage to ensure the accuracy of test process data.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor detection, in particular to a special testing device for detecting resistance of micro semiconductor chips. Background Art

[0002] A micro semiconductor refrigeration chip, also known as a micro semiconductor cooling chip or thermoelectric refrigeration chip, is a device that uses the thermoelectric effect of semiconductor materials to achieve cooling function. Resistance is one of the important electrical parameters of micro semiconductor chips. Its value directly affects the working state and performance of the device. By testing the resistance, it is possible to evaluate whether the micro semiconductor chip meets the design requirements, thereby ensuring that the device has stable performance within the normal working range.

[0003] In real life, when testing the resistance of micro-semiconductor wafers, a dedicated instrument called a four-probe tester is often used. The four-probe method squeezes the surface of the semiconductor wafer to test the resistance value. However, existing instruments can only adjust the distance between the four-probe probe and the semiconductor wafer by turning a knob and moving the slider up and down. Due to the human factor in manual adjustment, the distance and force of each adjustment may vary, which will affect the consistency and stability of the product. If the four-probe probe accidentally falls off, the four-probe probe will impact and squeeze the semiconductor wafer under the action of gravity, causing damage to the semiconductor and affecting subsequent testing.

[0004] Furthermore, the probes of a four-probe tester are components that directly contact the surface of the semiconductor wafer to be tested. If the probes are contaminated or damaged, the accuracy of the test will be directly affected. When the four-probe tester is idle and not testing, it is suspended above the instrument and will inevitably be affected by dust particles. If dust particles adhere to the outer wall, the contaminants in the test environment during subsequent testing will cause poor contact or test errors.

[0005] Therefore, a special test device for detecting the resistance of micro semiconductor wafers is proposed. Summary of the Invention

[0006] The purpose of the present invention is to provide a special test device for detecting the resistance of micro semiconductor chips to solve the problems raised in the above background technology.

[0007] To achieve the above-mentioned object, the present invention provides the following technical solution: a special test device for detecting the resistance of micro-semiconductor wafers, comprising a four-probe tester and a power switch, wherein the power switch is mounted on the outer wall of the four-probe tester, the top of the four-probe tester is fixedly connected to a test bench, the upper surface of the test bench is fixedly connected to a vertical pole, a slider is slidably connected to the outer wall of the vertical pole, a four-probe probe is plugged into the outer wall of the four-probe tester, one end of the four-probe probe away from the four-probe tester is fixedly connected to the slider, a button is threadedly connected to the middle part of the slider, a position adjustment pretreatment component for stabilizing the movement of the slider is provided above the four-probe tester, and a sleeve isolation and anti-fouling component for protective adjustment of the four-probe probe is provided above the four-probe tester, wherein:

[0008] The position adjustment pretreatment component includes a lifting rack, which is slidably connected to the outer wall of the test bench, and a connecting rod is fixedly connected to the end of the lifting rack away from the four-probe tester, and the connecting rod is fixedly connected to the slider at one end away from the lifting rack, and the connecting rod is slidably connected to the middle part of the test bench, and the middle part of the test bench is rotatably connected to a transmission gear, which is meshed with the lifting rack, and groove frames are rotatably connected on both sides of the rear of the test bench, and T-shaped plates are slidably connected to the inner walls of the groove frames on both sides, and connecting springs are provided inside the groove frames on both sides.

[0009] Preferably, one end of the connecting spring is fixedly connected to the T-shaped plate, the other end of the connecting spring is fixedly connected to the groove frame, and a reciprocating screw is fixedly connected to the middle part of the transmission gear, and the reciprocating screw is rotatably connected to the top of the four-probe tester.

[0010] Preferably, the outer wall of the reciprocating screw is threadedly connected to a roller, the top of the four-probe tester is fixedly connected to a guide rod, the guide rod and the reciprocating screw are symmetrically arranged around the center of the vertical rod, and the roller is slidably connected to the outer wall of the guide rod on the side away from the reciprocating screw.

[0011] Preferably, a rectangular hole is opened in the middle of the test bench, a bidirectional screw is rotatably connected inside the rectangular hole, arc blocks are threadedly connected on both sides of the outer wall of the bidirectional screw, the front end of the bidirectional screw and the end of the reciprocating screw away from the transmission gear are fixedly connected with pulleys, and the pulleys on both sides are connected by a connecting belt.

[0012] Preferably, the isolation and anti-fouling component includes an I-shaped plate, which is rotatably connected to the top of the four-probe tester, and the bottom of the I-shaped plate is fixedly connected to a receiving strip, and the inner wall of the receiving strip is fixedly connected to an electric telescopic rod, and the telescopic rod end of the electric telescopic rod is fixedly connected to a special-shaped block, and the special-shaped block is slidably connected to the bottom of the I-shaped plate, and the middle part of the I-shaped plate is fixedly connected to a connecting sleeve, and the inner wall of the connecting sleeve is slidably connected to a lifting rod, and the middle part of the lifting rod close to one end of the I-shaped plate is rotatably connected to a guide pulley, and the guide pulley is slidably connected to the bottom of the special-shaped block.

[0013] Preferably, a return spring is sleeved on the outer wall of the lifting rod, one end of the return spring is fixedly connected to the lifting rod, and the other end of the return spring is fixedly connected to the connecting sleeve.

[0014] Preferably, a limiting groove is provided in the middle of one side of the lifting rod close to the guide rod, the bottom of the receiving strip is fixedly connected to the limiting rod, the limiting rod and the limiting groove are slidably connected, and the end of the lifting rod away from the I-shaped plate is fixedly connected to a sheath, and the sheath is arranged on the outside of the four-probe probe.

[0015] Preferably, an arc-shaped groove is provided at the top of the four-probe tester on the side of the test bench, a guide ball is fixedly connected to the bottom of the receiving strip, the outer wall of the guide ball is slidably connected to the inner wall of the arc-shaped groove, and a magnetic plate is fixedly connected to the side of the top of the arc-shaped groove away from the test bench.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. By adjusting the vertical position of the slider by hand, the slider is buffered and supported while moving, and a lifting rack is set to move synchronously with the slider. When the four-probe probe is in contact with the semiconductor wafer downward, the lifting rack can move downward and squeeze the T-shaped plate into the groove frame through the springs connected on both sides to ensure the stability of the slider driving the four-probe probe to move and adjust, avoiding the influence caused by the difference in distance and hand strength. At the same time, as the lifting rack moves, it can drive the transmission gear meshing with it to rotate, and then drive the reciprocating screw fixedly connected to the transmission gear to rotate. With the cooperation of the guide rod, before testing the semiconductor wafer, the roller moves back and forth on the outer wall of the semiconductor wafer to be tested, and the particulate impurities on the surface are processed to reduce pollution and wear, and ensure the reliability of the test data. At the same time, with the rotation of the reciprocating screw, with the cooperation of the pulley group, it can also drive the bidirectional screw to rotate inside the rectangular hole, so as to realize the relative or opposite movement of the arc blocks on both sides, and adjust and position them according to the size of the semiconductor wafer placed on the test table to ensure stability during subsequent testing.

[0018] 2. By setting protective measures on the outer wall of the four-probe probe, after the semiconductor wafer test is completed, the power switch is used to control the power off of the magnetic plate, so that the iron guide ball adsorbed with it can be separated. The hand moves the I-shaped plate to rotate and slides inside the arc groove through the guide ball. The I-shaped plate is rotated 90 degrees clockwise from the longitudinal direction to the transverse direction, and the electric telescopic rod is extended to allow the guide pulley to slide from the bottom horizontal surface of the special-shaped block to the inclined surface, thereby reducing the downward pressure of the reset spring, allowing the lifting rod to move upward a certain distance, and with the assistance of the limit groove and the limit rod, the lifting rod can drive the sheath. It moves stably in the vertical direction. As the distance in the vertical direction is adjusted, the sheath can be placed on the outside of the four-probe probe to protect it. Correspondingly, when the semiconductor wafer is to be tested, after the power switch is turned on, the electric telescopic rod can be controlled to retract by an electrical signal, and the guide pulley is adjusted to slide from the upper surface of the special-shaped block to its bottom. The reset spring is compressed downward to move the lifting rod downward, and the sheath is separated from the four-probe probe. The magnetic plate is energized accordingly, so that the guide ball and the magnetic plate are attracted to each other, and the arc groove drives the sheath to rotate counterclockwise 90 degrees and return to a position close to the magnetic plate, so as not to affect the detection of semiconductor wafers.

[0019] 3. By providing buffer support and stable adjustment to the four-probe probe during the adjustment process, it is ensured that the tip of the four-probe probe can contact the semiconductor wafer at an appropriate moving speed and distance, reducing the influence of distance and force factors caused by manual operation, ensuring the integrity of the semiconductor wafer during the detection and testing process and avoiding damage. At the same time, it can complete the pretreatment of the outer wall of the side of the semiconductor wafer and clamp and position it, further and better improve the defects of interference factors in the detection and testing process, and take protective measures for the four-probe probe in the non-detection stage to avoid being suspended in the air and being contaminated by dust particles, avoid poor contact caused by subsequent detection, and ensure the accuracy of the test process data. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a three-dimensional schematic diagram of the overall device of the present invention;

[0021] Figure 2 It is a rear view schematic diagram of the overall device of the present invention;

[0022] Figure 3 For the present invention Figure 2 A magnified schematic diagram of point A in the middle;

[0023] Figure 4 It is a side view schematic diagram of the overall device of the present invention;

[0024] Figure 5 For the present invention Figure 4A magnified schematic diagram of point B in the middle;

[0025] Figure 6 It is a front view schematic diagram of the present invention;

[0026] Figure 7 It is a schematic top view of the overall device of the present invention;

[0027] Figure 8 Schematic diagram of a vertical cross-section of a four-probe probe of the present invention;

[0028] Figure 9 For the present invention Figure 8 Enlarged schematic diagram of point C in the middle;

[0029] Figure 10 For the present invention Figure 8 Enlarged schematic diagram of point D in the middle.

[0030] In the picture:

[0031] 1. Four-probe tester; 2. Power switch; 3. Test bench; 4. Pole; 5. Four-probe probe; 6. Slider; 7. Push button;

[0032] The position adjustment pre-processing assembly includes: 81, lifting rack; 82, connecting rod; 83, transmission gear; 84, groove frame; 85, T-shaped plate; 86, connecting spring; 87, reciprocating screw; 88, guide rod; 89, roller; 810, pulley; 811, connecting belt; 812, rectangular hole; 813, bidirectional screw; 814, arc block;

[0033] The isolation and anti-fouling components include: 91, I-shaped plate; 92, electric telescopic rod; 93, special-shaped block; 94, receiving slats; 95, connecting sleeve; 96, lifting rod; 97, guide pulley; 98, reset spring; 99, limit groove; 910, limit rod; 911, sheath; 912, arc groove; 913, guide ball; 914, magnetic plate. DETAILED DESCRIPTION

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0035] See also Figures 1 to 10, an embodiment of the present invention is provided: a special test device for detecting the resistance of micro-semiconductor wafers, comprising a four-probe tester 1 and a power switch 2, the power switch 2 being mounted on the outer wall of the four-probe tester 1, a test table 3 being fixedly connected to the top of the four-probe tester 1, a vertical pole 4 being fixedly connected to the upper surface of the test table 3, a slider 6 being slidably connected to the outer wall of the vertical pole 4, a four-probe probe 5 being plugged into the outer wall of the four-probe tester 1, the end of the four-probe probe 5 away from the four-probe tester 1 being fixedly connected to the slider 6, a button 7 being threadedly connected to the middle part of the slider 6, a position adjustment pre-processing component for adjusting the movement stability of the slider 6 being arranged above the four-probe tester 1, and a sleeve isolation and anti-fouling component for performing protective adjustment processing on the four-probe probe 5 being arranged above the four-probe tester 1, wherein:

[0036] The position adjustment pretreatment component includes a lifting rack 81, which is slidably connected to the outer wall of the test table 3, and the end of the lifting rack 81 away from the four-probe tester 1 is fixedly connected to the connecting rod 82, and the end of the connecting rod 82 away from the lifting rack 81 is fixedly connected to the slider 6, and the connecting rod 82 is slidably connected to the middle part of the test table 3, and the middle part of the test table 3 is rotatably connected to the transmission gear 83, and the transmission gear 83 is meshed with the lifting rack 81. The rear sides of the test table 3 are rotatably connected to the groove frames 84, and the inner walls of the groove frames 84 on both sides are slidably connected to the T-shaped plates 85. The interiors of the groove frames 84 on both sides are provided with connecting springs 86, one end of the connecting spring 86 is fixedly connected to the T-shaped plate 85, and the other end of the connecting spring 86 is fixedly connected to the groove frame 84, and the middle part of the transmission gear 83 is fixedly connected to the reciprocating screw rod 87, which is rotatably connected to the top of the four-probe tester 1;

[0037] Wherein: the inner wall of the transverse section of the groove frame 84 corresponds to and matches the T-shaped plate 85;

[0038] Better: Place the semiconductor wafer to be tested at the top center position of the test bench 3, rotate the paddle 7 counterclockwise to remove it, and manually adjust the position of the slider 6 by moving it downward. The lifting rack 81 is connected to the slider 6 through the connecting rod 82, so that it can move synchronously with the slider 6. During the downward movement of the lifting rack 81, the connecting spring 86 inside the groove frame 84 can be squeezed downward by the T-shaped plate 85, so that the slider 6 can be buffered and supported during the adjustment process, avoiding damage to the semiconductor wafer directly below due to improper manual operation. At the same time, as the lifting rack 81 moves, it can drive the transmission gear 83 meshing with it to rotate on the rear side of the test bench 3, and further drive the reciprocating screw 87 fixedly connected to the transmission gear 83 to rotate above the four-probe tester 1.

[0039] The outer wall of the reciprocating screw 87 is threadedly connected to a roller 89, and the top of the four-probe tester 1 is fixedly connected to a guide rod 88. The guide rod 88 and the reciprocating screw 87 are symmetrically arranged with the center of the vertical rod 4. The roller 89 is slidably connected to the outer wall of the guide rod 88 on the side away from the reciprocating screw 87. A rectangular hole 812 is opened in the middle of the test table 3. A bidirectional screw 813 is rotatably connected inside the rectangular hole 812. Both sides of the outer wall of the bidirectional screw 813 are threadedly connected to arc blocks 814. The front end of the bidirectional screw 813 and the end of the reciprocating screw 87 away from the transmission gear 83 are fixedly connected to a pulley 810, and the pulleys 810 on both sides are connected by a connecting belt 811;

[0040] Among them: the material of the roller 89 is polyethylene film, with pre-cut lines, the edge of the roller 89 is easy to peel off, the bottom of the roller 89 is set to correspond to the thickness of the semiconductor wafer, the outer walls of the two are in contact, the rectangular hole 812 is on the same straight line as the center line of the vertical rod 4, the two sides of the bidirectional screw 813 have opposite thread directions, and the inner wall of the arc block 814 is provided with multiple semi-cylinders, and the material is rubber;

[0041] Better: With the rotation of the reciprocating screw 87, the roller 89 threadedly connected to its outer wall can be moved toward the front side of the four-probe tester 1 with the cooperation of the guide rod 88, and slide on the surface of the semiconductor wafer to be tested. Correspondingly, when the semiconductor wafer is tested, the slider 6 is restored to its original position, and the lifting rack 81 moves upward synchronously, thereby driving the transmission gear 83 to rotate in the opposite direction, and then driving the reciprocating screw 87 to synchronously adjust the rotation direction, so that the roller 89 moves toward the back side of the four-probe tester 1 and slides on the surface of the semiconductor wafer to be tested, thereby achieving the purpose of removing dust or particles adhering to the outer wall of the semiconductor wafer back and forth during the adjustment process, thereby keeping the outer wall of the semiconductor wafer test clean. To avoid affecting the accuracy of the test data, as the reciprocating screw 87 rotates, the pulley 810 fixedly connected to one end of the transmission gear 83 rotates, and with the assistance of the connecting belt 811, it drives the pulley 810 on the other side to rotate synchronously, and then can drive the bidirectional screw 813 fixedly connected to this side pulley 810 to rotate inside the rectangular hole 812. At the same time, with the limit cooperation of the rectangular hole 812, the relative distance between the arc blocks 814 on both sides of the outer wall of the bidirectional screw 813 can be adjusted, and the size of the semiconductor wafer placed on the corresponding test table 3 can be adjusted to clamp and position it, ensuring that the four-probe probe 5 avoids sliding and offset when contacting the semiconductor wafer for testing, thereby ensuring the stability of the detection process.

[0042] The isolation and anti-fouling assembly includes an I-shaped plate 91, which is rotatably connected to the top of the four-probe tester 1. The bottom of the I-shaped plate 91 is fixedly connected to a receiving strip 94, and the inner wall of the receiving strip 94 is fixedly connected to an electric telescopic rod 92. The telescopic rod end of the electric telescopic rod 92 is fixedly connected to a special-shaped block 93, and the special-shaped block 93 is slidably connected to the bottom of the I-shaped plate 91. The middle part of the I-shaped plate 91 is fixedly connected to a connecting sleeve 95, and the inner wall of the connecting sleeve 95 is slidably connected to a lifting rod 96. The lifting rod 96 is rotatably connected to a guide pulley 97 at the middle of one end close to the I-shaped plate 91. The guide pulley 97 is slidably connected to the bottom of the special-shaped block 93, and a return spring 98 is sleeved on the outer wall of the lifting rod 96. One end of the return spring 98 is fixedly connected to the lifting rod 96, and the other end of the return spring 98 is fixedly connected to the connecting sleeve 95. A limiting groove 99 is provided in the middle of the side of the lifting rod 96 close to the guide rod 88. The bottom of the receiving strip 94 is fixedly connected to the limiting rod 910, and the limiting rod 910 is slidably connected to the limiting groove 99. The end of the lifting rod 96 away from the I-shaped plate 91 is fixedly connected to a sheath 911, which is sleeved on the outside of the four-probe probe 5;

[0043] The receiving strip 94 is configured to be L-shaped, the bottom of the special-shaped block 93 is configured to be horizontal and then tilted upward from left to right, the motion trajectory of the guide pulley 97 corresponds to the bottom of the special-shaped block 93, the limiting groove 99 and the limiting rod 910 are matched with each other, and the center point of the sheath 911 and the center point of the four-probe probe 5 are located on the same vertical line;

[0044] Better: Before preparing for the semiconductor manufacturing test operation, the power switch 2 controls the electric telescopic rod 92 to operate and extend, thereby driving the special-shaped block 93 to slide to the right on the outer wall of the I-shaped plate 91, so that the guide pulley 97 slides from the inclined surface to the horizontal plane from high to low along the bottom of the special-shaped block 93, and then the lifting rod 96 can be moved downward by squeezing the return spring 98 downward, so that the sheath 911 can be separated from the outer wall of the four-probe probe 5. The setting of the limit groove 99 and the limit rod 910 can guide the stable movement of the lifting rod 96 and the sheath 911.

[0045] The top of the four-probe tester 1 is located next to the test table 3 and is provided with an arc-shaped groove 912. A guide ball 913 is fixedly connected to the bottom of the receiving strip 94. The outer wall of the guide ball 913 is slidably connected to the inner wall of the arc-shaped groove 912. A magnetic plate 914 is fixedly connected to the top of the arc-shaped groove 912 on the side away from the test table 3.

[0046] The arc groove 912 is set to one-fourth of the annular groove, and the material of the guide ball 913 is metal iron.

[0047] Better: Since the probes of the four-probe tester 1 establish electrical contact with the object being tested on a microscopic scale, the probes are usually very small and sharp, which makes them vulnerable to damage. Any excessive force or improper use may cause damage or failure of the probes. Therefore, the installation and removal of the probe protection must be more meticulous. Through the limit setting of the arc groove 912, the guide ball 913 made of metal is adsorbed and moved with the magnetic plate 914, which reduces the deviation during movement adjustment. The installation and removal design of the probe protection is consistent with the four-probe tester 1 and the semiconductor wafer resistance test. The start and end synchronization linkage of the test operation is relatively more accurate and convenient, so that the sheath 911 can be attached to or separated from the probe more accurately. When the sheath 911 is separated from the outer wall of the four-probe probe 5, it is located directly below it at a distance. At the same time, the power switch 2 controls the power supply of the magnetic plate 914, and the guide ball 913 and the magnetic plate 914 are attracted to each other. The guide ball 913 slides inside the arc groove 912, thereby driving the whole to rotate ninety degrees counterclockwise and move to the side close to the magnetic plate 914, maintaining a vertical standing state on the top of the four-probe tester 1.

[0048] The above implementation works as follows:

[0049] The initialization steps are as follows:

[0050] Place the semiconductor wafer to be tested at the top center of the test bench 3, turn on the power switch 2, preheat the four-probe tester 1, prepare the computer and related software, check the test bench 3 and adjust the appropriate current and voltage gears to be ready. At the same time, the power switch 2 controls the electric telescopic rod 92 to operate and extend, thereby driving the special-shaped block 93 to slide to the right on the outer wall of the I-shaped plate 91, so that the guide pulley 97 slides from the inclined surface to the horizontal plane along the bottom of the special-shaped block 93 from high to low, and then the reset spring 98 can be squeezed downward to move the lifting rod 96 downward, so that the sheath 911 can be separated from the outer wall of the four-probe probe 5. The setting of the limit groove 99 and the limit rod 910 can guide the stable movement of the lifting rod 96 and the sheath 911. After the sheath 911 is separated from the outer wall of the four-probe probe 5, it is located directly below it at a distance. At the same time, the power switch 2 controls the magnetic plate 914 to be energized, and the guide ball 913 and the magnetic plate 914 are attracted to each other and move closer. The guide ball 913 slides inside the arc groove 912, thereby driving the whole to rotate ninety degrees counterclockwise and move to the side close to the magnetic plate 914, maintaining a vertical standing state on the top of the four-probe tester 1, and will not affect the subsequent process of testing the resistance data of semiconductor wafers;

[0051] The steps for running the job are as follows:

[0052] like Figure 1 - Figure 4As shown, rotate the paddle button 7 counterclockwise to remove it, and manually adjust the position of the slider 6 by dialing it downward. The lifting rack 81 is connected to the slider 6 through the connecting rod 82, so that it can move synchronously with the slider 6. During the downward movement of the lifting rack 81, the connecting spring 86 inside the groove frame 84 can be squeezed downward by the T-shaped plate 85, so that the slider 6 can be buffered and supported during the adjustment process, avoiding damage to the semiconductor wafer directly below due to improper manual operation. After adjusting the four-probe probe 5 to a suitable distance from the semiconductor wafer, the paddle button 7 is screwed into the interior of the slider 6 to lock it in position. At the same time, as the lifting rack 81 moves, it can drive the transmission gear 83 meshed with it to rotate on the rear side of the test bench 3, and further drive the reciprocating screw rod 87 fixedly connected to the transmission gear 83. The roller 89 is rotated above the four-probe tester 1. As the reciprocating screw 87 rotates, the roller 89 threadedly connected to its outer wall can be moved toward the front side of the four-probe tester 1 with the cooperation of the guide rod 88, and slide on the surface of the semiconductor wafer to be tested. Correspondingly, when the semiconductor wafer is tested, the slider 6 is restored to its original position, and the lifting rack 81 moves upward synchronously, thereby driving the transmission gear 83 to rotate in the opposite direction, and then driving the reciprocating screw 87 to adjust the rotation direction synchronously, so that the roller 89 moves toward the rear side of the four-probe tester 1 and slides on the surface of the semiconductor wafer to be tested, thereby achieving the purpose of removing dust or particles adhered to the outer wall of the semiconductor wafer back and forth during the adjustment process, thereby keeping the outer wall of the semiconductor wafer test clean and tidy, and avoiding affecting the accuracy of the test data;

[0053] like Figure 6 - Figure 8 and Figure 10 As shown, as the reciprocating screw 87 rotates, the pulley 810 fixedly connected to one end of the transmission gear 83 rotates, and with the assistance of the connecting belt 811, the pulley 810 on the other side is driven to rotate synchronously, thereby driving the bidirectional screw 813 fixedly connected to the pulley 810 on this side to rotate inside the rectangular hole 812. At the same time, under the limit cooperation of the rectangular hole 812, the relative distance between the arc blocks 814 on both sides of the bidirectional screw 813 connected to the outer wall can be adjusted, and the size of the semiconductor wafer placed on the test table 3 can be adjusted to clamp and position it, ensuring that the four-probe probe 5 avoids sliding and offset when contacting the semiconductor wafer for testing, thereby ensuring the stability of the detection process;

[0054] like Figure 5 - Figure 9As shown, finally, after the semiconductor manufacturing test is completed, the power switch 2 is used to control the magnetic plate 914 to be powered off, so that the adsorption of the magnetic plate 914 and the guide ball 913 is eliminated, and the inspector can manually turn the I-shaped plate 91 to drive the entire structure to rotate ninety degrees clockwise along the arc groove 912 to maintain a horizontal state. At the same time, the power switch 2 is used to control the electric telescopic rod 92 to operate and retract, driving the special-shaped block 93 to slide to the left at the bottom of the I-shaped plate 91, and the guide pulley 97 can move a certain distance upward in the vertical direction along the bottom of the special-shaped block 93. The reset spring 98 moves upward accordingly, thereby enabling the lifting rod 96 to drive the sheath 911 to adjust a certain distance upward and be mounted on the outer wall of the four-probe probe 5. The setting of the limit groove 99 and the limit rod 910 can play a guiding and anti-deviating role for the vertical adjustment of the lifting rod 96 and the sheath 911, so that the sheath 911 can be accurately docked and mounted on the outside of the four-probe probe 5 to protect it.

[0055] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0056] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A special test device for detecting resistance of micro semiconductor chips, characterized by: The invention comprises a four-probe tester (1) and a power switch (2), wherein the power switch (2) is mounted on the outer wall of the four-probe tester (1), the top of the four-probe tester (1) is fixedly connected to a test bench (3), the upper surface of the test bench (3) is fixedly connected to a vertical pole (4), a slider (6) is slidably connected to the outer wall of the vertical pole (4), a four-probe probe (5) is plugged and arranged on the outer wall of the four-probe tester (1), one end of the four-probe probe (5) away from the four-probe tester (1) is fixedly connected to the slider (6), the middle part of the slider (6) is threadedly connected to a button (7), a position adjustment pretreatment component for adjusting the movement stability of the slider (6) is arranged above the four-probe tester (1), and a sleeve isolation and anti-fouling component for performing protective adjustment processing on the four-probe probe (5) is arranged above the four-probe tester (1), wherein: The position adjustment pretreatment component includes a lifting rack (81), the lifting rack (81) is slidably connected to the outer wall of the test bench (3), the end of the lifting rack (81) away from the four-probe tester (1) is fixedly connected to a connecting rod (82), the end of the connecting rod (82) away from the lifting rack (81) is fixedly connected to the slider (6), the connecting rod (82) is slidably connected to the middle of the test bench (3), the middle of the test bench (3) is rotatably connected to a transmission gear (83), the transmission gear (83) and the lifting rack (81) are meshed and connected, the rear sides of the test bench (3) are rotatably connected to groove frames (84), the inner walls of the groove frames (84) on both sides are slidably connected to T-shaped plates (85), and the interiors of the groove frames (84) on both sides are provided with connecting springs (86); One end of the connecting spring (86) is fixedly connected to the T-shaped plate (85), and the other end of the connecting spring (86) is fixedly connected to the groove frame (84). A reciprocating screw (87) is fixedly connected to the middle of the transmission gear (83), and the reciprocating screw (87) is rotatably connected to the top of the four-probe tester (1); The outer wall of the reciprocating screw (87) is threadedly connected to a roller (89), the top of the four-probe tester (1) is fixedly connected to a guide rod (88), the guide rod (88) and the reciprocating screw (87) are symmetrically arranged around the center of the vertical rod (4), and the roller (89) is slidably connected to the outer wall of the guide rod (88) on a side away from the reciprocating screw (87); A rectangular hole (812) is provided in the middle of the test bench (3), a bidirectional screw (813) is rotatably connected inside the rectangular hole (812), arc blocks (814) are threadedly connected on both sides of the outer wall of the bidirectional screw (813), and the front end of the bidirectional screw (813) and the end of the reciprocating screw (87) away from the transmission gear (83) are fixedly connected to pulleys (810), and the pulleys (810) on both sides are connected by a connecting belt (811).

2. A dedicated test device for detecting resistance of micro semiconductor chips according to claim 1, characterized in that: The sleeve isolation and anti-fouling component includes an I-shaped plate (91), the I-shaped plate (91) is rotatably connected to the top of the four-probe tester (1), the bottom of the I-shaped plate (91) is fixedly connected to a receiving plate strip (94), the inner wall of the receiving plate strip (94) is fixedly connected to an electric telescopic rod (92), the telescopic rod end of the electric telescopic rod (92) is fixedly connected to a special-shaped block (93), the special-shaped block (93) is slidably connected to the bottom of the I-shaped plate (91), the middle of the I-shaped plate (91) is fixedly connected to a connecting sleeve (95), the inner wall of the connecting sleeve (95) is slidably connected to a lifting rod (96), the lifting rod (96) is rotatably connected to a guide pulley (97) near the middle of one end of the I-shaped plate (91), and the guide pulley (97) is slidably connected to the bottom of the special-shaped block (93).

3. The dedicated test device for detecting resistance of micro semiconductor chips according to claim 2, characterized in that: A return spring (98) is sleeved on the outer wall of the lifting rod (96), one end of the return spring (98) is fixedly connected to the lifting rod (96), and the other end of the return spring (98) is fixedly connected to the connecting sleeve (95).

4. The dedicated test device for detecting resistance of micro semiconductor chips according to claim 3, characterized in that: A limiting groove (99) is provided in the middle of one side of the lifting rod (96) close to the guide rod (88); the bottom of the receiving strip (94) is fixedly connected to the limiting rod (910); the limiting rod (910) is slidably connected to the limiting groove (99); one end of the lifting rod (96) away from the I-shaped plate (91) is fixedly connected to a sheath (911); the sheath (911) is sleeved on the outside of the four-probe probe (5).

5. The dedicated test device for detecting resistance of micro semiconductor chips according to claim 4, characterized in that: The top of the four-probe tester (1) is located next to the test bench (3) and is provided with an arc-shaped groove (912); the bottom of the receiving strip (94) is fixedly connected to a guide ball (913); the outer wall of the guide ball (913) is slidably connected to the inner wall of the arc-shaped groove (912); and the top of the arc-shaped groove (912) is fixedly connected to a side away from the test bench (3) with a magnetic plate (914).

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