CPU high-efficiency radiator for coal mining equipment

By combining a multi-stage heat conduction structure with gas flow, the problem of CPU heat sinks in underground coal mines being unable to effectively dissipate heat has been solved, achieving efficient heat dissipation and ensuring stable equipment operation.

CN119126945BActive Publication Date: 2025-12-09FANER INTELLIGENT TECH GRP CO LTD
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Patent Information

Application Number
CN202411224110.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-09-03
Publication Date
2025-12-09
Estimated Expiration
2044-09-03

AI Technical Summary

Technical Problem

Existing CPU coolers in coal mines are limited by their shape and cannot effectively dissipate heat, resulting in poor heat dissipation and affecting the long-term working efficiency of the equipment.

Method used

It adopts a multi-stage heat conduction structure, including heat dissipation contactors and heat conduction mechanisms. Through a combination of contact conduction and gas flow, heat is dissipated step by step. Thermal grease filling and thermal fins form S-shaped channels to increase the heat dissipation area and air flow.

Benefits of technology

It achieves efficient CPU heat dissipation, reduces processor temperature, avoids system crashes caused by heat buildup, and improves device stability and reliability.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a CPU high-efficiency radiator for coal mining equipment and relates to the technical field of computer hardware. The CPU high-efficiency radiator comprises a processor and a mainboard used for signal export of the processor. The processor self-contained radiator is cancelled, the processor is contacted with the shell through a heat dissipation contactor, heat is multi-stage exported in a contact mode, the heat conduction performance is relatively gently changed in a linear state, the shell is connected through the direct cancellation of the processor radiator, the effect is better, the heat conduction mechanism is additionally arranged at the bottom of the shell, the heat export effect of the heat conduction mechanism is improved on the basis of multi-stage heat conduction, heat is exported to the shell through the radiator when the processor is exported, the heat export efficiency is relatively gentle, and the multi-stage export cannot quickly achieve the cooling effect.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of computer hardware, and particularly relates to a CPU high-efficiency radiator for coal mining equipment. BACKGROUND

[0002] At present, with the continuous improvement and development of the intelligent degree of coal mining in China, the intelligent level of underground coal mining equipment is getting higher and higher, and special embedded single-chip microcomputers, control core computers and other equipment are widely used in coal mining sites. A large number of CPU chips are widely used. The CPU is the core component of intelligent equipment, and its high-speed operation will generate a large amount of heat. Therefore, the heat dissipation problem is a key link for the full play of the hardware function.

[0003] Due to the restriction of the conditions underground, the electrical equipment protection level is required to be at least IP67 or above, which means that the electrical components must be sealed inside the equipment shell and have no gas exchange with the outside world. It cannot be cooled by ordinary air. At present, the CPU of such equipment in coal mines relies on the internal installation of a cooling fan to cool the air in the limited space inside the shell. The shape of the radiator determines that it cannot be in direct contact with the shell for heat conduction. Therefore, it can only use the internal air cooling method. However, in the process of using internal air cooling, air is a poor conductor of heat, and the limited internal space cannot effectively transfer the heat generated by the CPU to the outside through air, resulting in poor heat dissipation effect of the radiator, leading to the phenomenon of external heat and internal heat, affecting the working efficiency of the CPU, and even unable to work for a long time. SUMMARY

[0004] The technical solution of the present application provides a solution significantly different from the prior art to solve the technical problem that the existing CPU radiator is limited in shape and cannot work efficiently for a long time.

[0005] The embodiment of the present application adopts the following technical solution: a CPU high-efficiency radiator for coal mining equipment, comprising a processor and a mainboard for signal output of the processor, further comprising a shell for protecting the processor and the mainboard, and a mounting stud for connecting the shell and the mainboard.

[0006] Further, the processor and the shell are provided with a contact surface at the corresponding position, the processor and the contact surface are provided with a heat dissipation contactor, the heat dissipation contactor and the contact surface are provided with heat-conducting silicone grease, and the heat dissipation contactor and the processor are provided with heat-conducting silicone grease.

[0007] Further, a plurality of porous structures are arranged in the heat dissipation contactor in a staggered manner, and the volume of the heat dissipation contactor decreases from top to bottom.

[0008] Further, a plurality of heat dissipation fine grooves are arranged in the contact surface.

[0009] Further, a heat conduction mechanism is arranged on the shell, the heat conduction mechanism comprises heat conduction fins, the heat conduction fins are connected with each other to form S-shaped channels, the heat conduction fins are hollow, a connecting channel is arranged between each adjacent heat conduction fin, and a heat insulation layer, a heat conduction pipe and a heat dissipation fin are arranged in the heat conduction fin from top to bottom.

[0010] Further, the heat conduction fins and the connecting channels are centrally symmetric, and the connecting channels are inclined.

[0011] Further, the heat insulation layer is arranged above the connecting channel, and the heat dissipation fin is arranged below the connecting channel.

[0012] Further, the thickness of the heat conduction fin gradually increases from both sides of the center.

[0013] Compared with the prior art, the present application has the following advantages:

[0014] Firstly, the heat sink of the processor is removed, and a high-efficiency heat dissipation contactor made of high-thermal-conductivity metal and having a large size is arranged between the processor and the shell (the heat dissipation contactor with a large size is convenient for contacting the processor), since the air in the shell cannot circulate, the temperature cannot be taken away by the air circulation, at this time, the heat of the processor can be taken out by using the heat transfer characteristics of the metal and by using the contact mode; secondly, the heat dissipation contactor adopts a plurality of staggered hole arrangement structures, such a structure not only has good heat conduction performance, but also can conduct heat to the surrounding space through the staggered holes, thereby playing a heat conduction and heat storage role, serving as a primary heat sink and playing a heat stabilizing role.

[0015] Secondly, the processor, the heat sink and the shell are tightly attached together by means of the customized mounting stud, and the complete attachment is ensured by filling the heat-conducting silicone grease therebetween.

[0016] A plurality of heat dissipation fine grooves are arranged on the surface of the shell in contact with the heat dissipation contactor, thereby playing the role of the shell heat sink and serving as a secondary heat sink, and by additionally arranging a layer of heat dissipation contactor, the processor can be connected with the shell, and a transition effect is achieved, thereby continuously diffusing the heat outward, the present application adopts a two-stage heat conduction structure in combination with the special scene of the coal mine, a heat conduction continuous gradient is formed between the two stages, and the heat conduction process is smooth, continuous and stable.

[0017] In summary, by canceling the processor self-heat sink, by the shell and the processor through the heat contactor makes it adopt the contact way to export heat in multiple stages, which can relatively gently make the heat conduction performance present a linear state change, and the heat export method of the present application is better than directly connecting the shell after canceling the processor heat sink, firstly, the processor is small in size, and the shell is relatively thin, so it is difficult to directly attach the processor surface to the shell, secondly, according to the heat conduction characteristics of the object, although the thin heat sink can increase the heat dissipation area, if it is too thin, the thermal resistance will increase, because the heat conduction path is shortened, the block point is increased, the heat is accumulated together (blocked together and cannot be discharged), the heat dissipation efficiency is reduced, the heat cannot be well exported, so not only the heat dissipation effect is not achieved, but also the heat dissipation is interfered, combined with the characteristics of the coal mine underground (slow gas flow speed, heat cannot be taken away by the shell through the gas flow), the temperature of the outer wall of the shell is relatively low, and the temperature of the processor is relatively high (that is, the outer cold and the inner hot, the heat is accumulated in the shell and cannot be dissipated), when running for a long time, the temperature of the processor will be higher and higher, resulting in the phenomenon of processor dead machine;

[0018] Secondly, by additionally arranging a heat conduction mechanism at the bottom of the shell, the heat export effect of the heat conduction mechanism is improved based on the multi-stage heat conduction, when the heat sink is used to export heat from the processor, the heat needs to be continuously exported to the shell through the heat sink, but the heat export efficiency is relatively flat, when the processor runs at high speed, the multi-stage export may not quickly achieve the effect of cooling, therefore, a heat conduction mechanism is additionally arranged between the shell and the heat contactor, so as to improve the heat transfer effect, the heat conduction mechanism uses the principle that the temperature difference of heat causes pressure difference, so that the hot air in the heat conduction mechanism flows to the place with lower temperature (because the pressure difference of hot air is large, it flows upward, the cold air after flowing will be continuously supplemented, and then heated, the hot air after heating will press the air above, so that the air above continuously flows), then the air in the heat conduction mechanism has temperature difference in a layer-by-layer decreasing manner, so that the heated air can flow along the set channel, so as to accelerate the discharge of heat from the place close to the processor, improve the heat dissipation effect of the heat sink, and the heat conduction fins of the heat conduction mechanism are hollow and snake-shaped, which is convenient for gas flow. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the specific embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the prior art description. Obviously, the drawings described in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative effort.

[0020] Figure 1 The first structure of the shell of the present application is shown in the structural diagram.

[0021] Figure 2 The second structure of the shell of the present application is shown in the structural diagram.

[0022] Figure 3 The second structure of the shell of the present application is shown in the structural diagram.

[0023] Figure 4 The first view of the heat conduction fin of the present application is shown in the structural diagram.

[0024] Figure 5 The second view of the heat conduction fin of the present application is shown in the structural diagram.

[0025] Figure 6 The third view of the heat conduction fin of the present application is shown in the structural diagram.

[0026] Figure 7 The fourth view of the heat conduction fin of the present application is shown in the structural diagram.

[0027] Figure 8 The distribution of the heat conduction pipe of the present application is shown in the structural diagram.

[0028] Reference signs:

[0029] 1, shell; 2, mounting stud; 3, contact surface; 31, heat conduction fin; 32, connecting channel; 33, heat insulation layer; 34, heat conduction pipe; 35, heat dissipation fin; 4, heat dissipation contactor; 5, heat conduction silicone grease; 6, processor; 7, mainboard. EMBODIMENT

[0030] The technical solutions of the present application will be described in detail below with reference to the drawings, obviously, the described embodiments are some embodiments of the present application, not all embodiments.

[0031] The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed application, but only represents selected embodiments of the present application.

[0032] All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative labor fall within the scope of the present application.

[0033] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0034] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0035] The embodiment of the present application provides a CPU high-efficiency radiator for coal mining equipment, which comprises a processor 6 and a mainboard 7 for signal output of the processor 6, and further comprises a shell 1 for protecting the processor 6 and the mainboard 7, and a mounting stud 2 is arranged between the shell 1 and the mainboard 7 for connecting them.

[0036] Embodiment 1, as shown in the following Figure 1

[0037] Specifically, the processor 6 and the shell 1 are provided with a contact surface 3 at the corresponding positions, a heat dissipation contactor 4 is arranged between the processor 6 and the contact surface 3, a heat-conducting silicone grease 5 is arranged between the heat dissipation contactor 4 and the contact surface 3, and a heat-conducting silicone grease 5 is arranged between the heat dissipation contactor 4 and the processor 6.

[0038] ​When the processor 6 generates heat during operation, the temperature of the processor 6 is transmitted to the heat dissipation contactor 4 due to the contact between the heat dissipation contactor 4 and the processor 6, and the heat in the heat dissipation contactor 4 is gradually transmitted to the contact surface 3 through the heat dissipation contactor 4 due to the contact between the heat dissipation contactor 4 and the contact surface 3. At this time, the heat dissipation contactor 4 plays a role of transition, so that the heat can be orderly discharged, avoiding direct contact of the heat with the shell 1, which cannot discharge the heat at one time, resulting in an increase in the phenomenon of heat dissipation failure. At the same time, the shell 1 and the heat dissipation contactor 4 are used for two-stage heat conduction.

[0039] Specifically, the heat dissipation contactor 4 is provided with a plurality of porous structures distributed in a staggered manner, and the volume of the heat dissipation contactor 4 is small at the top and large at the bottom.

[0040] During operation, the heat dissipation contactor 4 has good heat conduction performance and can also conduct heat to the surrounding space through the staggered through holes, playing a role of heat conduction and heat storage, and being used as a primary heat dissipation device, playing a role of heat stabilization. At the same time, the heat dissipation contactor 4 is small at the top and large at the bottom, so that the heat transfer transition is more gentle, and the heat dissipation contactor 4 can play a bridging role (the top of the heat dissipation contactor 4 is in contact with the processor 6, and the bottom of the heat dissipation contactor 4 is in contact with the contact surface 3, and the heat can be conducted away through the heat dissipation contactor 4). During heat transfer, the heat changes to a linear state, such as processor 6 temperature 90℃-heat dissipation contactor 4 temperature 65℃-shell 1 temperature 40℃. In this way, when the processor 6 is cooled, the temperature transmitted to the shell 1 is the temperature after decrement, so that the temperature received by the shell 1 can be gradually discharged, and the temperature transmission curve is more gentle, facilitating the gradual discharge of heat. Moreover, due to the temperature difference, the heat transfer effect can be achieved.

[0041] Specifically, the contact surface 3 is provided with a plurality of heat dissipation fine grooves.

[0042] During operation, the plurality of heat dissipation fine grooves can increase the surface area of the contact surface 3, thereby increasing the heat dissipation effect.

[0043] Embodiment 2, as shown in the following Figures 2 to 8

[0044] Specifically, the shell 1 is provided with a heat conduction mechanism, the heat conduction mechanism comprises heat conduction fins 31, the heat conduction fins 31 are connected with each other to form S-shaped channels, and the heat conduction fins 31 are hollow. Each adjacent heat conduction fin 31 is provided with a connecting channel 32, and a heat insulation layer 33, a heat conduction pipe 34 and a heat dissipation fin 35 are arranged in the heat conduction fin 31 from top to bottom.

[0045] ​Specifically, the heat-conducting fins 31 and the connecting channels 32 are centrally symmetrically arranged, and the connecting channels 32 are obliquely arranged, and the connecting positions of the heat-conducting fins are sealed by the sealing plates, so that the space in the shell 1 is still a closed space, and the device can be used underground.

[0046] The hot air flows downward to both sides, thereby achieving a multi-stage heat conduction effect

[0047] Specifically, the heat insulation layer 33 is arranged above the connecting channels 32, and the heat radiating fins 35 are arranged below the connecting channels 32.

[0048] Specifically, the thickness of the heat-conducting fins 31 gradually increases from the center to the sides, and different heat insulation materials are added according to the thickness.

[0049] When working, as the thickness of the heat-conducting fins 31 increases, the heat transfer effect of the heat-conducting fins 31 near the sides is poor due to the increase of the heat insulation materials, and the air pressure in the heat-conducting fins 31 is small (in the process of use, the closer to the side, the better the air contact effect, so the temperature of the side is lower, and the temperature of the shell 1 near the side is also lower, and the demand for heat dissipation is relatively reduced, and the heat at the center needs to be considered to be conducted out of the shell 1).

[0050] Working principle; in the process of use, at this time, due to the installation of the heat insulation layer 33 and the heat conduction pipe 34 in the heat conduction fin 31, the heat conduction fin 31 and the heat conduction pipe 34 located in the middle part are in contact with the processor 6, first, part of the heat is conducted out through the heat conduction fin 31 itself, second, in the process of heat conduction, the air in the heat conduction fin 31 is heated (so that the heat transfer of the heat conduction fin 31 at this position has two ways, one is through contact heat conduction, and the other is through the heat conduction fin 31 to heat the gas entering its interior to transfer heat, and multiple heat conduction ways improve the heat dissipation effect), so that it changes from cold air to hot air, because the pressure difference of hot air is large, it will flow upward, and the cold air after flowing will be continuously supplemented, and then heated, the hot air after heating will extrude the air above, so that the air above continuously flows, at this time in the process of heat transfer air, because the thickness of the heat dissipation fin 35 or the heat conduction fin 31 will change as it gets closer to both sides, and the heat insulation layer 33 above will gradually thicken, so that the air in the heat conduction fin 31 gradually changes from the center to both sides (it can be understood that the air temperature is high in the middle position, and the temperature is lower as it gets closer to both sides) The heat conducted out of the heat conduction fin 31 will be directly taken away by the air after moving to the contact surface 3, and the air entering the heat conduction fin 31 has different temperatures in different heat conduction fins 31, and the gas with different temperatures will produce a pressure difference, which will make the gas with high temperature push the gas with low temperature, so that the air in the displacement heat conduction fin 31 can flow along the heat conduction fin 31 and the connecting channel 32 arranged in the heat conduction fin 31, the flow of gas can better drive the heat transfer, thereby enhancing the heat dissipation effect of the shell 1.

[0051] Finally, it should be pointed out that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A CPU high-efficiency radiator for coal mining equipment, comprising a processor (6) and a mainboard (7) for signal output of the processor (6), characterized in that; Also include a housing (1) for protecting the processor (6) and mainboard (7), the housing (1) and mainboard (7) between the installation of the stud (2) for connecting them are provided; The housing (1) is provided with a heat conduction mechanism, the heat conduction mechanism includes heat conduction fin (31), the heat conduction fin (31) are connected to each other and form S type channel, and the heat conduction fin (31) is hollow, each adjacent heat conduction fin (31) is provided with connecting channel (32), the heat conduction fin (31) is provided with heat insulation layer (33), heat pipe (34) and fin (35) from top to bottom; The heat conduction fin (31) and connecting channel (32) are centrally symmetric, and the connecting channel (32) is inclined; The heat insulation layer (33) is arranged above the connecting channel (32), and the fin (35) is arranged below the connecting channel (32); The thickness of the heat conduction fin (31) gradually thickens from both sides of the center.

2. The CPU high-efficiency radiator for coal mining equipment according to claim 1, characterized in that; The processor (6) and the housing (1) are provided with a contact surface (3) at the corresponding position, the processor (6) and the contact surface (3) are provided with a heat dissipation contactor (4), the heat dissipation contactor (4) and the contact surface (3) are provided with heat-conducting silicone grease (5), and the heat dissipation contactor (4) and the processor (6) are provided with heat-conducting silicone grease (5).

3. The CPU high-efficiency radiator for coal mining equipment according to claim 2, characterized in that; A plurality of porous structures are arranged in the heat dissipation contactor (4), and the volume of the heat dissipation contactor (4) is small at the top and large at the bottom.

4. The CPU high-efficiency radiator for coal mining equipment according to claim 2, characterized in that; A plurality of heat dissipation fine grooves are arranged in the contact surface (3).

Citation Information

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