Display panel and preparation method thereof, and preparation method of display module

Abstract

The invention discloses a display panel and a preparation method thereof, and a preparation method of a display module, the display panel comprises a display area and a bonding area, and the display panel also comprises a substrate, a bonding terminal and a temporary protection layer; the substrate is located in the display area and the bonding area; the bonding terminal is arranged on one side of the substrate, is positioned in the bonding area and is used for bonding the driving chip; the temporary protection layer is at least arranged on the side, away from the substrate, of the bonding terminal, and the orthographic projection of the temporary protection layer on the substrate at least covers the orthographic projection of the bonding terminal on the substrate. Through the mode, the problem of corrosion of the bonding area can be avoided, the defects of bright lines, abnormal display and the like of the display panel are reduced, and the checking efficiency of corrosive element sources in the bonding area can also be greatly improved.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and specifically relates to a display panel and a method for preparing the same, and a method for preparing a display module. Background Art

[0002] With the rapid development of technology, display screens are increasingly used in mobile phones, TVs, computers, tablets, etc. The reliability of display screens is directly related to product quality and user experience, so it is critical to identify and ensure product reliability in advance.

[0003] Existing display panels are prone to reliability problems during the manufacturing process. Summary of the invention

[0004] The present application provides a display panel and a method for preparing the same, and a method for preparing a display module, which can improve product reliability.

[0005] In order to solve the above technical problems, a technical solution adopted in the present application is: providing a display panel, including a display area and a bonding area, and the display panel also includes a substrate, a bonding terminal and a temporary protective layer; the substrate is located in the display area and the bonding area; the bonding terminal is arranged on one side of the substrate and located in the bonding area, for bonding a driving chip; the temporary protective layer is at least arranged on the side of the bonding terminal away from the substrate, and the orthographic projection of the temporary protective layer on the substrate at least covers the orthographic projection of the bonding terminal on the substrate.

[0006] Preferably, there are a plurality of bonding terminals, and the orthographic projection of the temporary protection layer on the substrate covers the orthographic projections of the plurality of bonding terminals on the substrate.

[0007] Preferably, the temporary protective layer is a continuous film layer.

[0008] Preferably, an orthographic projection of the temporary protection layer on the substrate covers the substrate located at the bonding area.

[0009] Preferably, the material of the temporary protective layer includes at least one of hydrogel and photoresist.

[0010] Preferably, the material of the temporary protective layer includes at least one of agar and gelatin.

[0011] Preferably, the bonding terminal comprises at least two bonding blocks, the at least two bonding blocks are stacked in sequence and electrically connected in a direction away from the substrate, and different bonding blocks are located in different conductive layers.

[0012] Preferably, the display panel further includes a first conductive layer, a second conductive layer, a third conductive layer and a touch layer stacked in sequence in a direction away from the substrate, and the at least two bonding blocks include at least two of a first bonding block located in the first conductive layer, a second bonding block located in the second conductive layer, a third bonding block located in the third conductive layer and a fourth bonding block located in the touch layer.

[0013] Preferably, the thickness of the temporary protective layer is in the range of 0.8 mm to 1.2 mm.

[0014] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide a method for preparing a display panel, the method comprising: forming a bonding terminal on one side of a substrate; forming a temporary protective layer at least on the side of the bonding terminal facing away from the substrate, wherein the orthographic projection of the temporary protective layer on the substrate at least covers the orthographic projection of the bonding terminal on the substrate, and the temporary protective layer can be removed subsequently.

[0015] Preferably, the step of forming a temporary protective layer at least on a side of the bonding terminal facing away from the substrate comprises: forming a continuous temporary protective layer on a side of the bonding terminal facing away from the substrate by a coating process.

[0016] Preferably, the material of the temporary protective layer includes at least one of agar and gelatin, wherein the step of forming a continuous temporary protective layer on the side of the bonding terminal away from the substrate by using a coating process includes: under the condition of a first preset temperature, forming a continuous temporary protective layer on the side of the bonding terminal away from the substrate by using a coating process.

[0017] Preferably, the first preset temperature is in a range of less than or equal to 50°C.

[0018] To solve the above technical problems, another technical solution adopted in the present application is: a method for preparing a display module, the method comprising: obtaining the display panel described in any one of the embodiments; removing the temporary protective layer to at least expose the bonding terminal; and bonding and connecting the driving chip to the bonding terminal.

[0019] Preferably, the step of removing the temporary protective layer to at least expose the bonding terminals includes: raising the preparation temperature of the display panel to a second preset temperature so that the temporary protective layer is converted from a solid state to a liquid state; and removing the liquid temporary protective layer by means of an air gun, pure water or ethanol.

[0020] Preferably, the second preset temperature is in a range greater than 75°C.

[0021] Different from the prior art, the beneficial effect of the present application is that the display panel provided by the present application sets a temporary protective layer on the surface of the exposed bonding terminal, which prevents the bonding terminal of the display panel from being exposed for a long time before entering the bonding process, thereby avoiding the corrosion problem caused by exposure, reducing the defects such as bright lines and abnormal display of the display panel, and greatly improving the efficiency of checking the source of corrosive elements in the bonding area. And because the temporary protective layer can be removed in the subsequent steps, the bonding terminal covered by the temporary protective layer can be exposed again to achieve the subsequent bonding connection with the driver chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0023] Figure 1 This is a schematic structural diagram of an embodiment of a display panel of the present application;

[0024] Figure 2 For this application Figure 1 A schematic diagram of the partial structure of an implementation method of the middle A area;

[0025] Figure 3 For this application Figure 1 A schematic diagram of the partial structure of another implementation method of the middle A area;

[0026] Figure 4 A cross-sectional schematic diagram of an implementation of a bonding area of ​​a display panel of the present application;

[0027] Figure 5 A schematic diagram of a process of an embodiment of a method for manufacturing a display panel of the present application;

[0028] Figure 6 A schematic diagram of a process of an embodiment of a method for preparing a display module of the present application;

[0029] Figure 7 It is a structural schematic diagram of an implementation scheme of a display module of the present application. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0031] In the process of realizing the present invention, the inventors found that the following problems exist in the related technology: In the related manufacturing process of the display module, the bonding terminals on the display panel and the bonding terminals of the driver chip need to be interconnected through a bonding process. Since it is necessary to detect whether the circuit is short-circuited or open-circuited during the preparation of the display panel, the bonding terminals on the display panel need to be exposed for a long time before the bonding process, and the preparation process involves multiple processes such as pallet transportation turnover and partial bonding, which poses a greater risk of corrosion.

[0032] In view of this, the present application provides a display panel, referring to Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of an embodiment of a display panel of the present application. Figure 2 For this application Figure 1 A schematic diagram of a partial structure of an embodiment of area A in the middle. The display panel 10 includes a display area 101 and a non-display area 102, wherein the non-display area 102 includes a bonding area 1021, and the bonding area 1021 is located on one side of the display area 101. At the same time, the display panel 10 also includes a substrate (not shown), a bonding terminal 12 and a temporary protective layer 13. The substrate is located in the display area 101 and the non-display area 102. Specifically, the material of the substrate may include a flexible material PI (polyimide). Since the substrate is made of a flexible material, the display panel 10 can be bent, so that the bonding area 1021 can be bent to the back of the display area 101 after bonding is completed, realizing COP (Chip On Plastic) packaging technology; the bonding terminal 12 is arranged on one side of the substrate and located in the bonding area 1021, and the bonding terminal 12 can be used to bond the driver chip. Specifically, there are multiple bonding terminals 12, which are arranged in an array. The bonding terminals 12 specifically include input terminals 12a and output terminals 12b, wherein the output terminal 12b is arranged near the display area 101 relative to the input terminal 12a, wherein both the output terminal 12b and the input terminal 12a can be used for bonding with the driver chip. It can be understood that the A area is a part of the bonding area 1021, and includes both the output terminal 12b and the input terminal 12a; the temporary protective layer 13 is at least arranged on the side of the bonding terminal 12 away from the substrate, and the orthographic projection of the temporary protective layer 13 on the substrate at least covers the orthographic projection of the bonding terminal 12 on the substrate.

[0033] The display panel 10 of the present application is provided with a temporary protective layer 13 on the surface of the exposed bonding terminal 12, which prevents the bonding terminal 12 of the display panel 10 from being exposed for a long time before entering the bonding process, thereby avoiding the corrosion problem caused by exposure, reducing defects such as bright lines and abnormal display of the display panel 10, and greatly improving the efficiency of checking the source of corrosive elements in the bonding area 1021. And because the temporary protective layer 13 can be removed in the subsequent steps, the bonding terminal 12 covered by the temporary protective layer 13 can be exposed again to achieve the subsequent bonding connection with the driver chip.

[0034] Optionally, continue to Figure 2 , the number of bonding terminals 12 is multiple, and the orthographic projection of the temporary protective layer 13 on the substrate covers the orthographic projections of multiple bonding terminals 12 on the substrate. Specifically, the number of input terminals 12a and output terminals 12b are both multiple, and are distributed in an array. The temporary protective layer 13 can cover multiple input terminals 12a and output terminals 12b at the same time. Furthermore, the temporary protective layer 13 is a continuous film layer, that is, the temporary protective layer 13 is a whole layer structure, and multiple bonding terminals 12 can be protected simultaneously by preparing the temporary protective layer 13 only once, thereby improving the preparation efficiency. In other embodiments, refer to Figure 3 , Figure 3 For this application Figure 1 A schematic diagram of a partial structure of another embodiment of the middle A area. The temporary protection layer 13 may include a plurality of temporary protection portions 13a arranged at intervals, each of which covers a plurality of bonding terminals 12, for example Figure 3 In the illustrated embodiment, the temporary protection layer 13 includes two temporary protection portions 13 a , and the two temporary protection portions 13 a cover all the input terminals 12 a and all the output terminals 12 b respectively.

[0035] Optionally, the orthographic projection of the temporary protective layer 13 on the substrate covers the substrate located in the bonding area 1021, that is, the temporary protective layer 13 can completely cover the entire bonding area 1021, while covering the bonding terminal 12, it can also cover other structures of the bonding area 1021 such as the support column 14, thereby increasing the protection area and further reducing the probability of corrosion.

[0036] Optionally, the material of the temporary protective layer 13 includes at least one of a hydrogel and a photoresist. The photoresist is convenient for coating and can be removed by exposure or the like. The hydrogel can be specifically agar (C 12 H 18 O9)n)、gelatin((C 12 H 16 O 11)n), the above material is easy to apply, easy to operate, and can be quickly removed by heating, etc., and can be easily and completely removed without residues and damage to the display panel. In addition, since the main elements of the above material are C, H and O, no corrosive elements are introduced. Specifically, the thickness of the temporary protective layer 13 ranges from 0.8 mm to 1.2 mm, for example, 0.8 mm, 0.9 mm, 1 mm, 1.1 mm or 1.2 mm.

[0037] Optionally, see Figure 4 , Figure 4 FIG. 1 is a cross-sectional view of an embodiment of a bonding area of ​​a display panel of the present application. The bonding terminal 12 includes at least two bonding blocks, and the at least two bonding blocks are in a direction away from the substrate 11 (for details, see Figure 4The display panel 10 further includes an array layer 120 and a touch layer 130 located on one side of the substrate 11. The array layer 120 specifically includes a buffer layer 121, a first insulating layer 122, a first conductive layer 123, a second insulating layer 124, an interlayer dielectric layer 125, a second conductive layer 126, a third conductive layer 127 and a planarization layer 128 stacked sequentially in a direction away from the substrate 11. The touch layer 130 specifically includes a touch insulating layer 131 and a touch conductive layer 132 stacked sequentially in a direction away from the substrate 11. The buffer layer 121 and the first insulating layer 122 are both continuous whole layers. The film layer is arranged, the first conductive layer 123 includes a plurality of first bonding blocks 1231 arranged at intervals, the second insulating layer 124 is arranged between the first bonding blocks 1231 and is stacked at one end of the first insulating layer 122 away from the substrate 11, the interlayer dielectric layer 125 is arranged on the side of the second insulating layer 124 away from the substrate 11, the second insulating layer 124 and the interlayer dielectric layer 125 are arranged at positions corresponding to the first bonding blocks 1231 to penetrate to the first conductive layer 123 First through holes 125a, the plurality of first through holes 125a are arranged at intervals, and the second conductive layer 126 and the third conductive layer 127 are filled to the first through holes The first bonding block 1231, the second bonding block 1261 and the third bonding block 1271 are respectively formed in a spaced relationship in the first conductive layer 126 and the third conductive layer 127. The second through hole 127a penetrating the interlayer dielectric layer 125 is provided on the second conductive layer 126 and the third conductive layer 127. The planarization layer 128 is provided in the second through hole 127a and protrudes on the interlayer dielectric layer 125 to form a support column 14. The support column 14 is spaced from the second bonding block 1261 and the third bonding block 1271. The touch control insulating layer 131 covers the planarization layer 128 and fills the second conductive layer 126 and the third conductive layer 127. Through hole 127a, the touch insulating layer 131 is also provided with a third through hole 131a that penetrates to the third bonding block 1271, the touch conductive layer 132 fills the third through hole 131a to form a fourth bonding block 1321 and is stacked on the side of the third bonding block 1271 away from the second bonding block 1261, the stacked first bonding block 1231, the second bonding block 1261, the third bonding block 1271 and the fourth bonding block 1321 can form a bonding terminal 12, and the temporary protective layer 13 is stacked on the side of the touch conductive layer 132 away from the substrate 11 to prevent external corrosive elements from corroding the conductive layer.

[0038] The present application also provides a method for preparing the display panel 10, see Figure 5 , Figure 5 The figure is a flow chart of an embodiment of a method for manufacturing a display panel of the present application. The method comprises:

[0039] Step S110 : forming bonding terminals 12 on one side of the substrate 11 .

[0040] Step S120: forming a temporary protective layer 13 at least on the side of the bonding terminal 12 facing away from the substrate 11, wherein the orthographic projection of the temporary protective layer 13 on the substrate 11 at least covers the orthographic projection of the bonding terminal 12 on the substrate 11. Optionally, the temporary protective layer 13 can be formed by a coating process, and only one coating process needs to be added after the bonding terminal 12 is formed. The process step has low precision requirements and only needs to cover the bonding terminal 12. No additional tools such as a mask plate are required, and the temporary protective layer 13 can be formed at a low cost and high efficiency.

[0041] Optionally, when the material of the temporary protective layer 13 includes at least one hydrogel selected from agar and gelatin, step S120 includes forming a continuous temporary protective layer 13 on the side of the bonding terminal 12 facing away from the substrate 11 by a coating process under the condition of a first preset temperature. Specifically, the first preset temperature is less than or equal to 50°C (for example, it can be 15°C, 25°C, 35°C, 50°C, etc.). At the relatively low first preset temperature, agar and gelatin are both in a viscous solid state. At this time, it is convenient to coat the temporary protective layer 13 by a coating device so that it can be firmly covered on the surface of the bonding terminal 12, and it will not shift or fall off due to the transportation and turnover of the display panel 10. The temporary protective layer 13 is ensured to always protect the bonding terminal 12 from corrosion before the bonding process. In other embodiments, when the material of the temporary protective layer 13 is photoresist, it can also be coated at other temperatures.

[0042] The present application also provides a method for preparing the display module 100, see Figure 6 , Figure 6 1 is a flow chart of an embodiment of a method for preparing a display module of the present application. The method comprises:

[0043] Step S210 : obtaining the display panel 10 of any of the above embodiments. The display panel 10 obtained in this step has a temporary protective layer 13 .

[0044] Step S220: remove the temporary protective layer 13 to expose at least the bonding terminal 12. The temporary protective layer 13 is made of an insulating material and needs to be removed before the bonding process to expose the bonding terminal 12, so as to facilitate the subsequent bonding process on the bonding terminal 12. Optionally, when the material of the temporary protective layer 13 includes at least one hydrogel of agar and gelatin, step S220 further includes: raising the preparation temperature of the display panel 10 to a second preset temperature so that the temporary protective layer 13 is converted from a solid state to a liquid state. Specifically, when the material of the temporary protective layer 13 is agar, the second preset temperature is greater than 100°C (for example, 120°C, 150°C, etc.), and when the material of the temporary protective layer 13 is gelatin, the second preset temperature is greater than 75°C (for example, 80°C, 100°C, etc.). Under the above temperature conditions, both agar and gelatin can be converted from a solid state to a liquid state; and then the liquid temporary protective layer 13 is removed by means of an air gun, pure water or ethanol. The temporary protective layer 13 converted into liquid is easier to remove, and since agar and gelatin only include C, H and O elements, and pure water or ethanol also only include C, H and O elements, the above method will not introduce corrosive elements, and can ensure that the bonding area 1021 will not be corroded during the removal of the temporary protective layer 13, and the temporary protective layer 13 can be removed cleanly without damaging the display panel, thereby facilitating the implementation of subsequent bonding processes.

[0045] Step S230: Bonding the driver chip 30 to the bonding terminal 12. Specifically, in this step, ACF glue (not shown) can be firstly attached to the bonding area 1021, and then the driver chip 30 can be bonded to the bonding terminal (not shown) through the ACF glue to obtain the display module 100. Figure 7 As shown, the display module 100 may also be bonded with a flexible circuit board 20. The specific location of the arrangement may be determined according to actual conditions and is not limited here.

[0046] The above are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel includes a display area and a bonding area, and the display panel also includes: A substrate, located in the display area and the bonding area; A bonding terminal, arranged on one side of the substrate and located in the bonding area, for bonding a driver chip; The temporary protection layer is at least arranged on a side of the bonding terminal away from the substrate, and the orthographic projection of the temporary protection layer on the substrate at least covers the orthographic projection of the bonding terminal on the substrate.

2. The display panel according to claim 1, characterized in that: The number of the bonding terminals is multiple, and the orthographic projection of the temporary protection layer on the substrate covers the orthographic projections of the multiple bonding terminals on the substrate; Preferably, the temporary protective layer is a continuous film layer; Preferably, an orthographic projection of the temporary protection layer on the substrate covers the substrate located at the bonding area.

3. The display panel according to claim 1, characterized in that: The material of the temporary protective layer includes at least one of hydrogel and photoresist; Preferably, the material of the temporary protective layer includes at least one of agar and gelatin.

4. The display panel according to claim 1, characterized in that: The bonding terminal comprises at least two bonding blocks, the at least two bonding blocks are stacked in sequence in a direction away from the substrate and are electrically connected, and different bonding blocks are located in different conductive layers; Preferably, the display panel further includes a first conductive layer, a second conductive layer, a third conductive layer and a touch layer stacked in sequence in a direction away from the substrate, and the at least two bonding blocks include at least two of a first bonding block located in the first conductive layer, a second bonding block located in the second conductive layer, a third bonding block located in the third conductive layer and a fourth bonding block located in the touch layer.

5. The display panel according to claim 1, characterized in that: The thickness of the temporary protective layer is in the range of 0.8 mm to 1.2 mm.

6. A method for preparing a display panel, characterized in that: The method comprises: forming bonding terminals on one side of the substrate; A temporary protection layer is formed at least on a side of the bonding terminal facing away from the substrate, wherein an orthographic projection of the temporary protection layer on the substrate at least covers an orthographic projection of the bonding terminal on the substrate.

7. The preparation method according to claim 6, characterized in that: The step of forming a temporary protective layer at least on a side of the bonding terminal facing away from the substrate comprises: A coating process is adopted to form the continuous temporary protection layer on the side of the bonding terminal away from the substrate.

8. The preparation method according to claim 7, characterized in that: The material of the temporary protective layer includes at least one of agar and gelatin, wherein the step of forming a continuous temporary protective layer on the side of the bonding terminal away from the substrate by using a coating process includes: Under the condition of a first preset temperature, a coating process is used to form a continuous temporary protective layer on a side of the bonding terminal away from the substrate; Preferably, the first preset temperature is in a range of less than or equal to 50°C.

9. A method for preparing a display module, characterized in that: The method comprises: Obtain a display panel as claimed in any one of claims 1 to 5; removing the temporary protective layer to expose at least the bonding terminals; The driver chip is bonded and connected to the bonding terminals.

10. The preparation method according to claim 9, characterized in that: The step of removing the temporary protective layer to at least expose the bonding terminals comprises: Raising the preparation temperature of the display panel to a second preset temperature so that the temporary protective layer is transformed from a solid state to a liquid state; The liquid temporary protective layer is removed by means of an air gun, pure water or ethanol; preferably, the second preset temperature is in the range of greater than 75°C.

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