A pressure sensor chip packaging device

Abstract

The present invention relates to the technical field of chip packaging equipment, and in particular to a pressure sensor chip packaging equipment, comprising a first conveyor belt, a shell and a second conveyor belt; further comprising a plurality of molds, a plurality of chip slots, a plurality of filling holes, a plurality of shunt grooves, a plurality of overflow holes and a light source, a filling mechanism is installed at the inlet end of the shell, a plurality of chip slots are arranged in the middle of the upper end faces of the plurality of molds, a plurality of molds are arranged with filling holes, the filling holes are connected with a chip slot on the mold, the plurality of chip slots are connected with each other through a plurality of shunt grooves, the upper end faces of the left side walls of the plurality of molds are arranged with overflow holes, the overflow holes are connected with the top of a chip slot, the filling mechanism fills the filling holes with photocurable liquid, the light source is arranged in the middle of the shell, and the light source irradiates the photocurable liquid in the plurality of chip slots; the light curing packaging chip is adopted, the packaging temperature is low, the damage to the chip components is reduced, the equipment structure, the filling operation and the filling time are simplified, and the work efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging equipment, and in particular to a pressure sensor chip packaging equipment. Background Art

[0002] In electronics, a chip is a way of miniaturizing circuits, mainly semiconductor devices, but also passive components, and is often manufactured on the surface of a semiconductor wafer. The housing used to install semiconductor integrated circuit chips plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrical and thermal performance. Chip packaging is a technology that packages integrated circuits with insulating plastic or ceramic materials. Packaging technology is necessary and crucial for chips.

[0003] The prior art discloses a variety of chip packaging equipment, for example, a Chinese invention patent with publication number CN112827752B proposes a chip packaging grease injection device and a chip packaging process. The chip packaging grease injection device proposed in the invention is provided with a raw material temporary storage tank for heating and keeping the raw materials warm, and the solid fat raw materials for packaging are placed in each storage tank through the opened tank cover. The stirring motor drives each stirrer to rotate and continuously stir the fat raw material, so that the epoxy resin and the additive are evenly mixed. The electric heating tube is started to heat the raw materials in the storage tank, so that the fat raw material is melted into a molten state by the heat, and then the stirrer continues to stir to completely and fully mix the epoxy resin and the additive, so that the mixed liquid material discharged from the discharge pipe each time is uniform, thereby ensuring the strength and thermal conductivity of the packaging material. By setting a rotary grease injector capable of stepping motion, the stepper motor drives the rotary grease injector to rotate 45° again, so that the chip placement groove moves corresponding to the grease injection rod again, and the cycle is repeated in sequence. The controller controls the rotary grease injector to rotate 90° each time, and the grease injection mold steps forward once. The chip placement mechanism fills the chip into the grease injection mold once, and the grease injection packaging operation is repeated. Finally, the chip after grease injection and thermosetting is completed is transported by a pneumatic guide rail, so that the residual high-temperature chip packaging material is quickly cooled and dissipated under the action of the cooling fan, which is convenient for the next step of processing.

[0004] However, the above-mentioned packaging equipment uses high-temperature molten resin as packaging filler. The high temperature of the resin will cause certain damage to the circuits and components of the chip, resulting in reduced reliability of the chip after packaging. In addition, the resin filling structure is relatively complicated. Due to the high viscosity of the high-temperature resin, the grease injection head of the resin filling structure needs to be aligned with the chip placement groove in sequence before filling can be carried out, and the working efficiency is low. Summary of the invention

[0005] To solve the above technical problems, the present invention provides a pressure sensor chip packaging device that uses photocuring to package chips. The packaging temperature is low, which reduces damage to chip components, simplifies equipment structure, filling operations and filling time, and improves work efficiency.

[0006] A pressure sensor chip packaging device of the present invention comprises a first conveyor belt, a shell and a second conveyor belt, the shell cover buckle is installed on the first conveyor belt, the second conveyor belt is arranged in parallel with the first conveyor belt, the first conveyor belt conveys to the left, the second conveyor belt conveys to the right, an inlet is arranged on the right end side wall of the shell, and an outlet is arranged on the left end of the shell; it also comprises a plurality of molds, a plurality of chip slots, a plurality of filling holes, a plurality of diverter slots, a plurality of overflow holes and a light source, a filling mechanism is installed at the inlet end of the shell, the second conveyor belt conveys the mold to the right, the first conveyor belt conveys the mold to the left, and a plurality of molds are arranged at the middle of the upper end surface A chip slot, a filling hole is arranged on the upper end surface of the right side wall of the plurality of molds, the filling hole is communicated with a chip slot on the mold, a shunt groove is arranged on the top of the side wall of the plurality of chip slots of the mold, the plurality of chip slots are communicated with each other through the plurality of shunt grooves, an overflow hole is arranged on the upper end surface of the left side wall of the plurality of molds, the overflow hole is communicated with the top of a chip slot, a filling mechanism fills the filling hole with light curing liquid, a light source is installed in the middle part of the shell, and the light source irradiates the light curing liquid in the plurality of chip slots; when working, the first conveyor belt and the second conveyor belt rotate step by step, the second conveyor belt conveys the empty mold to the right, and the second conveyor belt conveys the empty mold to the right, and the second conveyor belt conveys the empty mold to the right. When the conveyor belt is paused, multiple chip components are placed in multiple chip slots respectively, and the mold filled with chip components enters the shell through the inlet of the shell. The filling mechanism fills the light-curing liquid into the filling hole of the mold filled with chip components. After the light-curing liquid fills one chip slot through the filling hole, it fills the other multiple chip slots in turn through multiple diversion slots. When the multiple chip slots are all filled, the excess light-curing liquid is discharged through the overflow hole. The position of the overflow hole limits the filling depth of the light-curing liquid. After the filling is completed, the filling mechanism is separated from the mold, and the first conveyor belt transports the filled mold to the left The light source pauses below the light source, and the light source illuminates the photocurable liquid in the multiple chip slots, so that the photocurable liquid is cured to complete the packaging of the pressure sensor chip. The mold is made of transparent material, which can improve the curing effect of the photocurable liquid. Compared with the existing technology, there is no need for high-temperature heating to melt the resin particles, and the packaging temperature is lower, which reduces damage to chip components and improves the reliability of the chip after chip packaging. Since a photocurable liquid with lower viscosity is used and multiple chip slots can be filled only through the filling hole, the structure of the filling mechanism is simplified, the filling operation is simplified, the filling time is shortened, and the work efficiency is improved.

[0007] Preferably, it also includes multiple screws and multiple nuts, the lower ends of the multiple screws are connected to the light source, the multiple screws are plug-connected to the top of the shell, and the multiple nuts are rotatably threaded on the multiple screws to fasten the multiple screws to the shell; the distance between the light source and the mold is adjusted by lifting and lowering the multiple screws, and the multiple nuts are tightened to lock the screws on the top wall of the shell, thereby adjusting the curing effect of the light source on the photocurable liquid in the multiple chip slots.

[0008] Preferably, it also includes a push cylinder three and a push plate, the fixed end of the push cylinder three is installed on the side of the frame of the second conveyor belt away from the shell, the push plate is installed on the piston rod of the push cylinder three, and the push plate is aligned with the inlet of the shell; when the mold moves to the inlet of the shell, the piston rod of the push cylinder three is extended so that the push plate pushes the mold through the inlet to the right end of the first conveyor belt and is located inside the shell, thereby realizing the transfer of the mold.

[0009] Preferably, the filling mechanism includes a filling tube, a lifting rod and a filling unit, the filling tube is slidably inserted on the top of the shell, the filling tube matches the filling hole, one end of the lifting rod is connected to the top of the shell, the other end of the lifting rod is connected to the upper part of the filling tube, the filling unit is installed on the shell, and the liquid outlet of the filling unit is connected to the upper end of the filling tube through a hose; when the mold filled with chips moves to the bottom of the filling tube and aligns the filling hole with the filling tube, the first conveyor belt is paused, the piston rod of the lifting rod contracts to lower the filling tube, so that the lower end of the filling tube is inserted into the filling hole, and the injection unit is operated to transport the photocurable liquid stored therein to the filling hole through the hose and the filling tube. When the filling of multiple chip slots is completed, the piston rod of the lifting rod contracts to raise the filling tube, so that the filling tube is separated from the filling hole and will not interfere with the movement of the mold. The structure is simple and the filling effect is stable.

[0010] Preferably, it also includes multiple contact switches, which are respectively installed on multiple molds, and the probes of the multiple contact switches are respectively extended into the multiple overflow holes; when the photocurable liquid is filled in the multiple chip slots, the photocurable lubricant enters the overflow hole and contacts with the contact switch, and the contact switch sends an electrical signal. When the equipment receives the above signal, it determines that the filling of the multiple chip slots is completed. At this time, the piston rod of the lifting rod 1 is extended to disengage the liquid filling tube from the filling hole, and the first conveyor belt and the second conveyor belt start to rotate in steps, which has good practicality.

[0011] Preferably, it also includes a lifting rod 2, a mounting frame and multiple detection units. The fixed end of the lifting rod 2 is installed on the top wall of the left end of the shell, the mounting frame is installed at the lower end of the piston rod of the lifting rod 2, and multiple detection units are installed on the mounting frame. The multiple detection units are respectively aligned with the multiple chip slots, and the multiple detection units are used to detect the chip packaging quality in the multiple chip slots; when the first conveyor belt drives the mold to move to the bottom of the mounting frame and pauses, the piston rod of the lifting rod 2 is extended to make the mounting frame descend, so that the multiple detection units are aligned with the multiple chip slots up and down, so that the multiple detection units detect the packaged chips in the multiple chip slots, and the detection items are circuit performance detection, appearance detection, etc., with good practicality.

[0012] Preferably, it also includes multiple positioning rods, the multiple positioning rods are installed on the lower end surface of the mounting frame, and positioning holes that match and align with the multiple positioning rods are set on the mold; when multiple detection units irradiate and cure the photocurable liquid in multiple chip slots, the multiple positioning rods are respectively inserted into the multiple positioning holes of the mold to improve the alignment effect of the multiple detection units and the multiple chip slots.

[0013] Preferably, it also includes multiple vertical rods and multiple pressure rods, the multiple vertical rods are installed on the top of the side walls between the multiple chip slots of the mold, and the multiple pressure rods are respectively rotatably installed on the upper ends of the multiple vertical rods through rotating shafts, and the multiple pressure rods are respectively facing the multiple chip slots; when the multiple chip slots are filled with photocuring liquid and the multiple detection units are detecting the multiple chip slots, the multiple pressure rods are in a vertical state on the multiple vertical rods, and the multiple pressure rods are respectively located on the outsides of the multiple chip slots, so that the multiple pressure rods will not cause interference, and when the multiple detection units complete the detection of the packaged chips in the multiple chip slots, the pressure rods are flipped over and laid flat and extended into the chip slots, so that the pressure rods block the unqualified packaged chips in the chip slots. At this time, the mold is flipped toward the exit of the shell toward the outside of the left end of the first conveyor belt, so that the qualified packaged chips in the multiple chip slots are unloaded, which has good practicality.

[0014] Preferably, it also includes multiple push rods, multiple protrusions, multiple spring sheets, a frame, a sliding rod, a spring, a push cylinder and a flip assembly, the fixed ends of the multiple push rods are installed on the mounting frame, the lower ends of the piston rods of the multiple push rods are respectively aligned with the upper ends of the multiple pressure rods, protrusions are arranged on the side walls of the rotating shafts of the multiple pressure rods, spring sheets are installed on the upper ends of the multiple vertical rods, two card slots are arranged on the multiple spring sheets, the two card slots match the protrusions, the two card slots of the spring sheets elastically lock the vertical state and the horizontal state of the pressure rod, multiple slots are arranged on the side walls between the multiple chip slots of the mold, and the multiple vertical rods are respectively vertically slidably inserted in the multiple slots In the embodiment, a lifting groove is arranged inside the mold, a frame is installed in the lifting groove of the mold in a lifting and lowering manner, the lower ends of a plurality of vertical rods are installed on the frame, the lower ends of the slide rods are installed on the frame, the upper ends of the slide rods extend out of the upper end surface of the mold, the lower ends of the springs are connected to the mold, the upper ends of the springs are connected to the slide rods, the push cylinders are installed outside the left end of the second conveyor belt, the flipping assembly is installed on the frame of the second conveyor belt, the flipping assembly flips the mold and transfers the mold from the first conveyor belt to the second conveyor belt; when the detection unit detects an unqualified packaged chip, the piston rod of the corresponding push rod extends downward, so that the lower ends of the piston rods of the push rods push the corresponding pressure rods to the mold. The rod is flattened. In the process of the pressure rod rotating from vertical to horizontal, the rotating shaft of the pressure rod drives the protrusion to rotate, so that the protrusion slides from the first card slot of the spring sheet to the second card slot, so that the upper end of the pressure rod extends into the chip slot to block the unqualified packaged new products. At this time, the flip assembly flips the mold through the outlet of the shell to the left end outside of the first conveyor belt, so that the qualified packaged chips fall from multiple chip slots into the qualified product box. When the flip assembly transfers the mold to the left end outside of the second conveyor belt, the piston rod of the push cylinder extends to push the slide rod toward the inside of the mold, so that the slide rod drives the frame to move upward, and the frame drives multiple vertical rods The plurality of pressure rods are then moved to the inside of the mold, and the plurality of pressure rods that are laid flat are blocked by the top of the side wall of the chip slot, thereby restoring the plurality of pressure rods to a vertical state. During this process, the rotating shafts of the plurality of pressure rods drive the protrusions to rotate, so that the protrusions slide from the second card slot of the spring sheet to the first card slot and reset. At this time, unqualified packaged chips fall from the plurality of chip slots to the unqualified box on the outer side of the left end of the second conveyor belt, the piston rod of the push cylinder contracts and disengages from the slide rod, the elastic force of the spring resets the slide rod and the frame, and the flipping assembly flips and resets the mold, so that the mold is placed on the left end of the second conveyor belt, thereby realizing the separate unloading of packaged chips, which is very practical.

[0015] Preferably, the flipping assembly includes multiple sockets, a push cylinder 2, a motor and a plug, the multiple sockets are respectively installed at the left ends of the side walls of the multiple molds, the push cylinder 2 is horizontally installed on the frame of the second conveyor belt, the motor is installed on the top of the piston rod of the push cylinder 2, the push cylinder 2 and the motor are located on the outside of the left end of the second conveyor belt, the plug is concentrically installed on the output shaft of the motor, and the plug matches the socket; when it is necessary to flip the mold, the piston rod of the push cylinder 2 is extended so that the plug is inserted into the socket of the mold, and the motor drives the plug to rotate 180 degrees, so that the mold is flipped to the outside of the left end of the first conveyor belt. , so that multiple chip slots face downward, so that qualified packaged chips in multiple chip slots fall out, the piston rod of the push cylinder two contracts, so that the mold moves to the outer side of the left end of the second conveyor belt, and aligns the push cylinder with the slide rod. After the unqualified packaged chips in multiple chip slots fall out, the motor drives the plug to reverse 180 degrees, so that the mold flips to the left end of the second conveyor belt, and the piston rod of the push cylinder two contracts again to disengage the plug from the socket, so that the second conveyor belt can transport the empty mold to the right, and the empty mold is convenient for carrying multiple chip components again, which has good practicality.

[0016] Compared with the prior art, the present invention has the following beneficial effects: no high-temperature heating is required to melt the resin particles, the packaging temperature is low, the damage to chip components is reduced, and the reliability of the chip after chip packaging is improved. Since a photocurable liquid with a lower viscosity is used and multiple chip slots can be filled only through the filling hole, the structure of the filling mechanism is simplified, the filling operation is simplified, the filling time is shortened, and the work efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the present invention;

[0018] Figure 2 It is a front cross-sectional structural schematic diagram of the present invention;

[0019] Figure 3 It is a schematic diagram of the axonometric structure of the present invention;

[0020] Figure 4 It is a schematic diagram of the structure of the mold, chip slot, filling hole, diversion slot, overflow hole, vertical rod and pressure rod;

[0021] Figure 5 It is a schematic diagram of the top view of the structure of the mold and the socket;

[0022] Figure 6 It is a schematic diagram of the structure of the vertical rod, compression rod, frame, slide rod and spring;

[0023] Figure 7 yes Figure 6 A schematic diagram of the local enlarged structure at point A in the middle;

[0024] Figure 8It is a structural diagram of the mold and the filling mechanism;

[0025] Fig. 9 It is a schematic diagram of the structure of the lifting rod 2, the mounting frame, the detection unit and the positioning rod;

[0026] Fig.10 It is a structural schematic diagram of the lifting rod 2, the mounting frame, the detection unit and the mold alignment state;

[0027] Fig.11 It is a structural schematic diagram of the connection state of the flip assembly and the mold;

[0028] Fig.12 It is a structural diagram of the flip component.

[0029] Markings in the accompanying drawings: 1. first conveyor belt; 2. shell; 3. second conveyor belt; 4. mold; 5. chip slot; 6. filling hole; 7. diverter slot; 8. overflow hole; 9. light source; 10. injection pipe; 11. lifting rod one; 12. injection unit; 13. contact switch; 14. lifting rod two; 15. mounting frame; 16. detection unit; 17. positioning rod; 18. vertical rod; 19. pressure rod; 20. push rod; 21. bump; 22. spring sheet; 23. frame; 24. sliding rod; 25. spring; 26. push cylinder; 27. socket; 28. push cylinder two; 29. ​​motor; 30. plug; 31. push cylinder three; 32. push plate; 33. screw; 34. nut. DETAILED DESCRIPTION

[0030] In order to facilitate understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0031] Example 1

[0032] like Figures 1 to 5 , Figure 7As shown, a pressure sensor chip packaging device includes a first conveyor belt 1, a shell 2 and a second conveyor belt 3. The shell 2 is buckled and installed on the first conveyor belt 1. The second conveyor belt 3 is arranged in parallel with the first conveyor belt 1. The first conveyor belt 1 conveys to the left, and the second conveyor belt 3 conveys to the right. An inlet is arranged on the right end side wall of the shell 2, and an outlet is arranged on the left end of the shell 2; it also includes a plurality of molds 4, a plurality of chip slots 5, a plurality of filling holes 6, a plurality of diverter slots 7, a plurality of overflow holes 8 and a light source 9. A filling mechanism is installed at the inlet end of the shell 2. The second conveyor belt 3 conveys the mold 4 to the right. A conveyor belt 1 conveys the mold 4 to the left, and multiple chip slots 5 are arranged in the middle of the upper end faces of the multiple molds 4. The upper end faces of the right side walls of the multiple molds 4 are arranged with filling holes 6, and the filling holes 6 are connected to a chip slot 5 on the mold 4. The tops of the side walls of the multiple chip slots 5 of the mold 4 are arranged with diverter grooves 7, and the multiple chip slots 5 are connected through the multiple diverter grooves 7. The upper end faces of the left side walls of the multiple molds 4 are arranged with overflow holes 8, and the overflow holes 8 are connected to the top of a chip slot 5. The filling mechanism fills the filling hole 6 with light curing liquid, and the light source 9 is installed in the middle of the shell 2. , the light source 9 irradiates the light-curing liquid in the plurality of chip slots 5; it also includes a plurality of screws 33 and a plurality of nuts 34, the lower ends of the plurality of screws 33 are connected to the light source 9, the plurality of screws 33 are plug-connected to the top of the shell 2, and the plurality of nuts 34 are rotatably screwed on the plurality of screws 33 to fasten the plurality of screws 33 to the shell 2; it also includes a push cylinder 31 and a push plate 32, the fixed end of the push cylinder 31 is installed on the side of the frame of the second conveyor belt 3 away from the shell 2, the push plate 32 is installed on the piston rod of the push cylinder 31, and the push plate 32 is aligned with the inlet of the shell 2; the filling mechanism includes The liquid injection tube 10, the lifting rod 11 and the liquid injection unit 12, the liquid injection tube 10 is slidably inserted into the top of the shell 2, the liquid injection tube 10 matches the filling hole 6, one end of the lifting rod 11 is connected to the top of the shell 2, the other end of the lifting rod 11 is connected to the upper part of the liquid injection tube 10, the liquid injection unit 12 is installed on the shell 2, and the liquid outlet of the liquid injection unit 12 is connected to the upper end of the liquid injection tube 10 through a hose; it also includes a plurality of contact switches 13, the plurality of contact switches 13 are respectively installed on the plurality of molds 4, and the probes of the plurality of contact switches 13 are respectively extended into the plurality of overflow holes 8.

[0033] The distance between the light source 9 and the mold 4 is adjusted by lifting and lowering a plurality of screw rods 33, and a plurality of nuts 34 are tightened to lock the screw rods 33 on the top wall of the shell 2, so as to adjust the curing effect of the light source 9 on the photocurable liquid in the plurality of chip slots 5. During operation, the first conveyor belt 1 and the second conveyor belt 3 rotate step by step, and the second conveyor belt 3 conveys the empty mold 4 to the right. When the second conveyor belt 3 is paused, the plurality of chip components are placed in the plurality of chip slots 5 respectively. When the mold 4 moves to the inlet of the shell 2, the piston rod of the push cylinder 31 is extended so that the push plate 32 pushes the mold 4 through the inlet to the first conveyor belt 1 and is located inside the shell 2 to realize the transfer of the mold 4. When the mold 4 filled with chips moves to the bottom of the injection tube 10 and aligns the filling hole 6 with the injection tube 10, the first conveyor belt 1 is suspended, and the piston rod of the lifting rod 11 contracts to make the injection tube 10 descend, so that the lower end of the injection tube 10 is inserted into the filling hole 6. The injection unit 12 is operated to transport the light-curing liquid stored therein to the filling hole 6 through the hose and the injection tube 10. After the light-curing liquid fills one chip slot 5 through the filling hole 6, it fills the other multiple chip slots 5 in turn through the multiple diversion slots 7. When multiple chips are When the slots 5 are fully filled, the excess photocurable liquid is discharged through the overflow hole 8. The position of the overflow hole 8 limits the depth of the photocurable liquid filling. After the filling is completed, the photocurable lubricant enters the overflow hole 8 and contacts the contact switch 13. The contact switch 13 sends an electrical signal. When the device receives the above signal, it is determined that the filling of multiple chip slots 5 is completed. At this time, the piston rod of the lifting rod 11 is extended to disengage the injection pipe 10 from the filling hole 6, which will not interfere with the movement of the mold 4. The first conveyor belt 1 and the second conveyor belt 3 start to rotate step by step. The first conveyor belt 1 transports the filled mold 4 to the left to the bottom of the light source 9. Pause, the light source 9 illuminates the photocurable liquid in the multiple chip slots 5, so that the photocurable liquid is cured to complete the packaging of the pressure sensor chip. The mold 4 is made of transparent material, which can improve the curing effect of the photocurable liquid. Compared with the existing technology, there is no need for high-temperature heating to melt the resin particles, and the packaging temperature is lower, which reduces damage to chip components and improves the reliability of the chip after chip packaging. Since a photocurable liquid with lower viscosity is used and multiple chip slots 5 can be filled only through the filling hole 6, the structure of the filling mechanism is simplified, the filling operation is simplified, the filling time is shortened, and the work efficiency is improved.

[0034] Example 2

[0035] like Figures 4 to 7 , Fig. 9As shown in the figure of the injection tube 10, on the basis of Example 1, it also includes a lifting rod 14, a mounting frame 15 and a plurality of detection units 16, the fixed end of the lifting rod 14 is installed on the top wall of the left end of the shell 2, the mounting frame 15 is installed on the lower end of the piston rod of the lifting rod 14, and a plurality of detection units 16 are installed on the mounting frame 15, and the plurality of detection units 16 are respectively aligned with the plurality of chip slots 5, and the plurality of detection units 16 are used to detect the chip packaging quality in the plurality of chip slots 5; it also includes a plurality of positioning rods 17, and a plurality of positioning rods 17 are installed on the lower end surface of the mounting frame 15, and positioning holes that match and align with the plurality of positioning rods 17 are provided on the mold 4; it also includes a plurality of vertical rods 18 and a plurality of pressure rods 19, and the plurality of vertical rods 18 are installed on the top of the side walls between the plurality of chip slots 5 of the mold 4, and the plurality of pressure rods 19 are respectively rotatably installed on the upper ends of the plurality of vertical rods 18 through rotating shafts, and the plurality of pressure rods 19 are respectively facing the plurality of chip slots 5.

[0036] When the first conveyor belt 1 drives the mold 4 to move to the bottom of the mounting frame 15, it pauses, and the piston rod of the lifting rod 14 is extended to make the mounting frame 15 descend, so that the multiple detection units 16 are aligned with the multiple chip slots 5 up and down, so that the multiple detection units 16 detect the packaged chips in the multiple chip slots 5, and the detection items are circuit performance detection, appearance detection, etc. When the multiple detection units 16 irradiate and cure the light-curing liquid in the multiple chip slots 5, the multiple positioning rods 17 are respectively inserted into the multiple positioning holes of the mold 4 to improve the alignment effect of the multiple detection units 16 and the multiple chip slots 5. When the photocuring liquid is injected and the multiple detection units 16 detect the multiple chip slots 5, the multiple pressure rods 19 are in a vertical state on the multiple vertical rods 18, and the multiple pressure rods 19 are respectively located on the outside of the multiple chip slots 5, so that the multiple pressure rods 19 will not cause interference. When the multiple detection units 16 complete the detection of the packaged chips in the multiple chip slots 5, the pressure rods 19 are flipped over and laid flat and extended into the chip slots 5, so that the pressure rods 19 block the unqualified packaged chips in the chip slots 5. At this time, the mold 4 is flipped toward the exit of the shell 2 toward the outside of the left end of the first conveyor belt 1, so that the qualified packaged chips in the multiple chip slots 5 are unloaded.

[0037] Example 3

[0038] like Figure 6 to Figure 7 , Figure 8As shown in FIG. 12 , on the basis of Example 2, the liquid injection unit further includes multiple push rods 20, multiple protrusions 21, multiple spring sheets 22, a frame 23, a sliding rod 24, a spring 25, a push cylinder 26 and a flip assembly. The fixed ends of the multiple push rods 20 are installed on the mounting frame 15. The lower ends of the piston rods of the multiple push rods 20 are respectively aligned with the upper ends of the multiple pressure rods 19. The side walls of the rotating shafts of the multiple pressure rods 19 are all provided with protrusions 21. The upper ends of the multiple vertical rods 18 are all installed with spring sheets 22. The multiple spring sheets 22 are all provided with two card slots, and the two card slots match the protrusions 21. The two card slots of the spring sheets 22 elastically lock the vertical state and the horizontal state of the pressure rod 19. Multiple slots are provided on the side walls between the multiple chip slots 5 of the mold 4. The multiple vertical rods 18 are respectively vertically slidably inserted in the multiple slots. A lifting slot is provided inside the mold 4. The frame 23 is slidably installed in the lifting slot of the mold 4. In the figure, the lower ends of multiple vertical rods 18 are installed on the frame 23, the lower ends of the slide bars 24 are installed on the frame 23, the upper ends of the slide bars 24 extend out of the upper end surface of the mold 4, the lower ends of the springs 25 are connected to the mold 4, the upper ends of the springs 25 are connected to the slide bars 24, the push cylinder 26 is installed on the left end outside of the second conveyor belt 3, the flip assembly is installed on the frame of the second conveyor belt 3, the flip assembly flips the mold 4 and transfers the mold 4 from the first conveyor belt 1 to the second conveyor belt 3; the flip assembly includes multiple sockets 27, push cylinders 28, motors 29 and plugs 30, multiple sockets 27 are respectively installed on the left ends of the side walls of multiple molds 4, push cylinders 28 are horizontally installed on the frame of the second conveyor belt 3, the motor 29 is installed on the top of the piston rod of the push cylinders 28, the push cylinders 28 and the motor 29 are located on the left end outside of the second conveyor belt 3, the output shaft of the motor 29 is concentrically installed with the plug 30, and the plug 30 matches the socket 27.

[0039] When the detection unit 16 detects an unqualified packaged chip, the piston rod of the corresponding push rod 20 extends downward, so that the lower end of the piston rod of the push rod 20 flattens the corresponding pressure rod 19. In the process of the pressure rod 19 rotating from vertical to horizontal, the rotating shaft of the pressure rod 19 drives the protrusion 21 to rotate, so that the protrusion 21 slides from the first slot of the spring sheet 22 to the second slot, so that the upper end of the pressure rod 19 extends into the chip slot 5 to block the unqualified packaged new product. At this time, the push cylinder 28 The piston rod of the push cylinder 28 is extended so that the plug 30 is inserted into the socket 27 of the mold 4, and the motor 29 drives the plug 30 to rotate 180 degrees, so that the mold 4 is turned over to the left end outside of the first conveyor belt 1, so that the multiple chip slots 5 face downward, so that the qualified packaged chips in the multiple chip slots 5 fall into the qualified product box, and the piston rod of the push cylinder 28 is retracted, so that the mold 4 moves to the left end outside of the second conveyor belt 3, and the push cylinder 26 is aligned with the slide rod 24, and the piston rod of the push cylinder 26 is extended to push the slide rod 24 toward the mold The internal push of the tool 4 causes the slide bar 24 to drive the frame 23 to move upward, and the frame 23 drives the multiple vertical rods 18 to shrink and move toward the inside of the mold 4. At this time, the multiple pressure rods 19 that are laid flat are blocked by the top of the side wall of the chip slot 5, so that the multiple pressure rods 19 are restored to a vertical state. In this process, the rotating shafts of the multiple pressure rods 19 drive the protrusions 21 to rotate, so that the protrusions 21 slide from the second card slot of the spring sheet 22 to the first card slot and reset. At this time, the unqualified packaged chips fall from the multiple chip slots 5 to the unqualified box outside the left end of the second conveyor belt 3, the piston rod of the push cylinder 26 shrinks and disengages from the slide bar 24, and the elastic force of the spring 25 resets the slide bar 24 and the frame 23, and the motor 29 drives the plug 30 to reverse 180 degrees, so that the mold 4 is flipped to the left end of the second conveyor belt 3, and the piston rod of the push cylinder 28 shrinks again to disengage the plug 30 from the socket 27, so that the second conveyor belt 3 can transport the empty mold 4 to the right, and the empty mold 4 is convenient for carrying multiple chip components again.

[0040] like Figure 1As shown in the injection unit 12 of FIG. 1 , a pressure sensor chip packaging device of the present invention, when working, firstly, the second conveyor belt 3 carries the empty mold 4, and multiple chip components are respectively placed in multiple chip slots 5, and the second conveyor belt 3 conveys the mold 4 to the inlet of the shell 2, and the piston rod of the push cylinder 31 is extended to make the push plate 32 push the mold 4 into the shell 2, and the piston rod of the lifting rod 11 is contracted to make the injection tube 10 descend and insert it into the filling hole 6, and the injection unit 12 injects the light curing liquid into the filling hole 6 through the hose and the injection tube 10, so that the light curing liquid is injected into the filling hole 6 connected with the filling hole 6. The chip slot 5 is filled with the remaining chip slots 5 in turn through the multiple shunt slots 7. When the light-curing liquid enters the overflow hole 8, the contact switch 13 generates a signal, the injection unit 12 stops filling, the lifting rod 11 contracts to separate the injection pipe 10 from the filling hole 6, and the first conveyor belt 1 starts to rotate, so that the mold 4 moves to the bottom of the light source 9, and then the first conveyor belt 1 is paused. The light source 9 irradiates the mold 4, so that the light-curing liquid in the multiple chip slots 5 is cured, and the packaging of the chips in the multiple chip slots 5 is completed. The first conveyor belt 1 rotates again, so that the mold 4 moves to the bottom of the mounting frame 15 After that, the first conveyor belt 1 is paused, the piston rod of the lifting rod 2 14 is extended to make the mounting frame 15 descend, and the multiple detection units 16 carefully detect the packaged chips in the multiple chip slots 5, and the corresponding multiple push rods 20 piston rods are extended to flatten the corresponding pressure rods 19, so that the upper ends of the pressure rods 19 extend into the corresponding chip slots 5, so that the pressure rods 19 block the unqualified packaged chips, the lifting rod 2 14 is retracted to reset the mounting frame 15, the piston rod of the push cylinder 28 is extended to make the plug 30 inserted into the socket 27 of the mold 4, and the motor 29 drives the plug 30 to rotate 180 degrees, so that the mold 4 is turned over. To the outer side of the left end of the first conveyor belt 1, multiple chip slots 5 are facing downward, so that qualified packaged chips in the multiple chip slots 5 are dropped, the piston rod of the push cylinder 28 is contracted, so that the mold 4 is moved to the outer side of the left end of the second conveyor belt 3, and the push cylinder 26 is aligned with the slide bar 24. After the unqualified packaged chips in the multiple chip slots 5 are dropped, the motor 29 drives the plug 30 to reverse 180 degrees, so that the mold 4 is flipped to the left end of the second conveyor belt 3, and the piston rod of the push cylinder 28 is contracted again to disengage the plug 30 from the socket 27, so that the second conveyor belt 3 can transport the empty mold 4 to the right.

[0041] The main functions achieved by the present invention are:

[0042] 1. Use light-curing to encapsulate the chip, the encapsulation temperature is low, reducing damage to chip components;

[0043] 2. No heating system is required, which simplifies the structure of the filling mechanism, simplifies the filling operation, shortens the filling time and improves work efficiency;

[0044] 3. Be able to detect the chip packaging quality and separate qualified products from unqualified products;

[0045] 4. Mold recycling application, no need for special mold preparation, simplifying operation and improving work efficiency.

[0046] A pressure sensor chip packaging device of the present invention has a common mechanical installation method, connection method or setting method, which can be implemented as long as it can achieve its beneficial effects; a first conveyor belt 1, a second conveyor belt 3, a light source 9, an injection tube 10, a lifting rod 11, an injection unit 12, a contact switch 13, a lifting rod 2 14, a detection unit 16, a push rod 20, a spring sheet 22, a slide bar 24, a spring 25, a push cylinder 26, a push cylinder 28, a motor 29, a push cylinder 31, a screw 33, and a nut 34 of a pressure sensor chip packaging device of the present invention are purchased on the market, and technicians in the industry only need to install and operate them according to the accompanying instruction manual, without the need for creative labor by technicians in this field.

[0047] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A pressure sensor chip packaging device, comprising a first conveyor belt (1), a shell (2) and a second conveyor belt (3), wherein the shell (2) is buckled and mounted on the first conveyor belt (1), the second conveyor belt (3) and the first conveyor belt (1) are arranged in parallel, the first conveyor belt (1) conveys to the left, and the second conveyor belt (3) conveys to the right, an inlet is arranged on the right end side wall of the shell (2), and an outlet is arranged on the left end of the shell (2); characterized in that: The invention also comprises a plurality of moulds (4), a plurality of chip slots (5), a plurality of filling holes (6), a plurality of diverter slots (7), a plurality of overflow holes (8) and a light source (9); a filling mechanism is installed at the inlet end of the housing (2); a second conveyor belt (3) conveys the mould (4) to the right; a first conveyor belt (1) conveys the mould (4) to the left; a plurality of chip slots (5) are arranged at the middle of the upper end faces of the plurality of moulds (4); a filling hole (6) is arranged at the upper end faces of the right side walls of the plurality of moulds (4); the filling hole (6) is connected to the mould (4) The mold (4) is connected to a chip slot (5) on the top, the side walls of the multiple chip slots (5) of the mold (4) are all provided with shunt grooves (7), the multiple chip slots (5) are connected to each other through the multiple shunt grooves (7), the upper end surfaces of the left side walls of the multiple molds (4) are all provided with overflow holes (8), the overflow holes (8) are connected to the top of a chip slot (5), a filling mechanism fills the filling hole (6) with light-curing liquid, and a light source (9) is installed in the middle of the shell (2), and the light source (9) irradiates the light-curing liquid in the multiple chip slots (5).

2. A pressure sensor chip packaging device as claimed in claim 1, characterized in that: It also includes a plurality of screw rods (33) and a plurality of nuts (34), wherein the lower ends of the plurality of screw rods (33) are connected to the light source (9), the plurality of screw rods (33) are plug-connected to the top of the housing (2), and the plurality of nuts (34) are rotatably threaded onto the plurality of screw rods (33) to fasten the plurality of screw rods (33) to the housing (2).

3. A pressure sensor chip packaging device as claimed in claim 1, characterized in that: It also includes a push cylinder three (31) and a push plate (32), wherein the fixed end of the push cylinder three (31) is mounted on the side of the frame of the second conveyor belt (3) away from the shell (2), and the push plate (32) is mounted on the piston rod of the push cylinder three (31), and the push plate (32) is aligned with the inlet of the shell (2).

4. A pressure sensor chip packaging device as claimed in claim 1, characterized in that: The filling mechanism comprises a filling pipe (10), a lifting rod (11) and a filling unit (12); the filling pipe (10) is slidably inserted into the top of the shell (2); the filling pipe (10) matches the filling hole (6); one end of the lifting rod (11) is connected to the top of the shell (2); the other end of the lifting rod (11) is connected to the upper part of the filling pipe (10); the filling unit (12) is installed on the shell (2); and the liquid outlet of the filling unit (12) is connected to the upper end of the filling pipe (10) through a hose.

5. A pressure sensor chip packaging device as claimed in claim 4, characterized in that: It also includes a plurality of contact switches (13), wherein the plurality of contact switches (13) are respectively mounted on the plurality of moulds (4), and the probes of the plurality of contact switches (13) are respectively extended into the plurality of overflow holes (8).

6. The pressure sensor chip packaging device according to claim 1, characterized in that: It also comprises a lifting rod 2 (14), a mounting frame (15) and a plurality of detection units (16); the fixed end of the lifting rod 2 (14) is mounted on the top wall at the left end of the shell (2); the mounting frame (15) is mounted on the lower end of the piston rod of the lifting rod 2 (14); the plurality of detection units (16) are mounted on the mounting frame (15); the plurality of detection units (16) are respectively aligned with the plurality of chip slots (5); and the plurality of detection units (16) are used to detect the chip packaging quality in the plurality of chip slots (5).

7. A pressure sensor chip packaging device as claimed in claim 6, characterized in that: It also includes a plurality of positioning rods (17), the plurality of positioning rods (17) are installed on the lower end surface of the mounting frame (15), and the mold (4) is provided with positioning holes that match and align with the plurality of positioning rods (17).

8. The pressure sensor chip packaging device according to claim 6, characterized in that: It also includes a plurality of vertical rods (18) and a plurality of pressure rods (19), wherein the plurality of vertical rods (18) are mounted on the top of the side walls between the plurality of chip slots (5) of the mold (4), and the plurality of pressure rods (19) are rotatably mounted on the upper ends of the plurality of vertical rods (18) via rotating shafts, and the plurality of pressure rods (19) are respectively facing the plurality of chip slots (5).

9. A pressure sensor chip packaging device as claimed in claim 8, characterized in that: The invention also comprises a plurality of push rods (20), a plurality of protrusions (21), a plurality of spring sheets (22), a frame (23), a slide rod (24), a spring (25), a push cylinder (26) and a flip assembly. The fixed ends of the plurality of push rods (20) are mounted on a mounting frame (15). The lower ends of the piston rods of the plurality of push rods (20) are respectively aligned with the upper ends of the plurality of pressure rods (19). The side walls of the rotating shafts of the plurality of pressure rods (19) are all provided with protrusions (21). The upper ends of the plurality of vertical rods (18) are all provided with spring sheets (22). Two card slots are arranged on the plurality of spring sheets (22). The two card slots match the protrusions (21). The two card slots of the spring sheets (22) elastically lock the vertical state and the horizontal state of the pressure rod (19). The side walls between the plurality of chip slots (5) of the mold (4) are provided with protrusions (21). A plurality of slots are arranged on the wall, and a plurality of vertical rods (18) are respectively inserted into the plurality of slots in a vertical sliding manner. A lifting slot is arranged inside the mold (4), and a frame (23) is slidably installed in the lifting slot of the mold (4) in a lifting manner. The lower ends of the plurality of vertical rods (18) are installed on the frame (23), and the lower end of the slide bar (24) is installed on the frame (23). The upper end of the slide bar (24) extends out of the upper end surface of the mold (4). The lower end of the spring (25) is connected to the mold (4), and the upper end of the spring (25) is connected to the slide bar (24). A push cylinder (26) is installed outside the left end of the second conveyor belt (3), and a flip assembly is installed on the frame of the second conveyor belt (3). The flip assembly flips the mold (4) and transfers the mold (4) from the first conveyor belt (1) to the second conveyor belt (3).

10. The pressure sensor chip packaging device according to claim 9, characterized in that: The flip assembly comprises a plurality of sockets (27), a push cylinder (28), a motor (29) and a plug (30), wherein the plurality of sockets (27) are respectively mounted on the left ends of the side walls of the plurality of moulds (4), the push cylinder (28) is horizontally mounted on the frame of the second conveyor belt (3), the motor (29) is mounted on the top of the piston rod of the push cylinder (28), the push cylinder (28) and the motor (29) are located on the outer side of the left end of the second conveyor belt (3), the output shaft of the motor (29) is coaxially mounted with the plug (30), and the plug (30) matches the socket (27).

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