Substrate etching device, backlight-free liquid crystal screen based on the substrate, and etching method

Abstract

The present invention relates to the field of semiconductor device manufacturing technology, and discloses a substrate etching device, a backlight-free liquid crystal screen based on the substrate, and an etching method. The device comprises an etching machine, a plurality of silicon wafers arranged in the etching machine, and a carrier for holding the plurality of silicon wafers. The etching machine is provided with a reaction tank and a cleaning tank, and the etching machine is provided with a driving device, a gripping device, and a cleaning device; a transmission assembly is provided between the driving device and the cleaning device. The present invention, through the provision of the transmission assembly, enables the cleaning device to move toward the carrying device during the movement of the carrying device toward the cleaning tank, so that the silicon wafer and the carrier are located between the two cleaning parts, thereby achieving the effect of cleaning the residual liquid on the silicon wafer and the carrier, and solving the problem that the residual chemical etching liquid on the surface of the silicon wafer and its carrier drops into the etching machine during the movement from the reaction tank to the cleaning tank, causing pollution to the etching machine.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device manufacturing, in particular to a substrate etching device, a backlight-free liquid crystal screen based on the substrate, and an etching method. Background Art

[0002] Etching is a process of placing the silicon wafer to be etched in a chemical etching solution to remove the surface material. After the etching of the silicon wafer is completed, the etched silicon wafer needs to be rinsed to remove the chemical etching solution on the surface of the silicon wafer. Finally, the operator collects the silicon wafer. During the process of taking the silicon wafer out of the chemical etching solution and placing it in the cleaning tank for cleaning, the silicon wafer and the container holding the silicon wafer are not dried, which can easily cause the chemical etching solution to drip into the etcher, thereby contaminating the etcher. Summary of the Invention

[0003] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0004] A substrate etching device, a backlight-free liquid crystal display based on the substrate, and an etching method, comprising an etching machine, a plurality of silicon wafers arranged in the etching machine, and a carrier device for holding the plurality of silicon wafers. The etching machine is provided with a reaction tank and a cleaning tank, and is provided with a driving device, a gripping device, and a cleaning device.

[0005] A transmission assembly is provided between the driving device and the cleaning device to enable the grabbing device and the cleaning device to move in opposite directions;

[0006] The carrying device includes a plurality of carrying members and a receiving member, wherein the plurality of carrying members are arranged in the receiving member, and the silicon wafer is arranged in the carrying member;

[0007] The grabbing device includes a movable plate, a driving member sleeved on the movable plate, and a plurality of connecting members provided at the bottom of the movable plate, wherein the connecting members match the bearing member, and the driving member drives the plurality of connecting members to move toward each other during the downward movement of the movable plate;

[0008] The cleaning device includes multiple cleaning parts and a loading part for loading the cleaning parts. A movable part is provided between the loading part and the cleaning part so that the cleaning part is driven to rotate when the loading part moves. The multiple cleaning parts and the multiple carrying parts are staggered with each other.

[0009] Preferably, a top plate is fixedly connected inside the etching machine, a guide rail groove is opened on the top plate, a guide rail block is fixedly connected to the top of the movable plate, the guide rail block is slidably arranged in the guide rail groove, a first piston rod is fixedly connected to one side of the guide rail block, a first cylinder is fixedly connected to one side of the top plate, and the output end of the first cylinder is fixedly connected to one end of the first piston rod.

[0010] Preferably, the connecting member includes a plurality of moving blocks, a rectangular frame is provided at the bottom of the moving plate, sliding grooves are provided on both sides of the rectangular frame, the plurality of moving blocks are provided in the rectangular frame and are slidably connected to the rectangular frame through the sliding grooves, connecting belts are fixedly connected between the plurality of moving blocks, and a hook is fixedly connected to the bottom of the moving block.

[0011] The top of the hinged plate is fixedly provided with a hinged plate, and the hinged plate is hingedly connected to the top of the hinged plate and the hinged plate is hinged to the bottom of the hinged plate.

[0012] Preferably, the carrier includes a rectangular frame, a mounting groove is provided in the rectangular frame, the wafer silicon piece is placed in the rectangular frame through the mounting groove, partitions are fixedly connected on both sides of the bottom of the rectangular frame, a fixed block is fixedly connected to the top of the rectangular frame, a hole groove is provided on one side of the fixed block, and the hook is connected to the fixed block through the hole groove.

[0013] Preferably, the storage component comprises a square frame, both sides of the square frame are provided with square grooves, the tops of both sides of the rectangular frame are fixedly connected with square blocks, and the square blocks are slidably arranged in the square grooves.

[0014] Preferably, the loading part includes a loading tray, a baffle is hinged on one side of the top of the loading tray, a torsion spring is installed at the hinge between the baffle and the loading tray, a cross plate is fixedly connected to one side of the loading tray, and the cross plate is slidably connected to the side wall of the etching machine.

[0015] Preferably, the cleaning member comprises two cleaning cotton plates, the top of the loading tray is fixedly connected to a support plate, the top of the support plate is rotatably connected to a rotating rod through a bearing, and the two cleaning cotton plates are respectively fixedly connected to both ends of the rotating rod;

[0016] The movable part includes a movable rod, which is arranged in the loading plate and is rotatably connected to the loading plate through a bearing. A transmission belt is connected to the outer surface of the movable rod and the rotating rod. One end of the movable rod extends into the horizontal plate and is fixedly connected to the first gear. The inner wall of the etching machine is fixedly connected to the first gear plate. The first gear plate is arranged at the bottom of the horizontal plate and is meshed with the first gear.

[0017] Preferably, the transmission assembly includes a second gear, an inner groove is opened in the side wall of the etching machine, a right-angle plate is fixedly connected to one side of the guide rail block, the right-angle plate extends into the inner groove and is slidably connected to the side wall, an upper tooth plate is fixedly connected to the bottom of the right-angle plate, one side of the cross plate extends into the inner groove and is slidably connected to the side wall, a lower tooth plate is fixedly connected to the top of the cross plate, the second gear is arranged in the inner groove and is rotatably connected to the side wall through a bearing, the upper tooth plate and the lower tooth plate are respectively arranged at the top and bottom outside the second gear and are meshed with the second gear.

[0018] The backlight-free LCD screen and etching method based on the substrate use a substrate etching device, and the specific steps are as follows:

[0019] The silicon wafer is placed on the carrier, and through the matching arrangement between the carrier and the connecting member, the carrier is placed at the bottom of the connecting member. Through the cooperation between the driving member and the connecting member, the driving member moves downward, driving the multiple connecting members to move toward each other, thereby separating the multiple carriers in the storage member. The setting of the driving member drives the carrier to continue to move downward, and the silicon wafer in the carrier enters the reaction tank;

[0020] After the etching of the silicon wafer is completed, the driving device is set to drive the carrying device to move upward and out of the reaction tank, and then the driving device drives the grasping device and the carrying device at the bottom thereof to move toward the cleaning tank. The transmission component is set to make the cleaning device move toward the reaction tank. The cleaning part and the carrying part are staggered with each other, so that during the movement of the carrying part toward the cleaning tank, the silicon wafer and the carrying part will be located between the two cleaning parts, and the residual chemical reaction liquid on the silicon wafer and the carrying part will be cleaned by the cleaning part. When the grasping device and the carrying device at the bottom thereof move to the top of the cleaning tank, the carrying device is separated from the cleaning device, and the driving device drives the carrying part and the silicon wafer into the cleaning tank for cleaning.

[0021] Beneficial effects

[0022] Compared with the prior art, the present invention provides a substrate etching device, a backlight-free liquid crystal display based on the substrate, and an etching method, which have the following beneficial effects:

[0023] 1. A substrate etching device, a backlight-free LCD screen based on the substrate, and an etching method. After the etching of the silicon wafer is completed, the transmission component is set so that the cleaning device moves toward the carrier device during the movement of the carrier device toward the cleaning tank, so that the silicon wafer and the carrier are located between the two cleaning parts, thereby achieving the effect of cleaning the residual liquid on the silicon wafer and the carrier, and solving the problem of residual chemical corrosion liquid on the surface of the silicon wafer and its carrier dripping into the etching machine during the movement from the reaction tank to the cleaning tank, causing pollution to the etching machine.

[0024] 2. A substrate etching device, a backlight-free LCD screen based on the substrate, and an etching method. After the carrying device is loaded on the grasping device, the sleeve is moved downward by the setting of the driving part, and after the slider is located at the bottom of the slide groove, the second piston rod drives the hinge block to move downward, and the two ends of the hinge plate are respectively hinged with the movable block and the hinge block, so that the two outermost movable blocks in the rectangular frame move backward, thereby allowing multiple carrying parts to unfold and increase the contact area between the wafer silicon wafer and the etching liquid. When the sleeve moves upward and the sliding block is located at the top of the slide groove, the second piston rod drives the hinge block to move upward, and the two ends of the hinge plate are respectively hinged with the movable block and the hinge block, so that the two outermost movable blocks in the rectangular frame move toward each other, thereby allowing multiple carrying parts to fit together, thereby facilitating the installation and disassembly between the carrying device and the grasping device.

[0025] 3. A substrate etching device, a backlight-free LCD screen based on the substrate, and an etching method. During the movement of the cleaning device toward the reaction tank, the meshing connection between the first tooth plate and the first gear drives the movable rod to rotate, and the sleeve connection between the transmission belt, the movable rod, and the rotating rod drives the rotating rod to rotate, thereby driving the cleaning cotton plate to rotate, thereby increasing the cleaning efficiency of the cleaning cotton plate on the corrosive liquid on the surface of the wafer silicon wafer and the carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 Schematic diagram of the overall structure of the substrate etching device of the present invention;

[0027] Figure 2 This is one of the schematic diagrams of the internal structure of the etching machine of the present invention;

[0028] Figure 3 This is the second schematic diagram of the internal structure of the etching machine of the present invention;

[0029] Figure 4 It is a structural schematic diagram of the grabbing device of the present invention;

[0030] Figure 5 For the present invention Figure 4 Schematic diagram of the structure of the middle part A;

[0031] Figure 6 Schematic diagram of the driving member structure of the present invention;

[0032] Figure 7 For the present invention Figure 6 Schematic diagram of the structure of the middle part B;

[0033] Figure 8 It is a structural schematic diagram of the carrying device of the present invention;

[0034] Figure 9 For the present invention Figure 8 Schematic diagram of the structure of the middle C part;

[0035] Figure 10 It is a schematic structural diagram of the cleaning device and transmission assembly of the present invention;

[0036] Figure 11 For the present invention Figure 10 Schematic diagram of the structure of the middle D part;

[0037] Figure 12 For the present invention Figure 10 Schematic diagram of the structure of the middle E part.

[0038] In the figure: 1. Etching machine; 2. Silicon wafer; 3. Carrying device; 4. Reaction tank; 5. Cleaning tank; 6. Driving device; 7. Grabbing device; 8. Cleaning device; 9. Transmission assembly; 31. Carrying member; 32. Storage member; 71. Moving plate; 72. Driving member; 73. Connecting member; 81. Cleaning member; 82. Loading member; 83. Moving member; 10. Top plate; 11. Guide rail groove; 12. Guide rail block; 13. First piston rod; 14. First cylinder; 731. Moving block; 732. Rectangular frame; 733. Connecting belt; 734. Hook; 721. Sleeve; 722. Slide; 723. Slider; 724. Rectangular groove; 72 5. Articulated block; 726. Articulated plate; 727. Spring; 728. Second piston rod; 729. Rectangular block; 720. Second cylinder; 321. Square frame; 322. Square block; 311. Rectangular frame; 312. Mounting slot; 313. Partition plate; 314. Fixed block; 315. Hole slot; 821. Loading tray; 822. Baffle; 823. Torsion spring; 824. Cross plate; 811. Cleaning cotton plate; 812. Support plate; 813. Rotating rod; 831. Movable rod; 832. Transmission belt; 833. First gear; 834. First tooth plate; 91. Second gear; 92. Right-angle plate; 93. Upper tooth plate; 94. Lower tooth plate. DETAILED DESCRIPTION

[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0040] As introduced in the background technology, in order to solve the deficiencies in the existing technology, this application proposes a substrate etching device, a backlight-free liquid crystal screen based on the substrate, and an etching method.

[0041] Example 1:

[0042] See also Figure 1-Figure 3 and Figure 10 , a substrate etching device, a backlight-free liquid crystal display based on the substrate, and an etching method, comprising an etching machine 1, a plurality of silicon wafers 2 arranged in the etching machine 1, and a carrier device 3 for holding the plurality of silicon wafers 2, a reaction tank 4 and a cleaning tank 5 are provided in the etching machine 1, and a driving device 6, a gripping device 7, and a cleaning device 8 are provided in the etching machine 1;

[0043] A transmission assembly 9 is provided between the driving device 6 and the cleaning device 8 to enable the grabbing device 7 and the cleaning device 8 to move in opposite directions;

[0044] The carrier device 3 includes a plurality of carriers 31 and a receiving member 32 . The plurality of carriers 31 are disposed in the receiving member 32 , and the silicon wafers 2 are disposed in the carriers 31 .

[0045] The grabbing device 7 includes a movable plate 71, a driving member 72 sleeved on the movable plate 71, and a plurality of connecting members 73 provided at the bottom of the movable plate 71. The connecting members 73 match the carrier 31. When the driving member 72 moves downward on the movable plate 71, it drives the plurality of connecting members 73 to move toward each other.

[0046] The cleaning device 8 includes multiple cleaning parts 81 and a loading part 82 for loading the cleaning parts 81. A movable part 83 is provided between the loading part 82 and the cleaning part 81 so that the cleaning part 81 can be driven to rotate when the loading part 82 moves. The multiple cleaning parts 81 and the multiple supporting parts 31 are staggered with each other.

[0047] Specifically, the silicon wafer 2 is placed on the carrier 31, and through the mutual matching arrangement between the carrier 31 and the connecting member 73, the carrier 31 is placed at the bottom of the connecting member 73. Through the cooperation between the driving member 72 and the connecting member 73, the driving member 72 moves downward, driving the multiple connecting members 73 to move toward each other, thereby separating the multiple carriers 31 in the receiving member 32. The setting of the driving member 72 drives the carrier device 3 to continue to move downward, and the silicon wafer 2 in the carrier 31 enters the reaction tank 4.

[0048] After the etching of the silicon wafer 2 is completed, the carrying device 3 is driven to move upward and out of the reaction tank 4 by the setting of the driving member 72, and then the driving device 6 drives the grasping device 7 and the carrying device 3 at the bottom thereof to move toward the cleaning tank 5. The setting of the transmission assembly 9 makes the cleaning device 8 move toward the reaction tank 4. The cleaning member 81 and the carrying member 31 are staggered with each other, so that during the movement of the carrying member 31 toward the cleaning tank 5, the silicon wafer 2 and the carrying member 31 will be located between the two cleaning members 81, and the residual chemical reaction liquid on the silicon wafer 2 and the carrying member 31 will be cleaned by the cleaning member 81. When the grasping device 7 and the carrying device 3 at the bottom thereof move to the top of the cleaning tank 5, the carrying device 3 is separated from the cleaning device 8, and the carrying member 31 and the silicon wafer 2 are driven by the driving member 72 to enter the cleaning tank 5 for cleaning;

[0049] By setting the transmission component 9, when the carrying device 3 moves toward the cleaning tank 5, the cleaning device 8 moves toward the carrying device 3, so that the wafer silicon wafer 2 and the carrying member 31 are located between the two cleaning members 81, thereby achieving the effect of cleaning the residual liquid on the wafer silicon wafer 2 and the carrying member 31, and solving the problem that the residual chemical etching liquid on the surface of the wafer silicon wafer 2 and its carrying container drops into the etching machine 1 during the movement from the reaction tank 4 to the cleaning tank 5, causing pollution to the etching machine 1.

[0050] Example 2:

[0051] The difference from the above embodiment 1 is that, see Figure 4-Figure 7 For the above-mentioned grabbing device 7, a top plate 10 is fixedly connected to the etching machine 1, and a guide rail groove 11 is opened on the top plate 10. A guide rail block 12 is fixedly connected to the top of the movable plate 71. The guide rail block 12 is slidably arranged in the guide rail groove 11. A first piston rod 13 is fixedly connected to one side of the guide rail block 12. A first cylinder 14 is fixedly connected to one side of the top plate 10. The output end of the first cylinder 14 is fixedly connected to one end of the first piston rod 13;

[0052] The connecting member 73 includes a plurality of movable blocks 731. A rectangular frame 732 is provided at the bottom of the movable plate 71. Sliding grooves are provided on both sides of the rectangular frame 732. The plurality of movable blocks 731 are disposed within the rectangular frame 732 and are slidably connected to the rectangular frame 732 via the sliding grooves. A connecting belt 733 is fixedly connected between the plurality of movable blocks 731. A hook 734 is fixedly connected to the bottom of the movable block 731.

[0053] The driving member 72 includes a sleeve 721, which is sleeved outside the movable plate 71 and fixedly connected to the rectangular frame 732 at the bottom. Slide grooves 722 are provided on both sides of the movable plate 71. Sliders 723 are fixedly connected to the tops of both sides of the sleeve 721. The slides 723 are slidably arranged in the slide grooves 722. Rectangular grooves 724 are provided on both sides of the sleeve 721. A hinge block 725 is slidably connected in the rectangular groove 724. The tops of the movable blocks 731 on both sides of the rectangular frame 732 are hinged to hinge plates 726. The hinge plate 726 is movably hinged to the hinge block 725 at one end away from the moving block 731. The top and bottom of the hinge plate 726 are fixedly connected to springs 727. The spring 727 is disposed in the rectangular groove 724. The top of the hinge block 725 is fixedly connected to a second piston rod 728. The top of the guide rail block 12 is fixedly connected to a rectangular block 729. The top of the rectangular block 729 is fixedly connected to the second cylinder 720. The top end of the second piston rod 728 passes through the guide rail block 12 and is fixedly connected to the output shaft end of the second cylinder 720.

[0054] Specifically, after the carrying device 3 is placed at the bottom of the grasping device 7, the second cylinder 720 drives the second piston rod 728 to stretch, thereby driving the hinge blocks 725 on both sides of the sleeve 721 to move downward. Through the setting of the spring 727 at the bottom of the hinge block 725, the second piston rod 728 drives the hinge block 725 to move downward, and drives the sleeve 721 to move downward. When the slider 723 in the sleeve 721 moves downward to the bottom of the slide groove 722, the sleeve 721 no longer moves, and the carrying device 3 is located in the reaction tank 4. The second cylinder 720 continues to drive the second piston rod 728 to stretch, and through the hinge block 725 and the rectangular The sliding connection between the grooves 724 causes the hinge block 725 to move downward. The hinged connection between the two ends of the hinge plate 726 and the hinged block 725 and the movable block 731 respectively drives the movable blocks 731 on both sides of the rectangular frame 732 to perform outward and backward movement. The connection belt 733 is fixedly connected between the multiple movable blocks 731. When the movable blocks 731 on both sides of the rectangular frame 732 move to the sides, the two outermost movable blocks 731 drive the other movable blocks 731 to expand toward the periphery, thereby increasing the distance between the multiple movable blocks 731 and increasing the contact area between the silicon wafer 2 and the etching solution.

[0055] When the carrying device 3 is cleaned, the second cylinder 720 drives the second piston to retract, thereby driving the hinge blocks 725 on both sides of the sleeve 721 to move upward. Through the setting of the spring 727 at the top of the hinge block 725, the second piston rod 728 drives the hinge block 725 to move upward, driving the sleeve 721 to move upward. When the slider 723 in the sleeve 721 moves upward to the top of the slide groove 722, the sleeve 721 stops moving. At this time, the carrying device 3 is located outside the cleaning tank 5. The second cylinder 720 continues to drive the second piston to retract, and through the sliding connection between the hinge block 725 and the rectangular groove 724, the hinge block 725 moves upward. Through the movable hinge connection between the two ends of the hinge plate 726 and the hinge block 725 and the moving block 731, the moving blocks 731 on both sides of the rectangular frame 732 are driven to move inward and toward each other, so that multiple moving blocks 731 are fit together, thereby facilitating the installation and disassembly between the carrying device 3 and the grasping device 7.

[0056] Example 3:

[0057] The difference from the above embodiment 2 is that, see Figure 8-Figure 9 For the above-mentioned carrying device 3, the carrying member 31 includes a rectangular frame 311, and a mounting groove 312 is opened in the rectangular frame 311. The silicon wafer 2 is placed in the rectangular frame 311 through the mounting groove 312. The bottom of the rectangular frame 311 is fixedly connected to the partition board 313 on both sides. The top of the rectangular frame 311 is fixedly connected to the fixing block 314. The fixing block 314 has a hole groove 315 on one side. The hook 734 is sleeved on the fixing block 314 through the hole groove 315.

[0058] The storage member 32 includes a square frame 321, with square grooves on both sides of the square frame 321. The tops of both sides of the rectangular frame 311 are fixedly connected with square blocks 322, and the square blocks 322 are slidably arranged in the square grooves.

[0059] Specifically, the rectangular frame 311 and the mounting groove 312 are provided to facilitate installation and disassembly of the silicon wafer 2. The partition 313 is provided to prevent the silicon wafer 2 from falling. The rectangular frame 311 is installed on the bottom of the moving block 731 through the connection between the hole groove 315 and the hook 734. The driving member 72 is provided to ensure that when the silicon wafer 2 is in the reaction tank 4, the multiple silicon wafers 2 are in a scattered state. When the silicon wafer 2 is above the cleaning tank 5, the multiple carriers 31 are in a fitted state.

[0060] Example 4:

[0061] The difference from the above embodiment 3 is that, see Figure 10-12For the transmission assembly 9, the loading member 82 includes a loading tray 821, a baffle 822 is hinged to one side of the top of the loading tray 821, a torsion spring 823 is installed at the hinge between the baffle 822 and the loading tray 821, and a horizontal plate 824 is fixedly connected to one side of the loading tray 821, and the horizontal plate 824 is slidably connected to the side wall of the etching machine 1;

[0062] The cleaning member 81 includes two cleaning cotton plates 811. A support plate 812 is fixedly connected to the top of the loading tray 821. A rotating rod 813 is rotatably connected to the top of the support plate 812 via a bearing. The two cleaning cotton plates 811 are fixedly connected to both ends of the rotating rod 813.

[0063] The movable member 83 includes a movable rod 831, which is disposed in the loading plate 821 and is rotatably connected to the loading plate 821 via a bearing. A transmission belt 832 is connected to the outer surface of the movable rod 831 and the rotating rod 813. One end of the movable rod 831 extends into the transverse plate 824 and is fixedly connected to a first gear 833. A first toothed plate 834 is fixedly connected to the inner wall of the etching machine 1. The first toothed plate 834 is disposed at the bottom of the transverse plate 824 and is meshed with the first gear 833.

[0064] The transmission assembly 9 includes a second gear 91. An inner groove is opened in the side wall of the etching machine 1. A right-angle plate 92 is fixedly connected to one side of the guide rail block 12. The right-angle plate 92 extends into the inner groove and is slidably connected to the side wall. An upper tooth plate 93 is fixedly connected to the bottom of the right-angle plate 92. One side of the cross plate 824 extends into the inner groove and is slidably connected to the side wall. A lower tooth plate 94 is fixedly connected to the top of the cross plate 824. The second gear 91 is arranged in the inner groove and is rotatably connected to the side wall through a bearing. The upper tooth plate 93 and the lower tooth plate 94 are respectively arranged at the top and bottom outside the second gear 91 and are meshed with the second gear 91.

[0065] Specifically, the first cylinder 14 drives the first piston rod 13 to extend, thereby driving the guide rail block 12 to slide forward, and then driving the movable plate 71 and the right-angle plate 92 to move forward synchronously. The movable plate 71 moves forward, driving the grabbing device 7 and the carrying device 3 to move toward the cleaning tank 5, and the right-angle plate 92 moves forward, and through the meshing connection between the upper tooth plate 93 and the second gear 91, drives the second gear 91 to rotate, and through the meshing connection between the lower tooth plate 94 and the second gear 91, drives the cross plate 824 fixedly connected to the lower tooth plate 94 to move, and the moving direction of the cross plate 824 is opposite to the moving direction of the right-angle plate 92, thereby driving the loading tray 821 to move toward the reaction tank 4, thereby making the loading tray 821 on the carrying device 3 The carrier 31 and the cleaning member 81 are misaligned and overlapped, and the rectangular frame 311 in the carrier 31 and the wafer silicon wafer 2 in the rectangular frame 311 are cleaned by the cleaning cotton plate 811. At the same time, in the process of the horizontal plate 824 moving toward the reaction tank 4, the first gear 833 is driven to rotate by the meshing connection between the first gear 833 and the first tooth plate 834, thereby driving the movable rod 831 fixedly connected to the first gear 833 to rotate, and the rotating rod 813 is driven to rotate by the connection between the transmission belt 832, the movable rod 831 and the rotating rod 813, thereby driving the rotating rod 813 to rotate, thereby driving the cleaning cotton plate 811 to rotate, thereby increasing the cleaning efficiency of the cleaning cotton plate 811 on the corrosive liquid on the surface of the wafer silicon wafer 2 and the carrier 31.

[0066] Embodiment 5:

[0067] See Figures 1-12 This embodiment discloses a backlight-free liquid crystal display and an etching method based on the substrate, and the specific steps are as follows:

[0068] The silicon wafer 2 is placed on the carrier 31, and through the mutual matching arrangement between the carrier 31 and the connecting member 73, the carrier 31 is placed at the bottom of the connecting member 73. Through the cooperation between the driving member 72 and the connecting member 73, the driving member 72 moves downward, driving the multiple connecting members 73 to move toward each other, thereby separating the multiple carriers 31 in the receiving member 32. The setting of the driving member 72 drives the carrier device 3 to continue to move downward, and the silicon wafer 2 in the carrier 31 enters the reaction tank 4;

[0069] After the etching of the silicon wafer 2 is completed, the driving member 72 is used to drive the carrying device 3 to move upward and separate from the reaction tank 4. Then the driving device 6 drives the grasping device 7 and the carrying device 3 at the bottom thereof to move toward the cleaning tank 5. The transmission component 9 is used to make the cleaning device 8 move toward the reaction tank 4. The cleaning member 81 and the carrying member 31 are staggered with each other, so that during the movement of the carrying member 31 toward the cleaning tank 5, the silicon wafer 2 and the carrying member 31 will be located between the two cleaning members 81, and the residual chemical reaction liquid on the silicon wafer 2 and the carrying member 31 will be cleaned by the cleaning member 81. When the grasping device 7 and the carrying device 3 at the bottom thereof move to the top of the cleaning tank 5, the carrying device 3 is separated from the cleaning device 8, and the driving member 72 drives the carrying member 31 and the silicon wafer 2 into the cleaning tank 5 for cleaning.

[0070] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A substrate etching device comprising an etcher, a plurality of silicon wafers disposed in the etcher, and a carrier for holding the plurality of silicon wafers, characterized in that: The etching machine is provided with a reaction tank and a cleaning tank, and is provided with a driving device, a grabbing device and a cleaning device; A transmission assembly is provided between the driving device and the cleaning device to enable the grabbing device and the cleaning device to move in opposite directions; The carrying device includes a plurality of carrying members and a receiving member, wherein the plurality of carrying members are arranged in the receiving member, and the silicon wafer is arranged in the carrying member; The grabbing device includes a movable plate, a driving member sleeved on the movable plate, and a plurality of connecting members provided at the bottom of the movable plate, wherein the connecting members match the bearing member, and the driving member drives the plurality of connecting members to move toward each other during the downward movement of the movable plate; The cleaning device includes a plurality of cleaning members and a loading member for loading the cleaning members. A movable member is provided between the loading member and the cleaning member so that the loading member drives the cleaning member to rotate when the loading member moves. The plurality of cleaning members and the plurality of loading members are staggered with each other. The top of the movable plate is fixedly connected with a guide rail block; The loading member includes a loading tray, and a transverse plate is fixedly connected to one side of the loading tray; The transmission assembly includes a second gear, an inner groove is opened in the side wall of the etching machine, a right-angle plate is fixedly connected to one side of the guide rail block, the right-angle plate extends into the inner groove and is slidably connected to the side wall, an upper tooth plate is fixedly connected to the bottom of the right-angle plate, one side of the cross plate extends into the inner groove and is slidably connected to the side wall, a lower tooth plate is fixedly connected to the top of the cross plate, the second gear is arranged in the inner groove and is rotatably connected to the side wall through a bearing, and the upper tooth plate and the lower tooth plate are respectively arranged at the top and bottom outside the second gear and are meshed with the second gear.

2. The substrate etching device according to claim 1, wherein: A top plate is fixedly connected inside the etching machine, a guide rail groove is opened on the top plate, the guide rail block is slidably arranged in the guide rail groove, a first piston rod is fixedly connected to one side of the guide rail block, a first cylinder is fixedly connected to one side of the top plate, and the output end of the first cylinder is fixedly connected to one end of the first piston rod.

3. The substrate etching device according to claim 2, wherein: The connecting member includes multiple moving blocks, a rectangular frame is provided at the bottom of the moving plate, sliding grooves are opened on both sides of the rectangular frame, multiple moving blocks are arranged in the rectangular frame and are slidably connected to the rectangular frame through the sliding grooves, connecting belts are fixedly connected between the multiple moving blocks, and a hook is fixedly connected to the bottom of the moving block.

4. The substrate etching device according to claim 3, wherein: The top of the hinged plate is fixedly provided with a hinged plate, and the hinged plate is hingedly connected to the top of the hinged plate and the hinged plate is hinged to the bottom of the hinged plate.

5. The substrate etching device according to claim 4, wherein: The carrier includes a rectangular frame with a mounting groove provided in the rectangular frame. The silicon wafer is placed in the rectangular frame through the mounting groove. Partitions are fixedly connected to both sides of the bottom of the rectangular frame. A fixed block is fixedly connected to the top of the rectangular frame. A hole groove is provided on one side of the fixed block. The hook is sleeved on the fixed block through the hole groove.

6. The substrate etching device according to claim 5, wherein: The storage component comprises a square frame, both sides of the square frame are provided with square grooves, the tops of both sides of the rectangular frame are fixedly connected with square blocks, and the square blocks are slidably arranged in the square grooves.

7. The substrate etching device according to claim 6, wherein: A baffle is hinged on one side of the top of the loading tray, a torsion spring is installed at the hinge between the baffle and the loading tray, and the transverse plate is slidably connected to the side wall of the etching machine.

8. The substrate etching device according to claim 7, wherein: The cleaning member includes two cleaning cotton plates, the top of the loading tray is fixedly connected to a support plate, the top of the support plate is rotatably connected to a rotating rod through a bearing, and the two cleaning cotton plates are respectively fixedly connected to both ends of the rotating rod; The movable part includes a movable rod, which is arranged in the loading plate and is rotatably connected to the loading plate through a bearing. A transmission belt is connected to the outer surface of the movable rod and the rotating rod. One end of the movable rod extends into the horizontal plate and is fixedly connected to the first gear. The inner wall of the etching machine is fixedly connected to the first gear plate. The first gear plate is arranged at the bottom of the horizontal plate and is meshed with the first gear.

9. A method for etching a liquid crystal display without backlight, characterized in that: The substrate etching device according to any one of claims 1 to 8 is applied, and the specific steps are as follows: The silicon wafer is placed on the carrier, and through the matching arrangement between the carrier and the connecting member, the carrier is placed at the bottom of the connecting member. Through the cooperation between the driving member and the connecting member, the driving member moves downward, driving the multiple connecting members to move toward each other, thereby separating the multiple carriers in the storage member. The setting of the driving member drives the carrier to continue to move downward, and the silicon wafer in the carrier enters the reaction tank; After the etching of the silicon wafer is completed, the driving device is set to drive the carrying device to move upward and out of the reaction tank, and then the driving device drives the grasping device and the carrying device at the bottom thereof to move toward the cleaning tank. The transmission component is set to make the cleaning device move toward the reaction tank. The cleaning part and the carrying part are staggered with each other, so that during the movement of the carrying part toward the cleaning tank, the silicon wafer and the carrying part will be located between the two cleaning parts, and the residual chemical reaction liquid on the silicon wafer and the carrying part will be cleaned by the cleaning part. When the grasping device and the carrying device at the bottom thereof move to the top of the cleaning tank, the carrying device is separated from the cleaning device, and the driving device drives the carrying part and the silicon wafer into the cleaning tank for cleaning.

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