Light emitting substrate, display device and method for manufacturing light emitting substrate

Abstract

The application provides a light-emitting substrate, a display device and a preparation method of the light-emitting substrate. In the embodiment of the application, the isolation structure is arranged higher than the light-emitting device and on the side of the light-emitting device, which is conducive to shielding the light emitted to the side of the light-emitting device, avoiding the light interference between the light-emitting devices and reducing the degree of light halo. Furthermore, the first end and the second end between the side away from the substrate of the isolation structure are recessed, so that the contact surface between the isolation structure and the encapsulation layer is not a single plane, thereby forming a blocking area on the side of the light-emitting device, and further improving the water vapor resistance of the encapsulation layer.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a light-emitting substrate, a display device, and a method for preparing the light-emitting substrate. Background Technology

[0002] Currently, Mini LED (Mini Light-Emitting Diode) substrates are encapsulated with silicone after die bonding to protect the light-emitting device. Using transparent materials for encapsulation can improve the utilization of light from a wide viewing angle, but it can also exacerbate halo problems. On the other hand, filling with opaque materials will cause a loss of brightness when viewed directly from the light-emitting device.

[0003] In addition, directly using silicone coating for filling can easily lead to moisture penetration at the interface between the encapsulation layer and the reflective layer, causing the light-emitting device to fail. Summary of the Invention

[0004] The main technical problem addressed by this application is to provide a light-emitting substrate, a display device, and a method for preparing the light-emitting substrate, thereby solving the problems of halo effect and light-emitting device failure in the prior art.

[0005] To address the aforementioned technical problems, the first technical solution provided in this application is: to provide a light-emitting substrate, comprising:

[0006] substrate;

[0007] Multiple light-emitting devices are spaced apart on one side of the substrate;

[0008] An isolation structure is provided on the side of the light-emitting device to block the light emitted laterally by the light-emitting device;

[0009] An encapsulation layer covers the light-emitting device and the isolation structure;

[0010] The isolation structure has a first end and a second end on the side away from the substrate, and a recess is formed between the first end and the second end;

[0011] The first end has a first height relative to the substrate, the second end has a second height relative to the substrate, and the light-emitting device has a third height relative to the substrate;

[0012] The third height is less than the first height but greater than the second height.

[0013] In the isolation structure, the second end is disposed on the side of the first end near the light-emitting device, and the second end is in contact with the surface of the adjacent light-emitting device that is close to each other.

[0014] Wherein, in the plane direction perpendicular to the substrate, the cross-section of the recess is rectangular, V-shaped or U-shaped.

[0015] The isolation structure includes a light-absorbing material.

[0016] in,

[0017] The isolation structure also includes light-reflecting particles;

[0018] And / or,

[0019] The isolation structure also includes dry particles.

[0020] The light-emitting device includes an inorganic light-emitting diode.

[0021] To solve the above-mentioned technical problems, the second technical solution provided in this application is: to provide a display device, which includes the above-mentioned light-emitting substrate.

[0022] To solve the above-mentioned technical problems, the third technical solution provided in this application is: a method for preparing a light-emitting substrate, used to prepare the aforementioned light-emitting substrate; wherein, it includes:

[0023] Step 1: Form multiple light-emitting devices spaced apart on one side of the substrate.

[0024] Step 2: An isolation structure is formed on the side of the light-emitting device to block the light emitted laterally by the light-emitting device; wherein, the isolation structure has a first end and a second end on the side away from the substrate, and a recess is formed between the first end and the second end; the first end has a first height relative to the substrate, the second end has a second height relative to the substrate, and the light-emitting device has a third height relative to the substrate; the third height is less than the first height and greater than the second height;

[0025] Step 3: Seal the light-emitting device and the isolation structure to form an encapsulation layer.

[0026] Between step one and step two, the following is also included:

[0027] A mask is provided on the light-emitting surface of the light-emitting device; the mask includes a cutout portion and a blocking portion located on the side of the cutout portion, and a groove is formed on the side of the blocking portion near the light-emitting device. The groove includes a first groove and a second groove that are interconnected, and the second groove is disposed on the bottom wall of the first groove; wherein, the bottom wall of the first groove is in contact with the light-emitting surface, and the side wall of the first groove is in partial contact with the side of the light-emitting device.

[0028] The mask plate comprises an elastic material; the mask plate includes an initial state and a deformed state; in the initial state, the mask plate includes the first groove; in the deformed state, the mask plate further includes the second groove.

[0029] The step of setting a mask on the light-emitting surface of the light-emitting device includes:

[0030] The mask plate is set in its initial state on the light-emitting surface of the light-emitting device, and the bottom wall of the first groove is in contact with the light-emitting surface, and there is a gap between the side wall of the first groove and the light-emitting device.

[0031] A force is applied to cause the mask plate in its initial state to deform into a deformed state, forming the second groove.

[0032] The beneficial effects of this application are as follows: Unlike existing technologies, this application provides a light-emitting substrate, a display device, and a method for fabricating the light-emitting substrate. The light-emitting substrate includes a substrate, multiple light-emitting devices, an isolation structure, and an encapsulation layer. The isolation structure has a first end and a second end on the side away from the substrate, with a recess formed between the first and second ends. The first end has a first height relative to the substrate, the second end has a second height relative to the substrate, and the light-emitting devices have a third height relative to the substrate. The third height is less than the first height and greater than the second height. The isolation structure is disposed on the side of the light-emitting devices to block light emitted laterally by the light-emitting devices. The encapsulation layer covers the light-emitting devices and the isolation structure. In this embodiment, the isolation structure is positioned above the light-emitting devices and on the side of the light-emitting devices, which helps to block light emitted laterally by the light-emitting devices, avoids light interference between the light-emitting devices, and helps to reduce the degree of halo effect. Furthermore, the recess formed between the first and second ends of the isolation structure on the side away from the substrate makes the contact surface between the isolation structure and the encapsulation layer non-uniform, thereby forming a barrier area on the side of the light-emitting devices, which helps to improve the waterproof and vapor-proof capability of the encapsulation layer. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0034] Figure 1 This is a schematic diagram of the structure of the first embodiment of the light-emitting substrate provided in this application;

[0035] Figure 2 yes Figure 1 Enlarged structural diagram at point A;

[0036] Figure 3 This is a schematic diagram of the structure of the second embodiment of the light-emitting substrate provided in this application;

[0037] Figure 4 This is a schematic diagram of the structure of the third embodiment of the light-emitting substrate provided in this application;

[0038] Figure 5 This is a schematic diagram of the structure of the fourth embodiment of the light-emitting substrate provided in this application;

[0039] Figure 6 This is a schematic diagram of the structure of the fifth embodiment of the light-emitting substrate provided in this application;

[0040] Figure 7 This is a schematic diagram of the structure of the sixth embodiment of the light-emitting substrate provided in this application;

[0041] Figure 8 yes Figure 7 Enlarged structural diagram at point B;

[0042] Figure 9 This is a flowchart illustrating the first embodiment of the light-emitting substrate provided in this application;

[0043] Figure 10 yes Figure 9 A schematic diagram of the structure corresponding to steps S100 to S300;

[0044] Figure 11 This is a flowchart illustrating the second embodiment of the light-emitting substrate provided in this application;

[0045] Figure 12 yes Figure 11 A schematic diagram of the structure corresponding to step S400 in the middle section;

[0046] Figure 13 This is a top view of an embodiment of the mask provided in this application;

[0047] Figure 14 This is a top view schematic diagram of an embodiment of the photomask and light-emitting device provided in this application;

[0048] Figure 15 This is a schematic diagram of the structure of the mask and light-emitting device in the first embodiment provided in this application;

[0049] Figure 16 This is a schematic diagram of the structure of the mask and light-emitting device in the second embodiment provided in this application;

[0050] Figure 17 This is a schematic diagram of the structure of the mask and light-emitting device in the third embodiment provided in this application;

[0051] Figure 18This is a schematic diagram of the structure of the mask and light-emitting device in the fourth embodiment provided in this application;

[0052] Figure 19 This is a flowchart illustrating an embodiment of step S400 provided in this application;

[0053] Figure 20 yes Figure 19 A schematic diagram of the structure corresponding to steps S410 and S420.

[0054] Explanation of icon numbers:

[0055] 100, Light-emitting substrate; 10, Substrate; 20, Light-emitting device; 21, Light-emitting surface; 22, Side surface; 30, Isolation structure; 31, First end; 32, Second end; 33, Recess; 40, Encapsulation layer; 50, Driving layer; 60, Mask; 61, Blocking part; 610, Groove; 611, First groove; 612, Second groove; 62, Hollowed-out part; 63, Connecting part; 631, Annular body; 632, Branch; h1, First height; h2, Second height; h3, Third height; H, Height; L, Distance; φ, Emission angle; 70, Light-emitting particle; 200, Display device. Detailed Implementation

[0056] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0057] In the following description, specific details such as particular system architectures, interfaces, and technologies are presented for illustrative purposes rather than for limiting purposes, in order to provide a thorough understanding of this application.

[0058] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0059] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0060] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0061] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of the first embodiment of the light-emitting substrate provided in this application. Figure 2 yes Figure 1 A magnified structural diagram of point A in the middle.

[0062] This application provides a light-emitting substrate 100. The light-emitting substrate 100 includes a substrate 10, a plurality of light-emitting devices 20, an isolation structure 30, and an encapsulation layer 40. The isolation structure 30 is disposed on the side 22 of the light-emitting device 20 to block the light emitted laterally by the light-emitting device 20. The isolation structure 30 has a first end 31 and a second end 32 on the side away from the substrate 10, and a recess 33 is formed between the first end 31 and the second end 32. The first end 31 has a first height h1 relative to the substrate 10, the second end 32 has a second height h2 relative to the substrate 10, and the light-emitting device 20 has a third height h3 relative to the substrate 10. The third height h3 is less than the first height h1 and greater than the second height h2. The encapsulation layer 40 covers the light-emitting device 20 and the isolation structure 30.

[0063] In this embodiment, the isolation structure 30 is positioned above the light-emitting device 20 and on the side 22 of the light-emitting device 20. This helps to block the light emitted laterally by the light-emitting device 20, avoid light interference between the light-emitting devices 20, and reduce the degree of halo. Furthermore, a recess 33 is formed between the first end 31 and the second end 32 of the isolation structure 30 on the side away from the substrate 10, so that the contact surface between the isolation structure 30 and the encapsulation layer 40 is not a single plane, thereby forming a barrier area on the side 22 of the light-emitting device 20, which in turn helps to improve the waterproof and vapor-proof capability of the encapsulation layer 40.

[0064] The substrate 10 can be a PCB (Printed Circuit Board) or a glass substrate. There are no restrictions on the material and manufacturing process of the substrate 10; it can be selected according to actual needs.

[0065] The light-emitting device 20 includes an inorganic light-emitting diode (LED).

[0066] Specifically, the light-emitting device 20 is a Mini LED (mini light-emitting diode).

[0067] The light-emitting device 20 has a light-emitting surface 21, which faces away from the substrate 10.

[0068] There are no restrictions on the arrangement of the light-emitting devices 20 on the substrate 10; the arrangement can be selected according to actual needs.

[0069] In this embodiment, the light-emitting devices 20 are arranged in an array.

[0070] The isolation structure 30 is disposed on the side 22 of the light-emitting device 20. It can be understood that the light-emitting device 20 is disposed around the light-emitting device 20, so that multiple isolation structures 30 are arranged around the light-emitting device 20 to block the light emitted by the light-emitting device 20 to the side, thereby avoiding light interference between the light-emitting devices 20.

[0071] The entire isolation structure 30 is a one-piece molded structure, that is, the first end 31 and the second end 32 of the isolation structure 30 are one-piece molded structures. In other words, the first end 31 and the second end 32 do not need to be completed in multiple steps, which can simplify the manufacturing process.

[0072] The third height h3 is less than the first height h1, so that the first end 31 is set higher than the light-emitting device 20 to reduce the degree of halo. The third height h3 is greater than the second height h2, so as to avoid the isolation structure 30 covering the light-emitting surface 21 of the light-emitting device 20 during the fabrication of the isolation structure 30.

[0073] In other words, the second height h2 is smaller than the first height h1, so that a recess 33 can be formed between the first end 31 and the second end 32, thereby forming a barrier area around the light-emitting device 20, which helps to prevent moisture from directly entering the light-emitting device 20 along the interface between the encapsulation layer 40 and the isolation structure 30.

[0074] The specific values ​​for the first height h1, the second height h2, and the third height h3 are not restricted here; they can be selected according to actual needs.

[0075] Based on the height H of the first end 31 relative to the light-emitting device 20, and the distance L from the center of the light-emitting device 20 to the first end 31, and using trigonometric relationships, the emission angle φ of the light from the light-emitting device 20 can be determined, i.e., tanφ = L / H. In other words, the emission angle φ of the light-emitting device can be adjusted according to this formula.

[0076] Please see Figures 1 to 6 , Figure 3 This is a schematic diagram of the structure of the second embodiment of the light-emitting substrate provided in this application. Figure 4 This is a schematic diagram of the structure of the third embodiment of the light-emitting substrate provided in this application. Figure 5 This is a schematic diagram of the structure of the fourth embodiment of the light-emitting substrate provided in this application. Figure 6 This is a schematic diagram of the structure of the fifth embodiment of the light-emitting substrate provided in this application.

[0077] Furthermore, in the plane direction perpendicular to the substrate 10, the cross-section of the recess 33 is rectangular, V-shaped, or U-shaped.

[0078] Specifically, the sides of the first end 31 and the second end 32 that are close to each other can be in contact or spaced apart.

[0079] When the first end 31 and the second end 32 are spaced apart and close to each other, the cross-section of the recess 33 is rectangular in the plane direction perpendicular to the substrate 10 (see...). Figure 1 ) or U-shaped (see Figure 3 and Figure 4 The U-shape can be a regular or irregular shape.

[0080] When the first end 31 and the second end 32 are in close side contact, the cross-section of the recess 33 is V-shaped in the plane direction perpendicular to the substrate 10 (see...). Figure 5 and Figure 6 ).

[0081] It should be understood that the cross-section of the recess 33 in the plane direction perpendicular to the substrate 10 may also be other shapes.

[0082] Furthermore, in the isolation structure 30, the second end 32 is disposed on the side of the first end 31 that is close to the light-emitting device 20, and the second end 32 is in contact with the side surface of the adjacent light-emitting device 20 that is close to each other.

[0083] In other words, placing the second end 32 on the side of the first end 31 close to the light-emitting device 20 helps prevent moisture from directly entering the light-emitting device 20 along the interface between the encapsulation layer 40 and the isolation structure 30, which could cause the light-emitting device 20 to fail.

[0084] The isolation structure 30 includes a light-absorbing material for absorbing light emitted laterally by the light-emitting device 20 to avoid light interference between the light-emitting devices 20.

[0085] The light-absorbing material can be ink or other black materials. There are no restrictions on the light-absorbing material here; it can be selected according to actual needs.

[0086] In this embodiment, the light-absorbing material is ink.

[0087] The encapsulation layer 40 is a transparent structure, which allows the encapsulation layer 40 to protect the entire light-emitting device 20 without attenuating the light emitted directly from the light-emitting device 20.

[0088] There are no restrictions on the material of the encapsulation layer 40 here; it can be selected according to actual needs.

[0089] Please see Figure 7 and Figure 8 , Figure 7 This is a schematic diagram of the structure of the sixth embodiment of the light-emitting substrate provided in this application. Figure 8 yes Figure 7 A magnified structural diagram at point B in the middle.

[0090] In some embodiments, the isolation structure 30 further includes light-reflecting particles 70; and / or, the isolation structure 30 further includes drying particles.

[0091] When the isolation structure 30 also includes light-reflecting particles 70, the light-reflecting particles 70 can reflect light emitted laterally from the light-emitting device 20 into light emitted directly towards the light-emitting device 20 in a viewing direction. That is, the light-reflecting particles 70 can, to a certain extent, convert wide-angle light into light emitted from a visible angle, thereby improving the utilization rate of the light emitted by the light-emitting device 20. The light-reflecting particles 70 have a spherical structure to better reflect light emitted laterally from the light-emitting device 20 into light emitted directly towards the light-emitting device 20 in a viewing direction. Figure 8As shown in the reflected light path, the wide-angle light (the light emitted by the light-emitting device 20 to the side) generally exits from the visible angle (the viewing angle of the light-emitting device 20) after being reflected by the interface after hitting the upper half of the light-reflecting particle 70. However, the light that hits the lower half of the light-reflecting particle 70 can no longer exit from the isolation structure 30 and is absorbed after one or more reflections.

[0092] When the isolation structure 30 also includes dry particles, it can improve the water vapor resistance of the light-emitting substrate 100 and better prevent the light-emitting device 20 from failing.

[0093] The light-emitting substrate 100 also includes a driving layer 50, which is used to drive the light-emitting device 20 to emit light. The driving layer 50 is disposed between the substrate 10 and the light-emitting device 20.

[0094] In this embodiment, the isolation structure 30 is disposed on the side of the driving layer 50 away from the substrate 10, and the amount of reflective layer is reduced, which can save costs.

[0095] This application provides a display device 200. The display device 200 includes the light-emitting substrate 100 described in the above embodiments.

[0096] In some embodiments, the display device 200 further includes a liquid crystal display panel, and the light-emitting substrate 100 is used to provide a backlight to the liquid crystal display panel.

[0097] In other embodiments, the display device 200 is a self-emissive display device. For example, the display device 200 is an LED display device.

[0098] This application provides a method for preparing a light-emitting substrate 100, which is used to prepare the light-emitting substrate 100 in the above embodiments.

[0099] Please see Figure 1 , Figure 9 and Figure 10 , Figure 9 This is a flowchart illustrating the first embodiment of the light-emitting substrate provided in this application. Figure 10 yes Figure 9 A schematic diagram of the structure corresponding to steps S100 to S300.

[0100] In some embodiments, the specific steps of the method for preparing the light-emitting substrate 100 are as follows:

[0101] S100: Multiple light-emitting devices are formed at intervals on one side of the substrate.

[0102] Specifically, a plurality of light-emitting devices 20 are formed at intervals on one side of the substrate 10.

[0103] A substrate 10 is provided, and driving lines are formed on the substrate 10 to form a driving layer 50. The light-emitting device 20 is transferred to the substrate 10, and the driving layer 50 is electrically connected to the light-emitting device 20.

[0104] The fabrication methods of the substrate 10, the driving layer 50, and the light-emitting device 20, as well as the transfer method of the light-emitting device 20, are not limited here and can be selected according to actual needs.

[0105] S200: An isolation structure is formed on the side of the light-emitting device to block the light emitted laterally by the light-emitting device; wherein, the side of the isolation structure away from the substrate has a first end and a second end, and a recess is formed between the first end and the second end; the first end has a first height relative to the substrate, the second end has a second height relative to the substrate, and the light-emitting device has a third height relative to the substrate; the third height is less than the first height and greater than the second height.

[0106] Specifically, an isolation structure 30 is formed on the side 22 of the light-emitting device 20 to block the light emitted laterally by the light-emitting device 20. The isolation structure 30 has a first end 31 and a second end 32 on the side away from the substrate 10, with a recess 33 formed between the first end 31 and the second end 32. The first end 31 has a first height h1 relative to the substrate 10, the second end 32 has a second height h2 relative to the substrate 10, and the light-emitting device 20 has a third height h3 relative to the substrate 10. The third height h3 is less than the first height h1 and greater than the second height h2.

[0107] Under the premise of protecting the light-emitting surface 21 of the light-emitting device 20, the isolation structure 30 can be prepared by deposition, screen printing, inkjet printing or other methods to avoid the isolation structure 30 blocking the light-emitting surface 21 and affecting the light emission effect.

[0108] S300: Encapsulation layer is formed by sealing the light-emitting device and the isolation structure.

[0109] Specifically, the light-emitting device 20 and the isolation structure 30 are encapsulated to form an encapsulation layer 40.

[0110] An encapsulation layer 40 is prepared on the side of the light-emitting device 20 away from the substrate 10, and the encapsulation layer 40 covers the light-emitting device 20 and the isolation structure 30.

[0111] Please see Figure 1 , Figures 11 to 18 , Figure 11 This is a flowchart illustrating the second embodiment of the light-emitting substrate provided in this application. Figure 12 yes Figure 11 A schematic diagram of the structure corresponding to step S400. Figure 13 This is a top view schematic diagram of an embodiment of the mask provided in this application. Figure 14This is a top view schematic diagram of an embodiment of the photomask and light-emitting device provided in this application. Figure 15 This is a schematic diagram of the structure of the mask and light-emitting device in the first embodiment provided in this application. Figure 16 This is a schematic diagram of the structure of the mask and light-emitting device in the second embodiment provided in this application. Figure 17 This is a schematic diagram of the structure of the mask and light-emitting device in the third embodiment provided in this application. Figure 18 This is a schematic diagram of the structure of the fourth embodiment of the mask and light-emitting device provided in this application.

[0112] In one embodiment, a further step is included between step S100 and step S200:

[0113] S400: A mask is provided on the light-emitting surface of the light-emitting device; the mask includes a cutout portion and a blocking portion located on the side of the cutout portion, and a groove is provided on the side of the blocking portion near the light-emitting device. The groove includes a first groove and a second groove that are interconnected, and the second groove is disposed on the bottom wall of the first groove; wherein, the bottom wall of the first groove is in contact with the light-emitting surface, and the side wall of the first groove is in partial contact with the side of the light-emitting device.

[0114] Specifically, a mask 60 is provided on the light-emitting surface 21 of the light-emitting device 20. The mask 60 includes a cutout portion 62 and a blocking portion 61 located on the side of the cutout portion 62. A groove 610 is formed on the side of the blocking portion 61 near the light-emitting device 20. The groove 610 includes a first groove 611 and a second groove 612 that are interconnected. The second groove 612 is disposed on the bottom wall of the first groove 611. The bottom wall of the first groove 611 is in contact with the light-emitting surface 21, and the side wall of the first groove 611 is in partial contact with the side edge 22 of the light-emitting device 20.

[0115] The mask plate 60 has a shielding portion 61 that corresponds to the light-emitting device 20. The shielding portion 61 covers the light-emitting device 20, and the projected area of ​​the shielding portion 61 on the substrate 10 is larger than the projected area of ​​the light-emitting device 20 on the substrate 10.

[0116] The mask plate 60 also includes a connecting portion 63, which is used to connect adjacent blocking portions 61. The structure of the connecting portion 63 is not limited here and can be selected according to actual needs. The blocking portions 61 are connected by the connecting portion 63 so that the area corresponding to the side of the light-emitting device 20 can be set with the cutout portion 62, allowing the isolation structure 30 to be set on the side of the light-emitting device 20 through the cutout portion 62, thereby preventing adjacent light-emitting devices 20 from directly communicating and avoiding light crosstalk.

[0117] In this embodiment, the connecting portion 63 includes an annular body 631 and a branch 632 disposed on the outside of the annular body 631. The annular body 631 is connected to the shielding portion 61 through the branch 632.

[0118] A shielding portion 61 is disposed over the light-emitting surface 21 of the light-emitting device 20, such that the bottom wall of the second groove 612 is in contact with the light-emitting surface 21. The thickness of the shielding portion 61 is less than the thickness of the light-emitting device 20, such that the side wall of the second groove 612 is in partial contact with the side edge 22 of the light-emitting device 20, rather than in contact with the entire surface of the side edge 22 of the light-emitting device 20. This design, where the bottom wall of the first groove 611 is in contact with the light-emitting surface 21 and the side wall of the first groove 611 is in partial contact with the side edge 22 of the light-emitting device 20, prevents the material used to fabricate the isolation structure 30 from contacting the light-emitting surface 21 of the light-emitting device 20 during subsequent fabrication, thus preventing attenuation of the light emitted directly from the light-emitting device 20.

[0119] The shielding part 61 is provided in a one-to-one correspondence with the first groove 611, and the first groove 611 is provided in a one-to-one correspondence with the second groove 612.

[0120] In this embodiment, the isolation structure 30 is fabricated using screen printing. A mask 60 serves as the screen printing plate. The material for fabricating the isolation structure 30 is filled into the side 22 of the light-emitting device 20 through the cutout portion 62 of the mask 60. In the direction perpendicular to the substrate 10, the cross-section of the blocking portion 61 is rectangular, and the cross-sections of the first groove 611 and the second groove 612 are both rectangular. The sidewall of the first groove 611 is planar.

[0121] In other embodiments, the cross-section of the shielding portion 61 may be trapezoidal in the direction perpendicular to the substrate 10 (see...). Figure 15 and Figure 17 ) or other graphics (see Figure 18 The cross-section of the first groove 611 can be trapezoidal (see...). Figure 16 and Figure 17 ) or other shapes. The sidewall of the first groove 611 can be curved (see Figure 18 ).

[0122] Please see Figure 1 , Figure 19 and Figure 20 , Figure 19 This is a flowchart illustrating an embodiment of step S400 provided in this application. Figure 20 yes Figure 19 A schematic diagram of the structure corresponding to steps S410 and S420.

[0123] In one embodiment, the mask 60 comprises an elastic material. The mask 60 includes an initial state and a deformed state. In the initial state, the mask 60 includes a first groove 611. In the deformed state, the mask 60 further includes a second groove 612. Step S300: The step of setting the mask 60 on the light-emitting surface 21 of the light-emitting device 20 specifically includes:

[0124] S410: An initial state mask is set on the light-emitting surface of the light-emitting device, and the bottom wall of the first groove is set in contact with the light-emitting surface, and there is a gap between the side wall of the first groove and the light-emitting device.

[0125] Specifically, a mask plate 60 in its initial state is set on the light-emitting surface 21 of the light-emitting device 20, and the bottom wall of the first groove 611 is made to contact the light-emitting surface 21, and there is a gap between the side wall of the first groove 611 and the light-emitting device 20.

[0126] In the initial state, the groove 610 in the mask 60 includes only the first groove 611, excluding the second groove 612. The orthographic projection area of ​​the first groove 611 on the substrate 10 is larger than the orthographic projection area of ​​the light-emitting device 20 on the substrate 10, and the bottom wall of the second groove 612 covers the light-emitting surface 21 of the light-emitting device 20. A gap is provided between the sidewall of the first groove 611 and the light-emitting device 20 so that, during the subsequent fabrication of the isolation structure 30, the surface of the isolation structure 30 away from the substrate 10 is not a single plane.

[0127] S420: Apply a force to transform the mask plate from its initial state to a deformed state and form a second groove.

[0128] Specifically, a force is applied to deform the mask plate 60 in its initial state into a deformed state, forming a second groove 612.

[0129] A force is applied to the substrate 10 and / or the mask 60, causing the mask 60 in its initial state to elastically deform in a direction perpendicular to the substrate 10. At this point, the initial deformation of the mask 60 transforms into a deformed state, forming a second groove 612 on the bottom wall of the first groove 611. This second groove 612 covers the end of the light-emitting device 20 away from the substrate 10. Specifically, the bottom wall of the second groove 612 contacts the light-emitting surface 21 of the light-emitting device 20, and the sidewall of the second groove 612 partially contacts the side edge 22 of the light-emitting device 20.

[0130] Setting the mask 60 as an elastic structure not only allows the light-emitting device 20 to be in close contact with the mask 60, preventing the material for fabricating the isolation structure 30 from contacting the light-emitting surface 21 of the light-emitting device 20 through the gap at the interface between the mask 60 and the light-emitting device 20, thus affecting the light-emitting effect of the light-emitting device 20; it also helps to make the surface of the isolation structure 30 away from the substrate 10 non-single plane, which can better improve the water vapor resistance of the light-emitting substrate 100; secondly, compared with setting the second groove 612 by etching or other methods, it can also simplify the fabrication process.

[0131] The material for preparing the isolation structure 30 is filled into the side 22 of the light-emitting device 20 through the cutout portion 62 of the mask plate 60 and cured to form the isolation structure 30. The curing method can be high temperature or ultraviolet irradiation, etc.

[0132] The surface of the first end 31 of the isolation structure 30, on the side away from the substrate 10, is lower than the surface of the mask 60 on the side away from the substrate 10, but higher than the surface of the light-emitting device 20 on the side away from the substrate 10; or the surface of the first end 31 of the isolation structure 30, on the side away from the substrate 10, is flush with the surface of the mask 60 on the side away from the substrate 10. This design avoids the isolation structure 30 from obstructing the mask 60, thus facilitating the removal of the mask 60; secondly, it also allows the first end 31 to be higher than the light-emitting device 20, preventing light interference between the light-emitting devices 20.

[0133] In this embodiment, the surface of the first end 31 of the isolation structure 30 away from the substrate 10 is flush with the surface of the mask plate 60 away from the substrate 10.

[0134] In another embodiment, the mask 60 may not be an elastic structure. That is, the mask 60 includes a first groove 611 and a second groove 612, and the second groove 612 of the mask 60 is directly covered on the light-emitting surface 21 of the light-emitting device 20.

[0135] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0136] The above are merely embodiments of this application and do not limit the scope of patent protection of this application. Any equivalent structural or procedural changes made using the content of this application’s specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A light-emitting substrate, characterized by, The application relates to a light-emitting substrate, comprising: a substrate; a plurality of light-emitting devices arranged at intervals on one side of the substrate; an isolation structure arranged on the side of the light-emitting devices to shield light emitted laterally by the light-emitting devices; and an encapsulation layer covering the light-emitting devices and the isolation structure; wherein the side of the isolation structure away from the substrate has a first end portion and a second end portion, and a recess is formed between the first end portion and the second end portion; the first end portion has a first height relative to the substrate, the second end portion has a second height relative to the substrate, and the light-emitting devices have a third height relative to the substrate; the third height is smaller than the first height and greater than the second height; in the isolation structure, the second end portion is two, and the second end portion is arranged on the side of the first end portion close to the light-emitting devices and is in surface contact with the side surface of the adjacent light-emitting devices close to each other; and the isolation structure comprises light-absorbing material. In the direction perpendicular to the plane of the substrate, the cross section of the recess is rectangular, V-shaped or U-shaped.

3. The light-emitting substrate according to claim 1, wherein the isolation structure further comprises light-reflecting particles; and / or the isolation structure further comprises dry particles. The light-emitting devices comprise inorganic light-emitting diodes. The application further relates to a light-emitting substrate comprising any one of the light-emitting substrates according to claims 1 to 4. The application relates to a method for manufacturing a light-emitting substrate, comprising: step one: forming a plurality of light-emitting devices arranged at intervals on one side of a substrate; step two: forming an isolation structure on the side of the light-emitting devices to shield light emitted laterally by the light-emitting devices; wherein the side of the isolation structure away from the substrate has a first end portion and a second end portion, and a recess is formed between the first end portion and the second end portion; the first end portion has a first height relative to the substrate, the second end portion has a second height relative to the substrate, and the light-emitting devices have a third height relative to the substrate; the third height is smaller than the first height and greater than the second height; in the isolation structure, the second end portion is two, and the second end portion is arranged on the side of the first end portion close to the light-emitting devices and is in surface contact with the side surface of the adjacent light-emitting devices close to each other; and the isolation structure comprises light-absorbing material; and step three: performing encapsulation treatment on the light-emitting devices and the isolation structure to form an encapsulation layer. Between the step one and the step two, the method further comprises: arranging a mask plate on the light-emitting surface of the light-emitting devices; the mask plate comprises a hollow portion and a shielding portion located on the side of the hollow portion, the shielding portion is provided with a groove close to the side of the light-emitting devices, and the groove comprises a first groove and a second groove in communication with each other, and the second groove is arranged on the bottom wall of the first groove; wherein the bottom wall of the first groove is in contact with the light-emitting surface, and the side wall of the first groove is in contact with part of the side of the light-emitting devices. The mask plate comprises an elastic material; the mask plate comprises an initial state and a deformed state; in the initial state, the mask plate comprises the first groove; in the deformed state, the mask plate further comprises the second groove. ​ ​ 2. The light emitting substrate of claim 1, wherein, ​ ​ ​ ​ ​ 4. The light emitting substrate of claim 1, wherein, ​ 5. A display device, characterized by comprising: ​ 6. A method for manufacturing a light-emitting substrate, for manufacturing the light-emitting substrate according to any one of claims 1 to 4, characterized by, ​ ​ ​ ​ 7. The method for preparing a light-emitting substrate according to claim 6, characterized in that, ​ ​ 8. The method of claim 7, wherein the light-emitting substrate is prepared by a method comprising: forming a first electrode layer on a substrate; forming a light-emitting layer on the first electrode layer; and forming a second electrode layer on the light-emitting layer. ​ ​ ​ The mask plate is arranged on the light emitting surface of the light emitting device, and the mask plate comprises: An initial state of the mask plate is arranged on the light emitting surface of the light emitting device, and the bottom wall of the first groove is arranged in contact with the light emitting surface, and the side wall of the first groove has a gap with the light emitting device; An acting force is applied to deform the initial state of the mask plate into a deformed state, and the second groove is formed.

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