Electronic device

Abstract

The invention provides electronic equipment. The electronic equipment comprises a frame body, a loudspeaker module, a dustproof net and a sealing assembly, a containing cavity is defined by the frame body, and a sound outlet channel is arranged on the frame body. The loudspeaker module is arranged in the accommodating cavity. The dustproof net is arranged between the loudspeaker module and the sound outlet channel, and the dustproof net is connected with one of the frame body and the loudspeaker module through a sealing assembly. Wherein the sealing assembly comprises a silica gel pad and a supporting piece, the supporting piece comprises a fitting part and a limiting part, the fitting part is connected between the silica gel pad and the dustproof net, one of the silica gel pad and the dustproof net is connected with the frame body, and the other of the silica gel pad and the dustproof net is connected with the loudspeaker module. The limiting part is connected to at least one side of the fitting part along the thickness direction of the frame body, and abuts against one of the loudspeaker module and the frame body.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] With the rapid development of smart terminals, the functions and design forms of terminals are becoming more and more complex, and their design forms are developing towards being lighter, thinner and smaller.

[0003] When the terminal is made thinner as a whole, the thickness of its speaker module or frame is also reduced, which causes the sealing component arranged between the speaker module and the frame to slip easily during the assembly process, which is not conducive to the dust and water resistance of the speaker module. Summary of the invention

[0004] In view of the above problems, the present application provides an electronic device, which is beneficial to improving the dustproof and waterproof performance of the speaker module, thereby helping to improve the reliability of the electronic device.

[0005] In the first aspect, an embodiment of the present application proposes an electronic device, comprising: a frame, the frame enclosing a accommodating cavity, and a sound outlet channel being arranged on the frame; a speaker module, arranged in the accommodating cavity; a dustproof net, arranged between the speaker module and the sound outlet channel, the dustproof net being connected to the frame and one of the speaker module through a sealing component; wherein the sealing component comprises a silicone pad and a support member, the support member comprises a fitting portion and a limiting portion, the fitting portion is connected between the silicone pad and the dustproof net, one of the silicone pad and the dustproof net is connected to the frame, and the other is connected to the speaker module; the limiting portion is connected to at least one side of the fitting portion along the thickness direction of the frame, and abuts against the speaker module and one of the frame.

[0006] In an embodiment of the present application, a dustproof net is arranged between a sound outlet channel of a frame and a speaker module to prevent foreign particles from affecting the speaker module. The dustproof net is connected to one of the frame and the speaker module through a sealing component. The sealing component includes a silicone pad and a support member connected to each other. The support member includes a fitting portion and a limiting portion. The fitting portion is connected between the silicone pad and the dustproof net. One of the silicone pad and the dustproof net is connected to the frame, and the other is connected to the speaker module. By connecting the limiting portion to at least one side of the fitting portion along the thickness direction and abutting against one of the frame and the speaker module, the limiting portion and the speaker module or the frame can abut against each other in the thickness direction to improve the connection strength between the sealing component as a whole and the speaker module or the frame, thereby limiting the displacement of the sealing component as a whole during the assembly process, improving the problem of poor dustproof and waterproof performance of the speaker module caused by poor sealing due to slippage of the sealing component, and helping to improve the dustproof and waterproof performance of the speaker module, thereby helping to improve the reliability of the electronic device.

[0007] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0009] Figure 1 is a partial cross-sectional view of an electronic device according to an embodiment of the present application;

[0010] Figure 2 is a partial structural diagram of an electronic device according to an embodiment of the present application;

[0011] Figure 3 is a partial cross-sectional view of an electronic device according to another embodiment of the present application;

[0012] Figure 4 is a partial structural schematic diagram of an electronic device according to another embodiment of the present application;

[0013] Figure 5 is a partial cross-sectional view of an electronic device according to another embodiment of the present application;

[0014] Figure 6 It is a partial structural diagram of an electronic device according to another embodiment of the present application.

[0015] in:

[0016] 10-frame; 111-accommodating cavity; 101-sound outlet channel; 102-second surface;

[0017] 20-speaker module; 202-first side;

[0018] 30-sealing assembly; 31-silicone pad; 32-supporting member; 321-fitting portion; 3211-connecting hole; 322-limiting portion; 302-accommodating space;

[0019] 40-positioning structure; 41-concave portion; 42-convex portion; 50-dustproof net;

[0020] X-thickness direction; Y-first direction; Z-second direction.

[0021] In the drawings, the same reference numerals are used for the same components. The drawings are not drawn to scale. DETAILED DESCRIPTION

[0022] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0023] The term "first" or "second" in the specification and claims of the present application may include one or more of the features explicitly or implicitly. In the description of the present invention, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0024] In the description of the present invention, it is necessary to understand that the terms "length", "thickness", "inside", "outside", "radial", "circumferential" and the like indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0025] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] With the rapid development of smart terminals, the functions and design forms of terminals are becoming more and more complex, and their design forms are developing in the direction of being thinner and smaller. When the terminal is made thinner, the thickness of its speaker module or frame is also reduced. The speaker module or frame does not have enough space to design a limiting structure to limit the sealing component set between them, which makes the sealing component easy to slip during the assembly process, which is not conducive to the dust and water resistance of the speaker module.

[0027] Based on the above technical problems, an embodiment of the present application provides an electronic device, which connects a limiting portion to at least one side of the fitting portion along the thickness direction and abuts against one of the frame and the speaker module, so that the limiting portion and the speaker module or the frame can abut against each other in the thickness direction, so as to improve the connection strength between the sealing component as a whole and the speaker module or the frame, thereby limiting the displacement of the sealing component as a whole during the assembly process, improving the problem of poor dustproof and waterproof performance of the speaker module caused by poor sealing due to slippage of the sealing component, and is beneficial to improving the dustproof and waterproof performance of the speaker module, thereby helping to improve the reliability of the electronic device.

[0028] Combine the following Figures 1 to 6 An electronic device provided according to an embodiment of the present application is described.

[0029] Please also read Figures 1 to 6 , an embodiment of the present application provides an electronic device, including a frame 10, a speaker module 20, a dustproof net 50 and a sealing assembly 30. The frame 10 encloses a receiving cavity 111, and a sound outlet channel 101 is provided on the frame 10. The speaker module 20 is arranged in the receiving cavity 111. The dustproof net 50 is arranged between the speaker module 20 and the sound outlet channel 101, and the dustproof net 50 is connected to one of the frame 10 and the speaker module 20 through the sealing assembly 30. Among them, the sealing assembly 30 includes a silicone pad 31 and a support member 32, and the support member 32 includes a fitting portion 321 and a limiting portion 322, and the fitting portion 321 is connected between the silicone pad 31 and the dustproof net 50, and one of the silicone pad 31 and the dustproof net 50 is connected to the frame 10, and the other is connected to the speaker module 20. The limiting portion 322 is connected to at least one side of the fitting portion 321 along the thickness direction X of the frame body 10 , and abuts against one of the speaker module 20 and the frame body 10 .

[0030] The electronic devices provided in the embodiments of the present application may include various electronic devices such as mobile phones, tablet computers, wearable smart devices, virtual reality devices, augmented reality devices, etc., and may also include electronic devices such as personal computers and servers. This embodiment does not impose any limitations on this.

[0031] In the embodiment of the present application, the thickness direction X of the frame 10 can be understood as the thickness direction of the electronic device; the first direction Y can be understood as the direction from one of the first surface 202 of the speaker module 20 and the second surface 102 of the wall portion 11 to the other, wherein the first surface 202 and the second surface 102 are arranged opposite to each other, and the sound outlet channel 101 passes through the second surface 102; the second direction Z can be understood as the extension direction of the sealing component 30 arranged between the speaker module 20 and the frame 10.

[0032] It is understandable that when the speaker module 20 is assembled with the frame 10 , the sealing assembly 30 is easily displaced along the second direction Z under the pressure provided by the speaker module 20 and the frame 10 .

[0033] The frame 10 has a certain strength. The frame 10 encloses a receiving cavity 111. The receiving cavity 111 is used to receive the speaker module 20 to protect the speaker module 20. The receiving cavity 111 can also be used to receive a screen, electronic devices, etc.

[0034] In some embodiments, the speaker module 20 further has a sound outlet hole 201 , and the sound outlet hole 201 is connected to the sound outlet channel 101 .

[0035] The sound outlet channel 101 is disposed in the frame 10 and is disposed opposite to the sound outlet hole 201 disposed in the speaker module 20. The dustproof net 50 is disposed between the speaker module 20 and the sound outlet channel 101 to prevent particles such as foreign matter from affecting the speaker module 20. Specifically, the dustproof net 50 is disposed between the sound outlet hole 201 and the sound outlet channel 101.

[0036] The dustproof net 50 is connected to one of the frame 10 and the speaker module 20 through the sealing component 30 to seal the sound outlet 201 and the sound outlet channel 101, so that the audio output by the speaker module 20 can be transmitted from the sound outlet 201 to the sound outlet channel 101, and then transmitted from the sound outlet channel 101.

[0037] Specifically, the dustproof net 50 is arranged between the frame 10 and the speaker module 20 and covers the sound outlet 201 to prevent particles such as foreign matter from entering the sound outlet 201 through the sound outlet channel 101 and entering the interior of the speaker module 20 through the sound outlet 201, which is beneficial to ensure the cleanliness of the speaker module 20 and improve the service life of the electronic device.

[0038] Optionally, the dustproof net 50 may include a mesh structure, which may include but is not limited to being made of plastic or non-woven fabric materials.

[0039] The sealing component 30 can surround the sound outlet hole 201 and the sound outlet channel 101 so that the two are sealed and connected, thereby preventing sound leakage from occurring during use of the electronic device and ensuring the broadcasting effect of the electronic device.

[0040] Optionally, the dustproof net 50 may be connected to the frame 10 via a sealing assembly 30 , and of course, may also be connected to the speaker module 20 via the sealing assembly 30 .

[0041] The sealing assembly 30 includes a silicone pad 31 and a support member 32 that are interconnected. The silicone pad 31 may include a sealing structure with a certain deformation ability, such as silicone, rubber, etc., so that the speaker module 20 and the frame 10 can be squeezed between the two during assembly to achieve a sealed fit; the support member 32 may include a limiting structure with a certain strength, such as a steel sheet, an aluminum sheet, etc., to connect the silicone pad 31 to the speaker module 20 or the frame 10 to limit the slippage of the silicone pad 31.

[0042] The support member 32 includes a fitting portion 321 and a limiting portion 322. The limiting portion 322 is connected to at least one side of the fitting portion 321 along the thickness direction X and abuts against the speaker module 20 and the frame 10. It can be understood that at least one side of the limiting portion 322 along the thickness direction X protrudes from the fitting portion 321, and the limiting portion 322 can abut against the speaker module 20 or the frame 10 along the thickness direction X.

[0043] Optionally, the fitting portion 321 and the limiting portion 322 are arranged to intersect each other, which can be understood as that the extending direction of the fitting portion 321 is different from the extending direction of the limiting portion 322 .

[0044] Before assembling the speaker module 20, the frame 10 and the dustproof net 50, the dustproof net 50 can be first connected to the speaker module 20, or first connected to the frame 10, or first connected to the sealing component 30, and the sealing component 30 can be first connected to the frame 10, or first connected to the speaker module 20.

[0045] Before assembling the electronic device provided in the embodiment of the present application, the dustproof net 50 and the sealing assembly 30 can be first set on the speaker module 20 and then assembled with the frame 10. Of course, the dustproof net 50 and the sealing assembly 30 can also be first set on the frame 10 and then assembled with the speaker module 20.

[0046] During the docking assembly of the speaker module 20 and the frame 10, the speaker module 20 and the frame 10 will generate pressure along the first direction Y. Under this pressure, the silicone pad 31 can fit tightly between the speaker module 20, one of the frame 10 and the dustproof net 50. During the continuous squeezing process of the speaker module 20 and the frame 10, the limiting portion 322 can abut against one of the speaker module 20 and the frame 10 to increase the connection strength between the sealing assembly 30 as a whole and the speaker module 20 or the frame 10, thereby limiting the possibility of displacement of the sealing assembly 30 as a whole.

[0047] In the electronic device provided by some embodiments of the present application, the limiting portion 322 is connected to at least one side of the fitting portion 321 along the thickness direction X, and is abutted against the frame 10 and the speaker module 20, so that the limiting portion 322 and the speaker module 20 or the frame 10 can abut against each other in the thickness direction X, so as to improve the connection strength between the sealing component 30 as a whole and the speaker module 20 or the frame 10, thereby limiting the displacement of the sealing component 30 as a whole during the assembly process, improving the problem of poor dustproof and waterproof performance of the speaker module 20 caused by poor sealing due to slippage of the sealing component 30, and helping to improve the dustproof and waterproof performance of the speaker module 20, thereby helping to improve the reliability of the electronic device.

[0048] Optionally, the sound outlet hole 201 is arranged to cover the sound outlet channel 101 , so that the audio emitted by the speaker module 20 can be smoothly transmitted from the sound outlet hole 201 to the sound outlet channel 101 and then transmitted from the sound outlet channel 101 .

[0049] Optionally, the shape of the sound outlet 201 may include but is not limited to any one of a square structure, a round structure, and a trapezoidal structure. Optionally, the number of the sound outlet 201 may be one, two, or more.

[0050] Optionally, the number of the sound output channels 101 can be set to one, two, or multiple. Exemplarily, the multiple sound output channels 101 can form a sound output hole array.

[0051] Optionally, the sound outlet channel 101 may include a hole that passes through the frame 10, and may also include a groove that is provided on the frame 10. The side of the groove opposite to the sound outlet hole 201 may be provided as a material body that can transmit sound, such as a mesh structure.

[0052] The sealing assembly 30 includes a silicone pad 31 and a support member 32, and is arranged between the frame 10, one of the speaker module 20 and the dustproof net 50. Specifically, the silicone pad 31 can be set as an annular structure. The silicone pad 31 is set between the frame 10 and the speaker module 20, and is set around the sound hole 201 and the sound outlet channel 101 to seal the sound hole 201 and the sound outlet channel 101.

[0053] Exemplarily, the connection between the fitting portion 321 and the dustproof net 50 may include an adhesive connection, the dustproof net 50 may be connected to the speaker module 20 by adhesive, and the silicone pad 31 may be interference fit with the frame 10 to achieve assembly of the speaker module 20 and the frame 10.

[0054] The silicone pad 31 and the fitting portion 321 are disposed between the speaker module 20 and the frame 10 , and the limiting portion 322 extends between the speaker module 20 and the frame 10 and abuts against the speaker module 20 or the frame 10 .

[0055] In some embodiments, the limiting portion 322 is connected to one side of the fitting portion 321 along the thickness direction X to be abutted against the speaker module 20 and one of the frame 10. This arrangement facilitates processing and manufacturing and helps reduce costs.

[0056] In other embodiments, the limiting portion 322 is connected to the fitting portion 321 and extends out of the silicone pad 31 on both sides along the thickness direction X to be abutted against the speaker module 20 and one of the frame 10. By setting in this way, the sealing component 30 can be better limited with the speaker module 20 or the frame 10 in the thickness direction X to limit the displacement of the sealing component 30 itself, so as to better improve the sealing effect.

[0057] As an example, Figure 1 As shown, the limiting portions 322 are connected to both sides of the fitting portion 321 along the thickness direction X and extend out of the silicone pad 31 to abut against the speaker module 20 .

[0058] In some embodiments, the silicone pad 31 is connected between the frame 10 and the speaker module 20 , and the fitting portion 321 is connected to a side of the silicone pad 31 along the second direction Z facing away from the sound outlet 201 .

[0059] In some other embodiments, the silicone pad 31 and the fitting portion 321 are connected between the frame 10 and the speaker module 20. The fitting portion 321 is connected to one side of the silicone pad 31 along the first direction Y.

[0060] According to one aspect of the embodiment of the present application, at least a portion of the limiting portion 322 along the thickness direction X is embedded in one of the speaker module 20 and the frame body 10 .

[0061] The limiting portion 322 may be embedded in the speaker module 20 to abut against the speaker module 20 . Of course, the limiting portion 322 may also be embedded in the frame 10 to abut against the frame 10 .

[0062] In some embodiments, the speaker module 20 may be provided with a first groove body.

[0063] Optionally, the first groove body can be formed by a side surface of the speaker module 20 in the thickness direction X being recessed inwardly, and at least a portion of the limiting portion 322 along the thickness direction X can be arranged in the first groove body to abut against the speaker module 20, making its structure with the speaker module 20 more compact, which is beneficial to improving the space utilization of the electronic device.

[0064] The depth of the first groove in the thickness direction X is greater than or equal to the thickness of the limiting portion 322 to prevent the limiting portion 322 from protruding from the surface of the speaker module 20 in the thickness direction X, thereby further improving the space utilization of the electronic device.

[0065] Optionally, the first groove body may also be formed by a side surface of the speaker module 20 along the first direction Y facing away from the frame body 10 being recessed toward the inside thereof.

[0066] In some other embodiments, a second groove body may be provided on the frame body 10 , and the second groove body is spaced apart from the sound outlet channel 101 .

[0067] Optionally, the second groove body can be formed by a side surface of the frame body 10 in the thickness direction X being recessed inwardly, and at least a portion of the limiting portion 322 along the thickness direction X can be arranged in the second groove body to abut against the frame body 10, making its structure with the frame body 10 more compact, thereby improving the space utilization of the electronic device.

[0068] The depth of the second groove in the thickness direction X is greater than or equal to the thickness of the limiting portion 322 to prevent the limiting portion 322 from protruding from the surface of the frame 10 in the thickness direction X, thereby further improving the space utilization of the electronic device.

[0069] Optionally, the second groove body may also be formed by a side surface of the frame body 10 along the first direction Y facing away from the speaker module 20 being recessed toward the inside thereof.

[0070] Please continue reading Figure 1 and Figure 6 According to one aspect of an embodiment of the present application, the fitting portion 321 and the limiting portion 322 enclose a receiving space 302 , and the speaker module 20 and one of the frame body 10 at least partially extends into the receiving space 302 and abuts against the limiting portion 322 .

[0071] A receiving space 302 can be formed between the fitting portion 321 and the limiting portion 322. One of the speaker module 20 and the frame body 10 at least partially extends into the receiving space 302 and abuts against the limiting portion 322. One of the speaker module 20 and the frame body 10 is connected to the dustproof net 50, and the other is connected to the silicone pad 31.

[0072] In some embodiments, the silicone pad 31 is connected to the side of the fitting portion 321 facing away from the accommodating space 302, that is, the silicone pad 31 is located outside the accommodating space 302. In this structure, one of the speaker module 20 and the frame 10 at least partially extends into the accommodating space 302 to abut against the limiting portion 322 and is connected to the dustproof net 50, and the other of the speaker module 20 and the frame 10 is connected to the silicone pad 31.

[0073] As an example, Figure 1 As shown, the dustproof net 50 is connected between the fitting portion 321 and the speaker module 20, the silicone pad 31 is connected to the side of the fitting portion 321 facing away from the accommodating space 302 and is connected to the frame 10, and at least part of the speaker module 20 extends into the accommodating space 302 to abut against the limiting portion 322 and is connected to the dustproof net 50.

[0074] In other embodiments, the silicone pad 31 is connected to the side of the fitting portion 321 facing the accommodating space 302, that is, the silicone pad 31 is located inside the accommodating space 302. In this structure, one of the speaker module 20 and the frame 10 at least partially extends into the accommodating space 302 to abut against the limiting portion 322 and is connected to the silicone pad 31, and the other of the speaker module 20 and the frame 10 is connected to the dustproof net 50.

[0075] According to one aspect of an embodiment of the present application, the fitting portion 321 and the silicone pad 31 are stacked along the first direction Y, and the limiting portion 322 is connected to the side of the fitting portion 321 facing away from the silicone pad 31 along the first direction Y, and the first direction Y intersects with the thickness direction X.

[0076] Exemplarily, the silicone pad 31 is connected to the frame 10 , the dustproof net 50 is connected to the speaker module 20 , and the limiting portion 322 is connected to a side of the fitting portion 321 facing away from the silicone pad 31 along the first direction Y and abuts against the speaker module 20 .

[0077] The silicone pad 31 may be disposed in contact with the frame 10 , specifically, may be interference fit, and the fitting portion 321 and the speaker module 20 may be bonded.

[0078] By stacking and connecting the fitting portion 321 and the silicone pad 31 along the first direction Y, the connection effect between the fitting portion 321 and the silicone pad 31 is improved, and the layout is reasonable, which is convenient for assembly.

[0079] In some optional embodiments, the fitting portion 321 and the limiting portion 322 are an integrated structure.

[0080] The electronic devices in some embodiments of the present application can improve processing efficiency and connection strength between the fitting portion 321 and the limiting portion 322 by configuring the fitting portion 321 and the limiting portion 322 as an integrally formed structure, thereby improving the reliability of the electronic devices.

[0081] The support member 32 can be manufactured by hydraulic forming, stamping forming, stretching forming or other process methods to include a fitting portion 321 and a limiting portion 322 that are intersectingly arranged.

[0082] Please continue reading Figures 3 to 6According to one aspect of an embodiment of the present application, at least one of the speaker module 20, the frame 10 and the fitting portion 321 includes a positioning structure 40. In a plane perpendicular to the second direction Z, the orthographic projection of the silicone pad 31 overlaps with the orthographic projection of the positioning structure 40, and the second direction Z intersects with the thickness direction X.

[0083] The positioning structure 40 can be arranged on the speaker module 20 , can also be arranged on the frame 10 , and can also be arranged on the fitting portion 321 . Of course, the positioning structure 40 can also be arranged on two or three of the speaker module 20 , the frame 10 and the fitting portion 321 .

[0084] When the silicone pad 31 is connected to the frame 10, the positioning structure 40 can be arranged on the side of the frame 10 along the first direction Y toward the speaker module 20, so that in a plane perpendicular to the second direction Z, the orthographic projection of the silicone pad 31 overlaps with the orthographic projection of the positioning structure 40.

[0085] Alternatively, when the silicone pad 31 is connected to the speaker module 20, the positioning structure 40 can be arranged on the side of the speaker module 20 toward the frame 10 along the first direction Y, so that in a plane perpendicular to the second direction Z, the orthographic projection of the silicone pad 31 overlaps with the orthographic projection of the positioning structure 40.

[0086] Alternatively, the positioning structure 40 can be disposed on the fitting portion 321 and protrude from the fitting portion 321 along the first direction Y, so that in a plane perpendicular to the second direction Z, the orthographic projection of the silicone pad 31 overlaps with the orthographic projection of the positioning structure 40 .

[0087] The electronic devices in some embodiments of the present application are provided with a positioning structure 40 to prevent the silicone pad 31 from being displaced along the second direction Z, so as to further limit the silicone pad 31, thereby helping to improve the dustproof and waterproof performance of the speaker module 20, thereby helping to improve the reliability of the electronic device.

[0088] In some optional embodiments, the speaker module 20 includes a first surface 202 disposed toward the frame body 10, and the positioning structure 40 includes a recess 41 that is recessed from the first surface 202 toward the interior of the speaker module 20; or, the frame body 10 includes a second surface 102, the sound outlet channel 101 is disposed through the second surface 102, the positioning structure 40 includes a recess 41 that is recessed from the second surface 102 toward the back of the speaker module 20, and at least a portion of the silicone pad 31 is disposed in the recess 41.

[0089] The sound outlet hole 201 is disposed through the first surface 202 .

[0090] When the silicone pad 31 is connected to the speaker module 20 , the positioning structure 40 can be disposed on the speaker module 20 .

[0091] Optionally, the positioning structure 40 can be configured as a recess 41 recessed from the first surface 202, and the silicone pad 31 is arranged in the recess 41 to abut against the speaker module 20. The side wall of the recess 41 along the second direction Z can limit the silicone pad 31 to prevent the silicone pad 31 from being displaced along the second direction Z.

[0092] In other embodiments, the positioning structure 40 may include a protrusion that starts from the first surface 202 and protrudes from the inside of the speaker module 20. The protrusion can be arranged on the side of the silicone pad 31 along the second direction Z facing the sound hole 201, and can also be arranged on the side of the silicone pad 31 along the second direction Z facing away from the sound hole 201. The silicone pad 31 can be provided with protrusions on both sides along the second direction Z. The silicone pad 31 abuts against the speaker module 20, and the protrusion can limit the silicone pad 31 along the second direction Z to prevent the silicone pad 31 from shifting along the second direction Z.

[0093] like Figure 3 and Figure 4 As shown, when the silicone pad 31 is connected to the frame 10 , the positioning structure 40 can be disposed on the frame 10 .

[0094] Optionally, the positioning structure 40 can be set as a recessed portion 41 recessed by the second surface 102, and the silicone pad 31 is set in the recessed portion 41 to abut against the frame 10. The side wall of the recessed portion 41 along the second direction Z can limit the silicone pad 31 to prevent the silicone pad 31 from shifting along the second direction Z.

[0095] In other embodiments, the positioning structure 40 may include a protrusion protruding from the second surface 102 toward the speaker module 20. The protrusion may be arranged on the side of the silicone pad 31 along the second direction Z toward the sound hole 201, and may also be arranged on the side of the silicone pad 31 along the second direction Z away from the sound hole 201. The silicone pad 31 may be provided with protrusions on both sides along the second direction Z. The silicone pad 31 abuts against the speaker module 20, and the protrusion can limit the silicone pad 31 along the second direction Z to prevent the silicone pad 31 from shifting along the second direction Z.

[0096] like Figure 5 As shown, in some optional embodiments, the positioning structure 40 includes a protrusion 42 connected to the fitting portion 321 , and at least a portion of the protrusion 42 is stacked with the silicone pad 31 along the second direction Z.

[0097] Specifically, the protrusion 42 protrudes toward the silicone pad 31 along the first direction Y, so that at least part of the protrusion 42 can be stacked with the silicone pad 31 along the second direction Z to limit the silicone pad 31 and prevent the silicone pad 31 from shifting along the second direction Z.

[0098] Optionally, a portion of the convex portion 42 is stacked with the silicone pad 31 along the second direction Z, and the entire convex portion 42 may also be stacked with the silicone pad 31 along the second direction Z.

[0099] Optionally, at least a portion of the protrusion 42 may be disposed in contact with the silicone pad 31 , or may be bonded to the silicone pad 31 .

[0100] like Figure 1 , Figure 5 and Figure 6 As shown, in some optional embodiments, the support member 32 has a connecting hole 3211 that is set through, the connecting hole 3211 is set between the speaker module 20 and the sound outlet channel 101, the protrusion 42 is connected to the fitting portion 321 and is set around the connecting hole 3211, and the silicone pad 31 is connected to the protrusion 42 and the fitting portion 321, and is set around the protrusion 42 and the connecting hole 3211.

[0101] Specifically, the connection hole 3211 is disposed between the sound outlet hole 201 and the sound outlet channel 101 .

[0102] The fitting portion 321 has a connecting hole 3211 extending through the first direction Y. The audio output by the speaker module 20 can be transmitted through the sound outlet hole 201 , the connecting hole 3211 , and the sound outlet channel 101 in sequence.

[0103] Optionally, the number of the connection holes 3211 can be one, two, or more. As an example, the number of the connection holes 3211 is two and they are spaced apart along the second direction Z.

[0104] The protrusion 42 may be connected to the fitting portion 321 around the connection hole 3211 .

[0105] Optionally, the fitting portion 321 on at least one side of the connecting hole 3211 along the second direction Z is connected with a protrusion 42, the silicone pad 31 is connected to the side of the fitting portion 321 along the first direction Y toward the fitting portion 321 and is connected to the fitting portion 321, the silicone pad 31 is arranged around the protrusion 42 and the connecting hole 3211, and the protrusion 42 is completely stacked with the silicone pad 31 along the second direction Z.

[0106] Optionally, the protrusion 42 can be set to a ring structure, the protrusion 42 is connected to the fitting portion 321 on the side of the connecting hole 3211, the silicone pad 31 is connected to the fitting portion 321 along the first direction Y toward the side of the fitting portion 321 and is connected to the fitting portion 321, the silicone pad 31 is arranged around the protrusion 42 and the connecting hole 3211, and part of the protrusion 42 is stacked with the silicone pad 31 along the second direction Z.

[0107] The limiting portion 322 may be connected to a side of the fitting portion 321 along the first direction Y facing away from the convex portion 42 , or may be connected to a side of the fitting portion 321 along the first direction Y facing the convex portion 42 .

[0108] In some optional embodiments, the protrusion 42 and the fitting portion 321 are an integral structure.

[0109] The electronic devices in some embodiments of the present application are configured with the protrusion 42 and the fitting portion 321 as an integrally formed structure, which helps to improve processing efficiency and the connection strength between the protrusion 42 and the fitting portion 321, thereby improving the reliability of the electronic device.

[0110] The convex portion 42 and the fitting portion 321 can be formed by hydraulic forming, stamping forming, stretching forming and other process methods.

[0111] In some optional embodiments, the protrusion 42, the fitting portion 321 and the limiting portion 322 are an integrated structure.

[0112] According to one aspect of the embodiment of the present application, the support member 32 includes at least one of a steel sheet and an aluminum sheet.

[0113] Both steel sheets and aluminum sheets can be deformed by pressure processing. By setting the support member 32 as one of the above structures, processing is facilitated and the thickness of the support member 32 is reduced, thereby improving the space utilization of the electronic equipment.

[0114] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. An electronic device, It is characterized in that include: A frame, the frame encloses a receiving cavity, and a sound outlet channel is provided on the frame; A speaker module is arranged in the accommodating cavity; A dustproof net is arranged between the speaker module and the sound outlet channel, and the dustproof net is connected to one of the frame and the speaker module through a sealing component; wherein, The sealing assembly includes a silicone pad and a support member, the support member includes a fitting portion and a limiting portion, the fitting portion is connected between the silicone pad and the dustproof net, one of the silicone pad and the dustproof net is connected to the frame, and the other is connected to the speaker module; The limiting portion is connected to at least one side of the fitting portion along the thickness direction of the frame body, and is in contact with one of the speaker module and the frame body.

2. The electronic device according to claim 1, It is characterized in that At least a portion of the limiting portion along the thickness direction is embedded in one of the speaker module and the frame.

3. The electronic device according to claim 1, It is characterized in that The fitting portion and the limiting portion enclose a receiving space, and one of the speaker module and the frame at least partially extends into the receiving space and abuts against the limiting portion.

4. The electronic device according to claim 1, It is characterized in that The fitting portion and the silicone pad are stacked along a first direction, the limiting portion is connected to a side of the fitting portion facing away from the silicone pad along the first direction, and the first direction intersects with the thickness direction.

5. The electronic device according to claim 1, It is characterized in that The fitting portion and the limiting portion are an integrated structure.

6. The electronic device according to any one of claims 1 to 5, It is characterized in that At least one of the speaker module, the frame and the fitting portion includes a positioning structure, and in a plane perpendicular to a second direction, an orthographic projection of the silicone pad overlaps with an orthographic projection of the positioning structure, and the second direction intersects with the thickness direction.

7. The electronic device according to claim 6, It is characterized in that The speaker module includes a first surface arranged toward the frame body, and the positioning structure includes a recessed portion starting from the first surface and recessed toward the interior of the speaker module. Alternatively, the frame body includes a second surface, the sound outlet channel is arranged through the second surface, and the positioning structure includes a recessed portion starting from the second surface and recessed away from the speaker module, and at least a portion of the silicone pad is arranged in the recessed portion.

8. The electronic device according to claim 6, It is characterized in that The positioning structure includes a convex portion connected to the fitting portion, and at least a portion of the convex portion is stacked with the silicone pad along the second direction.

9. The electronic device according to claim 8, It is characterized in that The support member has a connecting hole that is set through, and the connecting hole is set between the speaker module and the sound output channel. The protrusion is connected to the fitting portion and is set around the connecting hole. The silicone pad is connected to the protrusion and the fitting portion, and is set around the protrusion and the connecting hole.

10. The electronic device according to claim 8, It is characterized in that The convex portion and the fitting portion are an integrated structure.

11. The electronic device according to any one of claims 1 to 5, It is characterized in that The support member includes at least one of a steel sheet and an aluminum sheet.

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