A temperature control system and method for circuit board

Abstract

The present invention provides a temperature control system and method for a circuit board, belonging to the field of temperature control technology, comprising: a first determination module: obtaining the layout of a target circuit board, determining the type and structure of the target circuit board; a monitoring module: obtaining a temperature sensor according to the type and structure of the target circuit board, and monitoring the operating temperature of the target circuit board in real time; a control module: determining the measurement range of the temperature sensor, and controlling the temperature controller based on a PID controller; a second determination module: obtaining the load characteristics of the target circuit board, determining the temperature-related parameters and heat generation parameters of the target circuit board; an acquisition module: obtaining a heat dissipation strategy based on a temperature controller according to the temperature-related parameters and the heat generation parameters, and realizing temperature control of the target circuit board according to thermal management technology. The problem that the temperature control system cannot accurately control the temperature of each area of ​​the circuit board due to different temperatures in each area, resulting in overheating or overcooling of some areas, which affects the performance of the product is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature control, and in particular to a temperature control system and method for a circuit board. Background Art

[0002] With the widespread application of electronic devices in various fields, the stable operation and safety of their internal circuit boards have received more and more attention.

[0003] However, traditional circuit board temperature control systems require regular maintenance to ensure their normal operation, but this maintenance may affect the efficiency of the production line and waste manpower and time. At the same time, due to the different temperatures of various areas on the circuit board, traditional temperature control systems may not be able to accurately control the temperature of each area, causing some areas to overheat or overcool, resulting in damage to the circuit board and affecting the performance and life of the product.

[0004] Therefore, the present invention provides a temperature control system and method for a circuit board. Summary of the invention

[0005] The present invention provides a temperature control system and method for a circuit board, which is used to solve the problem in the prior art that regular maintenance is required, but such maintenance may affect the efficiency of the production line and waste manpower and time. At the same time, due to the different temperatures of various areas on the circuit board, the traditional temperature control system may not be able to accurately control the speed of each area, resulting in overheating or overcooling of certain areas, causing damage to the circuit board and affecting the performance and life of the product.

[0006] In one aspect, the present invention provides a temperature control system for a circuit board, comprising:

[0007] The first determination module: obtains the layout of the target circuit board, and determines the type and structure of the target circuit board according to the layout of the target circuit board;

[0008] Monitoring module: obtains the required type and quantity of temperature sensors according to the type and structure of the target circuit board, and monitors the operating temperature of the target circuit board in real time;

[0009] Control module: determining the measurement range and accuracy of the temperature sensor according to the type of the temperature sensor, and controlling the temperature controller based on the PID controller according to the measurement range and accuracy;

[0010] The second determination module: obtains the load characteristics of the target circuit board, and determines the temperature-related parameters and heat generation parameters of the target circuit board based on the load characteristics of the target circuit board and the operating temperature of the target circuit board;

[0011] Acquisition module: acquires the heat dissipation strategy based on the temperature controller according to the temperature-related parameters and the heat generation parameters, and implements temperature control of the target circuit board based on the heat dissipation strategy according to the thermal management technology.

[0012] According to a temperature control system for a circuit board provided by the present invention, a first determination module includes:

[0013] Generating unit: acquiring various information about the appearance and interior of the target circuit board, and generating a layout diagram of the target circuit board based on the automatic layout algorithm according to various information about the appearance and interior of the target circuit board;

[0014] Checking and adjusting unit: performing compliance check on the generated layout diagram of the target circuit board based on preset conditions and adjusting the layout diagram of the target circuit board;

[0015] A first determining unit determines the type and structure of the target circuit board based on the shape of the target circuit board according to the adjusted layout diagram of the target circuit board.

[0016] According to the present invention, a temperature control system for a circuit board, a monitoring module, includes:

[0017] A second determining unit: determining an application scenario of the target circuit board according to the type of the target circuit board, and determining a functional requirement of the target circuit board according to the application scenario;

[0018] A third determining unit: determining a physical size and layout restriction of a target circuit board according to a structure of the target circuit board;

[0019] A fourth determining unit: determining a corresponding temperature sensor according to the functional requirements, physical size and layout restrictions;

[0020] A first acquisition unit: acquires the physical positions and arrangement of multiple components of the target circuit board, and determines the key positions of the target circuit board according to the physical positions and arrangement;

[0021] Monitoring unit: Determine the type and quantity of temperature sensors at key locations according to the corresponding temperature sensors, and monitor the operating temperature of the circuit board in real time.

[0022] According to the present invention, a temperature control system for a circuit board, a control module, includes:

[0023] A fifth determining unit: determining a measuring range and accuracy of the temperature sensor based on a type of the temperature sensor and a technical specification of the temperature sensor;

[0024] Compensation unit: determines the characteristics of the temperature sensor according to the measurement range and accuracy of the temperature sensor, determines the non-ideal characteristics of the temperature sensor according to the characteristics of the temperature sensor, and compensates for the non-ideal characteristics of the temperature sensor according to the filtering and compensation mechanism;

[0025] The first control unit determines a PID controller according to the compensated temperature sensor characteristics, adjusts the parameters of the PID controller, controls the temperature controller according to the adjusted PID controller, and controls the operating temperature of the target circuit board according to the temperature controller.

[0026] According to a temperature control system for a circuit board provided by the present invention, the second determination module includes:

[0027] A sixth determining unit: obtaining power requirements and main components of the target circuit board, and determining different operating modes of the target circuit board according to the power requirements and main components;

[0028] A second acquisition unit: obtaining different power consumptions of the target circuit board in different working modes by applying an electronic load to the target circuit board, and determining the load characteristics of the target circuit board according to the different power consumptions;

[0029] Classification unit: classifies the load characteristics to obtain the magnitude and direction of the heat load generated by different types of loads;

[0030] The third acquisition unit: analyzes the operating temperature of the target circuit board and obtains the trend and law of temperature change;

[0031] A seventh determination unit: determines the temperature-related parameters and heat generation parameters of the target circuit board according to the magnitude and direction of the heat load based on the trend and law of temperature change.

[0032] According to a temperature control system for a circuit board provided by the present invention, a seventh determination unit includes:

[0033] The first determination subunit: determines the trend characteristics of the heat load according to the size and direction of the heat load, and infers the periodic characteristics and random characteristics of the heat load based on the trend characteristics;

[0034] Generating subunit: generating reference sample data of the heat load according to the periodic characteristics and random characteristics of the heat load, and generating a first development sequence matrix of the heat load according to the reference sample data;

[0035] The second determination subunit: determines the temperature rise inflection point sequence and the temperature drop inflection point sequence based on the trend and law of temperature change, and determines the second development sequence matrix of the heat load under the influence of temperature according to the temperature rise inflection point sequence and the temperature drop inflection point sequence combined with the linear relationship between heat load and temperature;

[0036] The third determining subunit is used to determine the matrix difference parameter between the first development sequence matrix and the second development sequence matrix, and determine the state balance order jump parameter of the heat load according to the matrix difference parameter;

[0037] The first acquisition subunit: acquires the operating temperature parameters of the target circuit board, and determines the heat load fluctuation variable under the operation of the target circuit board in combination with the state balance order jump parameters;

[0038] The fourth determination subunit: determines the temperature development characteristics and heat generation characteristics of the target circuit board through the heat load fluctuation variable and the thermal effect characteristics of the target circuit board;

[0039] A fifth determining subunit: determining a temperature variation and a heat variation based on a temperature development characteristic and a heat generation characteristic of a target circuit board and a temperature parameter and a heat generation parameter of the target circuit board under normal operation;

[0040] The sixth determination subunit determines the real-time temperature-related parameters and the real-time heat generation parameters of the circuit board according to the temperature change amount and the heat change amount as well as the working temperature state function of the circuit board and the preset temperature and heat-related state function.

[0041] According to a temperature control system for a circuit board provided by the present invention, an acquisition module includes:

[0042] A fourth acquisition unit: inputting the temperature-related parameters and the heat generation parameters into the temperature controller to obtain an optimal heat transfer strategy;

[0043] A fifth acquisition unit: acquiring the transfer efficiency and transfer rate of the optimal heat transfer strategy, and determining the heat generated by the target circuit board according to the transfer efficiency and transfer rate;

[0044] A sixth acquisition unit: acquiring a target range and safety requirements for temperature control of a target circuit board;

[0045] Evaluation unit: determining a heat dissipation strategy based on a target range and safety requirements according to the heat generated by the target circuit board, and evaluating the effectiveness of the heat dissipation strategy to obtain an evaluation result;

[0046] Second control unit: implements temperature control of the target circuit board based on thermal management technology according to the evaluation results.

[0047] A temperature control method for a circuit board provided by the present invention comprises:

[0048] Step 1: Obtain the layout of the target circuit board, and determine the type and structure of the target circuit board according to the layout of the target circuit board;

[0049] Step 2: Obtain the required type and quantity of temperature sensors according to the type and structure of the target circuit board, and monitor the operating temperature of the target circuit board in real time;

[0050] Step 3: Determine the measurement range and accuracy of the temperature sensor according to the type of the temperature sensor, and control the temperature controller based on the PID controller according to the measurement range and accuracy;

[0051] Step 4: Obtain the load characteristics of the target circuit board, and determine the temperature-related parameters and heat generation parameters of the target circuit board based on the load characteristics of the target circuit board and the operating temperature of the target circuit board;

[0052] Step 5: Obtain a heat dissipation strategy based on a temperature controller according to the temperature-related parameters and the heat generation parameters, and implement temperature control of the target circuit board based on the heat dissipation strategy according to thermal management technology.

[0053] Compared with the prior art, the present invention has the following beneficial effects:

[0054] The sensor is determined by the type and structure of the circuit board and monitors the working temperature of the circuit board in real time. The temperature controller is controlled based on the PID controller. The heat dissipation strategy is obtained based on the temperature controller according to the load characteristics of the circuit board. The temperature control system can be automated, does not require regular maintenance, does not affect the efficiency of the production line, saves manpower and time, and can accurately control the temperature of each area to avoid overheating or overcooling in certain areas, which may cause damage to the circuit board and affect the performance and life of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0056] Figure 1 is a schematic structural diagram of a temperature control system for a circuit board provided in an embodiment of the present invention;

[0057] Figure 2 It is a flow chart of a temperature control method for a circuit board provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0058] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0059] Embodiment 1:

[0060] An embodiment of the present invention provides a temperature control system for a circuit board, such as Figure 1 As shown, the system mainly includes the following modules:

[0061] The first determination module: obtains the layout of the target circuit board, and determines the type and structure of the target circuit board according to the layout of the target circuit board;

[0062] Monitoring module: obtains the required type and quantity of temperature sensors according to the type and structure of the target circuit board, and monitors the operating temperature of the target circuit board in real time;

[0063] Control module: determining the measurement range and accuracy of the temperature sensor according to the type of the temperature sensor, and controlling the temperature controller based on the PID controller according to the measurement range and accuracy;

[0064] The second determination module: obtains the load characteristics of the target circuit board, and determines the temperature-related parameters and heat generation parameters of the target circuit board based on the load characteristics of the target circuit board and the operating temperature of the target circuit board;

[0065] Acquisition module: acquires the heat dissipation strategy based on the temperature controller according to the temperature-related parameters and the heat generation parameters, and implements temperature control of the target circuit board based on the heat dissipation strategy according to the thermal management technology.

[0066] In this embodiment, the types of circuit boards include: single-sided board, double-sided board, multi-layer board and flexible board.

[0067] In this embodiment, the circuit board structure may be:

[0068] Single-layer boards: Made of copper foil, they usually have multiple layers of interconnects to achieve electrical connections between components.

[0069] Double-layer board: It is composed of two single-layer boards insulated from each other and interconnected by a wire layer.

[0070] Three-layer board: It is composed of more than two layers of single-layer boards, which can be single-sided or double-sided copper foil.

[0071] In this embodiment, the temperature sensor is a device for detecting the ambient temperature, such as a thermistor sensor or a thermocouple sensor.

[0072] In this embodiment, the load characteristics of the circuit board refer to the maximum current and voltage that the circuit board can withstand.

[0073] In this embodiment, the temperature-related parameters of the circuit board include: ambient temperature, operating temperature range, load temperature, heat dissipation conditions, and thermal resistance value.

[0074] In this embodiment, the heat generation parameters of the circuit board include: power density, load density, current density, and inductance density.

[0075] In this embodiment, the heat dissipation strategy refers to a series of measures taken to reduce the heat generated by the electronic product during operation and prevent overheating damage, such as natural convection heat dissipation and forced fan heat dissipation.

[0076] In this embodiment, thermal management technology refers to a technology that reduces heat generation of electronic equipment or systems by designing and applying different technologies and materials, and quickly transfers heat from the surface or inside of the device in various ways to prevent the device from overheating, such as: conduction heat dissipation, convection heat dissipation, radiation heat dissipation, and phase change heat dissipation.

[0077] The beneficial effects of the above technical solution are: determining the sensor through the type and structure of the circuit board and monitoring the working temperature of the circuit board in real time, controlling the temperature controller based on the PID controller, obtaining the heat dissipation strategy based on the temperature controller according to the load characteristics of the circuit board, and being able to realize the automation of the temperature control system. Regular maintenance is not required, and the efficiency of the production line is not affected, saving manpower and time. At the same time, the temperature of each area can be accurately controlled to avoid overheating or overcooling in certain areas, which may cause damage to the circuit board and affect the performance and life of the product.

[0078] Embodiment 2:

[0079] Based on Example 1, the first determination module in this embodiment of the present invention includes:

[0080] Generating unit: acquiring various information about the appearance and interior of the target circuit board, and generating a layout diagram of the target circuit board based on the automatic layout algorithm according to various information about the appearance and interior of the target circuit board;

[0081] Checking and adjusting unit: performing compliance check on the generated layout diagram of the target circuit board based on preset conditions and adjusting the layout diagram of the target circuit board;

[0082] A first determining unit determines the type and structure of the target circuit board based on the shape of the target circuit board according to the adjusted layout diagram of the target circuit board.

[0083] In this embodiment, the various information includes: size, number of pins, socket type, shape, installation method, electrical specifications and connector type of the circuit board.

[0084] In this embodiment, the automatic layout algorithm is a process for automatically completing the circuit board layout design, such as a heuristic algorithm and a mesh structure-based algorithm.

[0085] In this embodiment, the preset conditions may be: hole size, socket position, or a suitable number of solder joints.

[0086] In this embodiment, the adjustment may be:

[0087] Whether the size and position of circuit components are correct;

[0088] Confirm that the connector is in the correct position and orientation;

[0089] Check the integrity of the board, i.e. whether there are any missing elements;

[0090] Ensure that the electrical performance of the circuit board meets the requirements.

[0091] In this embodiment, the shape of the circuit board means: if the circuit board is rectangular, it may be a single-layer board or a double-layer board; if the circuit board is a cuboid, it may be a single-sided printed board or a double-sided printed board.

[0092] The beneficial effects of the above technical solution are: a layout diagram of the circuit board is generated based on various information of the circuit board, and adjustments are made based on preset conditions to determine the type and structure of the circuit board, which can better determine the space and physical limitations of the circuit board. By using appropriate layout and routing strategies, the reliability and performance of the circuit board can be improved.

[0093] Embodiment 3:

[0094] Based on Example 2, the monitoring module of the embodiment of the present invention includes:

[0095] A second determining unit: determining an application scenario of the target circuit board according to the type of the target circuit board, and determining a functional requirement of the target circuit board according to the application scenario;

[0096] A third determining unit: determining a physical size and layout restriction of a target circuit board according to a structure of the target circuit board;

[0097] A fourth determining unit: determining a corresponding temperature sensor according to the functional requirements, physical size and layout restrictions;

[0098] A first acquisition unit: acquires the physical positions and arrangement of multiple components of the target circuit board, and determines the key positions of the target circuit board according to the physical positions and arrangement;

[0099] Monitoring unit: Determine the type and quantity of temperature sensors at key locations according to the corresponding temperature sensors, and monitor the operating temperature of the circuit board in real time.

[0100] In this embodiment, the types of circuit boards include: single-sided board, double-sided board, multi-layer board and flexible board.

[0101] In this embodiment, the application scenarios of the circuit board may be: consumer electronic products, household appliances, and industrial control equipment.

[0102] In this embodiment, the functional requirements of the circuit board include: providing installation space for electronic components, connecting various electronic components together to form a complete circuit loop, realizing specific electrical functions, isolating, filtering, amplifying input / output signals, etc.

[0103] In this embodiment, the physical size of the circuit board refers to its length, width and height, for example:

[0104] Single-sided board: Single-sided board sizes range from 8.5 inches to 30 inches, and the length and width can be any size.

[0105] Double-sided boards: The size of double-sided boards is also 8.5 inches to 30 inches, but unlike single-sided boards, double-sided boards have conductor lines printed on both sides, which can achieve double-sided welding and routing.

[0106] Multilayer board: A multilayer board is a circuit board with three or more layers. Its size is usually determined by the size of the outermost layer, which can be 48 inches x 24 inches or 60 inches x 40 inches.

[0107] In this embodiment, the circuit board layout constraints can be: the power and ground layers need to be connected to all other components, the conductive paths of these layers should be as short as possible, and should avoid overlapping with the paths of other layers. At the same time, the potential difference between the power layer and the ground layer should be minimized to reduce electromagnetic interference.

[0108] The beneficial effects of the above technical solution are: determining the corresponding sensor according to the functional requirements, physical size and layout limitations of the circuit board can ensure the accuracy of the acquired data. At the same time, determining the key position according to the physical position and arrangement of the circuit board components, and monitoring the working temperature of the circuit board in real time can timely detect overheating of the circuit board or other abnormal conditions, thereby improving the performance and reliability of the circuit board.

[0109] Embodiment 4:

[0110] Based on the third embodiment, the control module of the embodiment of the present invention includes:

[0111] A fifth determining unit: determining a measuring range and accuracy of the temperature sensor based on a type of the temperature sensor and a technical specification of the temperature sensor;

[0112] Compensation unit: determines the characteristics of the temperature sensor according to the measurement range and accuracy of the temperature sensor, determines the non-ideal characteristics of the temperature sensor according to the characteristics of the temperature sensor, and compensates for the non-ideal characteristics of the temperature sensor according to the filtering and compensation mechanism;

[0113] The first control unit determines a PID controller according to the compensated temperature sensor characteristics, adjusts the parameters of the PID controller, controls the temperature controller according to the adjusted PID controller, and controls the operating temperature of the target circuit board according to the temperature controller.

[0114] In this embodiment, the temperature sensor is a device for detecting and measuring temperature, including: a contact temperature sensor, a non-contact temperature sensor, and an integrated temperature sensor.

[0115] In this embodiment, the sensor technical specification is a document that describes the sensor product characteristics in detail, including: the sensor's functions, performance, electrical indicators, physical dimensions, and interface standards.

[0116] In this embodiment, the characteristics of the sensor include: sensitivity, selectivity, and linear response.

[0117] In this embodiment, the non-ideal characteristics of the sensor include: spontaneous error, temperature drift, and sensitivity drift.

[0118] In this embodiment, the PID controller compares the difference (deviation) between the expected output and the actual output and adjusts the input signal according to a predetermined weight factor so that the output signal is as close to the expected output signal as possible.

[0119] In this embodiment, the PID controller has three main parameters, namely: proportion (P), integral (I) and differential (D).

[0120] In this embodiment, the circuit board temperature controller includes: a cooling fan controller, a temperature sensor, a heat sink controller, a power supply temperature controller, and an ambient temperature controller.

[0121] The beneficial effects of the above technical solution are: determining the characteristics and non-ideal characteristics of the sensor and compensating for them through the measurement range and accuracy of the sensor, determining the PID controller and adjusting the parameters, being able to maintain a stable control effect, making the control system more precise and efficient, thereby improving the efficiency and effect of the entire control process.

[0122] Embodiment 5:

[0123] Based on Example 4, the second determination module in this embodiment of the present invention includes:

[0124] A sixth determining unit: obtaining power requirements and main components of the target circuit board, and determining different operating modes of the target circuit board according to the power requirements and main components;

[0125] A second acquisition unit: obtaining different power consumptions of the target circuit board in different working modes by applying an electronic load to the target circuit board, and determining the load characteristics of the target circuit board according to the different power consumptions;

[0126] Classification unit: classifies the load characteristics to obtain the magnitude and direction of the heat load generated by different types of loads;

[0127] The third acquisition unit: analyzes the operating temperature of the target circuit board and obtains the trend and law of temperature change;

[0128] A seventh determination unit: determines the temperature-related parameters and heat generation parameters of the target circuit board according to the magnitude and direction of the heat load based on the trend and law of temperature change.

[0129] In this embodiment, the power requirement of the circuit board refers to parameters such as power type, voltage, current, and power required when designing the circuit board.

[0130] In this embodiment, the main components of the circuit board include: resistors, capacitors, inductors, diodes, batteries, power adapters, and voltage regulators.

[0131] In this embodiment, the working mode of the circuit board refers to the functions performed by the circuit board in different states, including: normal working mode, standby working mode, and fault protection mode.

[0132] In this embodiment, the electronic load is a device used to simulate real load current and voltage, and its main function is to provide a stable load during circuit testing to measure the performance and stability of a circuit board or device.

[0133] In this embodiment, power consumption refers to the energy consumed by the circuit board during operation.

[0134] In this embodiment, the load characteristics of the circuit board refer to the maximum current and voltage that the circuit board can withstand.

[0135] In this embodiment, the load characteristic classification includes: linear load characteristic and constant impedance load characteristic.

[0136] In this embodiment, the heat load refers to the amount of heat that passes through a specific area within a certain period of time.

[0137] In this embodiment, the heat load direction refers to the direction of heat flow in a component or the entire circuit, for example:

[0138] Conduction heat load direction: The conduction heat load direction refers to the direction of heat load transferred from the surface of the component to the inside.

[0139] Radiant heat load direction: The radiant heat load direction refers to the direction of heat load transferred from the surface of the component to the outside.

[0140] Combined heat load direction of conduction and radiation: The combined heat load direction of conduction and radiation refers to the direction of heat flow inside the component.

[0141] In this embodiment, the temperature-related parameters of the circuit board include: ambient temperature, operating temperature range, load temperature, heat dissipation conditions, and thermal resistance value.

[0142] In this embodiment, the heat generation parameters of the circuit board include: power density, load density, current density, and inductance density.

[0143] The beneficial effects of the above technical solution are: obtaining the different power consumption and load characteristics of the target circuit board under different working modes according to the electronic load, and classifying and obtaining the size and direction of the heat load generated by different types of loads, so that the controller and the heat dissipation device can better adapt to the load characteristics and effectively control the flow and distribution of heat. At the same time, combining the changing trend of the working temperature of the circuit board to determine multiple parameters of the circuit board can more effectively understand the circuit board and improve the working performance of the circuit board.

[0144] Embodiment 6:

[0145] Based on the fifth embodiment, the seventh determining unit in the embodiment of the present invention includes:

[0146] The first determination subunit: determines the trend characteristics of the heat load according to the size and direction of the heat load, and infers the periodic characteristics and random characteristics of the heat load based on the trend characteristics;

[0147] Generating subunit: generating reference sample data of the heat load according to the periodic characteristics and random characteristics of the heat load, and generating a first development sequence matrix of the heat load according to the reference sample data;

[0148] The second determination subunit: determines the temperature rise inflection point sequence and the temperature drop inflection point sequence based on the trend and law of temperature change, and determines the second development sequence matrix of the heat load under the influence of temperature according to the temperature rise inflection point sequence and the temperature drop inflection point sequence combined with the linear relationship between heat load and temperature;

[0149] The third determining subunit is used to determine the matrix difference parameter between the first development sequence matrix and the second development sequence matrix, and determine the state balance order jump parameter of the heat load according to the matrix difference parameter;

[0150] The first acquisition subunit: acquires the operating temperature parameters of the target circuit board, and determines the heat load fluctuation variable under the operation of the target circuit board in combination with the state balance order jump parameters;

[0151] The fourth determination subunit: determines the temperature development characteristics and heat generation characteristics of the target circuit board through the heat load fluctuation variable and the thermal effect characteristics of the target circuit board;

[0152] A fifth determining subunit: determining a temperature variation and a heat variation based on a temperature development characteristic and a heat generation characteristic of a target circuit board and a temperature parameter and a heat generation parameter of the target circuit board under normal operation;

[0153] The sixth determination subunit determines the real-time temperature-related parameters and the real-time heat generation parameters of the circuit board according to the temperature change amount and the heat change amount as well as the working temperature state function of the circuit board and the preset temperature and heat-related state function.

[0154] In this embodiment, the trend characteristic of the heat load refers to the law of the heat load changing with time within a certain period of time.

[0155] In this embodiment, the periodic characteristics of the heat load refer to the law of the heat load changing with the seasons over the four seasons of the year or a longer time scale.

[0156] In this embodiment, the random characteristic of the heat load means that in a specific environment, the change of the heat generated by the circuit board is uncertain and random.

[0157] In this embodiment, the benchmark sample data of the heat load refers to a series of data related to the operation of the circuit board collected under specific conditions.

[0158] In this embodiment, the development sequence matrix is ​​a mathematical tool used to describe and predict the relationship between different variables. It is a two-dimensional table consisting of a series of variables, each variable corresponds to a row in the matrix, and the relationship between these variables is represented by the numerical values ​​between them.

[0159] In this embodiment, the temperature inflection point sequence refers to a phenomenon in which, in a thermodynamic process, when a circuit board is subjected to external heating, its temperature rises to a specific point, and then the temperature no longer increases despite continued heating.

[0160] In this embodiment, the temperature reduction inflection point sequence refers to a phenomenon in which, in a certain process, when a circuit board is subjected to external cooling or slowing force, its temperature drops to a certain level and then begins to show a trend of temperature increase, but the rate of increase is slower than before.

[0161] In this embodiment, under the heat load state, the state balance stage means that the heat input and heat output of the circuit board reach a balance state, and the thermal variables of the circuit board no longer change.

[0162] In this embodiment, the heat load fluctuation variable is an indicator that describes the degree of heat load fluctuation, and reflects the magnitude of the heat load change process. The heat load fluctuation variable can be used to evaluate the thermal stability and adaptability of the circuit board.

[0163] In this embodiment, the thermal effect characteristics of the circuit board include: heat conduction, heat convection, and heat radiation.

[0164] In this embodiment, the temperature development characteristics of the circuit board include: uneven temperature distribution and temperature changes over time.

[0165] In this embodiment, the heat generation characteristics of the circuit board include: load characteristics, ambient temperature, and material characteristics.

[0166] In this embodiment, the operating temperature state function of the circuit board is an indicator for evaluating whether the circuit board can work normally at different temperatures. The operating temperature state function of the circuit board can be divided into two types: a state function within the design temperature range and a limit temperature state function.

[0167] In this embodiment, the heat-related state function refers to a state function that describes the internal heat distribution and energy conversion process of the circuit board at different temperatures.

[0168] The beneficial effect of the above technical solution is: the real-time temperature-related parameters and real-time heat generation parameters of the circuit board are determined according to the temperature change and heat change as well as the working temperature state function of the circuit board and the preset temperature and heat-related state function, so as to realize accurate monitoring and management of the operating status of the circuit board and improve the stability and reliability of the circuit board.

[0169] Embodiment 7:

[0170] Based on Example 6, the acquisition module of the embodiment of the present invention includes:

[0171] A fourth acquisition unit: inputting the temperature-related parameters and the heat generation parameters into the temperature controller to obtain an optimal heat transfer strategy;

[0172] A fifth acquisition unit: acquiring the transfer efficiency and transfer rate of the optimal heat transfer strategy, and determining the heat generated by the target circuit board according to the transfer efficiency and transfer rate;

[0173] A sixth acquisition unit: acquiring a target range and safety requirements for temperature control of a target circuit board;

[0174] Evaluation unit: determining a heat dissipation strategy based on a target range and safety requirements according to the heat generated by the target circuit board, and evaluating the effectiveness of the heat dissipation strategy to obtain an evaluation result;

[0175] Second control unit: implements temperature control of the target circuit board based on thermal management technology according to the evaluation results.

[0176] In this embodiment, the heat transfer strategy is a method used to reduce heat generation and prevent it from causing damage to the device.

[0177] In this embodiment, the transfer efficiency of the heat transfer strategy refers to the proportion of heat lost when the heat is transferred from the heat source to the heat sink.

[0178] In this embodiment, the transfer rate of the heat transfer strategy refers to the heat flow rate of heat transferred in a certain manner within a unit time.

[0179] In this embodiment, the target range should take into account the normal operating temperature, safety and reliability of the circuit board, and is usually -5°C to +70°C.

[0180] In this embodiment, thermal management technology refers to a technology that reduces heat generation of electronic equipment or systems by designing and applying different technologies and materials, and quickly transfers heat from the surface or inside of the device in various ways to prevent the device from overheating, such as: conduction heat dissipation, convection heat dissipation, radiation heat dissipation, and phase change heat dissipation.

[0181] The beneficial effects of the above technical solution are: obtaining the transfer efficiency and transfer rate of the optimal heat transfer strategy, determining the heat generated by the circuit board, and determining the heat dissipation and heating strategy in combination with the target range and safety requirements of the temperature control of the circuit board, which can effectively control the temperature of the circuit board, avoid damage to different areas of the circuit board due to overheating or overcooling, and improve the service life of the circuit board.

[0182] Embodiment 8:

[0183] Based on Example 7, the present invention provides a temperature control method for a circuit board, such as Figure 2 As shown, including:

[0184] Step 1: Obtain the layout of the target circuit board, and determine the type and structure of the target circuit board according to the layout of the target circuit board;

[0185] Step 2: Obtain the required type and quantity of temperature sensors according to the type and structure of the target circuit board, and monitor the operating temperature of the target circuit board in real time;

[0186] Step 3: Determine the measurement range and accuracy of the temperature sensor according to the type of the temperature sensor, and control the temperature controller based on the PID controller according to the measurement range and accuracy;

[0187] Step 4: Obtain the load characteristics of the target circuit board, and determine the temperature-related parameters and heat generation parameters of the target circuit board based on the load characteristics of the target circuit board and the operating temperature of the target circuit board;

[0188] Step 5: Obtain a heat dissipation strategy based on a temperature controller according to the temperature-related parameters and the heat generation parameters, and implement temperature control of the target circuit board based on the heat dissipation strategy according to thermal management technology.

[0189] The beneficial effects of the above technical solution are: determining the sensor through the type and structure of the circuit board and monitoring the working temperature of the circuit board in real time, controlling the temperature controller based on the PID controller, obtaining the heat dissipation strategy based on the temperature controller according to the load characteristics of the circuit board, and being able to realize the automation of the temperature control system. Regular maintenance is not required, and the efficiency of the production line is not affected, saving manpower and time. At the same time, the temperature of each area can be accurately controlled to avoid overheating or overcooling in certain areas, which may cause damage to the circuit board and affect the performance and life of the product.

[0190] Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform, and of course, can also be implemented by hardware. Based on this understanding, the above technical solution is essentially or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0191] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A temperature control system for a circuit board, characterized in that: include: The first determination module: obtains the layout of the target circuit board, and determines the type and structure of the target circuit board according to the layout of the target circuit board; Monitoring module: obtains the required type and quantity of temperature sensors according to the type and structure of the target circuit board, and monitors the operating temperature of the target circuit board in real time; Control module: determining the measurement range and accuracy of the temperature sensor according to the type of the temperature sensor, and controlling the temperature controller based on the PID controller according to the measurement range and accuracy; The second determination module: obtains the load characteristics of the target circuit board, and determines the temperature-related parameters and heat generation parameters of the target circuit board based on the load characteristics of the target circuit board and the operating temperature of the target circuit board; Acquisition module: acquiring a heat dissipation strategy based on a temperature controller according to the temperature-related parameters and the heat generation parameters, and realizing temperature control of a target circuit board based on the heat dissipation strategy according to thermal management technology; The acquisition module includes: A fourth acquisition unit: inputting the temperature-related parameters and the heat generation parameters into the temperature controller to obtain an optimal heat transfer strategy; A fifth acquisition unit: acquiring the transfer efficiency and transfer rate of the optimal heat transfer strategy, and determining the heat generated by the target circuit board according to the transfer efficiency and transfer rate; A sixth acquisition unit: acquiring a target range and safety requirements for temperature control of a target circuit board; Evaluation unit: determining a heat dissipation strategy based on a target range and safety requirements according to the heat generated by the target circuit board, and evaluating the effectiveness of the heat dissipation strategy to obtain an evaluation result; Second control unit: implements temperature control of the target circuit board based on thermal management technology according to the evaluation results.

2. The temperature control system for a circuit board according to claim 1, characterized in that: The first determination module includes: Generating unit: acquiring various information about the appearance and interior of the target circuit board, and generating a layout diagram of the target circuit board based on the automatic layout algorithm according to various information about the appearance and interior of the target circuit board; Checking and adjusting unit: performing compliance check on the generated layout diagram of the target circuit board based on preset conditions and adjusting the layout diagram of the target circuit board; A first determining unit determines the type and structure of the target circuit board based on the shape of the target circuit board according to the adjusted layout diagram of the target circuit board.

3. The temperature control system for a circuit board according to claim 1, characterized in that: Monitoring modules, including: A second determining unit: determining an application scenario of the target circuit board according to the type of the target circuit board, and determining a functional requirement of the target circuit board according to the application scenario; A third determining unit: determining a physical size and layout restriction of a target circuit board according to a structure of the target circuit board; A fourth determining unit: determining a corresponding temperature sensor according to the functional requirements, physical size and layout restrictions; A first acquisition unit: acquires the physical positions and arrangement of multiple components of the target circuit board, and determines the key positions of the target circuit board according to the physical positions and arrangement; Monitoring unit: Determine the type and quantity of temperature sensors at key locations according to the corresponding temperature sensors, and monitor the operating temperature of the circuit board in real time.

4. The temperature control system for a circuit board according to claim 1, characterized in that: Control module, including: A fifth determining unit: determining a measuring range and accuracy of the temperature sensor based on a type of the temperature sensor and a technical specification of the temperature sensor; Compensation unit: determines the characteristics of the temperature sensor according to the measurement range and accuracy of the temperature sensor, determines the non-ideal characteristics of the temperature sensor according to the characteristics of the temperature sensor, and compensates for the non-ideal characteristics of the temperature sensor according to the filtering and compensation mechanism; The first control unit determines a PID controller according to the compensated temperature sensor characteristics, adjusts the parameters of the PID controller, controls the temperature controller according to the adjusted PID controller, and controls the operating temperature of the target circuit board according to the temperature controller.

5. The temperature control system for a circuit board according to claim 1, characterized in that: The second determination module includes: A sixth determination unit: obtaining power requirements and main components of the target circuit board, and determining different working modes of the target circuit board according to the power requirements and the main components, wherein the main components include: resistors, capacitors, inductors, diodes, batteries, power adapters, and voltage regulators; A second acquisition unit: obtaining different power consumptions of the target circuit board in different working modes by applying an electronic load to the target circuit board, and determining the load characteristics of the target circuit board according to the different power consumptions; Classification unit: classifies the load characteristics to obtain the magnitude and direction of the heat load generated by different types of loads; The third acquisition unit: analyzes the operating temperature of the target circuit board and obtains the trend and law of temperature change; A seventh determination unit: determines the temperature-related parameters and heat generation parameters of the target circuit board according to the magnitude and direction of the heat load based on the trend and law of temperature change.

6. The temperature control system for a circuit board according to claim 5, characterized in that: The seventh determination unit includes: The first determination subunit: determines the trend characteristics of the heat load according to the size and direction of the heat load, and infers the periodic characteristics and random characteristics of the heat load based on the trend characteristics; Generating subunit: generating reference sample data of the heat load according to the periodic characteristics and random characteristics of the heat load, and generating a first development sequence matrix of the heat load according to the reference sample data; The second determination subunit: determines the temperature rise inflection point sequence and the temperature drop inflection point sequence based on the trend and law of temperature change, and determines the second development sequence matrix of the heat load under the influence of temperature according to the temperature rise inflection point sequence and the temperature drop inflection point sequence combined with the linear relationship between heat load and temperature; The third determining subunit is used to determine the matrix difference parameter between the first development sequence matrix and the second development sequence matrix, and determine the state balance order jump parameter of the heat load according to the matrix difference parameter; The first acquisition subunit: acquires the operating temperature parameters of the target circuit board, and determines the heat load fluctuation variable under the operation of the target circuit board in combination with the state balance order jump parameters; The fourth determination subunit: determines the temperature development characteristics and heat generation characteristics of the target circuit board through the heat load fluctuation variable and the thermal effect characteristics of the target circuit board; A fifth determining subunit: determining a temperature variation and a heat variation based on a temperature development characteristic and a heat generation characteristic of a target circuit board and a temperature parameter and a heat generation parameter of the target circuit board under normal operation; The sixth determination subunit determines the real-time temperature-related parameters and the real-time heat generation parameters of the circuit board according to the temperature change amount and the heat change amount as well as the working temperature state function of the circuit board and the preset temperature and heat-related state function.

7. A temperature control method for a circuit board, characterized in that: include: Step 1: Obtain the layout of the target circuit board, and determine the type and structure of the target circuit board according to the layout of the target circuit board; Step 2: Obtain the required type and quantity of temperature sensors according to the type and structure of the target circuit board, and monitor the operating temperature of the target circuit board in real time; Step 3: Determine the measurement range and accuracy of the temperature sensor according to the type of the temperature sensor, and control the temperature controller based on the PID controller according to the measurement range and accuracy; Step 4: Obtain the load characteristics of the target circuit board, and determine the temperature-related parameters and heat generation parameters of the target circuit board based on the load characteristics of the target circuit board and the operating temperature of the target circuit board; Step 5: obtaining a heat dissipation strategy based on a temperature controller according to the temperature-related parameters and the heat generation parameters, and implementing temperature control of the target circuit board based on the heat dissipation strategy according to thermal management technology; Wherein, step 5 comprises: Inputting the temperature-related parameters and heat generation parameters into a temperature controller to obtain an optimal heat transfer strategy; Acquire the transfer efficiency and transfer rate of the optimal heat transfer strategy, and determine the heat generated by the target circuit board according to the transfer efficiency and transfer rate; Obtain the target range and safety requirements for temperature control of the target circuit board; Determining a heat dissipation strategy based on a target range and safety requirements according to the heat generated by the target circuit board, and evaluating the effectiveness of the heat dissipation strategy to obtain an evaluation result; Based on the evaluation results, the temperature of the target circuit board is controlled based on thermal management technology.

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