Manufacturing method of a highly integrated half-hole stepped circuit board and the half-hole stepped circuit board

Abstract

The present invention provides a manufacturing method of a highly integrated half-hole stepped circuit board and the half-hole stepped circuit board, belonging to the technical field of circuit board manufacturing, and solving the problems of low production efficiency and poor product performance and quality of the half-hole stepped circuit board. The method includes: providing a first substrate and a second substrate; performing a first pretreatment on the first substrate to obtain a first substrate to be laminated; performing a second pretreatment on the second substrate to obtain a second substrate to be laminated; performing a lamination and copper deposition treatment on the first substrate to be laminated and the second substrate to be laminated to obtain a substrate after lamination and copper deposition; performing an electroplating and etching treatment on the substrate after lamination and copper deposition to obtain a substrate after electroplating and etching treatment; performing a shaping treatment on the substrate after electroplating and etching treatment to obtain a highly integrated half-hole stepped circuit board. This solution realizes the efficient production and manufacturing of the half-hole stepped circuit board by first manufacturing the circuit board in layers and then performing lamination and shaping treatments, improving the product performance and quality.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board manufacturing, and particularly to a manufacturing method for a highly integrated half-hole stepped circuit board and a half-hole stepped circuit board. Background Art

[0002] With the development of miniaturization and diversification of electronic products, new communication modules require the use of high-frequency and high-speed printed circuit boards, and traditional printed circuit boards can no longer meet the requirements of high-frequency and high-speed. With the development of high-frequency microwave technology, the functional requirements for high-frequency microwave printed boards are also increasing. To meet the fixation and installation miniaturization of some special functional devices or mounting parts, the overall device height needs to be reduced after assembly. The constraints of space and safety make the traditional planar design unable to meet the needs of many circuit boards in the electronic field. Therefore, circuit boards with a stepped groove structure have gradually been widely used. On the one hand, the stepped groove structure can make the most of the space inside the circuit board and provide technical support for the diversification development of electronic products; on the other hand, when customers solder electronic components, some components need to be stacked or avoid other components to ensure the safety of electrical components. Therefore, the superiority of the stepped groove structure is more prominent. Currently, in the production process of stepped boards in the printed circuit industry, processes similar to those for rigid-flexible combination, such as opening windows in non-flowing glue prepregs, routing blind vias, and uncovering covers, are usually used to achieve it. However, when it comes to manufacturing special structures like half-hole steps, the current manufacturing methods cannot be realized. Summary of the Invention

[0003] The present invention provides a manufacturing method for a highly integrated half-hole stepped circuit board and a half-hole stepped circuit board, which solves the problems of low production efficiency and poor product performance and quality of half-hole stepped circuit boards.

[0004] To solve the above technical problems, the technical solution of the present invention is as follows:

[0005] An embodiment of the present invention provides a manufacturing method for a highly integrated half-hole stepped circuit board, including:

[0006] Providing a first substrate and a second substrate;

[0007] Performing a first pretreatment on the first substrate to obtain a first substrate to be laminated;

[0008] Performing a second pretreatment on the second substrate to obtain a second substrate to be laminated;

[0009] Performing a lamination and copper deposition treatment on the first substrate to be laminated and the second substrate to be laminated to obtain a substrate after lamination and copper deposition;

[0010] Performing an electroplating and etching treatment on the substrate after lamination and copper deposition to obtain a substrate after electroplating and etching treatment;

[0011] The substrate after electroplating and etching treatment is subjected to a forming treatment to obtain a high-integration half-hole stepped circuit board.

[0012] Optionally, a first pretreatment is performed on the first substrate to obtain a first substrate to be laminated, including:

[0013] The first substrate is cut according to a first preset cutting parameter to obtain a cut first substrate;

[0014] The cut first substrate is drilled to obtain a drilled first substrate;

[0015] The drilled first substrate is subjected to graphic electroplating to obtain a graphically electroplated first substrate;

[0016] The graphically electroplated first substrate is subjected to half-hole routing to obtain a first substrate with half-holes;

[0017] The first substrate with half-holes is subjected to etching and browning treatment to obtain an etched and browned first substrate;

[0018] The etched and browned first substrate is processed to obtain a first substrate to be laminated.

[0019] Optionally, the etched and browned first substrate is processed to obtain a first substrate to be laminated, including:

[0020] The etched and browned first substrate is subjected to adhesive pasting treatment to obtain an adhesively pasted first substrate;

[0021] The adhesively pasted first substrate is routed with a stepped groove to obtain a first substrate to be laminated.

[0022] Optionally, a second pretreatment is performed on the second substrate to obtain a second substrate to be laminated, including:

[0023] The second substrate is cut according to a second preset cutting parameter to obtain a cut second substrate;

[0024] The cut second substrate is drilled to obtain a drilled second substrate;

[0025] The drilled second substrate is subjected to copper electroplating on the copper-clad board to obtain a second substrate with copper electroplated on the copper-clad board;

[0026] The second substrate with copper electroplated on the copper-clad board is subjected to hole plugging treatment to obtain a second substrate with holes plugged;

[0027] The second substrate with holes plugged is processed to obtain a second substrate to be laminated.

[0028] Optionally, the second substrate after plugging the vias is processed to obtain the second substrate to be laminated, including:

[0029] The second substrate after plugging the vias is subjected to electroless copper plating and copper cap plating to obtain the second substrate after electroless copper plating and copper cap plating;

[0030] The second substrate after electroless copper plating and copper cap plating is subjected to etching to obtain the second substrate after etching;

[0031] The second substrate after etching is subjected to brownification to obtain the second substrate to be laminated.

[0032] Optionally, the first substrate to be laminated and the second substrate to be laminated are subjected to laminated electroless copper plating to obtain the substrate after laminated electroless copper plating, including:

[0033] The first substrate to be laminated and the second substrate to be laminated are subjected to lamination to obtain the laminated substrate;

[0034] The laminated substrate is subjected to drilling to obtain the substrate after drilling;

[0035] The substrate after drilling is subjected to electroless copper plating to obtain the substrate after laminated electroless copper plating.

[0036] Optionally, the substrate after laminated electroless copper plating is subjected to electroplating and etching to obtain the substrate after electroplating and etching, including:

[0037] The substrate after laminated electroless copper plating is subjected to pattern electroplating to obtain the substrate after pattern electroplating;

[0038] The substrate after pattern electroplating is processed with blind vias to obtain the substrate with blind vias;

[0039] The substrate with blind vias is subjected to etching to obtain the substrate after electroplating and etching.

[0040] Optionally, the substrate after electroplating and etching is subjected to shaping to obtain a high-integration half-hole stepped circuit board, including:

[0041] The substrate after electroplating and etching is subjected to solder mask and text processing to obtain the substrate after solder mask and text processing;

[0042] The substrate after solder mask and text processing is subjected to surface immersion gold treatment to obtain the substrate after surface immersion gold treatment;

[0043] The substrate after surface immersion gold treatment is subjected to cutting and shaping to obtain a high-integration half-hole stepped circuit board.

[0044] Optionally, the method for manufacturing the high-integration half-hole stepped circuit board further includes:

[0045] The highly integrated half-hole stepped circuit board is tested and inspected according to preset test conditions to obtain a qualified highly integrated half-hole stepped circuit board; the preset test conditions include at least one of the following conditions:

[0046] Thermal stress test conditions: the baking temperature is 121°C to 149°C, the baking time is at least 6 hours, the temperature of the thermal stress test is 288°C ± 5°C, the time of the thermal stress test is at least 10 seconds, and the number of times of the thermal stress test is at least 3 times;

[0047] Constant temperature and humidity test conditions: the temperature of the constant temperature and humidity test is 85°C ± 1°C, the humidity of the constant temperature and humidity test is 85% ± 1%, and the time of the constant temperature and humidity test is at least 1000 hours.

[0048] An embodiment of the present invention also provides a half-hole stepped circuit board, which is prepared by the above method.

[0049] The technical solution of the present invention at least includes the following effects:

[0050] The above solution of the present invention provides a first substrate and a second substrate; performs a first pretreatment on the first substrate to obtain a first substrate to be laminated; performs a second pretreatment on the second substrate to obtain a second substrate to be laminated; performs a lamination and copper deposition treatment on the first substrate to be laminated and the second substrate to be laminated to obtain a substrate after lamination and copper deposition; performs an electroplating and etching treatment on the substrate after lamination and copper deposition to obtain a substrate after electroplating and etching treatment; performs a shaping treatment on the substrate after electroplating and etching treatment to obtain a highly integrated half-hole stepped circuit board. This solution realizes the efficient production and manufacturing of the half-hole stepped circuit board by first fabricating the circuit board in layers and then performing lamination and shaping treatments, improving the product performance and quality. Description of the Drawings

[0051] Figure 1 is a flowchart of the manufacturing method of the highly integrated half-hole stepped circuit board provided by the embodiment of the present invention;

[0052] Figure 2 is a front view of the highly integrated half-hole stepped circuit board provided by the embodiment of the present invention;

[0053] Figure 3 is a side view of the highly integrated half-hole stepped circuit board provided by the embodiment of the present invention;

[0054] Among them, 1, half-hole stepped circuit board; 2, first substrate; 3, second substrate; 4, half-hole; 5, slot; 6, controlled-depth milling blind slot; 7, micro-etching position. Detailed Embodiments

[0055] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present invention can be more thoroughly understood and the scope of the present invention can be completely conveyed to those skilled in the art.

[0056] As Figure 1 shown, the present invention provides a method for manufacturing a highly integrated half-hole stepped circuit board, including:

[0057] Step 11, providing a first substrate and a second substrate;

[0058] Step 12, performing a first pretreatment on the first substrate to obtain a first substrate to be laminated;

[0059] Step 13, performing a second pretreatment on the second substrate to obtain a second substrate to be laminated;

[0060] Step 14, performing a lamination and copper deposition treatment on the first substrate to be laminated and the second substrate to be laminated to obtain a substrate after lamination and copper deposition;

[0061] Step 15, performing an electroplating and etching treatment on the substrate after lamination and copper deposition to obtain a substrate after electroplating and etching treatment;

[0062] Step 16, performing a shaping treatment on the substrate after electroplating and etching treatment to obtain a highly integrated half-hole stepped circuit board.

[0063] In this example, two substrates are first prepared as the basic materials for manufacturing the circuit board. These substrates are usually composed of insulating materials such as epoxy resin and fiberglass to meet the subsequent circuit design and functional requirements. Among them, the materials of the first substrate and the second substrate are the same, and the thickness and size are basically the same; according to the design requirements, the thickness and size can also be different, for example, the thickness of the first substrate is 3 mm and the thickness of the second substrate is 2 mm; the pretreatment steps are to ensure that the substrate surface is clean, flat, and has good adhesiveness. Specifically, it includes cleaning the substrate surface to remove impurities such as grease and dust, and performing roughening treatment to increase surface adhesion. Finally, the substrate also needs to be dried to ensure that its surface is dry and free of moisture; after these pretreatment steps, the first substrate is ready for the subsequent lamination operation; similar to the first substrate, the second substrate also needs to go through the pretreatment steps to ensure that its surface is clean, flat, and has good adhesiveness; these pretreatment steps include cleaning, roughening, drying, etc.; after pretreatment, the first substrate and the second substrate can be laminated; during the lamination process, the pretreated first substrate and the second substrate are first tightly bonded together through a lamination device; after lamination, a copper deposition treatment is also required, that is, a thin copper layer is formed on the substrate surface, and this copper layer will serve as the basis for the subsequent electroplating and etching steps; after the copper deposition treatment, an electroplating and etching treatment is carried out. First, a thicker copper layer is formed on the copper layer through electroplating to meet the conductivity requirements of the circuit design, and then the unwanted parts of the copper layer are exposed using a mask or photolithography technology, and these parts are removed through chemical etching to form a substrate with a specific circuit pattern; the shaping process is the process of processing the substrate after the electroplating and etching treatment into the final required shape and size, including cutting, grinding and other steps. After the shaping process, the final high-integration half-hole stepped circuit board is obtained.

[0064] Through the above technical solution of the present invention, by first manufacturing the circuit board in layers and then performing lamination and shaping treatments, the problems of low production efficiency and poor product performance and quality of the half-hole stepped circuit board are solved, the efficient production and manufacturing of the half-hole stepped circuit board are realized, and the product performance and quality are improved.

[0065] In an optional embodiment proposed by the present invention, step 12 may include:

[0066] Step 121, cutting the first substrate according to the first preset cutting parameters to obtain the first substrate after blanking;

[0067] Step 122, drilling the first substrate after blanking to obtain the first substrate after drilling;

[0068] Step 123, performing graphic electroplating on the first substrate after drilling to obtain the first substrate after graphic electroplating;

[0069] Step 124: Perform half-hole routing on the first substrate after electroplating the pattern to obtain a first substrate with half-holes;

[0070] Step 125: Perform etching and brownification on the first substrate with half-holes to obtain a first substrate after etching and brownification;

[0071] Step 126: Process the first substrate after etching and brownification to obtain a first substrate to be laminated.

[0072] In this example, first, the first substrate is cut according to the first preset cutting parameters to obtain the first substrate after blanking. Specifically, a blanking knife is used for blanking under the conditions that the blanking speed is 4.5 ± 0.5 m / min and the blanking size tolerance is controlled within ±0.1 mm. After blanking, the first substrate after blanking is drilled to obtain the first substrate after drilling. Specifically, a drill bit, backing plate, and aluminum sheet are used for drilling under the conditions that the workshop environment temperature is 20 ± 2 °C and the number of times the drill bit is ground does not exceed 5 times. After drilling, the first substrate is subjected to pattern electroplating to obtain the first substrate after pattern electroplating. Specifically, an etching technology is used to fabricate the inner-layer graphic circuit. First, a layer of photoresist is coated on the copper foil substrate, and the required circuit pattern is formed through steps such as exposure and development. Then, an etchant is used to etch away the copper foil part not protected by the photoresist, thereby obtaining the inner-layer graphic circuit, where the concentration of industrial sulfuric acid pickling is 3 - 5%, the drying temperature is 90 ± 5 °C, the dry film laminating speed is 0.9 ± 0.2 m / min, the dry film laminating temperature is 120 ± 10 °C, the exposure scale is 6 - 7 levels, the LDI exposure energy is 24.3 MJ, and the temperature of the dust-free workshop environment is 20 ± 2 °C; the dry film developing speed is 2.5 ± 0.5 m / min, the dry film developing temperature is 30 ± 2 °C, and the concentration of sodium carbonate developing solution is 1.0 ± 0.2%; after obtaining the inner-layer graphic circuit, inner-layer graphic electroplating is carried out, and the main materials include copper brightener, tin brightener, AR-grade sulfuric acid, copper balls, tin balls, anode bags, titanium baskets, high-efficiency carbon cores, copper sulfate, and stannous sulfate; the first substrate after pattern electroplating is processed to form half-holes to obtain the first substrate with half-holes. Specifically, a routing tool is used to route half-holes under the conditions that the feed speed is 15 ± 5 m / min, the feed rate is 10 ± 5 m / min, the rotational speed is 48000 to 51000 r / min, the workshop environment temperature is 23 ± 3 °C, and the humidity is 60 ± 10%; after routing half-holes, alkaline etching is carried out using an etching solution, tin stripping solution, organic film stripping solution, and ammonia water, and brownification treatment is carried out using a brownification solution, degreaser, CP-grade sulfuric acid, hydrogen peroxide, and pre-impregnation solution. The parameters of alkaline etching are shown in Table 1; after etching and brownification treatment, the first substrate is subjected to adhesive pasting treatment to obtain the first substrate after adhesive pasting; the first substrate after adhesive pasting is routed with a stepped groove to obtain the first substrate to be laminated. Specifically, an AD adhesive is used for adhesive pasting treatment under the conditions that the temperature of the hot pressing roller is 30 ± 5 °C and the speed of the hot pressing roller is 3.0 ± 0.5 m / min, and a routing tool is used to route the stepped groove under the conditions that the feed speed is 10 ± 5 m / min, the feed rate is 5 ± 2 m / min, the rotational speed is 48000 to 51000 r / min, the workshop environment temperature is 23 ± 3 °C, and the humidity is 60 ± 10%.

[0073] Table 1 Parameters of Alkaline Etching

[0074]

[0075] In an alternative embodiment proposed by the present invention, step 13 may include:

[0076] Step 131, cutting the second substrate according to second preset cutting parameters to obtain the second substrate after blanking;

[0077] Step 132, drilling the second substrate after blanking to obtain the second substrate after drilling;

[0078] Step 133, performing copper electroplating on the second substrate after drilling to obtain the second substrate after copper electroplating;

[0079] Step 134, performing hole plugging on the second substrate after copper electroplating to obtain the second substrate after hole plugging;

[0080] Step 135, processing the second substrate after hole plugging to obtain the second substrate to be laminated.

[0081] In this example, first, the second substrate is cut according to the second preset cutting parameters to obtain the second substrate after blanking. Specifically, a blanking knife is used for blanking under the conditions that the blanking speed is 4.5 ± 0.5 m / min and the blanking size tolerance is controlled within ±0.1 mm. The blanked second substrate is drilled to obtain the second substrate after drilling. Specifically, a drill bit, a backing plate, and an aluminum sheet are used for drilling under the conditions that the workshop environment temperature is 20 ± 2°C and the number of times the drill bit is ground does not exceed 5 times. After drilling, the second substrate is subjected to electroless copper plating. The main materials for electroless copper plating include swelling agent M1601A, neutralizing agent M1603, degreasing agent M105D, pre-impregnation salt M201, activator M202, accelerator M204, accelerator salt M204S, as well as cylinder opening agent M1000HM, electroless copper M1000HA, electroless copper M1000HB, water-based lubricant J, water-based lubricant Q, potassium permanganate, sodium hydroxide, sodium persulfate, sulfuric acid (CP grade), sulfuric acid (industrial grade), hydrogen peroxide, AR hydrochloric acid. The second substrate after electroless copper plating is subjected to full-panel electroplating. The main materials for full-panel electroplating include copper sulfate, sulfuric acid, and CP grade sulfuric acid. Then, epoxy resin is used for resin plugging under the conditions that the doctor blade speed is 5 ± 0.5 m / min and the vacuum pressure is -99 kPa. The second substrate after plugging is subjected to electroless copper plating and copper cap plating to obtain the second substrate after electroless copper plating and copper cap plating. Specifically, the main materials for electroless copper plating and copper cap plating include copper sulfate, sulfuric acid, and CP grade sulfuric acid. The second substrate after electroless copper plating and copper cap plating is etched to obtain the second substrate after etching. The second substrate after etching is browned to obtain the second substrate to be laminated. Specifically, the main materials include anti-etch dry film, industrial sodium carbonate, industrial sulfuric acid, and grinding brush roller. The main parameters include: the pre-treatment grinding plate speed is 2.0 ± 0.5 m / min, the pickling concentration is 3% - 5%, the drying temperature is 90 ± 5°C, and the water break test is not less than 15 s; the dry film laminating speed is 0.9 ± 0.2 m / min, the dry film laminating temperature is 120 ± 10°C, the laminating inlet board temperature is 50 ± 5°C, and the laminating outlet board temperature is 55 ± 5°C; the exposure scale is 6 - 7 levels, the LDI exposure energy is 24.3 MJ, the temperature of the dust-free workshop environment is 20 ± 2°C, and the humidity is 55 ± 5%; the dry film developing speed is 2.5 ± 0.5 m / min, the dry film developing temperature is 30 ± 2°C, and the concentration of the sodium carbonate developing solution is 1.0 ± 0.2%.

[0082] In an alternative embodiment proposed by the present invention, step 14 may include:

[0083] Step 141, laminating the first substrate to be laminated and the second substrate to be laminated to obtain a laminated substrate;

[0084] Step 142, drilling the laminated substrate to obtain a drilled substrate;

[0085] Step 143: Perform copper deposition on the drilled substrate to obtain a substrate after press-fitting and copper deposition.

[0086] In this example, kraft paper, steel plates, high-temperature buffer pads, dust-removing cloths, abrasive belts, and hot kerosene are used to press-fit the first substrate and the second substrate. The main press-fitting parameters are shown in Table 2.

[0087] Table 2 Main press-fitting parameters

[0088]

[0089] Use a drill bit, backing plate, and aluminum sheet to drill the press-fitted substrate under the conditions that the workshop environment temperature is 20 ± 2°C and the number of times the drill bit is ground does not exceed 5 times; after drilling, perform copper deposition on the press-fitted substrate. The main materials for copper deposition include swelling agent M1601A, neutralizing agent M1603, degreasing agent M105D, pre-impregnation salt M201, activator M202, accelerator M204, accelerator salt M204S, as well as cylinder-opening agent M1000HM, electroless copper M1000HA, electroless copper M1000HB, water-based lubricant J, water-based lubricant Q, potassium permanganate, sodium hydroxide, sodium persulfate, sulfuric acid (CP grade), sulfuric acid (industrial grade), hydrogen peroxide, AR hydrochloric acid; the substrate after copper deposition is then subjected to flash plating treatment. Through flash plating treatment, a 2 - 3 μm thick copper plating layer is plated on the substrate, which can increase the thickness of the copper layer after copper deposition and improve the substrate's ability to resist quality risks. The main materials for flash plating treatment include copper sulfate, sulfuric acid, and CP grade sulfuric acid; after the substrate is subjected to flash plating treatment, it is then subjected to micro-etching treatment to remove the unnecessary copper. The main materials for micro-etching treatment include industrial sulfuric acid and hydrogen peroxide. Among them, the micro-etching speed is 1.0 ± 0.5 m / min, and the micro-etching temperature is 35 ± 3°C; after the substrate is subjected to micro-etching treatment, it is then subjected to film stripping treatment. The main materials for film stripping treatment include sodium hydroxide and sulfuric acid, and the main parameters are shown in Table 3; after the substrate is subjected to film stripping treatment, it is then subjected to outer layer pattern circuit treatment to achieve that the anti-etch dry film covers the required copper and exposes the copper positions that need to be micro-etched in the next process. The main materials for outer layer pattern circuit treatment include anti-etch dry film, industrial sodium carbonate, industrial sulfuric acid, and grinding brush rollers. The main parameters include: the grinding speed of the pre-treatment grinding plate is 2.0 ± 0.5 m / min, the pickling concentration is 3% - 5%, the drying temperature is 90 ± 5°C, and the water break test is not less than 15 s; the dry film laminating speed is 0.9 ± 0.2 m / min, the dry film laminating temperature is 120 ± 10°C, the laminating inlet board temperature is 50 ± 5°C, and the laminating outlet board temperature is 55 ± 5°C; the exposure scale is 6 - 7 levels, the LDI exposure energy is 24.3 MJ, the temperature of the clean workshop environment is 20 ± 2°C, and the humidity is 55 ± 5%; the dry film developing speed is 2.5 ± 0.5 m / min, the dry film developing temperature is 30 ± 2°C, and the concentration of the sodium carbonate developing solution is 1.0 ± 0.2%.

[0090] Table 3 Main parameters of stripping treatment

[0091]

[0092] In an optional embodiment proposed by the present invention, step 15 may include:

[0093] Step 151, perform pattern electroplating on the substrate after press-fit copper deposition to obtain a substrate after pattern electroplating;

[0094] Step 152, perform blind via routing on the substrate after pattern electroplating to obtain a substrate with blind vias;

[0095] Step 153, perform etching on the substrate with blind vias to obtain a substrate after electroplating etching treatment.

[0096] In this example, perform pattern electroplating on the substrate after press-fit copper deposition to obtain a substrate after pattern electroplating; specifically, the main materials for pattern electroplating include copper sulfate, sulfuric acid, and CP-grade sulfuric acid, and industrial sulfuric acid and hydrogen peroxide are used for micro-etching, where the micro-etching rate is 1.0 ± 0.5 m / min and the micro-etching temperature is 35 ± 3 °C; after micro-etching, sodium hydroxide and sulfuric acid are used for stripping, where the stripping concentration is 5 ± 2%, the stripping temperature is 50 ± 2 °C, the stripping rate is 3.0 ± 0.5 m / min, and the drying temperature is 80 ± 5 °C; after pattern electroplating treatment, a router, a base plate, and masking tape are used to route blind vias on the substrate, and the blind vias are routed with depth control under the conditions of a feed rate of 10 ± 5 m / min, a cutting speed of 5 ± 2 m / min, a rotational speed of 48000 to 51000 r / min, a workshop environment of 23 ± 3 °C, and a humidity of 60 ± 10%; then alkaline etching is performed, and the main parameters of alkaline etching are shown in Table 1.

[0097] In an optional embodiment proposed by the embodiment of the present invention, step 16 may include:

[0098] Step 161, perform solder mask lettering on the substrate after electroplating etching treatment to obtain a substrate after solder mask lettering treatment;

[0099] Step 162, perform surface immersion gold treatment on the substrate after solder mask lettering treatment to obtain a substrate after surface immersion gold treatment;

[0100] Step 163, perform cutting and shaping on the substrate after surface immersion gold treatment to obtain a high-integration half-hole stepped circuit board.

[0101] In this example, the substrate after electroplating and etching treatment is subjected to solder mask text treatment to obtain the substrate after solder mask text treatment. Among them, the main materials for solder mask treatment include solder mask ink, thinner, industrial sodium carbonate, and industrial sulfuric acid. The main parameters include a pre-treatment grinding speed of 1.5 ± 0.5 m / min, a pickling concentration of 3% - 5%, a drying temperature of 90 ± 5 °C, and a printing speed of 1.5 ± 0.5 m / min. The main materials for text treatment include character ink and inkjet cleaning solution. The substrate after solder mask text treatment is subjected to surface immersion gold treatment to obtain the substrate after surface immersion gold treatment. Among them, the main materials for surface treatment include gold salt, activation, pre-dipping, and sulfuric acid. The main parameters include a degreasing temperature of 40 - 60 °C, a degreasing concentration of 20 - 120 ml / L, sodium persulfate of 80 - 13 g / L, sulfuric acid of 10 - 30 ml / L, a micro-etching temperature of 28 - 32 °C, an activation temperature of 25 - 30 °C, an activation concentration of 80 - 120 ml / L, a chemical nickel temperature of 79 - 81 °C, a nickel bath concentration of 4.3 - 4.6 g / L, a bath load of 0.3 - 1.0 d㎡ / L, a PH of 4.5 - 4.7, an immersion gold temperature of 85 - 90 °C, a PH of 4.8 - 6.0, a gold concentration of 0.5 - 1.2%, and a gold solution concentration of 100 ml / L.

[0102] A specific embodiment of the method for manufacturing a highly integrated half-hole stepped circuit board provided by an embodiment of the present invention is as follows:

[0103] Step 1: Provide a first substrate and a second substrate;

[0104] The first substrate and the second substrate are made of epoxy resin and are basically the same size. Among them, the thickness of the first substrate is 3 mm, and the thickness of the second substrate is 2 mm.

[0105] Step 2: Perform a first pre-treatment on the first substrate and a second pre-treatment on the second substrate to obtain the first substrate and the second substrate to be laminated;

[0106] Use a cutting knife to cut the first substrate and the second substrate under the conditions that the cutting speed is 4.5±0.5 m / min and the cutting size tolerance is controlled within ±0.1 mm; after cutting, use a drill bit, backing plate, and aluminum sheet to drill the first substrate and the second substrate under the conditions that the workshop environment temperature is 20±2°C and the number of times the drill bit is ground does not exceed 5 times; after drilling, perform pattern electroplating on the first substrate to obtain the first substrate after pattern electroplating; then use a routing tool on the first substrate after pattern electroplating under the conditions that the feed rate is 15±5 m / min, the feed speed is 10±5 m / min, the rotational speed is 48000 to 51000 r / min, the workshop environment temperature is 23±3°C, and the humidity is 60±10% to route half holes; after routing half holes, perform alkaline etching using an etching solution, tin stripping water, organic film stripping solution, and ammonia water, and perform brownification treatment using a brownification solution, degreaser, CP grade sulfuric acid, hydrogen peroxide, and pre-impregnation solution; after etching and brownification treatment, perform glue pasting on the first substrate to obtain the first substrate after glue pasting; route a step groove on the first substrate after glue pasting to obtain the first substrate to be laminated.

[0107] Perform copper deposition treatment on the second substrate after drilling to deposit a uniform layer of chemical copper on the second substrate as the base for electroplated copper to improve the overall reliability of the circuit board; perform full-panel electroplating treatment on the second substrate after copper deposition treatment. The main materials for full-panel electroplating treatment include copper sulfate, sulfuric acid, and CP grade sulfuric acid; then use epoxy resin to perform resin plugging treatment on the second substrate under the conditions that the scraper speed is 5±0.5 m / min and the vacuum pressure is -99 kPa; perform copper deposition and copper cap treatment on the second substrate after plugging to obtain the second substrate after copper deposition and copper cap treatment; specifically, the main materials for copper deposition and copper cap treatment include copper sulfate, sulfuric acid, and CP grade sulfuric acid; perform etching treatment on the second substrate after copper deposition and copper cap treatment to obtain the second substrate after etching; perform brownification treatment on the second substrate after etching to obtain the second substrate to be laminated.

[0108] Step 3, perform laminated copper deposition treatment on the first substrate to be laminated and the second substrate to be laminated to obtain the substrate after laminated copper deposition.

[0109] Perform lamination treatment on the first substrate to be laminated and the second substrate to be laminated, and firmly fix them together by means of high temperature and high pressure to form an integral structure to obtain the laminated substrate; perform drilling treatment on the laminated substrate to form component insertion holes and wire connection ports to obtain the substrate after drilling; perform copper deposition treatment on the substrate after drilling to obtain the substrate after laminated copper deposition.

[0110] Step 4, perform electroplating and etching treatment on the substrate after laminated copper deposition to obtain the substrate after electroplating and etching treatment.

[0111] The substrate after press-fit and electroless copper plating needs to be pretreated first to ensure that the surface is clean, free of grease, oxides and other contaminants; clean the substrate surface with a cleaning agent, and then perform micro-etching treatment to remove the tiny unevenness on the surface and enhance the adhesion between the plating layer and the substrate; transfer the designed circuit pattern to the substrate through photolithography technology, closely attach the photolithographic film containing the circuit pattern to the substrate, and then irradiate with ultraviolet light to cause a chemical reaction in the graphic area of the photoresist, use a developer to remove the unexposed photoresist, leaving the graphic area corresponding to the circuit pattern; perform electroplating copper treatment in the graphic area; the electroplating copper solution contains copper ions and appropriate additives, and deposits a layer of copper in the graphic area through an electrochemical reaction; after electroplating, use a stripping agent to remove the photoresist, expose the copper layer in the non-electroplated area, and then thoroughly clean the substrate to remove all residues, mark the positions and sizes of the blind vias to be routed on the substrate according to the design requirements, and use a routing machine or a laser cutting device to perform routing cutting on the substrate according to the marked positions to form blind vias; perform pre-etching cleaning on the substrate with blind vias to remove all residues, use an anti-etching ink or a dry film to cover the copper layer areas to be retained to protect these areas from the etching solution; immerse the substrate in the etching solution, and the etching solution will dissolve the unprotected copper layer; after etching, use a cleaning solution to remove all residues, including the anti-etching ink or the dry film.

[0112] Step 5, perform a shaping process on the substrate after the electroplating and etching treatment to obtain a high-integration half-hole stepped circuit board.

[0113] The substrate after electroplating and etching treatment needs to be coated with a solder mask layer first. The solder mask layer is usually a special ink or resin material used to protect the non-conductive areas of the circuit board and prevent short circuits or damage during subsequent soldering; after the solder mask layer is dried and cured, perform text printing. Text printing usually includes markings, component numbers, polarity markings, etc. on the circuit board, which are used to guide subsequent assembly and testing; after the solder mask layer and text printing are completed, a curing process is required to fully cure the ink or resin material to improve adhesion and durability; the substrate after solder mask and text treatment needs to be pretreated, including degreasing, micro-etching, etc. to ensure good bonding between the metal layer and the substrate; then perform immersion gold treatment. Immersion gold is a chemical gold plating method that deposits a thin layer of gold on the substrate surface through a chemical reaction. This layer of gold not only has good electrical conductivity and corrosion resistance, but also provides an aesthetic appearance; after immersion gold is completed, perform post-treatment, including cleaning, drying and other steps to remove all residues and ensure the firm adhesion of the gold layer; use a laser cutting machine, a mechanical punch or a water jet and other equipment to cut and shape the substrate according to the cutting program to obtain a half-hole stepped circuit board.

[0114] Through the above technical solution of the present invention, by first fabricating the circuit board in layers and then performing lamination and shaping processes, the problems of low production efficiency and poor product performance and quality of the half-hole stepped circuit board are solved, realizing the efficient production and fabrication of the half-hole stepped circuit board and improving the product performance and quality.

[0115] In an alternative embodiment of the present invention, the method further includes the following steps:

[0116] Step 171, testing and inspecting the high-integration half-hole stepped circuit board according to preset test conditions to obtain a qualified high-integration half-hole stepped circuit board; the preset test conditions include at least one of the following conditions:

[0117] Step 172, thermal stress test conditions, baking temperature is 121°C to 149°C, baking time is at least 6h, thermal stress test temperature is 288°C ± 5°C, thermal stress test time is at least 10s, and the number of thermal stress tests is at least 3 times;

[0118] Step 173, temperature and humidity constant test conditions, temperature and humidity constant test temperature is 85°C ± 1°C, temperature and humidity constant test humidity is 85% ± 1%, and temperature and humidity constant test time is at least 1000h.

[0119] In this embodiment, in order to improve the qualification rate of the circuit board and user satisfaction, it is necessary to inspect the high-integration half-hole stepped circuit board. Only the circuit board that passes the preset inspection conditions is a qualified high-integration half-hole stepped circuit board and can be used for subsequent fabrication or factory shipment. In this embodiment, after the half-hole stepped circuit board is inspected according to the above inspection method, the product qualification rate of the half-hole stepped circuit board is relatively high, fully meeting the market demand.

[0120] As Figure 2 and Figure 3 shown, an embodiment of the present invention provides a half-hole stepped circuit board 1, and the half-hole stepped circuit board 1 is prepared by using the manufacturing method of the high-integration half-hole stepped circuit board described in any one of the above embodiments. The half-hole stepped circuit board 1 includes: a first substrate 2, a second substrate 3, a half-hole 4, and a slot 5; the total product thickness is 5mm, wherein the thickness of the first substrate 2 is 3mm, the thickness of the second substrate 3 is 2mm, and the slot depth is 3mm. The production efficiency and product performance of this half-hole stepped circuit board have been effectively improved.

[0121] The above are the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A method for manufacturing a highly integrated half-hole step circuit board, characterized in that: include: providing a first substrate and a second substrate; Performing a first pretreatment on the first substrate to obtain a first substrate to be pressed; Performing a second pretreatment on the second substrate to obtain a second substrate to be pressed; Performing a pressing copper deposition process on the first substrate to be pressed and the second substrate to be pressed to obtain a pressed copper-deposited substrate; Performing electroplating and etching treatment on the substrate after the copper deposition, to obtain a substrate after the electroplating and etching treatment; Performing a molding process on the substrate after the electroplating and etching process to obtain a highly integrated half-hole step circuit board; The first substrate is subjected to a first pretreatment to obtain a first substrate to be pressed, comprising: Cutting the first substrate according to first preset cutting parameters to obtain a cut first substrate; Performing a drilling process on the cut first substrate to obtain a drilled first substrate, wherein the drilling is performed under the condition that the workshop environment has a temperature of 20±2° C. and the drill tip is ground a maximum of 5 times; Performing pattern electroplating on the first substrate after drilling to obtain the first substrate after pattern electroplating, wherein a layer of photoresist is firstly coated on the first substrate, and a desired circuit pattern is formed by exposure and development, and then an etchant is used to etch away the copper foil portion not protected by the photoresist to obtain an inner layer pattern circuit; The first substrate after the pattern electroplating is subjected to half-hole processing to obtain a first substrate with half holes, wherein the half-holes are processed under the conditions of a feed speed of 15±5 m / min, a feed speed of 10±5 m / min, a rotation speed of 48000 to 51000 r / min, a workshop environment of 23±3° C., and a humidity of 60±10%; Performing an etching-browning treatment on the first substrate with the half hole to obtain an etched-brown first substrate; Processing the etched and browned first substrate to obtain a first substrate to be pressed; The first substrate after etching is processed to obtain the first substrate to be pressed, including: Performing a glue-coating process on the first substrate after etching and browning to obtain a glue-coated first substrate; The step groove is formed on the first substrate after the adhesive bonding to obtain the first substrate to be pressed; The second substrate is subjected to a second pretreatment to obtain a second substrate to be pressed, comprising: Cutting the second substrate according to second preset cutting parameters to obtain a cut second substrate; The second substrate after cutting is subjected to drilling processing to obtain a second substrate after drilling, wherein the drilling is performed under the condition that the workshop environment temperature is 20±2° C. and the drill bit is ground a maximum of 5 times; Performing copper plate electroplating treatment on the drilled second substrate to obtain a copper plate electroplated second substrate; The second substrate after the copper plate electroplating is subjected to a plugging treatment to obtain a plugged second substrate, wherein the plugging treatment is performed using epoxy resin at a scraper speed of 5±0.5 m / min and a vacuum pressure of -99 kPa; Processing the second substrate after plugging the holes to obtain a second substrate to be pressed; The first substrate to be pressed and the second substrate to be pressed are subjected to a pressing copper deposition process to obtain a pressed copper-deposited substrate, comprising: Performing a lamination process on the first substrate to be laminated and the second substrate to be laminated to obtain laminated substrates; Performing drilling processing on the pressed substrate to obtain a drilled substrate; Performing copper deposition on the drilled substrate to obtain a pressed copper-deposited substrate; Among them, the substrate after copper plating treatment is then subjected to flash plating treatment. Through the flash plating treatment, a 2~3um copper plating layer is added on the substrate to increase the thickness of the copper layer after copper plating and improve the substrate's ability to resist quality risks. The materials for the flash plating treatment include copper sulfate and sulfuric acid; the substrate is subjected to micro-etching treatment after the flash plating treatment. The materials for the micro-etching treatment include industrial sulfuric acid and hydrogen peroxide. The micro-etching speed is 1.0±0.5m / min and the micro-etching temperature is 35±3℃; the substrate is subjected to film stripping treatment after the micro-etching treatment. The materials for the film stripping treatment include sodium hydroxide and sulfuric acid; the substrate is subjected to outer layer graphic circuit treatment after the film stripping treatment.

2. The method for manufacturing a highly integrated half-hole step circuit board according to claim 1, characterized in that: The second substrate after plugging the holes is processed to obtain a second substrate to be pressed, including: Performing copper deposition and copper capping treatment on the second substrate after the plugging hole, so as to obtain the second substrate after copper deposition and copper capping; Etching the second substrate after copper deposition and copper capping to obtain an etched second substrate; The etched second substrate is subjected to browning treatment to obtain a second substrate to be pressed.

3. The method for manufacturing a highly integrated half-hole step circuit board according to claim 1, characterized in that: The substrate after the copper deposition is subjected to electroplating and etching treatment to obtain the substrate after the electroplating and etching treatment, comprising: Performing pattern electroplating on the substrate after the copper deposition by pressing to obtain a substrate after pattern electroplating; Processing the substrate after the pattern electroplating with blind grooves to obtain a substrate with blind grooves; The substrate with the blind groove is etched to obtain a substrate after electroplating and etching.

4. The method for manufacturing a highly integrated half-hole step circuit board according to claim 1, characterized in that: The substrate after the electroplating and etching process is subjected to a molding process to obtain a highly integrated half-hole step circuit board, including: Performing solder resist text processing on the substrate after the electroplating and etching processing to obtain a substrate after the solder resist text processing; Performing surface gold immersion treatment on the substrate after the solder mask text processing to obtain a substrate after the surface gold immersion treatment; The substrate with the surface immersion gold is cut and formed to obtain a highly integrated half-hole step circuit board.

5. The method for manufacturing a highly integrated half-hole step circuit board according to claim 1, characterized in that: Also includes: The highly integrated half-hole step circuit board is tested and inspected according to preset test conditions to obtain a qualified highly integrated half-hole step circuit board; the preset test conditions include at least one of the following conditions: Thermal stress test conditions: baking temperature is 121℃~149℃, baking time is at least 6h, thermal stress test temperature is 288℃±5℃, thermal stress test time is at least 10s, and the number of thermal stress tests is at least 3 times; Constant temperature and humidity test conditions: the temperature of the constant temperature and humidity test is 85℃±1℃, the humidity of the constant temperature and humidity test is 85%±1%, and the time of the constant temperature and humidity test is at least 1000h.

6. A half-hole step circuit board, characterized in that: The half-hole step circuit board is prepared by the method described in any one of claims 1 to 5.

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