Height-adjustable spray system for cleaner

Abstract

A cleaning apparatus is configured to clean an electronic substrate including a printed circuit board and a semiconductor product component. The cleaning apparatus includes: at least one cleaning module configured to process an electronic substrate; and a transfer system configured to convey the electronic substrates through the at least one cleaning module. The at least one cleaning module includes a spray system having a header connected to a fluid source and a plurality of spray bars fluidly coupled to the header; and an adjustable height spray system configured to move the header and the plurality of spray bars up and down relative to the transfer system.

Description

Background of the Invention 1. Technical Field

[0002] The present application relates generally to an apparatus for cleaning electronic substrates including printed circuit boards and semiconductor product components, and more particularly to a system and method for adjusting the height of a spray system of the cleaning apparatus. 2. Background technology

[0003] Various types of liquid cleaning equipment, commonly referred to as cleaners, are used to clean electronic substrates to remove contaminants such as flux residues, resins, etc. that remain on the electronic substrates as a result of the soldering process.

[0004] Soldering processes have recently advanced in two important ways: the transition from tin-lead solders to lead-free materials; and the reduction in size of electronic substrates and the associated increase in density of smaller, low-profile components. These new solder materials have increased soldering temperature requirements and are typically formulated with higher flux content (by weight). The combination of lead-free processes and new electronic substrate designs requires more time and energy to achieve industry cleanliness standards.

[0005] A cleaner is used to clean unwanted materials left by the soldering process on electronic substrates. Such a cleaner is equipped with one or more cleaning modules to clean the electronic substrates. Currently, adjusting the height of the spray system in the cleaning module of the cleaner requires manual adjustment of the spray system, which is time-consuming and inconvenient. Summary of the invention

[0006] One aspect of the present disclosure relates to a cleaning device for cleaning electronic substrates including printed circuit boards and semiconductor product components. In one embodiment, the cleaning device includes: at least one cleaning module, the at least one cleaning module is configured to process electronic substrates; and a conveyor system, the conveyor system is configured to transport the electronic substrates through the at least one cleaning module. The at least one cleaning module includes: a spray system, the spray system having a manifold connected to a fluid source and a plurality of spray bars fluidly coupled to the manifold; and an adjustable height spray system, the adjustable height spray system is configured to move the manifold and the plurality of spray bars up and down relative to the conveyor system.

[0007] The embodiment of the cleaning device may further include a lifting mechanism, which is configured to automatically move the manifold and multiple spray bars between the raised position and the lowered position. The lifting mechanism may include a linear actuator, which is mounted on the wall of the at least one cleaning module through a bracket. The linear actuator can be controlled by a control module. The lifting mechanism may further include: a connecting rod assembly, which has two pivoting connecting rods, each of which is pivotally fixed to the wall of the cleaning module; and a connecting crossbar, which connects the ends of these pivoting connecting rods. The first pivoting connecting rod of the two pivoting connecting rods can be fixed to a first pivot rod, which extends through the wall of the cleaning module, and the second pivoting connecting rod of the two pivoting connecting rods can be fixed to a second pivot rod, which extends through the wall of the cleaning module. The spraying system with adjustable height may further include a spraying support mechanism, which is configured to support the manifold and the spraying bar. The spray support mechanism can be connected to the lifting mechanism by a first pivot rod connected to the first pivot link and by a second pivot rod connected to the second pivot link. The spray support mechanism can include a first support assembly and a second support assembly, the first support assembly is connected to the first pivot rod, and the second support assembly is connected to the second pivot rod. The first support assembly can include at least one first pivot member, and the at least one first pivot member is configured to releasably engage the first support bracket. The second support assembly can include at least one second pivot member, and the at least one second pivot member is configured to releasably engage the second support bracket. The first support bracket and the second support bracket can be fixed to the manifold. At least one pivot member of the first support assembly can include two pivot members, and the two pivot members are fixed to each other by a first pivot cross member, and at least one pivot member of the second support assembly can include two pivot members, and the two pivot members are fixed to each other by a second pivot cross member. One of the first support bracket and the second support bracket can be configured to be releasably fixed to its corresponding first pivot cross member and second pivot cross member. The manifold may include an elongated manifold body having an opening connected to a fluid source and a plurality of ports extending along the length of the manifold body. The ports may be configured to connect the manifold to a plurality of spray bars. Each spray bar may include an inlet port formed in the middle of the spray bar, wherein each spray bar is fluidly connected to a corresponding port of the manifold by a quick-connect clamp.

[0008] Another aspect of the present disclosure relates to a method for cleaning an electronic substrate using a cleaning device, the method comprising: transporting the electronic substrate through at least one cleaning module via a conveyor system; adjusting the height of a manifold and a plurality of spray bars using an adjustable height spray system; and performing a cleaning operation using the at least one cleaning module.

[0009] Another aspect of the present disclosure relates to a spray system for a cleaning module of a cleaning device for cleaning electronic substrates including printed circuit boards and semiconductor product components. In one embodiment, the spray system includes: a manifold connected to a fluid source; a plurality of spray bars, the plurality of spray bars being fluidly coupled to the manifold; and an adjustable height spray system, the adjustable height spray system being configured to move the manifold and the plurality of spray bars up and down relative to a conveyor system.

[0010] The spraying system of the embodiment may further include a lifting mechanism, which is configured to automatically move the manifold and a plurality of spraying rods between a raised position and a lowered position. The lifting mechanism may include a linear actuator, which is mounted on the wall of the at least one cleaning module by a bracket. The lifting mechanism may further include: a link assembly, which has two pivoting links, each of which is pivotally fixed to the wall of the cleaning module; and a connecting crossbar, which connects the ends of these pivoting links. The first pivoting link of the two pivoting links can be fixed to a first pivot rod, which extends through the wall of the cleaning module, and the second pivoting link of the two pivoting links can be fixed to a second pivot rod, which extends through the wall of the cleaning module. The spraying system with adjustable height may further include a spraying support mechanism, which is configured to support the manifold and the spraying rod. The spraying support mechanism can be connected to the lifting mechanism by a first pivot rod and a second pivot rod. The spray support mechanism may include a first support assembly and a second support assembly, the first support assembly being connected to the first pivot rod and the second support assembly being connected to the second pivot rod. The first support assembly may include at least one pivot member configured to releasably engage the first support bracket. The second support assembly may include at least one pivot member configured to releasably engage the second support bracket. The first support bracket and the second support bracket may be fixed to the manifold. The at least one pivot member of each of the first support assembly and the second support assembly may include two pivot members connected to each other by a pivot cross member, wherein one of the pivot cross members is held in place by a clamping assembly of the corresponding support bracket. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component shown in various figures is represented by the same reference numeral. For the purpose of clarity, not every component may be labeled in every figure. In the drawings:

[0012] Figure 1 is a perspective view of an electronic substrate cleaning apparatus;

[0013] Figure 2is a three-dimensional diagram of a cleaning module of a cleaning device;

[0014] Figure 3 is another perspective view of a cleaning module of a cleaning device;

[0015] Figure 4 is another perspective view of a cleaning module of a cleaning device;

[0016] Figure 5 is a perspective view of a height-adjustable spray system of a cleaning module;

[0017] Figure 6 is an exploded perspective view of a spray system with adjustable height;

[0018] Figure 7 is another exploded perspective view of the height-adjustable spray system; and

[0019] Figure 8 is an enlarged side view of the cleaning apparatus showing the spray nozzle in a raised position and in a lowered position. DETAILED DESCRIPTION

[0020] Solder paste is commonly used when assembling electronic substrates including printed circuit boards and semiconductor product components, where the solder paste is used to bond electronic components to the substrate. Solder paste includes solder for forming solder joints and flux for preparing metal surfaces for solder attachment. Any number of application methods can be used to deposit solder paste onto metal surfaces (e.g., electronic pads) disposed on the electronic substrate. In one example, a stencil printer can use a scraper to force solder paste through a metal stencil laid on an exposed surface of the electronic substrate. In another example, a dispenser can dispense solder paste material onto specific areas of the electronic substrate. The leads of the electronic components are aligned with the solder deposits and pressed into these solder deposits to form an assembly. In the reflow soldering process, the solder is then heated to a temperature sufficient to melt the solder and cooled to permanently electrically and mechanically connect the electronic components to the electronic substrate. The solder typically includes an alloy having a melting temperature lower than the melting temperature of the metal surface to be bonded. The temperature must also be low enough not to damage the electronic components. In some embodiments, the solder can be a tin-lead alloy. However, solders using lead-free materials can also be used. Another process for attaching components to electronic substrates is the wave soldering process.

[0021] In solder, flux usually includes carrier, solvent, activator and other additives. The carrier is a solid or non-volatile liquid that coats the surface to be soldered, and may include rosin, resin, ethylene glycol, polyethylene glycol, polyethylene glycol surfactant and glycerol. The solvent evaporated during the preheating and soldering process is used to dissolve the carrier activator and other additives. Examples of common solvents include ethanol, ethylene glycol, ethylene glycol esters and / or ethylene glycol ethers and water. The activator promotes the removal of metal oxides from the surface to be soldered. Common activators include amine hydrochlorides, dicarboxylic acids (such as adipic acid or succinic acid), and organic acids (such as citric acid, malic acid or abietic acid). Other flux additives may include surfactants, viscosity modifiers and additives for providing low collapse or good viscosity characteristics to hold components in place before reflow.

[0022] As described above, the soldering process described herein can leave undesirable contaminants on the electronic substrate, which must be cleaned before releasing the electronic substrate for use. An on-line cleaning process is disclosed herein to remove undesirable contaminants caused by the manufacturing process. Specifically, a cleaning device is used to remove undesirable materials left by the soldering process from the electronic substrate. An embodiment of the present disclosure relates to a cleaning device in which the height of the spray nozzle of the cleaning device can be automatically adjusted to adjust the distance between the spray nozzle and the electronic substrate being cleaned.

[0023] It should be understood that the application of the embodiments of the systems and devices discussed herein is not limited to the details of the construction and arrangement of the components set forth in the following description or shown in the accompanying drawings. These systems and devices can be implemented with other embodiments and can be practiced or implemented in various ways. The examples of the specific embodiments provided herein are only for the purpose of display and are not intended to be limited. Similarly, the words and terms used herein are for the purpose of description and should not be considered as restrictions. The use of "including", "comprising", "having", "containing", "involving" and its variations herein is intended to cover the items listed thereafter and their equivalents and additional items. The reference to "or" can be interpreted as inclusive, so any term described using "or" can indicate any of the single items, multiple items and all items in the described items. Any reference to the front and back, left and right, top and bottom, upper and lower parts, and vertical and horizontal is intended to facilitate description, rather than limiting the system and method or its components to any one position or spatial orientation.

[0024] Referring now to the drawings and more particularly to Figure 1, the electronic substrate cleaning apparatus is generally indicated at 10. As shown, the cleaning apparatus 10 includes a cleaning module (indicated at 12) configured to clean and process components (e.g., components including electronic substrates and semiconductor wafers). The cleaning apparatus 10 may include one or more modules for cleaning, drying, etc. A control module (collectively indicated at 14) having a user interface provides an operator with the ability to program and monitor the operation of the cleaning apparatus 10. In certain embodiments, the cleaning apparatus 10 may include a control module provided by Electrovert Cleaners, an ITW Electronic Assembly Equipment company of Camdenton, Missouri. Series of cleaning platforms.

[0025] The cleaning apparatus 10 further includes an elongated conveyor 16 configured to carry electronic substrates (e.g., Figure 2 The electronic substrate 18 (shown in FIG. 1 ) is transported through the cleaning module 12 of the cleaning device. As described above, the electronic substrate 18 can include printed circuit boards and semiconductor product components. The conveyor 16 is designed to firmly hold the electronic substrate 18 during the sometimes rigorous cleaning process. Trays are sometimes used to support the items that are transported through the cleaning device 10 for cleaning by the conveyor 16. Embodiments of the present disclosure relate to an adjustable height spray system that is used to spray fluid onto the items contained in the cleaning module to clean the parts during the cleaning operation.

[0026] refer to Figure 2 and Figure 3 , the cleaning module of the cleaning device includes a spray system (generally represented by 20). As shown, the spray system 20 includes a manifold (generally represented by 22), which is connected to a fluid source (e.g., a water supply hose 24). Specifically, the manifold 22 includes: an elongated manifold body 26, which has an opening connected to the fluid source; and a plurality of ports or nozzles extending along the length of the manifold body, which are used to connect the manifold to a spray bar (each spray bar is represented by 28). The spray bar 28 is positioned above the conveyor 16 to clean the surface of the parts that need to be cleaned facing up on the conveyor. The spray system 20 further includes spray bars (each spray bar is represented by 30), which are positioned below the conveyor 16 to clean the parts facing down on the conveyor. The spray system 20 is further configured to recycle the fluid used during the cleaning process.

[0027] The cleaning module 12 of the cleaning apparatus 10 further includes an adjustable height spray system (generally indicated at 32) that is configured to adjust the height of the spray system 20 above the conveyor 16. The adjustable height spray system 32 is configured to move the manifold 22 and the spray bar 28 up and down relative to the conveyor 16 that carries the parts to be cleaned. Depending on the width or thickness of the parts to be cleaned, it is sometimes desirable to move the spray bar 28 up or down to optimize the distance that the spray bar applies the cleaning fluid to the parts. In some embodiments, the adjustable height spray system 32 is configured to raise and lower the spray bar 28 by a distance between 3-5 inches.

[0028] refer to Figure 4 , the adjustable height spray system 32 includes a lifting mechanism (generally indicated at 34) that is designed to automatically move the manifold and spray bar between a raised position and a lowered position of the manifold 22 and the spray bar 28. As shown, the lifting mechanism 34 includes a linear actuator 36 that is mounted on the wall 38 of the cleaning module 12 via a bracket 40. The linear actuator 36 can include any type of actuator controlled by the control module 14 of the cleaning device 10. The lifting mechanism 34 further includes: a linkage assembly having two pivoting links 42, 44, each of which is pivotally fixed to the wall of the cleaning module; and a connecting crossbar 46 that connects the ends of the pivoting links. The first pivoting link 42 is fixed to a first pivot rod 48, which extends through the wall 38 of the cleaning module 12 through an opening in the wall. Likewise, the second pivot link 44 is secured to a second pivot rod 50 which extends through the wall of the cleaning module through another opening in the wall.

[0029] As shown, the linear actuator 36 is positioned to move the first pivot link 42 to rotate the first pivot rod 48 about an axis. Because the connecting crossbar 46 connects the first pivot link 42 to the second pivot link 44, the second pivot link also rotates the second pivot rod 50 about an axis parallel to the axis of the first pivot rod 48. Therefore, the linear actuator 36 is configured to rotate the first pivot rod 48 by the same amount as the second pivot rod 50. Figure 4 As shown, the first pivot link member 42 and the second pivot link member 44 of the adjustable height spray system 32 are positioned to position the spray system 20, including the manifold 22 and the spray bar 28, in a lowered position.

[0030] refer to Figures 5 to 7The adjustable height spray system 32 further includes a spray support mechanism, generally indicated at 52, which is configured to support components of the spray system 20, including the manifold 22 and the spray bar 28. As shown, the spray support mechanism 52 is coupled to the lifting mechanism 34 via a first pivot rod 48 and a second pivot rod 50.

[0031] The spray support mechanism 52 includes a first support assembly, generally indicated at 54, connected to the first pivot rod 48 and a second support assembly, generally indicated at 56, connected to the second pivot rod 50. The first support assembly 54 includes two pivot members 58, 60 mounted on a first support plate 62. The pivot members 58, 60 are rotatably connected to the first pivot rod 48 of the lifting mechanism 34. The pivot members 58, 60 are connected to each other by a pivot cross member 64, which is configured to releasably engage a first support bracket 66. As shown, the first support bracket 66 is fixed to the manifold body 26 of the manifold 22.

[0032] Likewise, the second support assembly 56 includes two pivot members 68, 70 mounted on a second support plate 72. The pivot members 68, 70 are connected to the second pivot rod 50 of the lift mechanism 34. The pivot members 68, 70 are connected to each other by a pivot cross member 74, which is configured to releasably engage a second support bracket 76. As shown, the second support bracket 76 is fixed to the manifold body 26 of the manifold 22, and the second support bracket is spaced apart from the first support member 66.

[0033] When the first pivoting cross member 64 of the first support assembly 54 is secured, the first pivoting cross member is held in place by two clamp assemblies (each of which is indicated at 78) of the first support bracket 66. Each clamp assembly 78 is configured to releasably secure the first support bracket 66 to the first pivoting cross member 64, thereby releasably securing the manifold body 26 of the manifold 22 to the spray support mechanism 52. When the second pivoting cross member 74 of the second support assembly 56 is secured, the second pivoting cross member is positioned below the passage of the second support bracket 76. Thus, the manifold 22 and the spray bar 28 are first secured to the spray support mechanism 52 by positioning the second pivoting cross member 74 of the second support assembly 56 below the passage of the second support bracket 76. Next, the first pivoting cross member 64 of the first support assembly 54 is positioned adjacent to the clamp assemblies 78 of the first support bracket 66, and the clamp assemblies are closed to secure the first pivoting cross member.

[0034] This arrangement allows that when the lifting mechanism 34 is operated, the first pivot rod 48 and the second pivot rod 50 are rotated by activating the linear actuator 36, thereby causing the first support assembly 54 and the second support assembly 56 to rotate respectively. The rotational movement of the first support assembly 54 and the second support assembly 56 causes the manifold 22 and the spray bar 28 to move up and down to the desired height above the conveyor 16. And because the pivot rods 48, 50 cause the first support assembly 54 and the second support assembly 56 to rotate respectively, the manifold 22 and the spray bar 28 move vertically while maintaining a generally horizontal orientation.

[0035] Special References Figure 6 and Figure 7 , shows the manner in which the manifold body 26 of the manifold 22 is fixed to each spray bar 28. As described above, the manifold body 26 of the manifold 22 includes a plurality of ports (each port is represented by 80) formed along the bottom surface of the manifold body and along the length of the manifold body. Each spray bar 28 includes an inlet port (represented by 82) formed in the spray bar at the middle of the spray bar. The inlet port 82 of each spray bar 28 is fluidly connected to the corresponding port 80 of the manifold body 26 by a quick-connect clamp (represented by 84), which is configured to connect the port of the manifold to the inlet port of the spray bar. One or more valves (not shown) can be provided to control the flow of fluid to these ports. As shown, the spray bars 28 are evenly spaced from each other along the length of the manifold body 26 and extend vertically relative to the manifold body along a generally horizontal plane.

[0036] refer to Figure 8 , showing the spray bar 28 in a raised position and a lowered position. As shown, the manifold 22 and the spray bar 28 are shown in a raised position with solid lines, and the manifold and the spray bar are shown in a lowered position with dashed lines. The adjustable height spray system 32 can be configured to reach a desired height above the conveyor according to the specific application. As described above, the control module 14 can be configured to control the linear actuator 36 of the lifting mechanism 34 of the adjustable height spray system 32 to raise and lower to a desired height by controlling the linear actuator 36.

[0037] In some embodiments, a method for cleaning an electronic substrate using the cleaning device 10 is further provided. In one embodiment, the cleaning method includes: transporting the electronic substrate through the cleaning module 12 of the cleaning device 10 via the conveying system 16; and performing a cleaning operation on the electronic substrate. In one embodiment, the cleaning operation is controlled by the control module 14 of the cleaning device 10.

[0038] It should be understood that the above description is for the purpose of illustration and example only, rather than for the purpose of limitation, and changes and modifications are possible. For example, the cleaning device 10 described above can be any type of cleaning machine for cleaning electronic substrates. Accordingly, other embodiments can be expected without departing from the scope of the present application, and modifications and changes can be made.

[0039] In one embodiment, the control module 14 of the cleaning device 10 is configured with an operating system (e.g., based on The user interface provides an operating system that provides familiar drop-down menus and has data logging and bar coding capabilities. The operating system is easily networked to download recipes and access operating data remotely. The user interface enables quick and easy viewing of system pressures, water levels, pump and blower operation, temperatures, and fill / drain operations. In addition, the user interface can be configured to control the operation of the adjustable height spray system, particularly the actuator.

[0040] A variety of different controllers (such as control module 14) can perform a variety of different operations discussed above. Using data stored in associated memory and / or storage devices, control module 14 also executes one or more instructions stored in one or more non-transitory computer-readable media, and control module 14 may include and / or be connected to the one or more non-transitory computer-readable media, which can generate manipulation data. In some examples, control module 14 may include one or more processors or other types of controllers. In one example, control module 14 is at least one processor or includes the at least one processor. In another example, in addition to or instead of a general-purpose processor, control module 14 uses a dedicated integrated circuit to perform at least a portion of the operations discussed above, and the dedicated integrated circuit is customized to perform special operations. As shown by these examples, according to examples of the present disclosure, many specific combinations of hardware and software can be used to perform the operations described herein, and the present disclosure is not limited to any specific combination of hardware and software components. Examples of the present disclosure may include a computer program product, which is configured to perform the method, process, and / or operation discussed above. The computer program product may be or include one or more controllers and / or processors configured to execute instructions to perform the methods, processes, and / or operations discussed above.

[0041] Many process parameters can be configured in the computer controlled operator interface provided in the cleaning apparatus 10. System pressure, water level and temperature are readily available. Data logging and bar coding capabilities are features that enhance and simplify the production process.

[0042] In some embodiments, the cleaning apparatus 10 can be configured to include nozzles (including "jet" nozzles) to apply maximum direct dynamic impact to the product surface and effectively clean difficult cleaning applications with low stand-off components. These nozzles can be configured to produce large droplets to improve the cleaning performance of the cleaning apparatus when running at lower ramp rates. These nozzles can be configured to produce an oscillating motion to better clean and rinse flux residues in pre-wash, thereby reducing foaming in cycle washes.

[0043] In some embodiments, the cleaning equipment 10 can be equipped with fully welded stainless steel piping to eliminate pressure drops and leaks, and all piping sections can be replaced or updated in minutes to maximize uptime and process flexibility. Pipe sections have quick disconnect fittings for easy maintenance.

[0044] In some embodiments, the cleaning device 10 may include one or more rear panels that can be easily removed for maintenance. A front door may also be provided to quickly access the electrical panel, computer, heater, float, and thermocouple. The cleaning device 10 may include a hinged tempered glass window to provide optimal viewing and access.

[0045] Thus, having described several aspects of at least one embodiment of the present disclosure, it will be appreciated that various changes, modifications and improvements will readily occur to those skilled in the art. Such changes, modifications and improvements are intended to be a part of the present disclosure and are intended to fall within the spirit and scope of the present disclosure. Therefore, the previous description and drawings are intended only as examples.

Claims

1. A cleaning device for cleaning electronic substrates including printed circuit boards and semiconductor product components, the cleaning device comprising: at least one cleaning module configured to process an electronic substrate; as well as a conveyor system configured to transport the electronic substrate through the at least one cleaning module, The at least one cleaning module comprises: a spray system having a manifold connected to a fluid source and a plurality of spray bars fluidly coupled to the manifold, and An adjustable height spray system is configured to move the header and the plurality of spray bars up and down relative to the conveyor system.

2. The cleaning device according to claim 1, wherein: The adjustable height spray system includes a lift mechanism configured to automatically move the header and the plurality of spray bars between a raised position and a lowered position.

3. The cleaning device according to claim 2, wherein: The lifting mechanism comprises a linear actuator, and the linear actuator is mounted on a wall of the at least one cleaning module via a bracket.

4. The cleaning device according to claim 3, wherein: The linear actuator is controlled by a control module.

5. The cleaning device according to claim 3, wherein: The lifting mechanism further includes a link assembly having two pivoting link members, each pivoting link member being pivotally fixed to a wall of the cleaning module, and a connecting crossbar connecting ends of the pivoting link members.

6. The cleaning device according to claim 5, wherein: A first of the two pivot links is fixed to a first pivot rod extending through the wall of the cleaning module, and a second of the two pivot links is fixed to a second pivot rod extending through the wall of the cleaning module.

7. The cleaning device according to claim 5, wherein: The adjustable height spray system further includes a spray support mechanism configured to support the header and the spray bar.

8. The cleaning device according to claim 7, wherein: The spray support mechanism is coupled to the lifting mechanism via a first pivot rod coupled to the first pivot link and via a second pivot rod coupled to the second pivot link.

9. The cleaning device according to claim 8, wherein: The spray support mechanism includes a first support assembly connected to the first pivot rod and a second support assembly connected to the second pivot rod.

10. The cleaning device according to claim 9, wherein: The first support assembly includes at least one first pivot member configured to releasably engage a first support bracket, and The second support assembly includes at least one second pivot member configured to releasably engage a second support bracket, Wherein, the first supporting bracket and the second supporting bracket are fixed to the header.

11. The cleaning device according to claim 10, wherein: the at least one pivoting member of the first support assembly comprises two pivoting members, the two pivoting members being fixed to each other by a first pivoting cross member, and The at least one pivoting member of the second support assembly comprises two pivoting members, the two pivoting members being fixed to each other by a second pivoting cross member, Wherein, one of the first support bracket and the second support bracket is configured to be releasably secured to its corresponding first pivoting cross member and second pivoting cross member.

12. The cleaning device according to claim 1, wherein: The manifold includes an elongated manifold body having an opening connected to a fluid source and a plurality of ports extending along the length of the manifold body, the ports being configured to connect the manifold to the plurality of spray bars.

13. The cleaning device of claim 12, wherein: Each spray bar includes an inlet port formed in the spray bar at the middle of the spray bar, and each spray bar is fluidly connected to a corresponding port of the manifold by a quick-connect clamp.

14. A method for cleaning an electronic substrate using the cleaning device according to claim 1, the method comprising: conveying the electronic substrate through the at least one cleaning module via the conveyor system; adjusting the height of the header and the plurality of spray bars using the adjustable height spray system; as well as A cleaning operation is performed using the at least one cleaning module.

15. A spraying system for a cleaning module of a cleaning device for cleaning electronic substrates including printed circuit boards and semiconductor product components, the spraying system comprising: a header connected to a fluid source; a plurality of spray bars fluidly coupled to the header; as well as An adjustable height spray system is configured to move the header and the plurality of spray bars up and down relative to the conveyor system.

16. The spray system of claim 15, wherein: The adjustable height spray system includes a lift mechanism configured to automatically move the header and the plurality of spray bars between a raised position and a lowered position.

17. The spray system of claim 16, wherein: The lifting mechanism comprises a linear actuator, and the linear actuator is mounted on a wall of the at least one cleaning module via a bracket.

18. The spray system of claim 17, wherein: The lifting mechanism further includes a link assembly having two pivoting link members, each pivoting link member being pivotally fixed to a wall of the cleaning module, and a connecting crossbar connecting ends of the pivoting link members.

19. The spray system of claim 18, wherein: A first of the two pivot links is fixed to a first pivot rod extending through the wall of the cleaning module, and a second of the two pivot links is fixed to a second pivot rod extending through the wall of the cleaning module.

20. The spray system of claim 16, wherein: The adjustable height spray system further includes a spray support mechanism configured to support the header and the spray bar.

21. The spray system of claim 20, wherein: The spray support mechanism is coupled to the lifting mechanism via a first pivot rod and a second pivot rod.

22. The spray system of claim 21, wherein: The spray support mechanism includes a first support assembly connected to the first pivot rod and a second support assembly connected to the second pivot rod.

23. The spray system of claim 22, wherein: The first support assembly includes at least one pivot member configured to releasably engage a first support bracket, and The second support assembly includes at least one pivot member configured to releasably engage a second support bracket, Wherein, the first supporting bracket and the second supporting bracket are fixed to the header.

24. The spray system of claim 23, wherein: The at least one pivot member of each of the first support assembly and the second support assembly includes two pivot members connected to each other by a pivot cross member, wherein one of the pivot cross members is retained in place by a clamping assembly of the corresponding support bracket.

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