Display device

Abstract

The display device comprises a display module, a shell and a supporting piece, the display module comprises an array substrate, a packaging substrate and packaging glue, and the packaging glue is arranged between the array substrate and the packaging substrate and makes contact with the array substrate and the packaging substrate; the display module is installed on the shell, and the array substrate is arranged close to the shell; the supporting piece is arranged between the array substrate and the shell and is close to the packaging adhesive.

Description

Technical Field

[0001] The present application belongs to the technical field of electrical equipment, and in particular, relates to a display device. Background Art

[0002] Display devices are widely used in daily life, especially wearable devices. Wearable devices are widely used by users due to their small size and light weight, such as bracelets and watches. Wearable devices are used frequently and have more stringent strength requirements. In order to improve the strength of use, some display devices use hard panels to package display modules. Hard packaging panels are prone to broken screens when encountering strong impacts. The display device provided in the embodiment of the present application can improve the above problems. The display device provided in the embodiment of the present application can improve the strength of the display device and reduce the risk of broken screens on the display device. Summary of the invention

[0003] The present application aims to solve the technical problem of broken screen of display module at least to a certain extent. To this end, the present application provides a display device.

[0004] In a first aspect, an embodiment of the present application provides a display device, including:

[0005] A display module, comprising an array substrate, a packaging substrate and a packaging adhesive, wherein the packaging adhesive is arranged between the array substrate and the packaging substrate and contacts the array substrate and the packaging substrate;

[0006] A housing, the display module is mounted on the housing, and the array substrate is disposed close to the housing;

[0007] The support member is arranged between the array substrate and the housing and is close to the packaging glue.

[0008] Since most array substrates and packaging substrates use glass frame glue as packaging glue for welding, no grooving is required, the ability to block water and oxygen is good, and the process is simple. Since the glass frame glue is an inorganic material, laser sintering is required to bond the array substrate and the packaging substrate, and laser sintering will inevitably cause thermal stress on the surrounding packaging substrates due to local high temperature near the packaging glue. Due to the existence of thermal stress, when the whole machine is mechanically tested, the area around the packaging glue will become the weakest part of the whole machine. Setting the support close to the packaging glue can increase the strength around the packaging glue, reduce the risk of broken screen of the display module, and increase the service life of the display module.

[0009] In an optional embodiment of the present application, the distance between the support member and the packaging glue is less than or equal to 0.2 mm.

[0010] In an optional embodiment of the present application, the packaging glue ring is arranged between the array substrate and the packaging substrate, and there are multiple support members, and the multiple support members are arranged around the packaging glue at intervals along the trajectory of the packaging glue.

[0011] In an optional embodiment of the present application, the plurality of support members are all arranged on the inner side of the support member.

[0012] In an optional embodiment of the present application, the display module further includes a circuit board, the circuit board is arranged on a side of the array substrate close to the housing, and the support member is staggered with respect to the circuit board.

[0013] In an optional embodiment of the present application, the support member includes a first support segment and a second support segment connected to each other, the cross-sectional area of ​​the first support segment is larger than the cross-sectional area of ​​the second support segment, one end of the first support segment away from the second support segment contacts the array substrate, and one end of the second support segment away from the first support segment contacts the circuit board assembly.

[0014] In an optional embodiment of the present application, the first support segment is cylindrical, and the diameter of the first support segment is 0.15 mm to 0.3 mm.

[0015] In an optional embodiment of the present application, the support member is made of silicone and / or rubber.

[0016] In an optional embodiment of the present application, the hardness of the support member is 10 Shore hardness to 80 Shore hardness.

[0017] In an optional embodiment of the present application, a mounting cavity is provided on the shell, and the display module and the support member are disposed in the mounting cavity.

[0018] In an optional embodiment of the present application, the shell includes a middle frame and an outer frame, the display module also includes a cover plate, the outer frame has an installation channel, the middle frame is connected to one end of the installation channel, and the cover plate covers the other end of the installation channel, and the shell, the middle frame and the cover plate form the installation cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 A schematic diagram of the structure of a display device provided in an embodiment of the present application is shown.

[0021] Figure 2 The display device provided by the embodiment of the present application is shown in Figure 1 Cross-sectional view of the AA plane.

[0022] Figure 3 A schematic structural diagram of a support member of a display device provided in an embodiment of the present application is shown.

[0023] Figure numerals: 100-display device, 110-display module, 111-cover plate, 112-array substrate, 114-packaging substrate, 115-packaging glue, 116-device area, 117-circuit board, 118-polarizer, 119-adhesive layer, 120-support member, 122-first supporting section, 124-second supporting section, 130-housing, 132-installation cavity, 134-middle frame, 136-outer frame. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0025] It should be noted that all directional indications in the embodiments of the present application are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0026] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0027] In addition, in this application, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0028] Display devices are widely used in daily life, especially wearable devices. Wearable devices are widely used by users due to their small size and light weight, such as bracelets and watches. Wearable devices are used frequently and have more stringent strength requirements. In order to improve the strength of use, some display devices use hard panels to package display modules. Hard packaging panels are prone to broken screens when encountering strong impacts. The display device provided in the embodiment of the present application can improve the above problems. The display device provided in the embodiment of the present application can improve the strength of the display device and reduce the risk of broken screens on the display device.

[0029] Specifically, the display module includes an array substrate and a packaging substrate. Most array substrates and packaging substrates are welded with glass frame glue as the packaging glue, without grooving, with good water and oxygen blocking ability and simple process. Since the glass frame glue is an inorganic material, laser sintering is required to bond the array substrate and the packaging substrate, and laser sintering will inevitably cause thermal stress on the surrounding packaging substrates due to local high temperature near the packaging glue. Due to the presence of thermal stress, when the whole machine is mechanically tested, the area around the packaging glue will become the weakest part of the whole machine. Because when the ball drop experiment is carried out, the failure rate of the packaging substrate around the packaging glue will reach more than 80%, resulting in the easy breakage of the entire display module. The display device provided in the embodiment of the present application can improve the above-mentioned problems. The display device provided in the embodiment of the present application can improve the support strength of the display device, reduce the risk of broken screen of the display module, and increase the service life of the entire display device.

[0030] The present application is described below with reference to the accompanying drawings and specific embodiments:

[0031] Please refer to Figure 1 and Figure 2 The embodiment of the present application provides a display device 100. The display device 100 provided by the embodiment of the present application can improve the supporting strength of the display device, reduce the risk of the display module 110 being broken, and improve the service life of the entire display device 100.

[0032] The display device 100 may be a wearable device, such as a watch, a bracelet, etc., or an electronic product such as a mobile phone, a tablet computer, a laptop computer, a desktop computer, etc. It may also be other household appliances.

[0033] In an embodiment of the present application, the display device 100 includes: a display module 110, a shell 130 and a support member 120, the display module 110 includes an array substrate 112, a packaging substrate 114 and a packaging glue 115, the packaging glue 115 is arranged between the array substrate 112 and the packaging substrate 114, and is in contact with the array substrate 112 and the packaging substrate 114; the display module 110 is installed on the shell 130, and the array substrate 112 is arranged close to the shell 130; the support member 120 is arranged between the array substrate 112 and the shell 130, and is arranged close to the packaging glue 115.

[0034] The packaging glue 115 is in contact with the array substrate 112 and the packaging substrate 114 respectively. The packaging glue 115 can be connected to the array substrate 112 and the packaging substrate 114, and the connection can be fixed or detachable. In addition, there can be no direct connection relationship, and the packaging glue is squeezed between the array substrate 113 and the packaging substrate 114.

[0035] Since most array substrates 112 and packaging substrates 114 are welded with glass frame glue as packaging glue 115, no grooving is required, the ability to block water and oxygen is good, and the process is simple. Since the glass frame glue is an inorganic material, laser sintering is required to bond the array substrate 112 and the packaging substrate 114, and laser sintering will inevitably cause thermal stress on the surrounding packaging substrate 114 due to local high temperature near the packaging glue 115. Due to the existence of thermal stress, when the whole machine is mechanically tested, the area around the packaging glue 115 will become the weakest part of the whole machine. Placing the support member 120 close to the packaging glue 115 can increase the strength around the packaging glue 115, reduce the risk of broken screen of the display module 110, and increase the service life of the display module 110.

[0036] In the embodiment of the present application, the support member 120 is arranged between the shell 130 and the display module 110. When the display module 110 is impacted, the support member 120 can provide a certain supporting force to support the display module 110 and reduce the risk of the packaging substrate 114 of the display module 110 being broken.

[0037] In the embodiment of the present application, the support member 120 can be an elastic support member 120. When the display module 110 is impacted by external force, the display module 110 moves toward the direction close to the shell 130, so that the support member 120 is compressed, which can play a certain buffering role on the display module 110 and reduce the risk of the display module 110 being broken.

[0038] In addition, multiple support members 120 can be provided, and the multiple support members 120 can support the display module 110 from different positions of the display module 110. The arrangement of the multiple support members 120 can be the same as the shape of the display module 110, or can be related to the shape of the packaging glue 115, and can be flexibly arranged according to different products.

[0039] It is easy to understand that the packaging glue 115 is arranged between the array substrate 112 and the packaging substrate 114, and the support member 120 is arranged between the array substrate 112 and the shell 130. Although the support member 120 is arranged close to the packaging glue 115, the support member 120 is not in contact with the packaging glue 115. The support member 120 is in contact with the array substrate 112, and plays a certain supporting role on the packaging substrate 114 through the array substrate 112.

[0040] In some embodiments, one end of the support member 120 is fixedly connected to the housing 130 , and the other end is fixedly connected to a side of the array base 112 away from the packaging substrate 114 .

[0041] In some embodiments, the distance between the projection of the support member 120 on the array substrate 112 and the projection of the packaging glue 115 on the array substrate 112 is less than or equal to 0.2 mm.

[0042] Since the packaging panel around the support member 120 is prone to breakage when subjected to impact, the support member 120 can be set as close to the packaging glue 115 as possible, can be staggered with the packaging glue 115, or can be set directly below the packaging glue 115, as long as the distance between the support member 120 and the packaging glue 115 is less than 0.2 mm.

[0043] Since the encapsulation glue 115 is an inorganic material, laser sintering is required to bond the array substrate 112 and the encapsulation substrate 114. During the laser sintering process, thermal stress will exist on the encapsulation substrate 114 near the encapsulation glue 115. Due to the existence of thermal stress, the encapsulation substrate 114 in this area will become the weakest place in the entire display module 110. The distance between the support member 120 and the encapsulation glue 115 is less than or equal to 0.2 mm, which can provide certain support for the display module 110 in this area, and can provide support and buffering when the display module 110 is subjected to external force, thereby reducing the risk of damage to the display module 110.

[0044] It should be noted that the distance between the support member 120 and the packaging glue 115 can be the straight-line distance between the two, or the distance between the projections of the two on the housing 130 and the array substrate 112 .

[0045] In some embodiments, the packaging glue 115 is disposed between the array substrate 112 and the packaging substrate 114 , and there are multiple support members 120 . Along the trajectory of the packaging glue 115 , the multiple support members 120 are sequentially disposed around the packaging glue 115 .

[0046] The encapsulation glue 115 needs to encapsulate the array substrate 112 and the encapsulation substrate 114 to encapsulate the electronic components on the array substrate 112, that is, the encapsulation glue 115 needs to be arranged on the periphery of the array substrate 112 and the encapsulation substrate 114, and is arranged in a ring between the array substrate 112 and the encapsulation substrate 114. The strength of the encapsulation substrate 114 around the encapsulation glue 115 is the weakest, therefore, the support member 120 is arranged along the track of the encapsulation glue 115, which can support the display module 110 around the encapsulation glue 115 and improve the strength of the display module 110.

[0047] It should be noted that the packaging glue 115 is arranged between the array substrate 112 and the packaging substrate 114, which means that the packaging glue 115 is in a closed shape, which is not necessarily circular, and can be other structures such as rectangle, trapezoid, etc., as long as the packaging glue 115 is in a closed shape.

[0048] A plurality of support members 120 are disposed around the encapsulation glue 115 . There may be a certain distance between the support members 120 and the encapsulation glue 115 , or the support members 120 may be supported and disposed directly below the encapsulation glue 115 .

[0049] The plurality of support members 120 are arranged at intervals, and the distance between any two adjacent support members 120 may be equal or unequal, and may be arranged according to the shape of the packaging glue 115 and the layout of the entire display module 110 .

[0050] In some embodiments, the encapsulation glue 115 is roughly rectangular. In order to improve the supporting effect on the display module 110, a support member 120 can be set at each of the four corners of the encapsulation glue 115, and at least one support member 120 can be set on the long side of the encapsulation glue 115. The wide side of the encapsulation glue 115 can be set according to the actual layout of the electronic components.

[0051] In some embodiments, the plurality of support members 120 are disposed inside the packaging adhesive 115 .

[0052] Among them, the volume and size of the display module 110 are basically very small, and the support member 120 can be set on the inner side of the packaging glue 115, which can reasonably utilize the space of the display module 110, reduce the size of the outer side of the packaging glue 115, and reduce the volume of the display module 110 as much as possible.

[0053] Specifically, the encapsulation glue 115 is mainly used to seal the electronic components disposed on the array substrate 112. The electronic components are disposed on the inner side of the encapsulation glue 115, and the outer side of the encapsulation glue 115 is basically not used. The size of the outer side of the encapsulation glue 115 can be as small as possible, thereby reducing the size of the display module 110. If the support member 120 is disposed on the outer side of the encapsulation glue 115, a certain space needs to be left on the outer side of the display module 110, resulting in an increase in the size of the display module 110. By disposing the support member 120 on the inner side of the encapsulation glue 115, the display module 110 can be supported without occupying additional space of the display module 110, thereby miniaturizing the display module 110.

[0054] It is easy to understand that the packaging glue 115 is ring-shaped, and the multiple support members 120 are arranged on the inner side of the packaging glue 115, which means that the multiple support members are arranged inside the ring of the packaging glue 115.

[0055] In some embodiments, the display module 110 further includes a circuit board 117 . The circuit board 117 is disposed on a side of the array substrate 112 close to the housing 130 , and the support member 120 and the circuit board 117 are staggered.

[0056] The circuit board 117 is arranged on the outside of the array substrate 112, and is arranged on the side of the array substrate 112 away from the packaging substrate 114, that is, the circuit board 117 and the support member 120 are arranged on the same side of the array substrate 112. Similarly, since electronic components are arranged on the circuit board 117, when the display module 110 is impacted by external force, the array substrate 112 and the packaging substrate 114 as a whole will press the support member 120 downward. If the support member 120 contacts the circuit board 117, the electronic components arranged on the array substrate 112 will be pressed. The support member 120 and the circuit board 117 are staggered, which can reduce the damage to the electronic components on the circuit board 117 while supporting the display module 110, thereby increasing the service life of the whole device.

[0057] A device area 116 is provided on a side of the array substrate 112 away from the packaging substrate 114 . The circuit board 117 is installed in the device area 116 . A support member 120 may also be provided in the device area 116 , staggered from the circuit board 117 .

[0058] See also Figure 3 In some embodiments, the support member 120 includes a first support segment 122 and a second support segment 124 that are connected to each other, the cross-sectional area of ​​the first support segment 122 is greater than the cross-sectional area of ​​the second support segment 124, and one end of the first support segment 122 away from the second support segment 124 contacts the array substrate 112, and one end of the second support segment 124 away from the first support segment 122 contacts the circuit board 117 component.

[0059] It should be noted that the cross-sectional area of ​​the first support segment 122 refers to the cross-sectional area on a plane parallel to the housing 130, and similarly, the cross-sectional area of ​​the second support segment 124 also refers to the cross-sectional area on a plane parallel to the housing 130. If both the first support segment 122 and the second support segment 124 are cylindrical, the diameter of the first support segment 122 is greater than the diameter of the second support segment 124.

[0060] The cross-sectional area of ​​the first support segment 122 is greater than the cross-sectional area of ​​the second support segment 124, indicating that the contact area between the support member 120 and the array substrate 112 is greater than the contact area between the support member 120 and the housing 130. The first support segment 122 has a relatively large contact area with the array substrate 112, which can increase the contact area with the array substrate 112 and reduce the stress of the array substrate 112. When the display module 110 is subjected to a large external impact, the force can be dispersed, the risk of the package substrate 114 being broken is reduced, and the service life of the entire display module 110 and the display device 100 is increased.

[0061] In some embodiments, the first support segment 122 is cylindrical, and the diameter of the first support segment 122 is 0.15 mm to 0.3 mm.

[0062] Since the display modules 110 are mostly miniaturized structures, the size of the support member 120 should not be set too large. If the first support segment 122 is too large, it will squeeze other electronic components on the circuit board 117. If the first support segment 122 is set too small, it cannot play a role in supporting the display module 110. Setting the diameter of the first support segment 122 between 0.15 mm and 0.3 mm can not only play a supporting role, but also reduce damage to the electronic components of the display module 110 and increase the service life of the display module 110.

[0063] As for the length of the entire support member 120 , it can be set according to the specific size of the display module 110 and the installation space of the display device 100 , and no specific limitation is made thereto.

[0064] In addition, the first support segment 122 and the second support segment 124 are integrally formed, made of the same material and produced in the same process, and the integral formation of the two can improve production efficiency and reduce production costs.

[0065] In some embodiments, the support member 120 is made of at least one of silicone and / or rubber. The support member 120 is made of silicone or rubber, so that the support member 120 has a certain elasticity. When the display module 110 is impacted by an external force, the display module 110 presses the support member 120 toward the direction close to the housing 130. The support member 120 will be compressed after being subjected to the force, so that the display module 110 has a slight displacement close to the housing 130, and can have a certain buffer distance when impacted by an external force, thereby reducing the risk of the package substrate 114 being broken and increasing the service life of the whole machine.

[0066] In some embodiments, the hardness of the support member 120 is in the range of 10 Shore hardness to 80 Shore hardness.

[0067] The support member 120 is disposed between the display module 110 and the housing 130 and needs to have a certain hardness. If the hardness of the support member 120 is too low, it may cause a collision between the display module 110 and the housing 130, causing secondary damage to the display module 110. If the hardness of the support member 120 is too high, the support member 120 has no elasticity. When the display module 110 is impacted by an external force, the display module 110 and the support member 120 are in rigid contact, which also causes the risk of screen breakage. The support member 120 with a hardness of 10 to 80 Shore A can play a certain buffering role while supporting the display module 110 when the display module 110 is impacted by an external force, thereby reducing the risk of screen breakage of the display module 110 and increasing the service life of the display module 110.

[0068] Please refer to Figure 1 and Figure 2 In some embodiments, the display module 110 further includes a polarizer 118 , which is disposed above the packaging substrate 114 .

[0069] In some embodiments, a mounting cavity 132 is disposed on the housing 130 , and the display module 110 and the support member 120 are disposed in the mounting cavity 132 .

[0070] The display module 110 is disposed in the mounting cavity 132, which can provide some protection for the display module 110 and reduce the risk of collision and damage to the display module 110. One end of the support member 120 contacts the bottom wall of the mounting cavity 132, and the other end contacts the array substrate 112.

[0071] As for the connection method between the support member 120 and the display module 110 and the bottom wall of the installation cavity 132, they can be connected by bonding, by snapping, or by threaded screws.

[0072] Specifically, one end of the first support segment 122 away from the second support segment 124 can be bonded to the surface of the array substrate 112 , and one end of the second support segment 124 away from the first support segment 122 can be bonded to the bottom wall of the mounting cavity 132 .

[0073] In some embodiments, the shell 130 includes a middle frame 134 and an outer frame 136, the display module 110 also includes a cover plate 111, the outer frame 136 has an installation channel, the middle frame 134 is connected to one end of the installation channel, and the cover plate 111 covers the other end of the installation channel. The shell 130, the middle frame 134 and the cover plate 111 form an installation cavity 132.

[0074] The cover plate 111 is made of transparent material, and the display surface of the display module 110 is arranged toward the cover plate 111, and the user can see the picture arranged on the display surface through the transparent cover plate 111. The bottom wall of the installation cavity 132 is arranged on the middle frame 134, and the side wall of the installation cavity 132 is arranged on the outer frame 136.

[0075] The polarizer 118 is disposed toward the cover plate 111 and is connected to the cover plate 111 via an adhesive layer 119 .

[0076] The working principle of the display device 100 provided in the embodiment of the present application: In the embodiment of the present application, the entire display module 110 is installed in the installation cavity 132, and the display surface is arranged toward the cover plate 111. One end of the support member 120 is connected to the middle frame 134, and the other end is connected to the non-display surface of the display module 110. When the display module 110 is impacted by an external force, the support member 120 will be slightly compressed, and the display module 110 will produce a slight displacement in the direction close to the shell 130, which can buffer the external force. At the same time, the support member 120 can support the display module 110, reduce the risk of the display module 110 breaking the screen, and increase the service life.

[0077] In summary, the display device 100 provided in the embodiment of the present application, since most array substrates 112 and packaging substrates 114 are welded with glass frame glue as packaging glue 115, no grooving is required, the water and oxygen barrier ability is good, and the process is simple. Since the glass frame glue is an inorganic material, laser sintering is required to bond the array substrate 112 and the packaging substrate 114, and laser sintering will inevitably cause thermal stress in the surrounding packaging substrate 114 due to local high temperature near the packaging glue 115. Due to the presence of thermal stress, when the whole machine is mechanically tested, the area around the packaging glue 115 will become the weakest part of the whole machine. Arranging the support member 120 close to the packaging glue 115 can increase the strength around the packaging glue 115, reduce the risk of broken screen of the display module 110, and increase the service life of the display module 110.

[0078] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0079] In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0080] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A display device, characterized in that: include: A display module (110), comprising an array substrate (112), a packaging substrate (114) and a packaging adhesive (115), wherein the packaging adhesive (115) is arranged between the array substrate (112) and the packaging substrate (114), and is in contact with the array substrate (112) and the packaging substrate (114); A housing (130), the display module (110) being mounted on the housing (130), and the array substrate (112) being arranged close to the housing (130); The support member (120) is arranged between the array substrate (112) and the housing (130), and is arranged close to the packaging glue (115).

2. The display device according to claim 1, characterized in that The distance between the projection of the support member (120) on the array substrate (112) and the projection of the packaging glue (115) on the array substrate (112) is less than or equal to 0.2 mm.

3. The display device according to claim 1, characterized in that The packaging glue (115) is arranged in a ring between the array substrate (112) and the packaging substrate (114); there are a plurality of support members (120); and along the trajectory of the packaging glue (115), the plurality of support members (120) are arranged at intervals around the packaging glue (115).

4. The display device according to claim 3, characterized in that The plurality of support members (120) are all arranged on the inner side of the support member (120).

5. The display device according to claim 1, characterized in that The display module (110) further comprises a circuit board (117), wherein the circuit board (117) is arranged on a side of the array substrate (112) close to the housing (130), and the support member (120) and the circuit board (117) are arranged in a staggered manner.

6. The display device according to claim 1, characterized in that The support member (120) includes a first support segment (122) and a second support segment (124) which are connected to each other, the cross-sectional area of ​​the first support segment (122) is greater than the cross-sectional area of ​​the second support segment (124), one end of the first support segment (122) away from the second support segment (124) contacts the array substrate (112), and one end of the second support segment (124) away from the first support segment (122) contacts the circuit board (117) assembly.

7. The display device according to claim 6, characterized in that The first supporting section (122) is cylindrical, and the diameter of the first supporting section (122) is 0.15 mm to 0.3 mm.

8. The display device according to claim 1, characterized in that The support member (120) is made of silica gel and / or rubber.

9. The display device according to claim 1, characterized in that: The support member (120) has a hardness of 10 to 80 Shore hardness.

10. The display device according to any one of claims 1 to 9, characterized in that: The housing (130) is provided with a mounting cavity (132), and the display module (110) and the support member (120) are arranged in the mounting cavity (132).

11. The display device according to claim 10, characterized in that The housing (130) comprises a middle frame (134) and an outer frame (136); the display module (110) further comprises a cover plate (111); the outer frame (136) has a mounting channel; the middle frame (134) is connected to one end of the mounting channel; the cover plate (111) covers the other end of the mounting channel; the housing (130), the middle frame (134) and the cover plate (111) form the mounting cavity (132).

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