Macroscopic texturing of anodized coated surfaces

Abstract

A consumable component for a plasma processing chamber includes a plasma facing side. An engineered surface is formed in the plasma facing side of the consumable component. A plurality of raised features define the engineered surface, where features are disposed in a predetermined pattern, where each of the plurality of raised features includes a top region having an outer edge and a sidewall. A base surface of the engineered surface is configured to surround each of the plurality of raised features such that a respective sidewall of a respective raised feature extends upwardly at an angle from the base surface to a respective top region. The consumable component is configured to be mounted in the plasma processing chamber. The consumable component is configured to be exposed to a plasma and a by-product of the plasma.

Description

This application is a divisional application of application number 202080027826.0, application date February 5, 2020, and invention name “Macro-texturing of anodized coated surfaces”. Technical Field

[0001] The present embodiments relate to semiconductor substrate processing equipment tools, and more particularly, to improved coatings applied to consumable parts of processing equipment. Background Art

[0002] In semiconductor processing systems (e.g., plasma chambers), coated components within the plasma chamber are typically characterized by an aluminum surface that has been sandblasted to create random microfeatures to improve adhesion. The surface is then anodized and covered with a plasma-spray-resistant coating by plasma spraying. The surface finish is critical in determining the adhesion strength and durability of the sprayed coating. However, microroughening the surface by sandblasting does not provide sufficient adhesion for subsequently applied layers. For example, a major failure mode of the sprayed coating is delamination caused by the anodization of the underlying layer. Delamination can occur more frequently near areas of surface transition (e.g., corners, edges, etc.), where it promotes crack propagation in the sprayed coating due to a break in surface continuity. Once the coating begins to delaminate, the component is no longer usable because the damaged sprayed layer and exposed anodized aluminum cause metal contamination and particle defects on the wafer. Currently, failed / used components must undergo refurbishment to restore their in-house performance, or replacement parts must be ordered, which increases the operating costs of the semiconductor processing system.

[0003] In addition, byproducts of wafer processing may adhere to the surfaces of the semiconductor processing system. For example, byproducts may be produced during an etching process on a wafer or any other material performed in an etching chamber, which may then attach to components of the semiconductor processing system. Because the byproducts do not adhere firmly to the surfaces of the semiconductor processing system, these byproducts may then fall off and / or drop from these surfaces during subsequent wafer processing steps and deposit on the wafer surface. In one case, these byproducts adhering to the wafer surface cause contamination of at least a portion of the wafer surface. Depending on the extent of the contamination, a portion or all of the wafer may be defective, such that the damaged wafer surface may result in defective chips formed through wafer processing. In another case, the byproducts may adhere to the electrostatic chuck, and when the byproducts are non-conductive materials, the electrostatic chuck may be unable to clamp and / or hold the wafer.

[0004] The background description provided here is for the purpose of generally presenting the context of the present disclosure. No admission is made, either explicitly or implicitly, that the work of the presently designated inventors is prior art to the present disclosure to the extent that it is described in this background section and in aspects of the specification that were not determined to be prior art at the time the application was filed.

[0005] It is against this background that the embodiments of the present invention arise. Summary of the Invention

[0006] Embodiments of the present disclosure are directed to resolving one or more problems existing in the related art, and more particularly, to macrotexturing of plasma-facing surfaces, including consumable components, to increase the surface area of ​​the plasma-facing surfaces, thereby enhancing the adhesion of additional layers by creating additional bonding sites. Several inventive embodiments of the present disclosure are described below.

[0007] Embodiments of the present disclosure include a consumable part for a plasma processing chamber. The consumable part includes a plasma-facing side. An engineered surface is formed in the plasma-facing side of the consumable part. A plurality of raised features define the engineered surface. Features in the plurality of raised features are arranged in a predetermined pattern. Each of the plurality of raised features includes a top region having an outer edge and a sidewall. A base surface of the engineered surface surrounds each of the plurality of raised features such that a corresponding sidewall of a corresponding raised feature extends upward at an angle from the base surface to the corresponding top region. The consumable part is configured to be mounted in the plasma processing chamber. The consumable part is configured to be exposed to plasma and byproducts of the plasma.

[0008] Other embodiments of the present disclosure include a method for constructing an engineered surface of a consumable part configured to be installed in a plasma processing chamber. The method comprises: using a template to mask a plasma-facing side of the consumable part, wherein the template comprises a pattern of openings that provide access to the plasma-facing side. The method comprises: using a blasting medium through the template to differentially blast the plasma-facing side to produce a plurality of raised features defining the engineered surface, wherein the engineered surface is formed in the plasma-facing side. The features of the plurality of raised features are arranged above the engineered surface in a predetermined pattern. Each of the plurality of raised features comprises a top region having an outer edge and sidewalls. The base surface of the engineered surface surrounds each of the plurality of raised features such that the corresponding sidewalls of the corresponding raised features extend upward at an angle from the base surface to the corresponding top region. The consumable part is configured to be exposed to a plasma and byproducts of the plasma.

[0009] Another embodiment of the present disclosure includes a plasma processing chamber for processing a wafer, comprising: a bottom electrode configured to support the wafer; a top electrode located above the bottom electrode; and a consumable part. The consumable part includes a plasma-facing side. An engineered surface is formed in the plasma-facing side of the consumable part. A plurality of raised features define the engineered surface, wherein features in the plurality of raised features are arranged in a predetermined pattern, wherein each of the plurality of raised features includes a top region having an outer edge and a sidewall. A base surface of the engineered surface surrounds each of the plurality of raised features such that a corresponding sidewall of a corresponding raised feature extends upward at an angle from the base surface to a corresponding top region. The consumable part is configured to be mounted in the plasma processing chamber. The consumable part is configured to be exposed to plasma and byproducts of the plasma.

[0010] Those skilled in the art will appreciate these and other advantages from a reading of the entire specification and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The embodiments are best understood by referring to the following description when taken in conjunction with the accompanying drawings.

[0012] Figure 1A An exemplary plasma volume confinement etch chamber comprising at least one consumable component including an engineered surface having a macrotexture designed to increase the surface area of ​​the plasma-facing surface for better adhesion of additional layers and / or byproducts via additional bonding sites is shown according to one embodiment of the present disclosure.

[0013] Figure 1B Another example of an etch chamber comprising at least one consumable part including an engineered surface having a macrotexture designed to increase the surface area of ​​the plasma-facing surface for better adhesion of additional layers and / or byproducts via additional bonding sites is shown according to an embodiment of the present disclosure.

[0014] Figure 2 A cross-section of a consumable component of a plasma processing chamber is shown according to one embodiment of the present disclosure, showing an engineered surface with macrotexture designed to create additional bonding sites for better adhesion of additional layers and / or byproducts.

[0015] Figure 3is an illustration of a plasma confinement ring comprising an engineered surface having a macrotexture designed to create additional bonding sites for better adhesion of additional layers and / or byproducts, according to one embodiment of the present disclosure.

[0016] Figure 4A is a cross-sectional view of an engineered surface of a consumable part according to one embodiment of the present disclosure, the engineered surface having a macrotexture in the form of a plurality of raised features designed to create additional bonding sites for better adhesion of additional layers and / or byproducts.

[0017] Figure 4B is a cross-section of raised features of an engineered surface having a macrotexture designed to create additional bonding sites for better adhesion of additional layers and / or byproducts according to one embodiment of the present disclosure.

[0018] Figure 5 A flow chart is shown of a method for constructing an engineered surface of a consumable part having a macrotexture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or byproducts, according to one embodiment of the present disclosure.

[0019] Figure 6A One embodiment according to the present disclosure shows a process of sandblasting or bead blasting through a template for constructing an engineered surface of a consumable part having a macrotexture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or byproducts.

[0020] Figure 6B-1 One embodiment according to the present disclosure shows applying sandblasting or bead blasting at an angle to the plasma-facing side of a consumable part to create an engineered surface having a macrotexture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or byproducts.

[0021] Figure 6B-2 One embodiment according to the present disclosure shows applying sandblasting or bead blasting at multiple angles to the plasma-facing side of a consumable part to create an engineered surface having a macrotexture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or byproducts.

[0022] Figure 6CAn embodiment according to the present disclosure shows an engineered surface of a consumable part after applying a sandblast or beadblast treatment, wherein the engineered surface comprises a macrotexture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or byproducts.

[0023] Figure 7A One embodiment according to the present disclosure shows a consumable part comprising an anodized engineered surface covered with a plasma-resistant spray coating, the spray coating having a relatively flat surface exposed to plasma in a plasma processing system, the spray coating not conforming to the contours of the engineered surface having a macrotexture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or byproducts.

[0024] Figure 7B According to one embodiment of the present disclosure, a consumable part is shown comprising an engineered surface that is anodized and covered with a plasma-resistant spray coating, the spray coating having a surface exposed to plasma in a plasma processing system, the spray coating conforming to the contours of the engineered surface of the consumable part having a macrotexture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or byproducts.

[0025] Figure 8A A template and exemplary openings are shown according to one embodiment of the present disclosure that are configured to direct sandblasting or bead blasting media onto the plasma-facing side of a consumable part to create an engineered surface having a macrotexture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or byproducts.

[0026] Figure 8B According to one embodiment of the present disclosure, a template having a plurality of openings arranged in a pattern is shown for directing a sandblasting or bead blasting medium onto the plasma-facing side of a consumable part to create an engineered surface having a patterned macrotexture designed to create additional bonding sites for better adhesion of additional layers and / or byproducts.

[0027] Figure 8C According to one embodiment of the present disclosure, a template having a plurality of openings arranged in a dual-zone pattern is shown for directing sandblasting or bead blasting media onto the plasma-facing side of a consumable part to create an engineered surface having a patterned macrotexture designed to create additional bonding sites for better adhesion of additional layers and / or byproducts.

[0028] Figure 8DAccording to one embodiment of the present disclosure, a template having a plurality of openings arranged in a three-zone pattern is shown for directing sandblasting or bead blasting media onto the plasma-facing side of a consumable part to create an engineered surface having a patterned macrotexture designed to create additional bonding sites for better adhesion of additional layers and / or byproducts.

[0029] Figure 8E According to one embodiment of the present disclosure, a template having a plurality of openings arranged in a linear scale pattern is shown for directing sandblasting or bead blasting media onto the plasma-facing side of a consumable part to create an engineered surface having a patterned macrotexture designed to create additional bonding sites for better adhesion of additional layers and / or byproducts.

[0030] Figure 9A-1 An embodiment according to the present disclosure shows a uniformly arranged plurality of raised features having a uniform structure and height configured to build a conformal plasma spray resistant coating, wherein the raised features define an engineered surface having a patterned macrotexture designed to create additional bonding sites for better adhesion of additional layers and / or byproducts.

[0031] Figure 9A-2 One embodiment according to the present disclosure shows a plurality of raised features arranged uniformly with a density ratio of Figure 9A-1 The characteristics are low.

[0032] Figure 9B-1 One embodiment according to the present disclosure shows a plurality of raised features arranged uniformly, wherein the features have a uniform structure and a ratio Figure 9A-1 The raised features are of small height configured to build a relatively flat non-conformal plasma spray resistant coating, wherein the raised features define an engineered surface having a patterned macrotexture designed to create additional bonding sites for better adhesion of additional layers and / or byproducts.

[0033] Figure 9B-2 One embodiment according to the present disclosure shows a plurality of raised features arranged uniformly with a density ratio of Figure 9A-1 The characteristics are low.

[0034] Figure 9C-1 An embodiment according to the present disclosure shows a plurality of raised features arranged in two sub-patterns, wherein the features throughout the sub-patterns have a uniform structure and height, wherein the raised features define an engineered surface having a patterned macrotexture designed to create additional bonding sites for better adhesion of additional layers and / or byproducts.

[0035] Figure 9C-2 An embodiment according to the present disclosure shows a plurality of raised features arranged in two sub-patterns, wherein the features in each sub-pattern have a uniform structure and height, but may vary between the two sub-patterns, wherein the raised features define an engineered surface having a patterned macrotexture designed to create additional bonding sites for better adhesion of additional layers and / or byproducts.

[0036] Figure 9D An embodiment according to the present disclosure shows a plurality of raised features arranged in three sub-patterns, wherein the features throughout the sub-patterns have a uniform structure and height, wherein the raised features define an engineered surface having a patterned macrotexture designed to create additional bonding sites for better adhesion of additional layers and / or byproducts.

[0037] Figure 9E One embodiment according to the present disclosure shows a plurality of raised features arranged in a linearly scaled pattern such that the density of the features increases linearly, wherein the raised features define an engineered surface having a patterned macrotexture designed to create additional bonding sites for better adhesion of additional layers and / or byproducts.

[0038] Figure 10 An embodiment according to the present disclosure shows a process in which different templates are applied to the plasma-facing side of a consumable part for producing rounded edges in a patterned plurality of raised features.

[0039] Figure 11 is an electron micrograph of a cross-section of a consumable part according to one embodiment of the present disclosure, the consumable part comprising an engineered surface that is anodized and covered with a plasma spray resistant coating, the engineered surface having a macrotexture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers. DETAILED DESCRIPTION

[0040] Although the following detailed description contains many specific details for the purpose of illustration, it will be understood by those skilled in the art that many variations and modifications to the following details are within the scope of the present disclosure. Accordingly, the aspects of the present disclosure described below are set forth without losing the generality of the claims that follow this description and without imposing limitations thereon.

[0041] In general, the systems and methods described in many embodiments of the present disclosure provide novel methods for macrotexturing the surface of a consumable part. In embodiments of the present disclosure, macrotexturing adds patterned, large-scale features to or on the surface of a consumable part. In many embodiments, the consumable part can be a conventional bulk material (e.g., bare ceramic, bare aluminum, etc.), can be anodized (e.g., anodized aluminum), and can or can not have a plasma-sprayed coating applied. In embodiments, the intended effects of macrotexturing the plasma-facing surface of the consumable part include enhancing the adhesion of the sprayed coating (or the adhesion of additional layers) and / or the adhesion of byproducts. Macrotexturing increases the surface area of ​​the consumable part's surface, thereby enhancing the adhesion of subsequently applied layers (e.g., plasma-resistant coatings) by creating additional bonding sites (e.g., for improving the adhesion of yttrium oxide spray coatings). By improving adhesion strength, the coating life (and the life of the consumable part) can be extended, as one of the main sources of failure of consumable parts can be delamination of the sprayed coating from the underlying anodized layer on the consumable part's surface. Since plasma spray resistant coatings account for a significant portion of the cost of consumable parts, extending the life of consumable parts can significantly reduce the cost of ownership of plasma spray components (e.g., consumable parts) for the chamber body of a conductor etching chamber. This significantly increases the life and service life of consumable parts. In addition, since the service life of consumable parts between maintenance can be extended, tool downtime of the plasma processing system is reduced. Embodiments of the present disclosure provide the above advantages and further provide additional advantages because macrotexturing can lead to better capture and / or anchoring of byproducts formed during process steps, which enhances process performance because consumable parts are less likely to shed particles (e.g., byproducts) during their service life. Embodiments of the present disclosure provide the above advantages and provide additional advantages because macrotexturing (e.g., roughening) increases the crack resistance of the coating disposed over the modified surface of the consumable part. Still other embodiments of the present disclosure provide the above advantages and further provide the following features: macrotexturing introduces continuous and intentional breaks in the surface profile, which reduces the large in-plane stresses that develop and cause cracks in the subsequent sprayed coating. That is, macrotexturing improves stress reduction in films (e.g., spray coatings). Still other embodiments of the present disclosure provide the above advantages and further provide the following features: Macrotexturing increases the surface continuity of consumable parts (e.g., removes breaks in surface continuity), particularly near surface transitions (e.g., corners, edges, etc.). By increasing surface continuity, cracks in the prepared surface (e.g., spray coatings) that are caused by breaks in surface continuity are prevented from initiating / propagating through the surface.

[0042] Embodiments of the present disclosure provide for macrotexturing of a surface of a consumable part (e.g., a plasma-facing surface), wherein the consumable part can be any component present within a semiconductor processing assembly (e.g., a plasma processing chamber). In some cases, the consumable part can be removably positioned within the plasma processing chamber. Thus, the consumable part can be removed for repair and / or replacement. In this way, the lifespan and / or service life of the plasma processing chamber can be increased. For purposes of illustration, the following list provides examples of consumable parts present within a plasma processing chamber and is not exhaustive and includes: a liner configured to protect the interior wall of the plasma processing chamber, one or more portions of a C-shaped shield, one or more portions of a plasma confinement ring, a focus ring, an edge ring, an electrostatic semiconductor wafer holding / clamping system, an upper electrode, a bottom electrode, a susceptor configured to support a wafer, and the like. In other cases, embodiments of the present disclosure can be provided on any plasma-facing surface present within a semiconductor processing assembly, wherein the surface can be located on a consumable part or a fixed component.

[0043] Embodiments of the present disclosure relate to plasma processing modules, such as modules for use in: plasma etching chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, bevel edge etching chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, plasma enhanced chemical vapor deposition (PECVD) chambers or modules, atomic layer etch (ALE) chambers or modules, ion implantation chambers or modules, track chambers or modules, and any other semiconductor processing system that can be associated with or used in the processing and / or manufacture of semiconductor wafers to include processes such as electroplating, electroetching, electropolishing, electrochemical mechanical polishing, deposition, wet deposition, and through-silicon via (TSV) processing. Furthermore, embodiments of the present disclosure are not limited to the examples provided herein, but can be implemented in different plasma processing systems using different configurations, geometries, and plasma generation technologies (e.g., inductively coupled systems, capacitively coupled systems, electron cyclotron resonance systems, microwave systems, etc.). Examples of plasma processing systems and plasma processing modules are disclosed in commonly owned US Patent Nos. 8,862,855, 8,847,495, and 8,485,128, and US Patent Application Serial No. 15 / 369,110.

[0044] With a general understanding of the various embodiments described above, exemplary details of the embodiments will now be described with reference to a variety of figures. Elements and / or components with similar reference numbers in one or more figures generally have the same configuration and / or function. In addition, the figures may not be drawn to scale, but are intended to illustrate and emphasize novel concepts. Obviously, embodiments of the present invention can be practiced without some or all of these specific details. In other cases, well-known processing operations will not be described in detail to avoid unnecessarily obscuring the understanding of the embodiments herein.

[0045] According to one embodiment of the present disclosure, Figure 1A An exemplary plasma processing chamber 100A (e.g., a plasma volume confinement etch chamber) is shown including at least one consumable component including an engineered surface having a macrotexture designed to increase the surface area of ​​the plasma-facing surface for better adhesion of additional layers and / or byproducts through additional bonding sites. The plasma processing chamber 100A includes a top electrode 142 and a bottom electrode 144 on which a semiconductor wafer 146 is disposed. The etch chamber 100A is shown configured for small plasma volume confinement, wherein a plasma confinement ring 160 is disposed to define lateral boundaries of a small plasma volume confinement region 145. The top electrode 142 and the bottom electrode 144 on which the semiconductor wafer 146 is disposed define the top and bottom boundaries, respectively, of the small plasma confinement region 145.

[0046] The configurable plasma processing chamber 100A includes an outer plasma confinement structure 162, which functions as the plasma confinement structure 162 when the plasma processing chamber 100A is configured for a large plasma volume. When the plasma processing chamber 100A is configured for a small volume, the outer plasma confinement structure 162 remains in place to provide a redundant baffle through which neutral species of the plasma must pass when being exhausted from the etch chamber via the turbo pump 202.

[0047] In one embodiment, the plasma confinement ring 160 is configured to extend between the periphery of the upper electrode 142 and the periphery of the lower electrode 146, so that the plasma generated by ionizing the reactive gas using applied RF energy is confined within a small plasma volume confinement region 145, wherein the small plasma volume confinement region 145 is defined between the confinement ring 160 and the electrodes 142, 144 directly above the surface of the wafer 146. The plasma confinement ring 160 can define a slotted confinement shield composed of a plurality of circular rings 160. The circular rings 160 are composed of a dielectric (such as silica or quartz), and adjacent rings are separated by spacers 170, thereby forming circumferential slots or channels between the plurality of circular rings 160, through which neutral species of the plasma are exhausted. The circumferential slots thereby form parallel channels that are spaced perpendicular to the flow of plasma or gas through the parallel channels.

[0048] Similarly, spacer 170 is constructed of a dielectric (e.g., silica or quartz) or a conductive material (e.g., silicon carbide or doped silicon), and the slots or channels are configured to extinguish any ionic particles remaining in the exhaust gas that flows through confinement ring 160 and through chamber 100A for exhaust via turbo pump 202. In one embodiment, plasma confinement rings 160 are connected by shaft 179. Shaft 179 can be constructed of a lightweight, low-particle generating material (e.g., nylon) and is configured to support confinement ring 160 and spacer 170. Spacer 170 is configured to telescope around shaft 179 and between confinement rings 160 to create a desired gap between the rings to neutralize any ionic particles or electrons in the plasma that may pass through the slots or channels as plasma confinement ring 160 extends to define small plasma volume confinement region 145.

[0049] Plasma confinement rings 160, spacers 170, and shafts 179 collectively form confinement assembly 173. When confinement assembly 173 is retracted to configure large plasma volume confinement region 145, shafts 179 are retracted from confinement region 145, causing spacers 170 to fold within adjacent rings 160, thereby folding the stack of plasma confinement rings 160. In particular, the boundaries of the resulting large plasma volume extend to chamber liner 164 and outer plasma confinement structure 162 disposed within plasma processing chamber 100A.

[0050] Plasma protection chamber liners 164, 166 may be incorporated to provide thermal stability, adequate RF ground return paths, and durability with minimal downtime. The chamber liners 164, 166 may also be configured to provide additional protection to the walls of the plasma processing chamber 100A so that the liners are exposed to the plasma process, rather than the walls. The upper chamber liner 164 is configured to line the outer plasma confinement structure 162, while the lower chamber liner 166 is configured to line the lower region of the plasma processing chamber wall, from the outer plasma confinement structure 162 to the bottom of the etch chamber 100A and the exhaust of the turbo pump 202.

[0051] Embodiments of the present disclosure may be found in Figure 1A is performed on any plasma-facing surface shown. For illustration, Figure 1A The plasma-facing surfaces shown in FIG. 1 may include, but are not limited to, chamber liner 164 , chamber liner 166 , top electrode 142 , bottom electrode 144 , and components of confinement assembly 173 .

[0052] Figure 1B Another example of a plasma processing chamber 100B (e.g., an etch chamber) including at least one consumable component including an engineered surface having a macrotexture designed to increase the surface area of ​​the plasma-facing surface for better adhesion of additional layers and / or byproducts through additional bonding sites is shown according to an embodiment of the present disclosure. Specifically, the plasma processing chamber 100B may include a top central electrode 106, a top outer electrode 104, a bottom central electrode 108, and a bottom outer electrode 110, positioned within a plasma processing chamber 149 and surrounded by a chamber wall 150. A bottom insulating ring 112 insulates the bottom central electrode 108 from the bottom outer electrode 110. Ring 112 may be or may include an edge ring and / or a focus ring. Also positioned within the plasma processing chamber 149, a substrate 146 is positioned above the bottom central electrode 108. The bottom central electrode 108 provides an electrostatic chuck (ESC) to hold the substrate 146. In this embodiment, the bottom outside electrode 110 and the top outside electrode 104 have apertures that have a larger diameter than the substrate 146 , so the substrate 146 is positioned within the apertures.

[0053] Gas source 124 is connected to plasma processing chamber 149 and supplies etching gas into plasma region 140 of plasma processing chamber 149 during wafer processing (e.g., etching process). Bias RF source 148, first excitation RF source 152, and second excitation RF source 156 are electrically connected to plasma processing chamber 149 via controller 135 to provide power to electrodes 104, 106, 108, and 110. Bias RF source 148 generates bias RF power and supplies it to plasma processing chamber 149. First excitation RF source 152 generates source RF power and supplies it to plasma processing chamber 149. In addition to the RF power generated by first excitation RF source 152, second excitation RF source 156 generates another source RF power and supplies it to plasma processing chamber 149. Different RF signals can be supplied to various combinations of top and bottom electrodes. In this example, the top electrode is grounded, and power is supplied only to bottom center electrode 108.

[0054] A C-shaped shield 114 extends from the top outer electrode 104 to the bottom outer electrode 110 to provide additional plasma confinement. The C-shaped shield 114 has a plurality of apertures 102 to allow gas and plasma to flow out of the C-shaped shield 114. In this embodiment, the C-shaped shield 114 is grounded.

[0055] The upper temperature controller 171 provides independent temperature control for the top central electrode 106 and the top outer electrode 104. The lower temperature controller 172 provides independent temperature control for the bottom central electrode 108 and the bottom outer electrode 110. In one embodiment, the top outer electrode 104 and the C-shaped shield 114 can be maintained at the same temperature by the same setting of the upper temperature controller 171.

[0056] The controller 135 is connected to the gas source 124, the bias RF source 148, the upper temperature controller 171, the lower temperature controller 172, the exhaust pump 120, the first excitation RF source 152, and the second excitation RF source 156. The controller 135 controls the flow of etching gas into the plasma processing chamber 149, the chamber pressure, and the RF power generation from the three RF sources 148, 152, and 156, the electrodes 104, 106, 108, and 110, and the exhaust pump 120.

[0057] The top center electrode 106 also serves as a gas distribution plate that is connected to the gas source 124 and serves as a gas inlet for the gas from the gas source 124. The exhaust pump 120 serves as a gas outlet for removing gas from the top center electrode 106, through the plasma region 140, through the orifice 102, and to the exhaust pump 120. The exhaust pump 120 can assist in controlling the pressure.

[0058] Embodiments of the present disclosure may be found in Figure 1B is performed on any plasma-facing surface shown. For illustration, Figure 1B The plasma-facing surfaces shown in the figure may include, but are not limited to, a top central electrode 106, a top outer electrode 104, a bottom central electrode 108, and a bottom outer electrode 110, an insulating ring 112, an edge ring, a focus ring, and an electrostatic semiconductor wafer holding / clamping system (e.g., an electrostatic chuck ESC), a C-shaped cover 114.

[0059] Figure 2 A cross-section of a consumable component 210 of a plasma processing chamber is shown according to one embodiment of the present disclosure, showing an engineered surface 300 having a macrotexture designed to create additional bonding sites for better adhesion of additional layers and / or byproducts. Figure 2 FIG2 is an illustration of an engineered surface 300 formed as the plasma-facing side of a consumable component 210, wherein the engineered surface 300 includes a macrotexture that adds patterned, large-scale features extending from a substrate surface 350. The consumable component 210 is configured to be mounted in a plasma processing chamber. In one embodiment, the consumable component 210 is removably positioned in the plasma processing chamber. More specifically, the consumable component 210 is configured to be exposed to the plasma and plasma byproducts during wafer processing (e.g., etching, deposition, etc.). In one embodiment, the consumable component 210 is made of a conductive material (e.g., an aluminum alloy). In another embodiment, the consumable component is made of a dielectric material (e.g., a ceramic).

[0060] As shown, consumable component 210 includes a substrate surface 350 that includes a macrotexture. The substrate surface 350, which has been textured to form the engineered surface 300 and any other processing layers, can be exposed to plasma during wafer processing. In particular, the macrotexture includes a plurality of raised features 440 that define an engineered surface arranged in a predetermined pattern. That is, features in the plurality of raised features 440 are arranged in a predetermined pattern, for example, above the substrate surface 350. In embodiments, patterning the substrate surface 350 of consumable component 210 for coating adhesion and / or byproduct adhesion is a low-cost, easy-to-perform, and repeatable method. Instead of providing indiscriminate microtexturing (e.g., microscopic surface roughening applied via indiscriminate sandblasting) to promote adhesion as is performed in current techniques, embodiments of the present disclosure provide macrotexturing of the consumable substrate surface 350 to form an engineered surface 300, wherein macrofeatures are patterned on the substrate surface 350 to promote coating adhesion (e.g., adhesion to the substrate surface and / or an anodized layer above the substrate surface), and / or to promote enhanced anchoring of byproducts to the consumable during wafer processing (e.g., anchoring to the substrate surface, anodized substrate surface, and / or a sprayed coating above or on the substrate surface). In embodiments, the macrofeatures may be formed by masking, as well as media blasting, machining, wet chemical etching via a template or mask, selective deposition methods, additive manufacturing, and the like, as further described below. In many embodiments, the consumable part can be a conventional bulk material (e.g., bare ceramic, bare aluminum, etc.), can be anodized (e.g., anodized aluminum), and may or may not have a coated plasma sprayed layer. In embodiments, the intended effect of macro-texturing the plasma-facing surface of the consumable part includes enhancing sprayed layer adhesion (or adhesion of additional layers) and / or byproduct adhesion. For example, byproducts can be formed during an etching process, where the byproducts can adhere to one or more components of the corresponding plasma processing chamber (e.g., a plasma confinement liner). As an illustration, the features provided by the macro-texturing are approximately 5 to 100 times the size of the features provided by the previously generated micro-texturing. In embodiments, the size of the macro-features ranges from 0.1 mm to 3.0 mm. In other embodiments, the size of the macro-features ranges from 0.2 mm to 2.5 mm. In still other embodiments, the size of the macro-features ranges from 0.2 mm to 1.3 mm. In other embodiments, the size of the macro-features ranges from 0.3 mm to 1.0 mm.

[0061] Furthermore, multiple microfeatures can be applied indiscriminately to multiple raised features. For example, the multiple raised features can be roughened by applying bead blasting and / or sand blasting to build microfeatures into the multiple raised features. Additional microtexturing (e.g., roughening of macrofeatures) can enhance the crack resistance (e.g., better adhesion) of a coating disposed over the engineered surface.

[0062] In one embodiment, the patterned macrofeatured substrate surface 350 is then optionally anodized to provide anodized layer 220. That is, the engineered surface 300 is anodized. For example, in one embodiment, the consumable component is an aluminum alloy, and the engineered surface 300 is formed from the aluminum alloy. During the anodizing process, the aluminum alloy is anodized, for example, by an electrolytic passivation process. For example, anodizing the metal increases the thickness of the native oxide layer on the surface. In one embodiment, the contours of the macrofeatures are exposed through the anodized layer 220, so that the form factor of the macrofeatures is reflected through the anodized layer. That is, the anodized layer 220 conforms to the contours of the plurality of raised features 440.

[0063] In particular, the surface of the anodized layer 220 is altered by the presence and exposure of the macrofeatures. In this way, the surface area of ​​the consumable component's base surface 350 is increased, and the surface area of ​​the anodized layer 220 is also increased. That is, the surface topography of the anodized layer 220 becomes distorted. The combined effect of the increased surface area and the irregular surface topography serves to break down internal stresses in the plasma-spray-resistant coating 230, thereby improving the adhesion of the sprayed coating 230 to the anodized layer 220. Thus, the benefits of the macrofeatures exposed through the anodized layer 220 (e.g., exposed contours) can be used to provide better and enhanced adhesion of additional layers, such as through additional bonding sites.

[0064] Furthermore, in another embodiment, a plasma-resistant thermal spray coating 230 is optionally applied to the anodized layer 220. For example, the spray coating can be a yttrium-based spray coating (e.g., yttrium oxide) on an anodized consumable part 210 (e.g., an anodized aluminum alloy of the consumable part). The coating 230 can be applied by a thermal spray process in which a heated material is sprayed onto a surface. In one application, the spray coating is heated by an electrical (e.g., plasma or arc) or chemical (e.g., combustion) process. In an embodiment of the present disclosure, the macrofeatures defining the engineered surface 300 (e.g., formed as the substrate surface 350) enhance adhesion of the plasma-resistant spray coating 230 to the consumable part 210, and more specifically, to the anodized layer 220. That is, the macrofeatures provide for better bonding of the plasma-resistant spray coating 230 to the anodized layer 220, which in turn reduces delamination of the plasma-resistant spray coating 230 from the anodized layer 220. The better adhesion of the sprayed coating 230 prevents metal contamination on the wafer due to any damaged sprayed coating (eg, delamination) exposing the anodized aluminum.

[0065] Figure 3 is an illustration of a consumable part 210' comprising an engineered surface 300' having a macrotexture designed to create additional bonding sites for better adhesion of additional layers and / or byproducts according to one embodiment of the present disclosure. For illustrative purposes only, the consumable part 210' may be Figure 1A For clarity and illustration, plasma confinement ring 160 may be used to represent a consumable component 210' placed in a plasma processing chamber. For example, consumable component 210' may be removably placed in a plasma processing chamber.

[0066] As shown, the plasma-facing side 310 of the consumable component 210' comprises an engineered surface 300' comprising a plurality of raised features 440', as previously described. Each of the plurality of raised features 440' extends upwardly at an angle from the substrate surface 350'. For example, the consumable component 210' may be a plasma confinement ring 160 configured in the form of a disk (e.g., as Figure 1A) and includes an inner diameter of a disk or annular ring, wherein the inner diameter defines a plasma-facing side 310. In particular, when placed in a plasma processing chamber, the consumable part 210' is exposed to the plasma during wafer processing (e.g., during etching, deposition, etc.). More specifically, the plasma-facing side 310 can be directly exposed to the plasma within the plasma processing chamber during wafer processing. Embodiments of the present disclosure provide for macrotexturing of the plasma-facing side 310 of the consumable part 210' to form an engineered surface 300', wherein macrofeatures are patterned on the surface of the plasma-facing side 310 to promote coating adhesion and / or promote enhanced anchoring of byproducts to the consumable part surface during wafer processing.

[0067] Furthermore, for example, in a representative plasma confinement ring, the consumable component 210' may include a top portion 169 and a bottom portion 163. In certain embodiments, since the top portion 169 and / or the bottom portion 163 may not be directly exposed to the plasma, macrotexturing of these surfaces may not be necessary. In other embodiments, macrotexturing of the top portion 169 and / or the bottom portion 163 may be performed because these portions may be indirectly exposed to the plasma, thereby shortening the life of the consumable component 210' and / or increasing byproduct capture and potential detachment. In other cases, macrotexturing of the top portion 169 and / or the bottom portion 163 may help increase the life of any additional plasma spray resistant coating (not shown) applied to the consumable component 210' (e.g., the plasma confinement ring 160) and / or provide better adhesion of byproducts to these surfaces and prevent byproduct detachment during one or more wafer processing operations.

[0068] In one embodiment, a plurality of raised features may be formed around the aperture. As an illustration, a hole (e.g., a circular hole) may be formed in the plasma-facing side of the consumable component, wherein the surrounding structure surrounding the hole may be defined as a plurality of raised features. For example, a reverse template (e.g., for forming Figure 3 A negative of a template having an engineered surface can be used with a media blasting process (e.g., sand blasting, bead blasting, etc.) to form holes and raised features surrounding these holes.

[0069] In another embodiment, a plurality of recessed features define an engineered surface. For example, a reverse template (e.g., for forming Figure 3 The negative of the template of the engineered surface can be used with a media blasting process (e.g., sandblasting, bead blasting, etc.) to form a plurality of recessed features, wherein the recessed features can be pores (i.e., as opposed to solid raised features). Figure 3 Conversely, the recessed features may extend downwardly from the substrate surface at an angle.

[0070] Figures 4A-4BThe macrotexture of the surface of the consumable part 210' is shown according to an embodiment of the present disclosure and includes exemplary dimensions and configurations of each of the features defining the macrotexture. For example, Figures 4A-4B Can be Figure 3 A close-up of one or more raised features shown in FIG. In particular, Figure 4A is a cross-sectional view of an engineered surface 300' of a consumable part 210' having a macrotexture in the form of a plurality of raised features 440' designed to create additional bonding sites for better adhesion of additional layers and / or byproducts, according to one embodiment of the present disclosure. Figure 4B is a cross-section of a raised feature 440A of an engineered surface 300' having a macrotexture designed to create additional bonding sites for better adhesion of additional layers and / or byproducts, according to one embodiment of the present disclosure. Figures 4A-4B Various parameters that may be controlled when forming the plurality of raised features 440' are shown, including center-to-center spacing, aspect ratio, feature spacing (eg, distance between features in a pattern), edge finish (eg, rounding), and the like.

[0071] The plasma-facing side 310 of the consumable component 210' comprises an engineered surface 300'. As previously described, the consumable component 210' is removably positioned within the plasma processing chamber. For example, the consumable component 210' may be a liner configured to protect the interior wall of the plasma processing chamber; one or more portions of a C-shaped shield; one or more portions of a plasma confinement ring; a focus ring; an edge ring; an electrostatic semiconductor wafer holding / clamping system; a top electrode; a bottom electrode; or a dielectric window for an inductively coupled plasma, among others. In one embodiment, the plasma-facing side 310 of the consumable component 210' may be a conductive material or a dielectric material.

[0072] More specifically, the plurality of raised features 440' define the engineered surface 300'. The plurality of raised features 440' define a macrotexture formed in the plasma-facing side 310 of the consumable part 210'. The plurality of raised features 440' are designed to create additional bonding sites to better adhere additional layers and / or capture byproducts formed during wafer processing. The plurality of raised features 440' are formed on the plasma-facing side 310 in a predetermined pattern. As shown, the base surface 350' surrounds each of the plurality of raised features 440' such that a respective sidewall 450 of a respective raised feature 440A extends upward from the base surface 350' to a respective top region 470. For example, in Figure 4A In the cross section of FIG, the plurality of raised features 440′ include a raised feature 440A, a raised feature 440B on the left side of the raised feature 440A, and other raised features. Figure 4AOther raised features of the page are not shown.

[0073] Raised feature 440A is defined by central axis 480A, while raised feature 440B is defined by central axis 480B. A distance "B" is defined between central axes 480A and 480B, wherein distance B defines the spacing between the raised features. Additional spacing may be defined between the raised features depending on the pattern selected for the plurality of raised features formed in plasma-facing side 310 of consumable component 210'. For illustrative purposes only, distance B may be approximately 47 mm. In certain embodiments, distance B is in a range of about 15 mm to about 75 mm, or greater. In certain embodiments, distance B is in a range of about 10 mm to about 60 mm. In certain embodiments, distance B is in a range of about 20 mm to about 50 mm.

[0074] Each of the raised features includes a top region and sidewalls. In certain embodiments, the raised features may be described as nodules or truncated cones. As a representation of a raised feature, raised feature 440A includes a top region 470 (e.g., a platform). Top region 470 may have an outer edge 460. In one embodiment, outer edge 460 is rounded. In another embodiment, outer edge 460 is not rounded, but rather remains sharp. For illustrative purposes, outer edge 460 is described throughout this specification as rounded, but may be defined by other features, such as a sharp corner. Each of the raised features may have a predetermined edge finish for the corresponding outer edge. In one embodiment, the edge finish may include rounded corners at the outer edge, such as raised feature 440A. In another embodiment, the edge finish may be sharp and / or different. Other edge finish types are also supported, and their formation is controlled by applying bead blasting and / or sand blasting through the template onto the plasma-facing side 310. For example, the edge finish for the outer edge can include a beveled edge, an overall dome shape of the top region, a sharp edge, etc. Distance "A" defines the distance between the fillets on opposite sides of the top region 470. For illustration purposes only, distance A can be approximately 2 mm, where distance A can be the diameter of the top region 470. In certain embodiments, distance A is in the range of about 0.5 mm to about 5 mm. In other embodiments, distance A is in the range of about 1 mm to about 4 mm. In still other embodiments, distance A is in the range of about 1.5 mm to about 3 mm.

[0075] For representative raised feature 440A, distance "C" defines the height of the feature. For illustration purposes only, distance C may be approximately 0.5 mm. In certain embodiments, distance C ranges from approximately 0.1 mm to approximately 3.0 mm. In certain embodiments, distance C ranges from approximately 0.2 mm to approximately 3 mm. In other embodiments, distance C ranges from approximately 0.2 mm to approximately 2.5 mm. In still other embodiments, the size of the macrofeatures ranges from approximately 0.2 mm to approximately 1.3 mm. In other embodiments, the size of the macrofeatures ranges from approximately 0.3 mm to approximately 1.0 mm.

[0076] In addition, representative raised features 440A may include sidewalls 450. Raised features 440A extend upward from substrate surface 350' at an angle. In particular, sidewalls 450 extend upward from substrate surface 350' at an angle 490A, wherein angle 490A is defined between line 485A (extending from sidewalls 450) and central axis 480A. The configuration of sidewalls 450 and top region 470 defines an aspect ratio (the ratio between the approximate height and the approximate diameter of raised features 440A at substrate surface 350'), which can be controlled by applying sandblasting and / or bead blasting through the template onto the plasma-facing side of the consumable component. For illustration purposes only, angle 490A is approximately 30 degrees. In embodiments, angle 490A is within a range of approximately 15 to approximately 60 degrees. In certain embodiments, angle 490A is within a range of approximately 0 to approximately 45 degrees. In other embodiments, angle 490A is within a range of approximately 15 to approximately 40 degrees. In other embodiments, angle 490A is within a range of about 20 to about 40 degrees. In still other embodiments, angle 490A is within a range of about 25 to about 35 degrees. Furthermore, angle 490B is defined between opposite sides indicated by lines 485A and 485B extending downward from sidewall 450. For example, angle 490B is approximately 60 degrees. In certain embodiments, angle 490B is within a range of 0 to 90 degrees. In other embodiments, angle 490A is within a range of about 30 to about 80 degrees. In other embodiments, angle 490A is within a range of about 40 to about 80 degrees. In still other embodiments, angle 490A is within a range of about 50 to about 70 degrees. For illustration purposes only, angles 490A and 490B defining sidewall 450 and top region 470 may form a spherical body or a truncated cone.

[0077] Figure 5FIG. 5 is a flow chart 500 showing a method for constructing an engineered surface of a consumable part having a macrotexture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers, according to one embodiment of the present disclosure. FIG. 500 can be implemented to produce and / or construct the surface of a consumable part defined in the present application. Figures 1A-4B and any of the macro features of the engineered surface of the plasma-facing side of the consumable part described in 6A-11. Flowchart 500 shows a method for patterning a macro texture (e.g., a feature) defining an engineered surface of a consumable part, which is achieved by masking and media blasting. Other embodiments may form the macro texture (e.g., a feature) defining the engineered surface by mechanical processing (e.g., by physical or laser ablation, etc.). Still other embodiments may form the macro texture (e.g., a feature) defining the engineered surface by wet chemical etching through a template or mask, or selective deposition, or additive manufacturing for depositing features to generate the desired engineered surface (e.g., by powder bed fusion, material extrusion, direct deposition, etc.), etc.

[0078] At 510, the method includes masking a plasma-facing side of a consumable component using a template, wherein the template includes a pattern of openings that provide access to the plasma-facing side. The plasma-facing side of the consumable component can include a conductive material (e.g., an aluminum alloy, aluminum, a metal, etc.) or a dielectric material (e.g., a ceramic). The plasma-facing side of the consumable component is configured to be exposed to the plasma and plasma byproducts. As previously described, macrofeatures are patterned on the plasma-facing side of the consumable component to promote coating adhesion, such as enhancing the adhesion of a plasma-spray resistant coating. In one embodiment, the macrofeatures can be formed in a conductive material (e.g., an aluminum alloy) formed immediately after processing.

[0079] A template is used to control the formation of macrofeatures (e.g., a plurality of raised features). In particular, the form, shape, and / or profile of each of the macrofeatures is controlled by the template placed over the plasma-facing side during the blasting process. Furthermore, during the blasting process, the pattern (including sub-patterns) of the plurality of raised features formed in the plasma-facing side and defining the engineered surface of the plasma-facing side is controlled by the template. Control parameters that define the formation of the raised features include, but are not limited to, overall shape, center-to-center spacing, aspect ratio, feature spacing (e.g., the distance between features in the pattern), edge finish (e.g., rounding), and the like.

[0080] In embodiments, the template can be made of any suitable material. In particular, the template can be made of any material that does not deform under media blasting. In one embodiment, the template is made of a material that does not deform during media blasting. In other embodiments, the template can be made of a material that allows the template to be reused. In other embodiments, the template is disposable.

[0081] In yet other embodiments, the template is made of a material that can conform to complex component geometries, including transitions between edges (e.g., corners, etc.) of surfaces of corresponding consumable components (e.g., chamber liners), conductance gaps, transitions between surfaces of consumable components, and the like. That is, the plasma-facing side of the consumable component contains surface transitions (e.g., edges, corners, recesses, etc.) that may cause delamination of a later applied coating. For example, delamination may occur more frequently at corners of consumable components that have not been modified using embodiments of the present disclosure. In embodiments, adding macrofeatures to the plasma-facing side enhances the ability of the coating to adhere more securely to the plasma-facing side having surface transitions.

[0082] At 520, the method includes differentially blasting the plasma-facing side with a blasting medium through a template to produce a plurality of raised features defining an engineered surface formed in the plasma-facing side. In one embodiment, the macrofeatures are applied by blasting a coarse sand medium through a processed template. In another embodiment, the macrofeatures are applied by photomasking and etching. The plurality of raised features are arranged in a predetermined pattern above the engineered surface. Furthermore, in one embodiment, each of the plurality of raised features includes a top region having an outer edge and sidewalls. In one embodiment, the outer edge is rounded. In other embodiments, the outer edge is not rounded and may be defined as having a sharp edge or corner. The base surface of the engineered surface surrounds each of the plurality of raised features such that the corresponding sidewalls of the corresponding raised features extend upward at an angle from the base surface to the corresponding top region.

[0083] Macro-patterns may be produced by, but are not limited to, bead blasting with a medium, sand blasting with a medium, photomasking, and etching. In one embodiment, the macro-pattern is formed by bead blasting using beads as the blasting medium. In another embodiment, the macro-pattern is formed by sand blasting using a coarse sand material as the blasting medium. Control parameters during bead blasting and / or sand blasting include the type of medium, the size of the medium, the duration of the blasting process, the direction of the blasting process, the number of passes, and the like. In one embodiment, the medium used in the bead blasting or sand blasting process is formed of the same composition and / or material as the plasma-facing side of the consumable component to reduce and / or avoid contamination of the plasma-facing side caused by injecting the blasting medium onto the plasma-facing side. In yet other embodiments, the macro-pattern is formed by photomasking and etching. For example, the etching process includes wet chemical etching, plasma etching, and the like. In other embodiments, the patterned macro-features are formed by machining, selective deposition methods, additive manufacturing, and the like.

[0084] An additional finishing step is performed on the macro-textured plasma-facing side of the consumable part. For example, in one embodiment, the method may include removing the template and indiscriminately blasting the plasma-facing side with a second blasting medium to roughen the plurality of raised features with microfeatures. Microtexturing is performed on the plurality of raised features to enhance the crack resistance of the coating disposed above the engineered surface. In other embodiments, the additional finishing step may include anodizing the engineered surface, for example, to construct and / or produce an anodized layer. In addition, as an additional finishing step, a thermal spray coating (e.g., a plasma-resistant spray coating) may be applied to the anodized engineered surface. In particular, at least some of the plurality of raised features protrude through the anodized layer to enhance adhesion of the thermal spray coating to the anodized layer.

[0085] In one embodiment, macro features (e.g., a plurality of raised features, a plurality of recessed features, etc.) can be formed by wet chemical etching through a template or mask. For example, the consumable part can be masked with sticky tape, which results in selective chemical etching of the exposed surface, thereby resulting in the formation of the intended features.

[0086] In another embodiment, macro features (e.g., multiple raised features, multiple recessed features, etc.) can be formed by selective deposition methods. Raised features can be created by selectively activating target areas of interest using wet or dry chemistries (e.g., plasma), followed by deposition of the desired material in the activated areas. A reverse process can also be used to create raised features, i.e., by passivating the areas of the recessed features to facilitate subsequent deposition in the remaining areas.

[0087] In yet another embodiment, macrofeatures (e.g., a plurality of raised features, a plurality of recessed features, etc.) can be formed by additive manufacturing. The added material can be composed of the same material as the underlying plasma-facing side of the consumable component or a different composition. Furthermore, the added material can have the same or different microstructure as the underlying plasma-facing side of the consumable component. For example, additive manufacturing methods can include (for purposes of illustration, but not limitation) photopolymerization, powder bed fusion, material extrusion, direct deposition, and the like.

[0088] In yet another embodiment, a plurality of concave features define an engineered surface. For example, a reverse template or mask can be used with media blasting (e.g., sandblasting, bead blasting, etc.) to form a plurality of concave features. When a reverse template is used, the concave features that can be produced are pores in the engineered surface (i.e., as opposed to solid raised features). In another embodiment, a reverse template or mask can be used with chemical etching to form a plurality of concave features.

[0089] Figure 6A 、 6B-1 , 6B-2, and 6C illustrate a process of sandblasting or bead blasting through a template to create an engineered surface 300' of a consumable part 210' having a macrotexture. In particular, macrofeatures (e.g., raised features) are patterned on the plasma-facing side 310 (e.g., the surface) of the consumable part 210' to promote adhesion of coatings and / or byproducts.

[0090] In particular, Figure 6A One embodiment according to the present disclosure shows a process of sandblasting or bead blasting through a template to create an engineered surface 300' of a consumable part 210' having a macro texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or byproducts. Figure 6A As shown in , in one embodiment, a plurality of raised features are applied by blasting a grit medium through a machined template 610. For example, the template 610 includes openings 610A through which the blasting medium can pass and reach the plasma-facing side 310 of the consumable part 210'. In addition, the template 610 includes a blockage 610B where the blasting medium is blocked from reaching the plasma-facing side 310 of the consumable part 210'. In this manner, the template 610 controls the formation of a plurality of raised features on the plasma-facing side 310 of the consumable part, wherein the plurality of raised features define a corresponding engineered surface of the consumable part 210'.

[0091] like Figure 6A, distance 615 shows the distance between the template 610 and the plasma-facing side 310 (e.g., the surface of the plasma-facing side). In some applications, during bead blasting and / or sand blasting, distance 615 is minimized until the template 610 rests on the plasma-facing side 310. In other embodiments, during bead blasting and / or sand blasting, the template 615 is moved away from the plasma-facing side 310 (e.g., distance 615 has a certain value).

[0092] The sandblaster nozzle 620 is configured to deliver a blasting medium (e.g., grit and / or beads) through the template to the plasma-facing side 310 of the consumable part 210' at one or more angles. In some embodiments, the sandblaster nozzle 620 is moved across the template in a pattern. For example, in a first cycle or operation, the sandblaster nozzle 610 can be moved in one or more directions. For illustration, the sandblaster nozzle 610 can be moved across the template in one direction (e.g., vertically or laterally, or diagonally) during a cycle or operation. One or more cycles or operations can be performed during the bead and / or sandblasting process. Different movement patterns of the sandblaster nozzle 620 can also be implemented when multiple raised features are being constructed in the plasma-facing side 310 of the consumable part 210'.

[0093] Figure 6B-1 According to one embodiment of the present disclosure, Figure 6A The plasma-facing side 310 of the consumable component 210' is shown sandblasted or beadblasted at an angle to create an engineered surface 300' having a macrotexture in the form of raised features. These raised features are designed to create additional bonding sites for better adhesion of additional layers and / or byproducts. In particular, macrofeatures (e.g., raised features) are patterned on the plasma-facing side 310 (e.g., surface) of the consumable component 210' to promote adhesion of coatings and / or byproducts.

[0094] like Figure 6B-1 As shown, during a bead and / or grit media blasting process, a template 610 is positioned against the plasma-facing side 310 of the consumable part 210'. The template 610 includes openings 610B through which the blasting medium 629, when ejected from the blasting nozzle 620, can pass to the plasma-facing side 310. The template 610 includes a blockage 610A that restricts the blasting medium 629 from passing through and reaching the plasma-facing side 310 of the consumable part 210'. As previously described, the blasting nozzle 620 can be moved across the template in a predetermined or random pattern (e.g., in a designated movement pattern 625).

[0095] During the application of the bead blasting and / or sand blasting process, particles 635 are removed from the consumable part 210'. In particular, the blasting medium strikes and / or impacts the plasma-facing side 310 and removes portions (e.g., material) of the consumable part 210' as particles 635. For example, regions 630A and 630B are removed from opposite sides of a raised feature 440A of the consumable part 210'. In one embodiment, regions 630A and 630B are connected together to surround the raised feature 440A. The particles 635 may comprise the blasting medium 629.

[0096] The marked portion 690 of the outer edge of the raised feature 440A illustrates the undercutting of material from the consumable component 210' beneath the blocking portion 610A of the template 610. In particular, in one embodiment, the marked portion 690 illustrates the formation of a radiused corner at the outer edge of the top region of the raised feature 440A as the blasting medium removes material from the plasma-facing side 310 of the consumable component 210' beneath the blocking portion 610A.

[0097] Figure 6B-2 According to one embodiment of the present disclosure, sandblasting or bead blasting is applied at multiple angles to the plasma-facing side 310 of the consumable component 210' to create an engineered surface 300' having a macro-texture in the form of raised features. These raised features are designed to create additional bonding sites for better adhesion of additional layers and / or byproducts. In particular, macro-features (e.g., raised features) are patterned on the plasma-facing side 310 (e.g., surface) of the consumable component 210' to promote adhesion of coatings and / or byproducts.

[0098] like Figure 6B-2 As shown, during a bead and / or grit media blasting process, a template 610' is positioned against the plasma-facing side 310 of the consumable part 210'. The template 610' includes openings 610B' through which the blasting medium 629, when ejected from the blasting machine nozzle 620, can pass to the plasma-facing side 310. The template 610' includes obstructions 610A' that restrict the blasting medium 629 from passing through and reaching the plasma-facing side 310 of the consumable part 210'. Each of the obstructions 610A includes at least one inclined side 605. For example, a corresponding obstruction 610A' can include inclined sides 605A and 605B.

[0099] As previously described, the sandblaster nozzle 620 can be moved across the template in a predetermined or random pattern (e.g., in a designated movement pattern 625A and / or 625B). During the application of the bead blasting and / or sandblasting process, particles 635 are removed from the consumable part 210'. In particular, the blasting medium strikes and / or impacts the plasma-facing side 310 and removes portions (e.g., material) of the consumable part 210' as particles 635. For example, regions 630A' and 630B' are removed from opposite sides of a raised feature 440A' of the consumable part 210'. In one embodiment, regions 630A' and 630B' are connected together to surround the raised feature 440A'. The particles 635 can comprise the blasting medium 629.

[0100] For example, in one operation, the sandblaster nozzle 620 can move in one direction, while in another operation, the sandblaster nozzle 620 can move in the opposite direction. In another embodiment, the sandblaster nozzle 620 follows a specified movement pattern 625A in which the nozzle is at a first angle relative to the plasma-facing side 310. In particular, in one embodiment, at the first angle, the delivery of the blasting medium 629 is aligned with the angled side 605A of the corresponding obstruction 610A, enabling the blasting medium 629 to undercut the corresponding obstruction 610A to form a rounded corner at the outer edge of the top area of ​​the corresponding raised feature 440A. In another implementation, the sandblaster nozzle 620 follows a specified movement pattern 625B in which the nozzle is at a second angle relative to the plasma-facing side 310. In particular, in one embodiment, at the second angle, the delivery of the blasting medium 629 is aligned with the inclined side 605B of the corresponding obstruction 610A, so that the blasting medium 629 can undercut the corresponding obstruction 610A to form a rounded corner on the outer edge of the top area of ​​the corresponding raised feature 440A.

[0101] Figure 6C According to one embodiment of the present disclosure, applying Figure 6A 、 6B-1 , and / or the engineered surface 300' of the consumable part 210' after sandblasting or bead blasting as shown in 6B-2, wherein the engineered surface 300' includes a macro-texture in the form of multiple raised features 440' (including raised features 440A) that are designed to create additional bonding areas for better adhesion of additional layers.

[0102] In particular, after the macrofeatures are created in the plasma-facing side 310 of the consumable part 210', the template 610 is removed from the plasma-facing side 310 to expose the plurality of raised features defining the engineered surface 300'. In particular, the macrofeatures may be represented by raised features 440A, which have been previously described for Figures 4A-4BFor example, raised feature 440A includes a top region 470 that may have an outer edge and sidewalls that extend upward at an angle from base surface 350' of engineered surface 300'. Void regions 630A and 630B may be joined to surround raised feature 440A. Figure 6C As shown, in one embodiment, the outer edge 460 of raised feature 440A is rounded. As previously described, each of the raised features can have a predetermined edge finish for the corresponding outer edge. In one embodiment, the edge finish can include rounded corners at the outer edge, such as raised feature 440A. In other embodiments, the edge finish can include sharp corners at the outer edge.

[0103] In one embodiment, after the macro features are created, the template is removed and the entire engineered surface 300' is subjected to sandblasting and / or bead blasting to produce indiscriminate micro-roughening. Thereafter, the engineered surface 300' of the consumable part 210' undergoes anodization and finishing with a top coating (e.g., a plasma spray resistant coating). The plasma spray resistant coating can be applied via plasma spraying, thermal spraying, CVD, or other applicable techniques.

[0104] Figure 7A An embodiment according to the present disclosure shows a consumable part 210-1 comprising an engineered surface 300-1 that is anodized (e.g., anodized layer 220-1) and covered with a plasma spray resistant layer 230-1 that is not conformed to the engineered surface 300-1 having a macrotexture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers.

[0105] In particular, a plurality of raised features 440-1 are formed on the plasma-facing side 310-1 of the consumable component 210-1. The plurality of raised features 440-1 define an engineered surface 300-1. Furthermore, the plurality of raised features 440-1 can be further blasted using grit and / or bead media to uniformly form a microtexture. The engineered surface 300-1 is anodized to form an anodized layer 220-1. Furthermore, a plasma spray-resistant coating 230-1 is formed on the anodized layer 220-1.

[0106] Each of the plurality of raised features 440-1 has an approximate height "h1." The height "h1" can define the contours of the plurality of raised features 440-1. As shown, the surface 705-1 of the anodized layer 220-1 can closely follow and / or conform to the contours of the plurality of raised features 240-1. Because the contours of the plurality of raised features 440-1 are exposed through the anodized layer 220-1, the adhesion of the plasma spray resistant layer 230-1 to the anodized layer 220-1 is enhanced.

[0107] Furthermore, the height "h1" has a specific size such that the surface 710 of the plasma spray resistant layer 230-1 does not follow and / or conform to the contours of the plurality of raised features 440-1. That is, the height "h1" has a relatively small size such that the sprayed layer 230-1 (typically 2-3 times the thickness of the anodized layer 220-1) fills the peaks and valleys of the contours of the plurality of raised features 440-1 and further spreads over the plurality of raised features 440-1, making the surface 710 relatively flat.

[0108] Figure 7B An embodiment according to the present disclosure shows a consumable part 210-2 comprising an engineered surface 300-2 that is anodized (e.g., anodized layer 220-2) and covered with a plasma spray resistant layer 230-2 that conforms to the engineered surface 300-2 having a macrotexture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers.

[0109] In particular, a plurality of raised features 440-2 are formed on the plasma-facing side 310-2 of the consumable component 210-2. The plurality of raised features 440-2 define an engineered surface 300-2. Furthermore, the plurality of raised features 440-2 can be further blasted using grit and / or bead media to uniformly form a microtexture. The engineered surface 300-2 is anodized to form an anodized layer 220-2. Furthermore, a plasma spray-resistant coating 230-2 is formed on the anodized layer 220-2. A surface 720 of the plasma spray-resistant coating 230-2 is exposed to plasma within a plasma processing system.

[0110] Each of the plurality of raised features 440-2 has an approximate height "h2." The height "h2" can define the contours of the plurality of raised features 440-2. As shown, the surface 705-2 of the anodized layer 220-2 can closely follow and / or conform to the contours of the plurality of raised features 440-2. Because the contours of the plurality of raised features 440-2 are exposed through the anodized layer 220-2, the adhesion of the plasma spray resistant layer 230-2 to the anodized layer 220-2 is enhanced.

[0111] Furthermore, the height "h2" has a specific size such that the surface 720 of the plasma spray resistant layer 230-2 follows and / or conforms to the contours of the plurality of raised features 440-2. That is, the height "h2" has a larger size (e.g., the height "h2" is greater than the height "h1") such that the sprayed layer 230-2 follows the peaks and valleys of the contours of the plurality of raised features 440-2. As shown, the surface 720 is relatively uneven and conforms to the contours of the plurality of raised features 440-2.

[0112] Figure 8A A template 800A and a plurality of exemplary openings are shown according to one embodiment of the present disclosure, which are configured to direct a sandblasted or beadblasted medium onto the plasma-facing side of a consumable part to create an engineered surface having a macro-texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers. Different types of openings can have different effects when forming corresponding raised features in the plasma-facing side of corresponding consumable parts. For example, the shape of the openings can include (but are not limited to) an elliptical opening 801 (e.g., a circle, etc.), a multi-sided polygonal opening 802 (e.g., an octagonal, etc.), a square or rectangular opening 803, a triangular opening, a symmetrical shape, an asymmetrical shape, etc. Although the openings in the template are shown as circles in the template throughout the application, the openings can be of any type and shape.

[0113] Figure 8B According to one embodiment of the present disclosure, a template 800B having a plurality of openings disposed in a pattern 810 is shown. The patterned template 800B is configured to differentially direct a sandblasted or beadblasted medium onto the plasma-facing side of a consumable component to create an engineered surface. In particular, the engineered surface comprises a patterned macrotexture designed to create additional bonding sites for better adhesion of additional layers. In one embodiment, the openings in the pattern 810 are repeated in a uniform manner throughout the template, such as Figure 8B In addition, the shape and size of the openings are selectable, as described above. In addition, the density of the openings is selectable.

[0114] In yet another embodiment, for illustration only, the template 800B can be reversed to form a plurality of recessed features defining an engineered surface. For example, the reversed template or mask can be used with a media blasting process (e.g., sandblasting, bead blasting, etc.) to form a plurality of recessed features, wherein the recessed features can be pores in the engineered surface (i.e., as opposed to solid raised features). In another embodiment, the reversed template or mask can be used with a chemical etching process to form a plurality of recessed features.

[0115] Figure 8C According to one embodiment of the present disclosure, a template 800C having a plurality of openings arranged in a dual-zone pattern is shown for directing a sandblasted or beadblasted media onto the plasma-facing side of a consumable component to create an engineered surface having a patterned macrotexture designed to create additional bonding sites for better adhesion of additional layers. In particular, template 800C includes a defined pattern 820 comprising a first segment 820A and a second segment 820B, with a line 825 separating the two segments.

[0116] The openings in the two segments are shown as circular or oval, but can be of any shape. Furthermore, the openings in the first segment 820A can be of a first type (e.g., circular), while the openings in the second segment 820B can be of a second type (e.g., square). Furthermore, while the openings in the first segment 820A and the second segment 820B are uniform in size, the openings in the first segment 820A can be of a first size, while the openings in the second segment 820B can be of a second size. The size and shape of the openings can control the size and shape of the resulting macrofeatures.

[0117] The first section 820A includes a first set of raised features arranged in a first sub-pattern. The second section 820B includes a second set of raised features arranged in a second sub-pattern. Furthermore, the sub-patterns of the first section 820A and the second section 820B may closely follow each other, or may be different from each other. Figure 8C As shown, the first sub-pattern of the first segment 820A is similar to the sub-pattern of the second segment 820B, such that both follow a uniform displacement (e.g., lateral, vertical, and / or diagonal displacement) between the openings. However, the density of the openings in the two segments is different. In particular, the density of the openings in the first segment 820A is less than the density of the openings in the second segment 820B.

[0118] Figure 8D According to one embodiment of the present disclosure, a template 800D having a plurality of openings arranged in a three-zone pattern is shown for directing a sandblast or beadblasting medium onto the plasma-facing side of a consumable component to create an engineered surface having a patterned macrotexture designed to create additional bonding sites for better adhesion of additional layers. In particular, template 800D includes a defined pattern 830 comprising a first segment 830A, a second segment 830B, and a third segment 830C. Line 831 separates first segment 830A from second segment 830B, while line 832 separates second segment 830B from third segment 830C.

[0119] The openings in the three segments are shown as circular or elliptical, but can be of any shape. Furthermore, the openings in first segment 830A can be of a first type (e.g., circular), the openings in second segment 830B can be of a second type (e.g., square), and the openings in third segment 830C can be of the first, second, or third type (e.g., triangular). Furthermore, while the openings in the three segments are shown as being uniform in size, the openings in first segment 830A can be of a first size, the openings in second segment 830B can be of a second size, and the openings in third segment 830C can be of a third size. That is, the size of the openings in each of the three segments can be similar or different. The size and shape of the openings can control the size and shape of the corresponding macrofeatures formed.

[0120] The first segment 830A includes a first set of raised features arranged in a first sub-pattern. The second segment 830B includes a second set of raised features arranged in a second sub-pattern. The third segment 830C includes a third set of raised features arranged in a third sub-pattern. Furthermore, the sub-patterns of the three segments can closely follow one another, or they can differ from one another. As shown, the sub-patterns of each of the three segments are similar, such that each follows a uniform displacement (e.g., lateral, vertical, and / or diagonal displacement) between openings. However, the density of openings in the three segments is different. In particular, the density of openings in the first segment 830A is the highest of the three segments. The density of openings in the third segment 830C is the lowest of the three segments. Furthermore, the density of openings in the second segment is less than that in the first segment 830A, but greater than that in the third segment 830C.

[0121] Figure 8E According to one embodiment of the present disclosure, a template 800E having a plurality of openings arranged in a linear scale pattern is shown for directing a sandblasted or beadblasted media onto the plasma-facing side of a consumable component to create an engineered surface having a patterned macrotexture designed to create additional bonding sites for better adhesion of additional layers. In particular, a graph 850 shows the density of openings in the template 800E as one moves across the template in a particular direction. For example, the graph 850 includes a vertical axis 851 showing the density of openings in the template 800E and a horizontal axis 852 showing the distance across the template 800E in the particular direction. According to the graph 850, the density of openings is highest on the left side of the template 800E. Moving across the template 800E from left to right, the density decreases linearly until the density of openings reaches a minimum value (e.g., zero) on the right side of the template 800E.

[0122] The openings in template 800E are shown as circular or oval, but can be any shape. Furthermore, the openings can vary in shape throughout template 800E and within sub-patterns within any of the templates. Furthermore, while the size of the openings is shown as uniform throughout template 800E, the size of the openings can vary throughout template 800E. The size and shape of the openings can control the size and shape of the corresponding macrofeatures formed.

[0123] Figure 9A-1 、 9A-2 , 9B-1, 9B-2, 9C-1, 9C-2, 9D, and 9E show different configurations and patterns of raised features disposed across respective engineered surfaces and are provided for purposes of illustration and clarity only. Features can be formed across an engineered surface in a customized pattern, wherein the features are formed according to selectable parameters such as the size, shape, density, etc. of the raised features.

[0124] Figure 9A-1 According to one embodiment of the present disclosure, a plurality of raised features are uniformly arranged throughout a corresponding engineered surface in a pattern 910. The raised features defining the engineered surface include a patterned macrotexture designed to create additional bonding sites for better adhesion of additional layers and / or byproducts. These features have a uniform structure and height configured to construct a conformal plasma-resistant sprayed layer (not shown), as previously described. That is, the profile of the sprayed layer similarly conforms to the profile of the engineered surface. For example, the height of the macro-raised features in pattern 910 and the spacing between these raised features can cause the top surface of the sprayed layer to roughly conform to the profile of the engineered surface in pattern 910.

[0125] Figure 9A-2 One embodiment according to the present disclosure shows a plurality of raised features arranged uniformly with a density ratio of Figure 9A-1 The characteristics are low. Figure 9A-2 The features are uniformly arranged in pattern 920 throughout the corresponding engineered surface. Figure 9A-2 Features and Figure 9A-1 The features in are similarly configured and have uniform structures and heights configured to build conformal plasma spray resistant coatings, as previously described. However, Figure 9A-2 The feature density in pattern 920 is lower than Figure 9A-1 The density of features in pattern 910 is shown to indicate that density is selectable. In addition, the size and shape of features in each of patterns 910 and 920 are selectable.

[0126] Figure 9B-1 One embodiment according to the present disclosure shows a plurality of raised features uniformly arranged in a pattern 930. The features of the pattern 930 have a uniform structure and height. In particular, the height of the features of the pattern 930 is less than Figure 9A-1The features of pattern 910 have a uniform structure and height configured to create a relatively flat, non-conformal, plasma-spray-resistant coating, as previously described. That is, the profile of the sprayed coating does not conform to the profile of the engineered surface. The raised features define an engineered surface having a patterned macrotexture designed to create additional bonding sites for better adhesion of additional layers. For example, the height of the macro-raised features in pattern 930 and the spacing between these raised features do not allow the top surface of the sprayed coating to substantially conform to the profile of the engineered surface in pattern 930.

[0127] Figure 9B-2 One embodiment according to the present disclosure shows a plurality of raised features arranged uniformly with a density ratio of Figure 9B-1 The characteristics are low. Figure 9B-2 The features are uniformly arranged throughout the corresponding engineered surface in pattern 940. Figure 9B-2 The characteristics and Figure 9B-1 The features in are similarly configured and have a uniform structure and height configured to build a non-conformal plasma spray resistant coating, as previously described. Figure 9B-2 The feature density in pattern 940 is lower than Figure 9B-1 The density of features in pattern 930 is shown to indicate that density is selectable. In addition, the size and shape of features in each of patterns 930 and 940 are selectable.

[0128] Figure 9C-1 According to one embodiment of the present disclosure, a plurality of raised features are provided in pattern 950, which further includes two sub-patterns 950A and 950B. The raised features in the two sub-patterns 950A and 950B define an engineered surface having a patterned macrotexture designed to produce additional bonding sites for better adhesion of additional layers and / or byproducts. The features throughout each of the two sub-patterns 950A and 950B have a uniform structure and height to construct a conformal plasma spray-resistant coating (not shown), as described above. That is, the profile of the sprayed coating similarly conforms to the profile of the engineered surface. For example, the height of the macro-raised features in pattern 910 and the spacing between these raised features can make the top surface of the sprayed coating roughly conform to the profile of the engineered surface in pattern 910. Although the features shown are uniform across each of the two sub-patterns 950A and 950B, the density of features in sub-pattern 950B (on the right) is lower than the density of features in sub-pattern 950A (on the left), indicating that the density of raised features in each of sub-patterns 950A and 950B is selectable. Additionally, although the features shown are uniform across each of the two sub-patterns 950A and 950B, these features may have different configurations, such as Figure 9C-2 Further shown in .

[0129] Figure 9C-2 According to an embodiment of the present disclosure, a plurality of raised features are provided in two sub-patterns 960A and 960B, wherein the features in each sub-pattern have a uniform structure and height, but can be different between the two sub-patterns. The raised features in the two sub-patterns 960A and 960B define an engineered surface with a patterned macro-texture, which is designed to produce additional bonding sites to better adhere to additional layers and / or byproducts. The features throughout each of the two sub-patterns 960A and 960B have different configurations. In particular, the features in the sub-pattern 960A have a uniform structure and height to construct a conformal plasma spray resistant coating (not shown), as described above. For example, the height of the macro-raised features in the sub-pattern 960A and the spacing between these raised features can make the top surface of the spray coating similarly and / or roughly conform to the profile of the engineered surface in the sub-pattern 960A. On the other hand, the features in the sub-pattern 960B have a uniform structure and height to construct a non-conformal plasma spray resistant coating, as described above. For example, the height of the macroscopic raised features in sub-pattern 960B and the spacing between these raised features will not make the top surface of the spray coating similarly and / or roughly conform to the profile of the engineered surface in sub-pattern 960B. That is, the profile of the top surface of the spray coating does not conform to the profile of the raised features of sub-pattern 960B. Therefore, the spray coating can have different profiles depending on the sub-pattern of the raised features below. Although the features shown have the same density everywhere on sub-patterns 960A and 960B, the density of the features can be different between the two sub-patterns 960A and 960B, so that the density of the raised features in each of sub-patterns 960A and 960B is selectable. For example, the feature density in sub-pattern 960B (on the right) can be lower than the feature density in sub-pattern 960A (on the left), and vice versa.

[0130] Figure 9DAccording to an embodiment of the present disclosure, a plurality of raised features are provided by three sub-patterns (970A, 970B, and 970C), wherein the features throughout these sub-patterns have uniform structure and height. The raised features in the three sub-patterns 970A, 970B, and 970C define an engineered surface with a patterned macro texture, which is designed to produce an additional bonding portion to better adhere to additional layers and / or byproducts. The features throughout each of the three sub-patterns can have the same configuration. For example, the features in the three sub-patterns can have uniform structure and height, to construct a conformal or non-conformal plasma spray resistant coating (not shown), as described above. For example, the height of the macro-raised features in the three sub-patterns and the spacing between these raised features can make the top surface of the spray coating similarly and / or roughly conform to the profile of the engineered surface according to the sub-pattern below. Alternatively, the height of the macro-raised features in the three sub-patterns and the spacing between these raised features will not make the top surface of the spray coating similarly and / or roughly conform to the profile of the engineered surface. While the features shown are uniform across each of the three sub-patterns, in other embodiments, the configuration (e.g., size and shape) of the features in one sub-pattern may differ from the configuration of the features in another sub-pattern, depending on the underlying sub-pattern. More specifically, the density of features in each of sub-patterns 970A, 970B, and 970C has different densities. In particular, the density of features in sub-pattern 970A is the highest, while the density of features in sub-pattern 970C is the lowest. Furthermore, the density of features in sub-pattern 970B is greater than the density of features in sub-pattern 970C, but less than the density of features in sub-pattern 970A.

[0131] Figure 9E According to one embodiment of the present disclosure, a plurality of raised features are shown arranged in a linear scale pattern 980 such that the density of the features increases linearly. These raised features define an engineered surface having a patterned macrotexture designed to create additional bonding sites for better adhesion of additional layers and / or byproducts. For illustration purposes only, Figure 8ETemplate 800E is used to form the features in pattern 980. In particular, the features can have the same configuration throughout the engineered surface. For example, the features in pattern 980 can have a uniform structure and height to construct a conformal or non-conformal plasma spray resistant coating (not shown), as previously described. Although the features are shown as uniform across the engineered surface, in other embodiments, the configuration of the features (e.g., size and shape) can vary across the engineered surface. Graph 990 shows the density of raised features in pattern 980. For example, graph 990 includes a vertical axis 991 showing the density of raised features (e.g., blobs) and a horizontal axis 992 showing the distance across the engineered surface in a particular direction. According to graph 990, in a particular direction, the density of raised features is highest on the left side of pattern 980. Moving across pattern 980 showing the engineered surface in the particular direction, the density of raised features decreases linearly until the density of raised features reaches a minimum value (e.g., zero) as the density reaches the right side of pattern 980.

[0132] Figure 10 According to one embodiment of the present disclosure, different templates are applied to the plasma-facing side 310 of the consumable part 210' for producing the feature configuration (e.g., rounded edges) of the plurality of raised features arranged in a certain pattern. For example, bead blasting and / or sand blasting using corresponding blasting media are performed in two operations. In the first operation, bead blasting and / or sand blasting using a first blasting medium is performed using template 1. The bead blasting and / or sand blasting operation can be moved across template 1 (1010) in a specified pattern and at one or more specified angles (e.g., the angle of the sand blasting nozzle). In the second operation, bead blasting and / or sand blasting using a second blasting medium is performed using template 2 (1020). The first and second blasting media can be the same or different. The bead blasting and / or sand blasting operation can be moved across template 2 in a specified pattern and at one or more specified angles (e.g., the angle of the sand blasting nozzle). Using different templates 1 and 2 can promote the desired edges of the raised features defining the engineered surface. For example, the openings in template 2 may be larger than the openings in template 1, but both opening patterns generally follow the same pattern. In this way, during the second operation, the blasting medium may reach additional areas of the plasma-facing side 310 of the consumable component 210' to produce rounded corners at the outer edges of the top areas of the plurality of raised features formed in the engineered surface and defining the engineered surface, such as Figures 4A-4B As shown in .

[0133] According to one embodiment of the present disclosure, Figure 11FIG2 is an electron micrograph of a cross-section of a consumable part 210-3 comprising an engineered surface that is anodized (anodized layer 220-3) and covered with a plasma spray resistant layer 230-3. The engineered surface comprises a macrotexture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or byproducts.

[0134] The foregoing description of the embodiments is provided for illustration and description purposes. It is not intended to fully detail or limit the present disclosure. The individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but even if not specifically shown or described, they are interchangeable and can be used in selected embodiments where applicable. This can also be changed in various ways. Such changes are not considered to depart from the present disclosure, and all such modifications are also included within the scope of the present disclosure.

[0135] Although the foregoing embodiments have been described in some detail for purposes of clarity of understanding, it will be apparent that certain changes and modifications may be practiced within the scope of the appended claims. The present embodiments are, therefore, to be considered as illustrative and not restrictive, and the embodiments are not to be limited to the details provided herein, but may be modified within the scope and equivalents of the claims.

Claims

1. A device comprising: an engineered surface formed on a plasma-facing side of a consumable component; defining a plurality of raised features of the engineered surface, wherein the raised feature includes a top region having an outer edge and sidewalls, wherein the sidewall protrusion extends upward from the base surface of the consumable part to the top region, an anodized layer formed on the engineered surface, wherein the anodized layer adheres to the engineered surface, wherein a top surface of the anodized layer conforms to a contour formed by the plurality of raised features; a coating formed on the anodized layer, wherein the top surface of the coating conforms to the top surface of the anodized layer, wherein the coating is continuous and laminated on the anodized layer such that the anodized layer and the coating cover the plurality of raised features.

2. The device according to claim 1, The consumable component is configured to be installed in a plasma processing chamber.

3. The device according to claim 1, The consumable component is configured to be exposed to plasma and byproducts of the plasma.

4. The device according to claim 1, The plurality of raised features are arranged in a predetermined pattern.

5. The device according to claim 1, Wherein the plurality of raised features are configured to enhance adhesion of the coating to the anodized layer.

6. The device according to claim 1, wherein the coating is adhered to a top surface of the anodized layer.

7. The device according to claim 1, The sidewalls extend upward from the base surface to the top region at a certain angle.

8. The device according to claim 1, Each of the plurality of raised features is macroscopic, and a height of each of the plurality of raised features relative to the substrate surface ranges from about 0.2 mm to about 3 mm.

9. The apparatus according to claim 8, further comprising: A plurality of microfeatures are indiscriminately applied to the plurality of raised features.

10. The device of claim 1, wherein the consumable part comprises one of the following: a liner configured to protect an inner wall of a plasma processing chamber; or part of a C-shaped shield; or a portion of a plasma confinement ring; or focus ring; or marginal ring; or Electrostatic semiconductor wafer clamping systems; or upper electrode; or Dielectric window; or Bottom electrode.

11. A plasma processing chamber comprising: a lower electrode configured to support the substrate; a top electrode disposed above the lower electrode; Consumable parts, including: an engineered surface formed on a plasma-facing side of a consumable component; defining a plurality of raised features of the engineered surface, wherein the raised feature includes a top region having an outer edge and sidewalls, wherein the side wall protrusion extends upward from the base surface of the consumable part to the top area, an anodized layer formed on the engineered surface, wherein the anodized layer adheres to the engineered surface, wherein a top surface of the anodized layer conforms to a contour formed by the plurality of raised features; a coating formed on the anodized layer, wherein the top surface of the coating conforms to the top surface of the anodized layer, wherein the coating is continuous and laminated on the anodized layer such that the anodized layer and the coating cover the plurality of raised features.

12. The plasma processing chamber according to claim 11, The consumable parts are configured to be exposed to plasma and plasma byproducts generated by the plasma processing chamber.

13. The plasma processing chamber of claim 11, The plurality of raised features are arranged in a predetermined pattern.

14. The plasma processing chamber of claim 11, Wherein the plurality of raised features are configured to enhance adhesion of the coating to the anodized layer.

15. The plasma processing chamber of claim 11, wherein the coating is adhered to a top surface of the anodized layer.

16. The plasma processing chamber of claim 11, The sidewalls extend upward from the base surface to the top region at a certain angle.

17. The plasma processing chamber of claim 11, Each of the plurality of raised features is macroscopic, and a height of each of the plurality of raised features relative to the substrate surface ranges from about 0.2 mm to about 3 mm.

18. The plasma processing chamber of claim 17, further comprising: A plurality of microfeatures are indiscriminately applied to the plurality of raised features.

19. The plasma processing chamber of claim 11, wherein the consumable part comprises one of: a liner configured to protect an inner wall of a plasma processing chamber; or part of a C-shaped shield; or a portion of a plasma confinement ring; or focus ring; or marginal ring; or Electrostatic semiconductor wafer clamping systems; or upper electrode; or Dielectric window; or Bottom electrode.

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