Patch antenna with grounding well

Abstract

The invention relates to a patch antenna with a ground well. A global navigation satellite system (GNSS) patch antenna may include an intermediate stack, a top stack, a bottom stack, and a ground well. The intermediate stack may include a first side and a second side. The top stack may be coupled to the intermediate stack and may be positioned on a first side of the intermediate stack. The top stack may include a conductive antenna element configured to receive GNSS signals. The bottom stack may be coupled to the intermediate stack and may be positioned on a second side of the intermediate stack. The ground well may cover an exposed surface of the bottom stack and an exposed portion of the second side of the intermediate stack, and may include a conductive material. Some surfaces of the intermediate stack covered by the bottom stack may be free of conductive material.

Description

Technical Field

[0001] The present invention generally relates to patch antennas that can be used to receive and / or transmit electrical signals. Background Art

[0002] The patch antenna may be used, for example, with a global navigation system or other suitable system to receive data, transmit data, or a combination thereof with respect to the system. To receive signals, transmit signals, or a combination thereof, conventional patch antennas may be limited to a small range of frequencies, intensities, etc. For example, manufacturing limitations may not allow conventional patch antennas to receive or transmit signals in a desired frequency range, intensity range, etc. Summary of the invention

[0003] The present invention relates to patch antennas and is not limited to patch antennas including ground wells. The ground well may be or include a U-shaped ground plane. The patch antenna may be configured for use in a global navigation satellite system (GNSS). The GNSS patch antenna may include a top stack, an intermediate stack, and a bottom stack, wherein a ground well is formed on a lower exposed surface of the intermediate stack and a side exposed surface and a lower exposed surface of the bottom stack. The top stack may include at least one conductive antenna element. The at least one conductive antenna element and the ground well may include conductive materials such as copper, silver, aluminum, etc. The ground well may increase the volume of the GNSS patch antenna (e.g., compared to a conventional flat ground plane) to optimize (e.g., increase) the frequency range of signals that can be successfully received by the GNSS patch antenna.

[0004] In some embodiments, a global navigation satellite system (GNSS) patch antenna may include a top stack, an intermediate stack, a bottom stack, and a ground well. The intermediate stack may include a first side and a second side opposite the first side. The top stack may be coupled to the intermediate stack and may be positioned on the first side of the intermediate stack. The top stack may include at least one conductive antenna element configured to receive GNSS signals. The bottom stack may be coupled to the intermediate stack and may be positioned on the second side of the intermediate stack. The ground well may be formed on an exposed surface (i.e., a side surface and a lower surface) of the bottom stack and at least an exposed portion of a surface of the second side of the intermediate stack. The ground well may be formed by electroplating a conductive material. At least a portion of the surface of the intermediate stack covered by the bottom stack may be free of conductive material.

[0005] In one embodiment, the at least one conductive antenna element may have a geometry similar to that of the top stack, and the at least one conductive antenna element may include copper. In one embodiment, the middle stack may define a first three-dimensional shape, the top stack may define a second three-dimensional shape, and the bottom stack may define a third three-dimensional shape. At least two dimensions of each of the first three-dimensional shape, the second three-dimensional shape, and the third three-dimensional shape may be geometrically similar. In one embodiment, the first three-dimensional shape, the second three-dimensional shape, and the third three-dimensional shape may each be a cylindrical shape of different sizes, and the first three-dimensional shape may have a first radius that is greater than the second radius of the second three-dimensional shape and the third radius of the third three-dimensional shape. In one embodiment, the GNSS patch antenna may also include a set of channels that may extend from the uppermost conductive antenna element of at least one conductive antenna element included in the top stack to the first side of the bottom stack. The first side of the bottom stack may be positioned opposite to the second side of the bottom stack, and the second side of the bottom stack is adjacent to the second side of the middle stack. In one embodiment, the GNSS patch antenna may also include a set of conductive pins corresponding to the set of channels. Each conductive pin in the set of conductive pins may be positioned in a different channel among the plurality of channels. In one embodiment, each conductive pin in the set of conductive pins may include a set of vias connected by one or more connection pads, and each conductive pin in the set of conductive pins may be adjacent to, but may not contact, a conductive element in the middle stack or the bottom stack. In one embodiment, the ground well may increase the volume of the GNSS patch antenna to optimize the detectable frequency range associated with the GNSS patch antenna.

[0006] In another embodiment, a system may include a first global navigation satellite system (GNSS) patch antenna and a second GNSS patch antenna. The first GNSS patch antenna may include a first intermediate stack, a first top stack, a first bottom stack, and a first ground well. The first intermediate stack may include a first side and a second side opposite to the first side. The first top stack may be coupled to the first intermediate stack and may be positioned on the first side of the first intermediate stack. The first top stack may include at least one first conductive antenna element that may be configured to receive GNSS signals. The first bottom stack may be coupled to the first intermediate stack and may be positioned on the second side of the first intermediate stack. The first ground well may be formed on an exposed surface of the first bottom stack and at least an exposed portion of a surface of the second side of the first intermediate stack. The first ground well may be formed by electroplating a conductive material. At least a portion of the surface of the first intermediate stack covered by the first bottom stack may be free of conductive material. The second GNSS patch antenna may include a second intermediate stack, a second top stack, a second bottom stack, and a second ground well. The second intermediate stack may include a third side and a fourth side opposite to the third side. The second top stack may be coupled to the second middle stack and may be positioned on a third side of the second middle stack. The second top stack may include at least one second conductive antenna element. The second bottom stack may be coupled to the second middle stack and may be positioned on a fourth side of the second middle stack. A second ground well may be formed on an exposed surface of the second bottom stack and at least an exposed portion of a surface of the fourth side of the second middle stack. The second ground well may be formed by electroplating a conductive material. At least a portion of the surface of the second middle stack covered by the second bottom stack may be free of conductive material.

[0007] In one embodiment, the at least one first conductive antenna element may have a geometry similar to that of the first top laminate and may include copper, and the at least one second conductive antenna element may have a geometry similar to that of the second top laminate and may include copper. In one embodiment, the first intermediate laminate may define a first three-dimensional shape, the first top laminate may define a second three-dimensional shape, the first bottom laminate may define a third three-dimensional shape, and at least two dimensions of each of the second three-dimensional shape and the third three-dimensional shape may be geometrically similar. In addition, the second intermediate laminate may define a fourth three-dimensional shape, the second top laminate may define a fifth three-dimensional shape, the second bottom laminate may define a sixth three-dimensional shape, and at least two dimensions of each of the fifth three-dimensional shape and the sixth three-dimensional shape may be geometrically similar. In one embodiment, the second three-dimensional shape and the third three-dimensional shape may be cylindrical shapes of different sizes, the fifth three-dimensional shape and the sixth three-dimensional shape may be cylindrical shapes of different sizes, and the first three-dimensional shape and the fourth three-dimensional shape may be substantially the same shape, but different from the second three-dimensional shape, the third three-dimensional shape, the fifth three-dimensional shape, and the sixth three-dimensional shape. In one embodiment, the first three-dimensional shape may be the same as the fourth three-dimensional shape, the second three-dimensional shape may be the same as the fifth three-dimensional shape, the third three-dimensional shape may be the same as the sixth three-dimensional shape, and the first GNSS patch antenna may be the same as the second GNSS patch antenna.

[0008] In one embodiment, the system may further include a first group of channels and a second group of channels. The first group of channels may extend from the uppermost first conductive antenna element of at least one first conductive antenna element included in the first top stack to the first side of the first bottom stack. The first side of the first bottom stack may be positioned opposite to the second side of the first bottom stack, and the second side of the first bottom stack is adjacent to the second side of the first intermediate stack. In addition, the second group of channels may extend from the uppermost second conductive antenna element of at least one second conductive antenna element included in the second top stack to the first side of the second bottom stack. The first side of the second bottom stack may be positioned opposite to the second side of the second bottom stack, and the second side of the second bottom stack is adjacent to the second side of the second intermediate stack. In one embodiment, the system may further include a first group of conductive pins and a second group of conductive pins. The first group of conductive pins may correspond to the first group of channels, and each conductive pin in the first group of conductive pins may be positioned in a different channel in the first group of channels. In addition, the second group of conductive pins may correspond to the second group of channels, and each conductive pin in the second group of conductive pins may be positioned in a different channel in the second group of channels.

[0009] In one embodiment, each conductive pin in the first group of conductive pins may include a first group of vias connected by one or more connection pads, and each conductive pin in the first group of conductive pins may be adjacent to, but not in contact with, a conductive element in the first intermediate stack or the first bottom stack. In addition, each conductive pin in the second group of conductive pins may include a second group of vias connected by one or more connection pads, and each conductive pin in the second group of conductive pins may be adjacent to, but not in contact with, a conductive element in the second intermediate stack or the second bottom stack. In one embodiment, the first ground well may increase the volume of the first GNSS patch antenna to optimize the detectable frequency range associated with the first GNSS patch antenna, and the second ground well may increase the volume of the second GNSS patch antenna to optimize the detectable frequency range associated with the second GNSS patch antenna. In one embodiment, the system may also include an antenna board, which may include a first GNSS patch antenna and a second GNSS patch antenna. The first intermediate stack of the first GNSS patch antenna and the second intermediate stack of the second GNSS patch antenna may be a common intermediate stack of the antenna board and may be shared by the first GNSS patch antenna and the second GNSS patch antenna. The first bottom stack may be at substantially the same height as the second bottom stack.The first GNSS patch antenna and the second GNSS patch antenna may be arranged laterally offset from each other.

[0010] In another embodiment, a ground well layer for a global navigation satellite system (GNSS) patch antenna may include a housing and a set of channels. The housing may have a first side and a second side. The first side may be coupled to a first side of an intermediate stack of the GNSS patch antenna, and the second side may be plated with a conductive material. The set of channels may extend through the housing.

[0011] In one embodiment, each channel in the set of channels can be sized to accommodate a different conductive pin in a set of conductive pins. Each conductive pin in the set of conductive pins can be configured to extend within a corresponding channel in the set of channels and extend from the ground well layer to a patch included in a top stack of the GNSS patch antenna. The top stack can be positioned on a second side of the middle stack opposite to the first side.

[0012] Further areas of applicability of the present invention will become apparent from the detailed description provided hereinafter.It should be understood that the detailed description and specific examples, while indicating various embodiments, are intended for purposes of illustration only and are not intended to limit the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The present invention is described with reference to the accompanying drawings.

[0014] Figure 1 A perspective view and a side view of a patch antenna are depicted.

[0015] Figure 2 Depicted is a side cross-sectional view of a patch antenna with a ground well according to one embodiment.

[0016] Figure 3 Depicted are perspective and side views of a patch antenna with a ground well according to one embodiment.

[0017] Figure 4 Depicted is a Figure 2 A perspective view of a set of conductive pins of a patch antenna.

[0018] Figure 5 Depicted is a Figure 2 Bottom perspective view of the patch antenna.

[0019] Figure 6 A diagram of an antenna board including a set of patch antennas is depicted according to one embodiment.

[0020] Figure 7 Depicted is a method for forming a Figure 2 Flowchart of the process of making a patch antenna.

[0021] In the accompanying drawings, similar components and / or features may have the same reference number. In addition, various components of the same type may be distinguished by following the reference number with a dash and a second reference number that distinguishes between the similar components. If only the first reference number is used in the specification, the description applies to any one of the similar components having the same first reference number, regardless of the second reference number. DETAILED DESCRIPTION

[0022] The following description only provides (one or more) preferred exemplary embodiments, and is not intended to limit the scope, applicability or configuration of the present invention. On the contrary, the subsequent description of (one or more) preferred exemplary embodiments will provide an enabling description for implementing the preferred exemplary embodiments for those skilled in the art. It should be understood that various changes may be made to the function and arrangement of the elements without departing from the spirit and scope set forth in the appended claims.

[0023] The present invention relates to a patch antenna including a ground well for receiving and / or transmitting signals, but is not limited to such a patch antenna. The signal may originate from and / or terminate at a communication system such as a global navigation satellite system (GNSS), but other suitable communication systems such as a radio transmission system, a computer system, etc. may be used for the patch antenna. The patch antenna may include a bottom stack, an intermediate stack, a top stack, and any other suitable component for a patch antenna. The ground well may include one or more portions of the intermediate stack, one or more portions of the bottom stack, etc., or be formed on these portions. For example, the ground well may be formed on a lower exposed portion of the intermediate stack, a side exposed portion and a lower exposed portion of the bottom stack, or a combination thereof.

[0024] The middle stack, the top stack, and the bottom stack can be connected to each other. For example, the top stack can be positioned adjacent to and connected to a first side of the middle stack, and the bottom stack can be positioned adjacent to and connected to a second side opposite to the first side of the middle stack. The top stack of the patch antenna may include a conductive antenna element that can receive a signal from a communication system. In a specific example, the top stack may include at least one conductive antenna element that can receive a GNSS signal. In a specific example, the top stack may include a first conductive antenna element positioned on a first side of the top stack and a second conductive antenna element positioned within or on a second side opposite to the first side of the top stack.

[0025] In some embodiments, the bottom stack of the patch antenna may include one or more exposed surfaces and one or more non-exposed surfaces. The one or more non-exposed surfaces may be positioned adjacent to the intermediate stack, and the one or more exposed surfaces may be positioned opposite to the one or more non-exposed surfaces and away from the intermediate stack. In a specific example, the one or more exposed surfaces may form the bottom surface of the patch antenna or otherwise be included in the bottom surface of the patch antenna. Additionally or alternatively, the one or more exposed surfaces may include a conductive material that forms at least a portion of the ground well. For example, the one or more exposed surfaces may include an electroplated outer layer of a conductive material. Examples of conductive materials may include copper, silver, aluminum, titanium, other conductive elements, any alloys thereof, or any combination thereof. In some embodiments, the ground well of the patch antenna may include conductive material on one or more exposed portions of the bottom stack and one or more exposed portions of the intermediate stack. In these embodiments, the one or more exposed portions of the bottom stack and the one or more exposed portions of the intermediate stack may include at least an outer surface plated with a conductive material.

[0026] In some embodiments, the patch antenna, such as each of its components, may include a set of channels extending from a first side of the patch antenna to a second side of the patch antenna opposite to the first side. In a specific example, each channel in the set of channels or any subset thereof may extend from the top stack or its conductive antenna element to the second side of the patch antenna, which second side may be or include one or more exposed surfaces of the bottom stack. In addition, the size of each channel in the set of channels or any other subset thereof may be designed to accommodate different conductive pins in a set of conductive pins. The number of conductive pins in the set of conductive pins may be similar or the same as the number of channels in the set of channels. In addition, each conductive pin in the set of conductive pins may be positioned in a different channel in the set of channels to conduct signals between one or more conductive antenna elements and a circuit configured to process signals. In some embodiments, each conductive pin in the set of conductive pins may include one or more vias plated or filled with a conductive material. The via may be or include at least a portion of the corresponding conductive pin. For example, a particular conductive pin may include three separate plated vias extending through each of the top stack, the middle stack, and the bottom stack that are connected together to form the particular conductive pin, but any other number (e.g., less than three or more than three) of vias may be used to form the particular conductive pin.

[0027] The patch antenna with a ground well can be used for various applications. In a specific example, the patch antenna can be or include a GNSS patch antenna, which can be configured to receive signals from a GNSS transmitter. A GNSS transmitter that can be located in a satellite or can be communicatively coupled to a satellite in some examples can send one or more signals, and the GNSS patch antenna can receive the one or more signals, for example, via one or more conductive antenna elements, the set of conductive pins, etc.

[0028] In another example, the patch antenna may be included in a group of patch antennas that may be positioned on a common antenna board. The common antenna board may include a common (e.g., a single) intermediate stack that may be shared between each patch antenna included in the group of patch antennas or any subset thereof. In addition, each patch antenna may include a different top stack and a different bottom stack compared to other patch antennas in the group of patch antennas. The size, shape, or dimensions of the common antenna board may be designed to receive one or more signals from a transmitter. The transmitter may send one or more signals to the common antenna board (e.g., the transmitter may be communicatively coupled to the group of antennas of the common antenna board), or may otherwise appropriately send one or more signals so that the group of patch antennas may receive one or more signals. The transmitter may be or include a radio transmitter, a computer transmitter, or any other suitable transmitter that may send one or more signals that can be detected or otherwise received by the group of patch antennas.

[0029] In some embodiments, the structure of the patch antenna can provide various functional improvements for the patch antenna. In a specific example, the combination of the top stack, the middle stack, and the bottom stack, as well as the ground well, a set of conductive pins, etc., can allow the impedance of the received signal to be processed or otherwise controlled by the patch antenna without sending the received signal to a separate board. In addition, the ground well of the patch antenna can provide an increased or optimized (e.g., compared to other patch antennas) volume of the patch antenna, which can optimize (e.g., increase) the frequency range of the signal that the patch antenna can receive.

[0030] The following illustrative examples are presented to introduce the reader to the general subject matter discussed herein and are not intended to limit the scope of the disclosed concepts. The following sections describe various additional features and examples with reference to the accompanying drawings, in which like reference numerals indicate like elements, and directional descriptions are used to describe the illustrative aspects, but like the illustrative aspects, should not be used to limit the invention. In addition, the presented figures are generally described with respect to computer modeling operations, but the general subject matter discussed herein is not limited to computer modeling operations.

[0031] First reference Figure 1, depicting a perspective view 100a and a side view 100b of a patch antenna 103. As shown, the patch antenna 103 includes an intermediate stack 104 and a top stack 106, the intermediate stack 104 can be or include a ground plane, such as a flat ground plane, but the patch antenna 103 can include additional or alternative components or combinations of components. The intermediate stack 104 can include a first side 108 and a second side 110. The second side 110 can be positioned opposite the first side 108. In addition, the intermediate stack 104 can be or include a conductive material. In a specific example, the outer electroplating layer of the intermediate stack can be or include a conductive material, such as copper, silver, aluminum, titanium, any other conductive element, any alloy thereof, or any combination thereof.

[0032] The top stack 106 can be positioned on or adjacent to the first side 108 of the middle stack 104. For example, the top stack 106 can be coupled (e.g., mechanically, chemically, etc.) to the first side 108 of the middle stack 104, can be integrally formed with the first side 108 of the middle stack 104, etc. In addition, the top stack 106 can include a conductive antenna element 112, a stack portion 114, and any other suitable components for the top stack 106. The conductive antenna element 112 or any other suitable component of the patch antenna 103 can be positioned to receive one or more signals, such as from a transmitter of a global navigation satellite system (GNSS) or a transmitter communicatively coupled to the GNSS. In some embodiments, the conductive antenna element 112 can define a first shape that can be geometrically similar to a second shape defined by the top stack 106. In a particular example, the conductive antenna element 112 may be square or circular, and the top stack 106 may also be square or circular that is at least slightly larger than the square or circular shape of the conductive antenna element 112. Although described as square or circular, the conductive antenna element 112 and / or the top stack 106 may be or include other suitable shapes, such as rectangular, oval, triangular, irregular, etc.

[0033] The conductive antenna element 112 may be or include a conductive material, such as copper, silver, aluminum, titanium, any other conductive element, any alloy thereof, or any combination thereof. In a specific example, the conductive antenna element 112 may be or include copper or a copper alloy, and the intermediate stack 104 may be or include the same or similar copper or copper alloy. In addition, the stack portion 114 of the top stack 106 may be or include a non-metallic material that may be electrically insulating. For example, the stack portion 114 of the top stack 106 may be or include a dielectric material, a ceramic material, an electrically insulating polymer material, a stack material, other non-conductive materials, or any combination thereof. The stack portion 114 may be integrally formed with the conductive antenna element 112, or otherwise mechanically or chemically coupled to the conductive antenna element 112 to form the top stack 106.

[0034] Figure 2 2 is a side cross-sectional view 200 of a patch antenna 102 having a ground well 208 according to one embodiment. As shown, the patch antenna 102 may include a bottom stack 202, an intermediate stack 104, and a top stack 106, but the patch antenna 102 may include additional or alternative components for receiving GNSS signals or other suitable signals. The intermediate stack 104 may include a first side 108 and a second side 110 positioned opposite the first side 108. In addition, the top stack 106 may be positioned on or adjacent to the first side 108 of the intermediate stack 104.

[0035] The ground well 208 can increase the volume of the patch antenna 102 (e.g., compared to other patch antennas) to optimize the detectable frequency range associated with the patch antenna 102. The ground well 208 forms a ground plane disposed on a bottom surface or lower surface of the patch antenna 102. The bottom stack 202 can be positioned on or adjacent to the second side 110 of the intermediate stack 104. For example, one or more unexposed portions 204 of the bottom stack 202 can be positioned on or coupled to at least a portion 205 (e.g., a central portion) of the second side 110 of the intermediate stack 104. The portion 205 of the second side 110 of the intermediate stack 104 can be free of conductive material, can be partially coated or plated with a non-conductive material, etc. The one or more exposed portions 206 of the bottom stack 202 can be positioned or arranged to face away from or away from the second side 110 of the intermediate stack 104. For example, the conductive material on the one or more exposed portions 206 of the bottom stack 202 may form or be included in the ground well 208 of the patch antenna 102. In a specific example, the conductive material on the one or more exposed portions 206 of the bottom stack 202 may form a first component 210a of the ground well 208 of the patch antenna 102, and the conductive material on the one or more lower exposed portions 212 of the middle stack 104 may form a second component 210b of the ground well 208 of the patch antenna 102. In addition, the ground well 208 may be positioned adjacent to or near external circuitry (e.g., a printed circuit board assembly) that may process or otherwise receive signals received by the patch antenna 102.

[0036] In addition, the top stack 106 may include one conductive antenna element, two conductive antenna elements, or more conductive antenna elements. In a specific example, and as Figure 2 As shown, the top stackup 106 of the patch antenna 102 may include the conductive antenna element 112 and the second conductive antenna element 225. The conductive antenna element 112 and the second conductive antenna element 225 may be separated by a dielectric or other type of stackup material layer.

[0037] In some embodiments, patch antenna 102 may include one or more channels 215, such as channels 215a-215c. Figure 2The side cross-sectional view 200 shows three channels, but any suitable number of channels may be included as a feed portion in the patch antenna 102 (e.g., less than three or more than three channels). Each of the channels 215a-215c may extend from a first end of the patch antenna 102 to a second end of the patch antenna 102. In a specific example, each of the channels 215a-215c may extend from a second conductive antenna element 225 that may be included on the top stack 106 to a circuit that may be integrated with or separate from the patch antenna 200. Each of the channels 215a-215c may be substantially similar or identical to each other. For example, each of the channels 215a-215c may have a similar or identical radius to the other channels in the channels 215a-215c, may have a similar or identical length to the other channels in the channels 215a-215c, may have a similar or identical number and / or type of components, such as vias, and the like, as the other channels in the channels 215a-215c. In other embodiments, one or more of the channels 215a-215c may have one or more different dimensions or other properties than other of the channels 215a-215c.

[0038] In addition, the size, orientation, or other arrangement of each channel in the channels 215a-215c can be designed to accommodate different conductive pins in the conductive pins 216a-216c. As shown in the side cross-sectional view 200, the conductive pins 216a-216c include three conductive pins, but the patch antenna 102 may include other suitable numbers (e.g., less than three or more than three) of conductive pins. Each of the conductive pins 216a-216c can be positioned in a different channel in the channels 215a-215c. For example, the conductive pin 216a can be positioned in the channel 215a, the conductive pin 216b can be positioned in the channel 215b, and the conductive pin 216c can be positioned in the channel 215c, but any permutation thereof is possible.

[0039] In some embodiments, each of the conductive pins 216a-216c may include a set of vias that may be connected via one or more connection pads. In a specific example, the conductive pin 216c may include vias 220a-220c that may be connected together using connection pads 222a-222b. Via 220a may be connected to via 220b using connection pads 222a, and via 220c may be connected to via 220c using connection pads 222b. For example, each of the vias 220a-220c may be soldered to each of the connection pads 222a-222b so that the conductive pin 216c does not electrically contact the conductive elements in the middle stack 104 or the conductive elements in the bottom stack 202.

[0040] Figure 3 300a and side views 300b of a patch antenna 102 with a ground well 208 according to one embodiment. As shown, the patch antenna 102 may include a bottom stack 202, an intermediate stack 104, and a top stack 106, but the patch antenna 102 may include additional or alternative components for receiving GNSS signals or other suitable signals. The intermediate stack 104 may include a first side 108 and a second side 110 positioned opposite the first side 108. In addition, the top stack 106 may be positioned on or adjacent to the first side 108 of the intermediate stack 104. In some embodiments, the distance from the bottom stack 202 to the top stack 106 that can be measured may be less than or approximately 4 mm, 6 mm, 8 mm, 10 mm, 12 mm, 14 mm, 16 mm, 18 mm, 20 mm, etc. For example, the thickness of the middle stack 104, the top stack 106, and the bottom stack 202 may be less than or approximately 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, etc. The middle stack 104, the top stack 106, and the bottom stack 202 may have similar or the same height or other dimensions, or the middle stack 104, the top stack 106, and the bottom stack 202 may have different heights or other dimensions.

[0041] In some embodiments, the middle stack 104 can define a first three-dimensional shape, the top stack 106 can define a second three-dimensional shape, and the bottom stack 202 can define a third three-dimensional shape. In addition, at least two dimensions of each of the first three-dimensional shape, the second three-dimensional shape, and the third three-dimensional shape can be geometrically similar. In a specific example, for example, Figure 3 As shown, the middle stack 104, the top stack 106, and the bottom stack 202 can define a first cylinder, a second cylinder, and a third cylinder, respectively. The first cylinder, the second cylinder, and the third cylinder can have different heights, different radii, or other different dimensions, but can also have other dimensions that are substantially the same or similar to each other. Although described and shown as cylinders (or cylinder-like shapes), the middle stack 104, the top stack 106, and / or the bottom stack 202 can be or define other suitable shapes, such as a cube, a rectangular prism, an irregular three-dimensional shape, etc.

[0042] The ground well 208 may increase the volume of the patch antenna 102 (e.g., compared to other patch antennas) to optimize the detectable frequency range associated with the patch antenna 102. The bottom stack 202 may be positioned on or adjacent to the second side 110 of the middle stack 104. For example, one or more non-exposed portions 204 of the bottom stack 202 may be positioned on or coupled to at least a portion 205, which may be free of conductive material, may be partially coated or plated with a non-conductive material, etc. The one or more exposed portions 206 of the bottom stack 202 may be positioned or arranged to face away from or away from the second side 110 of the middle stack 104. For example, the conductive material on the one or more exposed portions 206 of the bottom stack 202 may form or be included in the ground well 208 of the patch antenna 102. In a specific example, the conductive material on the one or more exposed portions 206 of the bottom stack 202 can form a first portion 210 a of the ground well 208 of the patch antenna 102, and the conductive material on the one or more lower exposed portions 212 of the middle stack 104 can form a second portion 210 b of the ground well 208 of the patch antenna 102. In addition, the bottom stack 202 can be positioned adjacent to or proximate to external circuitry (e.g., a printed circuit board assembly) that can process or receive signals received by the patch antenna 102.

[0043] In some embodiments, the ground well 208 or any of its components, such as one or more exposed portions 206 of the bottom stack 202, one or more lower exposed portions 212 of the middle stack 104, or a combination thereof, may be or include a conductive material. For example, the portion of the ground well 208 covering the one or more exposed portions 206 of the bottom stack 202, one or more lower exposed portions 212 of the middle stack 104, or a combination thereof may be or include a conductive material, such as copper, silver, aluminum, titanium, any other conductive element, any alloy thereof, one or more conductive polymer materials, or any combination thereof. In some embodiments, the portion of the ground well 208 covering the one or more exposed portions 206 of the bottom stack 202 and the one or more lower exposed portions 212 of the middle stack 104 may be formed of or include similar or the same material. In a specific example, the portion of the ground well 208 covering the one or more exposed portions 206 of the bottom stack 202 and the one or more lower exposed portions 212 of the middle stack 104 may include copper or a copper alloy. In another specific example, the portion of the ground well 208 covering the one or more exposed portions 206 of the bottom stack 202 and the one or more lower exposed portions 212 of the middle stack 104 may be formed by plating similar or identical materials during a common process of manufacturing the patch antenna 102 .

[0044] Figure 4 1 is a perspective view of a group of conductive pins 216a-216d of the patch antenna 102 according to one embodiment. As shown, the patch antenna 102 includes four conductive pins 216a-216d, but any other suitable number (e.g., less than four or more than four) of conductive pins may be included in the patch antenna 102. In addition, the group of conductive pins 216a-216d is shown as being arranged in an approximately square shape around the center point 402 of the top stack 106, but the group of conductive pins 216a-216d may be appropriately arranged in the patch antenna 102 in other ways to optimize the detection frequency range of the patch antenna 102. For example, the group of conductive pins 216a-216d may be arranged around the center point 402 in an approximately circular shape, an elliptical shape, a rectangular shape, an irregular shape, etc.

[0045] like Figure 4 As shown, each of the conductive pins 216a-216d can extend from a first end 404 of the patch antenna 102 to a second end 406 of the patch antenna 102. In some embodiments, the first end 404 of the patch antenna 102 can be close to or adjacent to an outer surface of the patch antenna 102. For example, the first end 404 can coincide with the conductive antenna element 112 or the second conductive antenna element 225 of the top stack 106. In addition, the second end 406 of the patch antenna 102 can coincide with an outer (e.g., outwardly facing) surface of the bottom stack 202, such as one or more portions of the ground well 208. In a specific example, each of the conductive pins 216a-216d can extend from the first end 404 of the patch antenna 102 to the second end 406 of the patch antenna 102.

[0046] In some embodiments, each conductive pin in the set of conductive pins 216a-216d can extend through the intermediate stack 104, for example, from the first end 404 of the patch antenna 102 to the second end 406 of the patch antenna 102. In addition, although the set of conductive pins 216a-216d is shown as being arranged in an approximately square shape around the center point 402, the set of conductive pins 216a-216d can be arranged in other suitable ways. For example, the set of conductive pins 216a-216d can be arranged in an approximately circular shape around the center point 402, arranged in an approximately rectangular shape around the center point 402, irregularly spaced around the center point 402, arranged around a different point or a different set of points, etc. In some embodiments, one or more conductive pins in the set of conductive pins 216a-216d can extend through the intermediate stack 104 without being in electrical contact with the intermediate stack 104 or any component or portion thereof.

[0047] Figure 5FIG. 1 is a bottom perspective view of a patch antenna 102 according to one embodiment. Figure 5 As shown, the patch antenna 102 may include the middle stack 104 and the bottom stack 202, but the patch antenna 102 may additionally or alternatively include any other suitable components or combinations of components. In addition, the patch antenna 102 may include a set of conductive pins 216a-216d that may be arranged around a center point on a ground well 208 of the patch antenna 102. The ground well 208 may include a first component 210a that may be formed on an outer surface of the bottom stack 202 and a second component 210b that may be formed on a lower outer surface of the middle stack 104 oriented in the same or similar direction as the outer surface of the bottom stack 202.

[0048] In some embodiments, the first component 210a and the second component 210b can form a monolithic electrical ground plane for the patch antenna 102. For example, the ground well 208, which can include the first component 210a and the second component 210b, can be or include a continuous surface that is plated with or includes a conductive material that can serve as a ground plane for the patch antenna 102. The ground well 208 can define a cross-sectional shape that can include a U-shape, a stepped shape, or other suitable shapes for the cross-section of the ground well 208.

[0049] Figure 6 600a-600c are a set of views 600a-600c of an antenna board 602 including a set of patch antennas 102a-102b according to one embodiment. View 600a may be or include a top view of the antenna board 602, view 600b may be or include a bottom view of the antenna board 602, and view 600c may be or include a side view of the antenna board 602. Figure 6 As shown, the antenna board 602 includes two patch antennas 102a-102b, but any other suitable number (e.g., less than two or more than two) of patch antennas is also possible. In addition, although the patch antennas 102a-102b are shown as being positioned on the antenna board 602 in a single row, the patch antennas 102a-102b can be arranged in other ways (e.g., in an array, a circle, etc.) to adjust the function or orientation of the antenna board 602.

[0050] In some embodiments, each of the patch antennas 102a-102b may include a separate top stack, a separate bottom stack, and a separate set of channels. For example, (i) patch antenna 102a may include a top stack 106a, a bottom stack 202a, and a set of channels 215a-215d, and (ii) patch antenna 102b may include a top stack 106b, a bottom stack 202b, and a set of channels 215e-215h, but any suitable permutations thereof are possible. In addition, each of the channels 215a-215h may include or be sized to accommodate a different conductive pin that may extend from the corresponding top stack or any conductive antenna element thereof through the corresponding bottom stack.

[0051] In some embodiments, antenna board 602 may include or may be an intermediate laminate. For example, antenna board 602 may be a common intermediate laminate that may be shared between each of patch antennas 102a-102b. In other embodiments, antenna board 602 may be or include a printed circuit board or printed circuit board assembly that includes one or more intermediate laminates that may be shared by or distributed between patch antennas 102a-102b.

[0052] Figure 7 7 is a flow chart of a process 700 for manufacturing a patch antenna 102 according to one embodiment. At block 702, a top stack 106 is formed. The top stack 106 may be or include a stack material, such as a dielectric material, a polymer material, another non-conductive material, etc. In addition, the top stack 106 may include one or more conductive antenna elements. For example, the top stack 106 may include a conductive antenna element 112, a second conductive antenna element 225, or a combination thereof. In a specific example, the top stack 106 may include a conductive antenna element 112 and a second conductive antenna element 225 separated from each other by a dielectric material or other suitable stack material. Additionally or alternatively, the top stack 106 may include at least a portion of one or more channels (e.g., channels 215a-215c) that may extend through the thickness of the top stack 106.

[0053] At block 704, the intermediate stack 104 is formed. The intermediate stack 104 may be or include a stack material, such as a dielectric material, a polymer material, another non-conductive material, etc. In addition, the intermediate stack 104 may include one or more outer surfaces or portions thereof, which may be plated with a conductive material. For example, the intermediate stack 104 may include a second component 210b of the ground well 208, which may be formed on at least a portion of the lower outer surface of the intermediate stack 104. The second component 210b of the ground well 208 may be formed by electroplating, or may include a conductive material. Examples of conductive materials may include copper, silver, aluminum, titanium, other conductive elements, any alloys thereof, or any combination thereof.

[0054] At block 706, the bottom stack 202 is formed. The bottom stack 202 may be or include a stack material, such as a dielectric material, a polymer material, another non-conductive material, etc. In addition, the bottom stack 202 may include one or more outer surfaces or a portion thereof that may be plated with a conductive material. For example, the bottom stack 202 may include a first component 210a of the ground well 208, which may be formed on at least a portion of an outer surface of the bottom stack 202. The first component 210a of the ground well 208 may be formed by electroplating, or may include a conductive material. Examples of conductive materials may include copper, silver, aluminum, titanium, other conductive elements, any alloys thereof, or any combination thereof.

[0055] At block 708, the patch antenna 102 may be formed with the top stack 106, the middle stack 104, and the bottom stack 202. The top stack 106 may be coupled to a first side of the middle stack 104, and the bottom stack 202 may be coupled to a second side of the middle stack 104 opposite the first side. In some embodiments, coupling the middle stack 104 and the bottom stack 202 may form a ground well 208, which may be or include a bottom surface of the patch antenna 102, which may serve as an electrical ground plane for the patch antenna 102. In a specific example, the ground well 208 may be formed by or include a first component 210a and a second component 210b. Additionally or alternatively, a cross-section of the ground well 208 may be or include a U-shape, a stepped shape, or any other suitable shape of the ground well 208.

[0056] The various features described herein, such as methods, devices, computer-readable media, etc., can be implemented using a combination of dedicated components, programmable processors, and / or other programmable devices. The processes described herein can be implemented on the same processor or on different processors. Where components are described as being configured to perform certain operations, such configurations can be implemented, for example, by designing electronic circuits to perform the operations, by programming programmable electronic circuits (e.g., microprocessors) to perform the operations, or a combination thereof. In addition, although the above embodiments may refer to specific hardware and software components, it will be appreciated by those skilled in the art that different combinations of hardware and / or software components may also be used, and specific operations described as being implemented in hardware may also be implemented in software, and vice versa.

[0057] Specific details are given in the above description to provide an understanding of the embodiments. However, it should be understood that the embodiments can be practiced without these specific details. In some cases, in order to avoid obscuring the embodiments, well-known circuits, processes, algorithms, structures and techniques may be shown without unnecessary details.

[0058] Although the principles of the present invention are described above in conjunction with specific devices and methods, it should be understood that this description is intended to be exemplary only and not to limit the scope of the present invention. The embodiments are selected and described in order to explain the principles and practical applications of the present invention so that other persons skilled in the art can use the present invention in various embodiments suitable for the intended specific use and with various modifications. It should be understood that this description is intended to cover modifications and equivalents.

[0059] In addition, it should be noted that an embodiment may be described as a process, which is depicted as a flow chart, a job diagram, a data flow diagram, a structure diagram, or a block diagram. Although a flow chart may describe an operation as a sequential process, many operations may be performed in parallel or simultaneously. In addition, the order of the operations may be rearranged. A process terminates when its operations are completed, but may have additional steps not included in the figure. A process may correspond to a method, a function, a program, a subroutine, a subprogram, etc.

[0060] Unless otherwise stated, the terms "a", "an" or "the" mean "one or more". The patents, patent applications, publications, and descriptions mentioned herein are incorporated by reference in their entirety for all purposes. None is admitted to be prior art.

Claims

1. A global navigation satellite system patch antenna, comprising: an intermediate laminate, the intermediate laminate comprising a first side and a second side opposite the first side; a top stack coupled to the middle stack and positioned on a first side of the middle stack, the top stack comprising at least one conductive antenna element configured to receive a global navigation satellite system signal; a bottom stack coupled to the middle stack and positioned on a second side of the middle stack; as well as a ground well covering the exposed surface of the bottom stack and at least an exposed portion of a surface of the second side of the middle stack, the ground well comprising a conductive material, wherein at least a portion of the surface of the middle stack covered by the bottom stack is free of the conductive material.

2. The GNSS patch antenna according to claim 1, wherein: The at least one conductive antenna element has a geometry similar to that of the top stack, and the at least one conductive antenna element comprises copper.

3. The GNSS patch antenna according to claim 1, wherein: The middle stack defines a first three-dimensional shape, the top stack defines a second three-dimensional shape, and the bottom stack defines a third three-dimensional shape, wherein at least two dimensions of each of the first three-dimensional shape, the second three-dimensional shape, and the third three-dimensional shape are geometrically similar.

4. The GNSS patch antenna according to claim 3, wherein: The first three-dimensional shape, the second three-dimensional shape, and the third three-dimensional shape are each cylindrical shapes of different sizes, and wherein the first three-dimensional shape has a first radius, the first radius being greater than a second radius of the second three-dimensional shape and a third radius of the third three-dimensional shape.

5. The GNSS patch antenna of claim 1 , further comprising a plurality of channels extending from an uppermost conductive antenna element of the at least one conductive antenna element included in the top stack to a first side of the bottom stack, wherein: The first side of the bottom stack is positioned opposite to the second side of the bottom stack, and the second side of the bottom stack is adjacent to the second side of the middle stack.

6. The GNSS patch antenna according to claim 5, further comprising a plurality of conductive pins corresponding to the plurality of channels, wherein: Each conductive pin of the plurality of conductive pins is positioned in a different channel of the plurality of channels.

7. The GNSS patch antenna according to claim 6, wherein: Each of the plurality of conductive pins includes a plurality of vias connected by one or more connection pads, and each of the plurality of conductive pins is adjacent to, but not in contact with, a conductive element in the middle stack or the bottom stack.

8. The GNSS patch antenna of claim 1, wherein: The ground well increases the volume of the GNSS patch antenna to optimize a detectable frequency range associated with the GNSS patch antenna.

9. A system comprising: A first global navigation satellite system patch antenna, the first global navigation satellite system patch antenna comprising: a first intermediate laminate comprising a first side and a second side opposite the first side; a first top stack coupled to the first middle stack and positioned on a first side of the first middle stack, the first top stack comprising at least one first conductive antenna element configured to receive a global navigation satellite system signal; a first bottom stack coupled to the first intermediate stack and positioned on a second side of the first intermediate stack; and a first ground well, the first ground well covering an exposed surface of the first bottom stack and at least an exposed portion of a surface of a second side of the first middle stack, the first ground well comprising a conductive material, wherein at least a portion of the surface of the first middle stack covered by the first bottom stack is free of the conductive material; and A second global navigation satellite system patch antenna, the second global navigation satellite system patch antenna comprising: a second intermediate laminate comprising a third side and a fourth side opposite the third side; a second top stack coupled to the second middle stack and positioned on a third side of the second middle stack, the second top stack comprising at least one second conductive antenna element; a second bottom laminate coupled to the second intermediate laminate and positioned on a fourth side of the second intermediate laminate; and a second ground well, the second ground well covering the exposed surface of the second bottom stack and at least an exposed portion of a surface of a fourth side of the second middle stack, the second ground well comprising a conductive material, wherein at least a portion of the surface of the second middle stack covered by the second bottom stack is free of the conductive material.

10. The system according to claim 9, wherein: The at least one first conductive antenna element has a geometry similar to that of the first top stack and comprises copper; and The at least one second conductive antenna element has a geometry similar to that of the second top layer stack and comprises copper.

11. The system according to claim 9, wherein: the first middle laminate defines a first three-dimensional shape, the first top laminate defines a second three-dimensional shape, the first bottom laminate defines a third three-dimensional shape, and at least two dimensions of each of the second three-dimensional shape and the third three-dimensional shape are geometrically similar; and The second middle laminate defines a fourth three-dimensional shape, the second top laminate defines a fifth three-dimensional shape, the second bottom laminate defines a sixth three-dimensional shape, and at least two dimensions of each of the fifth and sixth three-dimensional shapes are geometrically similar.

12. The system according to claim 11, wherein: The second three-dimensional shape and the third three-dimensional shape are cylindrical shapes of different sizes; The fifth three-dimensional shape and the sixth three-dimensional shape are cylindrical shapes of different sizes; and The first three-dimensional shape and the fourth three-dimensional shape are substantially the same shape, but are different from the second three-dimensional shape, the third three-dimensional shape, the fifth three-dimensional shape, and the sixth three-dimensional shape.

13. The system according to claim 12, wherein: The first three-dimensional shape is the same as the fourth three-dimensional shape, the second three-dimensional shape is the same as the fifth three-dimensional shape, the third three-dimensional shape is the same as the sixth three-dimensional shape, and the first global navigation satellite system patch antenna is the same as the second global navigation satellite system patch antenna.

14. The system of claim 9, further comprising: a first plurality of channels extending from an uppermost first conductive antenna element of at least one first conductive antenna element included in the first top stack to a first side of the first bottom stack, wherein the first side of the first bottom stack is positioned opposite to a second side of the first bottom stack, the second side of the first bottom stack being adjacent to a second side of the first middle stack; and and a second plurality of channels extending from an uppermost second conductive antenna element of at least one second conductive antenna element included in the second top stack to a first side of the second bottom stack, wherein the first side of the second bottom stack is positioned opposite to a second side of the second bottom stack, and the second side of the second bottom stack is adjacent to a second side of the second middle stack.

15. The system of claim 14, further comprising: a first plurality of conductive pins, the first plurality of conductive pins corresponding to the first plurality of channels, wherein each conductive pin of the first plurality of conductive pins is positioned in a different channel of the first plurality of channels; and A second plurality of conductive pins corresponding to the second plurality of channels, wherein each conductive pin of the second plurality of conductive pins is positioned in a different channel of the second plurality of channels.

16. The system of claim 15, wherein: Each of the first plurality of conductive pins comprises a first plurality of vias connected by one or more connection pads, and wherein each of the first plurality of conductive pins is adjacent to, but not in contact with, a conductive element in the first middle stack or the first bottom stack; and Each of the second plurality of conductive pins includes a second plurality of vias connected by one or more connection pads, and wherein each of the second plurality of conductive pins is adjacent to, but not in contact with, a conductive element in the second middle stack or the second bottom stack.

17. The system according to claim 9, wherein: The first ground well increases the volume of the first global navigation satellite system patch antenna to optimize the detectable frequency range associated with the first global navigation satellite system patch antenna, and wherein the second ground well increases the volume of the second global navigation satellite system patch antenna to optimize the detectable frequency range associated with the second global navigation satellite system patch antenna.

18. The system of claim 9, further comprising an antenna panel including the first GNSS patch antenna and the second GNSS patch antenna, wherein: The first intermediate stack of the first GNSS patch antenna and the second intermediate stack of the second GNSS patch antenna are common intermediate stacks of the antenna board and are shared by the first GNSS patch antenna and the second GNSS patch antenna, and wherein, The first bottom stack is at substantially the same height as the second bottom stack, and The first GNSS patch antenna and the second GNSS patch antenna are arranged laterally offset from each other.

19. A ground well layer for a global navigation satellite system patch antenna, the ground well layer comprising: A housing having a first side and a second side, wherein The first side is coupled to a first side of an intermediate stack of the GNSS patch antenna, and The second side is plated with a conductive material; and A plurality of channels extend through the housing.

20. The ground well layer according to claim 19, wherein: Each of the plurality of channels is sized to accommodate a different one of the plurality of conductive pins, wherein each of the plurality of conductive pins is configured to extend within a corresponding one of the plurality of channels and to a patch included in a top stack of the global navigation satellite system patch antenna, and wherein the top stack is positioned on a second side opposite the first side of the middle stack.

Images