Processing method of copper-embedded circuit board and copper-embedded circuit board

Abstract

The invention relates to a processing method of a copper-embedded circuit board and the copper-embedded circuit board. The processing method of the copper-embedded circuit board comprises the following steps: preparing an integral circuit board with an embedded copper block and a welding column; drilling through holes in the whole circuit board, enabling the through holes to penetrate through the copper blocks, and removing the welding columns; and the through holes are filled with copper materials, so that all the circuit layers of the whole circuit board are connected with the copper blocks through the copper materials. According to the processing method of the copper-embedded circuit board, the copper block is embedded into the whole circuit board through the welding column for heat dissipation, then the through hole is drilled to remove the welding column and the through hole is filled with the copper material, and the copper block is conducted with each circuit layer of the whole circuit board. The contact area of the heat dissipation copper block and the high current density area of the copper-embedded circuit board can be effectively increased, the heat dissipation exchange efficiency of the copper-embedded circuit board is improved, the heat dissipation performance is improved, the processing efficiency and the processing precision are improved, meanwhile, the quality problem caused by the existence of the welding column is avoided, and the product reliability is improved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a processing method for a buried copper circuit board and a buried copper circuit board. Background Art

[0002] With the continuous advancement of technology, the functions of electronic devices are becoming increasingly powerful, and the requirements for heat dissipation performance are becoming higher and higher. Therefore, various heat dissipation circuit boards have become an indispensable part of modern electronic devices.

[0003] In the related art, copper particles are embedded inside the printed circuit board (PCB) for heat dissipation. However, the contact area between the copper particles and the high current density area in the circuit board is small, which limits the heat exchange efficiency, resulting in insufficient heat transfer, weakening the heat dissipation efficiency, and affecting the heat dissipation performance of the heat dissipation circuit board. Summary of the invention

[0004] Based on this, it is necessary to provide a processing method for a buried copper circuit board and a buried copper circuit board to address the problem that the contact area between copper particles and the high current density area in the circuit board is small, which affects the heat dissipation performance.

[0005] In a first aspect, a method for processing a buried copper circuit board is provided, comprising:

[0006] preparing an integral circuit board having embedded copper blocks and welding posts;

[0007] Drilling a through hole on the integral circuit board so that the through hole passes through the copper block and removes the welding column;

[0008] The through hole is filled with copper material, so that the copper material connects all circuit layers of the overall circuit board with the copper block.

[0009] In some embodiments, the through hole has a diameter that is 4 mils to 6 mils larger than an outer diameter of the solder post.

[0010] In some embodiments, the through hole includes one of a circular hole, an elliptical hole, and a polygonal hole.

[0011] In some embodiments, the step of filling the through hole with copper material comprises:

[0012] Performing copper deposition and board electrical processing on the overall circuit board, and making a resist coating;

[0013] The through-holes are filled with copper material by performing hole-filling electroplating.

[0014] In some embodiments, the preparation of the integrated circuit board having embedded copper blocks and welding columns includes:

[0015] The copper block is fixed to the base plate by welding columns to obtain a heat dissipation core plate;

[0016] The heat dissipation core board is pressed and fixed with at least one circuit core board to obtain the integral circuit board with embedded copper blocks and welding columns.

[0017] In some embodiments, the circuit layer is provided on at least one side of the circuit core board; the circuit core board includes a copper clad board, and the circuit layer is a copper layer formed with a circuit pattern.

[0018] In some embodiments, the heat dissipation core plate includes a plurality of the copper blocks; along the axial direction of the through hole, end surfaces of the plurality of the copper blocks are flush.

[0019] In some embodiments, the copper block has a thickness ranging from 300 micrometers to 800 micrometers.

[0020] In some embodiments, the shape of the copper block includes one of a square, a cylinder, a polygonal column, and a line.

[0021] In a second aspect, a buried copper circuit board is provided, wherein the buried copper circuit board is prepared by the processing method of the buried copper circuit board described in any one of the first aspects.

[0022] The above-mentioned processing method of the buried copper circuit board and the buried copper circuit board, bury the copper block into the interior of the overall circuit board through the welding column to dissipate heat, and then remove the welding column by drilling through holes and fill the through holes with copper material to connect the copper block with each circuit layer of the overall circuit board. This can effectively increase the contact area between the heat dissipation copper block and the high current density area of ​​the buried copper circuit board, improve the heat dissipation exchange efficiency of the buried copper circuit board, improve the heat dissipation performance, and is conducive to improving the processing efficiency and processing accuracy, while avoiding quality problems caused by the presence of welding columns, improving product reliability, and solving the problems of explosive boards and poor heat dissipation exchange efficiency of circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] FIG. 1 is a schematic flow chart of a method for processing a buried copper circuit board according to some embodiments of the present application.

[0024] FIG. 2 is a schematic diagram of the structure of an overall circuit board according to some embodiments of the present application.

[0025] FIG. 3 is a schematic diagram of drilling through holes on an integral circuit board according to some embodiments of the present application.

[0026] FIG. 4 is a schematic diagram of the structure of a buried copper circuit board according to some embodiments of the present application.

[0027] FIG. 5 is a schematic diagram of the structure of a heat dissipation core board according to some embodiments of the present application.

[0028] Figure Number:

[0029] 100. buried copper circuit board; 10. integral circuit board; 1. heat dissipation core board; 11. substrate; 12. copper foil; 2. copper block; 3. welding column; 4. circuit core board; 101. through hole; 20. copper material. DETAILED DESCRIPTION

[0030] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0031] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, "plurality" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0033] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0034] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0035] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. An element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and are not intended to be the only implementation method.

[0036] Referring to FIG. 1 , FIG. 1 shows a schematic flow chart of a method for processing a buried copper circuit board in some embodiments of the present application. The method for processing a buried copper circuit board provided in an embodiment of the present application comprises the following steps:

[0037] Step S100, preparing an integral circuit board with embedded copper blocks and welding columns;

[0038] Step S200, drilling a through hole on the overall circuit board, passing through the copper block and removing the soldering column;

[0039] Step S300, filling the through hole with copper material so that the copper material connects all circuit layers of the entire circuit board with the copper block.

[0040] As shown in Figure 2, Figure 2 shows a schematic diagram of the structure of the overall circuit board 10 in some embodiments of the present application; embedding at least one copper block 2 inside the overall circuit board 10 can greatly improve the heat dissipation performance of the overall circuit board 10; for example, the number of copper blocks 2 can be 1, 2, 3, 5 or more; each copper block 2 is embedded in the overall circuit board 10 through at least one welding column 3 for heat dissipation, and the processing efficiency and processing accuracy are higher; wherein, along the thickness direction of the overall circuit board 10, the projection of the welding column 3 is located within the projection range of the copper block 2; the welding column 3 can be a welding copper column.

[0041] As shown in FIG. 3 , FIG. 3 shows a schematic diagram of drilling a through hole 101 on the overall circuit board 10 in some embodiments of the present application; a drill is used to drill through the welding column 3 and the copper block 2, so that the through hole 101 passes through the two opposite sides of the overall circuit board 10 and the copper block 2, and the welding column 3 is removed at the same time; wherein, the inner diameter of the through hole 101 is larger than the diameter of the welding column 3 and smaller than the length and width of the copper block 2; the length and width of the copper block 2 refer to the dimensions of the copper block 2 in the axial direction perpendicular to the through hole 101. For example, the drilling machine may include a laser drilling device, which uses a laser to burn through the overall circuit board 10. By removing the welding column 3 while retaining the copper block 2, quality problems caused by the presence of the welding column 3, such as problems such as poor bonding and explosive circuit boards, can be avoided, while improving heat dissipation performance and product reliability.

[0042] As shown in FIG4 , FIG4 shows a schematic diagram of the structure of the buried copper circuit board 100 in some embodiments of the present application; after drilling the through hole 101 on the overall circuit board 10, the through hole 101 is filled with copper material 20, so that the copper material 20 forms a copper column with the same shape as the through hole 101; because the through hole 101 runs through each circuit layer and the copper block 2 of the overall circuit board 10, the copper material 20 filled in the through hole 101 can connect all circuit layers of the overall circuit board 10 with the copper block 2. In this way, the contact area between the heat dissipation copper block 2 and the high current density area of ​​the buried copper circuit board 100 can be effectively increased, the heat dissipation exchange efficiency of the buried copper circuit board 100 is improved, the heat transfer is sufficient, the heat dissipation efficiency is improved, and the heat dissipation performance of the buried copper circuit board 100 is improved.

[0043] The processing method of the buried copper circuit board 100 of the embodiment of the present application embeds the copper block 2 into the interior of the overall circuit board 10 through the welding column 3 for heat dissipation, and then removes the welding column 3 by drilling the through hole 101 and fills the through hole 101 with copper material 20 to connect the copper block 2 with each circuit layer of the overall circuit board 10. This can effectively increase the contact area between the heat dissipating copper block 2 and the high current density area of ​​the buried copper circuit board 100, improve the heat dissipation exchange efficiency of the buried copper circuit board 100, improve the heat dissipation performance, and help improve the processing efficiency and processing accuracy, while avoiding quality problems caused by the presence of the welding column 3, improving product reliability, and solving the problems of poor bonding strength, explosive boards, and poor heat dissipation exchange efficiency.

[0044] In some embodiments, the diameter of the through hole 101 is 4 mils to 6 mils larger than the outer diameter of the solder post 3 .

[0045] 1 mil is approximately equal to 0.0254 mm, 4 mils is approximately equal to 0.1016 mm, and 6 mils is approximately equal to 0.1524 mm. By setting the diameter of the through hole 101 to be at least 4 mils, i.e. approximately 0.1 mm, larger than the diameter of the welding column 3, it is ensured that the welding column 3 can be removed by drilling the through hole 101, reducing the processing accuracy requirements and facilitating the improvement of processing efficiency.

[0046] In some embodiments, the through hole 101 includes one of a circular hole, an elliptical hole, and a polygonal hole.

[0047] For example, the polygonal hole can be a triangular hole, a square hole, a pentagonal hole, a hexagonal hole, etc. The through hole 101 can be set to different cross-sectional shapes according to actual needs, which is convenient and flexible to process and meets actual needs.

[0048] In some embodiments, filling the through hole 101 with copper material 20 specifically includes the following steps:

[0049] Step S301, copper deposition and board electrical processing are performed on the entire circuit board 10, and a resist coating is formed;

[0050] Step S302 , performing hole-filling electroplating to fill the through-hole 101 , so that the through-hole 101 is filled with copper material 20 .

[0051] The overall circuit board 10 is subjected to copper deposition and board surface electroplating treatment, that is, a copper layer between the conductive graphic circuit layer and the graphic circuit layer is deposited in the through hole 101 by a chemical copper deposition method, including two or more adjacent graphic circuit layers, so that the through hole 101 becomes a conductive hole; and the overall circuit board 10 is electroplated with copper by a full-board electroplating method to thicken the board surface of the overall circuit board 10 and the thickness of the copper layer in the through hole 101.

[0052] A resist layer is formed, that is, a resist layer is formed on the board surface of the entire circuit board 10 to prevent the copper layer thickness of the board surface of the entire circuit board 10 from further increasing during the subsequent hole filling electroplating process.

[0053] The through hole 101 is filled with copper material 20 by hole-filling electroplating, and the copper material 20 filling the through hole 101 forms a copper column, so that the copper block 2 is conductively connected with all circuit layers of the overall circuit board 10.

[0054] In some embodiments, after the through hole 101 is filled by hole-filling electroplating, conventional post-processes may also be included; for example, conventional post-processes include: outer layer dry film; circuit plating and outer layer etching; outer layer circuit inspection; solder mask ink; surface treatment; gong board; electrical testing; and final inspection.

[0055] In some embodiments, preparing an integrated circuit board 10 having an embedded copper block 2 and a welding column 3 specifically includes the following steps:

[0056] Step S101, fixing the copper block 2 to the substrate 11 by welding the column 3 to obtain the heat dissipation core board 1;

[0057] Step S102 , pressing and fixing the heat dissipation core board 1 and at least one circuit core board 4 to obtain an integral circuit board 10 having embedded copper blocks 2 and welding columns 3 .

[0058] As shown in FIG. 5 , FIG. 5 shows a schematic diagram of the structure of the heat dissipation core board 1 in some embodiments of the present application; the substrate 11 may be a plate made of an insulating material such as a prepreg. The processing flow of fixing the copper block 2 to the substrate 11 by means of the welding column 3 may include: fixing at least one welding column 3 on the copper block 2; embedding the welding column 3 into the substrate 11, and fixing the copper block 2 to a set position on the substrate 11 by means of the welding column 3, and the set position may be a position aligned with the circuit layer on the adjacent circuit core board 4, thereby obtaining a heat dissipation core board 1 with the copper block 2 fixed in combination. The heat dissipation core board 1 may also include a copper foil 12 disposed on the surface of the substrate 11 away from the copper block 2, and the welding column 3 passes through the substrate 11 and is connected to the copper foil 12, which is conducive to improving the bonding force between the copper block 2 and the substrate 11 and the copper foil 12 and improving the heat transfer efficiency, thereby improving the heat dissipation performance. It is also possible to utilize the resin fluidity of the semi-cured sheet or the highly thermally conductive insulating material under certain temperature and pressure, and solidify when the temperature reaches a certain level, so as to bond the copper block 2, the substrate 11 and the copper foil 12 together, and further improve the bonding force of the copper block 2, the substrate 11 and the copper foil 12. By using the welding column 3 to fix the copper block 2 on the substrate 11, the position of the copper block 2 can be fixed, and then the relative position of the copper block 2 and the circuit layer on the circuit core board 4 aligned with it can be fixed, which is beneficial to improve the heat transfer efficiency of the copper block 2, improve the heat dissipation performance, and improve the processing efficiency and processing accuracy.

[0059] The circuit core board 4 can be a semi-finished circuit board with pre-printed circuits, that is, the circuit core board 4 has a circuit layer. The processing flow of pressing and fixing the heat dissipation core board 1 and at least one circuit core board 4 can include: stacking the heat dissipation core board 1 and at least one circuit core board 4 with the copper block 2 fixed in combination according to the laminated structure of the buried copper circuit board 100, and then under a certain temperature and pressure, using the resin fluidity of the semi-cured sheet or high thermal conductivity insulating material, solidification occurs when the temperature reaches a certain level, so that the heat dissipation core board 1 and at least one circuit core board 4 are connected by pressing and solidification, thereby obtaining an integral circuit board 10. Since the semi-cured sheet or other insulating resin materials have bonding properties and can melt and flow under high temperature and high pressure, the small gaps between the circuit core board 4, the heat dissipation core board 1 and the copper block 2 can be gradually filled during the pressing process, and the embedded copper block 2 can be bonded to the heat dissipation core board 1 and at least one circuit core board 4 as a whole after solidification.

[0060] In some embodiments, the number of circuit core boards 4 can be at least two, and the heat dissipation core board 1 combined with the copper block 2 is pressed between at least two circuit core boards 4, that is, the heat dissipation core board 1 combined with the copper block 2 is sandwiched between at least two circuit core boards 4; for example, 2 to 30 circuit core boards 4 are stacked, and the circuits of the circuit core boards 4 of different layers are electrically interconnected to perform specific functions; that is, the overall circuit board 10 can be a multi-layer circuit board, and the number of layers is 2 to 30. In this way, the overall circuit board 10 has a high assembly density, a small volume, and a light weight, which is conducive to the lightweight and miniaturization of electronic equipment, and is easy to install and has high reliability.

[0061] In some embodiments, the circuit core board 4 can be at least one of a FR-4 circuit board, a Teflon circuit board, a CAM-3 circuit board, a hydrocarbon resin circuit board, a BT resin circuit board, and a polyimide circuit board. Among them, FR-4 is a code for a flame retardant material grade, which means that the resin material must be able to extinguish itself after burning; the FR-4 grade material used for the circuit board can be a composite material made of a tera-function epoxy resin plus a filler (Filler) and glass fiber. Teflon refers to polytetrafluoroethylene. Hydrocarbon resin refers to a polyolefin homopolymer or copolymer, including but not limited to butadiene styrene copolymer, butadiene homopolymer, styrene homopolymer, styrene / divinylbenzene copolymer, styrene-butadiene-divinylbenzene copolymer, etc.; BT resin refers to bismaleimide triazine resin, which has good chemical corrosion resistance, insulation and heat resistance.

[0062] In some embodiments, before the heat dissipation core board 1 and at least one circuit core board 4 are pressed together in a stacked structure, a conventional pre-process for processing the circuit core board 4 may also be included; for example, the conventional pre-process includes: cutting; circuit layer graphic circuit transfer; circuit layer etching; circuit layer circuit inspection; browning, etc.

[0063] In some embodiments, at least one side of the circuit core board 4 is provided with a circuit layer; the circuit core board 4 includes a copper clad board, and the circuit layer is a copper layer formed with a circuit pattern.

[0064] The circuit core board 4 may have a circuit pattern formed on one side or on both sides, which is not limited here. The circuit core board 4 may be a copper clad board that has been etched, and the copper layer of the copper clad board has a circuit pattern formed thereon, thereby forming a circuit layer.

[0065] In some embodiments, the heat dissipation core board 1 includes a plurality of copper blocks 2 ; along the axial direction of the through hole 101 , the end surfaces of the plurality of copper blocks 2 are flush.

[0066] A plurality of copper blocks 2 are fixedly assembled on the heat dissipation core board 1, which is beneficial to improving the heat dissipation performance; and the plurality of copper blocks 2 are located on the same plane. In this way, the thickness difference between the plurality of copper blocks 2 is reduced, and the flatness problem of the buried copper circuit board 100 caused by the thickness difference is avoided, and the flatness of the surface of the buried copper circuit board 100 is improved, which is beneficial to reducing the overall thickness of the buried copper circuit board 100.

[0067] In some embodiments, the copper block 2 has a thickness ranging from 300 micrometers to 800 micrometers.

[0068] The thickness of the copper block 2 refers to the dimension along the axial direction of the through hole 101. The thickness of the copper block 2 is greater than or equal to 300 microns and less than or equal to 800 microns, that is, the thickness of the copper block 2 is greater than or equal to 8OZ and less than or equal to 22OZ. This is beneficial to improving the heat dissipation performance of the buried copper circuit board 100.

[0069] In some embodiments, the length or width of the copper block 2 is 10.2 mm or 12.2 mm.

[0070] The length of the copper block 2 refers to the dimension in the direction perpendicular to the axial direction of the through hole 101, and the width of the copper block 2 refers to the dimension in the direction perpendicular to the length direction of the copper block 2 and perpendicular to the axial direction of the through hole 101. The length of the copper block 2 may be 10.2 mm or 12.2 mm, and the width of the copper block 2 may be 10.2 mm or 12.2 mm, which is not limited here. In this way, the copper block 2 has a larger heat dissipation area, which is conducive to improving the heat dissipation performance of the buried copper circuit board 100.

[0071] In some embodiments, the shape of the copper block 2 includes one of a square, a cylinder, a polygonal column, and a line.

[0072] For example, the polygonal prism can be a triangular prism, a quadrangular prism, a pentagonal prism, a hexagonal prism, an octagonal prism, etc. The shape of the copper block 2 can be a circuit shape, which means that the shape of the copper block 2 is consistent with the circuit shape of the circuit core board 4 adjacent to the heat dissipation core board 1, that is, the width and length of the copper block 2 are the same as the width and length of the partial circuit of the circuit core board 4 aligned with it. In some embodiments, the copper block 2 is etched according to the required shape, such as the direction of the current (i.e., the circuit shape); the shape of the pattern formed by the arrangement of multiple copper blocks 2 on the heat dissipation core board 1 is the same as the shape of the circuit pattern of the circuit core board 4 adjacent to the heat dissipation core board 1. The copper block 2 can be set to different shapes according to actual needs, which is convenient and flexible to process, and is conducive to improving the heat transfer efficiency of the copper block 2, improving the heat dissipation effect, and meeting actual needs.

[0073] 4 , the buried copper circuit board 100 provided in the embodiment of the present application is prepared by the processing method of the buried copper circuit board 100 in any of the above embodiments.

[0074] The buried copper circuit board 100 of the embodiment of the present application has the same beneficial effects as the processing method of the buried copper circuit board 100 of the above-mentioned embodiment, which will not be described in detail here.

[0075] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A method for processing a buried copper circuit board, characterized in that: include: preparing an integral circuit board having embedded copper blocks and welding posts; Drilling a through hole on the integral circuit board so that the through hole passes through the copper block and removes the welding column; The through hole is filled with copper material, so that the copper material connects all circuit layers of the overall circuit board with the copper block.

2. The method for processing a buried copper circuit board according to claim 1, characterized in that: The through hole has a diameter that is 4 mils to 6 mils larger than the outer diameter of the welding column.

3. The method for processing a buried copper circuit board according to claim 1, characterized in that: The through hole includes one of a circular hole, an elliptical hole and a polygonal hole.

4. The method for processing a buried copper circuit board according to claim 1, characterized in that: The step of filling the through hole with copper material comprises: Performing copper deposition and board electrical processing on the overall circuit board, and making a resist coating; The through-holes are filled with copper material by performing hole-filling electroplating.

5. The method for processing a buried copper circuit board according to any one of claims 1 to 4, characterized in that: The method for preparing an integrated circuit board having embedded copper blocks and welding columns comprises: The copper block is fixed to the base plate by welding columns to obtain a heat dissipation core plate; The heat dissipation core board is pressed and fixed with at least one circuit core board to obtain the integral circuit board with embedded copper blocks and welding columns.

6. The method for processing a buried copper circuit board according to claim 5, characterized in that: The circuit layer is disposed on at least one side of the circuit core board; the circuit core board comprises a copper-clad board, and the circuit layer is a copper layer formed with a circuit pattern.

7. The method for processing a buried copper circuit board according to claim 5, characterized in that: The heat dissipation core plate comprises a plurality of copper blocks; along the axial direction of the through hole, the end surfaces of the plurality of copper blocks are flush.

8. The method for processing a buried copper circuit board according to claim 5, characterized in that: The copper block has a thickness ranging from 300 microns to 800 microns.

9. The method for processing a buried copper circuit board according to any one of claims 1 to 4, characterized in that: The shape of the copper block includes one of a square, a cylinder, a polygonal column and a line shape.

10. A buried copper circuit board, characterized in that: The buried copper circuit board is prepared by the buried copper circuit board processing method according to any one of claims 1 to 9.

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