Electronic equipment and shielding parts

Abstract

An embodiment of the present application provides an electronic device and a shielding member. The electronic device includes a mainboard, a camera device and a shielding member. The mainboard includes a first connection terminal and a ground terminal. The camera device includes a camera module, a circuit board and a second connection terminal. The camera module is electrically connected to the circuit board. The second connection terminal is electrically connected to the circuit board. The first connection terminal and the second connection terminal are electrically connected. A storage space is formed between the shielding member and the mainboard. The first connection terminal and the second connection terminal are located in the storage space. The shielding member includes an electrically connected shielding frame and a shielding cover. The shielding frame is connected to the mainboard. The shielding frame is electrically connected to the ground terminal. The shielding cover is connected to the shielding frame. The second connection terminal is electrically connected to the shielding cover. The electronic device of the embodiment of the present application can reduce the possibility that the camera device is affected by signal interference and affects the shooting experience.

Description

[0001] This application is a divisional application. The application number of the original application is 202310120762.4, and the original application date is February 2, 2023. The entire contents of the original application are incorporated into this application by reference. Technical Field

[0002] The embodiments of the present application relate to the field of terminal technology, and in particular to an electronic device and a shielding component. Background Art

[0003] With the explosive growth of electronic devices such as smartphones or tablets, electronic devices have more and more functions. Since people expect electronic devices to meet more functional requirements, electronic devices themselves can realize more and more functions. For example, electronic devices include camera devices. People expect the camera performance of electronic devices to be higher and higher to obtain high-resolution images. The camera device includes a camera module, such as a rear camera module. The camera module is used to take pictures of the selected target and form corresponding image information. The camera module includes a light inlet for receiving light. External light can enter the camera module through the light inlet. The camera module can be electrically connected to the mainboard, for example, the camera module can be electrically connected to the mainboard through a circuit board to achieve signal interaction. However, when the electronic device performs the shooting function, there is a situation where the camera device is interfered by the signal, resulting in a flowery screen, a freeze screen or the like on the shooting interface, which affects the shooting experience of the electronic device. Summary of the invention

[0004] The embodiments of the present application provide an electronic device and a shielding component, which can reduce the possibility that a camera device is interfered with by signals and thus affects the shooting experience.

[0005] A first aspect of the present application provides an electronic device, which includes a mainboard, a camera device and a shielding component.

[0006] The mainboard includes a first connection terminal and a ground terminal. The camera device includes a camera module, a circuit board and a second connection terminal. The camera module is electrically connected to the circuit board. The second connection terminal is electrically connected to the circuit board. The first connection terminal is electrically connected to the second connection terminal. A storage space is formed between the shielding member and the mainboard. The first connection terminal and the second connection terminal are located in the storage space. The shielding member includes an electrically connected shielding frame and a shielding cover. The shielding frame is connected to the mainboard. The shielding frame is electrically connected to the ground terminal. The shielding cover is connected to the shielding frame. The second connection terminal is electrically connected to the shielding cover.

[0007] In the electronic device of the present application, the mainboard includes a first connection terminal and a ground terminal, and the camera device includes a camera module, a circuit board and a second connection terminal. The first connection terminal and the second connection terminal are connected. The first connection terminal and the second connection terminal are electrically connected. The camera device and the mainboard are connected in communication to achieve signal interaction. The shielding member is connected to the mainboard, and the shielding member is covered on the outside of the first connection terminal and the second connection terminal. The shielding member is electrically connected to the ground terminal of the mainboard to achieve grounding. The second connection terminal is electrically connected to the shielding member. Therefore, the first connection terminal, the second connection terminal, the shielding cover and the shielding frame can be grounded through the ground terminal of the mainboard, which is conducive to reducing the ground impedance at the connector formed by the first connection terminal and the second connection terminal, avoiding the impedance mutation at the connector formed by the first connection terminal and the second connection terminal, and at the same time, it is conducive to eliminating the parasitic capacitance formed between the connector formed by the first connection terminal and the second connection terminal and the ground terminal of the mainboard, thereby helping to reduce the possibility of electromagnetic signals interfering with the first connection terminal and the second connection terminal and causing electromagnetic coupling, ensuring the stability of the signal transmission process between the camera device and the mainboard, so that the electronic device can smoothly perform the shooting function and improve the shooting experience. The shielding member can also effectively shield the electromagnetic signal from causing adverse effects and interference to the first connection terminal and the second connection terminal, thereby further helping to reduce the possibility of interference to the interactive signal between the camera device and the mainboard.

[0008] In a possible implementation manner, the shielding frame is a ring-shaped structure. The first connecting terminal is located in the shielding frame.

[0009] The shielding frame is arranged around the first connecting terminal, so that the shielding frame can have a good shielding effect on the first connecting terminal in any direction.

[0010] In a possible implementation, the shielding frame includes a bottom flange, a first side plate, and a top flange. The bottom flange and the top flange are both connected to the first side plate. The bottom flange is electrically connected to the ground terminal. The outer surface of the top flange facing away from the mainboard is electrically connected to the inner surface of the shielding cover facing the mainboard.

[0011] The outer surface of the top flange facing away from the mainboard is electrically connected to the inner surface of the shielding cover facing the mainboard, which is conducive to achieving a larger electrical connection area between the shielding cover and the shielding frame to effectively reduce impedance and maintain a good electrical connection state between the two.

[0012] In a possible implementation manner, the outer surface of the top flange facing away from the mainboard directly abuts against the inner surface of the shielding cover facing the mainboard, so that the top flange is electrically connected to the shielding cover.

[0013] The width of at least a portion of the top flange is greater than the width of the bottom flange.

[0014] Setting the width of at least part of the top flange to be larger is beneficial to increasing the contact area between the shielding cover and the shielding frame, so as to effectively compensate for the contact area between the shielding cover and the shielding frame and reduce the possibility that the contact area does not meet the requirements due to uneven contact surfaces of the shielding cover and the shielding frame.

[0015] The bottom flange is set to a relatively small width, which can help reduce the positive projection area of ​​the bottom flange on the mainboard while satisfying the connection strength between the bottom flange and the mainboard, thereby reducing the space occupancy rate of the bottom flange on the mainboard and reducing the possibility of reducing the area on the mainboard where electronic devices can be installed due to the bottom flange occupying too much space on the mainboard.

[0016] In a possible implementation manner, the shielding cover and the first side plate are clamped together.

[0017] The shielding cover and the first side plate are connected by a snap-fitting manner, which is conducive to quick assembly or separation of the shielding cover and the shielding frame, thereby improving the efficiency of assembly or separation work.

[0018] In a possible implementation manner, a clamping portion is disposed on one of the shielding cover and the first side plate, and a clamping portion is disposed on the other of the shielding cover and the first side plate.

[0019] In a possible implementation, the shielding cover includes a top plate and a second side plate connected to each other. A clamping portion is provided on one of the first side plate and the second side plate, and a clamping portion is provided on the other side plate. The first connecting terminal and the second connecting terminal are provided between the top plate and the main board. The outer surface of the top flange facing away from the main board is electrically connected to the inner surface of the top plate facing the main board.

[0020] In a possible implementation manner, there are multiple second side plates, and there is a gap between two adjacent second side plates.

[0021] Each second side plate is independently arranged, so that when any second side plate is deformed during the clamping process, other second side plates will not be pulled.

[0022] In a possible implementation manner, the outer surface of the top flange facing away from the main board directly abuts against the inner surface of the top plate facing the main board, so that the top flange is electrically connected to the top plate.

[0023] In a possible implementation manner, the shielding cover and the shielding frame are engaged with each other.

[0024] The shielding cover and the shielding frame are connected by a snap-on method, which is conducive to quick assembly or separation of the shielding cover and the shielding frame, thereby improving the assembly or separation work efficiency.

[0025] In a possible implementation manner, a surface of the second connection terminal facing away from the first connection terminal is bonded to the shielding cover by conductive adhesive, so that the second connection terminal is electrically connected to the shielding cover.

[0026] In a possible implementation, the electronic device further includes a reinforcing piece. At least part of the reinforcing piece is disposed on a side of the second connection terminal facing away from the first connection terminal. The reinforcing piece is a conductive structure. The reinforcing piece is electrically connected to the second connection terminal. The reinforcing piece is electrically connected to the shielding cover.

[0027] The reinforcing member can provide protection for the second connection terminal, effectively preventing the second connection terminal from being damaged by external force. The shielding member can apply compressive stress to the reinforcing member toward the second connection terminal to ensure the connection reliability and stability between the first connection terminal and the second connection terminal, and reduce the possibility of the second connection terminal withdrawing from the first connection terminal and being disconnected.

[0028] In a possible implementation manner, the shielding cover directly abuts against the reinforcing member.

[0029] The shielding cover of the shielding member is in direct contact with the reinforcing member to achieve electrical connection, so that there is no need to set up additional structural members for achieving electrical connection between the shielding member and the reinforcing member, which is beneficial to reducing the number of parts used and the assembly process.

[0030] In a possible implementation, the electronic device further includes a conductive member, which is disposed between the shielding cover and the reinforcing member, and electrically connects the shielding cover and the reinforcing member.

[0031] The shielding cover and the reinforcing member can jointly press the conductive member to ensure good contact between the shielding member and the reinforcing member and the conductive member, and maintain the stability of the electrical connection state between the shielding member and the reinforcing member and the conductive member.

[0032] In a possible implementation manner, the conductive element is a flexible structure.

[0033] Since the conductive part can be compressed and deformed, when there are uneven surfaces on the surface of at least one of the shielding cover and the reinforcement part of the shielding part, the conductive part can compensate by its own deformation, thereby ensuring that the shielding cover of the shielding part and the conductive part, as well as the reinforcement part and the conductive part maintain a close fit and contact state, so that the shielding cover of the shielding part and the reinforcement part maintain a good electrical connection, which is beneficial to reducing impedance.

[0034] In a possible implementation manner, the reinforcing member is capacitively coupled to the shielding cover.

[0035] The non-direct contact between the reinforcement and the shielding cover can avoid poor contact between the shielding cover and the reinforcement, thereby reducing the possibility of Passive Inter-Modulation (PIM) problems and spurious radiation (RSE) problems caused by poor contact.

[0036] In a possible implementation, the electronic device further includes a high dielectric layer, and the high dielectric layer is disposed between the reinforcing member and the shielding cover.

[0037] The shielding part and the reinforcing part are in non-electrical contact with the high dielectric layer. Since the capacitive coupling connection method does not have the problem of poor contact, there is no requirement for the stability of the contact resistance between the shielding part and the reinforcing part and the high dielectric layer, so there is no need to perform surface treatment such as nickel plating and gold plating on the shielding part and the reinforcing part. In addition, the location of the high dielectric layer can be freely and flexibly selected according to design requirements.

[0038] In a possible implementation manner, the material of the high dielectric layer includes a wave absorbing material.

[0039] The high dielectric layer can absorb and attenuate electromagnetic signals incident from space, reduce or eliminate reflected electromagnetic signals, and help reduce interference caused by adverse electromagnetic signals.

[0040] In a possible implementation manner, a avoidance hole is provided between the shielding cover and the shielding frame, and the circuit board is passed through the avoidance hole.

[0041] In a possible implementation manner, an insulating layer is disposed on the outer surface of the shielding cover.

[0042] The insulating layer provided on the shielding cover can help maintain a good insulation isolation state between the shielding cover and other conductive structures. If the shielding cover is not provided with an insulating layer, there is a possibility that the shielding cover and other conductive structures are electrically connected. If there is a poor contact between the shielding cover and other conductive structures, it will cause the shielding cover and other conductive structures to have Passive Inter-Modulation (PIM) problems and the possibility of generating stray radiation (RSE) problems. The outer surface of the shielding cover of the present application is provided with an insulating layer, which can effectively reduce the possibility of the above problems.

[0043] In a possible implementation, the electronic device further includes an electronic component, the electronic component is disposed on the mainboard, the electronic component is disposed in the accommodation space, and the electronic component is spaced apart from the first connection terminal.

[0044] The shielding member can shield the electronic components so that when the electronic components are in working state, the electromagnetic signals emitted by the electronic components are not easily transmitted to the devices located outside the shielding member and relatively close to the electronic components, thereby effectively reducing the possibility of the electronic components causing signal interference to adjacent devices.

[0045] In a possible implementation, the electronic device includes a housing and an antenna. The mainboard is disposed in the housing. The housing includes a frame. The antenna is disposed in the frame. The first connecting terminal, the second connecting terminal and the shielding member are disposed close to the antenna.

[0046] Since the shielding member can provide effective shielding for the first connecting terminal and the second connecting terminal, when the antenna is in a working state of radiating wireless signals, the electromagnetic signal generated by the antenna is not likely to interfere with the first connecting terminal and the second connecting terminal, thereby reducing the possibility of the antenna having an adverse effect on the camera device when performing a shooting function.

[0047] In a second aspect of the present application, a shielding member is provided for use in an electronic device. The shielding member comprises a shielding frame and a shielding cover. The shielding cover is connected to the shielding frame. The shielding cover is connected to the shielding frame and forms a receiving cavity. The receiving cavity has an opening. The shielding frame is used for grounding. The shielding cover is electrically connected to the shielding frame.

[0048] A third aspect of the present application provides an electronic device, which includes a mainboard, a camera device and a shielding component.

[0049] The mainboard includes a first connection terminal and a ground terminal. The camera device includes a camera module, a circuit board and a second connection terminal. The camera module is electrically connected to the circuit board. The second connection terminal is arranged on the circuit board. The first connection terminal and the second connection terminal are electrically connected. The shielding member is an integrally formed structure. The shielding member is connected to the mainboard. A storage space is formed between the shielding member and the mainboard. The first connection terminal and the second connection terminal are located in the storage space. The shielding member is electrically connected to the ground terminal. The second connection terminal is electrically connected to the shielding member.

[0050] In a possible implementation, the shielding member includes a top wall and a side wall. The side wall is an annular structure. The side wall is connected to the main board. The side wall is electrically connected to the ground terminal of the main board. The top wall is electrically connected to the second connection terminal.

[0051] The side wall of the shielding member is arranged around the first connecting terminal, so that the shielding member can have a good shielding effect on the first connecting terminal in any direction.

[0052] In a possible implementation manner, a surface of the second connection terminal facing away from the first connection terminal is bonded to the top wall of the shielding component by conductive adhesive, so that the second connection terminal is electrically connected to the top wall of the shielding component.

[0053] In a possible implementation, the electronic device further comprises a reinforcing piece. The reinforcing piece is arranged on a side of the second connection terminal facing away from the first connection terminal. The reinforcing piece is a conductive structure. The reinforcing piece is electrically connected to the second connection terminal. The reinforcing piece is electrically connected to the top wall of the shielding piece.

[0054] The reinforcing member can provide protection for the second connection terminal, effectively preventing the second connection terminal from being damaged by external force. The shielding member can apply compressive stress to the reinforcing member toward the second connection terminal to ensure the connection reliability and stability between the first connection terminal and the second connection terminal, and reduce the possibility of the second connection terminal withdrawing from the first connection terminal and being disconnected.

[0055] In a possible implementation manner, the top wall of the shielding component directly abuts against the reinforcing component.

[0056] The top wall of the shielding member is in direct contact with the reinforcing member to achieve electrical connection, so that no additional structural member for achieving electrical connection is required between the shielding member and the reinforcing member, which is beneficial to reducing the number of parts used and the assembly process.

[0057] In a possible implementation, the electronic device further includes a conductive member, which is disposed between the top wall of the shielding member and the reinforcing member, and electrically connects the top wall of the shielding member and the reinforcing member.

[0058] The shielding member and the reinforcing member can jointly press the conductive member to ensure good contact between the shielding member and the reinforcing member and the conductive member, and maintain the stability of the electrical connection state between the shielding member and the reinforcing member and the conductive member.

[0059] In a possible implementation manner, the conductive element is a flexible structure.

[0060] Since the conductive part can be compressed and deformed, when there are uneven surfaces on at least one of the shielding part and the reinforcement part, the conductive part can compensate by its own deformation, thereby ensuring that the shielding part and the conductive part, as well as the reinforcement part and the conductive part maintain a close fit and contact state, so that the shielding part and the reinforcement part maintain a good electrical connection, which is beneficial to reducing impedance.

[0061] In a possible implementation manner, the reinforcing member is capacitively coupled to the top wall of the shielding member.

[0062] The non-direct contact between the reinforcement and the shielding can avoid poor contact between the shielding and the reinforcement, thereby reducing the possibility of Passive Inter-Modulation (PIM) and spurious radiation (RSE) problems caused by poor contact.

[0063] In a possible implementation manner, the electronic device further includes a high dielectric layer, and the high dielectric layer is disposed between the reinforcing member and the top wall of the shielding member.

[0064] The shielding part and the reinforcing part are in non-electrical contact with the high dielectric layer. Since the capacitive coupling connection method does not have the problem of poor contact, there is no requirement for the stability of the contact resistance between the shielding part and the reinforcing part and the high dielectric layer, so there is no need to perform surface treatment such as nickel plating and gold plating on the shielding part and the reinforcing part. In addition, the location of the high dielectric layer can be freely and flexibly selected according to design requirements.

[0065] In a possible implementation, the shielding member has an avoidance hole, and the circuit board is passed through the avoidance hole.

[0066] In a possible implementation manner, an insulating layer is provided on the outer surface of the shielding element.

[0067] The insulating layer provided on the shielding member can help maintain a good insulation isolation state between the shielding member and other conductive structures. If the shielding member is not provided with an insulating layer, there is a possibility that the shielding member and other conductive structures are electrically connected. If there is poor contact between the shielding member and other conductive structures, it will cause the shielding member and other conductive structures to have Passive Inter-Modulation (PIM) problems and the possibility of generating stray radiation (RSE) problems. The outer surface of the shielding member of the present application is provided with an insulating layer, which can effectively reduce the possibility of the above problems. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] Figure 1 A schematic diagram of the structure of the electronic device provided for this application;

[0069] Figure 2 A schematic diagram of a partial exploded structure of an electronic device provided in this application;

[0070] Figure 3 A schematic diagram of the partial structure of the camera device provided in this application;

[0071] Figure 4 A schematic diagram of a partial cross-sectional structure of an electronic device provided for related technology;

[0072] Figure 5 A schematic diagram of a partial structure of an electronic device provided for this application;

[0073] Figure 6 A schematic diagram of a partial exploded structure of an electronic device provided in this application;

[0074] Figure 7 A schematic diagram of a partial structure of an electronic device provided for this application;

[0075] Figure 8 A schematic diagram of a partial cross-sectional structure of an electronic device provided in this application;

[0076] Fig. 9 A schematic diagram of a partial structure of an electronic device provided for this application;

[0077] Fig.10 A schematic diagram of a partial structure of an electronic device provided by the present application;

[0078] Fig.11 A schematic diagram of a partial cross-sectional structure of an electronic device provided in this application;

[0079] Fig.12 for Fig.11 The enlarged schematic diagram of the M in the middle;

[0080] Fig.13 A schematic diagram of a partial cross-sectional structure of an electronic device provided in this application;

[0081] Fig.14 A schematic diagram of a partial cross-sectional structure of an electronic device provided in this application;

[0082] Fig.15 A schematic diagram of a partial cross-sectional structure of an electronic device provided in this application;

[0083] Fig.16 A schematic diagram of a partial structure of an electronic device provided in this application;

[0084] Fig.17 A schematic diagram of a partial structure of an electronic device provided in this application;

[0085] Fig.18 A schematic diagram of the partial structure of the electronic device provided in this application.

[0086] Reference numerals:

[0087] 10. Electronic equipment;

[0088] 20. Display component;

[0089] 30. housing; 31. back cover; 32. frame;

[0090] 40. Main board; 41. First connection terminal; 42. Ground terminal;

[0091] 50. Electronic devices;

[0092] 60. Camera device; 61. Camera module; 611. Optical imaging system; 612. Image sensor; 62. Circuit board; 63. Second connection terminal;

[0093] 70. Shielding parts;

[0094] 71, shielding frame; 71a, middle through hole; 711, bottom flange; 712, first side plate; 7121, first outer side surface; 7122, second outer side surface; 7123, third outer side surface; 7124, fourth outer side surface; 713, top flange;

[0095] 72. Shielding cover; 721. Top plate; 722. Second side plate;

[0096] 70a, top wall;

[0097] 70b, side wall;

[0098] 80. Clamping part;

[0099] 90, snap-fitting portion;

[0100] 100. Reinforcement parts;

[0101] 110. Conductive parts;

[0102] 120. High dielectric layer;

[0103] 130. Avoidance hole;

[0104] 140, insulation layer;

[0105] 150. Electronic components;

[0106] 160, antenna;

[0107] 170. System-on-chip;

[0108] 180. Accommodation space;

[0109] 190, connector;

[0110] 200, metal bracket;

[0111] Z, thickness direction. DETAILED DESCRIPTION

[0112] The electronic device in the embodiment of the present application may be referred to as user equipment (UE) or terminal, etc. For example, the electronic device may be a portable android device (PAD), a personal digital assistant (PDA), a handheld device with wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in remote medical, a wireless terminal in smart grid, a wireless terminal in transportation safety, a wireless terminal in smart city, a wireless terminal in smart home, etc. Mobile terminals or fixed terminals. The form of the terminal device is not specifically limited in the embodiment of the present application.

[0113] In the embodiment of the present application, Figure 1 The structure of the electronic device 10 is schematically shown. Figure 1As shown, the electronic device 10 is taken as an example of a handheld device with a wireless communication function. The handheld device with a wireless communication function may be, for example, a mobile phone.

[0114] Figure 2 The partially exploded structure of the electronic device 10 is schematically shown. Figure 1 and Figure 2 As shown, the electronic device 10 of the embodiment of the present application includes a display assembly 20 , a housing 30 , a mainboard 40 and an electronic device 50 .

[0115] The display assembly 20 has a display area for displaying image information. The display assembly 20 presents image information to the user through the display area. The display assembly 20 is installed in the housing 30.

[0116] The mainboard 40 may be connected to the housing 30 and located in the housing 30. The mainboard 40 may be located between the display assembly 20 and the housing 30, so that the user cannot easily observe the mainboard 40 from the outside of the electronic device 10. Exemplarily, the housing 30 includes a back cover 31 and a frame 32. The back cover 31 is connected to the frame 32. Exemplarily, the frame 32 may be, but is not limited to, a rectangular frame. The mainboard 40 may be disposed in a space formed by the back cover 31 and the frame 32.

[0117] The electronic device 50 is arranged on the mainboard 40. The mainboard 40 may be a printed circuit board (PCB). The electronic device 50 is soldered to the mainboard 40 by a soldering process. The electronic device 50 includes, but is not limited to, a radio frequency integrated circuit (RFIC), a radio frequency power amplifier (RFPA), a wireless fidelity (WIFI) chip, a central processing unit (CPU), an intelligent algorithm chip, a power management chip (PMIC) or an application processor (AP). The application processor may be used, for example, but not limited to, to carry a system-on-chip (SOC). The system-on-chip includes an image signal processing (ISP) module. Since the internal space of the electronic device 10 is relatively small, the electronic device 50 is highly integrated on the mainboard 40 to fully reduce the volume of the mainboard 40 and reduce the space occupancy rate of the mainboard 40.

[0118] The electronic device 10 may also include other components such as a battery. The battery may be disposed in the housing 30. The battery is a structural component that can convert chemical energy into electrical energy. The battery is used to provide electrical energy to the electronic device 10 to ensure that the electronic device 10 operates normally. For example, the battery may provide electrical energy to the display component 20 so that the display component 20 displays image information or completes corresponding operation instructions, or the battery may provide electrical energy to the mainboard 40 to ensure that the electronic device 50 on the mainboard 40 operates normally. Exemplarily, the battery may be a lithium-ion battery, such as a lithium iron phosphate battery.

[0119] Figure 3 The partial structure of the camera device is schematically shown. Figure 2 and Figure 3 As shown, the electronic device 10 may include a camera device 60. The camera device 60 may include a camera module 61 and a circuit board 62. The camera module 61 may be electrically connected to the mainboard 40 through the circuit board 62 to achieve signal interaction. Exemplarily, the circuit board 62 may be, but is not limited to, a flexible printed circuit board (FPCB). The camera module 61 of the camera device 60 may be disposed in the housing 30. The housing 30 has a light-transmitting hole. Along the axial direction of the light-transmitting hole, the light-inlet portion of the camera module 61 is disposed corresponding to the light-transmitting hole. External light may reach the light-inlet portion through the light-transmitting hole. Exemplarily, the cross-sectional shape of the light-transmitting hole may be circular, elliptical or polygonal, which is not limited in the present application. The camera device 60 may be a rear-mounted camera or a front-mounted camera, which is not limited in the present application.

[0120] The camera module 61 may include an optical imaging system 611 and an image sensor 612. The optical imaging system 611 may include multiple lenses. When using the camera module 61 for shooting, the light on the object side may pass through the optical imaging system 611 and then be incident on the photosensitive surface of the image sensor 612. The photosensitive surface of the image sensor 612 refers to the surface that receives light. The optical imaging system 611 has a virtual imaging surface. The imaging surface of the optical imaging system 611 may coincide with the photosensitive surface of the image sensor 612. The image sensor 612 may be a sensor that converts light signals incident on the photosensitive surface into electrical signals. For example, the image sensor 612 may be a complementary metal oxide semiconductor (CMOS) sensor or a charge coupled device (CCD).

[0121] In the related technology, Figure 4 The partial cross-sectional structure of the electronic device in the related art is schematically shown. Figure 4As shown, the image sensor 612 of the camera module 61 can be electrically connected to the system-level chip 170 on the mainboard 40 through the circuit board 62 and the connector 190. The connector 190 includes two connecting terminals that are plugged into each other. For example, the connector 190 can be a board-to-board connector. When the camera device 60 of the electronic device 10 performs the shooting function, there is signal interaction between the image sensor 612, the circuit board 62, the connector 190, the wires on the mainboard 40, and the image signal processing module of the system-level chip 170, such as data signals or control signals. However, the connector 190 has a large ground impedance, which makes the connector 190 an impedance discontinuity point, and there is a sudden change in impedance, which is easy to couple with the external electromagnetic field, and there is a situation of interfering with the data signal or control signal transmitted between the camera module 61 and the image signal processing module, which in turn causes the camera device 60 to be interfered with by the signal, resulting in a phenomenon such as a flower screen, a freeze screen, or the like on the shooting interface, affecting the shooting experience of the electronic device 10. For example, when the radio frequency chip or the wireless fidelity chip transmits power, the generated electromagnetic signal may cause signal interference to the connector 190 .

[0122] In the electronic device 10 provided in the embodiment of the present application, the shielding member is arranged on the mainboard 40 and is covered on the outside of the first connection terminal and the second connection terminal. The first connection terminal and the second connection terminal can be grounded through the shielding member, effectively reducing the impedance. In addition, the shielding member can be used to shield the first connection terminal and the second connection terminal. Therefore, the electronic device 10 of the embodiment of the present application can reduce the possibility of electromagnetic signals interfering with the first connection terminal and the second connection terminal, thereby helping to reduce the possibility of the camera device 60 being interfered with by the signal and improving the shooting experience of the electronic device 10.

[0123] Figure 5 Schematically shows the partial structure of an electronic device. Figure 5 For along Figure 4 The structure of the middle main plate 40 in a plan view in the thickness direction Z. Figure 6 The partially exploded structure of the electronic device 10 is schematically shown. Figure 5 and Figure 6 As shown, the motherboard 40 of the embodiment of the present application includes a first connection terminal 41 and a ground terminal 42. The first connection terminal 41 provides a switching interface. The first connection terminal 41 can be electrically connected to the system-level chip 170 on the motherboard 40. The ground terminal 42 is used for grounding.

[0124] The camera device 60 includes a camera module 61, a circuit board 62 and a second connection terminal 63. The camera module 61 is electrically connected to the circuit board 62. The second connection terminal 63 is arranged on the circuit board 62. The second connection terminal 63 is electrically connected to the circuit board 62. Exemplarily, the circuit board 62 may be a flexible circuit board. Exemplarily, the circuit board 62 may be a strip structure. The camera module 61 is electrically connected to one end of the circuit board 62, and the second connection terminal 63 is electrically connected to the other end of the circuit board 62. The first connection terminal 41 and the second connection terminal 63 are electrically connected. The first connection terminal 41 and the second connection terminal 63 are detachably connected to facilitate assembly or separation of the first connection terminal 41 and the second connection terminal 63, thereby facilitating assembly or separation of the camera device 60 and the mainboard 40. The first connection terminal 41 and the second connection terminal 63 are connected to form a connector. Exemplarily, the connector formed by the first connection terminal 41 and the second connection terminal 63 may be a board-to-board connector. The first connection terminal 41 and the second connection terminal 63 may be connected by plugging. Exemplarily, the first connection terminal 41 and the second connection terminal 63 each have a pin, and the two are plugged into each other through their respective pins (PIN pins) to achieve electrical connection. The camera module 61 can be connected to the mainboard 40 through the circuit board 62, the second connection terminal 63 and the first connection terminal 41 to achieve signal interaction such as data signals or control signals.

[0125] See also Figure 5 and Figure 6 As shown, the electronic device 10 further includes a shielding member 70. The mainboard 40 can provide a mounting base for the shielding member 70. The shielding member 70 is connected to the mainboard 40. The shielding member 70 can avoid the electronic device 50 on the mainboard 40. A receiving space 180 (such as Figure 8 ). The first connection terminal 41 and the second connection terminal 63 are located in the accommodation space 180. The shielding member 70 is electrically connected to the grounding terminal 42 of the main board 40 to achieve grounding of the shielding member 70.

[0126] Figure 7 Schematically shows the partial structure of an electronic device. Figure 8 Schematically shows the partial cross-sectional structure of an electronic device. Figure 6 , Figure 7 and Figure 8 As shown, the shielding member 70 includes an electrically connected shielding frame 71 and a shielding cover 72. The shielding frame 71 is used for grounding. The shielding frame 71 is connected to the mainboard 40. The shielding frame 71 is electrically connected to the grounding terminal 42 of the mainboard 40. The shielding cover 72 is connected to the shielding frame 71. Exemplarily, the shielding cover 72 is detachably connected to the shielding frame 71. The shielding cover 72 is connected to the shielding frame 71 and forms a receiving cavity with an opening. After the shielding cover 72 and the shielding frame 71 are assembled, a shielding member 70 with a receiving cavity is formed. The second connecting terminal 63 is electrically connected to the shielding cover 72.

[0127] In the present application, the shielding frame 71 and the shielding cover 72 are electrically connected, and the shielding frame 71 is electrically connected to the ground terminal 42. Therefore, the shielding cover 72 is indirectly grounded through the shielding frame 71, and the second connection terminal 63 is indirectly grounded through the shielding cover 72 and the shielding frame 71. The assembled shielding member 70 can cover the first connection terminal 41 and the second connection terminal 63, and the shielding member 70 is grounded, which is conducive to eliminating the parasitic capacitance formed between the connector formed by the first connection terminal 41 and the second connection terminal 63 and the ground terminal 42 of the mainboard 40, thereby helping to reduce the possibility of electromagnetic coupling interference caused by electromagnetic signals to the first connection terminal 41 and the second connection terminal 63.

[0128] The shielding member 70 is arranged at the periphery of the connector formed by the first connection terminal 41 and the second connection terminal 63. The shielding member 70 is covered on the connector formed by the first connection terminal 41 and the second connection terminal 63. The accommodating space 180 formed by the shielding member 70 connected to the main board 40 can also be called a shielding space. The opening of the accommodating cavity of the shielding member 70 faces the main board 40. The accommodating space 180 includes the accommodating cavity of the shielding member 70. The first connection terminal 41 and the second connection terminal 63 are located in the shielding space. The shielding member 70 can be used to provide effective shielding for the first connection terminal 41 and the second connection terminal 63, reduce the electromagnetic signals of other components outside the shielding member 70 or the electromagnetic signals of the environment in which the electronic device 10 is located to interfere with the first connection terminal 41 and the second connection terminal 63, which is conducive to reducing the possibility of interference in the signal interaction between the camera module 61 and the main board 40 due to the interference of the electromagnetic signals of the first connection terminal 41 and the second connection terminal 63, and improve the working stability of the camera device 60.

[0129] In the electronic device 10 of the present application, the mainboard 40 includes a first connection terminal 41 and a ground terminal 42, and the camera device 60 includes a camera module 61, a circuit board 62 and a second connection terminal 63. The first connection terminal 41 and the second connection terminal 63 are detachably connected. The first connection terminal 41 and the second connection terminal 63 are electrically connected. The camera device 60 is connected to the mainboard 40 for communication to achieve signal interaction. The shielding member 70 is connected to the mainboard 40, and the shielding member 70 is covered on the outside of the first connection terminal 41 and the second connection terminal 63. The shielding member 70 is electrically connected to the ground terminal 42 of the mainboard 40 to achieve grounding. The second connection terminal 63 is electrically connected to the shielding member 70. Therefore, the first connection terminal 41, the second connection terminal 63, the shielding cover 72 and the shielding frame 71 can be grounded through the grounding terminal 42 of the mainboard 40, which is conducive to reducing the ground impedance at the connector formed by the first connection terminal 41 and the second connection terminal 63, avoiding the impedance mutation at the connector formed by the first connection terminal 41 and the second connection terminal 63, and at the same time, it is conducive to eliminating the parasitic capacitance formed between the connector formed by the first connection terminal 41 and the second connection terminal 63 and the grounding terminal 42 of the mainboard 40, thereby helping to reduce the possibility of electromagnetic signals interfering with the first connection terminal 41 and the second connection terminal 63 and causing electromagnetic coupling, ensuring the stability of the signal transmission process between the camera device 60 and the mainboard 40, so that the electronic device 10 can smoothly perform the shooting function and improve the shooting experience. The shielding member 70 can also effectively shield the adverse effects and interference of electromagnetic signals on the first connection terminal 41 and the second connection terminal 63, thereby further helping to reduce the possibility of interference to the interactive signal between the camera device 60 and the mainboard 40.

[0130] In some feasible embodiments, the shielding member 70, the shielding cover 72 and the shielding frame 71 of the present application can be welded to each other, which is beneficial to ensure that the shielding cover 72 and the shielding frame 71 have good connection reliability and stability, and reduce the possibility of the shielding cover 72 and the shielding frame 71 being separated due to accidental collision.

[0131] In some achievable ways, the shielding member 70 of the present application, the shielding cover 72 and the shielding frame 71 are detachably connected, so as to facilitate the assembly or separation of the shielding cover 72 and the shielding frame 71. The first connection terminal 41 and the second connection terminal 63 are arranged between the shielding cover 72 and the main board 40. When the first connection terminal 41 and the second connection terminal 63 need to be repaired or inspected, the shielding cover 72 can be removed from the shielding frame 71, and the shielding member 70 does not need to be removed as a whole from the main board 40. After the repair or inspection of the first connection terminal 41 and the second connection terminal 63 is completed, the shielding cover 72 is reassembled with the shielding frame 71. Therefore, the detachable connection between the shielding cover 72 and the shielding frame 71 is conducive to improving the efficiency of the repair or inspection work. The assembly process can be, but is not limited to, setting the first connection terminal 41 on the main board 40. Then the shielding frame 71 is sleeved on the periphery of the first connection terminal 41. Then the shielding frame 71 is connected to the main board 40. The second connection terminal 63 is connected to the first connection terminal 41. The shielding cover 72 is connected to the shielding frame 71. The assembled shielding member 70 covers the first connection terminal 41 and the second connection terminal 63 .

[0132] In some achievable ways, the shielding member 70 can be welded to the mainboard 40 by a welding process. The shielding member 70 is welded to the ground terminal 42, which is conducive to achieving good grounding, and can ensure that the connection strength between the shielding member 70 and the ground terminal 42 is relatively large, and improve the connection stability between the shielding member 70 and the ground terminal 42. For example, the shielding member 70 and the ground terminal 42 can be welded by solder. Specifically, the shielding frame 71 of the shielding member 70 is welded to the mainboard 40 by a welding process. The shielding frame 71 of the shielding member 70 can be welded to the ground terminal 42.

[0133] In some achievable manners, the shielding cover 72 and the shielding frame 71 may be made of conductive metal materials. For example, the shielding cover 72 and the shielding frame 71 may be made of stainless steel.

[0134] In some possible implementations, see Figure 6As shown, the electronic device 10 further includes an electronic component 150. The electronic component 150 is disposed on the mainboard 40. The electronic component 150 is disposed in the accommodating space 180. The electronic component 150 is spaced apart from the first connecting terminal 41. The shielding member 70 can shield the electronic component 150, so that when the electronic component 150 is in a working state, the electromagnetic signal emitted by the electronic component 150 is not easy to propagate to the device located outside the shielding member 70 and relatively close to the electronic component 150, effectively reducing the possibility that the electronic component 150 causes signal interference to the adjacent device. In some examples, the electronic component 150 can be an inductor. The electronic device 10 further includes an antenna. The housing 30 includes a back cover 31 and a frame 32. The antenna can be disposed on the frame 32. When the first connecting terminal 41 and the shielding member 70 are disposed in the edge area of ​​the mainboard 40 close to the antenna, the electronic component 150 (such as an inductor) near the first connecting terminal 41 is relatively close to the antenna. In the embodiment of the present application, since the inductor is shielded by the shielding member 70 , the inductor is unlikely to cause signal interference to an adjacent antenna when in operation.

[0135] In some achievable ways, Fig. 9 Schematic diagram showing the partial structure of an electronic device. Figure 6 and Fig. 9 As shown, the shielding frame 71 can be a frame having a middle through hole 71a. The first connecting terminal 41 is located in the middle through hole 71a. In some examples, the shielding frame 71 can be an annular frame. The shape of the orthographic projection of the shielding frame 71 on the mainboard 40 can be regular, such as a rectangle or a circle. The shape of the orthographic projection of the shielding frame 71 on the mainboard 40 can also be irregular, and the present application does not specifically limit this. In some examples, the shielding frame 71 can also have a notch, and the shielding frame 71 is disconnected and discontinuous at the notch, so that the shielding frame 71 is not a continuous annular structure.

[0136] The first connection terminal 41 is located in the shielding frame 71. Exemplarily, there is a spacing between the first connection terminal 41 and the shielding frame 71. Along the thickness direction Z of the mainboard 40, the orthographic projection of the first connection terminal 41 is located in the orthographic projection of the shielding frame 71, and the two do not overlap. The middle through hole 71a of the shielding frame 71 avoids the first connection terminal 41, so that during the assembly process of the second connection terminal 63 and the first connection terminal 41, position interference between the shielding frame 71 and the second connection terminal 63 is avoided. In some examples, the shielding frame 71 can be an annular frame. The shielding frame 71 is arranged around the first connection terminal 41, so that in any direction, the shielding frame 71 can have a good shielding effect on the first connection terminal 41.

[0137] In some possible implementations, see Figure 6 , Figure 7 and Figure 8As shown, the shielding frame 71 includes a bottom flange 711, a first side plate 712 and a top flange 713. The bottom flange 711 and the top flange 713 are both connected to the first side plate 712. The bottom flange 711 and the top flange 713 are respectively arranged to intersect with the first side plate 712. The bottom flange 711 is electrically connected to the ground terminal 42 of the mainboard 40. Exemplarily, the bottom flange 711 can be welded to the ground terminal 42 of the mainboard 40. Exemplarily, the bottom flange 711 is an annular structure, and the shape of the ground terminal 42 of the mainboard 40 can match the bottom flange 711, that is, it can also be an annular structure. Exemplarily, the material of the ground terminal 42 can be but is not limited to copper or copper alloy.

[0138] The outer surface of the top flange 713 facing away from the mainboard 40 is electrically connected to the inner surface of the shielding cover 72 facing the mainboard 40, which is conducive to achieving a larger electrical connection area between the shielding cover 72 and the shielding frame 71, so as to effectively reduce the impedance and maintain a good electrical connection state between the two. The shielding cover 72 can be grounded to the ground terminal 42 of the mainboard 40 through the top flange 713, the first side plate 712 and the bottom flange 711. In some examples, the outer surface of the top flange 713 facing away from the mainboard 40 is directly abutted against the inner surface of the shielding cover 72 facing the mainboard 40, so that the top flange 713 is electrically connected to the shielding cover 72.

[0139] In some examples, along the thickness direction Z of the main board 40, the bottom flange 711 and the top flange 713 are respectively disposed at the bottom end and the top end of the first side plate 712. The bottom flange 711 and the top flange 713 are respectively located on both sides of the first side plate 712. The bottom flange 711 can be folded outwardly away from the first connection terminal 41, and the top flange 713 can be folded inwardly toward the first connection terminal 41. Along the thickness direction Z of the main board 40, the orthographic projection of the top flange 713 does not overlap with the orthographic projection of the first connection terminal 41.

[0140] For some examples, see Figure 6 and Figure 8 As shown, the outer surface of the top flange 713 facing away from the main board 40 directly abuts against the inner surface of the shielding cover 72 facing the main board 40, so that the top flange 713 is electrically connected to the shielding cover 72. Figure 6 and Fig. 9As shown, at least part of the width of the top flange 713 is greater than the width of the bottom flange 711. The width of the top flange 713 and the width of the bottom flange 711 refer to the dimensions measured along the thickness direction Z perpendicular to the mainboard 40. After the shielding cover 72 and the shielding frame 71 are processed and manufactured, there is a possibility that the surface is uneven. If the surfaces used for contact of the shielding cover 72 and the shielding frame 71 are uneven, the actual contact area between the shielding cover 72 and the shielding frame 71 will be reduced, which is not conducive to the shielding cover 72 and the shielding frame 71 maintaining a good electrical connection. In the present application, setting the width of at least part of the top flange 713 to be larger is conducive to increasing the contact area between the shielding cover 72 and the shielding frame 71, so as to effectively compensate for the contact area between the shielding cover 72 and the shielding frame 71, and reducing the possibility that the contact area does not meet the requirements due to the unevenness of the surfaces used for contact of the shielding cover 72 and the shielding frame 71.

[0141] The bottom flange 711 is set to a relatively small width, which can help reduce the positive projection area of ​​the bottom flange 711 on the main board 40 while satisfying the connection strength between the bottom flange 711 and the main board 40, thereby reducing the space occupancy rate of the bottom flange 711 on the main board 40 and reducing the possibility of reducing the area on the main board 40 where the electronic device 50 can be set due to the bottom flange 711 occupying too much space on the main board 40.

[0142] Exemplarily, the width of the top flange 713 at any position is greater than the width of the bottom flange 711 .

[0143] Exemplarily, the width of some areas of the top flange 713 itself is greater than the width of the remaining areas. In the area where the top flange 713 needs to avoid the first connection terminal 41, the width of the top flange 713 can be set to be relatively small, and in the area where the top flange 713 does not need to avoid the first connection terminal 41, the width of the top flange 713 can be set to be relatively large, so that the top flange 713 can be set to a larger width dimension as a whole without interfering with the position of the first connection terminal 41, so as to facilitate a larger contact area between the shielding cover 72 and the shielding frame 71.

[0144] Exemplarily, the blank for manufacturing the shield frame 71 is a flat plate. The blank is first punched out by a stamping process to punch out the shield frame 71 having a bottom flange 711, a first side plate 712 and a top flange 713. Then, the shield frame 71 is shaped to fully release the internal stress of the shield frame 71.

[0145] In some possible implementations, see Figure 6 , Figure 7 and Figure 8As shown, the shielding cover 72 and the shielding frame 71 are mutually clamped. The shielding cover 72 and the shielding frame 71 are in contact and pressed against each other at the clamping position, so that the shielding cover 72 and the shielding frame 71 can also maintain good electrical connection at the clamping position. A clamping portion 80 is provided on one of the shielding cover 72 and the shielding frame 71, and a clamping portion 90 is provided on the other. The shielding cover 72 and the shielding frame 71 can be clamped to each other through the clamping portion 80 and the clamping portion 90. The shielding cover 72 and the shielding frame 71 are clamped in a manner, which is conducive to the quick assembly or separation of the shielding cover 72 and the shielding frame 71, and improves the efficiency of the assembly or separation work.

[0146] The mutually engaged clamping part 80 and the clamping part 90 can be pressed and fitted to each other, so that the shielding cover 72 and the shielding frame 71 can also maintain good electrical connection at the clamping position of the clamping part 80 and the clamping part 90. After the clamping part 80 is clamped into the clamping part 90, the clamping part 80 can be limited by the clamping part 90, so that the clamping part 80 and the clamping part 90 can maintain a stable connection state. Under the action of external force, the clamping part 80 is not easy to fall out of the clamping part 90, reducing the possibility that the shielding cover 72 and the shielding frame 71 are separated by accidental collision, resulting in the shielding failure of the shielding member 70.

[0147] In some examples, the engaging portion 80 may be a protrusion, and the engaging portion 90 may be a blind hole or a through hole.

[0148] In some examples, the shielding cover 72 can be an integrally formed structure. The shielding frame 71 can be an integrally formed structure. The snap-fitting portion 80 can be directly processed on one of the shielding cover 72 and the shielding frame 71, and the snap-fitting portion 90 can be directly processed on the other. Therefore, on the one hand, the shielding cover 72 and the shielding frame 71 can maintain good integrity in their own structures; on the other hand, there is no need to additionally set a snap-fitting assembly including the snap-fitting portion 80 and the snap-fitting portion 90 between the shielding cover 72 and the shielding frame 71, which is conducive to reducing the number of parts used and reducing the assembly process in which one of the shielding cover 72 and the shielding frame 71 needs to be assembled with the snap-fitting portion 80 and the other needs to be assembled with the snap-fitting portion 90.

[0149] In some examples, the outer surface of the top flange 713 facing away from the mainboard 40 directly abuts against the inner surface of the shielding cover 72 facing the mainboard 40. At the same time, the shielding cover 72 and the shielding frame 71 are clamped together, which can improve the connection reliability between the shielding cover 72 and the shielding frame 71, so that the shielding cover 72 effectively presses the top flange 713 to ensure that the shielding cover 72 and the top flange 713 are kept in a good fitting contact state, thereby reducing the possibility of poor contact between the shielding cover 72 and the top flange 713 due to looseness of the shielding cover 72 and the shielding frame 71, thereby reducing the possibility of passive inter-modulation (PIM) problems and stray radiation (RSE) problems caused by poor contact.

[0150] In some examples, the shielding frame 71 may include a first side plate 712, a bottom flange 711, and a top flange 713 that are connected. The shielding cover 72 and the first side plate 712 are snap-fitted to each other. The shielding cover 72 and the first side plate 712 are snap-fitted to each other, which is conducive to quick assembly or separation of the shielding cover 72 and the shielding frame 71, and improves the efficiency of assembly or separation. Exemplarily, a snap-fitting portion 80 is provided on one of the shielding cover 72 and the first side plate 712, and a snap-fitting portion 90 is provided on the other. The snap-fitting portion 80 is snap-fitted to the snap-fitting portion 90. The outer surface of the top flange 713 of the shielding frame 71 facing away from the main board 40 is electrically connected to the inner surface of the top plate facing the main board 40.

[0151] See also Figure 6 , Figure 7 and Figure 8 As shown, the shielding cover 72 may include a connected top plate 721 and a second side plate 722. The second side plate 722 and the top plate 721 of the shielding cover 72 are arranged to intersect with each other, and a predetermined angle is formed between the two. For example, the angle between the second side plate 722 and the top plate 721 may be 90°. There may also be an arc transition section between the second side plate 722 and the top plate 721 to reduce stress concentration between the second side plate 722 and the top plate 721. Exemplarily, the blank for manufacturing the shielding cover 72 is a flat plate. The blank is first stamped using a stamping process to stamp out the shielding cover 72 having the second side plate 722 and the top plate 721. Then, the shielding cover 72 is shaped to fully release the internal stress of the shielding cover 72.

[0152] A clamping portion 80 is provided on one of the first side plate 712 of the shielding frame 71 and the second side plate 722 of the shielding cover 72, and a clamping portion 90 is provided on the other. The first connection terminal 41 and the second connection terminal 63 are provided between the top plate 721 of the shielding cover 72 and the main board 40. The first connection terminal 41 and the second connection terminal 63 are provided on the side of the top plate 721 of the shielding cover 72 facing the main board 40.

[0153] In some examples, during the assembly process of the shielding cover 72 and the shielding frame 71, before the clamping portion 80 is clamped into the clamping portion 90, the second side plate 722 of the shielding cover 72 can be elastically deformed. After the clamping portion 80 is clamped into the clamping portion 90, the clamping portion 80 and the clamping portion 90 are pressed and fitted against each other under the elastic restoring force of the second side plate 722. At the same time, the top flange 713 of the shielding frame 71 and the top plate 721 of the shielding cover 72 are pressed and fitted against each other.

[0154] In some examples, the shielding cover 72 is provided with a snap-fit ​​portion 80, and the shielding frame 71 is provided with a snap-fit ​​portion 90. Exemplarily, the snap-fit ​​portion 90 is provided on the first side plate 712 of the shielding frame 71, and the snap-fit ​​portion 80 is provided on the second side plate 722 of the shielding cover 72.

[0155] The engaging portion 90 on the first side plate 712 of the shielding frame 71 has an opening disposed opposite to the middle through hole 71a, that is, the engaging portion 90 has an opening disposed outward. The engaging portion 80 on the second side plate 722 of the shielding cover 72 protrudes toward the accommodating space 180. After the shielding cover 72 and the shielding frame 71 are assembled, the second side plate 722 of the shielding cover 72 is located outside the first side plate 712 of the shielding frame 71 and is visible from outside. The engaging portion 80 on the second side plate 722 is located inside the engaging portion 90.

[0156] In some examples, after the shielding cover 72 is snapped onto the shielding frame 71 , the second side plate 722 may abut against the first side plate 712 , so that the first side plate 712 and the second side plate 722 are in contact.

[0157] In some examples, the first side plate 712 of the shielding frame 71 may have multiple outer sides. The shielding cover 72 may include multiple second side plates 722. The multiple second side plates 722 are independent of each other. There is a spacing between two adjacent second side plates 722, so that a gap is formed between two adjacent second side plates 722. Each second side plate 722 is independently arranged, so that when any second side plate 722 is deformed during the clamping process, it will not pull other second side plates 722. A clamping portion 80 may be provided on each second side plate 722. A clamping portion 90 is provided on the first side plate 712 at a position corresponding to the second side plate 722.

[0158] For example, Fig.10 Schematic diagram showing the partial structure of an electronic device. Figures 8 to 10 As shown, the first side plate 712 of the shielding frame 71 has a first outer side surface 7121, a second outer side surface 7122, a third outer side surface 7123 and a fourth outer side surface 7124 connected to each other. The circuit board 62 of the camera device 60 can pass through between the shielding cover 72 and the shielding frame 71. The circuit board 62 of the camera device 60 is arranged corresponding to the first outer side surface 7121. The third outer side surface 7123 can be a step surface. The shielding cover 72 can include five second side plates 722. The first outer side surface 7121 corresponds to a second side plate 722, and the second side plate 722 is close to the fourth outer side surface 7124, and there is a gap between the second side plate 722 and the circuit board 62 of the camera device 60. The second outer side surface 7122 and the fourth outer side surface 7124 each correspond to a second side plate 722. The third outer side surface 7123 corresponds to two second side plates 722 , wherein a second side plate 722 close to the second outer side surface 7122 is relatively close to the first outer side surface 7121 , and a second side plate 722 close to the fourth outer side surface 7124 is relatively far from the first outer side surface 7121 .

[0159] In some examples, the outer surface of the top flange 713 facing away from the main board 40 directly abuts against the inner surface of the top plate 721 facing the main board 40 , so that the top flange 713 is electrically connected to the top plate 721 .

[0160] In some achievable embodiments, one end of the circuit board 62 is connected to the camera module 61 , and the other end is provided with a second connection terminal 63 . The second connection terminal 63 is provided at an end of the circuit board 62 away from the camera module 61 .

[0161] In some examples, Fig.11 Schematically shows a partial cross-sectional structure of an electronic device. Fig.12 for Fig.11 Enlarged view of M in the middle. Fig.11 and Fig.12 As shown, the shielding member 70 includes an avoidance hole 130. In some examples, the end of the second connection terminal 63 provided on the circuit board 62 passes through the avoidance hole 130 and is located together with the second connection terminal 63 in the accommodating space 180. After the shielding cover 72 and the shielding frame 71 are assembled by being buckled with each other, the avoidance hole 130 can be formed between the shielding cover 72 and the shielding frame 71. The circuit board 62 of the camera device 60 is passed through the avoidance hole 130. After the second connection terminal 63 and the first connection terminal 41 are connected, the circuit board 62 is located above the shielding frame 71. Exemplarily, the avoidance hole 130 is set corresponding to the first outer side surface 7121 of the first side plate 712. The circuit board 62 of the camera device 60 is set corresponding to the first outer side surface 7121 of the first side plate 712.

[0162] In some achievable ways, the surface of the second connection terminal 63 facing away from the first connection terminal 41 is bonded to the shielding cover 72 by conductive adhesive, so that the second connection terminal 63 is electrically connected to the shielding cover 72. The assembly method may be, but is not limited to, after the second connection terminal 63 and the first connection terminal 41 are assembled, conductive adhesive is provided on the surface of the second connection terminal 63 facing away from the first connection terminal 41. Then, the shielding cover 72 is buckled with the shielding frame 71. After the shielding cover 72 and the shielding frame 71 are assembled, the shielding cover 72 is bonded with the conductive adhesive.

[0163] In some possible implementations, see Fig.12 As shown, the electronic device 10 further includes a reinforcing member 100. The reinforcing member 100 is located in the accommodating space 180. At least part of the reinforcing member 100 is disposed on the side of the second connection terminal 63 facing away from the first connection terminal 41. The shielding member 70 can apply a compressive stress toward the second connection terminal 63 to the reinforcing member 100 to ensure the connection reliability and stability between the first connection terminal 41 and the second connection terminal 63, and reduce the possibility of the second connection terminal 63 withdrawing from the first connection terminal 41 and being out of the connection state.

[0164] The reinforcing piece 100 can provide protection for the second connection terminal 63, effectively preventing the second connection terminal 63 from being damaged due to external impact. For example, the reinforcing piece 100 can separate the second connection terminal 63 from the shielding piece 70, reducing the possibility of damage to the structure of the second connection terminal 63 due to the shielding piece 70 directly applying compressive stress to the second connection terminal 63. For example, the reinforcing piece 100 can be connected to the second connection terminal 63.

[0165] The reinforcing piece 100 is a conductive structure. The reinforcing piece 100 is electrically connected to the second connection terminal 63. The reinforcing piece 100 is electrically connected to the shielding cover 72. Therefore, the second connection terminal 63 is electrically connected to the grounding terminal 42 of the mainboard 40 through the reinforcing piece 100, the shielding cover 72 and the shielding frame 71 to achieve indirect grounding.

[0166] In some embodiments, the structure of the above-mentioned shielding member 70 can be replaced by a clamping steel sheet. For example, a strip-shaped clamping steel sheet is provided above the reinforcing member 100 along the thickness direction Z of the main board 40. The clamping steel sheet is used to clamp the reinforcing member 100 and the second connecting terminal 63 along the thickness direction Z of the main board 40. The two ends of the clamping steel sheet can be grounded to the main board 40. Exemplarily, fasteners such as screws can be used to connect the ends of the clamping steel sheet to the main board 40 to achieve grounding. In this scheme, the grounding area between the clamping steel sheet and the main board 40 is small, and the shielding area of ​​the first connecting terminal 41 and the second connecting terminal 63 by the clamping steel sheet is also small. Compared with the structure of the above-mentioned shielding member 70, the grounding area between the shielding member 70 and the main board 40 is relatively large, and the shielding member 70 can cover the first connecting terminal 41 and the second connecting terminal 63, so that the shielding member 70 can effectively improve the shielding effect. In addition, the contact area between the reinforcing member 100 and the shielding member 70 is relatively large, which is conducive to achieving a larger electrical connection area between the reinforcing member 100 and the shielding member 70 and reducing impedance. Therefore, the method of simultaneously providing the shielding member 70 and the reinforcing member 100 can effectively improve the shielding effect.

[0167] The material of the reinforcing piece 100 may be a metal material. For example, the material of the reinforcing piece 100 may be steel, for example, stainless steel. For example, the reinforcing piece 100 may be a steel sheet.

[0168] In some examples, at least one of the second connection terminal 63 and the top plate 721 of the shielding cover 72 may be bonded to the reinforcing member 100. For example, the reinforcing member 100 may be connected to the second connection terminal 63 by bonding. For example, the reinforcing member 100 may be bonded to the second connection terminal 63 by a conductive adhesive layer, and the reinforcing member 100 and the second connection terminal 63 are electrically connected.

[0169] In some examples, the shielding cover 72 of the shielding member 70 directly abuts against the reinforcing member 100. The shielding cover 72 of the shielding member 70 directly contacts the reinforcing member 100 to achieve electrical connection, so that there is no need to set up additional structural members for achieving electrical connection between the shielding member 70 and the reinforcing member 100, which is beneficial to reduce the number of parts used and the assembly process. The shielding cover 72 is located on the side of the reinforcing member 100 facing away from the mainboard 40. After the shielding cover 72 and the shielding frame 71 are assembled, the shielding cover 72 can directly abut against the reinforcing member 100. The shielding cover 72 can apply compressive stress to the reinforcing member 100 and the second connecting terminal 63 to ensure the connection stability between the second connecting terminal 63 and the first connecting terminal 41.

[0170] In some examples, Fig.13 Schematically shows the partial cross-sectional structure of an electronic device. Fig.13 As shown, the shielding member 70 has an insulating layer 140. The insulating layer 140 can be provided on the outer surface of the shielding cover 72. The insulating layer 140 provided on the shielding cover 72 can help maintain a good insulation isolation state between the shielding cover 72 and other conductive structures. If the shielding cover 72 is not provided with the insulating layer 140, there is a situation where the shielding cover 72 and other conductive structures are electrically connected. If there is a poor contact between the shielding cover 72 and other conductive structures, it will cause the shielding cover 72 and other conductive structures to generate Passive Inter-Modulation (PIM) problems and the possibility of generating stray radiation (RSE) problems. The insulating layer 140 is provided on the outer surface of the shielding cover 72 of the present application, which can effectively reduce the possibility of the above-mentioned problems.

[0171] Exemplarily, an insulating paint may be provided on the outer surface of the shielding cover 72. The insulating paint is cured to form the insulating layer 140. For example, the insulating paint may be sprayed on the outer surface of the shielding cover 72 by spraying.

[0172] In some examples, Fig.14 Schematically shows the partial cross-sectional structure of an electronic device. Fig.13 As shown, the electronic device 10 further includes a conductive member 110. The conductive member 110 is disposed between the shielding cover 72 of the shielding member 70 and the reinforcing member 100. The conductive member 110 can realize electrical connection between the shielding member 70 and the reinforcing member 100. After the shielding cover 72 and the shielding frame 71 are assembled, the shielding cover 72 and the reinforcing member 100 can jointly press the conductive member 110 to ensure good contact between the shielding member 70 and the reinforcing member 100 and the conductive member 110, and maintain the stability of the electrical connection state between the shielding member 70 and the reinforcing member 100 and the conductive member 110.

[0173] The conductive member 110 may be a flexible structure, which has the property of being compressible and deformable. The shielding cover 72 of the shielding member 70 and the reinforcing member 100 may jointly press the conductive member 110. Since the conductive member 110 may be compressible and deformable, when the surface of at least one of the shielding cover 72 of the shielding member 70 and the reinforcing member 100 is uneven, the conductive member 110 may compensate by deforming itself, thereby ensuring that the shielding cover 72 of the shielding member 70 and the conductive member 110 and the reinforcing member 100 and the conductive member 110 maintain a close fit and contact state, so that the shielding cover 72 of the shielding member 70 and the reinforcing member 100 maintain a good electrical connection state, which is conducive to reducing impedance.

[0174] Exemplarily, the conductive member 110 may be a conductive cloth or a conductive adhesive layer.

[0175] In some examples, the reinforcing member 100 is capacitively coupled to the shielding cover 72 of the shielding member 70, thereby achieving an equivalent electrical connection effect between the reinforcing member 100 and the shielding member 70. A capacitor with a relatively large capacity can be equivalently formed between the reinforcing member 100 and the shielding cover 72 of the shielding member 70, thereby achieving electrical signal coupling from one of the reinforcing member 100 and the shielding member 70 to the other. The non-direct contact between the reinforcing member 100 and the shielding cover 72 can avoid the poor contact between the shielding cover 72 and the reinforcing member 100, thereby reducing the possibility of Passive Inter-Modulation (PIM) problems and spurious radiation (RSE) problems caused by poor contact.

[0176] Fig.15 Schematically shows the partial cross-sectional structure of an electronic device. Fig.15 As shown, the electronic device 10 further includes a high dielectric layer 120. The high dielectric layer 120 is disposed between the shielding cover 72 of the shielding member 70 and the reinforcing member 100. When the shielding member 70, the reinforcing member 100 and the high dielectric layer 120 are assembled, the shielding cover 72 of the shielding member 70 and the reinforcing member 100 can jointly compress the high dielectric layer 120. The shielding member 70, the reinforcing member 100 and the high dielectric layer 120 form a capacitive coupling connection.

[0177] The high dielectric layer 120 is a film layer structure having a relatively high dielectric constant. The high dielectric layer 120 can be used as an insulating medium, thereby isolating the reinforcing member 100 from the shielding member 70. The reinforcing member 100 and the shielding cover 72 of the shielding member 70 respectively form coupling surfaces with the areas corresponding to the high dielectric layer 120. According to the capacitance calculation formula, under the premise that the spacing between the reinforcing member 100 and the shielding cover 72 of the shielding member 70 and the area of ​​the coupling surface remain unchanged, the greater the dielectric constant of the insulating medium between the reinforcing member 100 and the shielding cover 72 of the shielding member 70, the greater the capacity of the equivalently formed capacitor. According to the capacitance impedance calculation formula, the greater the capacitance of the capacitor, the smaller its capacitance impedance. The capacitance impedance is the equivalent impedance.

[0178] The shielding member 70 and the reinforcing member 100 are in non-electrical contact with the high dielectric layer 120. Since the capacitive coupling connection method does not have the problem of poor contact, there is no requirement for the stability of the contact resistance between the shielding member 70 and the reinforcing member 100 and the high dielectric layer 120, so there is no need to perform surface treatment such as nickel plating or gold plating on the shielding member 70 and the reinforcing member 100. In addition, the setting position of the high dielectric layer 120 can be freely and flexibly selected according to design requirements.

[0179] Exemplarily, when a high-frequency electrical signal is generated on the reinforcing member 100 , the high-frequency electrical signal may be released to the shielding member 70 through capacitive coupling between the reinforcing member 100 and the shielding member 70 .

[0180] Exemplarily, the high dielectric layer 120 itself can have good elasticity so that it can be used in a small space, and the resilience of the high dielectric layer 120 can be used to absorb the assembly tolerance and processing tolerance of the shielding member 70 and the reinforcement member 100, ensuring that the shielding member 70 and the reinforcement member 100 are each in good pressure state with the high dielectric layer 120.

[0181] For example, the high dielectric layer 120 may include an elastomer and magnesium powder or aluminum powder disposed in the elastomer. The material of the elastomer may be plastic.

[0182] Exemplarily, the high dielectric layer 120 may include an absorbing material, so that the high dielectric layer 120 can absorb and attenuate electromagnetic signals incident from space, reduce or eliminate reflected electromagnetic signals, and help reduce interference caused by bad electromagnetic signals. For example, the absorbing material of the high dielectric layer 120 may include sendust material.

[0183] In some achievable ways, Fig.16 Schematic diagram showing the partial structure of an electronic device. Fig.16 As shown, different from the above-mentioned embodiment in which the shielding member 70 includes a shielding frame 71 and a shielding cover 72, the shielding member 70 of this embodiment is an integrally formed structure.

[0184] The shielding member 70 is connected to the main board 40. Exemplarily, the shielding member 70 is welded to the main board 40. An accommodation space is formed between the shielding member 70 and the main board 40. The first connection terminal 41 and the second connection terminal 63 are located in the accommodation space. The shielding member 70 is electrically connected to the ground terminal 42. The second connection terminal 63 is electrically connected to the shielding member 70.

[0185] In some examples, the shielding member 70 includes a top wall 70a and a side wall 70b. The side wall 70b is connected to the main board 40. The side wall 70b is electrically connected to the ground terminal 42 of the main board 40. Exemplarily, the shielding member 70 is welded to the ground terminal 42. The top wall 70a is electrically connected to the second connection terminal 63. The first connection terminal 41, the second connection terminal 63, the top wall 70a and the side wall 70b can be grounded through the ground terminal 42 of the main board 40.

[0186] The side wall 70b can be an annular structure. The side wall 70b of the shielding member 70 is arranged around the first connecting terminal 41, so that the shielding member 70 can provide a good shielding effect on the first connecting terminal 41 in any direction. The shape of the side wall 70b can be regular, such as rectangular or circular. The shape of the side wall 70b can also be irregular, and the present application does not specifically limit this. In some examples, the side wall 70b can also have a notch, and the side wall 70b is disconnected and discontinuous at the notch, so that the side wall 70b is not a continuous annular structure.

[0187] The surface of the second connection terminal 63 facing away from the first connection terminal 41 is bonded to the top wall 70a of the shielding member 70 by conductive adhesive, so that the second connection terminal 63 is electrically connected to the top wall 70a of the shielding member 70. The assembly method may be, but is not limited to, after the second connection terminal 63 and the first connection terminal 41 are assembled, conductive adhesive is provided on the surface of the second connection terminal 63 facing away from the first connection terminal 41. Then, the shielding member 70 is assembled with the main board 40. After the shielding member 70 and the main board 40 are assembled, the top wall 70a of the shielding member 70 is bonded with the conductive adhesive.

[0188] The electronic device 10 further includes a reinforcing member 100. The reinforcing member 100 is disposed on a side of the second connection terminal 63 that faces away from the first connection terminal 41. The reinforcing member 100 is a conductive structure. The reinforcing member 100 is electrically connected to the second connection terminal 63. The reinforcing member 100 is electrically connected to the top wall 70a of the shielding member 70.

[0189] The reinforcing piece 100 can provide protection for the second connection terminal 63, effectively preventing the second connection terminal 63 from being damaged by external impact. The shielding piece 70 can apply compressive stress toward the second connection terminal 63 to the reinforcing piece 100 to ensure the connection reliability and stability between the first connection terminal 41 and the second connection terminal 63, and reduce the possibility of the second connection terminal 63 withdrawing from the first connection terminal 41 and being disconnected.

[0190] In some examples, the top wall 70a of the shielding member 70 directly abuts against the reinforcing member 100. The top wall 70a of the shielding member 70 directly contacts the reinforcing member 100 to achieve electrical connection, so that there is no need to set up additional structural members for achieving electrical connection between the shielding member 70 and the reinforcing member 100, which is beneficial to reduce the number of parts used and the assembly process. The top wall 70a of the shielding member 70 is located on the side of the reinforcing member 100 facing away from the main board 40. After the shielding member 70 and the main board 40 are assembled, the top wall 70a of the shielding member 70 can directly abut against the reinforcing member 100. The top wall 70a of the shielding member 70 can apply compressive stress to the reinforcing member 100 and the second connecting terminal 63 to ensure the connection stability between the second connecting terminal 63 and the first connecting terminal 41.

[0191] In some examples, the electronic device 10 further includes a conductive member 110. The conductive member 110 is disposed between the top wall 70a of the shielding member 70 and the reinforcing member 100. The conductive member 110 electrically connects the top wall 70a of the shielding member 70 and the reinforcing member 100. The conductive member 110 is disposed between the top wall 70a of the shielding member 70 and the reinforcing member 100. The conductive member 110 can realize electrical connection between the shielding member 70 and the reinforcing member 100. After the shielding member 70 and the mainboard 40 are assembled, the top wall 70a of the shielding member 70 and the reinforcing member 100 can jointly press the conductive member 110 to ensure good contact between the shielding member 70 and the reinforcing member 100 and the conductive member 110, and maintain the stability of the electrical connection state between the shielding member 70 and the reinforcing member 100 and the conductive member 110. Exemplarily, the conductive member 110 can be a flexible structure, which itself has the property of being compressible and deformable. Since the conductive member 110 can be compressed and deformed, when the surface of at least one of the shielding member 70 and the reinforcing member 100 is uneven, the conductive member 110 can compensate by deforming itself, thereby ensuring that the shielding member 70 and the conductive member 110 and the reinforcing member 100 are in close contact with each other, so that the shielding member 70 and the reinforcing member 100 are in good electrical connection, which is conducive to reducing impedance. Exemplarily, the conductive member 110 can be a conductive cloth or a conductive adhesive layer.

[0192] In some examples, the reinforcing member 100 is capacitively coupled to the top wall 70a of the shielding member 70, thereby achieving an equivalent electrical connection effect between the reinforcing member 100 and the shielding member 70. A capacitor with a relatively large capacity can be equivalently formed between the reinforcing member 100 and the top wall 70a of the shielding member 70, thereby achieving electrical signal coupling from one of the reinforcing member 100 and the shielding member 70 to the other. The non-direct contact between the reinforcing member 100 and the shielding member 70 can avoid poor contact between the shielding member 70 and the reinforcing member 100, thereby reducing the possibility of Passive Inter-Modulation (PIM) problems and spurious radiation (RSE) problems caused by poor contact.

[0193] In some examples, the electronic device 10 further includes a high dielectric layer 120. The high dielectric layer 120 is disposed between the reinforcing member 100 and the top wall 70a of the shielding member 70. When the shielding member 70, the reinforcing member 100, and the high dielectric layer 120 are assembled, the top wall 70a of the shielding member 70 and the reinforcing member 100 can jointly compress the high dielectric layer 120. The shielding member 70, the reinforcing member 100, and the high dielectric layer 120 form a capacitive coupling connection.

[0194] The shielding member 70 and the reinforcing member 100 are in non-electrical contact with the high dielectric layer 120. Since the capacitive coupling connection method does not have the problem of poor contact, there is no requirement for the stability of the contact resistance between the shielding member 70 and the reinforcing member 100 and the high dielectric layer 120, so there is no need to perform surface treatment such as nickel plating or gold plating on the shielding member 70 and the reinforcing member 100. In addition, the setting position of the high dielectric layer 120 can be freely and flexibly selected according to design requirements.

[0195] In some examples, the shielding member 70 has an escape hole 130 . The circuit board 62 passes through the escape hole 130 .

[0196] In some examples, an insulating layer 140 is provided on the outer surface of the shielding member 70. The insulating layer 140 provided on the shielding member 70 can help maintain a good insulation isolation state between the shielding member 70 and other conductive structures. If the shielding member 70 is not provided with the insulating layer 140, there is a situation where the shielding member 70 and other conductive structures are electrically connected. If there is a poor contact between the shielding member 70 and other conductive structures, it will cause the shielding member 70 and other conductive structures to generate Passive Inter-Modulation (PIM) problems and the possibility of generating stray radiation (RSE) problems. The insulating layer 140 is provided on the outer surface of the shielding member 70 of the present application, which can effectively reduce the possibility of the above problems.

[0197] In some achievable ways, Fig.17The partial structure of the electronic device is schematically shown. The electronic device 10 may include one or more camera devices 60. For each camera device 60, a corresponding shielding member 70 may be provided in any manner in the above embodiments. Fig.17 As shown, the electronic device 10 further includes an antenna 160. Figures 1 to 3 , the housing 30 includes a back cover 31 and a frame 32. The back cover 31 may be connected to the frame 32. The antenna 160 is disposed on the frame 32. Exemplarily, the antenna 160 is disposed on the inner wall of the frame 32 facing the mainboard 40. The first connection terminal 41, the second connection terminal 63 and the shielding member 70 are disposed near the antenna 160. The first connection terminal 41, the second connection terminal 63 and the shielding member 70 may be disposed on the edge area of ​​the mainboard 40, so that the edge area of ​​the mainboard 40 can be effectively utilized, which is conducive to improving the utilization rate of the mainboard 40. Since the shielding member 70 can provide effective shielding for the first connection terminal 41 and the second connection terminal 63, when the antenna 160 is in a working state of radiating wireless signals, the electromagnetic signal generated by the antenna 160 is not easy to interfere with the first connection terminal 41 and the second connection terminal 63, thereby reducing the possibility of the antenna 160 having an adverse effect on the camera device 60 when performing the shooting function.

[0198] In some examples, the mainboard 40 is provided with an electronic component 150. The electronic component 150 is disposed in the accommodation space 180. The shielding member 70 can shield the electronic component 150. When the electronic component 150 is in operation, the electromagnetic signal emitted by the electronic component 150 is not easily propagated to the antenna 160 located outside the shielding member 70 and relatively close to the electronic component 150, effectively reducing the possibility of the electronic component 150 causing signal interference to the antenna 160.

[0199] In some examples, as shown in Table 1, a comparison of relevant data between the electronic device 10 of the embodiment of the present application and the electronic device 10 of the related art is exemplarily described:

[0200] Table 1:

[0201]

[0202] The operating frequency band of the antenna 160 can support the N1 band, the N3 band and the B39 band. When the antenna 160 operates in these frequency bands, if the shielding member 70 is not provided outside the connector formed by the first connecting terminal 41 and the second connecting terminal 63, the isolation between the connector formed by the first connecting terminal 41 and the second connecting terminal 63 and the antenna 160 can be -41.2dB. In the present application, a shielding member 70 is provided outside the connector formed by the first connecting terminal 41 and the second connecting terminal 63, so that when the antenna 160 operates in these frequency bands, the isolation between the antenna 160 and the connector can be -50.7dB, so that the isolation can be improved, and then the isolation requirements between the antenna 160 and the connector are met, reducing the possibility of signal interference. Exemplarily, the camera device 60 can be a rear camera of the electronic device 10.

[0203] It should be noted that isolation is used to quantitatively characterize the strength of electromagnetic coupling, and its unit is dB.

[0204] The operating frequency band of the antenna 160 can support the N41 band and the WIFI 2.4 GHz band. When the antenna 160 operates in these frequency bands, if the shielding member 70 is not provided outside the connector formed by the first connecting terminal 41 and the second connecting terminal 63, the isolation between the connector formed by the first connecting terminal 41 and the second connecting terminal 63 and the antenna 160 can be -40.2 dB. The connector formed outside the first connecting terminal 41 and the second connecting terminal 63 of the present application is provided with a shielding member 70, so that when the antenna 160 operates in these frequency bands, the isolation between the antenna 160 and the connector can be -50.1 dB, so that the isolation can be improved, and then the isolation requirements between the antenna 160 and the connector are met, reducing the possibility of signal interference.

[0205] In some examples, in the related art, a shielding member 70 is not provided outside the connector formed by the first connection terminal 41 and the second connection terminal 63. In an environment with electromagnetic signals, the maximum value of the electric field strength measurement value at the positions of the first connection terminal 41 and the second connection terminal 63 can be 42 dB V / m. A shielding member 70 is provided outside the connector formed by the first connection terminal 41 and the second connection terminal 63 of the present application. In the same environment, the maximum value of the electric field strength measurement value at the positions of the first connection terminal 41 and the second connection terminal 63 can be 26 dB V / m, thereby relatively optimizing 16 dB V / m. Therefore, by providing a shielding member 70, the first connection terminal 41 and the second connection terminal 63 can be effectively protected and signal interference can be reduced.

[0206] In some achievable ways, Fig.18 Schematically shows the partial cross-sectional structure of an electronic device. Fig.18As shown, the electronic device 10 also includes a metal bracket 200. The mainboard 40 can be connected to the metal bracket 200. The metal bracket 200 is used to provide support and installation foundation for the mainboard 40. A partial area of ​​the metal bracket 200 can be located on one side of the shielding member 70. The shielding member 70 can be located between the mainboard 40 and the metal bracket 200. Since the shielding member 70 is grounded and the shield is arranged outside the connector formed by the first connecting terminal 41 and the second connecting terminal 63, the shielding member 70 can effectively isolate the connector formed by the first connecting terminal 41 and the second connecting terminal 63 and the metal bracket 200, thereby reducing the possibility of electromagnetic signal interference in the connector formed by the first connecting terminal 41 and the second connecting terminal 63 due to the provision of the metal bracket 200.

[0207] The outer surface of the shielding member 70 may have an insulating layer 140 , so that the metal bracket 200 and the shielding member 70 are insulated and isolated from each other, and no electrical connection occurs between the two.

[0208] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0209] The embodiments of the present application do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise precisely and specifically specified.

[0210] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0211] The term "plurality" in this article refers to two or more than two. The term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the previous and next associated objects are in an "or" relationship; in a formula, the character " / " indicates that the previous and next associated objects are in a "division" relationship.

[0212] It should be understood that the various numerical numbers involved in the embodiments of the present application are only used for the convenience of description and are not used to limit the scope of the embodiments of the present application.

[0213] It can be understood that in the embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. An electronic device, characterized in that: include: A mainboard, comprising a first connecting terminal and a grounding terminal; A camera device, comprising a camera module, a circuit board and a second connection terminal, wherein the camera module is electrically connected to the circuit board, the second connection terminal is electrically connected to the circuit board, and the first connection terminal is electrically connected to the second connection terminal; A shielding member, forming an accommodation space with the mainboard, the first connecting terminal and the second connecting terminal are located in the accommodation space, the shielding member comprises an electrically connected shielding frame and a shielding cover, the shielding frame is connected to the mainboard, the shielding frame is electrically connected to the ground terminal, and the shielding cover is connected to the shielding frame; A reinforcing piece, at least part of which is disposed on a side of the second connecting terminal facing away from the first connecting terminal, the reinforcing piece is a conductive structure, the reinforcing piece is electrically connected to the second connecting terminal, and the reinforcing piece is electrically connected to the shielding cover.

2. The electronic device according to claim 1, characterized in that: The shielding frame is a ring-shaped structure, and the first connecting terminal is located in the shielding frame.

3. The electronic device according to claim 1, characterized in that: The shielding cover is detachably connected to the shielding frame.

4. The electronic device according to claim 3, characterized in that: The shielding cover and the shielding frame are clamped with each other.

5. The electronic device according to claim 1, characterized in that: The shielding frame includes a bottom flange, a first side plate and a top flange, the bottom flange and the top flange are both connected to the first side plate, the bottom flange is electrically connected to the grounding terminal, and the outer surface of the top flange facing away from the mainboard is electrically connected to the inner surface of the shielding cover facing the mainboard.

6. The electronic device according to claim 5, characterized in that: The outer surface of the top flange facing away from the mainboard directly abuts against the inner surface of the shielding cover facing the mainboard, so that the top flange is electrically connected to the shielding cover, and at least part of the width of the top flange is greater than the width of the bottom flange.

7. The electronic device according to claim 5, characterized in that: The shielding cover and the first side plate are clamped with each other.

8. The electronic device according to claim 7, characterized in that: A clamping portion is disposed on one of the shielding cover and the first side plate, and a clamping portion is disposed on the other of the shielding cover and the first side plate, and the clamping portion is clamped with the clamping portion.

9. The electronic device according to claim 8, characterized in that: The shielding cover includes a connected top plate and a second side plate, the clamping portion is arranged on one of the first side plate and the second side plate, and the clamping portion is arranged on the other side, the first connecting terminal and the second connecting terminal are arranged between the top plate and the main board, and the outer surface of the top flange facing away from the main board is electrically connected to the inner surface of the top plate facing the main board.

10. The electronic device according to claim 9, characterized in that: There are multiple second side plates, and there is a gap between two adjacent second side plates.

11. The electronic device according to claim 9, characterized in that: The outer surface of the top flange facing away from the main board directly abuts against the inner surface of the top plate facing the main board, so that the top flange is electrically connected to the top plate.

12. The electronic device according to any one of claims 1 to 11, characterized in that: The shielding cover directly contacts the reinforcing member.

13. The electronic device according to claim 12, characterized in that: The electronic device further comprises a conductive member, which is disposed between the shielding cover and the reinforcing member and electrically connects the shielding cover and the reinforcing member.

14. The electronic device according to claim 13, characterized in that: The conductive element is a flexible structure.

15. The electronic device according to any one of claims 1 to 11, characterized in that: The reinforcing piece is capacitively coupled to the shielding cover.

16. The electronic device according to claim 15, characterized in that: The electronic device further comprises a high dielectric layer, and the high dielectric layer is arranged between the reinforcing piece and the shielding cover.

17. The electronic device according to claim 16, characterized in that: The material of the high dielectric layer includes a wave absorbing material.

18. The electronic device according to any one of claims 1 to 11, characterized in that: An escape hole is provided between the shielding cover and the shielding frame, and the circuit board is passed through the escape hole.

19. The electronic device according to any one of claims 1 to 11, characterized in that: An insulating layer is disposed on the outer surface of the shielding cover.

20. The electronic device according to any one of claims 1 to 11, characterized in that: The electronic device further includes an electronic component, which is disposed on the mainboard, disposed in the accommodation space, and spaced apart from the first connection terminal.

21. The electronic device according to any one of claims 1 to 11, characterized in that: The electronic device comprises a shell and an antenna, the mainboard is arranged in the shell, the shell comprises a frame, the antenna is arranged in the frame, and the first connecting terminal, the second connecting terminal and the shielding component are arranged close to the antenna.

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