Display panel, preparation method of display panel and display device

Abstract

The invention discloses a display panel, a preparation method of the display panel and a display device, relates to the technical field of display, and can improve the performance of a frame of the display panel and prolong the service life of the display device. The display panel comprises a substrate layer, and the substrate layer comprises at least two organic film layers and at least two inorganic film layers which are stacked; the substrate layer comprises a display area and a non-display area, and the non-display area surrounds the display area; the non-display area comprises a first non-display area and a second non-display area, the second non-display area is arranged between the first non-display area and the display area, and the first non-display area comprises a virtual cutting line; an inorganic film layer is arranged between at least two organic film layers in the display area, the total thickness value of the inorganic film layer in the first non-display area is a first numerical value, the total thickness value of the inorganic film layer in the display area is a second numerical value, and the first numerical value is smaller than the second numerical value.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a method for preparing a display panel, and a display device. Background Art

[0002] At present, as AMOLED (Active Matrix Organic Light Emitting Diode) display technology becomes more and more common in people's lives, AMOLED display devices are inevitably subject to drops and collisions during use, so the requirements for their quality are gradually increasing. However, the display panel frame of existing AMOLED display devices is relatively fragile. In the event of collision and drop, the display panel is prone to film peeling, and the reliability is poor, which affects the service life of the display device. Summary of the invention

[0003] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device, which can improve the performance of a display panel frame and extend the service life of the display device.

[0004] According to a first aspect of an embodiment of the present application, a display panel is provided, comprising: a substrate layer, the substrate layer comprising at least two organic film layers and at least two inorganic film layers stacked;

[0005] The substrate layer includes a display area and a non-display area, and the non-display area surrounds the display area;

[0006] The non-display area includes a first non-display area and a second non-display area, the second non-display area is arranged between the first non-display area and the display area, and the first non-display area includes a virtual cutting line;

[0007] The inorganic film layer is arranged between at least two organic film layers in the display area, the total thickness of the inorganic film layers in the first non-display area is a first value, and the total thickness of the inorganic film layers in the display area is a second value, and the first value is smaller than the second value.

[0008] In some embodiments, an orthographic projection of at least one of the inorganic film layers on the substrate layer does not overlap with the first non-display area.

[0009] In some embodiments, the substrate layer includes a first inorganic film layer and a second inorganic film layer;

[0010] The orthographic projection of the first inorganic film layer on the substrate layer does not overlap with the first non-display area; and / or,

[0011] The orthographic projection of the second inorganic film layer on the substrate layer does not overlap with the first non-display area.

[0012] In some embodiments, an orthographic projection boundary of the inorganic film layer on the substrate layer is close to the display area relative to the virtual cutting line.

[0013] In some embodiments, a distance between an orthographic projection boundary of the inorganic film layer on the substrate layer and the virtual cutting line ranges from 30 to 40 um.

[0014] In some embodiments, the substrate layer includes a first inorganic film layer and a second inorganic film layer;

[0015] The thickness of the first inorganic film layer is greater than the thickness of the second inorganic film layer;

[0016] The orthographic projection boundary of the first inorganic film layer on the substrate is a first boundary, and the first boundary falls within the second non-display area; and / or

[0017] The orthographic projection boundary of the second inorganic film layer on the substrate is a second boundary, and the second boundary falls within the first non-display area.

[0018] In some embodiments, at least two of the organic film layers in the first non-display area are connected; and / or,

[0019] At least two layers of the organic film cover the virtual cutting line.

[0020] In some embodiments, the display panel further includes:

[0021] a third organic film layer, the third organic film layer being disposed on a side of the substrate layer away from the substrate layer, wherein the third organic film layer covers the first non-display area, the second non-display area and the display area;

[0022] an encapsulation layer, wherein the encapsulation layer is disposed between the third organic film layer and the substrate layer, and an orthographic projection of the encapsulation layer on the substrate layer does not overlap with the first non-display area;

[0023] a driving layer, wherein the driving layer is disposed between the substrate layer and the encapsulation layer, and the driving layer covers at least a portion of the second non-display area and the display area;

[0024] A light emitting device layer is provided between the driving layer and the encapsulation layer, the light emitting device layer is electrically connected to the pixel circuit of the driving layer, and the light emitting device layer covers the display area.

[0025] In some embodiments, the display panel further includes:

[0026] A fourth organic film layer, wherein the fourth film layer is disposed between the third organic film layer and the encapsulation layer, the orthographic projection boundary of the fourth organic film layer on the substrate layer is a third boundary, and the third boundary coincides with the boundary of the first non-display area.

[0027] In some embodiments, the display panel further includes:

[0028] a blocking column, wherein the blocking column is disposed in the second non-display area;

[0029] The encapsulation layer comprises a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer, the first inorganic encapsulation layer and the second inorganic encapsulation layer both cover the barrier column, and a side of the barrier column close to the display area is connected to the inorganic encapsulation layer;

[0030] The orthographic projection of the blocking pillar on the substrate layer overlaps with the orthographic projection of the inorganic film layer on the substrate layer.

[0031] In some embodiments, the substrate layer includes a first inorganic film layer and a second inorganic film layer;

[0032] The thickness of the first inorganic film layer in the first non-display area is less than the thickness of the first inorganic film layer in the second non-display area; and / or,

[0033] A thickness of the second inorganic film layer in the first non-display area is smaller than a thickness of the second inorganic film layer in the second non-display area.

[0034] A second aspect of the embodiments of the present application provides a method for manufacturing a display panel, which is applied to the display panel described in the first aspect. The method for manufacturing the display panel includes:

[0035] At least two organic film layers and at least two inorganic film layers are respectively provided to obtain a substrate layer, wherein:

[0036] The substrate layer comprises a display area and a non-display area, the non-display area surrounds the display area, the non-display area comprises a first non-display area and a second non-display area, the second non-display area is arranged between the first non-display area and the display area, the first non-display area comprises a virtual cutting line, the inorganic film layer is arranged between at least two layers of the organic film layers in the display area, the total thickness value of the inorganic film layer in the first non-display area is a first value, the total thickness value of the inorganic film layer in the display area is a second value, and the first value is less than the second value;

[0037] Cutting is performed along the virtual cutting line to obtain a plurality of display panels.

[0038] In some embodiments, the at least two organic film layers and the at least two inorganic film layers are provided separately, comprising:

[0039] At least two organic film layers and at least two inorganic film layers are respectively provided;

[0040] At least one layer of the inorganic film layer in the first non-display area is removed.

[0041] In some embodiments, the at least two organic film layers and the at least two inorganic film layers are provided separately, comprising:

[0042] At least two organic film layers and at least two inorganic film layers are respectively provided;

[0043] The thickness of at least one inorganic film layer in the first non-display area is reduced.

[0044] According to a third aspect of the embodiments of the present application, a display device is provided, including:

[0045] A display panel as claimed in claim 1.

[0046] The display panel provided by the embodiment of the present application is provided with at least one inorganic film layer between at least two organic film layers, and the thickness of the inorganic film layer in the first non-display area is less than the thickness of the inorganic film layer in the second non-display area. By providing the virtual cutting line in the first non-display area, the thickness of the inorganic film layer in the area where the virtual cutting line is located is reduced, and the gap between the organic film layers is reduced, so that the bonding force between the organic film layers at the cutting boundary is enhanced. It can prevent the film layer of the display panel from falling off in the event of collision and falling, improve the anti-fall and anti-collision performance of the display panel, and extend the service life of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 A schematic structural diagram of a display panel provided in an embodiment of the present application;

[0048] Figure 2 A schematic partial diagram of a display panel provided in an embodiment of the present application;

[0049] Figure 3 A schematic partial diagram of another display panel provided in an embodiment of the present application;

[0050] Figure 4 A schematic partial diagram of another display panel provided in an embodiment of the present application;

[0051] Figure 5 A schematic partial diagram of another display panel provided in an embodiment of the present application;

[0052] Figure 6A schematic partial diagram of another display panel provided in an embodiment of the present application;

[0053] Figure 7 A schematic structural diagram of another display panel provided in an embodiment of the present application;

[0054] Figure 8 A schematic structural diagram of another display panel provided in an embodiment of the present application;

[0055] Fig. 9 A schematic structural diagram of another display panel provided in an embodiment of the present application;

[0056] Fig.10 A schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application;

[0057] Fig.11 A schematic flow chart of another method for preparing a display panel provided in an embodiment of the present application;

[0058] Fig.12 A schematic flow chart of another method for preparing a display panel provided in an embodiment of the present application;

[0059] Fig.13 A schematic structural diagram of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0060] In order to better understand the technical solutions provided by the embodiments of this specification, the technical solutions of the embodiments of this specification are described in detail below through the accompanying drawings and specific embodiments. It should be understood that the embodiments of this specification and the specific features in the embodiments are detailed descriptions of the technical solutions of the embodiments of this specification, rather than limitations on the technical solutions of this specification. In the absence of conflict, the embodiments of this specification and the technical features in the embodiments can be combined with each other.

[0061] In this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or equipment. In the absence of more restrictions, the elements limited by the statement "comprise one..." do not exclude the existence of other identical elements in the process, method, article or equipment including the elements. The term "more than two" includes two or more than two situations.

[0062] At present, as AMOLED display technology becomes more and more common in people's lives, AMOLED display devices are inevitably subject to drops and collisions during use, so the requirements for their quality are gradually increasing. However, the display panel frame of existing AMOLED display devices is relatively fragile. In the event of collision and drop, the display panel is prone to film peeling, and the reliability is poor, which affects the service life of the display device.

[0063] In view of this, the embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device, which can improve the performance of the display panel frame and extend the service life of the display panel.

[0064] In a first aspect of an embodiment of the present application, a display panel is provided. The display panel includes a substrate layer, and the substrate layer includes at least two organic film layers and at least two inorganic film layers stacked. The substrate layer includes a display area and a non-display area, and the non-display area surrounds the display area. The non-display area includes a first non-display area and a second non-display area, and the second non-display area is arranged between the first non-display area and the display area. The first non-display area includes a virtual cutting line, and the virtual cutting line can be used as a cutting boundary of the display panel frame structure. According to actual cutting requirements, the position of the virtual cutting line in the first non-display area can be moved. An inorganic film layer is arranged between at least two organic film layers in the display area, and at least one inorganic film layer is etched so that the total thickness of the inorganic film layer in the first non-display area is less than the total thickness of the inorganic film layer in the second non-display area. Among them, the total thickness value of the inorganic film layer in the first non-display area is a first value, and the total thickness value of the inorganic film layer in the display area is a second value, and the first value is less than the second value.

[0065] The display panel provided in the embodiment of the present application sets the total thickness of the inorganic film layer in the first non-display area to be smaller than the total thickness of the inorganic film layer in the second non-display area, thereby reducing the thickness of the inorganic film layer at the cutting boundary of the display panel and reducing the distance between the organic film layers of adjacent layers in the first non-display area, so that the bonding force between the organic film layers in the area near the cutting line is enhanced, thereby avoiding the phenomenon of adjacent organic film layers peeling off from each other in the event of collision and falling, thereby reducing the damage of the display panel during falling, improving the reliability of the display panel, and extending the service life of the display panel.

[0066] Figure 1 A schematic structural diagram of a display panel provided in an embodiment of the present application, Figure 2 A schematic partial diagram of a display panel provided in an embodiment of the present application. For example, Figures 1 to 2As shown, the substrate layer 100 includes a display area 700 and a non-display area 800, and the non-display area 800 is a frame of the display panel. The non-display area 800 surrounds the display area 700. The display panel also includes a binding area 900 and a flexible circuit board 910, and the flexible circuit board is connected to the non-display area 800. The non-display area 800 includes a first non-display area 110 and a second non-display area 120, and the second non-display area 120 is arranged between the first non-display area 110 and the display area 700. The substrate layer 100 includes a first organic film layer 101, a second organic film layer 103, a first inorganic film layer 102, and a second inorganic film layer 104. The first inorganic film layer 102 is arranged between the first organic film layer 101 and the second organic film layer 103, and the second inorganic film layer 104 is arranged on the side of the second organic film layer 103 away from the second organic film layer 103. At least one first inorganic film layer 102 is disposed between the first organic film layer 101 and the second organic film layer 103, and at least one second inorganic film layer 104 is disposed on the side of the second organic film layer 103 away from the substrate layer 100. The substrate layer 100 includes a first non-display area 110 and a second non-display area 120, and the second non-display area 120 is disposed between the first non-display area 110 and the display area. A virtual cutting line 105 is disposed in the first non-display area 110, and the virtual cutting line 105 serves as a cutting boundary of the display panel frame structure. By etching the first inorganic film layer 102 in the first non-display area 110, the total thickness of at least one inorganic film layer in the first non-display area 110 is less than the total thickness of at least one inorganic film layer in the display area. By reducing the thickness of the inorganic film layer in the area where the virtual cutting line is located, reducing the gap between the organic film layers, and enhancing the bonding force between the organic film layers at the cutting boundary, the phenomenon of adjacent organic film layers peeling off from each other in the event of collision and falling can be avoided, thereby reducing the damage to the display panel during falling, improving the reliability of the display panel, and extending the service life of the display panel.

[0067] It should be noted that the organic film layer and the inorganic film layer in the non-display area can be arranged in the same layer as the film layer in the display area, and the organic film layer and the inorganic film layer can be used as an insulating layer, isolation layer or flat layer in the display area.

[0068] It should be noted that the border area of ​​the display panel includes multiple inorganic film layers and multiple organic film layers. The organic film layers can be flexible substrate materials such as polyimide, and the inorganic film layers can be silicon dioxide, silicon nitride, etc., to avoid the phenomenon of adjacent organic film layers peeling off from each other in the event of collision and falling, thereby reducing the damage to the display panel during falling, improving the reliability of the display panel, and extending the service life of the display panel.

[0069] The display panel provided by the embodiment of the present application is provided with at least one inorganic film layer between at least two organic film layers, and the thickness of the inorganic film layer in the first non-display area is less than the thickness of the inorganic film layer in the second non-display area. By providing the virtual cutting line in the first non-display area, the thickness of the inorganic film layer in the area where the virtual cutting line is located is reduced, and the gap between the organic film layers is reduced, so that the bonding force between the organic film layers at the cutting boundary is enhanced. It can prevent the film layer of the display panel from falling off in the event of collision and falling, improve the anti-fall and anti-collision performance of the display panel, and extend the service life of the display panel.

[0070] In some embodiments, the orthographic projection of at least one inorganic film layer on the substrate layer does not overlap with the first non-display area. Exemplarily, the substrate layer includes at least two inorganic film layers and two organic film layers. The at least one inorganic film layer can be etched so that the orthographic projection of the at least one inorganic film layer on the substrate layer does not overlap with the first non-display area. By removing the at least one inorganic film layer in the first non-display area, the inorganic film layer can be removed between the at least two organic film layers, that is, the at least two organic film layers are directly connected, thereby enhancing the bonding force between the organic film layers at the cutting boundary and reducing the peeling problem of the organic film layer caused by the isolation effect of the inorganic film layer.

[0071] Figure 3 A schematic partial diagram of another display panel provided in an embodiment of the present application; Figure 4 A schematic partial diagram of another display panel provided in an embodiment of the present application. Figures 2 to 4 As shown, the substrate layer 100 includes a first organic film layer 101, a second organic film layer 103, a first inorganic film layer 102, and a second inorganic film layer 104 which are stacked. Figure 2 , the second inorganic film layer 104 in the first non-display area 110 is etched to remove the second inorganic film layer 104 in the first non-display area 110, and the first organic film layer 101, the second organic film layer 103 and the first inorganic film layer 102 are stacked in the first non-display area 110, thereby reducing the total thickness of the inorganic film layer in the first non-display area.

[0072] Exemplary, reference Figure 3 The first inorganic film layer 102 in the first non-display area 110 is etched to remove the first inorganic film layer 102 in the first non-display area 110, and the first organic film layer 101, the second organic film layer 103 and the second inorganic film layer 104 are stacked in the first non-display area 110 to reduce the total thickness of the inorganic film layer in the first non-display area 110.

[0073] Exemplary, reference Figure 4The first inorganic film layer 102 and the second inorganic film layer 104 are etched respectively to retain the stack of the first organic film layer 101 and the second organic film layer 103 in the first non-display area 110, and no inorganic film layer is set in the first non-display area.

[0074] The embodiment of the present application etches at least one of the two inorganic film layers to remove the inorganic film layer sandwiched between the organic film layers, and reduces the thickness of the inorganic film layer in the area where the virtual cutting line is located, thereby enhancing the bonding force between the organic film layers at the cutting boundary, thereby avoiding the phenomenon of adjacent organic film layers peeling off from each other in the event of collision and falling, thereby reducing the damage to the display panel during falling, improving the reliability of the display panel, and extending the service life of the display panel.

[0075] Figure 5 A schematic partial diagram of another display panel provided in an embodiment of the present application, Figure 6 A schematic partial diagram of another display panel provided in an embodiment of the present application. For example, Figures 5 to 6 As shown, the substrate layer 100 includes a first inorganic film layer 102 and a second inorganic film layer 104 .

[0076] Exemplary, reference Figure 5 , the thickness of the first inorganic film layer 102 in the first non-display area 110 is less than the thickness of the first inorganic film layer 102 in the second non-display area.

[0077] Exemplary, reference Figure 6 , the thickness of the second inorganic film layer 104 in the first non-display area 110 is less than the thickness of the second inorganic film layer 104 in the second non-display area 120 .

[0078] The embodiment of the present application reduces the thickness of at least one inorganic film layer in the first non-display area. The thinning process may be performed on at least one inorganic film layer, or all inorganic film layers. The thinning process reduces the thickness of the inorganic film layer between the organic film layers, thereby reducing the gap between the organic film layers, reducing the cutting stress between the organic film layers and the inorganic film layers, and enhancing the bonding force between the organic film layers. By thinning the inorganic film layer, the bonding ability between the organic film layers can be achieved, and the problem of over-etching during the film layer removal process can be avoided.

[0079] In some embodiments, the orthographic projection boundary of the inorganic film layer on the substrate layer is close to the display area relative to the virtual cutting line. In some examples, the substrate layer includes at least two organic film layers and at least two inorganic film layers. By adjusting the boundary position of the inorganic film layer, the orthographic projection boundary of the inorganic film layer on the substrate layer is made close to the display area relative to the virtual cutting line. The orthographic projection boundary of the inorganic film layer on the substrate layer can be set in the first non-display area or in the second non-display area. By adjusting the orthographic projection boundary of the inorganic film layer on the substrate layer, it is possible to adapt to the requirements of the bonding force between different organic film layers and improve the drop resistance and collision resistance of the display panel.

[0080] Exemplarily, the distance between the orthographic projection boundary of the inorganic film layer on the substrate layer and the virtual cutting line ranges from 30 to 40um. When the distance between the orthographic projection boundary of the inorganic film layer on the substrate layer and the virtual cutting line ranges from 30um, the orthographic projection boundary of the inorganic film layer on the substrate layer falls in the first non-display area. When the distance between the orthographic projection boundary of the inorganic film layer on the substrate layer and the virtual cutting line ranges from 40um, the orthographic projection boundary of the inorganic film layer on the substrate layer falls in the second non-display area. When the distance between the orthographic projection boundary of the inorganic film layer on the substrate layer and the virtual cutting line ranges from 35um, the orthographic projection boundary of the inorganic film layer on the substrate layer falls at the junction of the first non-display area and the second non-display area. By adjusting the orthographic projection boundary of the inorganic film layer on the substrate layer, it is possible to adapt to the requirements of the bonding force between different organic film layers and improve the drop and collision resistance of the display panel.

[0081] For example, Figures 2 to 4 As shown, the substrate layer includes a first inorganic film layer 102 and a second inorganic film layer 104, and the substrate layer 100 is provided with a first non-display area 110 and a second non-display area 120. The thickness of the first inorganic film layer 102 in a direction perpendicular to the substrate layer 100 is greater than the thickness of the second inorganic film layer 104 in a direction perpendicular to the substrate layer 100. The orthographic projection boundary of the first inorganic film layer 102 on the substrate layer 100 is a first boundary 106, and the orthographic projection boundary of the second inorganic film layer 104 on the substrate layer 100 is a second boundary 107.

[0082] Exemplary, reference Figure 2 , the first boundary 106 falls within the first non-display area 110 , and the second boundary 107 falls within the second non-display area 120 .

[0083] Exemplary, reference Figure 3 , the first boundary 106 falls within the second non-display area 120 , and the second boundary 107 falls within the first non-display area 110 .

[0084] Exemplary, reference Figure 4, the first boundary 106 and the second boundary 107 fall within the second non-display area 120 at the same time.

[0085] In some examples, the first boundary 106 and the second boundary 107 may also fall within the first non-display area at the same time. By adjusting the positions of the first boundary 106 and the second boundary 107 on the substrate layer 100, and then adjusting the distance between the virtual cutting line 105 and the first boundary 106 and the second boundary 107, the display panel can adapt to different processing errors during the preparation process, adapt to the requirements of the bonding force between different organic film layers, and reduce the processing difficulty of the display panel. At the same time. By adjusting the positions of the first boundary and the second boundary on the substrate layer, the total thickness of the inorganic film layer in the first non-display area is reduced, the bonding force between the organic film layers at the cutting boundary is enhanced, and the anti-drop and anti-collision performance of the display panel is improved.

[0086] In some embodiments, at least two organic film layers in the first non-display area 110 are connected, and at least three organic film layers in the first non-display area 110 may be connected. By removing the inorganic film layer in the first non-display area 110, the multiple organic film layers in the first non-display area 110 are connected. At least two organic film layers of the same material cover the virtual cutting line 105, and the virtual cutting line 105 serves as the cutting boundary of the display panel. The organic film layers of the same material have a strong bonding force, which can prevent the film layers from falling off during the cutting process of the display panel, and can also prevent the film layers from falling off when the display panel is collided or dropped, thereby improving the anti-fall performance of the display panel and extending the service life of the display panel.

[0087] Figure 7 A schematic structural diagram of another display panel provided in an embodiment of the present application. Figure 7As shown, the display panel further includes a third organic film layer 500, an encapsulation layer 300, a driving layer 200 and a light-emitting device layer. The third organic film layer 500 is arranged on the side of the first inorganic film layer 104 of the substrate layer away from the substrate layer. The third organic film layer 500 covers the first non-display area 110, the second non-display area 120 and the display area. The third organic film layer 500 is connected to the second organic film layer 103 in the first non-display area 110, and the third organic film layer 500 is connected to the encapsulation layer 300 in the second non-display area 120. The third organic film layer 500 can be formed by an inkjet printing process. The encapsulation layer 300 is arranged between the third organic film layer and the substrate layer, and the orthographic projection of the encapsulation layer 300 on the substrate layer 100 does not overlap with the first non-display area 110. The driving layer 200 is arranged between the substrate layer 100 and the encapsulation layer 300, and the driving layer 200 covers at least part of the second non-display area 120 and the display area. The light emitting device layer is disposed between the driving layer 200 and the encapsulation layer 300, the light emitting device layer is electrically connected to the pixel circuit of the driving layer 200, and the light emitting device layer covers the display area. The display area includes the third organic film layer, the encapsulation layer, the driving layer and the light emitting device layer. The third organic film layer can be provided to protect the film layer of the display panel from external damage and to provide a flat effect.

[0088] Figure 8 A schematic structural diagram of another display panel provided in an embodiment of the present application. Figure 8 As shown, the display panel also includes a fourth organic film layer 400, which is disposed between the third organic film layer 500 and the encapsulation layer 300. The orthographic projection boundary of the fourth organic film layer 400 on the substrate layer is the third boundary 108, which coincides with the boundary of the first non-display area 110, and the third boundary 108 connects the first non-display area 110 and the second non-display area 120. The third boundary 108 can be used as the boundary line between the first non-display area 110 and the second non-display area 120. The virtual cutting line 105 is disposed in the first non-display area 110, and the distance between the third boundary 108 and the virtual cutting line 105 is 30 to 40 um. The virtual cutting line 105 does not overlap with the second non-display area 120, and the virtual cutting line 105 is not disposed in the second non-display area 120, so as to avoid damaging the film layer structure connecting the second non-display area and the display area during the display panel cutting process.

[0089] Fig. 9 A schematic structural diagram of another display panel provided in an embodiment of the present application. Fig. 9As shown, in some embodiments, the display panel further includes a blocking column 600, and the blocking column 600 is disposed in the second non-display area 120. The driving layer 200 further includes a source-drain electrode 210 and an insulating layer, etc. The insulating layer may include a gate insulating layer 220, an inter-insulating layer and a buffer layer, and the insulating layer may include a stacked structure of silicon nitride and silicon oxide. The gate insulating layer 220 may be disposed between two gate metal layers, and the gate insulating layer 220 may also be disposed between the gate and the semiconductor layer, the inter-insulating layer may be disposed between the semiconductor layer and the source-drain electrode, and the buffer layer may be disposed between the gate and the substrate layer. The encapsulation layer 300 includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer, and the first inorganic encapsulation layer and the second inorganic encapsulation layer both cover the blocking column 600, and the side of the blocking column 600 close to the display area is connected to the inorganic encapsulation layer, and the blocking column 600 is used to block the organic encapsulation layer, and the organic encapsulation layer may be prepared by an inkjet printing process. The orthographic projection of the blocking column 600 on the substrate layer overlaps with the orthographic projection of the inorganic film layer on the substrate layer 100. On the one hand, the blocking column can prevent the organic encapsulation layer from flowing into the first non-display area to avoid affecting the cutting of the display panel frame, and on the other hand, it can block the connection between the first non-display area and the area to avoid screen breaks on the display panel.

[0090] For example, Figures 1 to 9 As shown, the orthographic boundary of the gate insulation layer 220 on the substrate layer is the fourth boundary 109, the orthographic boundary of the encapsulation layer 300 on the substrate layer is the fifth boundary 111, and the orthographic boundary of the third inorganic film layer 310 on the substrate layer is the sixth boundary 112. The first boundary 106, the second boundary 107, the third boundary 108, the fourth boundary 109, the fifth boundary 111 and the sixth boundary 112 in the non-display area do not overlap, so as to increase the processing feasibility error between the film layers and reduce the processing difficulty of the display panel.

[0091] For example, Fig. 9As shown, the display panel also includes a third inorganic film layer 310, which is disposed between the encapsulation layer 300 and the fourth organic film layer 400, and the third inorganic film layer 310 is disposed in the second non-display area 120. The third inorganic film layer can increase the hardness of the display panel, and the arrangement of the third organic film layer can protect the film layer of the display panel from external damage and flattening, etc. In some embodiments, the substrate layer includes a first inorganic film layer and a second inorganic film layer. The first inorganic film layer in the first non-display area can be thinned so that the thickness of the first inorganic film layer in the first non-display area is less than the thickness of the first inorganic film layer in the second non-display area. The thickness of the second inorganic film layer in the first non-display area can also be less than the thickness of the second inorganic film layer in the second non-display area. The thinning treatment of the inorganic film layer in the first display area can be to thin only the first inorganic film layer, while the second inorganic film layer is not thinned; only the second inorganic film layer can be thinned while the first inorganic film layer is not thinned; or both the first inorganic film layer and the second inorganic film layer can be thinned at the same time, which can be suitable for cutting requirements of different panel cutting boundaries. At the same time, by thinning the inorganic film layer in the substrate layer, the total thickness of the inorganic film layer in the first non-display area is less than the total thickness of the inorganic film layer in the second non-display area, which can avoid the inorganic film layer from being removed during the processing, damaging other film layers arranged adjacent to the inorganic film layer, and avoiding the problem of weak bonding between the first inorganic film layer and the second inorganic film layer due to different materials. The performance of the display panel is greatly improved and the service life of the display panel is extended.

[0092] A second aspect of the embodiments of the present application provides a method for preparing a display panel, which is applied to the display panel of the first aspect. Fig.10 A schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application. Fig.10 As shown, the method for preparing the display panel includes:

[0093] S100: at least two organic film layers and at least two inorganic film layers are respectively arranged to obtain a substrate layer, wherein the substrate layer includes a display area and a non-display area, the non-display area surrounds the display area, the non-display area includes a first non-display area and a second non-display area, the second non-display area is arranged between the first non-display area and the display area, the first non-display area includes a virtual cutting line, an inorganic film layer is arranged between the at least two organic film layers in the display area, the total thickness value of the inorganic film layer in the first non-display area is a first value, the total thickness value of the inorganic film layer in the display area is a second value, and the first value is less than the second value.

[0094] Exemplarily, the material of the first organic film layer and the second organic film layer may be polyimide, the material of the first inorganic film layer and the second inorganic film layer may be silicon dioxide, the first inorganic film layer is arranged on the surface of the first organic film layer, the second organic film layer is arranged on the side of the first inorganic film layer away from the first organic film layer, and the second inorganic film layer is arranged between the first organic film layer and the second organic film layer. The substrate layer is divided into a first non-display area and a second non-display area, and the first non-display area is used to set a virtual cutting line to form a cutting boundary of the display panel in the first non-display area. The second non-display area is used to connect with the display area. By setting the total thickness of the inorganic film layer in the first non-display area to be less than the total thickness of the inorganic film layer in the display area, the thickness of the inorganic film layer in the area where the virtual cutting line is located is reduced, the gap between the first organic film layer and the second organic film layer is reduced, the bonding ability between the first organic film layer and the second organic film layer is enhanced, and the frame structure of the display panel is stronger, avoiding the phenomenon of mutual peeling between adjacent layers of organic film layers in the event of collision and falling, thereby reducing the damage of the display panel in the fall, improving the reliability of the display panel, and extending the service life of the display panel.

[0095] S200: Cutting along a virtual cutting line to obtain a plurality of display panels.

[0096] For example, the entire display panel is cut along the virtual cutting line to obtain multiple display panels. The cutting of the multiple display panels is performed synchronously, which improves the processing efficiency of the display panels.

[0097] The embodiment of the present application reduces the thickness of the inorganic film layer in the first non-display area where the cutting line is located, reduces the gap between the organic film layers in the first non-display area, reduces the stress between the inorganic film layer and the organic film layer during the cutting process, and avoids the film layer from falling off during the cutting process of the display panel. In actual use, the gap between the organic film layers in the first non-display area is reduced, and the bonding ability between the first organic film layer and the second organic film layer is enhanced, making the frame structure of the display panel stronger, which can prevent the display panel from being easily damaged in the event of collision and falling, and extend the service life of the display panel.

[0098] In some embodiments, Fig.11 A schematic flow chart of another method for preparing a display panel provided in an embodiment of the present application. Fig.11 As shown, step S100 may include:

[0099] S101: respectively providing at least two organic film layers and at least two inorganic film layers.

[0100] For example, at least one inorganic film layer is disposed between at least two organic film layers, and at least one inorganic film layer is disposed on a side of the first inorganic film layer away from the organic film layer. An organic film layer, an inorganic film layer, an organic film layer, and an inorganic film layer are sequentially disposed at the frame position of the display panel to form a film layer stack to obtain a substrate layer.

[0101] S102: removing at least one inorganic film layer in the first non-display area.

[0102] Exemplarily, at least one inorganic film layer in the first non-display area is removed by performing a removal process on the substrate layer, so that at least two organic film layers are in direct contact with each other. An etching process can be used to remove all inorganic film layers in the first non-display area, so that the film layer structure at the location of the virtual cutting line is an organic film layer of the same material, and no inorganic film layer is set. The organic films of the same material have a strong bonding force, which can avoid the problem of poor film layer bonding force caused by setting inorganic materials between organic film layers, thereby improving the drop and collision resistance of the display panel.

[0103] In some embodiments, Fig.12 A schematic flow chart of another method for preparing a display panel provided in an embodiment of the present application. Fig.12 As shown, step S100 may include:

[0104] S103: respectively providing at least two organic film layers and at least two inorganic film layers.

[0105] S104: reducing the thickness of at least one inorganic film layer in the first non-display area.

[0106] By performing a thinning process on the substrate layer, the thickness of at least one inorganic film layer in the first non-display area is thinned. The thinning process can be performed on at least one inorganic film layer, or all inorganic film layers. The thickness of the inorganic film layer between the organic film layers is reduced by the thinning process, thereby reducing the gap between the organic film layers, reducing the cutting stress between the organic film layers and the inorganic film layers, and enhancing the bonding force between the organic film layers. By performing a thinning process on the inorganic film layer, the bonding ability between the organic film layers can be achieved, and the problem of over-etching during the film layer removal process can be avoided.

[0107] According to a third aspect of the embodiments of the present application, a display device is provided. Fig.13 Schematic diagram of a display device provided in an embodiment of the present application. Fig.13As shown, the display device 1000 includes a display panel 2000 as in the first aspect. The substrate layer is provided with at least two organic film layers and at least two inorganic film layers. The substrate layer includes a display area and a non-display area, and the non-display area surrounds the display area. The non-display area includes a first non-display area and a second non-display area, and the second non-display area is arranged between the first non-display area and the display area. The first non-display area includes a virtual cutting line, and the virtual cutting line can be used as a cutting boundary of the display panel frame structure. According to actual cutting requirements, the position of the virtual cutting line in the first non-display area can be moved. An inorganic film layer is arranged between at least two organic film layers in the display area, and at least one inorganic film layer is etched so that the total thickness of the inorganic film layer in the first non-display area is less than the total thickness of the inorganic film layer in the second non-display area. Among them, the total thickness value of the inorganic film layer in the first non-display area is a first value, and the total thickness value of the inorganic film layer in the display area is a second value, and the first value is less than the second value. By setting the total thickness of the inorganic film layer in the first non-display area to be smaller than the total thickness of the inorganic film layer in the second non-display area, the thickness of the inorganic film layer at the cutting boundary of the display panel is reduced, and the gap between the organic film layers in the first non-display area is reduced, so that the bonding force between the organic film layers at the cutting boundary is enhanced, and the phenomenon of adjacent organic film layers peeling off from each other in the event of collision and falling is avoided, thereby reducing the damage of the display panel during falling, improving the reliability of the display panel, and extending the service life of the display panel.

[0108] The display device provided in the embodiment of the present application may include a television, a computer, a smart phone, a smart wearable device, a laptop computer, a tablet computer, etc. The smart wearable device may include a smart watch, an AR (augmented reality) device, a VR (virtual reality) device, etc.

[0109] It should be noted that in the above embodiments, the description of each embodiment has its own emphasis, and for parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0110] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

[0111] Although the preferred embodiments of this specification have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of this specification.

[0112] Obviously, those skilled in the art can make various changes and modifications to this specification without departing from the spirit and scope of this specification. Thus, if these modifications and variations of this specification fall within the scope of the claims of this specification and their equivalents, this specification is also intended to include these modifications and variations.

Claims

1. A display panel, characterized in that: include: A substrate layer, the substrate layer comprising at least two organic film layers and at least two inorganic film layers stacked; The substrate layer includes a display area and a non-display area, and the non-display area surrounds the display area; The non-display area includes a first non-display area and a second non-display area, the second non-display area is arranged between the first non-display area and the display area, and the first non-display area includes a virtual cutting line; The inorganic film layer is arranged between at least two organic film layers in the display area, the total thickness of the inorganic film layers in the first non-display area is a first value, and the total thickness of the inorganic film layers in the display area is a second value, and the first value is smaller than the second value.

2. The display panel according to claim 1, characterized in that: An orthographic projection of at least one of the inorganic film layers on the substrate layer does not overlap with the first non-display area.

3. The display panel according to claim 2, characterized in that: The substrate layer includes a first inorganic film layer and a second inorganic film layer; The orthographic projection of the first inorganic film layer on the substrate layer does not overlap with the first non-display area; and / or, The orthographic projection of the second inorganic film layer on the substrate layer does not overlap with the first non-display area.

4. The display panel according to claim 1, characterized in that: The orthographic projection boundary of the inorganic film layer on the substrate layer is close to the display area relative to the virtual cutting line.

5. The display panel according to claim 1, characterized in that: The substrate layer includes a first inorganic film layer and a second inorganic film layer; The thickness of the first inorganic film layer is greater than the thickness of the second inorganic film layer; The orthographic projection boundary of the first inorganic film layer on the substrate is a first boundary, and the first boundary falls within the second non-display area; and / or The orthographic projection boundary of the second inorganic film layer on the substrate is a second boundary, and the second boundary falls within the first non-display area.

6. The display panel according to claim 1, characterized in that: Also includes: a third organic film layer, the third organic film layer being disposed on a side of the substrate layer away from the substrate layer, wherein the third organic film layer covers the first non-display area, the second non-display area and the display area; an encapsulation layer, wherein the encapsulation layer is disposed between the third organic film layer and the substrate layer, and an orthographic projection of the encapsulation layer on the substrate layer does not overlap with the first non-display area; a driving layer, wherein the driving layer is disposed between the substrate layer and the encapsulation layer, and the driving layer covers at least a portion of the second non-display area and the display area; A light emitting device layer is provided between the driving layer and the encapsulation layer, the light emitting device layer is electrically connected to the pixel circuit of the driving layer, and the light emitting device layer covers the display area.

7. The display panel according to claim 1, characterized in that: Also includes: a fourth organic film layer, wherein the fourth film layer is disposed between the third organic film layer and the encapsulation layer, the orthographic projection boundary of the fourth organic film layer on the substrate layer is a third boundary, and the third boundary coincides with a boundary of the first non-display area; a blocking column, wherein the blocking column is disposed in the second non-display area; The encapsulation layer comprises a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer, the first inorganic encapsulation layer and the second inorganic encapsulation layer both cover the barrier column, and a side of the barrier column close to the display area is connected to the inorganic encapsulation layer; The orthographic projection of the blocking pillar on the substrate layer overlaps with the orthographic projection of the inorganic film layer on the substrate layer.

8. A method for preparing a display panel, characterized in that: A display panel according to any one of claims 1 to 7, wherein the method for preparing the display panel comprises: At least two organic film layers and at least two inorganic film layers are respectively provided to obtain a substrate layer, wherein: The substrate layer comprises a display area and a non-display area, the non-display area surrounds the display area, the non-display area comprises a first non-display area and a second non-display area, the second non-display area is arranged between the first non-display area and the display area, the first non-display area comprises a virtual cutting line, the inorganic film layer is arranged between at least two layers of the organic film layers in the display area, the total thickness value of the inorganic film layer in the first non-display area is a first value, the total thickness value of the inorganic film layer in the display area is a second value, and the first value is less than the second value; Cutting is performed along the virtual cutting line to obtain a plurality of display panels.

9. The method for preparing a display panel according to claim 8, characterized in that: The at least two organic film layers and at least two inorganic film layers are provided respectively, comprising: At least two organic film layers and at least two inorganic film layers are respectively provided; removing at least one layer of the inorganic film layer in the first non-display area; or, At least two organic film layers and at least two inorganic film layers are respectively provided; The thickness of at least one inorganic film layer in the first non-display area is reduced.

10. A display device, characterized in that: include: A display panel as claimed in any one of claims 1 to 7.

Images