Injection molding cooling device for mold processing

Abstract

The invention relates to an injection molding cooling device for mold processing, and belongs to the technical field of mold cooling. The injection molding cooling device for mold processing comprises a box body, and an injection pipe and a return pipe which are arranged on the outer side of the box body, a cooling water source is guided into a mold cooling cavity in a step-by-step cooling mode, the butt joint positions of the water sources with different temperatures can be mixed in advance, the temperature difference of the butt joint positions of the water sources is reduced, the phenomenon of excessive temperature difference between the water sources is reduced, meanwhile, gas is guided in advance in a spiral flow mode, and it is guaranteed that after precooling of the inner wall of the cooling cavity is completed, the cooling efficiency is improved. Then a cooling water source is guided in in a spiral flow mode, the laminar flow phenomenon is reduced, the attaching effect of the cooling water source and the inner wall of the cooling cavity is guaranteed, and therefore cooling uniformity is guaranteed, meanwhile, after the mold is demolded every time, hot air can be adopted for conducting temperature returning and preheating on the cooling cavity, residual heat in the mold is matched, and the temperature difference phenomenon in the mold is reduced; and the injection molding effect of the next product can be conveniently ensured.

Description

Technical Field

[0001] The invention relates to the technical field of mold cooling, in particular to an injection molding cooling device for mold processing. Background Art

[0002] Injection molds are necessary equipment in the injection molding production process. Products are produced by injecting and molding the molten rubber. In order to help the product demould quickly, a cooling device is needed to assist the operation.

[0003] After searching the prior art, it is found that "a cooling device for injection molds" has a publication number of "CN116787718A". By installing multiple water tanks inside a shell, and adjusting the water temperature in the multiple water tanks to a step-by-step distribution state, the straight pipe and the arc pipe in the water supply switching component and the return water switching component are matched, and the straight pipe is connected with the arc pipe by rotation. The water channel in the injection mold can be injected with gradually reduced circulating water. By gradually reducing the temperature of the cooling water, the temperature in the injection mold can be steadily and orderly reduced. However, this method has the following defects in actual use: although the cooling water source is introduced in a gradual cooling method, the introduction method is ordinary, and the cooling water Laminar flow is prone to occur during the introduction process, resulting in poor adhesion between the cooling water source and the inner wall of the cooling cavity, which in turn leads to uneven cooling of the mold area and affects the product effect. In addition, when the water sources at different temperatures are connected and introduced, there is a large temperature difference at the water source connection point, which can easily cause cooling differences in multiple areas when introduced into the mold cooling cavity. If the number of water tanks is increased in the above manner to weaken the temperature difference between the water sources in various locations, there will be problems of increased equipment costs and increased occupied area. At the same time, after each cooling operation is completed, there is no temperature recovery function. When the next product is injected and molded, there is a large temperature difference between the mold cooling cavity and the inside of the mold, which can easily affect the product molding effect. Summary of the invention

[0004] Based on this, it is necessary to provide an injection molding cooling device for mold processing to address the problems of poor adhesion between the cooling water source and the inner wall of the cooling cavity and the inability to reheat the inside of the cooling cavity.

[0005] An injection molding cooling device for mold processing, comprising a box body and an injection pipe and a return pipe arranged on the outside of the box body; an adjusting mechanism, wherein the adjusting mechanism is arranged inside the injection pipe; wherein the adjusting mechanism comprises a rotatable adjusting disk, wherein a group of through holes are opened inside the adjusting disk, and a group of arc guide grooves are arranged on one side of the adjusting disk; a temperature control mechanism, wherein the temperature control mechanism is arranged inside the box body; wherein the temperature control mechanism comprises an inclined plate and a group of partitions installed on the inclined plate, wherein the side edges of the partitions are fixedly connected to the inside of the box body, and a group of metal guide plates arranged alternately with the partitions are arranged on the inclined plate.

[0006] In one embodiment, a group of diverter grooves are arranged inside the adjusting disk, the inner openings of the diverter grooves are connected to the through holes, the outer openings of the diverter grooves are located on the sides of the adjusting disk, and the inner diameter of the through holes decreases from left to right.

[0007] In one of the embodiments, a conical surface is provided on one side of the adjusting disk close to the fixing ring, and the diverter groove is inclined and has the same inclination as the conical surface.

[0008] In one embodiment, the adjustment mechanism further includes a fixing ring, a T-shaped rod is installed inside the fixing ring, and one end of the T-shaped rod passes through and is rotatably connected to the outer side of the adjustment disk.

[0009] In one embodiment, two water-gas dual-purpose pumps are installed on one side of the box body, the input end of the water-gas dual-purpose pump at the top is fixedly connected to one end of the return pipe, and the output end of the water-gas dual-purpose pump at the bottom is fixedly connected to one end of the injection pipe. A horizontal pipe is provided at the output end of the water-gas dual-purpose pump at the top, and a main pipe is provided at the input end of the water-gas dual-purpose pump at the bottom.

[0010] In one of the embodiments, a group of branch pipes passing through the inclined plate are arranged on the outside of the main pipe, and the branch pipes are staggered with the partitions. A horizontal plate located above the partition is installed inside the box body, and a group of guide holes are arranged inside the horizontal plate. A group of metal rods passing through and extending to the bottom of the guide holes are installed on the inner top wall of the box body, and the metal rods are staggered with the partitions.

[0011] In one embodiment, the temperature control mechanism further comprises a semiconductor refrigerator mounted on the bottom wall of the box body, the semiconductor refrigerator is connected to the metal guide plate via a wire, and a heat dissipation port is provided on one side of the box body.

[0012] In the above-mentioned injection molding cooling device for mold processing, during the discharge process, part of the water source will contact the side of the adjustment disk. At this time, the arc-shaped guide groove will be affected by the impact of the water source, driving the adjustment disk to rotate, so that the contacted water source is discharged along the outer side of the adjustment disk in the form of a spiral flow, reducing the occurrence of laminar flow. An inclined diverter groove is used to discharge part of the water source in the through hole along the diverter groove. During the process of the water source being discharged in a spiral flow manner, gas and liquid can be supplemented on the inner side of the spiral flow to ensure the stability of the flow field structure of the outer spiral flow, extend the spiral flow discharge length, and ensure the fit effect between the gas and liquid and the inner wall of the cooling chamber, thereby ensuring rapid cooling and uniform cooling effect;

[0013] During the water source guiding process, the water source is affected by the change in flow direction of the regulating disk, so that the water sources with different temperatures can achieve a simple mixing effect at the joint, thereby weakening the temperature difference between the water sources with different temperatures. In combination with the setting of through holes, arc guide grooves and diversion grooves, the water source guiding path is increased, making the gradual cooling method smoother and reducing the occurrence of uneven cooling conduction due to excessive temperature difference;

[0014] The heat energy generated by the semiconductor refrigerator is used to heat the gas. After the product is demoulded, it is then introduced into the mold cooling cavity in a spiral flow to reheat the inside of the cooling cavity and reduce the temperature difference between the inside of the cooling cavity and the inner wall of the mold, so that the product molding is more stable after the next injection of the rubber compound. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction is given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1 It is a structural schematic diagram of the present invention;

[0017] Figure 2 It is a cross-sectional schematic diagram of the box body and the inclined plate structure of the present invention;

[0018] Figure 3 The structure of the present invention Figure 2 A is an enlarged schematic diagram;

[0019] Figure 4 It is a schematic cross-sectional view of the T-shaped rod and the adjusting disk structure of the present invention;

[0020] Figure 5 It is a schematic diagram of the structure of the adjustment disk and the arc guide groove of the present invention;

[0021] Figure 6 It is a schematic diagram of the structure of the horizontal plate and the metal rod of the present invention;

[0022] Figure 7 It is a schematic diagram of the connecting pipe and folded pipe structure of the present invention.

[0023] Reference numerals:

[0024] 100, box body; 110, water-gas dual-purpose pump; 120, horizontal plate; 130, guide hole; 140, metal rod; 150, folded pipe; 160, air pump; 170, connecting pipe; 200, injection pipe; 300, reflux pipe; 310, shunt pipe; 311, discharge hole; 320, exhaust pipe; 400, adjustment mechanism; 410, adjustment plate; 411, shunt groove; 420, through hole; 430, arc guide groove; 440, fixing ring; 450, T-bar; 500, temperature control mechanism; 510, inclined plate; 520, partition; 530, metal guide plate; 540, semiconductor refrigerator; 600, horizontal pipe; 700, main pipe; 710, branch pipe; 800, solenoid valve. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of the present invention are for illustrative purposes only and do not represent the only implementation method.

[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0028] In the present invention, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, a first feature being “above”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0029] Unless otherwise defined, all technical and scientific terms used in the specification of the present invention have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in the specification of the present invention includes any and all combinations of one or more related listed items.

[0030] Combine the following Figure 1-Figure 7 The injection molding cooling device for mold processing of the present invention is described.

[0031] like Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, in one embodiment, an injection molding cooling device for mold processing includes: a box body 100 and an injection pipe 200 and a return pipe 300 arranged on the outside thereof; an adjusting mechanism 400, the adjusting mechanism 400 is arranged inside the injection pipe 200; wherein the adjusting mechanism 400 includes a rotatable adjusting disk 410, a group of through holes 420 are opened inside the adjusting disk 410, and a group of arc guide grooves 430 are arranged on one side of the adjusting disk 410; a temperature control mechanism 500, the temperature control mechanism 500 is arranged inside the box body 100; wherein the temperature control mechanism 500 includes an inclined plate 510 and a group of partitions 520 installed on the inclined plate 510, the side of the partition 520 is fixedly connected to the inside of the box body 100, and a group of metal guide plates 530 arranged alternately with the partitions 520 are arranged on the inclined plate 510.

[0032] A group of diverter grooves 411 are arranged inside the adjusting disk 410, the inner opening of the diverter groove 411 is connected to the through hole 420, the outer opening of the diverter groove 411 is located on the side of the adjusting disk 410, and the inner diameter of the through hole 420 decreases from left to right; a conical surface is arranged on the side of the adjusting disk 410 close to the fixing ring 440, and the diverter groove 411 is inclined and has the same inclination as the conical surface; solenoid valves 800 are installed on the outside of the exhaust pipe 320, the diverter pipe 310, the branch pipe 710 and the folded pipe 150.

[0033] The cooling water source is introduced into the box 100 and placed on the inclined plate 510, and the water source is separated and stored by using the partition 520. When the internal cooling water source is introduced into the injection mold, the water sources with different temperatures between the partitions 520 can be led out along the injection pipe 200 into the mold cooling cavity;

[0034] During the export process, part of the water source is discharged along the through hole 420. Since the inner diameter of the through hole 420 decreases from left to right, the water source flow rate can be increased, and the laminar flow phenomenon when encountering a cooling cavity with a large inner diameter can be reduced. Subsequently, part of the water source will contact the side of the adjusting disk 410. At this time, the arc guide groove 430 will be affected by the impact of the water source, driving the adjusting disk 410 to rotate, so that the contacted water source is exported along the outer side of the adjusting disk 410 in the form of a spiral flow. The conical adjusting disk 410 is set to reduce the resistance during the flow of the water source. The inclined diverter groove 411 is used to make part of the water source in the through hole 420 discharged along the diverter groove 411. During the process of the water source being discharged in a spiral flow manner, gas and liquid can be supplemented on the inner side of the spiral flow to ensure that the flow field structure of the outer spiral flow is stable, extend the spiral flow discharge length, and ensure the fit between the gas and liquid and the inner wall of the cooling cavity.

[0035] In addition, during the process of introducing water sources at different temperatures, the regulating disk 410 is used to make pre-contact with the export water source. Therefore, when the water sources at different temperatures are connected, the water source is affected by the change in flow direction of the regulating disk 410. In combination with the arrangement of the through hole 420, the arc guide groove 430 and the diverter groove 411, the water source export path is increased, so that a simple mixing effect can be achieved at the connection point of the water sources at different temperatures, thereby weakening the temperature difference between the connection points of the water sources at different temperatures, making the gradual cooling method smoother, and reducing the occurrence of uneven cooling conduction caused by excessive temperature difference.

[0036] The used cooling water in the cooling chamber will then move along the return pipe 300 to the interior of the housing 100, completing the water recycling process.

[0037] like Figure 3 and Figure 4 As shown, the adjustment mechanism 400 further includes a fixing ring 440 , a T-shaped rod 450 is installed inside the fixing ring 440 , and one end of the T-shaped rod 450 passes through and is rotatably connected to the outer side of the adjustment disk 410 .

[0038] The adjustment disk 410 is supported by a T-shaped rod 450 in the fixing ring 440 .

[0039] like Figure 2 and Figure 6As shown, two water-gas dual-purpose pumps 110 are installed on one side of the box body 100, the input end of the top water-gas dual-purpose pump 110 is fixedly connected to one end of the return pipe 300, the output end of the bottom water-gas dual-purpose pump 110 is fixedly connected to one end of the injection pipe 200, a horizontal pipe 600 is provided at the output end of the top water-gas dual-purpose pump 110, and a main pipe 700 is provided at the input end of the bottom water-gas dual-purpose pump 110; a group of branch pipes 710 passing through the inclined plate 510 are provided on the outside of the main pipe 700, and the branch pipes 710 and the partition 520 are arranged alternately, a horizontal plate 120 located above the partition 520 is installed inside the box body 100, a group of guide holes 130 are provided inside the horizontal plate 120, and a group of metal rods 140 passing through and extending to the bottom of the guide holes 130 are installed on the inner top wall of the box body 100, and the metal rods 140 and the partition 520 are arranged alternately.

[0040] The bottom water-gas dual-purpose pump 110 is used in combination with the main pipe 700 and the branch pipe 710 to pressurize the water source in the box body 100. The water vapor in the mold cooling cavity is pressurized and extracted by the bottom water-gas dual-purpose pump 110, so that the water source flows back to the cross plate 120. Since the water source temperature between each partition 520 is different, the temperature of each metal rod 140 in contact with the water source is also different. In the process of the water source flowing back from the guide hole 130 along the metal rod 140 to each partition 520, the metal rods 140 with different temperatures will change the temperature of the returned water source in the cooling cavity, thereby reducing the excessive temperature difference between the returned water source and the water source stored in the original box body 100, which is convenient for rapid circulation.

[0041] like Figure 1 and Figure 2 As shown, the temperature control mechanism 500 also includes a semiconductor cooler 540 installed on the inner bottom wall of the box body 100. The semiconductor cooler 540 is connected to the metal guide plate 530 through a wire. A heat dissipation port is opened on one side of the box body 100 to help the semiconductor cooler 540 to quickly dissipate heat.

[0042] By using a semiconductor cooler 540 in combination with a metal guide plate 530, the water source temperature in each partition 520 can be reduced. Due to the setting of the inclined plate 510, the amount of water between each partition 520 is different. Under the influence of the metal guide plate 530 with the same cooling efficiency, the water source in the top area of ​​the inclined plate 510 is less, so the required cooling time is shorter and the water source temperature is lower. The water source in the bottom area of ​​the inclined plate 510 is more, so the required cooling time is longer and the water source temperature is relatively high, thereby forming a water source temperature difference between each partition 520, and the water sources of different temperatures can be gradually introduced through the branch pipe 710 in sequence.

[0043] like Figure 1 , Figure 2 and Figure 7As shown, an air pump 160 is installed on the top of the box body 100, and a connecting pipe 170 is installed on the output end of the air pump 160. Two folded pipes 150 connected to the connecting pipe 170 are installed on the connecting pipe 170. The connecting pipe 170 is connected to the main pipe 700 through the folded pipe 150 passing through the box body 100. The middle part of one folded pipe 150 is above the inclined plate 510, and the middle part of the remaining folded pipe 150 is below the inclined plate 510.

[0044] Before each cooling water source is introduced, the branch pipe 710 and the electromagnetic valve 800 on the folded pipe 150 located in the middle below the inclined plate 510 can be closed, and then the air pump 160 is started to introduce the external gas into the corresponding folded pipe 150. At this time, the gas is discharged along the corresponding folded pipe 150. The middle part of the folded pipe 150 is located above the inclined plate 510, so that it contacts the low-temperature water source, and the temperature of the gas inside it is reduced. Then, the bottom water-gas dual-purpose pump 110 discharges the low-temperature gas along the injection pipe 200 into the mold cooling cavity. During the discharge process, the gas will be discharged in a spiral flow manner to adhere to the inner wall of the cooling cavity, similar to the above-mentioned water source extraction, to pre-cool the cooling cavity, reduce the damage to the mold itself caused by the subsequent sudden introduction of the cooling water source, and at the same time improve the subsequent rapid cooling efficiency;

[0045] After each cooling water source is introduced, when the product inside the mold is demolded, the opening and closing states of the solenoid valves 800 on the two folded tubes 150 are swapped to exhaust the folded tube 150 whose middle part is below the inclined plate 510. The middle part of the folded tube 150 is affected by the heat dissipation of the semiconductor refrigerator 540, which can increase the temperature of the gas inside it. Then, it is introduced into the mold cooling cavity along the injection pipe 200 in the above-mentioned spiral flow manner, and the residual temperature inside the mold is combined to complete the temperature recovery operation, thereby reducing the excessive temperature difference between the inside of the cooling cavity and the inner wall of the mold, so that the product molding is more stable after the next injection of the rubber.

[0046] like Figure 1 and Figure 2 As shown, a bypass pipe 310 connected to the return pipe 300 is installed on the outside of the return pipe 300. One end of the bypass pipe 310 penetrates into the box body 100 and passes through the partition 520 in sequence. A group of discharge holes 311 are opened on the outside of the bypass pipe 310, and an exhaust pipe 320 is installed on the outside of the return pipe 300.

[0047] During the gas precooling operation, the solenoid valve 800 on the exhaust pipe 320 is closed, and the used cooling gas is introduced into the box 100 along the shunt pipe 310, so that the low-temperature gas is discharged along the discharge hole 311 in the water source. The return water source is mixed with the water source in the original box 100 by using the upward flow of the gas after being led out, so as to ensure the uniform temperature of the water source and recycle the cold source at the same time;

[0048] During the gas reheating operation, the solenoid valve 800 on the diversion pipe 310 is closed, and the solenoid valve 800 on the exhaust pipe 320 is opened, so that the hot air is introduced into the cooling chamber along the spiral flow, and the used hot air is discharged along the exhaust pipe 320.

[0049] Working principle: The semiconductor refrigerator 540 is used in combination with the metal guide plate 530 to reduce the water source temperature in each partition 520. The inclined plate 510 is used to make the water source temperature between the partitions 520 different. When cooling, the low-temperature gas is introduced into the mold cooling cavity in a spiral flow manner to pre-cool the cooling cavity, thereby reducing the damage to the mold itself caused by the sudden introduction of subsequent cooling water sources. At the same time, the subsequent rapid cooling efficiency is also improved. Subsequently, during the process of cooling water source extraction, part of the water source is discharged along the through hole 420. Since the inner diameter of the through hole 420 is reduced from left to right, the water source flow rate can be increased, reducing the laminar flow phenomenon when encountering a cooling cavity with a large inner diameter. Subsequently, part of the water source is discharged along the through hole 420. The water source will contact the side of the regulating disk 410. At this time, the arc guide groove 430 will be affected by the impact of the water source, driving the regulating disk 410 to rotate, so that the contacted water source is guided out along the outer side of the regulating disk 410 in the form of a spiral flow. The conical regulating disk 410 is set to reduce the resistance during the flow of the water source. The inclined diverter groove 411 is used to make part of the water source in the through hole 420 be discharged along the diverter groove 411. During the process of the water source being discharged in a spiral flow, gas and liquid can be supplemented inside the spiral flow to ensure the stability of the flow field structure of the outer spiral flow, extend the spiral flow discharge length, and ensure the fitting effect of gas and liquid with the inner wall of the cooling chamber. The used water source is guided back to the inside of the box 100 along the return pipe 300 for recycling.

[0050] After completing the cooling and demoulding of the product, the gas in the folded tube 150 is heated and then discharged, and introduced into the mold cooling cavity along the injection pipe 200 in the above-mentioned spiral flow manner, and combined with the residual temperature inside the mold, the temperature recovery operation is completed to reduce the excessive temperature difference between the inside of the cooling cavity and the inner wall of the mold, so that the product molding is more stable after the next injection of the rubber material.

[0051] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0052] The above-described embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. An injection molding cooling device for mold processing, characterized in that: include: A box body (100) and an injection pipe (200) and a return pipe (300) arranged outside the box body; An adjusting mechanism (400), wherein the adjusting mechanism (400) is arranged inside the injection pipe (200); The adjusting mechanism (400) comprises a rotatable adjusting disk (410), a group of through holes (420) are opened inside the adjusting disk (410), and a group of arc-shaped guide grooves (430) are arranged on one side of the adjusting disk (410); A temperature control mechanism (500), wherein the temperature control mechanism (500) is arranged inside the box (100); The temperature control mechanism (500) comprises an inclined plate (510) and a group of partitions (520) mounted on the inclined plate (510); the side of the partition (520) is fixedly connected to the interior of the box (100); and a group of metal guide plates (530) arranged in an alternating manner with the partitions (520) are arranged on the inclined plate (510).

2. The injection molding cooling device for mold processing according to claim 1, characterized in that: A group of flow channels (411) are arranged inside the regulating disk (410); the inner opening of the flow channels (411) is connected to the through hole (420); the outer opening of the flow channels (411) is located on the side of the regulating disk (410); and the inner diameter of the through hole (420) decreases from left to right.

3. The injection molding cooling device for mold processing according to claim 2, characterized in that: A conical surface is provided on one side of the adjustment disk (410) close to the fixing ring (440), and the diversion groove (411) is arranged in an inclined manner and has the same inclination as the conical surface.

4. The injection molding cooling device for mold processing according to claim 1, characterized in that: The adjustment mechanism (400) further comprises a fixing ring (440), a T-shaped rod (450) being installed inside the fixing ring (440), and one end of the T-shaped rod (450) passing through and rotatably connected to the outer side of the adjustment disk (410).

5. The injection molding cooling device for mold processing according to claim 1, characterized in that: Two water-gas dual-purpose pumps (110) are installed on one side of the box body (100); the input end of the water-gas dual-purpose pump (110) at the top is fixedly connected to one end of the return pipe (300); the output end of the water-gas dual-purpose pump (110) at the bottom is fixedly connected to one end of the injection pipe (200); the output end of the water-gas dual-purpose pump (110) at the top is provided with a horizontal pipe (600); and the input end of the water-gas dual-purpose pump (110) at the bottom is provided with a main pipe (700).

6. The injection molding cooling device for mold processing according to claim 5, characterized in that: A group of branch pipes (710) passing through the inclined plate (510) are arranged on the outside of the main pipe (700), and the branch pipes (710) are arranged in a staggered manner with the partition plate (520). A transverse plate (120) located above the partition plate (520) is installed inside the box body (100), and a group of flow guide holes (130) are arranged inside the transverse plate (120). A group of metal rods (140) passing through and extending to the bottom of the flow guide holes (130) are installed on the inner top wall of the box body (100), and the metal rods (140) are arranged in a staggered manner with the partition plate (520).

7. The injection molding cooling device for mold processing according to claim 1, characterized in that: The temperature control mechanism (500) further comprises a semiconductor refrigerator (540) mounted on the inner bottom wall of the box body (100), wherein the semiconductor refrigerator (540) is connected to the metal guide plate (530) via a wire, and a heat dissipation port is provided on one side of the box body (100).

8. The injection molding cooling device for mold processing according to claim 6, characterized in that: An air pump (160) is installed on the top of the box body (100), and a connecting pipe (170) is installed on the output end of the air pump (160). Two folded pipes (150) connected to the connecting pipe (170) are installed on the connecting pipe (170). The connecting pipe (170) is connected to the main pipe (700) through the folded pipe (150) passing through the box body (100). The middle part of one of the folded pipes (150) is located above the inclined plate (510), and the middle part of the remaining folded pipe (150) is located below the inclined plate (510).

9. The injection molding cooling device for mold processing according to claim 8, characterized in that: A shunt pipe (310) connected to the return pipe (300) is installed on the outside of the return pipe (300); one end of the shunt pipe (310) penetrates into the box body (100) and passes through the partition (520) in sequence; a group of discharge holes (311) are opened on the outside of the shunt pipe (310); and an exhaust pipe (320) is installed on the outside of the return pipe (300).

10. The injection molding cooling device for mold processing according to claim 9, characterized in that: Solenoid valves (800) are installed on the outsides of the exhaust pipe (320), the diverter pipe (310), the branch pipe (710) and the folded pipe (150).

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