Evaporation device

By using heat insulating rings and multi-layer heat insulating plate design in the evaporation device, combined with magnetic focusing components, the problem of changes in the incident angle of the electron beam is solved, and the evaporation quality and efficiency are improved.

CN119162543APending Publication Date: 2024-12-20BEIJING NORTH HUACHUANG VACUUM TECH CO LTD
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Patent Information

Application Number
CN202310729646.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-06-19
Publication Date
2024-12-20

AI Technical Summary

Technical Problem

In the vapor deposition device, the incident angle of the electron beam is prone to undergo large changes, resulting in a decrease in the gasification efficiency of the metal in the crucible.

Method used

The evaporation device design is adopted including a vacuum container, a flange, an electronic gun, a control board and a cooling device. The cooling device is a heat-insulating ring, and the side wall of the vacuum container is limited by the design composed of a heat-insulating ring and a multi-layer heat-insulating plate. Temperature changes prevent thermal deformation and increase the focus of the electron beam through the magnetic focusing assembly.

Benefits of technology

It effectively reduces the deviation of the incident angle of the electron beam, improves the evaporation quality, ensures that the electron beam can accurately reach the preset position, and improves the efficiency and uniformity of the evaporation process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses an evaporation device, and relates to the technical field of evaporation device cooling, and the evaporation device comprises a vacuum container provided with a first through hole; the flange plate is fixedly connected to the outer side wall of the vacuum container, a second through hole is formed in the flange plate, and the second through hole is communicated with the first through hole; the electronic gun is fixedly connected with the flange plate, and the output end of the electronic gun faces the second through hole; the control panel is arranged on the side, away from the flange plate, of the vacuum container and located at an orifice of the first through hole, and the control panel is used for controlling the range of the position where electrons emitted by the electron gun hit the crucible; the cooling device is arranged at the position, close to the first through hole, of the vacuum container, and the cooling device is used for reducing the temperature of the side wall of the vacuum container. According to the technical scheme, the problem that the incident angle of electrons is prone to large change can be solved.
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Description

Technical Field

[0001] The present application relates to the technical field of cooling of evaporation devices, and in particular to an evaporation device. Background Art

[0002] Reference Figure 1 In an evaporation device having an electron emission device and a crucible, the electron emission device emits an electron beam to the metal in the crucible in the evaporation device. The energy of the electron beam enables some atoms in the metal material to obtain sufficient energy, thereby vaporizing the metal in the crucible into metal vapor. The metal vapor rises onto the substrate and forms an evaporation film on the substrate.

[0003] Reference Figure 2 In actual use, although most of the electron beams emitted by the electron emission device can enter the vacuum container 1, a part of the electron beams will be scattered onto the inner surface of the chamber horizontal plate 11 of the vacuum container 1. Since the energy of the electron beams emitted by the electron emission device is relatively large, the temperature of the chamber horizontal plate 11 is relatively high, which in turn causes the chamber horizontal plate 11 to produce a large thermal deformation, which is often irreversible. The electron emission device is mounted on the flange 2, which is fixedly mounted on the chamber horizontal plate 11. The large deformation of the chamber horizontal plate 11 will cause the position of the electron emission device to shift, which in turn causes a large change in the incident angle of the electron beam, so that the electron beam cannot be aimed at the metal in the crucible, reducing the gasification efficiency of the metal in the crucible. Summary of the invention

[0004] The purpose of the present application is to provide a vapor deposition device that helps solve the problem that the incident angle of electrons is prone to large changes.

[0005] The present application provides a vapor deposition device that adopts the following technical solution, including: The vacuum container is provided with a first through hole; A flange, fixedly connected to the outer wall of the vacuum container, the flange is provided with a second through hole, and the second through hole is communicated with the first through hole; An electron gun, fixedly connected to the flange, with an output end of the electron gun facing the second through hole; A control board is arranged on a side of the vacuum container away from the flange and located at the opening of the first through hole, and the control board is used to control the position range of the electrons emitted by the electron gun hitting the crucible; The cooling device is arranged at a position of the vacuum container close to the first through hole, and is used to reduce the temperature of the side wall of the vacuum container.

[0006] The above technical solution helps to solve the problem that the incident angle of electrons is prone to large changes. When the chamber horizontal plate and the control plate at the first through hole undergo large thermal deformation due to the energy of the electrons, the electrons emitted by the electron gun will be seriously deviated from the preset position. If the cooling device is arranged at a position of the vacuum container close to the first through hole, the temperature of the control plate and the chamber horizontal plate at the first through hole can be greatly limited, so that the control plate and the chamber horizontal plate at the first through hole will not undergo large deformation, so that most of the electrons emitted by the electron gun can reach the preset position.

[0007] Optionally, the cooling device is an insulation ring, which is divided into an insulation part and a first abutment part, the insulation part abuts against the hole wall of the first through hole and the hole wall of the second through hole, the first abutment part is fixed at one end of the insulation part, and the first abutment part is connected to the side of the control board facing the output end of the electron gun.

[0008] Through the above technical solution, the effect of reducing the deviation of the incident angle of the electrons is achieved. The heat insulation ring provides heat insulation protection, which can reduce the thermal stress caused by the high energy of the electrons emitted by the electron gun on the control board and the side wall of the vacuum container, reduce the deformation of the control board and the chamber cross plate of the vacuum container, and thus enable the electrons emitted by the electron gun to reach the preset position, thereby improving the evaporation quality of the evaporation device.

[0009] Optionally, a second abutment portion is provided on the outer peripheral surface of the first abutment portion, one side of the second abutment portion abuts against a side of the control board facing the electron gun, and the other side of the second abutment portion abuts against an inner wall of the vacuum container.

[0010] Through the above-mentioned technical solution, the effect of preventing heat from being transferred from the control board to the side wall of the vacuum container is achieved. The second abutment portion is arranged on the outer peripheral surface of the first abutment portion, one side of the second abutment portion abuts against the inner side wall of the vacuum container, and the other side of the second abutment portion abuts against the control board. The second abutment portion makes the connection between the control board and the inner side wall of the vacuum container more stable, and the second abutment portion plays a role similar to a gasket, reducing the risk of loosening of the insulation ring during the evaporation process. Moreover, if there is no second abutment portion, heat will be transferred from the side wall of the incident hole of the control board to the control board, and then from the control board to the inner side wall of the vacuum container, thereby causing the inner side wall to deform due to heat, and then causing the electrons of the electron gun to be unable to reach the preset position. The second abutment portion is arranged on the outer periphery of the first abutment portion, which can effectively prevent heat from being transferred from the control board to the side wall of the vacuum container.

[0011] Optionally, the heat insulating portion, the first abutting portion and the second abutting portion are mainly composed of multiple layers of heat insulating boards.

[0012] Through the above technical solution, the effect of efficient heat insulation is achieved. The design of the multi-layer heat insulation board can effectively provide a multi-layer heat insulation effect. The heat insulation boards at different levels can form a temperature gradient, limit the transfer of heat, and greatly reduce the risk of heat conduction to the side wall of the vacuum container, thereby keeping the side wall of the vacuum container at a low temperature, so that most of the electrons emitted by the electron gun can reach the preset position.

[0013] Optionally, a vacuum layer is provided between the multiple layers of thermal insulation boards.

[0014] Through the above technical solution, the effect of reducing the use of thermal insulation materials and significantly improving the thermal insulation performance of the multi-layer thermal insulation board is achieved. Vacuum is an excellent thermal insulation medium. There is no heat conduction or convection in a vacuum. The vacuum layer between the multi-layer thermal insulation boards can effectively prevent the conduction of heat. While reducing the use of thermal insulation materials, the thermal insulation performance of the multi-layer thermal insulation board can be significantly improved.

[0015] Optionally, it also includes a magnetic focusing component, which is arranged in the inner cavity of the insulation part, and the control board is provided with an incident hole deviating from the center of the control board, and the magnetic focusing component is used to focus electrons to the incident hole.

[0016] Through the above technical solution, the effect of making the evaporation process more efficient is achieved. The magnetic focusing component can control the strength and direction of the magnetic field so that the electrons emitted by the electron gun are directly focused on the incident hole of the control board, making the electrons more concentrated, keeping the electrons with a smaller beam spot diameter and a higher focusing degree, so that more electron energy can be directly shot to the metal in the crucible, reducing energy loss, improving energy utilization, and making the evaporation process more efficient.

[0017] Optionally, the thermal insulation ring is rotatably mounted on the inner wall of the first through hole, and an extension direction of a rotation axis of the thermal insulation ring is parallel to an incident direction of the electron gun.

[0018] Through the above-mentioned technical solution, the effect of being able to flexibly adjust the incident position of electrons is achieved. When the metal in the crucible needs to be heated, the electrons enter the vacuum container through the incident hole of the control board. When the incident position of the electrons needs to be adjusted, since one end of the control board abuts against the second abutting portion of the insulation ring, the control board can be driven to rotate by simply rotating the insulation ring. Since the incident hole of the control board deviates from the center of the control board, when the control board rotates, the position where the electrons enter the crucible will also change. In this way, the control board is driven to rotate by rotating the insulation ring, and the incident position of the electrons can be flexibly adjusted.

[0019] Optionally, the thermal insulation ring and the control board are formed integrally.

[0020] The above technical solution reduces the risk of possible accessory installation errors and accessory loosening. The heat insulation ring and the control board are integrally formed. This tight combination ensures a stable connection between the heat insulation ring and the control board, preventing the heat insulation ring and the control board from moving relative to each other during the evaporation process, thereby preventing the control board from deviating from the preset position, and causing the electrons emitted by the electron gun to fail to reach the preset position. It also reduces the risk of possible accessory installation errors and accessory loosening.

[0021] Optionally, the material of the thermal insulation ring is a material with low thermal conductivity.

[0022] Through the above technical solution, the vacuum container, flange and control panel are provided with good thermal insulation protection. The low thermal conductivity material can effectively slow down the conduction of heat, thereby providing good thermal insulation protection for the vacuum container, flange and control panel, reducing the impact of heat on them, and thus enabling the electrons emitted by the electron gun to accurately reach the preset position.

[0023] In summary, the present application includes at least one of the following beneficial technical effects: 1. A first through hole is provided on the vacuum container, a flange is fixedly connected to the outer wall of the vacuum container, a second through hole is provided on the flange, the second through hole is interconnected with the first through hole, an electron gun is fixedly connected to the flange, and the output end of the electron gun faces the second through hole. A control board is arranged on the side of the vacuum container away from the flange and at the opening of the first through hole, the control board is used to control the position range of the electrons emitted by the electron gun hitting the crucible, a cooling device is arranged at a position of the vacuum container close to the first through hole, and the cooling device is used to reduce the temperature of the side wall of the vacuum container. The above technical solution helps to solve the problem that the incident angle of the electrons is prone to large changes.

[0024] 2. The cooling device is a heat-insulating ring, which is divided into a heat-insulating portion and a first abutting portion, the heat-insulating portion abuts against the hole wall of the first through hole and the hole wall of the second through hole, the first abutting portion is fixed at one end of the heat-insulating portion, and the first abutting portion is connected to the side of the control board facing the output end of the electron gun. Through the above technical solution, the effect of reducing the incident angle deviation of the electrons is achieved.

[0025] 3. The outer peripheral surface of the first abutting portion is provided with a second abutting portion, one side of the second abutting portion abuts against the side of the control board facing the electron gun, and the other side of the second abutting portion abuts against the inner wall of the vacuum container. Through the above technical solution, the effect of preventing heat from being transferred from the control board to the side wall of the vacuum container is achieved.

[0026] 4. The heat insulation part, the first abutting part and the second abutting part are mainly composed of multiple layers of heat insulation boards. Through the above technical solution, an efficient heat insulation effect is achieved.

[0027] 5. A vacuum layer is provided between the multi-layer insulation boards. Through the above technical solution, the use of insulation materials is reduced while the insulation performance of the multi-layer insulation boards is significantly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a cross-sectional view of an existing evaporation device; Figure 2 It is a partial cross-sectional view of an existing evaporation device; Figure 3 is a cross-sectional view of a vapor deposition device of the present application; Figure 4 is a partial cross-sectional view of a vapor deposition device according to Example 1 of the present application; Figure 5 is a partial cross-sectional view of a vapor deposition device according to Embodiment 2 of the present application; Figure 6 is a partial cross-sectional view of a vapor deposition device according to Embodiment 3 of the present application; Figure 7 It is an enlarged schematic diagram of point A in Example 3 of the present application.

[0029] In the figure, 1. vacuum container; 11. chamber horizontal plate; 12. first through hole; 2. flange; 21. second through hole; 3. electron gun; 31. electron; 4. control board; 41. incident hole; 5. cooling device; 51. insulation ring; 511. insulation part; 512. first abutment part; 513. second abutment part; 514. insulation plate; 515. vacuum layer; 6. magnetic focusing assembly; 61. focusing coil; 62. inner pole shoe; 63. outer pole shoe; 64. aperture. DETAILED DESCRIPTION

[0030] The following is combined with Figure 3 -Attached Figure 7 , further details of this application are given.

[0031] Embodiment 1: See also Figure 3 and Figure 4 As shown, a vapor deposition device includes: a vacuum container 1, a flange 2, an electron gun 3, a control panel 4, a cooling device 5 and a magnetic focusing assembly 6. Among them: The vacuum container 1 has a first through hole 12 formed on its side wall.

[0032] See also Figure 4 As shown, the flange 2 is fixedly connected to the outer wall of the vacuum container 1 , and a second through hole 21 is formed in the flange 2 , and the second through hole 21 is communicated with the first through hole 12 .

[0033] The electron gun 3 is used to emit electrons 31 into the vacuum container 1 . The electron gun 3 is fixedly connected above the flange 2 , and the output end of the electron gun 3 faces the inside of the vacuum container 1 .

[0034] The control board 4 is arranged below the chamber horizontal plate 11 and at the opening of the first through hole 12. The control board 4 is provided with an incident hole 41 which is offset from the center of the control board 4. The electron beam of the electron gun 3 is injected into the vacuum container 1 through the incident hole 41. Compared with the electron gun 3 directly emitting electrons 31 into the vacuum container 1, the incident hole 41 of the control board 4 enables most of the electrons 31 emitted by the electron gun 3 to hit the predetermined position range of the crucible more accurately.

[0035] In this embodiment, the temperature reduction device 5 is an insulation ring 51, which is used to reduce the temperature of the side wall of the vacuum container 1 and the control board 4. The insulation ring 51 includes an insulation portion 511, a first abutting portion 512 and a second abutting portion 513. The insulation portion 511 abuts against the hole wall of the first through hole 12 and the hole wall of the second through hole 21. The insulation portion 511 matches the shape of the first through hole 12 and the second through hole 21. The insulation portion 511 can be clamped with the hole wall of the first through hole 12 and the hole wall of the second through hole 21, and can also be threaded.

[0036] The first abutting portion 512 is fixedly connected to the lower end of the heat insulating portion 511, and the first abutting portion 512 is fixedly connected to the upper end of the control board 4, and the fixed connection can be adhesive, threaded connection, etc. The second abutting portion 513 is arranged around the outside of the first abutting portion 512, and the lower end surface of the second abutting portion 513 abuts against the upper end surface of the control board 4, and the upper end surface of the second abutting portion 513 abuts against the lower end surface of the chamber horizontal plate 11.

[0037] The heat-insulating ring 51 is rotatably mounted on the inner wall of the first through hole 12, and the extension direction of the rotation axis of the heat-insulating ring 51 is parallel to the incident direction of the electron gun 3. When the metal in the crucible needs to be heated, the electron gun 3 emits electrons 31 and then enters the vacuum container 1 through the incident hole 41 of the control board 4 to heat the metal in a specific area. When the metal in other areas of the crucible needs to be heated, the incident position of the electrons 31 needs to be adjusted, and since the incident hole 41 of the control board 4 deviates from the center of the control board 4, the incident position of the electrons 31 can be changed by rotating the control board 4. Since the upper end of the control board 4 abuts against the lower ends of the first abutting portion 512 and the second abutting portion 513 of the heat-insulating ring 51, it is only necessary to rotate the heat-insulating ring 51 to drive the control board 4 to rotate synchronously. When the control board 4 rotates, the position where the electrons 31 enter the crucible will also change accordingly. In this way, the control board 4 is driven to rotate by rotating the heat-insulating ring 51, and the incident position of the electrons 31 can be flexibly adjusted.

[0038] See also Figure 3 and Figure 4As shown, after the heat-insulating ring 51 is provided, the temperature of the control board 4 and the chamber horizontal plate 11 at the first through hole 12 can be limited to a great extent, so that the control board 4 and the chamber horizontal plate 11 at the first through hole 12 will not be greatly deformed, so that most of the electrons 31 emitted by the electron gun 3 can reach the preset position. This enables the evaporation device to achieve more accurate and uniform evaporation, helps to improve the evaporation quality of the evaporation device, and ensures that the coating on the surface of the substrate is uniform and dense, and has the required performance characteristics. The second abutment portion 513 of the heat-insulating ring 51, on the one hand, plays a role similar to a gasket, reducing the risk of loosening of the heat-insulating ring 51 during the evaporation process; on the other hand, it prevents and reduces the influence of heat on the vacuum container 1. If there is no second abutment portion 513, heat will be transferred from the side wall of the incident hole 41 of the control board 4 to the upper end surface of the control board 4, and then from the upper end surface of the control board 4 to the lower end surface of the chamber horizontal plate 11 of the vacuum container 1, so that the heat bypasses the heat insulation ring 51, and the chamber horizontal plate 11 of the vacuum container 1 is deformed by heat. The chamber horizontal plate 11 is deformed by heat and in turn affects the control board 4, so that the control board 4 is not in the preset position, and the output end of the electron gun 3 is not aligned with the incident hole 41 of the control board 4, so that some electrons 31 cannot reach the preset position in the vacuum container 1. The second abutting portion 513 is provided on the periphery of the first abutting portion 512. When heat is transferred from the side wall of the incident hole 41 of the control board 4 to the upper end surface of the control board 4, since the lower end surface of the second abutting portion 513 abuts against the upper end surface of the control board 4, the heat can only be transferred to the second abutting portion 513, and cannot be transferred to the lower end surface of the chamber horizontal plate 11 of the vacuum container 1. In this way, it is possible to effectively prevent heat from being transferred from the control board 4 to the side wall of the vacuum container 1, causing the vacuum container 1 to deform.

[0039] The material of the insulation ring 51 is a material with low thermal conductivity, which can be a foamed polyurethane board, graphite felt, etc. This embodiment is introduced with graphite felt. During the evaporation process, since the electrons 31 have high energy, the surrounding environment will be at a high temperature, especially the temperature near the output end of the electron gun 3. Graphite felt has excellent thermal insulation performance, which can not only withstand high temperature environment, but also maintain its own performance and structural stability. Using graphite felt as the material of the insulation ring can effectively slow down the conduction of heat, thereby providing good thermal insulation protection for the vacuum container 1, flange 2 and control board 4, reducing the impact of heat on them, reducing their deformation, and thus allowing the electrons 31 emitted by the electron gun 3 to accurately reach the preset position.

[0040] In other embodiments, the heat-insulating ring 51 may also be integrally formed with the control board 4. This tight combination ensures a stable connection between the heat-insulating ring 51 and the control board 4, preventing the heat-insulating ring 51 and the control board 4 from relative movement during the evaporation process, thereby causing the control board 4 to deviate from the preset position, thereby causing the electrons 31 emitted by the electron gun 3 to hit the heat-insulating ring 51 or other areas of the control board 4, so that the electrons 31 cannot reach the preset position. If the design of the control board 4 and the heat-insulating ring 51 being integrally formed is not adopted, when assembling the heat-insulating ring 51 and the control board 4, it is necessary to consider the thickness of the heat-insulating ring 51 and the effect of the heat-insulating ring 51 on the incident hole 41 that is opened on the control board 4 and deviates from the center of the control board 4. If the heat-insulating ring 51 is too thick, it will cover the incident hole 41. If the heat-insulating ring 51 is too thin, a good heat-insulating effect may not be achieved. Compared with independent insulation ring 51 and control board 4, the design of integrally forming insulation ring 51 and control board 4 does not need to consider the above situation, which not only simplifies the assembly process, but also reduces the risk of possible accessory installation errors and loose accessories.

[0041] The implementation principle of this embodiment is as follows: when it is necessary to coat the substrate in the vacuum container 1, the insulation ring 51 is rotated and installed on the inner wall of the first through hole 12 and the second through hole 21, so that the side wall of the insulation ring 51 abuts against the side wall of the first through hole 12 and the second through hole 21, until the second abutting portion 513 of the insulation ring 51 abuts against the bottom of the chamber horizontal plate 11 of the vacuum container 1, and then the control board 4 is fixedly connected to the bottom of the first abutting portion 512 and the second abutting portion 513. The position of the control board 4 is adjusted, and the electrons 31 emitted by the electron gun 3 are controlled to hit the position range of the crucible through the incident hole 41 on the control board 4. Then, the electron gun 3 is used to emit electrons 31 to provide energy for the metal in the crucible, so that the metal in the crucible is vaporized, and the substrate in the vacuum container 1 is coated.

[0042] Embodiment 2: See also Figure 5 As shown, a vapor deposition device, the vapor deposition device provided in Example 2 is basically the same as the vapor deposition device of Example 1, the difference between them is that the insulation part 511, the first abutting part 512 and the second abutting part 513 are mainly composed of multiple layers of insulation boards 514, and a vacuum layer 515 is arranged between the multiple layers of insulation boards 514.

[0043] In this embodiment, the design of the multi-layer insulation board 514 can effectively provide a multi-layer insulation effect. The insulation boards 514 at different levels can form a temperature gradient, limit the transfer of heat, and greatly reduce the risk of heat conduction to the side wall of the vacuum container 1, thereby keeping the side wall of the vacuum container 1 at a low temperature, so that most of the electrons 31 emitted by the electron gun 3 can reach the preset position. The insulation boards 514 of each layer are connected to each other to form an integral structure. Even if some insulation boards 514 have a tendency to deform due to high temperature, other insulation boards 514 will also limit this deformation tendency, which helps to reduce the deformation of the multi-layer insulation boards 514, thereby enhancing the structural strength and stability between the multi-layer insulation boards 514. A vacuum layer 515 is provided between the multi-layer insulation boards 514. Vacuum is an excellent insulation medium. There is neither heat conduction nor convection in a vacuum. The vacuum layer 515 provided between the multi-layer insulation boards 514 can effectively prevent the conduction of heat, and can significantly improve the insulation performance of the multi-layer insulation boards 514 while reducing the use of insulation materials. Furthermore, by providing a vacuum layer 515 between the multi-layer heat insulation board 514, under high temperature conditions, even if the structure and size of the heat insulation board 514 change under the continuous influence of thermal expansion and thermal stress, the vacuum layer 515 can serve as a buffer area, thereby achieving the effect of reducing the influence of thermal expansion and thermal stress on the multi-layer heat insulation board 514. The implementation principle of this embodiment 2 is basically the same as that of embodiment 1, and will not be described in detail here.

[0044] Embodiment 3: See also Figure 6 and Figure 7 As shown, a vapor deposition device, the vapor deposition device provided in Example 3 is basically the same as the vapor deposition device of Example 1, the difference being that the vapor deposition device further includes a magnetic focusing component 6, the magnetic focusing component 6 is disposed in the inner cavity of the heat insulation part 511, and the magnetic focusing component 6 is used to focus the electrons 31 to the incident hole 41.

[0045] In this embodiment, the magnetic focusing assembly 6 is used to focus the electrons 31 to the incident hole 41 of the control board 4. The magnetic focusing assembly 6 includes a focusing coil 61, an inner pole shoe 62, an outer pole shoe 63 and an aperture 64. The inner pole shoe 62 and the outer pole shoe 63 are integrally formed, and the focusing coil 61 is installed in the outer pole shoe 63 and the inner pole shoe 62. A focusing channel is formed in the outer pole shoe 63 and the inner pole shoe 62, and one end of the focusing channel is connected to the output end of the electron gun 3, and the other end of the focusing channel is connected to the incident hole 41 of the control board 4 through the aperture 64. The magnetic focusing assembly 6 can control the strength and direction of the magnetic field so that the electrons 31 emitted by the electron gun 3 are directly focused on the incident hole 41 of the control board 4. On the one hand, the heat of the electrons 31 is difficult to be transferred to the chamber cross plate 11 of the vacuum container 1, so that the temperature of the chamber cross plate 11 of the vacuum container 1 is effectively controlled; on the one hand, the magnetic focusing assembly 6 can make the electrons 31 more concentrated, so that the electrons 31 maintain a smaller beam spot diameter and a higher focusing degree, which helps to improve the directionality and energy density of the electron beam, thereby achieving a more accurate and efficient evaporation process; on the other hand, by focusing the electron beam to the incident hole 41 on the control board 4, more energy of the electrons 31 can be directly shot to the metal in the crucible, reducing energy loss, improving energy utilization, and making the evaporation process more efficient. The principle of this embodiment is basically the same as the implementation principle of embodiment 1 and embodiment 2, and will not be repeated here.

[0046] In other embodiments, the magnetic focusing component 6 may also be combined with Embodiment 2 to achieve a better effect of focusing the electrons 31 .

[0047] The embodiments of this specific implementation are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. The same components are represented by the same figure marks. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A vapor deposition device, characterized in that: include: The vacuum container (1) is provided with a first through hole (12); A flange (2) fixedly connected to the outer wall of the vacuum container (1), the flange (2) being provided with a second through hole (21), the second through hole (21) being in communication with the first through hole (12); An electron gun (3) is fixedly connected to the flange (2), and an output end of the electron gun (3) faces the second through hole (21); A control board (4) is arranged on a side of the vacuum container (1) away from the flange (2) and located at the opening of the first through hole (12), the control board (4) being used to control the position range of the electrons (31) emitted by the electron gun (3) hitting the crucible; A temperature-reducing device (5) is arranged at a position of the vacuum container (1) close to the first through hole (12), and the temperature-reducing device (5) is used to reduce the temperature of the side wall of the vacuum container (1).

2. The evaporation device according to claim 1, characterized in that: The temperature reduction device (5) is a heat-insulating ring (51), the heat-insulating ring (51) being divided into a heat-insulating portion (511) and a first abutting portion (512), the heat-insulating portion (511) abutting against the hole wall of the first through hole (12) and the hole wall of the second through hole (21), the first abutting portion (512) being fixed to one end of the heat-insulating portion (511), and the first abutting portion (512) being connected to a side of the control board (4) facing the output end of the electron gun (3).

3. The evaporation device according to claim 2, characterized in that: A second abutment portion (513) is provided on the outer peripheral surface of the first abutment portion (512), one side of the second abutment portion (513) abuts against a side of the control board (4) facing the electron gun (3), and the other side of the second abutment portion (513) abuts against the inner wall of the vacuum container (1).

4. The evaporation device according to claim 3, characterized in that: The heat insulating portion (511), the first abutting portion (512), and the second abutting portion (513) are mainly composed of multiple layers of heat insulating panels (514).

5. The evaporation device according to claim 4, characterized in that: A vacuum layer (515) is provided between the multiple layers of the heat insulation boards (514).

6. The evaporation device according to any one of claims 2 to 5, characterized in that: It also includes a magnetic focusing component (6), the magnetic focusing component (6) being arranged in the inner cavity of the heat insulation portion (511), the control board (4) being provided with an incident hole (41) deviating from the center of the control board (4), and the magnetic focusing component (6) being used to focus the electrons (31) onto the incident hole (41).

7. The evaporation device according to claim 6, characterized in that: The heat insulation ring (51) is rotatably mounted on the inner wall of the first through hole (12), and the extension direction of the rotation axis of the heat insulation ring (51) is parallel to the incident direction of the electron gun (3).

8. The evaporation device according to claim 2, characterized in that: The heat insulation ring (51) and the control panel (4) are integrally formed.

9. The evaporation device according to claim 2, characterized in that: The material of the heat insulation ring (51) is a material with low thermal conductivity.