Optical module

Abstract

The optical module comprises a circuit connecting plate and light receiving parts, each light receiving part comprises a tube shell, a notch is formed in the end of the circuit connecting plate, and the surface of the notch comprises a first side wall, a second side wall and a connecting face arranged between the first side wall and the second side wall. An avoiding hole is formed in one end of the tube shell, a first step, a second step, a third step and a fourth step which are sequentially increased in height are formed on the bottom surface of the tube shell, and different optical elements are arranged through the steps with different heights. The avoiding hole is used for enabling the circuit connecting plate to extend into the tube shell until the gap comprises the periphery of the second step; the first step is used for supporting the circuit connection board; the second step is used for supporting the optical receiving chip and the TIA. The surface of the notch is composed of the first side wall, the second side wall and the connecting face arranged between the first side wall and the second side wall, the notch in the form can increase the arrangement direction and area of the bonding pad, routing of the light receiving chip and the TIA is facilitated, and the routing length is shortened.

Description

Technical Field

[0001] The present application relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules, as one of the key components in optical communication equipment, can realize the conversion of optical and electrical signals. In the development of optical communication technology, the data transmission rate of optical modules is required to be continuously improved.

[0003] In optical modules with some structures, optical elements are supported by supporting members such as ceramic substrates. The reliability of supporting members such as ceramic substrates is low during mounting, thereby reducing the coupling accuracy of the optical module. Summary of the invention

[0004] The embodiment of the present application provides an optical module to ensure the coupling accuracy of the optical module.

[0005] The optical module provided in this application includes:

[0006] A circuit connection board, with a notch formed at the end thereof, wherein the surface of the notch comprises a first side wall, a second side wall and a connection surface arranged between the first side wall and the second side wall;

[0007] The light receiving component is electrically connected to the circuit connection board and includes:

[0008] The tube shell has an avoidance hole at one end, and the bottom surface is respectively formed with a first step, a second step, a third step and a fourth step with increasing heights in sequence, so as to arrange different optical elements, wherein the avoidance hole is used to allow the circuit connection board to extend into the tube shell until the notch wraps around the outer periphery of the second step; the first step is used to support the circuit connection board;

[0009] Light receiving chips are arranged on the second step surface in the form of an array, and the light receiving chips are electrically connected to the first side wall or the surface of the second side wall;

[0010] The TIA is disposed on the second step surface and between the connection surface and the light receiving chip. The TIA is electrically connected to the light receiving chip and the TIA is electrically connected to the surface of the connection surface.

[0011] The optical module provided in the present application includes a circuit connection board and a light receiving component, and the light receiving component includes a tube shell, wherein a notch is formed at the end of the circuit connection board, and the surface of the notch includes a first side wall, a second side wall, and a connection surface arranged between the first side wall and the second side wall. A relief hole is provided at one end of the tube shell, and a first step, a second step, a third step, and a fourth step with increasing heights are formed on the bottom surface, and different optical elements are arranged through steps of different heights. The relief hole is used to allow the circuit connection board to extend into the tube shell until the notch includes the outer periphery of the second step; the first step is used to support the circuit connection board; and the second step is used to support the light receiving chip and TIA. The surface of the notch is composed of a first side wall, a second side wall and a connecting surface arranged between the first side wall and the second side wall. This form of notch can increase the orientation and area of ​​the pad setting, especially when the light receiving chips are arranged in the form of an array and a TIA is arranged between the light receiving chip and the connecting surface. For example, each light receiving chip in the light receiving chip array can be selected to be wired connected with the pad on the surface of the first side wall or the second side wall to realize the electrical connection between the light receiving chip and the circuit connection board. The pads are arranged on the surfaces of the first side wall and the second side wall, which is beneficial to the distribution of the wires of the light receiving chip and shortening the wire length between the light receiving chip and the circuit connection board; the TIA is wired connected to the pad on the surface of the connecting surface, thereby shortening the wire length between the TIA and the circuit connection board, which is beneficial to the transmission of high-frequency signals. At the same time, in the present application, by arranging each optoelectronic element on different steps in the tube shell, the steps of different heights make the optical axis of the optical element on the same axis, eliminating the ceramic support plate used in some embodiments, thereby reducing production costs; step surfaces of different heights are integrally formed in the tube shell to avoid fixing the ceramic support plate by patching, thereby improving product reliability and thus improving optical coupling accuracy. At the same time, the present application ensures the height of the optical axis of the optical element by reasonably setting the height of each step, thereby ensuring its normal operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0013] Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments;

[0014] Figure 2 is a partial structural diagram of a host computer according to some embodiments;

[0015] Figure 3 is a structural diagram of an optical module according to some embodiments;

[0016] Figure 4 is an exploded view of an optical module according to some embodiments;

[0017] Figure 5 is a structural diagram of a first light receiving component according to some embodiments;

[0018] Figure 6 A tube shell structure according to some embodiments Figure 1 ;

[0019] Figure 7 A tube shell structure according to some embodiments Figure 2 ;

[0020] Figure 8 is a cross-sectional schematic diagram of a tube shell according to some embodiments;

[0021] Fig. 9 The cross-sectional structure of the first light receiving component according to some embodiments Figure 1 ;

[0022] Fig.10 The cross-sectional structure of the first light receiving component according to some embodiments Figure 2 ;

[0023] Fig.11 The cross-sectional structure of the first light receiving component according to some embodiments Figure 3 ;

[0024] Fig.12 The cross-sectional structure of the first light receiving component according to some embodiments Figure 4 ;

[0025] Fig.13 The cross-sectional structure of the first light receiving component according to some embodiments Figure 5 ;

[0026] Fig.14 The cross-sectional structure of the first light receiving component according to some embodiments Figure 6 ;

[0027] Fig.15 is a structural diagram of a second light receiving component according to some embodiments;

[0028] Fig.16 is a cross-sectional view of a second light receiving component according to some embodiments;

[0029] Fig.17 is an exploded cross-sectional view of a second light receiving component according to some embodiments;

[0030] Fig.18 FIG. 2 is a cross-sectional view of another tube package according to some embodiments. Figure 1 ;

[0031] Fig.19 FIG. 2 is a cross-sectional view of another tube package according to some embodiments. Figure 2 ;

[0032] Fig. 20 is a cross-section of a third light receiving component according to some embodiments Figure 1 ;

[0033] Fig.21 is a cross-sectional exploded view of a third light receiving component according to some embodiments;

[0034] Fig. 22 is a cross-section of a third light receiving component according to some embodiments Figure 2 ;

[0035] Fig.23 is a cross-section of a third light receiving component according to some embodiments Figure 3 . DETAILED DESCRIPTION

[0036] In optical communication technology, in order to establish information transmission between information processing devices, it is necessary to load information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When optical signals are transmitted in information transmission equipment, the loss of optical power can be reduced, so high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment usually includes optical network terminals (Optical Network Unit, ONU), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment usually includes optical fibers and optical waveguides.

[0037] The optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the upper computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0038] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0039] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0040] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the working state of the optical module 200.

[0041] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0042] The host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200, and the optical module 200 converts the first optical signal into a first electrical signal, and the optical module 200 transmits the first electrical signal to the host computer 100, and the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between the optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0043] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0044] Figure 2 FIG. 1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0045] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101.

[0046] Figure 3 is a structural diagram of an optical module according to some embodiments, Figure 4 FIG. 1 is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400 and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0047] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0048] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0049] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0050] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold finger of the circuit board 300 extends from the opening 204 and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port, which is configured to access the external optical fiber 101, so that the optical fiber 101 connects the optical emitting component 400 and the optical receiving component 500 in the optical module 200.

[0051] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted, which facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the above shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the above components. In addition, when assembling the circuit board 300, the light emitting component 400 and the light receiving component 500, etc., it is convenient to deploy the positioning components, heat dissipation components and electromagnetic shielding components of these components, which is conducive to the automated production.

[0052] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0053] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0054] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0055] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, transistors, metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET), etc. The chips may include microcontroller units (Microcontroller Unit, MCU), laser driver chips, transimpedance amplifiers (Transimpedance Amplifier, TIA), limiting amplifiers (Limiting amplifier), clock and data recovery chips (Clock and Data Recovery, CDR), power management chips, digital signal processing (Digital Signal Processing, DSP) chips.

[0056] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0057] The circuit board 300 also includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be provided on the surface of only one side of the circuit board 300 (for example, Figure 4 The upper surface shown in the figure) can also be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, so as to adapt to occasions where the number of pins is large. The gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0058] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger.

[0059] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0060] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0061] Figure 5 FIG. 4 is a structural diagram of a first light receiving component according to some embodiments. Figure 5 As shown, in some embodiments, the optical receiving component 500 includes a tube shell 510a, an optical demultiplexing component 520, a lens, a reflector, an optical receiving chip, and a TIA560. The optical demultiplexing component 520, the lens, the reflector, and the TIA560 are respectively arranged inside the tube shell 510a. The lens is located in the light-emitting direction of the optical demultiplexing component 520 to receive each light beam generated by the optical demultiplexing component 520; the reflector is located in the light-emitting direction of the lens to receive each light beam signal transmitted from the lens; the optical receiving chip is located in the light-emitting direction of the reflector to receive the light signal reflected by the reflector.

[0062] The optical demultiplexing component 520 is used to receive the optical signal transmitted from the outside of the optical module to the tube shell 510a, and decompose the optical signal into multiple optical signals of different wavelengths; illustratively, the lens is a converging lens, which is used to convert each optical signal from divergent light to convergent light; the reflector is used to reflect the optical signal transmitted from the lens, change the transmission direction of the optical signal, turn the optical signal downward, and then reflect the optical signal to the optical receiving chip; the optical receiving chip converts the optical signal into a current signal; TIA560 is used to convert the current signal into a voltage signal and amplify it. Exemplarily, the optical receiving chips are arranged in the form of an array, so that each optical receiving chip can receive each optical signal decomposed and generated by the optical demultiplexing component 520.

[0063] One end of the optical receiving component 500 is connected to the optical fiber adapter, and the other end is electrically connected to the circuit connection board 300a. One end of the circuit connection board 300a extends into the interior of the tube shell 510a. In some embodiments, the circuit connection board 300a can be the circuit board 300 of the optical module. At this time, one end of the circuit connection board 300a extends into the interior of the tube shell 510a, and the other end is electrically connected to the host computer through the electrical port. In some embodiments, the circuit connection board 300a can be a sub-circuit board. Exemplarily, the sub-circuit board is a printed circuit board or a ceramic connection board. One end of the sub-circuit board extends into the interior of the tube shell 510a, and the other end is electrically connected to the circuit board 300 of the optical module through a flexible circuit board. In some embodiments, the circuit connection board 300a can be a flexible circuit board. One end of the flexible circuit board extends into the interior of the tube shell 510a, and the other end is electrically connected to the circuit board 300 of the optical module.

[0064] Figure 6 A tube shell structure according to some embodiments Figure 1 .like Figure 6 As shown, in some embodiments, a relief hole 515 is provided at one end of the tube shell 510a, and the relief hole 515 is used to allow the circuit connection board 300a to extend into the tube shell 510a, and then the circuit connection board 300a is electrically connected to the TIA560. The optical receiving chip 550 converts the received optical signal into a photocurrent signal, and the TIA560 converts the photocurrent signal into a voltage signal, and amplifies the voltage signal at the same time, and then transmits the voltage signal through the circuit connection board 300a. The optical receiving chip 550 and the TIA560 are both arranged on the surface of the second step 512, and the optical receiving chip 550 and the TIA560 are electrically connected.

[0065] Figure 7 A tube shell structure according to some embodiments Figure 2 .like Figure 7 As shown, in some embodiments, a boss 516 is provided at the other end of the tube shell 510a, and an optical window is provided inside the boss 516, and an optical connection with the optical fiber adapter is achieved through the boss 516.

[0066] Figure 8 FIG. 1 is a cross-sectional schematic diagram of a tube shell according to some embodiments. Figure 8 As shown, in some embodiments, the bottom surface of the tube housing 510a is respectively formed with step surfaces of different heights, including a first step 511, a second step 512, a third step 513 and a fourth step 514. Exemplarily, the heights of the first step 511, the second step 512, the third step 513 and the fourth step 514 are sequentially increased. In some embodiments, there is a gap between the fourth step 514 and the end surface of the tube housing 510a provided with a light window to avoid the light window. Of course, no gap may be provided as long as the light window is avoided.

[0067] In some embodiments, the bottom surface of the tube shell 510a is respectively formed with step surfaces of different heights, and these step surfaces are integrally formed with the main structure of the tube shell 510a, which can increase the reliability of each step. Compared with some embodiments in which a ceramic substrate is pasted and then the ceramic substrate plays the role of these step surfaces, the present application forms each step inside the tube shell 510a to avoid patching, thereby increasing the reliability of each step, increasing the optical reliability of each optical element, and thus improving the optical coupling accuracy.

[0068] Fig. 9 The cross-sectional structure of the first light receiving component according to some embodiments Figure 1 ; Fig.10 The cross-sectional structure of the first light receiving component according to some embodiments Figure 2 .like Fig. 9 and Fig.10As shown, a notch 301a is provided at the end of the circuit connection board 300a close to the tube shell 510a. Exemplarily, the notch 301a is a U-shaped notch.

[0069] The circuit connection board 300a extends from the avoidance hole 515 into the tube shell 510a until the notch 301a wraps around the outer periphery of the second step 512, and the first step 511 supports the circuit connection board 300a, thereby achieving the fixation of the circuit connection board 300a. Exemplarily, the notch 301a wraps around the outer periphery of the second step 512 means that the notch 301a surrounds the outer periphery of the other three surfaces of the second step 512 except the interface between the second step 512 and the third step 513.

[0070] The surface of the second step 512 is provided with a light receiving chip 550 and a TIA 560. For example, there is a certain distance between the light receiving chip 550 and the TIA 560 to avoid problems such as light path pollution caused by glue overflowing during pasting and fixing.

[0071] A lens is provided on the surface of the third step 513. The reflector includes a light incident surface, a bevel, and a light emitting surface, wherein the light incident surface faces the lens, the bevel is used to reflect the light signal transmitted from the lens, and the light emitting surface faces the second step 512. In some embodiments, the lens and the reflector may be connected together or separately provided according to different scenarios. In the present application, the lens is fixed to the surface of the third step 513, which is more stable than that in some embodiments where the lens is provided between the reflector and the light receiving chip.

[0072] The lens is disposed on the surface of the third step 513 , the reflector is not disposed on the surface of any step, and the reflector is disposed above the second step.

[0073] The lens and the reflector are arranged opposite to each other so that the light signal transmitted from the lens is incident on the reflector. The focal length of the lens should be sufficient to make the light signal transmitted from the lens, after being reflected by the reflector, focus on the surface of the light receiving chip, thereby reducing the size of the light spot and making the light signal fall within the light receiving range of the light receiving chip.

[0074] An optical demultiplexing assembly 520 is disposed on the surface of the fourth step 514 . The fourth step 514 is disposed at a preset height so that the optical axis of the optical demultiplexing assembly 520 and the optical port of the optical module are on the same axis, thereby increasing optical coupling efficiency.

[0075] When the optical demultiplexing component 520 is selected to be of standard specifications, its height is smaller than the height of the lens. Therefore, the optical demultiplexing component 520 is arranged on the surface of the fourth step 514 which is relatively higher, and the lens is arranged on the surface of the third step 513 which is relatively lower, so that the optical axis of the optical demultiplexing component 520 and the optical axis of the lens are in the same straight line. By arranging the optical demultiplexing component 520 on a separate step surface, it is more conducive to selecting standard specifications and facilitating production.

[0076] In some embodiments, the circuit connection board 300a, TIA560 and the optical receiving chip 550 are arranged in sequence, and the TIA560 and the optical receiving chip 550 are electrically connected to the circuit connection board 300a respectively. Since the TIA560 is arranged between the optical receiving chip 550 and the circuit connection board 300a, the wiring length between the optical receiving chip 550 and the circuit connection board 300a is relatively long, which is not conducive to the transmission of high-frequency signals. Moreover, since the optical receiving chip 550 is arranged in the form of an array, that is, it includes multiple optical receiving chips, the difficulty of wiring between the optical receiving chip and the circuit connection board 300a is further increased.

[0077] Exemplarily, a notch 301a is provided at the end of the circuit connection board 300a, and the notch 301a includes a first side wall 301a1, a second side wall 301a2 and a connecting surface 301a3 connecting the first side wall 301a1 and the second side wall 301a2. The first side wall 301a1 and the second side wall 301a2 of the notch 301a can increase the pad setting area and orientation, especially when the optical receiving chips are arranged in the form of an array and a TIA is provided between the optical receiving chip and the connecting surface. Exemplarily, each optical receiving chip in the optical receiving chip array can be selected to be wired and connected with the pad on the surface of the first side wall or the second side wall nearby, so that the electrical connection between the optical receiving chip and the circuit connection board is conducive to the distribution of the bonding wires of the optical receiving chip array.

[0078] Exemplarily, the surfaces of the first side wall 301a1 and the second side wall 301a2 are provided with solder pads electrically connected to the optical receiving chip 550, which increases the pad setting positions and is beneficial to shortening the wire bonding length. For example, when the optical receiving chip array includes eight optical receiving chips, the surface of the first side wall 301a1 is provided with 4 solder pads to achieve electrical connection with the 4 optical receiving chips, and the surface of the second side wall 301a2 is provided with 4 solder pads to achieve electrical connection with the other 4 optical receiving chips. Therefore, when the solder pads electrically connected to the optical receiving chip 550 are provided on the surfaces of the first side wall 301a1 and the second side wall 301a2, it is beneficial to the layout of the wire bonding, shortens the wire bonding length, and is beneficial to high-frequency signal transmission.

[0079] Illustratively, the surface of the connection surface 301a3 is provided with a solder pad electrically connected to TIA560, thereby realizing wire bonding between the optical receiving chip 550 and the circuit connection board 300a. Since TIA560 is arranged adjacent to the connection surface 301a3, the wire bonding length between the circuit connection board 300a and TIA560 can be shortened at this time, which is beneficial to high-frequency signal transmission.

[0080] In some embodiments, the lens includes a first lens 530a; and the reflector includes a first reflector 540a. The first lens 530a is a converging lens. The light incident surface of the first lens 530a is a curved surface, and the light emitting surface is a flat surface.

[0081] The light beams emitted by the optical demultiplexing component 520 are respectively converged by the first lens 530a and coupled to the first reflector 540a. Then, after being reflected by the first reflector 540a, the light path turns downward to the surface of the light receiving chip 550. The focal length of the first lens 530a satisfies that the light spot formed by the optical signal falls on the surface of the light receiving chip 550.

[0082] The first reflector 540a includes a light incident surface, a first inclined surface 540a1 and a light emitting surface, wherein the light incident surface faces the first lens 530a, the first inclined surface 540a1 has a preset inclination angle so that the light signal incident thereon is totally reflected to the surface of the light receiving chip 550, and the light emitting surface faces the surface of the light receiving chip 550.

[0083] In some embodiments, the first lens 530a is disposed on the surface of the third step 513, and the first reflector 540a is not disposed on the surface of any step. In order to fix the first reflector 540a, the first reflector 540a can be supported by the first lens 530a. Exemplarily, the first lens 530a and the first reflector 540a are glued together. Exemplarily, the light emitting surface of the first lens 530a and the light incident surface of the first reflector 540a are glued together by optical glue. At this time, the first reflector 540a is suspended relative to the step surface.

[0084] Since the light-emitting surface of the first lens 530a is a plane, it can be ensured that there is a large contact surface between the light-emitting surface of the first lens 530a and the light-entering surface of the first reflector 540a, thereby ensuring the stability of the pasting of the first reflector 540a. When pasting the first lens 530a and the first reflector 540a together, it is only necessary to fix the first lens 530a on the surface of the third step 513 through a high-precision chip mounter, eliminating the need to perform chip fixation on the first reflector 540a through a high-precision chip mounter, thereby simplifying the chip fixation process; the light-emitting surface of the first lens 530a and the light-entering surface of the first reflector 540a do not need to be fixed through a high-precision chip mounter, and can be manually coated with optical glue and pasted and fixed. Therefore, when the first lens 530a and the first reflector 540a are pasted together, the chip fixation process can be simplified, thereby improving efficiency.

[0085] In some embodiments, when the circuit connection board 300a is a circuit board, a printed circuit board, or a flexible circuit board of an optical module, the pads on the surface of TIA560 and the pads on the surface of the circuit connection board 300a can be directly connected by wire bonding; when the circuit connection board 300a is a ceramic connection board, a wire bonding capacitor is set on the surface of the ceramic connection board, and then the pads on the surface of TIA560 are electrically connected to the wire bonding capacitor, and then the wire bonding capacitor is connected to the pads on the surface of the ceramic connection board by wire bonding.

[0086] Fig.11 The cross-sectional structure of the first light receiving component according to some embodiments Figure 3 .like Fig.11 As shown, the inner bottom surface of the tube shell 510a is respectively formed with a first step 511, a second step 512, a third step 513 and a fourth step 514. The first step 511 is used to support the circuit connection board 300a; the surface of the second step 512 is provided with a TIA 560 and a light receiving chip 550; the surface of the third step 513 is provided with a first lens 530a, and the light emitting surface of the first reflector 540a faces the light receiving chip 550 on the surface of the second step 512; the surface of the fourth step 514 is provided with an optical demultiplexing component 520.

[0087] In the embodiment of the present application, the optical path of the optical element is ensured by reasonably setting the height of each step, thereby ensuring its normal operation. For example, the height of the second step 512 has a preset height, and the preset height is required to make the surface of the TIA 560 flush with the surface of the circuit connection board 300a to shorten the wire bonding between the TIA 560 and the circuit connection board 300a.

[0088] Exemplarily, the height of the third step 513 has a preset height, and the preset height needs to meet the working distance of the first lens 530a, and at the same time, the optical axis of the first lens 530a must be in the same straight line with the optical axis of the optical demultiplexing component 520. Exemplarily, the first lens 530a has a certain working distance. If the height of the third step 513 is too low, and the optical axes of the first lens 530a and the first reflector 540a need to be kept in the same straight line with the optical axis of the optical demultiplexing component 520, and the height of the first reflector 540a remains fixed, then the distance between the first reflector 540a and the optical receiving chip 550 is relatively large, and it is possible to exceed the working distance of the first lens 530a, so that the magnification of the first lens 530a cannot be guaranteed, and the normal operation of the first lens 530a cannot be met. If the height of the third step 513 is too low, and the optical axes of the first lens 530a and the first reflector 540a need to be kept in the same straight line as the optical axis of the optical demultiplexing assembly 520, the distance between the first reflector 540a and the optical receiving chip 550 is relatively small, thereby interfering with operations such as wiring of the optical receiving chip 550. Therefore, the height of the third step 513 has a preset height, and the preset height needs to meet the working distance of the first lens 530a, and at the same time, the optical axis of the first lens 530a and the optical axis of the optical demultiplexing assembly 520 need to be kept in the same straight line.

[0089] Exemplarily, the height of the fourth step 514 has a preset height, and the preset height needs to satisfy that the optical axis of the optical demultiplexing component 520 on the surface and the optical port of the optical module are on the same axis, thereby ensuring the optical coupling power.

[0090] Fig.12 The cross-sectional structure of the first light receiving component according to some embodiments Figure 4 .like Fig.12 As shown, in some embodiments, when the first lens 530a and the first reflector 540a are pasted together, the bottom surface of the first lens 530a and the bottom surface of the first reflector 540a are on the same surface. At this time, the optical axes of the first lens 530a and the first reflector 540a are on the same straight line.

[0091] The optical receiving chip 550 and the TIA 560 are both disposed on the surface of the second step 512 ; the first lens 530 a is disposed on the surface of the third step 513 ; and the optical demultiplexing component 520 is disposed on the surface of the fourth step 514 .

[0092] In some embodiments, the third step 513 and the fourth step 514 may be arranged in a plane. In this case, the sizes of the optical demultiplexing assembly 520 and the first lens 530a should satisfy that the optical axis of the optical demultiplexing assembly 520 and the optical axis of the first lens 530a are on the same axis.

[0093] Fig.13The cross-sectional structure of the first light receiving component according to some embodiments Figure 5 .like Fig.13 As shown, in some embodiments, when the first lens 530a and the first reflector 540a are pasted together, the bottom surface of the first lens 530a is arranged on the surface of the third step 513, and then the bottom surface of the first reflector 540a is not on the same surface as the bottom surface of the first lens 530a, but is closer to the light receiving chip 550 relative to the bottom surface of the first lens 530a, so that the bottom surface of the first lens 530a and the bottom surface of the first reflector 540a are relatively staggered. This is because when the first lens 530a is pasted, excess glue may overflow to the bottom surface of the first reflector 540a, thereby reducing the transmittance of the bottom surface of the first reflector 540a. When the bottom surface of the first lens 530a and the bottom surface of the first reflector 540a are relatively staggered, the step surface formed by the staggered state can block the glue, thereby preventing the glue from overflowing to the bottom surface of the first reflector 540a, thereby ensuring the transmittance of the bottom surface of the first reflector 540a.

[0094] In some embodiments, when the first lens 530a and the first reflector 540a are pasted together, the bottom surface of the first lens 530a is disposed on the surface of the third step 513, and then the bottom surface of the first reflector 540a is not on the same surface as the bottom surface of the first lens 530a, but is upwardly further away from the light receiving chip 550 relative to the bottom surface of the first lens 530a. When the first reflector 540a is further upwardly away from the light receiving chip 550, the gap between the first reflector 540a and the light receiving chip 550 can be increased, leaving enough safety space for bonding the surface of the light receiving chip 550 and pasting capacitors near the light receiving chip 550.

[0095] Fig.14 The cross-sectional structure of the first light receiving component according to some embodiments Figure 6 .like Fig.14 As shown, the TIA 560 is disposed on the surface of the second step 512 and in the notch 301 a of the circuit connection board 300 a , and the notch 301 a wraps around the TIA 560 .

[0096] The light emitting surface of the first lens 530a and the light incident surface of the first reflector 540a are adhered together by optical adhesive, which simplifies the patch process. At the same time, the working distance of the first lens 530a is shorter at this time, reducing the working distance pressure of the first lens 530a.

[0097] In some embodiments, when the working distance of the first lens 530a is determined, in some scenarios, for example, when the first lens 530a and the first reflector 540a are separately set, if the first lens 530a and the first reflector 540a are directly separately set, then in order to ensure that the working distance of the first lens 530a remains unchanged, the first reflector 540a needs to be moved downward close to the light receiving chip 550. Since the optical axes of the first lens 530a and the first reflector 540a are on the same straight line, the first lens 530a should also be set downward at this time, which will cause the optical axis of the first lens 530a and the optical axis of the optical demultiplexing component 520 to be not on the same axis, affecting the optical coupling efficiency. Therefore, when the working distance of the first lens 530a is determined, it is not suitable to separately set the first lens 530a and the first reflector 540a.

[0098] In some embodiments, when the working distance of the first lens 530a is determined, in some scenarios, for example, when the first lens 530a and the first reflector 540a are separately set, if the first lens 530a and the first reflector 540a are directly separated, then in order to ensure that the working distance of the first lens 530a remains unchanged, the height of the surface of the second step 512 can be increased to shorten the chip between the first reflector 540a and the light receiving chip 550. At this time, the thickness of the circuit connection board 300a needs to be reduced to ensure that the surface of the TIA560 on the surface of the second step 512 is on the same surface as the circuit connection board 300a.

[0099] In some embodiments, in some scenarios, for example, when the first lens 530a and the first reflector 540a are separately arranged, if the first lens 530a and the first reflector 540a are directly separately arranged, in order to ensure that the thickness of the circuit connection board 300a remains unchanged, and the surface where the TIA560 on the surface of the second step 512 is located is on the same surface as the circuit connection board 300a, the working distance of the first lens 530a should be adjusted at this time. For example, the working distance of the first lens 530a is increased.

[0100] Fig.15 FIG. 4 is a structural diagram of a second light receiving component according to some embodiments. Fig.15 As shown, as described above, in some embodiments, the circuit connection board 300a may be a flexible circuit board, one end of which extends into the tube shell 510a, and the other end of which is electrically connected to the circuit board 300 of the optical module.

[0101] Exemplarily, the circuit connection board 300a is in the form of a flexible circuit board 300b. Since the flexible circuit board 300b has a certain flexibility, the flexible circuit board 300b is supported by the reinforcing plate 300c. The flexible circuit board 300b and the reinforcing plate 300c pass through the avoidance hole 515 and extend into the tube shell 510a.

[0102] In some embodiments, the flexible circuit board 300b and the reinforcement plate 300c are stacked, and the flexible circuit board 300b and the reinforcement plate 300c are respectively provided with a notch, the form of the notch is the same as the notch of the aforementioned circuit connection plate 300a, and the notches of the flexible circuit board 300b and the reinforcement plate 300c also surround the second step 512.

[0103] Fig.16 is a cross-sectional view of a second light receiving component according to some embodiments; Fig.17 FIG. 2 is an exploded cross-sectional view of a second light receiving component according to some embodiments. Fig.16 and Fig.17 As shown, the gaps of the flexible circuit board 300b and the reinforcing plate 300c also surround the second step 512. The reinforcing plate 300c supports the flexible circuit board 300b. The surface of the first step 511 is used to support the reinforcing plate 300c and the flexible circuit board 300b.

[0104] An optical demultiplexing component 520 is arranged on the surface of the fourth step 514; a first lens 530a is arranged on the surface of the third step 513, and the first lens 530a is connected to the first reflector 540a. The first reflector 540a is used to reflect the optical signal transmitted by the first lens 530a and turn the optical signal downward to the surface of the optical receiving chip 550.

[0105] A light receiving chip 550 and a TIA 560 are respectively disposed on the surface of the second step 512. The light receiving chip 550 and the TIA 560 are electrically connected. The light receiving chip 550 converts the optical signal into a current signal, and the TIA 560 converts the current signal into a voltage signal and amplifies the voltage signal.

[0106] Fig.18 FIG. 2 is a cross-sectional schematic diagram of another tube shell according to some embodiments. Fig.18 As shown, in some embodiments, another tube shell 510b different from the above-mentioned tube shell 510a is provided.

[0107] In the tube shell 510b, a relief hole 515 is provided at one end, and a boss 516 is provided at the other end. The relief hole 515 in the tube shell 510b plays the same role as the relief hole 515 in the tube shell 510a, and is used to allow the circuit connection board 300a to extend therein. The boss 516 in the tube shell 510b plays the same role as the boss 516 in the tube shell 510a, and is used to couple with the optical fiber adapter.

[0108] The inner bottom surface of the tube shell 510b is respectively formed with a first step 511, a second step 512, a third step 513 and a fourth step 514 with increasing heights. By providing corresponding optical elements on the step surfaces with different heights, the optical axis can be reasonably set and the optical path can be reasonably designed.

[0109] Fig.19 FIG. 2 is a cross-sectional view of another tube package according to some embodiments. Figure 2 .like Fig.19 As shown, in some embodiments, a first support protrusion 517 and a second support protrusion 518 are respectively formed at both ends of the interface between the second step 512 and the third step 513. The first support protrusion 517 and the second support protrusion 518 are both designed as slots, and the slots are set on the surface of the second step 512, and then the side surfaces are connected to the interface between the second step 512 and the third step 513, so as to achieve a fixed connection between the first support protrusion 517 and the second support protrusion 518. Exemplarily, a first snap-in groove is formed on the surface of the first support protrusion 517, and a second snap-in groove is formed on the surface of the second support protrusion 518, and the first snap-in groove and the second snap-in groove are respectively set on both sides of the interface between the second step 512 and the third step 513.

[0110] Exemplarily, the top surfaces of the first supporting protrusion 517 and the second supporting protrusion 518 are higher than the surface of the third step 513 , and thus the heights of the first supporting protrusion 517 and the second supporting protrusion 518 are higher than the height of the third step 513 .

[0111] Since the first supporting protrusion 517 and the second supporting protrusion 518 are separated and spaced apart at both ends, an optical element can be disposed on the top surface thereof, and an optical element can also be disposed below the optical element.

[0112] Fig. 20 is a cross-section of a third light receiving component according to some embodiments Figure 1 .like Fig. 20 As shown, the surface of each step in the tube shell 510b is provided with a corresponding optical element. In some embodiments, the surface of the fourth step 514 is provided with an optical demultiplexing component 520; the surface of the third step 513 is provided with a lens, which is a converging lens; a reflector is provided on the other side of the lens, and the reflector is used to reflect the optical signal transmitted by the lens; the surface of the second step 512 is provided with an optical receiving chip 550 and a TIA560, respectively, and the optical receiving chip 550 and the TIA560 are electrically connected. Exemplarily, the optical receiving chip 550 and the TIA560 are electrically connected by wire bonding. The reflector reflects the optical signal to the surface of the optical receiving chip 550, and the optical receiving chip 550 converts the optical signal into a current signal. The TIA560 converts the current signal into a voltage signal and amplifies the voltage signal at the same time. The TIA560 is electrically connected to the circuit connection board 300a. Exemplarily, the pads on the surface of the TIA560 are electrically connected to the pads on the surface of the circuit connection board 300a.

[0113] In some embodiments, the lens includes a second lens 530b, the reflector includes a second reflector 540b, the surface of the second reflector 540b has a second slope 540b1, and the second slope 540b1 has a preset inclination angle so that the optical signal incident on the surface of the second reflector 540b is totally reflected to the surface of the optical receiving chip 550.

[0114] The light incident surface of the second lens 530 b faces the optical demultiplexing assembly 520 , and the light emitting surface faces the second reflector 540 b ; the light incident surface of the second reflector 540 b faces the second lens 530 b , and the light emitting surface faces the light receiving chip 550 on the surface of the second step 512 .

[0115] In some embodiments, the second lens 530b is disposed on the surface of the third step 513, and the second reflector 540b is not disposed on the surface of any step. In order to fix the second reflector 540b, the second reflector 540b can be supported and fixed by the first supporting protrusion 517 and the second supporting protrusion 518. Exemplarily, the second lens 530b and the second reflector 540b are separately disposed, that is, there is a certain interval between the second lens 530b and the second reflector 540b, and the two ends of the second reflector 540b are respectively straddled on the surfaces of the first supporting protrusion 517 and the second supporting protrusion 518, and the first supporting protrusion 517 and the second supporting protrusion 518 support the second reflector 540b, and then the light receiving chip 550 is disposed below the second reflector 540b. By setting the first supporting protrusion 517 and the second supporting protrusion 518 apart from each other, a second reflector 540b is set on the top surface thereof, and a light receiving chip 550 is set therebelow, so that the second reflector 540b and the light receiving chip 550 are set upside down, thereby transmitting the optical signal reflected by the second reflector 540b to the surface of the light receiving chip 550.

[0116] Fig.21 FIG. 4 is a cross-sectional exploded view of a third light receiving component according to some embodiments. Fig.21 As shown, a notch is also provided at the end of the circuit connection board 300 a , and the notch extends through the avoidance hole 515 into the tube shell 510 b until the notch surrounds the outer periphery of the second step 512 .

[0117] Fig. 22 is a cross-section of a third light receiving component according to some embodiments Figure 2 ; Fig.23 is a cross-section of a third light receiving component according to some embodiments Figure 3 .like Fig. 22 and Fig.23As shown, the surface of the fourth step 514 is provided with an optical demultiplexing component 520, the surface of the third step 513 is provided with a second lens 530b, and a second reflector 540b is provided above the second step 512. The second reflector 540b is arranged opposite to the optical receiving chip 550, and the optical signal transmitted from the second lens 530b is reflected to the surface of the optical receiving chip 550 by the second reflector 540b. The optical receiving chip 550 and the TIA560 are both arranged on the surface of the second step 512.

[0118] In some embodiments, the second lens 530b and the second reflector 540b are separated and arranged, which is easier to couple than to arrange them in contact. When the two are arranged in contact, joint coupling is required, and the efficiency of joint coupling is low. Therefore, the two can be arranged separately and then coupled separately. Exemplarily, the second reflector 540b is coupled first, and then the second lens 530b is coupled. At the same time, in order to facilitate the coupling of the second lens 530b, the interval between the second lens 530b and the second reflector 540b is large, so as to leave enough space for the coupling of the second lens 530b.

[0119] In some embodiments, the light receiving chip 550 and the TIA 560 are wire-bonded. In order not to interfere with the wire bonding, the distance between the second reflector 540 b and the light receiving chip 550 can also be set to be larger to facilitate the wire bonding operation.

[0120] In order to increase the distance between the second reflector 540b and the light receiving chip 550, since the height of the second step 512 where the light receiving chip 550 is located should ensure that the surface of the TIA560 is flush with the surface of the circuit connection board 300a, the height of the second step 512 should remain unchanged, and the height of the light receiving chip 550 will remain unchanged accordingly. Therefore, at this time, the second reflector 540b can be adjusted to increase the distance between the second reflector 540b and the light receiving chip 550.

[0121] Since the optical axis height of the second reflector 540b should remain unchanged, the position of the second bevel 540b1 should remain unchanged. Then, the distance between the second reflector 540b and the light receiving chip 550 can be increased by reducing the size of the second reflector 540b in the height direction of the tube shell 510b, that is, reducing the height of the second reflector 540b in the up-down direction, while ensuring the position of the second bevel 540b1, so as to facilitate operations such as wire bonding. Accordingly, the size of the first reflector 540a in the height direction of the tube shell 510a is greater than the size of the second reflector 540b in the height direction of the tube shell 510a, that is, the size of the second reflector 540b in the up-down direction is smaller than the size of the first reflector 540a in the up-down direction. It can be understood that the "up-down direction" refers to the direction from the second reflector 540b to the light receiving chip 550. At this time, the distance from the first reflector 540a to the corresponding light receiving chip 550 is smaller than the distance from the second reflector 540b to the corresponding light receiving chip 550.

[0122] Exemplarily, the cross-section of the first reflector 540a in the vertical direction is a trapezoid plus a rectangle, and the cross-section of the second reflector 540b in the vertical direction is a trapezoid, so that the size of the second reflector 540b in the vertical direction is smaller than the size of the first reflector 540a in the vertical direction. When the cross-section of the first reflector 540a in the vertical direction is a trapezoid plus a rectangle, a rectangle is provided below the first inclined surface 540a1 to avoid the formation of a sharp corner at the first inclined surface 540a1, which is easy to cause angle collapse. When the cross-section of the second reflector 540b in the vertical direction is a trapezoid, the distance between the second reflector 540b and the light receiving chip 550 can be increased, which is convenient for the wire bonding and other operations of the light receiving chip 550.

[0123] In some embodiments, when the position of the optical port remains unchanged, the height of the optical axis of the optical demultiplexing component 520 should also remain unchanged, and thus the height of the optical axis of the second reflector 540b should remain unchanged. Then, the height of the top surface of the second reflector 540b is the same as the height of the top surface of the first reflector 540a. Therefore, the first support protrusion 517 and the second support protrusion 518 have a preset height so that the height of the top surface of the second reflector 540b is the same as the height of the top surface of the first reflector 540a.

[0124] When the dimension of the first reflector 540a along the height direction of the tube shell 510a is greater than the dimension of the second reflector 540b along the height direction of the tube shell 510a, that is, the dimension of the second reflector 540b in the up-down direction is smaller than the dimension of the first reflector 540a in the up-down direction, the optical path from the second lens 530b to the corresponding optical receiving chip 550 is compared with the optical path from the first lens 530a to the corresponding optical receiving chip 550, and the distance the optical signal is transmitted at the second reflector 540b is shorter than the distance the optical signal is transmitted at the first reflector 540a. When the reflector is the second reflector 540b, the distance the optical signal is transmitted in the air is longer than the distance when the reflector is the first reflector 540a. Due to the small refractive index of air, the optical path from the second lens 530b to the corresponding optical receiving chip 550 is shorter than the optical path from the first lens 530a to the corresponding optical receiving chip 550. At this time, the working distance of the second lens 530b is shorter than the working distance of the first lens 530a.

[0125] In order to ensure the coupling effect, the gap between the second lens 530b and the second reflector 540b is relatively large. Exemplarily, the gap is greater than the size difference, and the size difference refers to the difference between the size of the second reflector 540b along the height direction of the tube shell 510b and the size of the first reflector 540a along the height direction of the tube shell 510a. At this time, although the size of the second reflector 540b in the up and down direction is smaller than the size of the first reflector 540a in the up and down direction, the gap between the second lens 530b and the second reflector 540b is relatively large. Therefore, the working distance of the second lens 530b may be greater than the working distance of the first lens 530a.

[0126] In the present application, the lens is fixed on the surface of the third step to increase the stability of the lens; at the same time, the reflector is arranged above the second step, and the light receiving chip is arranged on the surface of the second step to make full use of the space in the upper and lower directions of the tube shell. In the present application, the focal length of the lens makes the light signal transmitted from the lens focus on the surface of the light receiving chip after being reflected by the reflector, thereby reducing the size of the light spot and making the light signal fall within the light receiving range of the light receiving chip. In the present application, by arranging each photoelectric element on different steps in the tube shell, the steps of different heights make the optical axis of the optical element on the same axis, eliminating the ceramic support plate used in some embodiments, thereby reducing the production cost; the step surfaces of different heights are integrally formed in the tube shell to avoid fixing the ceramic support plate by patching, thereby improving the product reliability and thus improving the optical coupling accuracy. At the same time, the present application ensures the height of the optical axis of the optical element by reasonably setting the height of each step, thereby ensuring its normal operation.

[0127] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. An optical module, It is characterized in that include: A circuit connection board, wherein a notch is formed at the end thereof, wherein the notch surface comprises a first side wall, a second side wall and a connection surface disposed between the first side wall and the second side wall; The light receiving component is electrically connected to the circuit connection board and includes: A tube shell, one end of which is provided with an avoidance hole, and the bottom surface is respectively formed with a first step, a second step, a third step and a fourth step with increasing heights in sequence, so as to arrange different optical elements, wherein the avoidance hole is used to allow the circuit connection board to extend into the tube shell until the notch wraps around the outer periphery of the second step; the first step is used to support the circuit connection board; Light receiving chips are arranged on the second step surface in the form of an array, and the light receiving chips are electrically connected to the first side wall or to the surface of the second side wall; The TIA is disposed on the second step surface and between the connection surface and the light receiving chip. The TIA is electrically connected to the light receiving chip and is electrically connected to the surface of the connection surface.

2. The optical module according to claim 1, It is characterized in that The light receiving component also includes: An optical demultiplexing component, disposed on the surface of the fourth step, for decomposing an optical signal transmitted to the tube shell into multiple optical signals; A lens, disposed on the surface of the third step, for converging the multiple light signals respectively; a reflector, arranged in the light emitting direction of the lens, the reflector is not located on the bottom surface of the tube shell, the reflector comprises a light incident surface, an inclined surface, and a light emitting surface, the light incident surface faces the lens, the inclined surface is used to reflect the light signal transmitted from the lens, and the light emitting surface faces the second step; The light receiving chip faces the reflector, and a preset distance is formed between the surface of the light receiving chip and the light emitting surface of the reflector to meet the working distance of the lens; the light receiving chips are arranged in an array to receive each light signal reflected by the reflector and convert the light signal into an electrical signal; wherein the focal length of the lens is such that the light signal transmitted from the lens is reflected by the reflector and then focused on the surface of the light receiving chip; The surface of the TIA is flush with the surface of the circuit connection board; The second step has a preset height so that the TIA surface is flush with the circuit connection board surface; the third step has a preset height to meet the working distance of the lens and make the optical axis of the lens and the optical axis of the optical demultiplexing component on the same axis; the fourth step has a preset height so that the optical axis of the optical demultiplexing component and the optical port of the optical module are on the same axis.

3. The optical module according to claim 2, It is characterized in that The lens includes a first lens, the reflector includes a first reflector, and a first inclined surface is formed on a surface of the first reflector; The light emitting surface of the first lens is connected to the light incident surface of the first reflector by optical glue.

4. The optical module according to claim 3, It is characterized in that The lens includes a second lens, the reflector includes a second reflector, and a second inclined surface is formed on the surface of the second reflector; the second lens and the second reflector are arranged separately; and the central axis of the second inclined surface is on the same axis as the central axis of the first inclined surface; A first supporting protrusion and a second supporting protrusion are respectively formed at the interface between the second step and the third step, and the first supporting protrusion and the second supporting protrusion are used to support the second reflector; The first supporting protrusion and the second supporting protrusion have preset heights respectively, so that the central axis of the second inclined surface and the optical axis of the second lens are on the same axis.

5. The optical module according to claim 4, It is characterized in that A first clamping groove is formed on the surface of the first supporting protrusion, and a second clamping groove is formed on the surface of the second supporting protrusion; The first clamping groove and the second clamping groove are respectively clamped on both sides of the interface between the second step and the third step.

6. The optical module according to claim 4, It is characterized in that The dimension of the first reflector along the height direction of the tube shell is greater than the dimension of the second reflector along the height direction of the tube shell; The distance from the first reflector to the corresponding light receiving chip is smaller than the distance from the second reflector to the corresponding light receiving chip.

7. The optical module according to claim 3, It is characterized in that The bottom surface of the first lens and the bottom surface of the reflector are on the same surface; Or, the bottom surface of the first lens is lower than the bottom surface of the reflector to prevent glue from overflowing to the bottom surface of the reflector when the first lens is attached; Alternatively, the bottom surface of the first lens is higher than the bottom surface of the reflector, so as to increase the distance between the reflector and the light receiving chip.

8. The optical module according to claim 1, It is characterized in that The circuit connection board is the circuit board of the optical module; or, the circuit connection board is a flexible circuit board, one end of the flexible circuit board extends into the tube shell, and the other end is electrically connected to the circuit board of the optical module; or, the circuit connection board is a printed circuit board, one end of the printed circuit board extends into the tube shell, and the other end is electrically connected to the circuit board of the optical module; or, the circuit connection board is a ceramic connection board, one end of the ceramic connection board extends into the tube shell, and the other end is electrically connected to the circuit board of the optical module through a flexible circuit board.

9. The optical module according to claim 4, It is characterized in that Surfaces of the first supporting protrusion and the second supporting protrusion are higher than a surface of the third step.

10. The optical module according to claim 3, It is characterized in that The light incident surface of the first lens is a curved surface, and the light emitting surface is a flat surface.

Images