Spraying equipment and method for spacers and liquid crystal display panel

Abstract

The invention provides a spacer scattering device and method and a liquid crystal display panel, the spacer scattering device comprises a filler box, the bottom of the filler box is a sieve plate, the sieve plate is provided with a plurality of sieve hole assemblies for spacers to pass through, and the aperture of the sieve hole assemblies is adjustable; the at least one first connecting rod extends in the first direction, and each first connecting rod is movably connected with the at least one sieve hole assembly; the at least one second connecting rod extends in the second direction, and each second connecting rod is movably connected with the at least one first connecting rod; wherein the first direction is perpendicular to the second direction. According to the invention, the spacers can be dispersed on the surface of the substrate according to the preset dispersion density, so that the uniformity of the spacers is improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a spacer dispersing device and method, and a liquid crystal display panel. Background Art

[0002] The liquid crystal display panel includes upper and lower substrates and spacers between the substrates, and the spacers support the upper and lower substrates. Evenly distributing ball spacers between the upper and lower substrates of the liquid crystal display panel can effectively control the uniformity of the thickness of the liquid crystal display panel.

[0003] In the related art, the spacers of the liquid crystal display panel are usually spread by dry spraying or wet spraying, and the spreading principle is random spraying. However, due to the influence of gravity, the spreading density of the spacers is difficult to control and the uniformity is poor.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present invention, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0005] In view of this, an object of the present invention is to provide a spacer dispersing device and method, and a liquid crystal display panel, so as to at least solve the problem that the spacer dispersing density and uniformity are both poor.

[0006] In one aspect, an embodiment of the present invention provides a spacer spreading device, comprising: a stuffing box, the bottom of the stuffing box is a sieve plate, the sieve plate has a plurality of sieve hole assemblies for the spacers to pass through, and the aperture of the sieve hole assemblies is adjustable; at least one first connecting rod, the first connecting rod extends along a first direction, and each first connecting rod is movably connected to at least one sieve hole assembly; at least one second connecting rod, the second connecting rod extends along a second direction, and each second connecting rod is movably connected to at least one first connecting rod; wherein the first direction is perpendicular to the second direction.

[0007] On the other hand, an embodiment of the present invention also provides a method for spreading spacers, using the above-mentioned spacer spreading equipment, including: providing an array substrate; positioning a filling box on the array substrate; adjusting the position of the sieve assembly by a first connecting rod and a second connecting rod, and adjusting the aperture of the sieve assembly to allow the spacers to fall onto the array substrate.

[0008] In another aspect, an embodiment of the present invention further provides a liquid crystal display panel, which is prepared using the above-mentioned spacer dispersing method.

[0009] The spacer dispersing device and method and the liquid crystal display panel of the present invention contain the spacers through a stuffing box. The sieve hole assembly on the sieve plate of the stuffing box is used to allow the spacers to pass through the sieve plate. The aperture size of the sieve hole assembly controls the spacers to pass through the sieve hole assembly and finally fall on the substrate. The position of the sieve hole assembly is controlled by the first connecting rod and the second connecting rod, so that the spacers can be dispersed on the surface of the substrate according to a preset scattering density, thereby improving the uniformity of the spacers. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The accompanying drawings herein are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present invention, and together with the specification are used to explain the principles of the present invention. Obviously, the accompanying drawings described below are only some embodiments of the present invention, and for those of ordinary skill in the art, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

[0011] Figures 1 to 3 This is a schematic diagram of a dry spraying process for a spacer in the related art;

[0012] Figure 4 It is a schematic diagram of a wet spraying spreading process of a spacer in the related art;

[0013] Figure 5 It is a schematic diagram of the dispersion of a small-particle spacer in the related art;

[0014] Figure 6 This is a schematic diagram of the dispersion of a large-particle spacer in the related art;

[0015] Figure 7 It is a structural schematic diagram of a spacer dispersing device provided by an embodiment of the present invention;

[0016] Figure 8 yes Figure 7 Schematic diagram of the middle sieve assembly in a closed state;

[0017] Fig. 9 yes Figure 7 Schematic diagram of the middle sieve assembly in the open state;

[0018] Fig.10 yes Figure 7 Schematic diagram of the middle stuffing box;

[0019] Fig.11 yes Fig.10 Top view of the middle stuffing box;

[0020] Fig.12 is a schematic structural diagram of another sieve assembly provided by an embodiment of the present invention;

[0021] Fig.13 yes Fig.12Schematic diagram of the neutron screen assembly in the closed state;

[0022] Fig.14 yes Fig.12 Schematic diagram of the neutron screen assembly in the open state;

[0023] Fig.15 is a schematic diagram of another sieve assembly in an open state provided by an embodiment of the present invention;

[0024] Fig.16 is a schematic structural diagram of another spacer dispersing device provided by an embodiment of the present invention;

[0025] Fig.17 is a flow chart of steps of a method for spreading spacers provided by an embodiment of the present invention;

[0026] Fig.18 is a schematic diagram of an open state of a sub-sieve hole assembly provided by an embodiment of the present invention;

[0027] Fig.19 is a schematic diagram of a sieve assembly in an open state provided by an embodiment of the present invention;

[0028] Fig. 20 is a flowchart of another method for distributing spacers provided by an embodiment of the present invention;

[0029] Fig.21 It is a structural schematic diagram of a liquid crystal display panel provided by an embodiment of the present invention.

[0030] Reference numerals:

[0031] 10. Stuffing box;

[0032] 11. Screen plate;

[0033] 12. Sieve hole assembly;

[0034] 121, leaves;

[0035] 122. Sub-sieve assembly;

[0036] 123, cotyledon;

[0037] 20. First connecting rod;

[0038] 30. Second connecting rod;

[0039] 40. Spacers;

[0040] 50. Feed inlet;

[0041] 60. Air inlet;

[0042] X, first direction;

[0043] Y, second direction;

[0044] 100. Liquid crystal display panel;

[0045] 110. Array substrate. DETAILED DESCRIPTION

[0046] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted.

[0047] The words "first", "second" and the like used in the specific description do not indicate any order, quantity or importance, but are only used to distinguish different components. In addition, in the description of the present invention, the orientation or position relationship indicated by the terms "upper" and "lower" are based on the orientation or position relationship shown in the drawings, which are only for the convenience of description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

[0048] It should be noted that, in the absence of conflict, the embodiments of the present invention and features in different embodiments may be combined with each other.

[0049] In the related art, the spacers 40 of the liquid crystal display panel are usually dispersed by dry spraying or wet spraying, and the dispersion principle is random spraying.

[0050] like Figures 1 to 3 As shown, in the dry spraying method, the spacer 40 enters the feeding device through the spacer inlet 10', and the spacer 40 is transported by the roller inside the feeding device, transmitted through the guide pipe 20' and charged before being evenly sprayed on the surface of the substrate 30'. However, because the spacer 40 is affected by gravity, its spreading density cannot be guaranteed during the spreading process, and the uniformity is poor.

[0051] like Figure 4 As shown, in the wet spraying method, the spacers 40 and the organic solvent are mixed into a suspension liquid and then sprayed on the surface of the substrate 30' through a nozzle 40', and the spacers 40 are evenly distributed on the surface of the substrate 30' after baking to volatilize the solvent. However, since the spacers 40 are affected by gravity, the spacers 40 cannot be evenly dispersed in the organic solvent by general organic solvents, and there is a phenomenon of sinking to the bottom, which seriously affects the dispersion density and uniformity.

[0052] The inventor of this case has conducted a detailed and in-depth study and provided a spacer dispersing device and method, and a liquid crystal display panel for the problems existing in the related art. The spacer dispersing device includes: a stuffing box, the bottom of which is a sieve plate, the sieve plate has a plurality of sieve hole components for the spacers to pass through, and the aperture of the sieve hole components is adjustable; at least one first connecting rod, the first connecting rod extends along a first direction, and each first connecting rod is movably connected to at least one sieve hole component; at least one second connecting rod, the second connecting rod extends along a second direction, and each second connecting rod is movably connected to at least one first connecting rod; wherein the first direction is perpendicular to the second direction. The present invention accommodates the spacers through the stuffing box, and the sieve hole component on the sieve plate of the stuffing box is used to allow the spacers to pass through the sieve plate, and the aperture size of the sieve hole component controls the spacers to pass through the sieve hole component and finally fall on the substrate, and the position of the sieve hole component is controlled by the first connecting rod and the second connecting rod, so that the spacers can be dispersed on the surface of the substrate according to the preset dispersion density, thereby improving the uniformity of the spacers.

[0053] like Figure 5 As shown, in one aspect, an embodiment of the present invention provides a spacer spreading device, comprising: a stuffing box 10, at least one first connecting rod 20 and at least one second connecting rod 30.

[0054] Specifically, the bottom of the stuffing box 10 is a sieve plate 11, and the sieve plate 11 has a plurality of sieve hole components 12 for the spacers 40 to pass through. It should be noted that the stuffing box 10 accommodates the spacers 40, and the spacers 40 only need to be roughly evenly distributed in the stuffing box 10, so that each sieve hole component 12 has a spacer 40, so that when the sieve hole component 12 is opened, the spacers 40 can pass through the sieve hole component 12, and it is not necessary to maintain a high uniformity.

[0055] like Figure 6 and Figure 7 As shown, further, the aperture of the sieve assembly 12 is adjustable. It should be noted that when it is necessary to prevent the spacer 40 from passing through the sieve assembly 12, the aperture of the sieve assembly 12 is adjusted to be smaller than the particle size of the spacer 40, or the sieve assembly 12 is completely closed; when it is necessary to allow the spacer 40 to pass through the sieve holes of the sieve assembly 12 to fall on the substrate surface, the aperture of the sieve assembly 12 is adjusted to be larger than the particle size of the spacer 40.

[0056] Continue to refer Figure 5Specifically, the first connecting rod 20 extends along the first direction X, and each first connecting rod 20 is movably connected to at least one sieve assembly 12. The first connecting rod 20 is used to control the position of the sieve assembly 12 along the first direction X, so that the spacers 40 can be distributed on the substrate surface along the first direction X according to a preset distribution density, thereby improving the uniformity of the spacers 40. The number of the first connecting rods 20 can be determined according to the required distribution density of the spacers 40. The first direction X can be the length direction of the sieve plate 11, and the present application does not limit this.

[0057] Continue to refer Figure 5 Specifically, the second connecting rod 30 extends along the second direction Y, and each second connecting rod 30 is movably connected to at least one first connecting rod 20. The second connecting rod 30 is used to control the position of the sieve assembly 12 along the second direction Y, so that the spacers 40 can be distributed on the substrate surface along the second direction Y according to a preset distribution density, thereby improving the uniformity of the spacers 40. Among them, the number of second connecting rods 30 can be determined according to the required distribution density of the spacers 40. The second direction Y can be the width direction of the sieve plate 11, so that the first direction X is perpendicular to the second direction Y, and the present application does not limit this. In some other embodiments, the first direction X can also only intersect with the second direction Y but not be perpendicular, and it can also be achieved that the spacers 40 are distributed on the substrate surface according to a preset distribution density.

[0058] In some embodiments, the spacer dispersing device further includes: a first grating ruler and a second grating ruler. Specifically, the first grating ruler can extend along the first direction X to measure the first position information of the sieve assembly 12. The second grating ruler can extend along the second direction Y to measure the second position information of the sieve assembly 12. The present application can establish a plane rectangular coordinate system based on the plane of the array substrate where the spacer 40 is dispersed, and determine the first coordinate and the second coordinate in the plane rectangular coordinate system through the first position information and the second position information. That is, the sieve assembly 12 has a first coordinate corresponding to the first grating ruler, and a second coordinate corresponding to the second grating ruler. The adjustment of the first coordinate and the second coordinate of the sieve assembly 12 can be achieved by precisely adjusting the position of the sieve assembly 12 on the first connecting rod 20 and the second connecting rod 30 by a servo motor. By adjusting the first coordinate and the second coordinate of the sieve assembly 12, the spacer 40 can be dispersed on the substrate surface according to a preset dispersion density, thereby improving the uniformity of the spacer 40.

[0059] like Figure 8 and Fig. 9As shown, in some embodiments, the length of the array substrate 110 where the spacers 40 are spread along the first direction X is L1, and the length along the second direction Y is D1. The array substrate 110 and the stuffing box 10 are arranged in the same direction to facilitate the spreading of the spacers 40. The outer diameter of the mesh assembly 12 is R. The maximum range of variation of the first coordinate of the mesh assembly 12 is L, and the maximum range of variation of the second coordinate is D. The maximum range of variation of the coordinates of the mesh assembly 12 can be the length and width of the mesh plate 11 of the stuffing box 10. The number of mesh assemblies 12 connected to each first connecting rod 20 is N1, and the number of first connecting rods 20 connected to each second connecting rod 30 is N2. Among them, L>L1>N1*R, D>D1>N2*R. It can be understood that by making L>L1, the movement range of the mesh assembly 12 along the first direction X can be greater than the length of the array substrate 110 along the first direction X, that is, the spacers 40 can be completely spread on the array substrate 110 along the first direction X. Similarly, by making D>D1, the spacers 40 can be completely spread on the array substrate 110 along the second direction Y. In addition, N1*R is the minimum length required to set N1 mesh components 12 along the first direction X, and L1>N1*R, that is, the N1 mesh components 12 can be moved on the first connecting rod 20 to achieve the spacers 40 to be completely spread on the array substrate 110 along the first direction X. Similarly, by making D1>N2*R, the spacers 40 can be completely spread on the array substrate 110 along the second direction Y. In addition, along the first direction X, the maximum distance that each mesh component 12 can move can be L / N1, so that the spacers 40 can be spread in different regions along the first direction X, thereby improving the uniformity of the spacers 40. Similarly, along the second direction Y, the maximum distance that each mesh component 12 can move can be D / N2, so that the spacers 40 can be spread in different regions along the second direction Y, thereby improving the uniformity of the spacers 40.

[0060] In the field of 3D light field display, it is necessary to generate multi-viewpoint images through a liquid crystal display, which usually requires higher resolution and more precise optical control. The particle size of the spacer 40 will affect the arrangement of liquid crystal molecules and the thickness of the liquid crystal box, thereby affecting the optical properties of the display. If a 3D light field display requires a larger viewing angle or higher resolution, the thickness of the liquid crystal box needs to be increased, which also means that a spacer 40 with a larger particle size (20 to 100 μm) is required.

[0061] However, in the related art, whether the spacer 40 is sprayed by dry spraying or wet spraying, the spacer 40 is mainly used for small particle size (3 to 5.5 μm). Fig.10 As shown, however, the principle of the spreading of dry spray or wet spray is random spray spreading, and in addition, the spreading beam expansion angle is small during the random spray spreading process, and the position and uniformity of the small-size spacer 40 on the substrate 30' cannot be accurately controlled. Fig.11 As shown, for the spacers 40 with large particle size (20-100 μm), the large particle size of the spacers 40 is more susceptible to gravity, resulting in that the positions of the large particle size spacers 40 scattered on the substrate 30 ′ are more difficult to control and the uniformity is worse.

[0062] In response to the above problems, in some embodiments, the spacer dispersing device further includes: a control component. The aperture and opening time of each mesh component 12 can be individually adjusted by the control component. It should be noted that the adjustable aperture of the mesh component 12 can also be used to allow spacers 40 of a specific particle size to pass through the mesh component 12. By adjusting the size of the aperture, the spacer dispersing device can be used to disperse spacers 40 of different particle sizes, thereby improving the versatility of the spacer dispersing device of the present application. In addition, the opening time of the mesh component 12 is adjustable, which can be used to allow a preset number of spacers 40 to pass through the mesh component 12 within a preset time. Combined with the movement of each mesh component 12 along the first direction X and the second direction Y, it is possible to achieve the dispersion of a preset number of spacers 40 within a preset dispersion area, thereby achieving a preset dispersion density. In addition, the individual adjustment of each mesh component 12 can improve the control accuracy, thereby improving the dispersion accuracy of the spacers 40.

[0063] In some embodiments, the aperture range of the sieve assembly 12 can be 0 to 150 μm to meet the demand for large-particle spacers 4040 in scenarios such as 3D light field display, while taking into account the demand for small-particle spacers 4040 in other scenarios, thereby improving the versatility of the spacer dispersing device of the present application.

[0064] Continue to refer Figure 6 and Figure 7 In some embodiments, the mesh assembly 12 includes a plurality of spirally arranged blades 121, and the mesh assembly 12 adjusts the aperture size through the blades 121. Specifically, when it is necessary to allow the spacer 40 to pass through the mesh holes of the mesh assembly 12 to fall on the substrate surface, the plurality of spirally arranged blades 121 form a through hole in the center of the mesh assembly 12, and the aperture of the through hole is made larger than the particle size of the spacer 40, so that the spacer 40 can pass through the mesh assembly 12. Specifically, the aperture of the through hole can be made only slightly larger than the particle size of one spacer 40, so that only one spacer 40 can pass through the mesh assembly 12 at the same time, so that a preset number of spacers 40 can pass through the mesh assembly 12 within a preset time, thereby achieving a preset scattering density.

[0065] like Fig.12As shown, in some embodiments, the sieve assembly 12 includes at least one sub-sieve assembly 122 for the spacer 40 to pass through, and the sub-sieve assembly 122 passes through the blade 121. It should be noted that although the sieve assembly 12 can take into account both large-particle-size and small-particle-size spacers 40, each sieve assembly 12 has only one through hole for the spacer 40 to pass through. For the spacer 40 with a small particle size, in order to improve the dispersion efficiency, a sub-sieve assembly 122 can be set on the blade 121 of the sieve assembly 12 for the spacer 40 with a small particle size to pass through. Specifically, when it is necessary to allow the spacer 40 with a small particle size to pass through the sieve assembly 12, according to the needs of the dispersion efficiency, either the sieve assembly 12 can be opened alone, or the sub-sieve assembly 122 can be opened alone, or the sieve assembly 12 and the sub-sieve assembly 122 can be opened at the same time.

[0066] like Fig.13 and Fig.14 As shown, in some embodiments, the sub-sieve assembly 122 includes a plurality of spirally arranged sub-blades 123, and the sub-sieve assembly 122 adjusts the aperture size through the sub-blades 123. Specifically, the structural arrangement of the sub-sieve assembly 122 can be the same as that of the sieve assembly 12, but the size is smaller. The number of sub-sieve assemblies 122 of each sieve assembly 12 can be selected according to specific scattering needs, and the present application does not limit this.

[0067] In some embodiments, the pore size of the sub-sieve assembly 122 may range from 0 to 10 μm to meet the requirements for small-sized spacers 40. The pore size of each sub-sieve assembly 122 may be the same to simplify the manufacturing cost.

[0068] like Fig.15 As shown, in some embodiments, the blades 121 are tilted downward along the direction from the edge to the center of the sieve assembly 12. Specifically, the blades 121 are tilted downward so that the spacers 40 can be arranged near the through holes of the opened sieve assembly 12 by gravity, so that when the through holes of the sieve assembly 12 are opened, the spacers 40 can pass through the through holes quickly by gravity.

[0069] In some embodiments, the sub-blades 123 are tilted downward from the edge of the sub-sieve assembly 122 to the center. That is, the sub-blades 123 of the sub-sieve assembly 122 are arranged in the same manner as the blades 121 of the sieve assembly 12, so that the spacer 40 passes through the sub-sieve assembly 122 quickly under the action of gravity.

[0070] In some embodiments, the spacer 40 may be spherical so as to be able to slide into the through hole of the sieve assembly 12 or the sub-sieve assembly 122 by tilting the blade 121 or the sub-blade 123 .

[0071] like Fig.16As shown, in some embodiments, the spacer dispersing device further includes: a feed port 50 and an air inlet 60. The feed port 50 is located at the top of the stuffing box 10, and is used to put the spacer 40 into the stuffing box 10. The air inlet 60 is located on the side of the stuffing box 10, and the air inlet 60 is used to introduce CDA gas (Clean Dry Air) after the spacer 40 is put into the stuffing box 10 through the feed port 50, so that the internal spacer 40 is evenly distributed on the sieve plate 11, so that when the sieve hole assembly 12 is opened later, the spacer 40 can quickly pass through the sieve plate 11.

[0072] In summary, the spacer spreading device of the present invention accommodates the spacer 40 through the stuffing box 10, and the sieve hole assembly 12 on the sieve plate 11 of the stuffing box 10 is used to allow the spacer 40 to pass through the sieve plate 11, and the aperture size of the sieve hole assembly 12 controls the spacer 40 to pass through the sieve hole assembly 12 and finally fall on the substrate, and the position of the sieve hole assembly 12 is controlled by the first connecting rod 20 and the second connecting rod 30, so that the spacer 40 can be scattered on the surface of the substrate according to the preset scattering density, thereby improving the uniformity of the spacer 40.

[0073] like Fig.17 As shown, on the other hand, an embodiment of the present invention further provides a method for spreading spacers 40, using the above-mentioned spacer spreading device, comprising:

[0074] S110, providing an array substrate;

[0075] S120, positioning the stuffing box 10 on the array substrate;

[0076] S130 , adjusting the position of the mesh assembly 12 by the first connecting rod 20 and the second connecting rod 30 , and adjusting the aperture of the mesh assembly 12 to allow the spacer 40 to fall onto the array substrate.

[0077] Continue to refer Figure 8 and Fig. 9, for the above step S120, specifically, the array substrate and the stuffing box 10 can be arranged in the same direction, and the stuffing box 10 can accommodate the spacer 40. The sieve assembly 12 on the sieve plate 11 of the stuffing box 10 is used to allow the spacer 40 to pass through the sieve plate 11, and the pore size of the sieve assembly 12 controls the spacer 40 to pass through the sieve assembly 12 and finally fall on the substrate, so as to facilitate the spreading of the spacer 40. Further, the length of the array substrate where the spacer 40 is spread along the first direction X is L1, and the length along the second direction Y is D1. The maximum range of change of the first coordinate of the sieve assembly 12 is L, and the maximum range of change of the second coordinate is D. It can be understood that, by making L>L1, the movement range of the sieve assembly 12 along the first direction X can be achieved to be greater than the length of the array substrate along the first direction X, that is, the spacer 40 can be completely spread on the array substrate along the first direction X. Similarly, by making D>D1, the spacer 40 can be completely spread on the array substrate along the second direction Y.

[0078] Continue to refer Figure 8 and Fig. 9 For the above step S130, the position of the sieve assembly 12 is controlled by the first connecting rod 20 and the second connecting rod 30, so that the spacers 40 can be scattered on the substrate surface according to the preset scattering density, thereby improving the uniformity of the spacers 40. Specifically, the outer diameter of the sieve assembly 12 can be set to R. The maximum variation range of the coordinates of the sieve assembly 12 can be the length and width of the sieve plate 11 of the stuffing box 10. The number of sieve assemblies 12 connected to each first connecting rod 20 is N1, and the number of first connecting rods 20 connected to each second connecting rod 30 is N2. Then, N1*R is the minimum length required to set N1 sieve assemblies 12 along the first direction X, so that L1>N1*R, that is, N1 sieve assemblies 12 can be moved on the first connecting rod 20 to achieve the complete scattering of the spacers 40 on the array substrate along the first direction X. Similarly, D1>N2*R is made to achieve the complete scattering of the spacers 40 on the array substrate along the second direction Y.

[0079] It is worth noting that S110 to S130 are merely step numbers, which are used to facilitate reference and avoid text duplication. Unless otherwise specified, the above step numbers do not limit the order of implementation of the various steps of the method. In other embodiments, the above steps of the method can also be written in an interchangeable order, and the present application does not limit this.

[0080] like Fig.18 and Fig.19 As shown, in some embodiments, in step S130, adjusting the aperture of the sieve assembly 12 to allow the spacer 40 to fall onto the array substrate includes:

[0081] If the particle size D2 of the spacer 40 is less than or equal to 10 μm, the blade 121 of the sieve assembly 12 is closed, the sub-blade 123 of the sub-sieve assembly 122 is opened, and the aperture A1 of the sub-sieve assembly 122 is adjusted to satisfy: D2<A1<1.05*D2;

[0082] If the particle size D2 of the spacer 40 is greater than 10 μm, the sub-blade 123 of the sub-sieve assembly 122 is closed, the blade 121 of the sieve assembly 12 is opened, and the aperture A2 of the sieve assembly 12 is adjusted to satisfy: 1.05*D2<A2<1.1*D2;

[0083] The sieve assembly 12 includes at least one sub-sieve assembly 122 for the spacer 40 to pass through.

[0084] Specifically, by differentiating the particle size of the spacer 40 to open the sieve assembly 12 or the sub-sieve assembly 122 respectively, the scattering efficiency of the spacer 40 can be improved for the spacers 40 of different particle sizes. By making D2<A1<1.05*D2 ​​and 1.05*D2<A2<1.1*D2, it can be achieved that the aperture of the through hole of the sub-sieve assembly 122 or the sieve assembly 12 is only slightly larger than the particle size of one spacer 40, so that only one spacer 40 can pass through the sieve assembly 12 at the same time, so that a preset number of spacers 40 can pass through the sieve assembly 12 within a preset time, thereby achieving a preset scattering density.

[0085] Continue to refer Fig.18 and Fig.19 In some embodiments, step S130 further includes: according to a preset density ρ of the spacer 40, controlling the opening time t of the sieve assembly 12 to satisfy: t=ρt0 / n0; wherein t0 is the measurement duration, and n0 is the number of spacers 40 passing through the sieve assembly 12 within the measurement duration.

[0086] Specifically, if the required distribution density of the spacers 40 is ρ pieces / mm2, the aperture opening time t can be controlled to satisfy: t=ρt0 / n0, and the grating position moves 1 mm each time, so the number of spacers 40 distributed per mm2 can be accurately controlled.

[0087] like Fig. 20 As shown, in some embodiments, after step S120 and before step S130, the process further includes:

[0088] S140, adding a spacer 40 into the stuffing box 10 through the feed port 50;

[0089] S150 , clean dry air is introduced into the stuffing box 10 through the air inlet 60 , so that the spacers 40 are evenly distributed on the sieve plate 11 .

[0090] Specifically, the feed port 50 is located at the top of the stuffing box 10, and is used to put the spacer 40 into the stuffing box 10. The air inlet 60 is located at the side of the stuffing box 10, and is used to introduce CDA gas (Clean Dry Air) after the spacer 40 is put into the stuffing box 10 through the feed port 50, so that the internal spacer 40 is evenly distributed on the sieve plate 11, so that when the sieve hole assembly 12 is opened later, the spacer 40 can quickly pass through the sieve plate 11.

[0091] In summary, the method for scattering spacers 40 of the present invention contains spacers 40 through a stuffing box 10, and the sieve hole assembly 12 on the sieve plate 11 of the stuffing box 10 is used to allow the spacers 40 to pass through the sieve plate 11, and the aperture size of the sieve hole assembly 12 controls the spacers 40 to pass through the sieve hole assembly 12 and finally fall on the substrate, and the position of the sieve hole assembly 12 is controlled by the first connecting rod 20 and the second connecting rod 30, so that the spacers 40 can be scattered on the surface of the substrate according to a preset scattering density, thereby improving the uniformity of the spacers 40.

[0092] like Fig.21 As shown, on the other hand, an embodiment of the present invention further provides a liquid crystal display panel 100, which is prepared using the above-mentioned spacer scattering method. The liquid crystal display panel 100 can be used for: vehicle display screens, mobile phones, tablet computers, televisions, monitors, laptops, digital photo frames, navigators, and any other products or components with display functions, or 3D light field display devices. The specific implementation and technical effects of the liquid crystal display panel 100 can be referred to the specific embodiments of the above-mentioned spacer scattering device and method, and the repeated parts will not be repeated.

[0093] In summary, the spacer scattering device and method and the liquid crystal display panel of the present invention accommodate spacers through a stuffing box, and the sieve hole assembly on the sieve plate of the stuffing box is used to allow the spacers to pass through the sieve plate. The aperture size of the sieve hole assembly controls the spacers to pass through the sieve hole assembly and finally fall on the substrate. The position of the sieve hole assembly is controlled by the first connecting rod and the second connecting rod, so that the spacers can be scattered on the surface of the substrate according to a preset scattering density, thereby improving the uniformity of the spacers.

[0094] The above contents are further detailed descriptions of the present invention in combination with specific optional implementation methods, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the scope of protection of the present invention.

Claims

1. A spacer dispersing device, characterized in that: include: A stuffing box, wherein the bottom of the stuffing box is a sieve plate, the sieve plate has a plurality of sieve hole components for the spacers to pass through, and the aperture of the sieve hole components is adjustable; at least one first connecting rod, the first connecting rod extending in a first direction, each of the first connecting rods being movably connected to at least one of the sieve assembly; At least one second connecting rod, the second connecting rod extends along a second direction, and each of the second connecting rods is movably connected to at least one of the first connecting rods; wherein the first direction is perpendicular to the second direction.

2. The spacer dispersing device according to claim 1, characterized in that: Also includes: a first grating ruler, the first grating ruler extending along the first direction; a second grating ruler, wherein the second grating ruler extends along the second direction; Wherein, in a coordinate system established based on a plane where the array substrate on which the spacers are scattered is located, the sieve hole assembly has a first coordinate corresponding to the first grating ruler and a second coordinate corresponding to the second grating ruler.

3. The spacer dispersing device according to claim 2, characterized in that: The length of the array substrate along the first direction is L1, and the length along the second direction is D1; The outer diameter of the sieve assembly is R; the maximum variation range of the first coordinate of the sieve assembly is L, and the maximum variation range of the second coordinate is D; The number of the sieve hole assemblies connected to each of the first connecting rods is N1, and the number of the first connecting rods connected to each of the second connecting rods is N2; Among them, L>L1>N1*R, D>D1>N2*R.

4. The spacer dispersing device according to claim 1, characterized in that: Also includes: A control component, the aperture and opening time of each sieve hole component can be adjusted individually through the control component.

5. The spacer dispersing device according to claim 1, characterized in that: The pore size of the sieve assembly ranges from 0 to 150 μm.

6. The spacer dispersing device according to claim 1, characterized in that: The sieve hole assembly comprises a plurality of spirally arranged blades, and the sieve hole assembly is used to adjust the aperture size through the blades.

7. The spacer dispersing device according to claim 6, characterized in that: The sieve hole assembly includes at least one sub-sieve hole assembly for the spacer to pass through, and the sub-sieve hole assembly passes through the blade; The sub-sieve assembly comprises a plurality of spirally arranged sub-blades, and the sub-sieve assembly adjusts the aperture size through the sub-blades.

8. The spacer dispersing device according to claim 7, characterized in that: The pore size of the sub-sieve assembly ranges from 0 to 10 μm.

9. The spacer dispersing device according to claim 6, characterized in that: The blades are inclined downward along the direction from the edge of the sieve assembly to the center.

10. The spacer dispersing device according to claim 1, characterized in that: Also includes: A feed inlet, the feed inlet being located at the top of the stuffing box; An air inlet is located on a side of the stuffing box.

11. A method for spreading spacers, using the spacer spreading device according to any one of claims 1 to 10, characterized in that: include: Providing an array substrate; Positioning a stuffing box on the array substrate; The position of the mesh assembly is adjusted by the first connecting rod and the second connecting rod, and the aperture of the mesh assembly is adjusted to allow the spacers to fall onto the array substrate.

12. The method for spreading spacers according to claim 11, characterized in that: The step of adjusting the aperture of the sieve assembly so that the spacer falls onto the array substrate comprises: If the particle size D2 of the spacer is ≤10 μm, close the blades of the sieve assembly, open the sub-blades of the sub-sieve assembly, and adjust the aperture A1 of the sub-sieve assembly to satisfy: D2<A1<1.05*D2; If the particle size D2 of the spacer is greater than 10 μm, the sub-blades of the sub-sieve assembly are closed, the blades of the sieve assembly are opened, and the aperture A2 of the sieve assembly is adjusted to satisfy: 1.05*D2<A2<1.1*D2; Wherein, the sieve hole assembly includes at least one sub-sieve hole assembly for the spacer to pass through.

13. The method for spreading spacers according to claim 11, characterized in that: The method of adjusting the position of the sieve assembly by the first connecting rod and the second connecting rod, and adjusting the sieve assembly so that the spacer falls to the array substrate, further comprises: According to the preset density ρ of the spacer, the opening time t of the sieve assembly is controlled to satisfy: t=ρt0 / n0; wherein t0 is the measurement duration, and n0 is the number of the spacers passing through the sieve assembly within the measurement duration.

14. The method for spreading spacers according to claim 11, characterized in that: After positioning the stuffing box on the array substrate, adjusting the position of the sieve assembly by the first connecting rod and the second connecting rod, and adjusting the sieve assembly so that the spacer falls before the array substrate, further comprising: Adding the spacer into the stuffing box through a feed port; Clean dry air is introduced into the stuffing box through the air inlet to make the spacers evenly distributed on the sieve plate.

15. A liquid crystal display panel, characterized in that: The spacer is prepared by using the spacer dispersing method according to any one of claims 11 to 14.

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