Power management system, method and device, electronic equipment and readable storage medium

Abstract

The invention discloses a power management system, method and device, electronic equipment and a readable storage medium, and belongs to the technical field of electronic equipment. The power management system comprises a first chip and a second chip; the relay chip is connected with the first chip and the second chip, and the relay chip is used for transmitting the first power supply instruction sequence output by the first chip to the second chip in an unvarnished mode; wherein the relay chip obtains scene information of an application scene where the electronic equipment is located and first operation information of the first chip and the second chip; in the process that the relay chip transmits the first power supply instruction sequence in an unvarnished mode, the relay chip monitors the first power supply instruction sequence; the relay chip trains a power management strategy according to the scene information, the first operation information and the first power supply instruction sequence; and the relay chip stops transmitting the first power supply instruction sequence to the second chip, and transmits the second power supply instruction sequence to the second chip based on the power management strategy.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to a power management system, method, device, electronic equipment and readable storage medium. Background Art

[0002] The power management system of an electronic device usually manages the power of hardware systems such as the processor subsystem, graphics processor subsystem and storage subsystem. For example, it performs AVS (Adaptive Voltage Scaling) and DVFS (Dynamic Voltage and Frequency Scaling) adjustments. Taking into account the performance, power consumption and stability of the electronic device system, the power management system needs to be customized, optimized and controlled in specific scenarios.

[0003] In related technologies, since the underlying design of power management is implemented in a closed-loop manner by major platform manufacturers and has a low degree of openness, it is difficult to customize power management strategies. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a power management system, method, device, electronic device and readable storage medium, which solve the problem of high difficulty in customizing power management strategies.

[0005] In a first aspect, an embodiment of the present application provides a power management system, which is applied to an electronic device, and the power management system includes: a first chip and a second chip; a relay chip, the relay chip is connected to the first chip and the second chip, and the relay chip is used to transparently transmit a first power supply instruction sequence output by the first chip to the second chip; wherein the relay chip obtains scene information of an application scene in which the electronic device is located, and first operating information of the first chip and the second chip; in the process of the relay chip transparently transmitting the first power supply instruction sequence, the relay chip monitors the first power supply instruction sequence; the relay chip trains a power management strategy according to the scene information, the first operating information and the first power supply instruction sequence; the relay chip stops transparently transmitting the first power supply instruction sequence to the second chip, and transmits the second power supply instruction sequence to the second chip based on the power management strategy.

[0006] In a second aspect, an embodiment of the present application provides a power management method, which is applied to the power management system in the above-mentioned first aspect, and the power management method includes: the relay chip obtains scenario information of the application scenario of the electronic device, and first operating information of the first chip and the second chip; in the process of the relay chip transparently transmitting the first power supply instruction sequence, the relay chip monitors the first power supply instruction sequence, and the first power supply instruction sequence includes an instruction sequence transmitted from the first chip to the second chip; the relay chip trains the power management strategy according to the scenario information, the first operating information and the first power supply instruction sequence; the relay chip stops transparently transmitting the first power supply instruction sequence to the second chip, and transmits the second power supply instruction sequence to the second chip based on the power management strategy.

[0007] In a third aspect, an embodiment of the present application provides a power management device, which is applied to the power management system in the first aspect above, and the power management device includes: an acquisition module, which is used for the relay chip to obtain scene information of the application scenario of the electronic device, and first operation information of the first chip and the second chip; a monitoring module, which is used for the relay chip to monitor the first power supply instruction sequence during the process of the relay chip transparently transmitting the first power supply instruction sequence, and the first power supply instruction sequence includes an instruction sequence transmitted from the first chip to the second chip; a training module, which is used for the relay chip to train the power management strategy according to the scene information, the first operation information and the first power supply instruction sequence; a transmission module, which is used for the relay chip to stop transparently transmitting the first power supply instruction sequence to the second chip, and transmit the second power supply instruction sequence to the second chip based on the power management strategy.

[0008] In a fourth aspect, an embodiment of the present application provides an electronic device, including a processor and a memory, wherein the memory stores programs or instructions that can be executed on the processor, and when the programs or instructions are executed by the processor, the steps of the method of the second aspect are implemented.

[0009] In a fifth aspect, an embodiment of the present application provides a readable storage medium, on which a program or instruction is stored, and when the program or instruction is executed by a processor, the steps of the method of the second aspect are implemented.

[0010] In a sixth aspect, an embodiment of the present application provides a chip, comprising a processor and a communication interface, wherein the communication interface is coupled to the processor, and the processor is used to run programs or instructions to implement the steps of the method of the second aspect.

[0011] In a seventh aspect, an embodiment of the present application provides a computer program product, which is stored in a storage medium and is executed by at least one processor to implement the method of the second aspect.

[0012] In an embodiment of the present application, a relay chip is provided between the first chip and the second chip, and the first power supply instruction sequence issued by the first chip to the second chip can be transparently transmitted through the relay chip, so that the second chip can perform power management on the hardware system according to the first power supply instruction sequence issued by the first chip. The relay chip can also generate a power management policy based on the scene information of the electronic device, the first operation information of the first chip and the second chip, and the first power supply instruction obtained by monitoring. When the second chip initiates a power management request, the relay chip can shield the first power supply instruction sequence issued by the first chip, and send the second power supply instruction sequence to the second chip based on the power management policy to perform power management on the hardware system. When the hardware system has special voltage regulation requirements, the relay chip can find the optimal power management policy for performance and power consumption, provide custom power management policies for each hardware system, support various scenario requirements of the hardware system, and reduce the difficulty of customizing the power management policy. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A schematic diagram of the structure of a power management system provided in some embodiments of the present application is shown;

[0014] Figure 2 A flowchart of a power management method provided in some embodiments of the present application is shown;

[0015] Figure 3 A flow chart showing the internal processing flow of a relay chip provided in some embodiments of the present application;

[0016] Figure 4 A schematic diagram of application scenarios provided in some embodiments of the present application is shown;

[0017] Figure 5 One of the instruction sequence schematic diagrams provided in some embodiments of the present application is shown;

[0018] Figure 6 One of the graphs of current and voltage changing over time provided in some embodiments of the present application is shown;

[0019] Figure 7 The second schematic diagram of the instruction sequence provided in some embodiments of the present application is shown;

[0020] Figure 8 A second graph showing the change of current and voltage over time provided in some embodiments of the present application;

[0021] Fig. 9 A schematic block diagram of a power management device provided in some embodiments of the present application is shown;

[0022] Fig.10A structural block diagram of an electronic device according to an embodiment of the present application is shown;

[0023] Fig.11 A schematic diagram of the hardware structure of an electronic device provided in some embodiments of the present application is shown.

[0024] Figure 1 The reference numerals in the figures are as follows:

[0025] 100 power management system, 110 first chip, 120 second chip, 130 relay chip, 132 transmission component, 1322 first interface, 1324 second interface, 1326 third interface, 1328 fourth interface, 134 training component. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0027] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way are interchangeable where appropriate, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0028] The following is combined with Figures 1 to 11 , the power management system, method, device, electronic device and readable storage medium provided in the embodiments of the present application are described in detail through specific embodiments and their application scenarios.

[0029] In some embodiments of the present application, a power management system is provided, which is applied to electronic equipment. Figure 1 FIG. 4 shows a structural block diagram of a power management system provided in some embodiments of the present application. Figure 1As shown, the power management system 100 includes: a first chip 110, a second chip 120 and a relay chip 130, the second chip 120 is used to perform power management on the hardware system, the relay chip 130 is connected to the first chip 110 and the second chip 120, and the relay chip 130 is used to transparently transmit the first power supply instruction sequence output by the first chip 110 to the second chip 120; wherein the relay chip 130 obtains scene information of the application scene of the electronic device, and first operation information of the first chip 110 and the second chip 120; in the process of the relay chip 130 transparently transmitting the first power supply instruction sequence, the relay chip 130 monitors the first power supply instruction sequence; the relay chip 130 generates a power management strategy according to the scene information, the first operation information and the first power supply instruction sequence; the relay chip 130 stops transparently transmitting the first power supply instruction sequence to the second chip 120, and transmits the second power supply instruction sequence to the second chip 120 based on the power management strategy.

[0030] In the embodiment of the present application, the first chip 110 is used to initiate a voltage adjustment instruction, or to respond to a voltage configuration request of the second chip 120. The relay chip 130 is connected between the first chip 110 and the second chip 120. The relay chip 130 can transmit the first power supply instruction sequence output by the first chip 110 to the second chip 120, that is, the second chip 120 is communicatively connected with the first chip 110 through the relay chip 130. The first chip 110, the relay chip 130 and the second chip 120 are connected through an SPMI (Serial Peripheral Management Interface, a serial communication protocol for managing and controlling peripheral devices) bus, and the relay chip 130 supports SPMI data translation and transparent transmission between the first chip 110 and the second chip 120.

[0031] Exemplarily, the electronic device may be a mobile phone, a tablet computer, a smart watch or other device, and the first chip 110 is an AP (Application Processor) or a PMIC (Power Management IC) in the electronic device. The second chip 120 is a Sub PMIC (Sub Power Management Chip) in the electronic device, and the second chip 120 may be used to perform power management on the hardware system of the electronic device, and the second chip 120 is responsible for responding to the voltage adjustment instructions of the first chip 110 and initiating voltage configuration requests.

[0032] The hardware system includes but is not limited to: core processor subsystem, graphics processor subsystem, storage subsystem, and external device system. The core processor is the most important computing and control unit in the mobile phone system. It will adjust the frequency and voltage under different load conditions to balance performance and power consumption. The graphics processor subsystem is used to process graphics and video tasks on the mobile phone. Adjusting the frequency and voltage of the graphics processor subsystem can provide higher performance when needed while saving power. The storage subsystem includes flash memory and memory. The storage subsystem may also adjust the voltage and frequency as needed to achieve better energy saving and performance.

[0033] In the embodiment of the present application, the relay chip 130 trains the power management strategy during the transparent transmission of the first power supply instruction sequence between the first chip 110 and the second chip 120. After the power management strategy is obtained through training, the relay chip 130 replaces the first chip 110 in power management of the second chip 120 based on the power management strategy. Specifically, the relay chip 130 can also obtain the application scenario of the electronic device, and obtain the first operation information of the first chip 110 and the second chip 120 in the application scenario. It can also monitor the first power supply instruction sequence when transparently transmitting the first power supply instruction sequence, train the power management strategy according to the scenario information of the electronic device, the first operation information of the first chip 110 and the second chip 120, and the first power supply instruction sequence obtained through monitoring, and send the second power supply instruction sequence to the second chip 120 through the power management strategy obtained by the training of the relay chip 130 itself, so as to configure the power supply of the second chip 120 and realize the unified power management of the system.

[0034] Exemplarily, the application scenarios of the electronic device include but are not limited to: video playback scenario, shooting scenario, game scenario, etc. The scenario information includes but is not limited to: scene entry information, scene stable operation information and scene exit information. The first operation information includes but is not limited to: operation status, operation frequency, operation temperature, etc.

[0035] In the embodiment of the present application, by setting a relay chip 130 between the first chip 110 and the second chip 120, the first power supply instruction sequence issued by the first chip 110 to the second chip 120 can be transparently transmitted through the relay chip 130, so that the second chip 120 can perform power management on the hardware system according to the first power supply instruction sequence issued by the first chip 110. The relay chip 130 can also generate a power management strategy based on the scene information of the electronic device, the first operation information of the first chip 110 and the second chip 120, and the first power supply instruction obtained by monitoring. When the second chip 120 initiates a power management request, the relay chip 130 can shield the first power supply instruction sequence issued by the first chip 110, and send the second power supply instruction sequence to the second chip 120 based on the power management strategy to perform power management on the hardware system. When there is a special voltage regulation requirement for the hardware system, the power management strategy with the optimal solution for performance and power consumption can be found through the relay chip 130, and a custom power management strategy for each hardware system is provided to support various scene requirements of the hardware system, reducing the difficulty of customizing the power management strategy.

[0036] like Figure 1 As shown, in some embodiments of the present application, the relay chip 130 includes: a transmission component 132, a first interface 1322 and a second interface 1324 of the transmission component 132 are connected to the first chip 110, and a third interface 1326 of the transmission component 132 is connected to the second chip 120; wherein, the first interface 1322 of the transmission component 132 is used to receive a first power supply instruction sequence transmitted by the first chip 110, the second interface 1324 of the transmission component 132 is used to obtain scene information and first operation information, and the third interface 1326 of the transmission component 132 is used to transmit the first power supply instruction sequence or the second power supply instruction sequence to the second chip 120.

[0037] In the embodiment of the present application, the relay chip 130 includes a transmission component 132, which can be used to transparently transmit the first power supply instruction sequence transmitted by the first chip 110, and can also obtain the first operation information of the first chip 110 and the second chip 120, as well as the scene information of the electronic device. Specifically, the transmission component 132 includes a first interface 1322 and a second interface 1324, and the transmission component 132 is connected to the first chip 110 through the first interface 1322 and the second interface 1324, and the transmission component 132 also includes a third interface 1326, and the transmission component 132 is connected to the second chip 120 through the third interface 1326.

[0038] Specifically, when the transmission component 132 needs to transparently transmit the first power supply instruction, the transmission component 132 transparently transmits the first power supply instruction sequence through the first interface 1322 and the third interface 1326, and the transmission component 132 obtains the scene information and the first operation information transmitted by the first chip 110 through the second interface 1324. When the transmission component 132 needs to transmit the second power supply instruction sequence generated by the relay chip 130 to the second chip 120, the relay chip 130 can transmit the second power supply instruction sequence to the second chip 120 through the third interface 1326.

[0039] Exemplarily, the first interface 1322 and the third interface 1326 are SPMI interfaces, and the second interface 1324 can be optionally an I3C interface. The relay chip 130 communicates with the first chip 110 via the I3C interface. The first chip 110 can transmit the corresponding scene information to the relay chip 130 via the I3C interface, so that the relay chip 130 can train the power management strategy based on the scene information, the first operating information and the first power supply instruction sequence monitored.

[0040] In an embodiment of the present application, a transmission component 132 is set in the relay chip 130. Through the transmission component 132, the relay chip 130 can transparently transmit the first power supply instruction sequence, and can also communicate with the first chip 110, so as to obtain first operating information of the first chip 110 and the second chip 120, as well as scene information of the application scenario of the electronic device, so as to facilitate the subsequent generation of a customized power management strategy based on the scene information and the first operating information, and the first power supply instruction sequence.

[0041] In some embodiments of the present application, the fourth interface 1328 of the transmission component 132 is connected to an external device, and the fourth interface 1328 of the transmission component 132 is used to configure a power management policy for the external device.

[0042] In the embodiment of the present application, the transmission component 132 also includes a fourth interface 1328, and the relay chip 130 can communicate with the external device through the fourth interface 1328 of the transmission component 132, thereby configuring the power management strategy of the external device to achieve unified power management of the electronic device system.

[0043] Exemplarily, the fourth interface 1328 includes, but is not limited to, a GPIO (General-purpose input / output) interface, an I2C (Inter-Integrated Circuit) interface, and an SPI (Serial Peripheral Interface) interface. External devices include, but are not limited to, camera chips, NFC (Near Field Communication) chips, and ISP (In-System Programming) chips.

[0044] In some embodiments of the present application, the relay chip 130 further includes: a training component 134, connected to the transmission component 132, for training a power management strategy according to the scene information, the first operation information and the first power supply instruction sequence.

[0045] It should be noted that the user can directly configure the preset management policy in the relay chip 130 through the transmission component 132, so that the user can customize the power management policy to replace the original policy in the first chip 110, further improving the convenience of customizing the power management policy of the electronic device.

[0046] In an embodiment of the present application, the relay chip 130 also includes a training component 134. After acquiring the scene information and monitoring the first power supply instruction sequence, the transmission component 132 transmits the scene information, the first operation information and the first power supply instruction sequence to the training component 134. The training component 134 can train and obtain a power management strategy based on this.

[0047] Specifically, the training component 134 includes an AI Core (Artificial Intelligence Core), which can complete the training of AVS and DVFS based on scene information, first operating information and a first power supply instruction sequence transmitted by the relay chip 130, and use the ARM (Advanced RISC Machine, general processing unit) in the electronic device for autonomous programming to generate a customized power management strategy.

[0048] In an embodiment of the present application, the relay chip 130 includes a training component 134. The relay chip 130 can generate a power management strategy based on the scene information, the first operating information and the first power supply instruction sequence acquired by the transmission component 132 through the training component 134, so that the relay chip 130 can take over the power management of the second chip 120 based on the power management strategy, thereby improving the balance between performance and power consumption of the electronic device.

[0049] In some embodiments of the present application, the number of first chips 110 is at least two, and at least two first chips 110 are connected to the relay chip 130; and / or the number of second chips 120 is at least two, and at least two second chips 120 are connected to the relay chip 130.

[0050] In an embodiment of the present application, the relay chip 130 can connect multiple first chips 110 and / or multiple second chips 120, so that the relay chip 130 can transparently transmit the first power supply instruction sequence transmitted between the multiple first chips 110 and the multiple second chips 120, and can also generate a power management strategy between the multiple first chips 110 and the multiple second chips 120, thereby further improving the balance of power management of the electronic device system.

[0051] like Figure 1 As shown, SOC1, SOC2, and SOC3 are three first chips 110, respectively, PMIC1 and PMIC2 are two second chips 120, respectively, the SCLK line is used to transmit a clock signal, and the SDATA line is used to transmit a data signal.

[0052] In some embodiments of the present application, a power management method is provided, which is applied to the power management system in any of the above embodiments. Figure 2 A flow chart of a power management method provided in some embodiments of the present application is shown. Figure 2 As shown, the power management method includes:

[0053] Step 202, the relay chip obtains scene information of an application scene in which the electronic device is located, and first operation information of the first chip and the second chip;

[0054] In the embodiment of the present application, the electronic device operates in a certain application scenario, and the relay chip obtains the scenario information by interacting with the first chip. The relay chip can also obtain the first operation information of the first chip and the second chip by interacting with the first chip.

[0055] Exemplarily, the application scenarios of the electronic device include but are not limited to: video playback scenario, shooting scenario, game scenario, etc. The scenario information includes but is not limited to: scene entry information, scene stable operation information and scene exit information. The first operation information includes but is not limited to: operation status, operation frequency, operation temperature, etc.

[0056] Step 204, during the process of the relay chip transparently transmitting the first power supply instruction sequence, the relay chip monitors the first power supply instruction sequence, where the first power supply instruction sequence includes an instruction sequence transmitted from the first chip to the second chip;

[0057] In the embodiment of the present application, the first chip, the relay chip and the second chip are connected via an SPMI bus, and the relay chip supports SPMI data translation and transparent transmission between the first chip and the second chip. When transparently transmitting the first power supply instruction sequence, the relay chip monitors the first power supply instruction sequence.

[0058] Specifically, the relay chip includes a training component and a transmission component. The relay chip transparently transmits the first power supply instruction sequence through the transmission component, and transmits the monitored first power supply instruction sequence and the acquired scene information to the training component.

[0059] Step 206, the relay chip trains the power management strategy according to the scene information, the first operation information and the first power supply instruction sequence;

[0060] In an embodiment of the present application, the relay chip trains the power management strategy during the process of transparently transmitting the first power supply instruction sequence between the first chip and the second chip. After the power management strategy is obtained through training, the relay chip replaces the first chip in power management of the second chip based on the power management strategy. Specifically, the relay chip can also obtain the application scenario of the electronic device, and obtain the first operating information of the first chip and the second chip in the application scenario. It can also monitor the first power supply instruction sequence when transparently transmitting the first power supply instruction sequence, and train the power management strategy according to the scenario information of the electronic device, the first operating information of the first chip and the second chip, and the first power supply instruction sequence obtained through monitoring. The second power supply instruction sequence is sent to the second chip through the power management strategy obtained through the training of the relay chip itself, so as to configure the power supply of the second chip and realize unified power management of the system.

[0061] Step 208: The relay chip stops transparently transmitting the first power supply instruction sequence to the second chip, and transmits the second power supply instruction sequence to the second chip based on the power management strategy.

[0062] In an embodiment of the present application, after the relay chip is trained to obtain the power management strategy, the first power supply instruction sequence transmitted from the first chip to the second chip is shielded, and a second power supply instruction sequence is generated based on the trained power management strategy, and the second power supply instruction sequence is transmitted to the second chip, so as to implement power management of the hardware system corresponding to the second chip through the power management strategy obtained through training.

[0063] The hardware system includes but is not limited to: core processor subsystem, graphics processor subsystem, storage subsystem, and external device system. The core processor is the most important computing and control unit in the mobile phone system. It will adjust the frequency and voltage under different load conditions to balance performance and power consumption. The graphics processor subsystem is used to process graphics and video tasks on the mobile phone. Adjusting the frequency and voltage of the graphics processor subsystem can provide higher performance when needed while saving power. The storage subsystem includes flash memory and memory. The storage subsystem may also adjust the voltage and frequency as needed to achieve better energy saving and performance.

[0064] In an embodiment of the present application, a relay chip is provided between the first chip and the second chip, and the first power supply instruction sequence issued by the first chip to the second chip can be transparently transmitted through the relay chip, so that the second chip can perform power management on the hardware system according to the first power supply instruction sequence issued by the first chip. The relay chip can also generate a power management policy based on the scene information of the electronic device, the first operation information of the first chip and the second chip, and the first power supply instruction obtained by monitoring. When the second chip initiates a power management request, the relay chip can shield the first power supply instruction sequence issued by the first chip, and send the second power supply instruction sequence to the second chip based on the power management policy to perform power management on the hardware system. When the hardware system has special voltage regulation requirements, the relay chip can find the optimal power management policy for performance and power consumption, provide custom power management policies for each hardware system, support various scenario requirements of the hardware system, and reduce the difficulty of customizing the power management policy.

[0065] In some embodiments of the present application, after the relay chip stops transparently transmitting the first power supply instruction sequence to the second chip and transmits the second power supply instruction sequence to the second chip based on the power management strategy, the power management method also includes: the relay chip obtains second operating information of the first chip and the second chip; the relay chip updates the power management strategy according to the operating information.

[0066] In an embodiment of the present application, the operating information is to obtain second operating information of the first chip and the second chip under the power management policy after power management of the hardware system corresponding to the second chip is performed according to the power management policy generated by the relay chip, and the power management policy generated by the relay chip is updated based on the second operating information, so that the power management policy generated by the relay chip can be dynamically adjusted with the use of the hardware system.

[0067] Exemplarily, the second operating information includes, but is not limited to, operating status, operating frequency, and operating temperature. The maximum operating voltage, aging time, etc. of the hardware system can be determined based on the second operating information.

[0068] In an embodiment of the present application, after the relay chip transmits the second power supply instruction sequence to the second chip in accordance with the power management strategy, it continuously detects the second operating information of the first chip and the second chip, and dynamically adjusts the power management strategy based on the second operating information, thereby further improving the performance and power consumption balance of the electronic device in power management of various hardware systems in accordance with the power management strategy generated by the relay chip.

[0069] In some embodiments of the present application, the first operating information includes at least one of the following: operating status, operating frequency, and operating temperature.

[0070] In an embodiment of the present application, by setting the first operating information to include at least one of the operating status, operating frequency, and operating temperature, the accuracy of the power management strategy generated by the relay chip training can be improved, and the accuracy and balance of the power management of various hardware systems by the electronic device based on the power management strategy generated by the relay chip can be further improved.

[0071] Exemplarily, when the first operating information includes the first operating information transmitted by the first chip, the relay chip interacts with the first chip through the I3C interface, obtains the working status information of the first chip in the application scenario, and uses the working status information as the first operating information. The working status information of the first chip in the application scenario includes at least one of the following: whether the first chip is in an operating state, the operating frequency of the first chip, the operating temperature of the first chip and other information, and the Corner (process variable) of the first chip.

[0072] Exemplarily, when the first operating information includes the first operating information transmitted by an external device, the relay chip interacts with the external device through an I2C interface or an SPI interface to obtain the working status information of the external device in the application scenario, and uses the working status information as the first operating information. The working status information of the external device in the application scenario includes at least one of the following: whether the external device is in an operating state, the operating frequency of the external device, the operating temperature of the external device and other information, and the Corner of the control chip of the external device.

[0073] In some embodiments of the present application, the relay chip trains a power management strategy based on scenario information, first operating information and a first power supply instruction sequence, including: the relay chip determines a configuration sequence and a power configuration behavior of at least two operating stages in an application scenario based on the scenario information, the first operating information and the first power supply instruction sequence; the relay chip generates first chip and second chip label information based on the configuration sequence, the power configuration behavior and stage information corresponding to at least two operating stages; and the relay chip generates a power management strategy based on the label information.

[0074] In an embodiment of the present application, after obtaining the first power supply instruction sequence, the relay chip can conduct in-depth study of the instructions in the first power supply instruction sequence, and combine the scene information to analyze and obtain the configuration sequence and power configuration behavior of each operating stage in the application scenario.

[0075] Exemplarily, at least two operation stages include but are not limited to: entering the application scenario stage, stable operation stage under the application scenario, and exiting the application scenario stage. Power configuration behaviors include but are not limited to: power-on behavior, power-off behavior, voltage increase behavior, and voltage reduction behavior. The configuration sequence includes the instruction sequence in each operation stage in the first instruction sequence.

[0076] In the embodiment of the present application, after determining the configuration sequence and power configuration behavior in each operation stage, power management tag information is generated based on the stage information corresponding to each operation stage, and the power management tag information includes scene information, instruction sequence and power configuration behavior. The power management tag information is programmed to generate a power management strategy.

[0077] Specifically, the AI ​​Core in the relay chip can complete the training of AVS and DVFS based on the scene information, the first operating information and the first power supply instruction sequence transmitted by the relay chip, obtain the power management label information, and use the ARM (Advanced RISC Machine, general-purpose processing unit) in the electronic device for autonomous programming to generate a power management strategy.

[0078] In an embodiment of the present application, the relay chip can generate power management tag information based on the acquired first operating information, scene information and first power supply instruction sequence, and then autonomously program the power management tag information to obtain a power management strategy. No staff participation is required throughout the process, thereby realizing automatic configuration of the power management strategies of each second chip and improving the balance between power consumption and performance of power management of electronic devices.

[0079] Figure 3 A flowchart showing the internal processing flow of the relay chip provided in some embodiments of the present application is shown in FIG. Figure 3 As shown in the figure, the internal processing flow of the relay chip includes:

[0080] Step 302, receiving platform scenario related information;

[0081] In an embodiment of the present application, the platform scenario-related information includes the first operation information and scenario information in any of the above embodiments.

[0082] Step 304, developing a voltage regulation algorithm based on the learning tag library;

[0083] In the embodiment of the present application, the voltage regulation algorithm includes the power management strategy in any of the above embodiments;

[0084] Step 306, blocking AP SPMI instruction issuance;

[0085] In the embodiment of the present application, the AP is the first chip in any of the above embodiments, and the SPMI instruction is the first power supply instruction sequence;

[0086] Step 308, issuing a customized instruction sequence;

[0087] In the embodiment of the present application, the customized instruction sequence is a second power supply instruction sequence generated based on the power management strategy in any of the above embodiments;

[0088] Step 310, implementing a startup and shutdown acceleration algorithm or a working module voltage regulation algorithm;

[0089] Step 312, continuously receiving platform scenario related information;

[0090] In the embodiment of the present application, the platform scenario-related information that is continuously received is the second operation information in any of the above embodiments.

[0091] Step 314 , dynamically adjust the power management strategy based on the algorithm, and return to step 308 .

[0092] Figure 4 Schematic diagrams of application scenarios provided in some embodiments of the present application are shown, such as Figure 4 As shown, CCM is a camera module, ISP is a customized impact chip, AP is a first chip, Relay Chip is a relay chip, and MIPI is a CPHY protocol interface or a DPHY interface.

[0093] The relay chip can generate a customized power management strategy to optimize the power supply for CCM, AP, and ISP chips, improving the power switching speed and power supply stability; in other low-power scenarios, the voltage can be reduced or the power can be turned off accordingly.

[0094] In the above system, the specific workflow is as follows:

[0095] First, the AP can send the working scene required by the imaging system to the Relay Chip through the I3C interface. The AI ​​Core in the Relay Chip conducts in-depth learning of the first instruction sequence sent by the AP, and combines the first operating information of the AP and external devices obtained through the I3C interface, I2C interface or SPI interface to parse the instruction sequence of the scene entry stage, stable working stage and scene exit stage, as well as the power configuration line corresponding to the sequence.

[0096] Figure 5 One of the instruction sequence diagrams provided in some embodiments of the present application is shown, such as Figure 5As shown, the transmission process of the first instruction sequence in each stage, wherein PMIC1, PMIC2, and PMIC3 are the second chips in any of the above embodiments, and are used to power the CCM chip, the ISP chip, and the AP chip, respectively.

[0097] During the camera startup phase, the platform executes instructions: CMD3_1, CMD3_2 to configure PMIC3 power-on output, waits for AP-related modules to stabilize, then executes instructions: CMD2_1, CMD2_2 to configure PMIC2 power-on output, waits for ISP-related modules to stabilize, then executes instructions CMD1_1, CMD1_2 to configure PMIC1 power-on output, waits for CCM-related modules to stabilize, and completes the startup configuration.

[0098] During the stable operation stage of the camera, the platform executes instructions: CMD3_3, CMD3_4, configures PMIC3 voltage regulation, waits for the AP-related module status to switch to the stable operation stage, then executes instructions: CMD2_3, CMD2_4, configures PMIC2 voltage regulation, waits for the ISP-related module status to switch to a stable state, then executes CMD1_3, CMD1_4 to configure PMIC1 voltage regulation, and waits for the CCM-related modules to complete the status switch.

[0099] During the camera shutdown phase, the platform executes instructions: CMD1_5, CMD1_6 to configure PMIC1 to power off, waits for CCM to exit, then executes instructions: CMD2_5, CMD2_6 to configure PMIC2 to power off, waits for ISP phase to exit, then executes instructions: CMD3_5, CMD3_6 to configure PMIC1 to power off, and waits for the AP module to shut down.

[0100] Among them, CMD1_1, CMD1_2, CMD1_3, CMD1_4, CMD1_5, CMD1_6, CMD2_1, CMD2_2, CMD2_3, CMD2_4, CMD2_5, CMD2_6, CMD3_1, CMD3_2, CMD3_3, CMD3_4, CMD3_5, and CMD3_6 are all power supply instructions in the first power supply instruction sequence obtained through training.

[0101] Figure 6 One of the graphs of current and voltage over time provided in some embodiments of the present application is shown, such as Figure 6 As shown, in the process of controlling the camera to start, operate and shut down according to the first power supply instruction sequence, the voltage remains unchanged and the current changes with time.

[0102] The Relay Chip completes the above startup, stable operation, and shutdown configuration sequence learning through preliminary training, combines the tag library and customized algorithm to take over the platform to execute the power management strategy, and adjusts the power supply voltage of the AP and peripherals involved in the working scenario in real time to achieve accurate boost, buck, startup, and shutdown acceleration operations:

[0103] Figure 7 One of the instruction sequence diagrams provided in some embodiments of the present application is shown, such as Figure 7 As shown, the transmission process of the second instruction sequence at each stage can accelerate the process of starting, working and shutting down the camera. Among them, PMIC1, PMIC2, and PMIC3 are the second chips in any of the above embodiments, and are used to power the CCM chip, the ISP chip, and the AP chip respectively.

[0104] During the camera startup phase, the Relay Chip receives the first power supply command sequence issued by the AP scenario, executes the command: CMD3_1 to configure the PMIC3 power-on output, executes the command: CMD2_1 to configure the PMIC2 power-on output, and executes the command: CMD1_1 to configure the PMIC1 power-on output. Through early learning, the AP-related modules and the ISP-related module startup time are accurately controlled, the parallel processing speed is improved, and the CCM startup configuration is accelerated.

[0105] In the stable working stage, the Relay Chip receives AP scene delivery and peripheral status reading, executes instructions: CMD3_3 configures PMIC3 voltage regulation, executes instructions: CMD2_3 configures PMIC2 voltage regulation, and executes instructions: CMD1_3 configures PMIC1 voltage regulation. Through previous learning, the AP-related modules are accurately controlled, and the ISP-related module voltage regulation switching time is time-consuming, which accelerates the CCM voltage regulation configuration.

[0106] When shutting down the camera, the Relay Chip receives the AP scene delivery and reads the peripheral status, executes CMD1_5 to configure PMIC1 to power off, executes CMD2_5 to configure PMIC2 to power off, and executes CMD3_5 to configure PMIC1 to power off. Through previous learning, the shutdown time of AP-related modules and ISP-related modules is accurately controlled, accelerating the CCM shutdown configuration.

[0107] Figure 8 FIG2 shows a second graph of current and voltage changes over time provided in some embodiments of the present application, such as Figure 8 As shown, in the process of controlling the camera startup, operation and shutdown according to the second power supply instruction sequence, the required voltage is set according to the actual current demand and adjusted in real time. Since the camera does not require high current output in most application scenarios, the corresponding voltage value can be dynamically adjusted according to the power management strategy generated by the Relay Chip to achieve the purpose of reducing power consumption.

[0108] The power management method provided in the embodiment of the present application can be executed by a power management device. In the embodiment of the present application, the power management method provided in the embodiment of the present application is described by taking the power management device executing the power management method as an example.

[0109] In some embodiments of the present application, a power management device is provided, which is applied to the power management system in any of the above embodiments. Fig. 9 Schematic block diagram of a power management device provided in some embodiments of the present application is shown. Fig. 9 As shown, the power management device 900 includes:

[0110] An acquisition module 902 is used for the relay chip to acquire scene information of an application scene in which the electronic device is located, and first operation information of the first chip and the second chip;

[0111] A monitoring module 904 is used for monitoring the first power supply instruction sequence by the relay chip during the process of transparently transmitting the first power supply instruction sequence, where the first power supply instruction sequence includes an instruction sequence transmitted from the first chip to the second chip;

[0112] A training module 906, configured to train the relay chip a power management strategy according to the scene information, the first operation information and the first power supply instruction sequence;

[0113] The transmission module 908 is used for the relay chip to stop transparently transmitting the first power supply instruction sequence to the second chip, and transmit the second power supply instruction sequence to the second chip based on the power management strategy.

[0114] In an embodiment of the present application, a relay chip is provided between the first chip and the second chip, and the first power supply instruction sequence issued by the first chip to the second chip can be transparently transmitted through the relay chip, so that the second chip can perform power management on the hardware system according to the first power supply instruction sequence issued by the first chip. The relay chip can also generate a power management policy based on the scene information of the electronic device, the first operation information of the first chip and the second chip, and the first power supply instruction obtained by monitoring. When the second chip initiates a power management request, the relay chip can shield the first power supply instruction sequence issued by the first chip, and send the second power supply instruction sequence to the second chip based on the power management policy to perform power management on the hardware system. When the hardware system has special voltage regulation requirements, the relay chip can find the optimal power management policy for performance and power consumption, provide custom power management policies for each hardware system, support various scenario requirements of the hardware system, and reduce the difficulty of customizing the power management policy.

[0115] In some embodiments of the present application, the acquisition module 902 is used for the relay chip to acquire the second operation information of the first chip and the second chip;

[0116] The power management device 900 further includes:

[0117] The update module is used for the relay chip to update the power management strategy according to the second operation information.

[0118] In an embodiment of the present application, after the relay chip transmits the second power supply instruction sequence to the second chip in accordance with the power management strategy, it continuously detects the second operating information of the first chip and the second chip, and dynamically adjusts the power management strategy based on the second operating information, thereby further improving the performance and power consumption balance of the electronic device in power management of various hardware systems in accordance with the power management strategy generated by the relay chip.

[0119] In some embodiments of the present application, the first operating information includes at least one of the following: operating status, operating frequency, and operating temperature.

[0120] In an embodiment of the present application, by setting the first operating information to include at least one of the operating status, operating frequency, and operating temperature, the accuracy of the power management strategy generated by the relay chip training can be improved, and the accuracy and balance of the power management of various hardware systems by the electronic device based on the power management strategy generated by the relay chip can be further improved.

[0121] In some embodiments of the present application, the power management device further includes:

[0122] A determination module, configured for the relay chip to determine, according to the scenario information, the first operation information and the first power supply instruction sequence, a configuration sequence and a power supply configuration behavior of at least two operation stages in the application scenario;

[0123] A generation module, configured to generate power management tag information for the relay chip according to the configuration sequence, the power configuration behavior and the phase information corresponding to at least two operation phases;

[0124] The generation module is used for the relay chip to generate a power management strategy according to the power management tag information.

[0125] In an embodiment of the present application, the relay chip can generate power management tag information based on the acquired first operating information, scene information and first power supply instruction sequence, and then autonomously program the power management tag information to obtain a power management strategy. No staff participation is required throughout the process, thereby realizing automatic configuration of the power management strategies of each second chip and improving the balance between power consumption and performance of power management of electronic devices.

[0126] The power management device in the embodiment of the present application can be an electronic device, or a component in the electronic device, such as an integrated circuit or a chip. The electronic device can be a terminal, or other devices other than a terminal. Exemplarily, the electronic device can be a mobile phone, a tablet computer, a laptop computer, a PDA, a vehicle-mounted electronic device, a mobile Internet device (Mobile Internet Device, MID), an augmented reality (augmented reality, AR) / virtual reality (virtual reality, VR) device, a robot, a wearable device, an ultra-mobile personal computer (ultra-mobile personal computer, UMPC), a netbook or a personal digital assistant (personal digital assistant, PDA), etc., and can also be a server, a network attached storage (Network Attached Storage, NAS), a personal computer (personal computer, PC), a television (television, TV), a teller machine or a self-service machine, etc., which is not specifically limited in the embodiment of the present application.

[0127] The power management device in the embodiment of the present application may be a device having an operating system. The operating system may be an Android operating system, an iOS operating system, or other possible operating systems, which are not specifically limited in the embodiment of the present application.

[0128] The power management device provided in the embodiment of the present application can implement each process implemented in the above method embodiment, and will not be described again here to avoid repetition.

[0129] Optionally, an embodiment of the present application further provides an electronic device, which includes a power management device as in any of the above embodiments, and thus has all the beneficial effects of the power management method in any of the embodiments, which will not be elaborated herein.

[0130] Optionally, an embodiment of the present application further provides an electronic device, Fig.10 A structural block diagram of an electronic device according to an embodiment of the present application is shown. Fig.10 As shown, the electronic device 1000 includes a processor 1002, a memory 1004, and a program or instruction stored in the memory 1004 and executable on the processor 1002. When the program or instruction is executed by the processor 1002, each process of the above-mentioned power management method embodiment is implemented, and the same technical effect can be achieved. To avoid repetition, it will not be described here.

[0131] It should be noted that the electronic devices in the embodiments of the present application include the above-mentioned mobile electronic devices and non-mobile electronic devices.

[0132] Fig.11 A schematic diagram of the hardware structure of an electronic device to implement an embodiment of the present application.

[0133] The electronic device 1100 includes but is not limited to: a radio frequency unit 1101, a network module 1102, an audio output unit 1103, an input unit 1104, a sensor 1105, a display unit 1106, a user input unit 1107, an interface unit 1108, a memory 1109 and a processor 1110 and other components.

[0134] Those skilled in the art will appreciate that the electronic device 1100 may also include a power source (such as a battery) for supplying power to each component, and the power source may be logically connected to the processor 1110 through a power management system, thereby implementing functions such as managing charging, discharging, and power consumption management through the power management system. Fig.11 The electronic device structure shown in the figure does not constitute a limitation on the electronic device. The electronic device may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently, which will not be described in detail here.

[0135] The processor 1110 is used to obtain scene information of an application scene in which the electronic device is located, and first operation information of the first chip and the second chip;

[0136] The processor 1110 is configured to monitor the first power supply instruction sequence during transparent transmission of the first power supply instruction sequence, where the first power supply instruction sequence includes an instruction sequence transmitted from the first chip to the second chip;

[0137] Processor 1110, configured to train a power management strategy according to the scene information, the first operation information and the first power supply instruction sequence;

[0138] The processor 1110 is configured to stop transparently transmitting the first power supply instruction sequence to the second chip, and transmit the second power supply instruction sequence to the second chip based on the power management strategy.

[0139] In an embodiment of the present application, a relay chip is provided between the first chip and the second chip, and the first power supply instruction sequence issued by the first chip to the second chip can be transparently transmitted through the relay chip, so that the second chip can perform power management on the hardware system according to the first power supply instruction sequence issued by the first chip. The relay chip can also generate a power management policy based on the scene information of the electronic device, the first operation information of the first chip and the second chip, and the first power supply instruction obtained by monitoring. When the second chip initiates a power management request, the relay chip can shield the first power supply instruction sequence issued by the first chip, and send the second power supply instruction sequence to the second chip based on the power management policy to perform power management on the hardware system. When the hardware system has special voltage regulation requirements, the relay chip can find the optimal power management policy for performance and power consumption, provide custom power management policies for each hardware system, support various scenario requirements of the hardware system, and reduce the difficulty of customizing the power management policy.

[0140] Further, the processor 1110 is configured to obtain second operation information of the first chip and the second chip;

[0141] Processor 1110 is used to update the power management policy according to the second operation information.

[0142] In an embodiment of the present application, after the relay chip transmits the second power supply instruction sequence to the second chip in accordance with the power management strategy, it continuously detects the second operating information of the first chip and the second chip, and dynamically adjusts the power management strategy based on the second operating information, thereby further improving the performance and power consumption balance of the electronic device in power management of various hardware systems in accordance with the power management strategy generated by the relay chip.

[0143] Furthermore, the first operating information includes at least one of the following: operating status, operating frequency, and operating temperature.

[0144] In an embodiment of the present application, by setting the first operating information to include at least one of the operating status, operating frequency, and operating temperature, the accuracy of the power management strategy generated by the relay chip training can be improved, and the accuracy and balance of the power management of various hardware systems by the electronic device based on the power management strategy generated by the relay chip can be further improved.

[0145] In some embodiments of the present application, the processor 1110 is used to determine the configuration sequence and power configuration behavior of at least two operation stages in the application scenario according to the scenario information, the first operation information and the first power supply instruction sequence;

[0146] Processor 1110, configured to generate power management tag information according to the configuration sequence, the power configuration behavior and the phase information corresponding to at least two operation phases;

[0147] Processor 1110 is used to generate a power management policy according to the power management tag information.

[0148] In an embodiment of the present application, the relay chip can generate power management tag information based on the acquired first operating information, scene information and first power supply instruction sequence, and then autonomously program the power management tag information to obtain a power management strategy. No staff participation is required throughout the process, thereby realizing automatic configuration of the power management strategies of each second chip and improving the balance between power consumption and performance of power management of electronic devices.

[0149] It should be understood that in the embodiment of the present application, the input unit 1104 may include a graphics processor (Graphics Processing Unit, GPU) 11041 and a microphone 11042, and the graphics processor 11041 processes the image data of the static picture or action file obtained by the image capture device (such as a camera) in the action file capture mode or the image capture mode. The display unit 1106 may include a display panel 11061, and the display panel 11061 may be configured in the form of a liquid crystal display, an organic light emitting diode, etc. The user input unit 1107 includes a touch panel 11071 and at least one of other input devices 11072. The touch panel 11071 is also called a touch screen. The touch panel 11071 may include two parts: a touch detection device and a touch controller. Other input devices 11072 may include, but are not limited to, a physical keyboard, function keys (such as volume control keys, switch keys, etc.), a trackball, a mouse, and a joystick, which will not be repeated here.

[0150] The memory 1109 can be used to store software programs and various data. The memory 1109 may mainly include a first storage area for storing programs or instructions and a second storage area for storing data, wherein the first storage area may store an operating system, an application program or instructions required for at least one function (such as a sound playback function, an image playback function, etc.), etc. In addition, the memory 1109 may include a volatile memory or a non-volatile memory, or the memory 1109 may include both volatile and non-volatile memories. Among them, the non-volatile memory may be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory may be a random access memory (RAM), a static random access memory (SRAM), a dynamic random access memory (DRAM), a synchronous dynamic random access memory (SDRAM), a double data rate synchronous dynamic random access memory (DDRSDRAM), an enhanced synchronous dynamic random access memory (ESDRAM), a synchronous link dynamic random access memory (SLDRAM) and a direct memory bus random access memory (DRRAM). The memory 1109 in the embodiment of the present application includes but is not limited to these and any other suitable types of memory.

[0151] The processor 1110 may include one or more processing units; optionally, the processor 1110 integrates an application processor and a modem processor, wherein the application processor mainly processes operations related to an operating system, a user interface, and application programs, and the modem processor mainly processes wireless communication signals, such as a baseband processor. It is understandable that the modem processor may not be integrated into the processor 1110.

[0152] An embodiment of the present application also provides a readable storage medium, on which a program or instruction is stored. When the program or instruction is executed by a processor, the various processes of the above-mentioned method embodiment are implemented and the same technical effect can be achieved. To avoid repetition, it will not be repeated here.

[0153] The processor is the processor in the electronic device in the above embodiment. The readable storage medium includes a computer readable storage medium, such as a computer read-only memory ROM, a random access memory RAM, a magnetic disk or an optical disk.

[0154] An embodiment of the present application further provides a chip, which includes a processor and a communication interface, wherein the communication interface and the processor are coupled, and the processor is used to run programs or instructions to implement the various processes of the above-mentioned power management method embodiment, and can achieve the same technical effect. To avoid repetition, it will not be repeated here.

[0155] It should be understood that the chip mentioned in the embodiments of the present application can also be called a system-level chip, a system chip, a chip system or a system-on-chip chip, etc.

[0156] An embodiment of the present application provides a computer program product, which is stored in a storage medium. The program product is executed by at least one processor to implement the various processes of the power management method embodiment described above, and can achieve the same technical effect. To avoid repetition, it will not be repeated here.

[0157] It should be noted that, in this article, the term "comprises", "includes" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, device, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, device, article or device. In the absence of further restrictions, an element defined by the statement "includes one..." does not exclude the presence of other identical elements in the process, device, article or device including the element. In addition, it should be noted that the scope of the devices and apparatuses in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described device may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0158] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment device can be implemented by means of software plus a necessary general hardware platform, and of course it can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art can be embodied in the form of a computer software product, which is stored in a storage medium (such as ROM / RAM, disk, CD), including a number of instructions for a terminal (which can be a mobile phone, computer, server, or network equipment, etc.) to execute the device of each embodiment of the present application.

[0159] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A power management system, characterized in that: Used in electronic equipment, including: A first chip and a second chip; a relay chip, the relay chip being connected to the first chip and the second chip, and the relay chip being used for transparently transmitting the first power supply instruction sequence output by the first chip to the second chip; Among them, the relay chip obtains scene information of the application scenario of the electronic device, and first operating information of the first chip and the second chip; in the process of the relay chip transparently transmitting the first power supply instruction sequence, the relay chip monitors the first power supply instruction sequence; the relay chip trains the power management strategy according to the scene information, the first operating information and the first power supply instruction sequence; the relay chip stops transparently transmitting the first power supply instruction sequence to the second chip, and transmits the second power supply instruction sequence to the second chip based on the power management strategy.

2. The power management system according to claim 1, characterized in that: The relay chip comprises: A transmission component, wherein a first interface and a second interface of the transmission component are connected to the first chip, and a third interface of the transmission component is connected to the second chip; Among them, the first interface of the transmission component is used to receive the first power supply instruction sequence transmitted by the first chip, the second interface of the transmission component is used to obtain the scene information and the first operation information, and the third interface of the transmission component is used to transmit the first power supply instruction sequence or the second power supply instruction sequence to the second chip.

3. The power management system according to claim 2, characterized in that: The fourth interface of the transmission component is connected to an external device, and the fourth interface of the transmission component is used to configure the power management policy for the external device.

4. The power management system according to claim 2, characterized in that: The relay chip also includes: A training component is connected to the transmission component and is used to train a power management strategy based on the scene information and the first power supply instruction sequence.

5. A power management method, characterized in that: The power management system according to any one of claims 1 to 4, wherein the power management method comprises: The relay chip obtains scene information of an application scene in which the electronic device is located, and first operation information of the first chip and the second chip; During the process of the relay chip transparently transmitting the first power supply instruction sequence, the relay chip monitors the first power supply instruction sequence, where the first power supply instruction sequence includes an instruction sequence transmitted from the first chip to the second chip; The relay chip trains a power management strategy according to the scenario information, the first operation information and the first power supply instruction sequence; The relay chip stops transparently transmitting the first power supply instruction sequence to the second chip, and transmits a second power supply instruction sequence to the second chip based on the power management strategy.

6. The power management method according to claim 5, characterized in that: After the relay chip stops transparently transmitting the first power supply instruction sequence to the second chip and transmits the second power supply instruction sequence to the second chip based on the power supply management strategy, the power supply management method further includes: The relay chip acquires second operation information of the first chip and the second chip; The relay chip updates the power management strategy according to the second operation information.

7. The power management method according to claim 5 or 6, characterized in that: The relay chip trains a power management strategy according to the scene information, the first operation information and the first power supply instruction sequence, including: The relay chip determines, according to the scenario information, the first operation information and the first power supply instruction sequence, a configuration sequence and a power supply configuration behavior of at least two operation stages in the application scenario; The relay chip generates power management tag information according to the configuration sequence, the power configuration behavior and the phase information corresponding to the at least two operation phases; The relay chip generates the power management policy according to the power management tag information.

8. A power management device, characterized in that: The power management system according to any one of claims 1 to 4, wherein the power management device comprises: An acquisition module, configured to obtain, through a relay chip, scene information of an application scene in which the electronic device is located, and first operation information of the first chip and the second chip; A monitoring module, configured to monitor the first power supply instruction sequence during the process in which the relay chip transparently transmits the first power supply instruction sequence, wherein the first power supply instruction sequence includes an instruction sequence transmitted from the first chip to the second chip; A training module, used for the relay chip to train a power management strategy according to the scenario information, the first operation information and the first power supply instruction sequence; A transmission module is used for the relay chip to stop transparently transmitting the first power supply instruction sequence to the second chip, and to transmit a second power supply instruction sequence to the second chip based on the power management strategy.

9. An electronic device, characterized in that: include: A processor and a memory, wherein the memory stores a program or instruction that can be run on the processor, and when the program or instruction is executed by the processor, the steps of the method according to any one of claims 5 to 7 are implemented.

10. A readable storage medium, characterized in that: The readable storage medium stores a program or instruction, and when the program or instruction is executed by a processor, the steps of the method according to any one of claims 5 to 7 are implemented.

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