Chip defect processing integrated system and chip defect detection method

Abstract

The invention provides a chip defect processing integrated system and a chip defect detection method. The system comprises a chip defect information storage module, a data analysis module and an interaction tracking module, the chip defect information storage module stores a plurality of pieces of known chip defect case information, a plurality of pieces of known chip defect case basic information and a first defect model; the data analysis module is used for carrying out preprocessing, defect abnormity judgment and similarity analysis on the original defect information; and the interaction tracking module performs defect solving tracking and defect case information arrangement according to the similarity information of the defect original information. According to the scheme, automatic analysis and case arrangement of the process defects are realized, so that the process defect solving efficiency is greatly improved. And the chip defect information storage module can also store the basic information of the defect information and the chip defect case information in real time, so that the reliability of data in the chip defect information storage module is greatly improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to an integrated system for chip defect processing and a chip defect detection method. Background Art

[0002] As feature sizes continue to shrink, the limits of semiconductor manufacturing equipment and process capabilities have gradually been reached. As chip manufacturing continues to advance, production processes are becoming more sophisticated and patterns are becoming more dense. At this time, defects in the process will directly affect chip manufacturing costs.

[0003] When the existing technology detects defects and abnormalities in the process at the machine end, engineers usually retrieve the defect images and related data of the corresponding machine, use visual methods to manually check the corresponding defect manual or defect database, and manually analyze the source and cause of the defects. Finally, the defect information is sorted and summarized and entered into the corresponding defect manual or defect database. However, the problems with this solution are: 1. Manual defect analysis takes too much time, and the types of defects analyzed at one time are very limited, resulting in multiple batches of wafers being scrapped between the end of the engineer's analysis and the corresponding module resolving the defects. 2. Due to the huge amount of engineering work and low efficiency of manual defect analysis, the frequency of defect manuals or defect databases is extremely low, usually updated every six months, which reduces the reliability of the data in the defect manual or defect database.

[0004] Therefore, providing an integrated system for chip defect processing with high efficiency and reliability has become a technical problem that the industry urgently needs to solve. Summary of the invention

[0005] The technical problem solved by the present invention is to provide an integrated system for chip defect processing and a chip defect detection method, which solves the problems of inefficiency and low reliability in the process of solving process defects in the prior art.

[0006] In order to solve the above technical problems, an embodiment of the present invention provides an integrated system for chip defect processing, including a chip defect information storage module, a data analysis module and an interactive tracking module; wherein:

[0007] The chip defect information storage module stores information of several known chip defect cases, basic information of several known chip defect cases and a first defect model, wherein the chip defect case information at least includes basic information of the case, cause of the case, preventive measures and defect solution measures;

[0008] The data analysis module is used for:

[0009] Acquire original defect information output by the machine end, pre-process the original defect information to obtain basic information of the defect information, and send the basic information of the defect information to the chip defect information storage module for storage; and

[0010] Determine defect anomalies on the basic information of the defect information according to the first defect model; when defect anomalies exist in the basic information of the defect information, compare and analyze the basic information of the defect information with basic information of several known chip defect cases stored in the chip defect information storage module to obtain similarity information;

[0011] The interactive tracking module is used to determine whether to retrieve several known chip defect case information in the chip defect information storage module based on the similarity information, and on this basis, to interact with the outside world to output defect solution information to the outside world and obtain feedback information from the outside world, form new case information based on the feedback information, and send it to the chip defect information storage module for storage, so as to update the chip defect case information in the chip defect information storage module.

[0012] Optionally, the interaction tracking module is specifically used for:

[0013] When the similarity information is less than a first threshold, information is exchanged with the outside world, defect resolution information is output to the outside world and feedback information from the outside world is obtained, new case information is formed according to the feedback information, and sent to the chip defect information storage module for storage, so as to update the chip defect case information in the chip defect information storage module;

[0014] When the similarity information is greater than or equal to the first threshold, the interactive tracking module is used to retrieve similar cases and external data from several known chip defect case information, generate a case report to interact with the outside world, output defect resolution information to the outside world and obtain feedback information from the outside world, form new case information based on the feedback information, and send it to the chip defect information storage module for storage to update the chip defect case information in the chip defect information storage module. Optionally, the external data includes at least: production line delivery records, online abnormality analysis sheets, machine detection system information, module process parameters, and experimental data analysis.

[0015] Optionally, the interactive tracking module is also used to generate control instructions to the manufacturing execution system after receiving feedback information from the outside world. The manufacturing execution system controls the corresponding machine end to perform additional scanning to track whether there are other defect cases; and after the defect case tracking is completed, the complete case report is imported into the chip defect information storage module for storage to update the chip defect case information in the chip defect information storage module.

[0016] Optionally, the data analysis module is further used to store the basic information of the defect information in the chip defect information storage module when there is no defect information in the basic information of the defect information.

[0017] Optionally, the feedback information includes at least processing measures and preventive measures for resolving the defect information.

[0018] Correspondingly, the technical solution of the present invention also provides a chip defect detection method, which uses the integrated chip defect processing system to perform chip defect detection, and the method includes:

[0019] Acquire defect information output by the machine end, pre-process the original defect information to obtain basic information of the defect information, and send the basic information of the defect information to the chip defect information storage module for storage;

[0020] Determine defect anomalies on the basic information of the defect information according to the first defect model; when defect anomalies exist in the basic information of the defect information, compare and analyze the basic information of the defect information with basic information of several known chip defect cases stored in the chip defect information storage module to obtain similarity information;

[0021] Determine whether to retrieve several known chip defect case information in the chip defect information storage module based on the similarity information, and on this basis, interact with the outside world to output defect solution information to the outside world and obtain feedback information from the outside world, form new case information based on the feedback information, and send it to the chip defect information storage module for storage, so as to update the chip defect case information in the chip defect information storage module.

[0022] Optionally, determining whether to retrieve similar cases in the chip defect information storage module according to the similarity information, and exchanging information with the outside world on this basis, specifically includes:

[0023] When the similarity information is less than a first threshold, the interactive tracking module interacts with the outside world, outputs defect resolution information to the outside world and obtains feedback information from the outside world, forms new case information according to the feedback information, and sends it to the chip defect information storage module for storage, so as to update the chip defect case information in the chip defect information storage module;

[0024] When the similarity information is greater than or equal to a first threshold, the interactive tracking module retrieves similar cases and external data in the chip defect information storage module, generates a case report to interact with the outside world, outputs defect resolution information to the outside world and obtains feedback information from the outside world, forms new case information based on the feedback information, and sends it to the chip defect information storage module for storage, so as to update the chip defect case information in the chip defect information storage module.

[0025] Correspondingly, the technical solution of the present invention also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is processed and executed, the steps of the chip defect detection method are executed.

[0026] Compared with the prior art, the technical solution of the embodiment of the present invention has the following beneficial effects:

[0027] In the integrated system for chip defect processing of the technical solution of the present invention, a chip defect information storage module is constructed for storing several known chip defect case information, several known chip defect case basic information and a first defect model, a data analysis module is constructed for preprocessing the original defect information, defect abnormality judgment and similarity analysis, and an interactive tracking module is constructed for tracking defect solutions and collating defect case information based on the similarity information of the original defect information, thereby realizing the automated analysis and case collation of process defects, greatly speeding up the efficiency of process defect resolution and reducing the number of scrapped wafers. The chip defect information storage module also stores the basic information of the defect information and the chip defect case information in real time, thereby greatly improving the reliability of the data stored in the chip defect information storage module. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A module structure diagram of an integrated system for chip defect processing provided by the technical solution of the present invention;

[0029] Figure 2 The process of the chip defect detection method provided by the technical solution of the present invention Figure 1 ;

[0030] Figure 3 The process of the chip defect detection method provided by the technical solution of the present invention Figure 2 . DETAILED DESCRIPTION

[0031] As described in the background technology, the existing technology has problems such as low efficiency in processing defects in the process, resulting in wafer waste and low frequency of updating the defect manual. In addition to the above problems, the existing technology also has problems such as high training costs and poor consistency of defect manuals. The following will explain the problems existing in the existing technology in detail.

[0032] When a defect abnormality occurs on the machine side, the engineer will retrieve the defect image and related data of the corresponding machine, use visual methods to manually check the corresponding defect manual or defect database, and analyze the source and cause of the defect based on work experience, process knowledge, and manual search of production line run records, online abnormality analysis sheets, machine detection system information, module process parameters, and experimental data analysis. After completing the analysis of the defect abnormality, the engineer will summarize the analysis and judgment results into a report or PPT to notify the corresponding module to solve the defect abnormality. However, the problem is:

[0033] 1. Engineers can only perform defect analysis on one or two representative defect images on a wafer at a time, so there is a possibility of inaccurate defect analysis. At the same time, it takes engineers several hours or even days to complete a defect analysis, and every hour of delay in defect resolution will result in the scrapping of a batch of wafers.

[0034] 2. After completing the analysis and resolution of the defect, if the defect is a new defect, experts or senior engineers are required to improve the basic information, causes, solutions and preventive measures of the defect and update them to the defect manual or defect database. To establish and improve the defect manual or defect database, it takes a lot of time for experts or senior engineers. It takes several hours to improve and update a new defect, and it takes several working days for a new defect of a certain type. The workload of improving the defect manual or defect database is huge and time-consuming. Chip manufacturers generally update the defect manual or defect database every six months or more. Since the defects existing in the chip manufacturing process cannot be recorded in the defect manual or defect database in real time, the data in the defect manual or defect database is outdated and cannot better serve defect analysis.

[0035] 3. Before engineers participate in defect management and analysis work, they need to undergo a lot of training and learning. Only after they are familiar with the contents of the manual can they participate in defect management work.

[0036] 4. The accuracy or reliability of engineers' defect classification judgments may vary with the engineers' skills in identifying defects. In addition, different engineers may have deviations in the classification judgment results of the same defect, resulting in poor consistency in the defect classification judgment results. Therefore, it is necessary to regularly verify the defect classification results.

[0037] In view of this, the technical solution of the present invention provides a new integrated system for chip defect processing, which is used to efficiently analyze, solve, organize and summarize defects.

[0038] in, Figure 1A module structure diagram of the integrated system for chip defect processing provided by the technical solution of the present invention.

[0039] Please refer to Figure 1 The integrated chip defect processing system provided by the technical solution of the present invention includes: a chip defect information storage module 20, a data analysis module 10 and an interactive tracking module 30; wherein:

[0040] The chip defect information storage module 20 stores a number of known chip defect case information D6, a number of known chip defect case basic information D3 and a first defect model D4, wherein the chip defect case information D6 at least includes the case basic information, the cause of the case, preventive measures and defect solution measures;

[0041] The data analysis module 10 is used for:

[0042] Acquire the original defect information D1 outputted by the machine end, pre-process the original defect information D1 to obtain basic information D2 of the defect information, and send the basic information D2 of the defect information to the chip defect information storage module 20 for storage; and

[0043] Defect anomaly judgment is performed on the basic information D2 of the defect information according to the first defect model D4; when defect anomaly exists in the basic information D2 of the defect information, the basic information D2 of the defect information is compared and analyzed with basic information D3 of several known chip defect cases stored in the chip defect information storage module 20 to obtain similarity information D5;

[0044] The interactive tracking module 30 is used to determine whether to retrieve several known chip defect case information D6 in the chip defect information storage module 20 according to the similarity information D5, and on this basis, to interact with the outside world to output defect solution information D9 to the outside world and obtain feedback information D7 from the outside world, form new case information D8 based on the feedback information D7, and send it to the chip defect information storage module 20 for storage, so as to update the chip defect case information D6 in the chip defect information storage module 20.

[0045] Through the above technical means, the technical solution of the present invention greatly improves the efficiency and accuracy of defect analysis, and greatly facilitates the sorting and summarization of defects. The specific principles are as follows:

[0046] The integrated system is provided with a chip defect information storage module 20, which stores a number of known chip defect case information D6, a number of known chip defect case basic information D3 and a first defect model D4, respectively. The chip defect case information D6 includes at least the basic information of the case, the cause of the case, preventive measures and defect resolution measures.

[0047] The integrated system is also provided with a data analysis module 10. The data analysis module 10 will pre-process the original defect information D1 outputted from the machine end to obtain the basic information D2 of the defect information, and send the obtained basic information D2 of the defect information to the chip defect information storage module 20 for storage to update the data in the chip defect information storage module 20. After completing the pre-processing of the original defect information D1, the data analysis module 10 will make a defect abnormality judgment on the obtained basic information D2 of the defect information according to the first defect model D4. When the data analysis module 10 determines that the basic information D2 of the defect information has a defect abnormality, it will call the basic information D3 of several known chip defect cases stored in the chip defect information storage module 20 and the basic information D2 of the defect information for comparison and analysis to obtain the similarity information D5.

[0048] The integrated system is also provided with an interactive tracking module 30. After the data analysis module 10 completes the comparison of the basic information D2 of the defect information and obtains the similarity information D5, the interactive tracking module 30 will formulate the corresponding defect solution information D9 according to the size of the similarity information D5 and output it to the outside world to notify the outside world to solve the corresponding defect. The interactive tracking module 30 is also used to organize and summarize the basic information D2 of the defect information, the defect solution plan and the defect prevention plan after the defect is solved, to form complete case information and store it in the chip defect information storage module 20, so as to update the chip defect case information D6 in the chip defect information storage module 20.

[0049] On the one hand, because the integrated system integrates the data collection, processing, storage and tracking of chip defects into one system, the storage, processing and tracking of defect information are synchronized and updated, maintaining data consistency. On the other hand, the integrated system will automatically analyze the original defect information D1 of the chip, formulate solutions, and track defect solutions until the defects are resolved. Compared with engineers manually analyzing defects and specifying solutions, the technical solution of the present invention greatly improves the work efficiency of defect resolution. On the other hand, in the process of solving chip defects, the data between different modules of the integrated system will be synchronously interconnected. Compared with the independent defect processing of the prior art, the technical solution of the present invention greatly enhances the flexibility and timeliness of chip defect data processing. On the other hand, after solving the chip defects, the integrated system will also store the defect case information in a timely manner, which improves the reliability of the information stored in the chip defect information storage module 20 and the update frequency of the stored information.

[0050] It should be noted that after preprocessing the original defect information D1, the data analysis module 10 still needs to use the first defect model D4 to make a defect abnormality judgment on the basic information D2 of the defect information. This is because: since there may be a possibility of misdiagnosis of defects on the machine side, it is necessary to use the first defect model D4 to perform defect abnormality judgment on the preprocessed data again.

[0051] It should be added that the first defect model D4 includes several models for defect judgment. For example, a defect counting model, a defect type model, and a defect distribution model, etc. The specific judgment model can be set according to the needs and is not limited here. Among them, the defect distribution model is used to analyze the distribution of defects on the wafer. The defect counting model is used to count the number of defects existing under specific conditions. The defect type model is used to identify the defect type on the wafer, for example, point defects, line defects, surface defects or body defects.

[0052] It should be added that the basic information D2 of the defect information at least includes: data of the fault detection control system, image information of the defect, data of the wafer acceptance test and the circuit probe test, and queue time. Of course, in addition to the data described above, the basic information D2 of the defect information may also include other data in the actual process, which is not limited here.

[0053] It should be added that the data analysis module 10 specifically analyzes and compares the basic information D2 of the defect information and several known chip defect case information D6 through a convolutional neural network algorithm. Of course, data comparison and analysis can also be performed through a custom analysis model or other AI analysis model, which is not limited here.

[0054] In order to make the above-mentioned objectives, features and beneficial effects of the present invention more obvious and easy to understand, the integrated system for chip defect processing provided by the present invention is described in detail below with reference to a specific embodiment.

[0055] As a specific implementation, the interaction tracking module 30 is specifically used for:

[0056] When the similarity information D5 is less than the first threshold, information is exchanged with the outside world, defect solution information D9 is output to the outside world and feedback information D7 from the outside world is obtained, new case information D8 is formed according to the feedback information D7, and is sent to the chip defect information storage module 20 for storage, so as to update the chip defect case information D6 in the chip defect information storage module 20;

[0057] When the similarity information D5 is greater than or equal to the first threshold, the interactive tracking module 30 is used to retrieve similar cases and external data from several known chip defect case information D6, generate a case report to interact with the outside world, output defect solution information D9 to the outside world and obtain feedback information D7 from the outside world, form new case information D8 based on the feedback information D7, and send it to the chip defect information storage module 20 for storage, so as to update the chip defect case information D6 in the chip defect information storage module 20.

[0058] Specifically, if the similarity information D5 is less than the first threshold, it means that the basic information D2 of the defect information is not similar to the stored chip defect case information D6, and it belongs to a new type of defect. Therefore, it is impossible to call the case cause and defect solution measures in the stored chip defect case information D6 to handle the defect, so the interactive tracking module 30 directly notifies the external yield improvement engineer to directly handle the defect. After the yield improvement engineer analyzes the defect and confirms the source and cause of the defect, he notifies the corresponding module to solve the defect. After the corresponding module solves the defect, the source, cause, solution and preventive measures corresponding to the defect are fed back to the interactive tracking module 30. The interactive tracking module 30 organizes the defect case information corresponding to the basic information, source, cause, solution and preventive measures of the defect and stores it in the chip defect information storage module 20. It should be noted that even if the yield improvement engineer is required to analyze the defect, the integrated system for chip defect processing will provide some stored analysis methods to assist the yield improvement engineer in defect analysis. Therefore, the analysis of new defects by yield improvement engineers is more efficient than the existing technology which requires engineers to manually query the defect manual or defect database.

[0059] If the similarity information D5 is greater than or equal to the first threshold, it means that there is chip defect case information D6 similar to the basic information D2 of the defect information. Therefore, the interactive tracking module 30 will first collect the corresponding production data in the chip production process, including but not limited to: production line delivery records, online abnormal analysis sheets, machine detection system information, module process parameters and experimental data analysis. After completing the collection of production data, the interactive tracking module 30 will call the chip defect case information D6 similar to the defect information and combine it with the production data to obtain the root cause of the defect, and notify the corresponding module to solve the defect. The corresponding module will verify the root cause of the defect and solve the defect. After solving the defect, the corresponding module will also send back the solution and preventive measures of the defect to the interactive tracking module 30. The interactive tracking module 30 organizes the basic information, source, cause, solution and preventive measures corresponding to the defect into complete defect case information and stores it in the chip defect information storage module 20.

[0060] Specifically, the first threshold is 40%. Of course, this data is the best data set by the inventor in the actual defect processing process, and the specific value can be adjusted according to actual needs and is not limited here.

[0061] It should be noted that the corresponding module is specifically the engineering group of the relevant process. For example, if the interactive tracking module 30 or the yield improvement engineer determines that the cause of the defect is the peeling phenomenon on the photoresist, the interactive tracking module 30 or the yield improvement engineer will notify the engineering group of the yellow light process to solve the defect anomaly.

[0062] As a specific implementation method, the interactive tracking module 30 is also used to generate a control instruction to the manufacturing execution system after receiving external feedback information D7. The manufacturing execution system controls the corresponding machine end to perform additional scanning to track whether there are other defect cases for the defect; and after the defect case tracking is completed, the complete case report is imported into the chip defect information storage module 20 for storage to update the chip defect case information D6 in the chip defect information storage module 20.

[0063] Specifically, after receiving the defect prevention measures and solutions fed back by the corresponding module, the interactive tracking module 30 will automatically generate a control instruction and output it to the external manufacturing execution system (MES). After receiving the control instruction, the manufacturing execution system will output an additional scan command to the machine end, so that the machine end rescans the wafer to track other possible defects besides the existing defects. The control instruction is specifically an intelligent sampling instruction, which enables the manufacturing execution system to automatically complete the online defect sampling of the wafer.

[0064] As a specific implementation manner, the data analysis module 10 is further configured to store the basic information D2 of the defect information into the chip defect information storage module 20 when there is no defect information in the basic information D2 of the defect information.

[0065] In summary, the integrated system for chip defect processing provided by the embodiment of the present invention will automatically analyze the original defect information of the chip, formulate solutions, and track defect solutions until the defects are resolved. Compared with engineers manually analyzing defects and specifying solutions, the technical solution of the present invention greatly improves the work efficiency and reliability of defect resolution. In addition, the integrated system integrates the data collection, processing, storage and tracking of chip defects into one system, realizes the synchronous update of the storage, processing and tracking of defect information, and maintains the consistency of the data. Furthermore, in the process of solving chip defects in the integrated system, the data between different modules will be synchronously interconnected. Compared with the independent defect processing of the prior art, the technical solution of the present invention greatly enhances the flexibility and timeliness of chip defect data processing. Finally, after solving the chip defects, the integrated system will also store the defect case information in a timely manner, which improves the reliability of the information stored in the chip defect information storage module and the update frequency of the stored information.

[0066] The technical solution of the present invention also provides a chip defect detection method, and uses the technical solution of the present invention to provide an integrated chip defect processing system for chip defect detection.

[0067] in, Figure 2 The process of the chip defect detection method provided by the technical solution of the present invention Figure 1 .

[0068] Please refer to Figure 1 and 2 The specific steps of the chip defect detection method provided by the technical solution of the present invention are as follows:

[0069] S1: acquiring defect information outputted by the machine end, preprocessing the original defect information D1 to obtain basic information D2 of the defect information, and sending the basic information D2 of the defect information to the chip defect information storage module 20 for storage.

[0070] S2: Determine defect abnormality of the basic information D2 of the defect information according to the first defect model D4; if abnormal, adjust to S4; if not abnormal, adjust to S3.

[0071] S3: storing the basic information D2 of the defect information and the defect judgment information into the chip defect information storage module 20.

[0072] S4: Compare and analyze the basic information D2 of the defect information with basic information D3 of several known chip defect cases stored in the chip defect information storage module 20 to obtain similarity information D5.

[0073] S5: determining whether to retrieve several known chip defect case information D6 in the chip defect information storage module 20 according to the similarity information D5, and on this basis, performing information exchange with the outside world to output defect solution information D9 to the outside world;

[0074] S6: Obtaining external feedback information D7, forming new case information D8 according to the feedback information D7, and sending it to the chip defect information storage module 20 for storage, so as to update the chip defect case information D6 in the chip defect information storage module 20.

[0075] Figure 3 The process of the chip defect detection method provided by the technical solution of the present invention Figure 2 .

[0076] Please refer to Figure 1 and 3 As a specific implementation method, in S5, it is determined whether to retrieve some known chip defect case information D6 in the chip defect information storage module 20 according to the similarity information D5, and on this basis, information is exchanged with the outside world to output defect solution information D9 to the outside world. The specific steps are as follows:

[0077] S51: Determine whether the similarity information D5 is greater than a first threshold value. If it is less than the first threshold value, jump to S52; if it is greater than the first threshold value, jump to S53.

[0078] S52: The interactive tracking module 30 directly outputs the defect resolution information D9 to the outside world to notify the outside world to resolve the corresponding defect.

[0079] S53: The interactive tracking module 30 retrieves similar cases and external data from the chip defect information storage module 20, generates a case report and outputs defect resolution information D9 to the outside world to notify the outside world to resolve the corresponding defects.

[0080] Among them, the interactive tracking module 30 in S52 interacts with the outside world and directly notifies the outside world to solve the corresponding defects, specifically including: the interactive tracking module 30 directly notifies the yield improvement engineer of the outside world to directly deal with the defects. After analyzing the defects and confirming the causes of the sources of the defects, the yield improvement engineer notifies the corresponding module to solve the defects.

[0081] The interactive tracking module 30 in S53 retrieves similar cases and external data in the chip defect information storage module 20, generates a case report to interact with the outside world, and notifies the outside world to solve the corresponding defects, specifically including: the interactive tracking module 30 will first collect the corresponding production data in the chip production process, including but not limited to: production line delivery records, online abnormal analysis sheets, machine detection system information, module process parameters and experimental data analysis. After completing the collection of production data, the interactive tracking module 30 will call the chip defect case information D6 similar to the defect information and combine it with the production data to obtain the root cause of the defect, and notify the corresponding module to solve the defect. The corresponding module will verify the root cause of the defect and solve the defect.

[0082] As a specific implementation method, S6 obtains external feedback information D7, forms new case information D8 based on the feedback information D7, and sends it to the chip defect information storage module 20 for storage, specifically including: after the corresponding module solves the defect, it will also send the solution and preventive measures of the defect back to the interactive tracking module 30. The interactive tracking module 30 organizes the basic information, source, cause, solution and preventive measures corresponding to the defect into complete defect case information and stores it in the chip defect information storage module 20.

[0083] The technical solution of the present invention also provides a computer-readable storage medium, and when the computer program is processed and executed, the steps of the chip defect detection method as described above are executed.

[0084] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. An integrated system for chip defect processing, characterized in that: include: Chip defect information storage module, data analysis module and interactive tracking module; among which: The chip defect information storage module stores information of several known chip defect cases, basic information of several known chip defect cases and a first defect model, wherein the chip defect case information at least includes basic information of the case, cause of the case, preventive measures and defect solution measures; The data analysis module is used for: Acquire original defect information output by the machine end, pre-process the original defect information to obtain basic information of the defect information, and send the basic information of the defect information to the chip defect information storage module for storage; and Determine defect anomalies on the basic information of the defect information according to the first defect model; when defect anomalies exist in the basic information of the defect information, compare and analyze the basic information of the defect information with basic information of several known chip defect cases stored in the chip defect information storage module to obtain similarity information; The interactive tracking module is used to determine whether to retrieve several known chip defect case information in the chip defect information storage module based on the similarity information, and on this basis, to interact with the outside world to output defect solution information to the outside world and obtain feedback information from the outside world, form new case information based on the feedback information, and send it to the chip defect information storage module for storage, so as to update the chip defect case information in the chip defect information storage module.

2. The integrated system for chip defect processing according to claim 1, characterized in that: The interaction tracking module is specifically used for: When the similarity information is less than a first threshold, information is exchanged with the outside world, defect resolution information is output to the outside world and feedback information from the outside world is obtained, new case information is formed according to the feedback information, and sent to the chip defect information storage module for storage, so as to update the chip defect case information in the chip defect information storage module; When the similarity information is greater than or equal to a first threshold, the interactive tracking module is used to retrieve similar cases and external data from several known chip defect case information, generate a case report to interact with the outside world, output defect solution information to the outside world and obtain feedback information from the outside world, form new case information based on the feedback information, and send it to the chip defect information storage module for storage, so as to update the chip defect case information in the chip defect information storage module.

3. The integrated system for chip defect processing according to claim 2, characterized in that: The external data includes at least: production line delivery records, online abnormality analysis sheets, machine detection system information, module process parameters and experimental data analysis.

4. The integrated system for chip defect processing according to claim 2, characterized in that: The interactive tracking module is also used to generate a control instruction to the manufacturing execution system after receiving feedback information from the outside world, and the manufacturing execution system controls the corresponding machine end to perform additional scanning to track whether the defect has other defect cases; After the defect case tracking is completed, the complete case report is imported into the chip defect information storage module for storage to update the chip defect case information in the chip defect information storage module.

5. The integrated system for chip defect processing according to claim 1, characterized in that: The data analysis module is also used to store the basic information of the defect information in the chip defect information storage module when there is no defect information in the basic information of the defect information.

6. The integrated system for chip defect processing according to claim 1, characterized in that: The feedback information at least includes processing measures and preventive measures for resolving defect information.

7. A chip defect detection method, characterized in that: Using the integrated chip defect processing system according to any one of claims 1 to 6 to perform chip defect detection, the method comprising: Acquire defect information output by the machine end, pre-process the original defect information to obtain basic information of the defect information, and send the basic information of the defect information to the chip defect information storage module for storage; Determine defect anomalies on the basic information of the defect information according to the first defect model; when defect anomalies exist in the basic information of the defect information, compare and analyze the basic information of the defect information with basic information of several known chip defect cases stored in the chip defect information storage module to obtain similarity information; Determine whether to retrieve several known chip defect case information in the chip defect information storage module based on the similarity information, and on this basis, interact with the outside world to output defect solution information to the outside world and obtain feedback information from the outside world, form new case information based on the feedback information, and send it to the chip defect information storage module for storage, so as to update the chip defect case information in the chip defect information storage module.

8. The chip defect detection method according to claim 7, characterized in that: Determining whether to retrieve similar cases in the chip defect information storage module according to the similarity information, and exchanging information with the outside world on this basis, specifically includes: When the similarity information is less than a first threshold, the interactive tracking module interacts with the outside world, outputs defect resolution information to the outside world and obtains feedback information from the outside world, forms new case information according to the feedback information, and sends it to the chip defect information storage module for storage, so as to update the chip defect case information in the chip defect information storage module; When the similarity information is greater than or equal to a first threshold, the interactive tracking module retrieves similar cases and external data in the chip defect information storage module, generates a case report to interact with the outside world, outputs defect resolution information to the outside world and obtains feedback information from the outside world, forms new case information based on the feedback information, and sends it to the chip defect information storage module for storage, so as to update the chip defect case information in the chip defect information storage module.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is processed and executed, the steps of the chip defect detection method according to claim 7 or 8 are executed.

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