An electronic book tag capable of reminding temperature and humidity

Abstract

The present invention provides a book electronic tag capable of reminding temperature and humidity, belonging to the technical field of electronic tags, which includes an encapsulation housing, a chip, a data wire, and a temperature and humidity sensing module. The chip is arranged inside the encapsulation housing; one end of the data wire extends into the interior of the encapsulation housing and is connected to the chip to transmit signals; the temperature and humidity sensing module is connected to the data wire to transmit signals. The present invention can fix the encapsulation housing on the outside of books such as books or file boxes to facilitate scanning and reading of data, while placing the temperature and humidity sensing module inside books such as books or file boxes for temperature and humidity monitoring. The monitoring results can be transmitted to an external receiving device through the chip during scanning, so as to judge whether the physical state of the book is normal according to the temperature and humidity data; in this way, accurate monitoring of the temperature and humidity of specific books can be realized, which is convenient for book management, thereby reducing the possibility of damage or destruction.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic tags, and more specifically, relates to a book electronic tag capable of reminding temperature and humidity. Background Art

[0002] Currently, in the work of library management, through the existing library management system, the access status of books can be conveniently monitored, but it is relatively difficult to monitor the physical status of specific books.

[0003] For example, book materials need to be stored within a certain temperature and humidity range, otherwise they are prone to mildew, insect infestation or fire. Currently, the common way to monitor temperature and humidity is to set up a thermometer and a hygrometer in the library, and be monitored regularly by a special person; however, this method can actually only monitor the temperature and humidity in the library, and cannot monitor the temperature and humidity of specific books.

[0004] Another example is that during the process of borrowing and filing books, occasionally there will be situations where the books are returned without being completely dried inside after being soaked in water, or there are contaminants and flammable substances such as food, medicine, power banks, and Bluetooth headsets in the returned books or file boxes. If these situations are not discovered during the process of sorting and filing, it may lead to the damage of books due to mildew, insect infestation or fire, and these situations are difficult to monitor through existing methods.

[0005] In addition, roof or wall seepage, air conditioner leakage, summer moisture return, and electrical circuit failures are likely to cause abnormal temperature and humidity in a part of the library, or even a small part of the bookshelf, and these situations are also difficult to monitor through existing methods. Summary of the Invention

[0006] The purpose of the present invention is to provide a book electronic tag capable of reminding temperature and humidity, so as to solve the technical problem of difficult monitoring of the physical status of specific books in the prior art.

[0007] To achieve the above object, the technical solution adopted by the present invention is: to provide a book electronic tag capable of reminding temperature and humidity, including a packaging shell, a chip, a data wire, and a temperature and humidity sensing module. The chip is arranged inside the packaging shell; one end of the data wire extends into the interior of the packaging shell and is connected to the chip to transmit signals; the temperature and humidity sensing module is connected to the data wire to transmit signals.

[0008] Combined with the above technical solution, in a possible implementation manner, the chip includes a substrate, a control module, a power module, and a communication module. The control module is integrated on the substrate and is connected to the data wire to transmit signals; the power module is arranged inside the packaging shell and is connected to the control module to supply power; the communication module is integrated on the substrate and is connected to the control module to transmit signals.

[0009] Combined with the above technical solution, in a possible implementation, the chip further includes a display module and an alarm module. The display module is disposed on the substrate and connected to the control module to transmit signals; the alarm module is disposed on the substrate and connected to the control module to transmit signals; a window corresponding to the display module is provided on the encapsulation housing.

[0010] Combined with the above technical solution, in a possible implementation, the temperature and humidity sensing module includes a protective jacket, a temperature sensor, and a humidity sensor. The temperature sensor is used to detect temperature data, is disposed inside the protective jacket, and is connected to a data wire to transmit signals; the humidity sensor is used to detect humidity data, is disposed inside the protective jacket, and is connected to the data wire to transmit signals. Vent holes are provided at the position of the sensing part of the humidity sensor on the protective jacket.

[0011] Combined with the above technical solution, in a possible implementation, the temperature sensor includes a first insulating substrate, a first electrode group, and a thermistor. The first insulating substrate is disposed inside the protective jacket; the first electrode group is disposed on the first insulating substrate and connected to the data wire; the thermistor is disposed on the first insulating substrate and connected to the first electrode group; the humidity sensor includes a second insulating substrate, a second electrode group, a humidity-sensitive film, and a water-permeable gasket. The second insulating substrate is disposed inside the protective jacket; the second electrode group is disposed on the second insulating substrate and connected to the data wire; the humidity-sensitive film is a film structure with different capacitances or resistances at different humidities, is disposed on the second insulating substrate, and is connected to the second electrode group; the water-permeable gasket is a sheet-like or film-like structure that can permeate air and water, covers the outside of the humidity-sensitive film, vent holes are provided at the position of the water-permeable gasket on the protective jacket, and the edge of the water-permeable gasket is hermetically connected to the protective jacket.

[0012] Combined with the above technical solution, in a possible implementation, the protective jacket is a plastic hot-press encapsulation structure; the first insulating substrate and the second insulating substrate are arranged at intervals inside the protective jacket.

[0013] Combined with the above technical solution, in a possible implementation, a strengthening protective layer is provided outside the data wire. The strengthening protective layer is a sheet-like structure, and one end is connected to the encapsulation housing and the other end is connected to the protective jacket.

[0014] Combined with the above technical solution, in a possible implementation, reinforcing ribs are further provided on the strengthening protective layer; the data wire is arranged in a wavy shape inside the strengthening protective layer; the strengthening protective layer is a planar spring curve structure; the strengthening protective layer and the protective jacket are connected by integral molding, bonding, welding, or clamping.

[0015] Combined with the above technical solution, in a possible implementation, a rotating connection assembly is provided on the encapsulation housing, and the strengthening protective layer is connected to the rotating connection assembly.

[0016] Combined with the above technical solutions, in a possible implementation, one side of the encapsulation housing is provided with an adhesive surface, and an adhesive layer is provided on the adhesive surface.

[0017] The beneficial effects of the book electronic tag capable of reminding temperature and humidity provided by the present invention are as follows: Compared with the prior art, when the present invention is used, the encapsulation housing can be fixed to the outside of books or file boxes and other books to facilitate scanning and reading data. Since the data wire has a certain length, the temperature and humidity sensing module can be placed inside books or file boxes and other books to monitor the internal temperature and humidity, and the monitoring results can be transmitted to an external receiving device through the chip during scanning, so as to judge whether the physical state of the book is normal according to the temperature and humidity data; Through this form, accurate monitoring of the temperature and humidity of specific books can be realized, which is convenient for the management of books, thereby reducing the possibility of damage or destruction. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0019] Figure 1 It is a top view structural schematic diagram of the book electronic tag capable of reminding temperature and humidity provided by an embodiment of the present invention in a flattened state;

[0020] Figure 2 It is a structural schematic diagram of the book electronic tag capable of reminding temperature and humidity provided by another embodiment of the present invention in a flattened state and cut along the horizontal plane;

[0021] Figure 3 For Figure 2 an enlarged structural schematic diagram of the temperature and humidity sensing module part;

[0022] Figure 4 It is a front view structural schematic diagram of the book electronic tag capable of reminding temperature and humidity provided by yet another embodiment of the present invention in a flattened state;

[0023] Figure 5 For Figure 4 a lateral sectional view structural schematic diagram of the rotating connection component part of the embodiment.

[0024] Among them, the reference numerals in the drawings are as follows:

[0025] 10. Encapsulation housing; 11. Adhesive surface; 12. Accommodation groove; 13. T-shaped sliding groove;

[0026] 141. Rotating shaft; 142. Wire groove; 143. Turntable; 144. Positioning elastic member; 145. Buffer traction shaft; 146. Buffer elastic member; 147. Narrow opening

[0027] 20. Chip; 21. Substrate; 22. Control module; 23. Power module; 24. Communication module; 25. Display module; 26. Alarm module

[0028] 30. Data wire; 31. Reinforced protective layer; 32. Reinforcing rib wire

[0029] 40. Temperature and humidity sensing module; 41. Protective jacket; 411. Ventilation hole

[0030] 42. Temperature sensor; 421. First insulating substrate; 422. First electrode group; 423. Thermistor

[0031] 43. Humidity sensor; 431. Second insulating substrate; 432. Second electrode group; 433. Humidity sensitive film; 434. Water permeable gasket Detailed implementation mode

[0032] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0033] It should be further noted that the drawings and embodiments of the present invention mainly describe and explain the concept of the present invention. On the basis of this concept, the specific forms and settings of some connection relationships, positional relationships, power mechanisms, power supply systems, hydraulic systems and control systems may not be fully described. However, on the premise that those skilled in the art understand the concept of the present invention, those skilled in the art can adopt well-known methods to implement the above specific forms and settings.

[0034] When an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0035] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more, and "several" means one or more, unless otherwise specifically defined.

[0036] Now, the book electronic tag capable of reminding temperature and humidity provided by the present invention will be described.

[0037] As Figure 1 shown, a first embodiment of the present invention provides a book electronic tag capable of reminding temperature and humidity, including an encapsulation housing 10, a chip 20, a data wire 30, and a temperature and humidity sensing module 40. The chip 20 is disposed inside the encapsulation housing 10; one end of the data wire 30 extends into the encapsulation housing 10 and is connected to the chip 20 to transmit signals; the temperature and humidity sensing module 40 is connected to the data wire 30 to transmit signals.

[0038] For the book electronic tag capable of reminding temperature and humidity provided in this embodiment, compared with the prior art, when in use, the encapsulation housing 10 can be fixed to the outside of books or file boxes and other books, so as to facilitate scanning and reading data. Since the data wire 30 has a certain length, the temperature and humidity sensing module 40 can be placed inside books or file boxes and other books to monitor the internal temperature and humidity, and the monitoring results can be transmitted to an external receiving device through the chip 20 during scanning, so as to judge whether the physical state of the book is normal according to the temperature and humidity data; in this way, accurate monitoring of the temperature and humidity of specific books can be achieved, which is convenient for the management of books, thereby reducing the possibility of damage or destruction.

[0039] As Figures 1 to 5 shown, some specific embodiments provided by the present invention on the basis of the first embodiment are as follows:

[0040] As Figure 2 and Figure 5 shown, one side of the encapsulation housing 10 is provided with a paste surface 11, and a paste layer is provided on the paste surface 11 to facilitate directly pasting and fixing the encapsulation housing 10 on books, file boxes or other positions.

[0041] As Figure 2 shown, the chip 20 includes a substrate 21, a control module 22, a power module 23, and a communication module 24. The control module 22 is integrated on the substrate 21 and is connected to the data wire 30 to transmit signals; the power module 23 is disposed inside the encapsulation housing 10 and is connected to the control module 22 to supply power; the communication module 24 is integrated on the substrate 21 and is connected to the control module 22 to transmit signals.

[0042] Specifically, the power supply module 23 can be a battery, a charging interface, an induction coil, or other components that can supply power to power-consuming modules or components such as the control module 22; the communication module 24 is preferably a radio frequency module, and can also be a wireless signal transceiver module for active communication.

[0043] During use, the control module 22 obtains and processes the temperature and humidity signals detected by the temperature and humidity sensing module 40 through the data wire 30, and then sends the signals to an external receiving device through the communication module 24 to transmit the temperature and humidity data.

[0044] Furthermore, the chip 20 further includes a display module 25 and an alarm module 26. The display module 25 is provided on the substrate 21 and is connected to the control module 22 to transmit signals; the alarm module 26 is provided on the substrate 21 and is connected to the control module 22 to transmit signals; a window corresponding to the display module 25 is provided on the packaging housing 10.

[0045] The alarm module 26 can be a module that can generate signals such as sound, light, or vibration that can be directly felt by the administrator. During use, the detected temperature, humidity, and other parameters can be directly obtained through the display module 25, and when parameters such as temperature and humidity exceed the rated values, the control module 22 controls the alarm module 26 to emit an alarm signal to alert the administrator.

[0046] Such as Figure 2 and Figure 3 As shown, the temperature and humidity sensing module 40 includes a protective jacket 41, a temperature sensor 42, and a humidity sensor 43. The temperature sensor 42 is used to detect temperature data, is provided inside the protective jacket 41, and is connected to the data wire 30 to transmit signals; the humidity sensor 43 is used to detect humidity data, is provided inside the protective jacket 41, and is connected to the data wire 30 to transmit signals. An air vent 411 is provided at a position on the protective jacket 41 corresponding to the sensing part of the humidity sensor 43 to facilitate the passage of air.

[0047] The protective jacket 41 is used to carry the temperature sensor 42 and the humidity sensor 43 to provide strength and protect the temperature sensor 42 and the humidity sensor 43.

[0048] The temperature sensor 42 can adopt relatively thin and light temperature sensors such as a thin-film temperature sensor or a chip-type thermistor; the humidity sensor 43 can adopt relatively small humidity sensors such as a resistive humidity-sensitive element or a capacitive humidity-sensitive element.

[0049] In some specific embodiments, the temperature sensor 42 includes a first insulating substrate 421, a first electrode group 422, and a thermistor 423. The first insulating substrate 421 is disposed within the protective jacket 41; the first electrode group 422 is disposed on the first insulating substrate 421 and is connected to the data wire 30; the thermistor 423 is disposed on the first insulating substrate 421 and is connected to the first electrode group 422.

[0050] During use, the control module 22 of the chip 20 detects the resistance change of the thermistor 423 through the data wire 30 and the first electrode group 422, and after data processing, temperature data can be obtained.

[0051] The humidity sensor 43 includes a second insulating substrate 431, a second electrode group 432, a humidity-sensitive film 433, and a water-permeable gasket 434. The second insulating substrate 431 is disposed within the protective jacket 41; the second electrode group 432 is disposed on the second insulating substrate 431 and is connected to the data wire 30; the humidity-sensitive film 433 is a film structure having different capacitances or resistances at different humidities, and is disposed on the second insulating substrate 431 and is connected to the second electrode group 432; the water-permeable gasket 434 is a sheet-like or film-like structure capable of passing air and water, covering the outside of the humidity-sensitive film 433, and ventilation holes 411 are provided at the corresponding position of the protective jacket 41 for the water-permeable gasket 434, and the edge of the water-permeable gasket 434 is hermetically connected to the protective jacket 41 by bonding, welding or the like.

[0052] During use, air and water vapor act on the humidity-sensitive film 433 through the water-permeable gasket 434, causing the capacitance or resistance of the humidity-sensitive film 433 to change. The control module 22 of the chip 20 detects the change in the capacitance value or resistance value of the humidity-sensitive film 433 through the data wire 30 and the first electrode group 422, and after data processing, humidity data can be obtained.

[0053] Specifically, the protective jacket 41 is a plastic thermocompression packaging structure, so that the temperature and humidity sensing module 40 is more lightweight and compact for easy use.

[0054] The first insulating substrate 421 and the second insulating substrate 431 are spaced apart within the protective jacket 41 to improve the sealing performance and prevent air or water vapor from contacting the thermistor 423, affecting the use of the thermistor 423.

[0055] Such as Figure 2 and Figure 4 As shown, a reinforcing protective layer 31 is provided outside the data wire 30. The reinforcing protective layer 31 is a sheet-like structure, one end of which is connected to the encapsulation housing 10 and the other end is connected to the protective jacket 41, so as to strengthen and protect the data wire 30, reduce the possibility of damage to the data wire 30, and at the same time, the sheet-like reinforcing protective layer 31 can prevent the data wire 30 from being twisted, thereby reducing the damage caused by torsional fatigue.

[0056] Furthermore, reinforcing rib lines 32 are also provided on the reinforcing protective layer 31 to enhance the tensile strength of the data wire 30.

[0057] The data wire 30 is arranged in a wavy shape within the reinforcing protective layer 31 so that the data wire 30 will not be broken even after the reinforcing protective layer 31 is stretched.

[0058] The reinforcing protective layer 31 is in the shape of a planar spring curve, i.e., a curve such as a wavy line or a broken line, so that the reinforcing protective layer 31 has a certain elasticity and can be stretched or bent moderately for convenient use.

[0059] Specifically, the reinforcing protective layer 31 and the protective outer sleeve 41 are connected by means of integral molding, bonding, welding, snap connection, etc.

[0060] Such as Figure 4 and Figure 5 As shown, a rotating connection assembly is provided on the encapsulation housing 10, and the reinforcing protective layer 31 is connected to the rotating connection assembly so that the reinforcing protective layer 31 can rotate to a certain extent, ensuring that the reinforcing protective layer 31 can extend smoothly to the required position regardless of the location of the encapsulation housing 10, avoiding the situation of the reinforcing protective layer 31 standing up or folding, which is beneficial to the protection of the data wire 30.

[0061] In some specific embodiments, a receiving groove 12 is provided on the encapsulation housing 10, a T-shaped sliding groove 13 is provided in the receiving groove 12, and a wire passing through hole communicating with the inside of the encapsulation housing 10 is provided at one end of the T-shaped sliding groove 13; the rotating connection assembly includes a rotating shaft 141, a turntable 143, and a positioning elastic member 144. The rotating shaft 141 is a tubular structure with both ends communicating, and a T-shaped head for sliding and limiting cooperation with the T-shaped sliding groove 13 is provided at one end. A wire passing groove 142 is provided on the side of the T-shaped head facing the wire passing through hole; the turntable 143 is rotatably connected to the other end of the rotating shaft 141, and a cavity is provided inside. The reinforcing protective layer 31 is connected to the turntable 143, and the data wire 30 extends into the turntable 143, passes through the rotating shaft 141, passes through the wire passing groove 142 and the wire passing through hole, and then extends into the encapsulation housing 10. A friction limiting structure is provided between the side of the turntable 143 and the side wall of the receiving groove 12; the positioning elastic member 144 is respectively connected to the rotating shaft 141 and the encapsulation housing 10 to provide an elastic force for pressing the turntable 143 against the side wall of the receiving groove 12, so as to limit the rotation angle of the turntable 143 through the friction limiting structure.

[0062] The friction limiting structure can be structures or components such as teeth, anti-slip patterns, or anti-slip soft pads provided on the side of the turntable 143 and the side wall of the receiving groove 12 that can perform friction positioning on the turntable 143. The positioning elastic member 144 can be an element such as a spring, a spring sheet, or an elastic block that can provide an elastic force.

[0063] During use, by pulling the reinforcement protection layer 31 or the turntable 143, the side of the turntable 143 is separated from the side wall of the receiving groove 12, and the turntable 143 is rotated so that the reinforcement protection layer 31 faces the appropriate direction. Then, the reinforcement protection layer 31 and the turntable 143 are released, so that the turntable 143 presses on the elastic force of the side wall of the receiving groove 12 driven by the positioning elastic member 144. The rotation angle of the turntable 143 is limited by the friction limiting structure to prevent the turntable 143 from being too loose, resulting in the reinforcement protection layer 31 moving randomly under the action of gravity or vibration when taking or transporting books, causing the position of the temperature and humidity sensing module 40 to move or damaging the books. At the same time, it can also make the arrangement of the books more neat and beautiful.

[0064] Furthermore, a buffer traction shaft 145 and a buffer elastic member 146 are provided inside the turntable 143. A slit 147 for the reinforcement protection layer 31 to pass through is provided on the side wall of the turntable 143. The buffer elastic member 146 is respectively connected to the turntable 143 and the buffer traction shaft 145 to provide an elastic force for the buffer traction shaft 145 to move away from the slit 147; one end of the reinforcement protection layer 31 penetrates into the slit, bypasses the buffer traction shaft 145, and then returns to the middle of the turntable 143 and is fixedly connected to the turntable 143.

[0065] In this way, when pulling the reinforcement protection layer 31, the buffer traction shaft 145 moves towards the slit 147, so that one end of the reinforcement protection layer 31 extends out of the slit 147 for a certain distance, playing a buffering role to prevent the connection between the reinforcement protection layer 31 and the turntable 143 from being disconnected due to accidental strong pulling.

[0066] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An electronic book tag capable of reminding temperature and humidity, characterized in that Comprising: An encapsulation housing (10); A chip (20) disposed within the encapsulation housing (10); A data wire (30) having one end extending into the interior of the encapsulation housing (10) and connected to the chip (20) to transmit signals; A temperature and humidity sensing module (40) connected to the data wire (30) to transmit signals; An enhanced protective layer (31) is provided outside the data wire (30). The enhanced protective layer (31) is a sheet-like structure, with one end connected to the encapsulation housing (10) and the other end connected to a protective jacket (41); A rotational connection assembly is provided on the encapsulation housing (10), and the enhanced protective layer (31) is connected to the rotational connection assembly; The encapsulation housing (10) is provided with a receiving groove (12). A T-shaped sliding groove (13) is provided within the receiving groove (12). One end of the T-shaped sliding groove (13) is provided with a wire passing through hole communicating with the interior of the encapsulation housing (10). The rotational connection assembly includes a rotating shaft (141), a turntable (143), and a positioning elastic member (144). The rotating shaft (141) is a tubular structure with both ends communicating, and one end is provided with a T-shaped head that is slidably and limit-fitted with the T-shaped sliding groove (13). A wire passing groove (142) is provided on the side of the T-shaped head facing the wire passing through hole; the turntable (143) is rotatably connected to the other end of the rotating shaft (141), and has a cavity inside. The enhanced protective layer (31) is connected to the turntable (143), and the data wire (30) extends into the turntable (143), passes through the rotating shaft (141), passes through the wire passing groove (142) and the wire passing through hole, and then extends into the encapsulation housing (10). A friction limiting structure is provided between the side of the turntable (143) and the side wall of the receiving groove (12); the positioning elastic member (144) is connected to the rotating shaft (141) and the encapsulation housing (10) respectively, for providing an elastic force to press the turntable (143) against the side wall of the receiving groove (12), so as to limit the rotation angle of the turntable (143) through the friction limiting structure.

2. The electronic book tag capable of reminding temperature and humidity according to claim 1, characterized in that, The chip (20) includes: A substrate (21); A control module (22) integrated on the substrate (21) and connected to the data wire (30) to transmit signals; A power supply module (23) disposed within the encapsulation housing (10) and connected to the control module (22) for power supply; A communication module (24) integrated on the substrate (21) and connected to the control module (22) to transmit signals.

3. The book electronic tag capable of reminding temperature and humidity according to claim 2, characterized in that, The chip (20) further includes: A display module (25) disposed on the substrate (21) and connected to the control module (22) to transmit signals; An alarm module (26) disposed on the substrate (21) and connected to the control module (22) to transmit signals; A window corresponding to the display module (25) is provided on the encapsulation housing (10).

4. The book electronic label capable of reminding temperature and humidity according to claim 1, characterized in that, The temperature and humidity sensing module (40) includes: A protective jacket (41); A temperature sensor (42) for detecting temperature data, disposed within the protective jacket (41) and connected to the data wire (30) to transmit signals; A humidity sensor (43) for detecting humidity data is disposed within the protective jacket (41) and connected to the data wire (30) to transmit signals. An air vent (411) is provided at a position on the protective jacket (41) corresponding to the sensing portion of the humidity sensor (43).

5. The book electronic tag capable of reminding temperature and humidity according to claim 4, characterized in that, The temperature sensor (42) includes: A first insulating substrate (421) disposed within the protective jacket (41); A first electrode group (422) disposed on the first insulating substrate (421) and connected to the data wire (30); A thermistor (423) disposed on the first insulating substrate (421) and connected to the first electrode group (422); The humidity sensor (43) includes: A second insulating substrate (431) disposed within the protective jacket (41); A second electrode group (432) disposed on the second insulating substrate (431) and connected to the data wire (30); A humidity-sensitive film (433), which is a film structure having different capacitances or resistances at different humidities, is disposed on the second insulating substrate (431) and connected to the second electrode group (432); A water-permeable gasket (434), which is a sheet-like or film-like structure capable of passing air and water, covers the outside of the humidity-sensitive film (433). The air vent (411) is provided at a position on the protective jacket (41) corresponding to the water-permeable gasket (434), and the edge of the water-permeable gasket (434) is hermetically connected to the protective jacket (41).

6. The book electronic tag capable of reminding temperature and humidity according to claim 5, characterized in that: The protective jacket (41) is a plastic thermocompression packaging structure; the first insulating substrate (421) and the second insulating substrate (431) are spaced apart within the protective jacket (41).

7. The book electronic label capable of reminding temperature and humidity according to claim 1, characterized in that: Reinforcing rib lines (32) are further provided on the reinforcing protective layer (31); the data wire (30) is arranged in a wavy shape within the reinforcing protective layer (31); the reinforcing protective layer (31) is a planar spring curve structure; the reinforcing protective layer (31) is connected to the protective jacket (41) by integral molding, bonding, welding, or clamping.

8. The book electronic tag capable of reminding temperature and humidity according to claim 1, characterized in that: One side of the encapsulation housing (10) is provided with an adhesive surface (11), and an adhesive layer is provided on the adhesive surface (11).

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