Photoetching image defect detection method, device, storage medium and system

Abstract

The invention discloses a photolithographic image defect detection method and device, a storage medium and a system.The photolithographic image defect detection method comprises the steps that a photolithographic image is obtained, and the photolithographic image comprises a plurality of to-be-detected patterns arranged in a two-dimensional array; determining the detection direction, the detection range and the detection type of defect detection; determining at least one group of target to-be-detected graphs according to the detection direction, the detection range and the detection type, wherein each group of target to-be-detected graphs comprises two to-be-detected graphs; acquiring a center distance between two to-be-measured graphs in each group of target to-be-measured graphs; and determining whether each group of target to-be-detected graphs have defects or not based on the center distance. According to the scheme, the accuracy of photolithographic image defect detection can be improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of photolithography technology, and specifically to a photolithography image defect detection method, device, storage medium and system. Background Art

[0002] In the field of semiconductor integrated circuit technology, after exposure, the measurement of the key dimensions of the pattern obtained by lithography is particularly important. As the key dimensions of semiconductors become smaller and smaller, the number of semiconductor devices and the difficulty of processes become more and more complex, the demand for the measurement of key dimensions of patterns has also increased significantly, and at the same time, the demand for diversified measurement methods has also increased significantly.

[0003] Moreover, as the types of measured patterns increase, the measurement methods for different types of patterns are also improved. For example, most of the patterns in semiconductors used for storage are repeated array patterns. The patterns are simple, small in size and repeated. It is difficult for common bridge connection detectors to accurately detect whether the patterns are deviated, that is, the accuracy of photolithography image defect detection is not high. Summary of the invention

[0004] The embodiments of the present application provide a method, device, storage medium and system for detecting defects in lithography images, which can improve the accuracy of lithography image defect detection.

[0005] In a first aspect, an embodiment of the present application provides a method for detecting defects in a lithography image, comprising: Acquire a photolithography image, wherein the photolithography image includes a plurality of patterns to be tested arranged in a two-dimensional array; Determine the detection direction, detection range and detection type of defect detection; Determine at least one group of target graphics to be tested according to the detection direction, the detection range and the detection type, each group of target graphics to be tested includes two graphics to be tested; Obtaining the center distance between two of the target patterns to be tested in each group of the target patterns to be tested; Determine whether each group of the target patterns to be tested has defects based on the center distance.

[0006] In the photolithography image defect detection method provided in an embodiment of the present application, when the detection type is the first detection type, determining at least one group of target patterns to be detected according to the detection direction, the detection range and the detection type includes: Taking any of the patterns to be tested within the detection range as the current detection pattern; The pattern to be tested that is detected for the first time in the detection direction based on the current detection pattern and the current detection pattern are taken as a group of target patterns to be tested.

[0007] In the photolithography image defect detection method provided in an embodiment of the present application, when the detection type is the second detection type, determining at least one group of target patterns to be detected according to the detection direction, the detection range and the detection type includes: Taking any of the patterns to be tested within the detection range as the current detection pattern; All the patterns to be detected based on the current detection pattern in the detection direction are respectively combined with the current detection pattern to form a group of target patterns to be detected.

[0008] In the photolithography image defect detection method provided in the embodiment of the present application, the step of obtaining the center distance between two of the target patterns to be tested in each group includes: Determining the centroid positions of two of the target graphics to be tested in each group of the target graphics to be tested; Taking the center of gravity position as the center position of the figure to be measured; The center distance between two of the target patterns to be tested in each group of the target patterns to be tested is calculated based on the center distance.

[0009] In the photolithography image defect detection method provided in the embodiment of the present application, determining whether each group of the target patterns to be tested has defects based on the center distance includes: Preset one or more center distance thresholds; The center distance is compared with the center distance threshold, and whether each group of the target patterns to be tested has defects is determined according to the comparison result.

[0010] In the photolithography image defect detection method provided in the embodiment of the present application, determining whether each group of the target patterns to be tested has defects according to the comparison result includes: When the center distance is greater than or less than the center distance threshold, it is determined that the target graphics to be tested in the current group have defects; When the center distance is equal to the center distance threshold, it is determined that the target graphics to be tested in the current group are normal.

[0011] In the photolithography image defect detection method provided in the embodiment of the present application, when it is determined that the target patterns to be tested in the current group have defects, the target patterns to be tested in the current group are marked.

[0012] In a second aspect, an embodiment of the present application provides a lithography image defect detection device, comprising: An image acquisition unit, used for acquiring a photolithography image, wherein the photolithography image includes a plurality of patterns to be measured arranged in a two-dimensional array; A first determination unit, used to determine a detection direction, a detection range and a detection type of defect detection; A second determining unit, configured to determine at least one group of target patterns to be tested according to the detection direction, the detection range and the detection type, each group of the target patterns to be tested including two patterns to be tested; A distance acquisition unit, used for acquiring the center distance between two of the target patterns to be tested in each group of the target patterns to be tested; A defect detection unit is used to determine whether each group of the target patterns to be tested has defects based on the center distance.

[0013] In a third aspect, an embodiment of the present application provides a storage medium, wherein the storage medium stores a plurality of instructions, wherein the instructions are suitable for loading by a processor to execute any of the above-mentioned lithography image defect detection methods.

[0014] In a fourth aspect, an embodiment of the present application provides a lithography image defect detection system, comprising an input module, a detection module and an output module, wherein the detection module is connected to the input module and the output module respectively; the input module is used to detect information; the detection module is integrated with the above-mentioned lithography image defect detection device, and the detection module is used to perform defect detection based on the detection information; the output module is used to output the detection results.

[0015] In summary, the photolithography image defect detection method provided by the embodiment of the present application includes acquiring a photolithography image, wherein the photolithography image includes a plurality of test patterns arranged in a two-dimensional array; determining the detection direction, detection range, and detection type of defect detection; determining at least one group of target test patterns according to the detection direction, the detection range, and the detection type, wherein each group of the target test patterns includes two test patterns; acquiring the center distance between two test patterns in each group of the target test patterns; and determining whether each group of the target test patterns has a defect based on the center distance. This solution can improve the accuracy of photolithography image defect detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 It is a flow chart of the photolithography image defect detection method provided in an embodiment of the present application.

[0018] Figure 2 It is a schematic diagram of the arrangement of the photolithography image provided in the embodiment of the present application.

[0019] Figure 3It is a structural schematic diagram of a lithography image defect detection device provided in an embodiment of the present application.

[0020] Figure 4 It is a structural schematic diagram of a lithography image defect detection system provided in an embodiment of the present application.

[0021] Figure 5 It is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0022] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0023] It should be noted that, in this article, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined by their explanation in the specific embodiment or further combined with the context of the specific embodiment.

[0024] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0025] In the subsequent description, the suffixes such as "module", "component" or "unit" used to represent elements are only used to facilitate the description of the present application, and have no specific meanings. Therefore, "module", "component" or "unit" can be used in a mixed manner.

[0026] In the description of the present application, it should be noted that the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, terms such as "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0027] As the types of measured graphics increase, the measurement methods for different types of graphics are also improved. For example, most of the graphics in semiconductors used for storage are repeated array graphics. The graphics are simple, small in size and repeated. Common bridge connection detectors are difficult to accurately detect whether the graphics are deviated. That is, the accuracy of lithography image defect detection is not high.

[0028] Based on this, the embodiments of the present application provide a method, device, storage medium and system for lithography image defect detection. Specifically, the lithography image defect detection device can be integrated in a lithography image defect detection system, and the lithography image defect detection system can be integrated in an electronic device, which can be a server or a terminal; wherein the terminal can include terminal devices such as a tablet computer, a laptop computer, and a personal computer (PC); the server can be an independent physical server, or a server cluster or distributed system composed of multiple physical servers, or a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, CDN, and big data and artificial intelligence platforms.

[0029] The technical solutions shown in the present application will be described in detail below through specific embodiments. It should be noted that the description order of the following embodiments is not intended to limit the priority order of the embodiments.

[0030] See also Figure 1 , Figure 1 : is a schematic diagram of the process of the photolithography image defect detection method provided in the embodiment of the present application. The specific process of the photolithography image defect detection method can be as follows: 101. Acquire a photolithography image, where the photolithography image includes a plurality of patterns to be tested arranged in a two-dimensional array.

[0031] The lithography image does not refer to the image actually formed on the silicon wafer, but a virtual lithography image generated by simulation software. This simulated image can simulate various situations that may occur in the actual lithography process, helping engineers predict and solve potential problems before actual production. In this way, the trial and error costs in actual production can be greatly reduced, and production efficiency and product quality can be improved.

[0032] In the embodiment of the present application, a plurality of test patterns arranged in a two-dimensional array refers to a structure in which a plurality of test patterns are organized into a matrix or grid in rows and columns. Moreover, under normal circumstances, the test patterns in each row / row are evenly distributed. The center distance between any two adjacent test patterns (in the same row or column) is the same as the center distance between any other two adjacent test patterns (in the same row or column).

[0033] 102. Determine the detection direction, detection range and detection type of defect detection.

[0034] It should be noted that the detection direction, detection range and detection type are all preset in advance.

[0035] In the embodiment of the present application, the detection type includes a first detection type and a second detection type. The difference between the first detection type and the second detection type will be illustrated in the following embodiments, and will not be repeated here. The detection direction may include any angular direction, specifically in the range of 0 degrees to 360 degrees.

[0036] 103. Determine at least one group of target patterns to be tested according to the detection direction, detection range, and detection type, each group of target patterns to be tested includes two patterns to be tested.

[0037] In one embodiment, when the detection type is the first detection type, any pattern to be detected within the detection range can be used as the current detection pattern; the pattern to be detected for the first time in the detection direction based on the current detection pattern and the current detection pattern are used as a group of target patterns to be detected.

[0038] For example, Figure 2 As shown, the pattern to be tested Bi is any one of the patterns in the repeated arrangement (the current detection pattern). If the detection range R is large, the pattern to be tested Bi can form a group of target patterns to be tested with any other patterns to be tested within the detection range R. Taking the pattern to be tested Bi as an example, when the detection direction is 0 degrees, the detection directions of the pattern to be tested Bi and the pattern to be tested B1, and the pattern to be tested Bi and the pattern to be tested B2 all meet 0 degrees. When the detection direction is 45 degrees, the detection directions of the pattern to be tested Bi and the pattern to be tested B3, and the pattern to be tested Bi and the pattern to be tested B6 all meet 45 degrees.

[0039] When the detection direction is 0 degrees, the detection range is R, and the detection type is the first detection type, only the first detected pattern to be detected in the detection direction and the pattern to be tested Bi will form a group of target patterns to be tested. Figure 2 As shown, the pattern to be tested Bi and the pattern to be tested B1 are combined into a group of target patterns to be tested. When the detection direction is 45 degrees, the detection range is R, and the detection type is the first detection type, the pattern to be tested detected for the first time in the detection direction and the pattern to be tested Bi are combined into a group of target patterns to be tested. Figure 2 As shown, the pattern to be tested Bi and the pattern to be tested B3 form a group of target patterns to be tested.

[0040] In another embodiment, when the detection type is the second detection type, any pattern to be detected within the detection range can be used as the current detection pattern; all patterns to be detected in the detection direction based on the current detection pattern are respectively combined with the current detection pattern to form a group of target patterns to be detected.

[0041] Likewise, if Figure 2 As shown, when the detection direction is 0 degrees, the detection range is R, and the detection type is the second detection type, all the patterns to be tested detected in the detection direction will be combined with the pattern to be tested Bi to form a group of target patterns to be tested. For example, the pattern to be tested Bi and the pattern to be tested B1 form a group of target patterns to be tested, and the pattern to be tested Bi and the pattern to be tested B2 form a group of target patterns to be tested. When the detection direction is 45 degrees, the detection range is R, and the detection type is the second detection type, the pattern to be tested Bi and the pattern to be tested B3 will be combined into a group of target patterns to be tested, and the pattern to be tested Bi and the pattern to be tested B6 will be combined into a group of target patterns to be tested.

[0042] 104. Obtain the center distance between two graphics to be tested in each group of target graphics to be tested.

[0043] Specifically, the center of gravity positions of two test patterns in each group of target test patterns can be determined; the center of gravity positions are used as the center positions of the test patterns; and the center distance between the two test patterns in each group of target test patterns is calculated based on the center distance.

[0044] It is understandable that the step of determining the center of gravity position of the figure to be measured includes but is not limited to this, and this step may also be performed after step 101, before or after step 102, and before or after step 103.

[0045] In the embodiment of the present application, the centroid position of the pattern to be tested is taken as the center position of the pattern to be tested. It is understandable that since the pattern to be tested simulated by lithography can be infinitely close to a polygon, the centroid position of the pattern to be tested can be obtained by using the centroid formula of any two-dimensional polygon.

[0046] For example, suppose the figure to be tested Xn can be divided into n finite triangles X1, X2, X3...Xn, the centroids of these triangles are C1, C2, C3...Cn, and the areas are A1, A2, A3...An. Let the coordinates of the centroid of the figure to be tested be (Cx, Cy), then the centroid coordinates of any polygon can be as follows:

[0047] In the above formula, "∑" represents a summation symbol.

[0048] After obtaining the centroid position of any figure to be tested, the centroid distance between any two figures to be tested can be directly calculated by the formula. Assuming that the centroid coordinates of any two figures to be tested are (Cx1, Cy1), (Cx2, Cy2), the centroid distance between the two figures to be tested is D:

[0049] It can be understood that in the embodiment of the present application, the center of gravity distance is the center distance.

[0050] 105. Determine whether each group of target test patterns has defects based on the center distance.

[0051] Specifically, one or more center distance thresholds may be preset; the center distance is compared with the center distance threshold, and whether each group of target graphics to be tested has defects is determined based on the comparison result.

[0052] It should be noted that the center distance threshold can be a value or a range.

[0053] When a center distance threshold is set, the center distance threshold can be the center distance threshold of two adjacent patterns to be tested in the same row or column. Figure 2 B i The center distance threshold between B1 and B3), or the center distance threshold between two non-adjacent patterns to be tested in the same row / column can be calculated based on the center distance threshold between two adjacent patterns to be tested in the same row or column. When multiple center distance thresholds are set, the center distance threshold can be set for all or part of the patterns to be tested in the above situations. In actual application, the method of setting one center distance threshold is generally adopted.

[0054] It can be understood that when the center distance is greater than or less than the center distance threshold, it is determined that the current group of target graphics to be tested has defects; when the center distance is equal to the center distance threshold, it is determined that the current group of target graphics to be tested is normal.

[0055] In some embodiments, when it is determined that the current group of target patterns to be tested have defects, the current group of target patterns to be tested are marked.

[0056] In actual application, the center distances of the two test patterns can be used to obtain the standard deviation. The size of the standard deviation reflects the degree of deviation of the test pattern at that location. If the standard deviation is 0, it indicates that the target test pattern of this group is normal. If the standard deviation between a group of target test patterns is greater than 0, it indicates that there is a certain deviation in the group of target test patterns, and the larger the standard deviation, the greater the degree of deviation of the target test pattern.

[0057] In summary, the method for detecting defects in lithography images provided in the embodiment of the present application includes acquiring a lithography image, the lithography image includes a number of test patterns arranged in a two-dimensional array; determining the detection direction, detection range and detection type of defect detection; determining at least one group of target test patterns according to the detection direction, detection range and detection type, each group of target test patterns includes two test patterns; acquiring the center distance between two test patterns in each group of target test patterns; and determining whether each group of target test patterns has defects based on the center distance. This solution can improve the accuracy of lithography image defect detection by measuring the center distance between two test patterns to be tested to determine whether the two test patterns are deviated from the position.

[0058] In order to better implement the photolithography image defect detection method provided in the embodiment of the present application, the embodiment of the present application also provides a photolithography image defect detection device, wherein the meanings of the terms are the same as those in the above-mentioned photolithography image defect detection method, and the specific implementation details can refer to the description in the method embodiment.

[0059] See also Figure 3 , Figure 3 201 is a schematic diagram of the structure of the lithography image defect detection device provided in the embodiment of the present application. The lithography image defect detection device may include an image acquisition unit 201, a first determination unit 202, a second determination unit 203, a distance acquisition unit 204 and a defect detection unit 205. An image acquisition unit 201 is used to acquire a lithography image, where the lithography image includes a plurality of patterns to be tested arranged in a two-dimensional array; A first determination unit 202, used to determine a detection direction, a detection range and a detection type of a defect detection; A second determination unit 203 is used to determine at least one group of target graphics to be tested according to the detection direction, detection range and detection type, each group of target graphics to be tested includes two graphics to be tested; A distance acquisition unit 204 is used to acquire the center distance between two to-be-tested patterns in each group of target to-be-tested patterns; The defect detection unit 205 is used to determine whether each group of target patterns to be tested has defects based on the center distance.

[0060] The specific implementation of each of the above units can refer to the embodiment of the above-mentioned photolithography image defect detection method, which will not be described in detail here.

[0061] In summary, the lithography image defect detection device provided in the embodiment of the present application acquires the lithography image through the image acquisition unit 201, and the lithography image includes a plurality of test patterns arranged in a two-dimensional array; the first determination unit 202 determines the detection direction, detection range and detection type of the defect detection; the second determination unit 203 determines at least one group of target test patterns according to the detection direction, detection range and detection type, and each group of target test patterns includes two test patterns; the distance acquisition unit 204 acquires the center distance between the two test patterns in each group of target test patterns; the defect detection unit 205 determines whether each group of target test patterns has defects based on the center distance. This solution can improve the accuracy of lithography image defect detection by measuring the center distance between the two test patterns to be tested to determine whether the two test patterns are deviated from the position.

[0062] See also Figure 4 An embodiment of the present application provides a lithography image defect detection system, which may include an input module 301, a detection module 302 and an output module 303.

[0063] Wherein, the detection module 302 is connected to the input module 301 and the output module 303 respectively; The input module 301 is used for detecting information, which may include the photolithography image name, detection direction, detection range, detection type, center distance threshold, defect mark information, etc.

[0064] The detection module 302 integrates the lithography image defect detection device in the above embodiment. The detection module 302 is used to perform defect detection based on detection information. The specific implementation process can be found in the above embodiment, and will not be described in detail in this embodiment.

[0065] The output module 303 is used to output the detection results. After the detection module 302 performs defect detection, a defect mark is generated in the lithography image. At the same time, the defect mark information (detection result) is output in the format of a layout and a database, which mainly includes the defect name, defect number, defect location, center distance value and other information of the lithography pattern, which is convenient for subsequent browsing and viewing.

[0066] The present application also provides an electronic device, in which the photolithography image defect detection system of the present application can be integrated, such as Figure 5 As shown, it shows a schematic diagram of the structure of the electronic device involved in the embodiment of the present application, specifically: The electronic device may include components such as a radio frequency (RF) circuit 401, a memory 402 including one or more computer-readable storage media, an input unit 403, a display unit 404, a sensor 405, an audio circuit 406, a wireless fidelity (WiFi) module 407, a processor 408 including one or more processing cores, and a power supply 409. Those skilled in the art will appreciate that Figure 5 The electronic device structure shown in the figure does not constitute a limitation on the electronic device, and may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently. The RF circuit 401 can be used for receiving and sending signals during the process of sending and receiving information or making calls. In particular, after receiving the downlink information of the base station, it is handed over to one or more processors 408 for processing; in addition, the data related to the uplink is sent to the base station. Generally, the RF circuit 401 includes but is not limited to an antenna, at least one amplifier, a tuner, one or more oscillators, a subscriber identity module (Subscriber Identity Module, SIM) card, a transceiver, a coupler, a low noise amplifier (LowNoise Amplifier, LNA), a duplexer, etc. In addition, the RF circuit 401 can also communicate with the network and other devices through wireless communication. Wireless communication can use any communication standard or protocol, including but not limited to Global System of Mobile communication (Global System of Mobile communication, GSM), General Packet Radio Service (General PacketRadio Service, GPRS), Code Division Multiple Access (Code Division Multiple Access, CDMA), Wideband Code Division Multiple Access (Wideband Code Division Multiple Access, WCDMA), Long Term Evolution (Long Term Evolution, LTE), email, Short Messaging Service (SMS), etc.

[0067] The memory 402 can be used to store software programs and modules. The processor 408 executes various functional applications and information processing by running the software programs and modules stored in the memory 402. The memory 402 may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area may store data created according to the use of the electronic device (such as audio data, a phone book, etc.), etc. In addition, the memory 402 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other volatile solid-state storage devices. Accordingly, the memory 402 may also include a memory controller to provide the processor 408 and the input unit 403 with access to the memory 402.

[0068] The input unit 403 can be used to receive input digital or character information, and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control. Specifically, in a specific embodiment, the input unit 403 may include a touch-sensitive surface and other input devices. The touch-sensitive surface, also known as a touch display screen or a touch pad, can collect the user's touch operations on or near it (such as the user's operation on or near the touch-sensitive surface using any suitable object or accessory such as a finger, a stylus, etc.), and drive the corresponding connection device according to a pre-set program. Optionally, the touch-sensitive surface may include a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch direction, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into the touch point coordinates, and then sends it to the processor 408, and can receive and execute the command sent by the processor 408. In addition, the touch-sensitive surface can be implemented using multiple types such as resistive, capacitive, infrared and surface acoustic wave. In addition to the touch-sensitive surface, the input unit 403 may also include other input devices. Specifically, other input devices may include, but are not limited to, one or more of a physical keyboard, function keys (such as a volume control key, a switch key, etc.), a trackball, a mouse, a joystick, and the like.

[0069] The display unit 404 can be used to display information input by the user or information provided to the user, as well as various graphical user interfaces of the electronic device, which can be composed of graphics, text, icons, videos, and any combination thereof. The display unit 404 may include a display panel. Optionally, the display panel may be configured in the form of a liquid crystal display (LCD), an organic light-emitting diode (OLED), or the like. Furthermore, the touch-sensitive surface may cover the display panel, and when the touch-sensitive surface detects a touch operation on or near it, it is transmitted to the processor 408 to determine the type of touch event, and then the processor 408 provides a corresponding visual output on the display panel according to the type of touch event. Although in Figure 5 In the embodiment, the touch-sensitive surface and the display panel are used as two independent components to realize input and output functions, but in some embodiments, the touch-sensitive surface and the display panel can be integrated to realize input and output functions.

[0070] The electronic device may also include at least one sensor 405, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display panel according to the brightness of the ambient light, and the proximity sensor may turn off the display panel and / or backlight when the electronic device is moved to the ear. As a type of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally three axes), and can detect the magnitude and direction of gravity when stationary. It can be used for applications that identify the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc.; As for other sensors that can be configured in electronic devices, such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc., they will not be repeated here.

[0071] The audio circuit 406, the speaker, and the microphone can provide an audio interface between the user and the electronic device. The audio circuit 406 can transmit the electrical signal converted from the received audio data to the speaker, which is converted into a sound signal for output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit 406 and converted into audio data, and then the audio data is output to the processor 408 for processing, and then sent to another electronic device through the RF circuit 401, or the audio data is output to the memory 402 for further processing. The audio circuit 406 may also include an earplug jack to provide communication between an external headset and the electronic device.

[0072] WiFi is a short-range wireless transmission technology. Electronic devices can help users send and receive emails, browse web pages, and access streaming media through WiFi module 407. It provides users with wireless broadband Internet access. Figure 5 , a WiFi module 407 is shown, but it is understandable that it is not a necessary component of the electronic device and can be omitted as needed without changing the essence of the invention.

[0073] The processor 408 is the control center of the electronic device. It uses various interfaces and lines to connect various parts of the entire mobile phone. By running or executing software programs and / or modules stored in the memory 402, and calling data stored in the memory 402, it performs various functions of the electronic device and processes data, thereby monitoring the mobile phone as a whole. Optionally, the processor 408 may include one or more processing cores; preferably, the processor 408 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface, and application programs, and the modem processor mainly processes wireless communications. It is understandable that the above-mentioned modem processor may not be integrated into the processor 408.

[0074] The electronic device also includes a power supply 409 (such as a battery) for supplying power to each component. Preferably, the power supply can be logically connected to the processor 408 through a power management system, so that the power management system can manage charging, discharging, and power consumption. The power supply 409 can also include one or more DC or AC power supplies, recharging systems, power failure detection circuits, power converters or inverters, power status indicators, and other arbitrary components.

[0075] Although not shown, the electronic device may also include a camera, a Bluetooth module, etc., which will not be described in detail here. Specifically in this embodiment, the processor 408 in the electronic device will load the executable files corresponding to the processes of one or more applications into the memory 402 according to the following instructions, and the processor 408 will run the application stored in the memory 402 to achieve various functions, such as: Acquire a photolithography image, wherein the photolithography image includes a plurality of patterns to be tested arranged in a two-dimensional array; Determine the detection direction, detection range and detection type of defect detection; Determine at least one group of target graphics to be tested according to the detection direction, detection range and detection type, each group of target graphics to be tested includes two graphics to be tested; Obtaining the center distance between two test patterns in each group of target test patterns; Determine whether each group of target test patterns has defects based on the center distance.

[0076] In summary, the electronic device provided in the embodiment of the present application can obtain a lithography image, which includes a number of test patterns arranged in a two-dimensional array; determine the detection direction, detection range and detection type of defect detection; determine at least one group of target test patterns according to the detection direction, detection range and detection type, each group of target test patterns includes two test patterns; obtain the center distance between two test patterns in each group of target test patterns; and determine whether each group of target test patterns has defects based on the center distance. This solution can improve the accuracy of lithography image defect detection by measuring the center distance between two test patterns to determine whether the two test patterns are deviated from the position.

[0077] In the above embodiments, the description of each embodiment has its own emphasis. For the part that is not described in detail in a certain embodiment, please refer to the detailed description of the photolithography image defect detection method above, and will not be repeated here.

[0078] It should be noted that, for the lithography image defect detection method in the embodiment of the present application, those skilled in the art can understand that the whole or part of the process of implementing the lithography image defect detection method in the embodiment of the present application can be completed by controlling the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium, such as stored in the memory of a terminal, and executed by at least one processor in the terminal. During the execution process, it can include the process of the embodiment of the lithography image defect detection method.

[0079] For the lithography image defect detection device of the embodiment of the present application, each functional module can be integrated into a processing chip, or each module can exist physically separately, or two or more modules can be integrated into one module. The above-mentioned integrated module can be implemented in the form of hardware or in the form of a software functional module. If the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.

[0080] To this end, an embodiment of the present application provides a storage medium in which a plurality of instructions are stored, and the instructions can be loaded by a processor to execute the steps in any one of the photolithography image defect detection methods provided in the embodiments of the present application. The storage medium may be a magnetic disk, an optical disk, a read-only memory (ROM), a random access memory (RAM), etc.

[0081] The above respectively introduces in detail the lithography image defect detection method, device, storage medium and system provided by the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the core idea of ​​the present application; at the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A method for detecting defects in a lithography image, characterized in that: include: Acquire a photolithography image, wherein the photolithography image includes a plurality of patterns to be tested arranged in a two-dimensional array; Determine the detection direction, detection range and detection type of defect detection; Determine at least one group of target graphics to be tested according to the detection direction, the detection range and the detection type, each group of target graphics to be tested includes two graphics to be tested; Obtaining the center distance between two of the target patterns to be tested in each group of the target patterns to be tested; Determine whether each group of the target patterns to be tested has defects based on the center distance.

2. The method for detecting photolithography image defects according to claim 1, wherein: When the detection type is the first detection type, determining at least one group of target graphics to be detected according to the detection direction, the detection range and the detection type includes: Taking any of the patterns to be tested within the detection range as the current detection pattern; The pattern to be tested that is detected for the first time in the detection direction based on the current detection pattern and the current detection pattern are taken as a group of target patterns to be tested.

3. The method for detecting photolithography image defects according to claim 1, wherein: When the detection type is the second detection type, determining at least one group of target graphics to be detected according to the detection direction, the detection range and the detection type includes: Taking any of the patterns to be tested within the detection range as the current detection pattern; All the patterns to be detected based on the current detection pattern in the detection direction are respectively combined with the current detection pattern to form a group of target patterns to be detected.

4. The method for detecting photolithography image defects according to claim 1, wherein: The obtaining of the center distance between two of the target patterns to be tested in each group of the target patterns to be tested comprises: Determining the centroid positions of two of the target graphics to be tested in each group of the target graphics to be tested; Taking the center of gravity position as the center position of the figure to be measured; The center distance between two of the target patterns to be tested in each group of the target patterns to be tested is calculated based on the center distance.

5. The method for detecting photolithography image defects according to claim 1, wherein: The determining whether each group of the target patterns to be tested has defects based on the center distance includes: Preset one or more center distance thresholds; The center distance is compared with the center distance threshold, and whether each group of the target patterns to be tested has defects is determined according to the comparison result.

6. The method for detecting photolithography image defects according to claim 5, wherein: The step of determining whether each group of the target graphics to be tested has defects according to the comparison results includes: When the center distance is greater than or less than the center distance threshold, it is determined that the target graphics to be tested in the current group have defects; When the center distance is equal to the center distance threshold, it is determined that the target graphics to be tested in the current group are normal.

7. The method for detecting photolithography image defects according to claim 6, wherein: When it is determined that the target patterns to be tested in the current group have defects, the target patterns to be tested in the current group are marked.

8. A photolithography image defect detection device, characterized in that: include: An image acquisition unit, used for acquiring a photolithography image, wherein the photolithography image includes a plurality of patterns to be measured arranged in a two-dimensional array; A first determination unit, used to determine a detection direction, a detection range and a detection type of defect detection; A second determining unit, configured to determine at least one group of target patterns to be tested according to the detection direction, the detection range and the detection type, each group of the target patterns to be tested including two patterns to be tested; A distance acquisition unit, used for acquiring the center distance between two of the target patterns to be tested in each group of the target patterns to be tested; A defect detection unit is used to determine whether each group of the target patterns to be tested has defects based on the center distance.

9. A storage medium, characterized in that: The storage medium stores a plurality of instructions, and the instructions are suitable for being loaded by a processor to execute the photolithography image defect detection method according to any one of claims 1 to 7.

10. A photolithography image defect detection system, characterized in that: It includes an input module, a detection module and an output module, the detection module is connected to the input module and the output module respectively; the input module is used to detect information; the detection module is integrated with the lithography image defect detection device as claimed in claim 8, the detection module is used to perform defect detection based on the detection information; the output module is used to output the detection result.

Images