Stacked capacitor assembly and manufacturing method thereof, and stacked capacitor packaging structure

Abstract

The invention provides a stacked capacitor assembly, a manufacturing method thereof and a stacked capacitor packaging structure. The stacked capacitor assembly comprises a plurality of conductive substrates, a plurality of internal conductive structures, a plurality of connecting layers and an outermost coating structure. The plurality of internal conductive structures are configured to cover the plurality of first portions of the plurality of conductive substrates, respectively. Each connecting layer is configured to be connected between any two adjacent internal conductive structures. The outermost cladding structure is configured for cladding the plurality of internal conductive structures and the plurality of connection layers. Therefore, the stacked capacitor assembly provided by the invention not only can simplify the overall structure, but also can meet the characteristic requirements of the capacitor. When the stacked capacitor assembly is applied to the stacked capacitor packaging structure, the stacked capacitor packaging structure can still achieve the electrical characteristics and functions provided by the capacitor under the condition that the overall structure is simplified.

Description

Technical Field

[0001] The present invention relates to a capacitor assembly and a manufacturing method thereof and a capacitor packaging structure, and in particular to a stacked capacitor assembly and a manufacturing method thereof and a stacked capacitor packaging structure. Background Art

[0002] Capacitors have been widely used as basic components in consumer home appliances, computer motherboards and their peripherals, power supplies, communication products, and automobiles. Their main functions include filtering, bypassing, rectification, coupling, decoupling, phase shifting, etc., making them one of the indispensable components in electronic products. However, the overall structure of the stacked capacitor in the prior art is too complicated and there is still room for improvement. Summary of the invention

[0003] The problem to be solved by the present invention is to provide a stacked capacitor assembly and a manufacturing method thereof and a stacked capacitor packaging structure in view of the deficiencies in the prior art, so as to meet the capacitor characteristic requirements while simplifying the overall structure.

[0004] In order to solve the above-mentioned problems, one of the technical means adopted by the present invention is to provide a stacked capacitor assembly, which includes: multiple conductive substrates, multiple internal conductive structures, multiple connecting layers and an outermost coating structure. Each conductive substrate has a first part and a second part arranged opposite to the first part. The multiple internal conductive structures are configured to respectively coat the multiple first parts of the multiple conductive substrates. Each connecting layer is configured to be connected between any two adjacent internal conductive structures so that the multiple internal conductive structures are stacked in sequence through multiple connecting layers. The outermost coating structure is configured to coat the multiple internal conductive structures and the multiple connecting layers. Among them, the multiple internal conductive structures are not carbon paste material layers or silver paste material layers. Among them, there will be no silver paste material between any two adjacent conductive substrates.

[0005] In order to solve the above-mentioned problems, another technical means adopted by the present invention is to provide a method for manufacturing a stacked capacitor assembly, which includes: providing multiple conductive substrates, each of which has a first part and a second part arranged opposite to the first part; forming multiple internal conductive structures to respectively cover multiple first parts of multiple conductive substrates; forming multiple connecting layers, each of which is configured to connect between any two adjacent internal conductive structures, so that multiple internal conductive structures are stacked in sequence through multiple connecting layers; and forming an outermost covering structure to cover multiple internal conductive structures and multiple connecting layers. The multiple internal conductive structures are not carbon paste material layers or silver paste material layers. There will be no silver paste material between any two adjacent conductive substrates.

[0006] In order to solve the above-mentioned problems, another technical means adopted by the present invention is to provide a stacked capacitor packaging structure, which includes: a stacked capacitor component, an electrode component and an insulating package. The stacked capacitor component includes multiple conductive substrates, multiple internal conductive structures, multiple connecting layers and an outermost coating structure. The electrode component includes a first electrode structure and a second electrode structure electrically connected to the stacked capacitor component respectively. The insulating package is configured to cover the stacked capacitor component and carry the electrode component. Wherein, each conductive substrate has a first part and a second part arranged opposite to the first part. Wherein, the multiple internal conductive structures are configured to cover the multiple first parts of the multiple conductive substrates respectively. Wherein, each connecting layer is configured to connect between any two adjacent internal conductive structures so that the multiple internal conductive structures are stacked in sequence through multiple connecting layers. Wherein, the outermost coating structure is configured to cover the multiple internal conductive structures and the multiple connecting layers. Wherein, the multiple internal conductive structures are not carbon paste material layers or silver paste material layers, and there is no silver paste material between any two adjacent conductive substrates. The first electrode structure and the second electrode structure of the electrode assembly are electrically connected to the second portion of each conductive substrate and the outermost covering structure respectively.

[0007] One of the beneficial effects of the present invention is that the stacked capacitor assembly provided by the present invention can be simplified in overall structure and meet the requirements of capacitor characteristics through the technical solutions of "multiple internal conductive structures are configured to respectively cover multiple first parts of multiple conductive substrates", "each connection layer is configured to connect between any two adjacent internal conductive structures, so that multiple internal conductive structures are stacked in sequence through multiple connection layers", "the outermost coating structure is configured to cover multiple internal conductive structures and multiple connection layers", "multiple internal conductive structures are not carbon paste material layers or silver paste material layers", and "there is no silver paste material between any two adjacent conductive substrates". Thus, when the stacked capacitor assembly is applied to the stacked capacitor packaging structure, the stacked capacitor packaging structure can still achieve the characteristics and functions that the capacitor can provide while simplifying the overall structure.

[0008] Another beneficial effect of the present invention is that the manufacturing method of a stacked capacitor assembly provided by the present invention can simplify the overall structure and meet the capacitor characteristic requirements through the technical solutions of "providing multiple conductive substrates, each of which has a first part and a second part arranged opposite to the first part", "forming multiple internal conductive structures for respectively covering multiple first parts of multiple conductive substrates", "forming multiple connection layers, each of which is configured to connect between any two adjacent internal conductive structures, so that multiple internal conductive structures are stacked in sequence through multiple connection layers", "forming an outermost covering structure for covering multiple internal conductive structures and multiple connection layers", "multiple internal conductive structures are not carbon paste material layers or silver paste material layers", and "there is no silver paste material between any two adjacent conductive substrates". By this, when the stacked capacitor assembly is applied to the stacked capacitor packaging structure, the stacked capacitor packaging structure can still achieve the characteristics and functions that the capacitor can provide while simplifying the overall structure.

[0009] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a flow chart of a method for manufacturing a stacked capacitor assembly provided in a first embodiment of the present invention.

[0011] Figure 2 It is a cross-sectional schematic diagram of step S100 and step S102 of the manufacturing method of the stacked capacitor assembly provided by the first embodiment of the present invention.

[0012] Figure 3 It is a cross-sectional schematic diagram of step S104 of the method for manufacturing a stacked capacitor assembly provided in the first embodiment of the present invention.

[0013] Figure 4 It is a cross-sectional schematic diagram of step S106 of the method for manufacturing a stacked capacitor assembly provided in the first embodiment of the present invention.

[0014] Figure 5 It is a cross-sectional schematic diagram of a first stacked capacitor packaging structure provided by the first embodiment of the present invention.

[0015] Figure 6 It is a cross-sectional schematic diagram of a second stacked capacitor packaging structure provided by the first embodiment of the present invention.

[0016] Figure 7It is a cross-sectional schematic diagram of a third stacked capacitor packaging structure provided by the first embodiment of the present invention.

[0017] Figure 8 This is a flow chart of a method for manufacturing a stacked capacitor assembly provided in accordance with a second embodiment of the present invention.

[0018] Fig. 9 It is a cross-sectional schematic diagram of step S200 and step S202 of the manufacturing method of the stacked capacitor assembly provided by the second embodiment of the present invention.

[0019] Fig.10 It is a cross-sectional schematic diagram of step S204 of the method for manufacturing a stacked capacitor assembly provided in the second embodiment of the present invention.

[0020] Fig.11 It is a cross-sectional schematic diagram of step S206 of the method for manufacturing a stacked capacitor assembly provided in the second embodiment of the present invention.

[0021] Fig.12 It is a cross-sectional schematic diagram of a first stacked capacitor packaging structure provided by a second embodiment of the present invention.

[0022] Fig.13 It is a cross-sectional schematic diagram of a second stacked capacitor packaging structure provided by the second embodiment of the present invention.

[0023] Fig.14 It is a cross-sectional schematic diagram of a third stacked capacitor packaging structure provided by the second embodiment of the present invention.

[0024] Fig.15 It is a cross-sectional schematic diagram of a fourth stacked capacitor packaging structure provided by the second embodiment of the present invention.

[0025] Fig.16 It is a cross-sectional schematic diagram of a fifth stacked capacitor packaging structure provided by the second embodiment of the present invention. DETAILED DESCRIPTION

[0026] The following is an explanation of the implementation methods of the "stacked capacitor assembly, its manufacturing method and stacked capacitor packaging structure" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, it should be stated in advance that the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0027] [First embodiment]

[0028] See also Figures 1 to 4 As shown, the first embodiment of the present invention provides a method for manufacturing a stacked capacitor assembly S, which at least includes the following steps: first, Figure 1 and Figure 2 As shown, a plurality of conductive substrates 1 (eg Figure 2 Three conductive substrates 1 are used as an example. Figure 2 The three conductive substrates 1 exemplified can be provided or manufactured separately, and in a feasible embodiment, Figure 2 The plurality of surrounding insulating layers 5 and the plurality of spacers 6 may be omitted, or one of the surrounding insulating layers 5 and the spacers 6 may be omitted), wherein each conductive substrate 1 has a first portion 101 and a second portion 102 disposed opposite to the first portion 101 (step S100); then, Figure 1 and Figure 2 As shown, a plurality of conductive substrates 1 may be arranged in a predetermined direction (eg, in a vertical direction) so that the plurality of conductive substrates 1 are arranged at intervals (step S102); then, Figure 1 , Figure 2 and Figure 3 As shown, an internal conductive structure 2 is formed (for example, by impregnation or any other method that can form a conductive material) to cover the first portion 101 of each conductive substrate 1 and fill between any two adjacent conductive substrates 1 (that is, a spacing space G formed between every two adjacent conductive substrates 1 will be filled with the internal conductive structure 2) (step S104); next, Figure 1 and Figure 4As shown, an outermost coating structure 4 is formed (for example, by impregnation or any method that can form a conductive material) to coat the internal conductive structure 2 (step S106). It is worth noting that since the internal conductive structure 2 will not be a carbon paste material layer, a silver paste material layer or any internal conductive layer containing a carbon paste material or a silver paste material, there will be no carbon paste material or silver paste material between any two adjacent conductive substrates 1. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0029] For example, with Figure 1 and Figure 2 As shown, the step S100 of providing a plurality of conductive substrates 1 further includes: forming a plurality of surrounding insulating layers 5 for being respectively arranged on the plurality of conductive substrates 1 in a surrounding manner (for example, in a feasible embodiment, Figure 2 The multiple spacers 6 shown in the example may be omitted) (step S1001). Figure 2 As shown, each surrounding insulating layer 5 may be located between the first portion 101 and the second portion 102 of the corresponding conductive substrate 1. Figure 2 As shown, in the step S102 of arranging a plurality of conductive substrates 1, a plurality of surrounding insulating layers 5 can be separated from each other or sequentially connected to form an insulating barrier structure ( Figure 2 A plurality of surrounding insulating layers 5 are sequentially connected to form an insulating barrier structure as an example for explanation). Figure 4 As shown, the inner conductive structure 2 and the outermost cladding structure 4 are both connected to the plurality of surrounding insulating layers 5, and the inner conductive structure 2 and the outermost cladding structure 4 are both blocked by the plurality of surrounding insulating layers 5 and separated from the second portion 102 of each conductive substrate 1. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0030] For example, with Figure 1 and Figure 2 As shown, the step S100 of providing a plurality of conductive substrates 1 further includes: forming a plurality of spacers 6 to separate the plurality of conductive substrates 1 from each other (for example, in a feasible embodiment, Figure 2 The multiple surrounding insulating layers 5 shown in the example may be omitted) (step S1002). Figure 2 As shown, each spacer 6 can be connected between any two adjacent conductive substrates 1 (that is, at least one spacer 6 can be arranged between every two adjacent conductive substrates 1) to form a separation space G between any two adjacent conductive substrates 1. Figure 2 and Figure 3As shown, any two adjacent conductive substrates 1 can be separated from each other by the support of at least one spacer 6, so that the spacing space G formed between any two adjacent conductive substrates 1 can be filled by the internal conductive structure 2 (for example, the spacing space G can be completely or partially filled by the internal conductive structure 2). Figure 3 As shown, each spacer 6 may be a conductive spacer or an insulating spacer, and the thickness H1 of a portion of insulating material located between any two adjacent conductive substrates 1 (that is, when a plurality of surrounding insulating layers 5 are used, a portion of insulating material will be equal to a portion of material of two adjacent surrounding insulating layers 5) will be equal to or substantially equal to the thickness H2 of the spacer 6. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0031] In addition, if Figure 4 As shown, through a manufacturing method of a stacked capacitor component S provided by the first embodiment of the present invention, the first embodiment of the present invention further provides a stacked capacitor component S, which includes: a plurality of conductive substrates 1, an internal conductive structure 2 and an outermost coating structure 4. Further, each conductive substrate 1 has a first portion 101 (or a first substrate portion) and a second portion 102 (or a second substrate portion) arranged opposite to the first portion 101. The internal conductive structure 2 is configured to coat the first portion 101 of each conductive substrate 1 and fill between any two adjacent conductive substrates 1. The outermost coating structure 4 is configured to coat the internal conductive structure 2. It is worth noting that since the internal conductive structure 2 will not be a carbon paste material layer, a silver paste material layer or any internal conductive layer containing a carbon paste material or a silver paste material, there will be no carbon paste material or silver paste material between any two adjacent conductive substrates 1.

[0032] For example, if Figure 4 As shown, the stacked capacitor assembly S further includes a plurality of surrounding insulating layers 5, and the plurality of surrounding insulating layers 5 can be configured to be respectively disposed on the plurality of conductive substrates 1. In addition, the stacked capacitor assembly S further includes a plurality of spacers 6, and each spacer 6 is connected between any two adjacent conductive substrates 1 to form a separation space G between any two adjacent conductive substrates 1. It is worth noting that in a feasible embodiment, Figure 4 The plurality of surrounding insulating layers 5 and the plurality of spacers 6 mentioned above can be omitted, or one of the surrounding insulating layers 5 and the spacers 6 can be omitted. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0033] For example, if Figure 4As shown, each conductive substrate 1 can be a metal foil with an oxide layer on the surface, the internal conductive structure 2 can be a conductive polymer layer without carbon paste and silver paste, and the outermost coating structure 4 can include at least one of a single carbon paste layer (not shown) and a single silver paste layer (not shown) (that is, the outermost coating structure 4 can be a single carbon paste layer, a single silver paste layer, or a single carbon paste layer and a single silver paste layer at the same time). In addition, when the outermost coating structure 4 includes a single carbon paste layer and a single silver paste layer at the same time, the single carbon paste layer of the outermost coating structure 4 is configured to cover the internal conductive structure 2, and the single silver paste layer of the outermost coating structure 4 is configured to cover the single carbon paste layer. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0034] Furthermore, cooperation Figures 4 to 6 As shown, when a stacked capacitor component S provided by the first embodiment of the present invention is applied to a stacked capacitor packaging structure M, the first embodiment of the present invention further provides a stacked capacitor packaging structure M, which includes: a stacked capacitor component S, an electrode component E and an insulating packaging body B. Further, the stacked capacitor component S includes a plurality of conductive substrates 1, an internal conductive structure 2 and an outermost coating structure 4, each conductive substrate 1 has a first portion 101 and a second portion 102 arranged opposite to the first portion 101, the internal conductive structure 2 is configured to cover the first portion 101 of each conductive substrate 1 and fill between any two adjacent conductive substrates 1, and the outermost coating structure 4 is configured to cover the internal conductive structure 2. The electrode component E includes a first electrode structure 7 and a second electrode structure 8 electrically connected to the stacked capacitor component S, respectively, and the first electrode structure 7 and the second electrode structure 8 of the electrode component E are electrically connected to the second portion 102 of each conductive substrate 1 and the outermost coating structure 4, respectively. The insulating package B is configured to cover the stacked capacitor assembly S and carry the electrode assembly E.

[0035] For example, with Figure 5 and Figure 6 As shown, the electrode assembly E can be a conductive pin assembly (such as Figure 5 As shown) or one end electrode assembly (as Figure 6 In addition, the plurality of second portions 102 of the plurality of conductive substrates 1 can cooperate with each other (e.g., be electrically connected to each other by welding) to form a positive electrode portion P of the stacked capacitor assembly S, and the outermost coating structure 4 can be configured to serve as a negative electrode portion N of the stacked capacitor assembly S. Thus, the first electrode structure 7 and the second electrode structure 8 of the electrode assembly E can be electrically connected to the positive electrode portion P and the negative electrode portion N of the stacked capacitor assembly S, respectively. It is worth noting that in a feasible embodiment, Figure 5 and Figure 6 The plurality of surrounding insulating layers 5 and the plurality of spacers 6 mentioned above can be omitted, or one of the surrounding insulating layers 5 and the spacers 6 can be omitted. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0036] For example, with Figure 4 and Figure 5 As shown, when the electrode assembly E is a conductive pin assembly (or when the stacked capacitor package structure M is a pin-type capacitor), the first electrode structure 7 of the electrode assembly E includes a first embedded portion 71 covered by the insulating package B and a first exposed portion 72 connected to the first embedded portion 71 and exposed outside the insulating package B, and the second electrode structure 8 of the electrode assembly E includes a second embedded portion 81 covered by the insulating package B and a second exposed portion 82 connected to the second embedded portion 81 and exposed outside the insulating package B. Further, the first embedded portion 71 of the first electrode structure 7 is electrically connected to the positive electrode portion P of the stacked capacitor assembly S, and the first exposed portion 72 of the first electrode structure 7 extends along the outer surface of the insulating package B (for example, extending from one side end of the insulating package B to the bottom end). In addition, the second embedded portion 81 of the second electrode structure 8 is electrically connected to the negative electrode portion N of the stacked capacitor assembly S, and the second exposed portion 82 of the second electrode structure 8 extends along the outer surface of the insulating package B (for example, extending from the other side end to the bottom end of the insulating package B). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0037] For example, with Figure 4 and Figure 6As shown, when the electrode component E is an end electrode component (or when the stacked capacitor package structure M is an end electrode capacitor), the first electrode structure 7 of the electrode component E includes a first internal conductive layer 73 configured to cover a first side end B1 of the insulating package body B and electrically contact the positive electrode portion P of the stacked capacitor component S (that is, electrically contacting the multiple second portions 102 of the multiple conductive substrates 1), a first intermediate conductive layer 74 configured to cover the first internal conductive layer 73, and a first external conductive layer 75 configured to cover the first intermediate conductive layer 74, and the second electrode structure 8 of the electrode component E includes a second internal conductive layer 83 configured to cover a second side end B2 of the insulating package body B and electrically contact the negative electrode portion N of the stacked capacitor component S (that is, electrically contacting the outermost encapsulation structure 4), a second intermediate conductive layer 84 configured to cover the second internal conductive layer 83, and a second external conductive layer 85 configured to cover the second intermediate conductive layer 84. Furthermore, the first inner conductive layer 73 may be one of an Ag layer and a Cu layer, the first intermediate conductive layer 74 may be a Ni layer, and the first outer conductive layer 75 may be a Sn layer. In addition, the second inner conductive layer 83 may be one of an Ag layer and a Cu layer, the second intermediate conductive layer 84 may be a Ni layer, and the second outer conductive layer 85 may be a Sn layer. However, the above example is only one possible embodiment and is not intended to limit the present invention.

[0038] It is worth noting that Figure 7 As shown, the stacked capacitor assembly S can be further supported by a conductive supporting substrate C, and the negative electrode portion N of the stacked capacitor assembly S can be electrically connected to the second electrode structure 8 of the electrode assembly E through the conductive supporting substrate C (that is, the negative electrode portion N of the stacked capacitor assembly S will not directly electrically contact the second electrode structure 8 of the electrode assembly E).

[0039] [Second embodiment]

[0040] See also Figures 8 to 11 As shown, the second embodiment of the present invention provides a method for manufacturing a stacked capacitor assembly S, which at least includes the following steps: first, Figure 8 and Fig. 9 As shown, a plurality of conductive substrates 1 (eg Fig. 9 Three conductive substrates 1 are used as an example. Fig. 9 The three conductive substrates 1 exemplified can be provided or manufactured separately, and in a feasible embodiment, Fig. 9 The multiple surrounding insulating layers 5 can be omitted), wherein each conductive substrate 1 has a first portion 101 and a second portion 102 arranged opposite to the first portion 101 (step S200); then, Figure 8 and Fig. 9 As shown, a plurality of internal conductive structures 2 are formed (for example, by impregnation or any method that can form a conductive material) to respectively cover a plurality of first portions 101 of a plurality of conductive substrates 1 (step S202); then, Figure 8 and Fig.10 As shown, a plurality of connection layers 3 are formed (for example, by spraying, coating, printing or any other method that can form a conductive material), wherein each connection layer 3 is configured to connect between any two adjacent internal conductive structures 2, so that the plurality of internal conductive structures 2 are stacked in sequence through the plurality of connection layers 3 (step S204); next, Figure 8 and Fig.11 As shown, an outermost coating structure 4 is formed (for example, by impregnation or any method that can form a conductive material) to coat the internal conductive structure 2 and multiple connecting layers 3 (step S206). It is worth noting that the internal conductive structure 2 will not be a carbon paste material layer, a silver paste material layer or any internal conductive layer containing a carbon paste material or a silver paste material, and there will be no silver paste material between any two adjacent conductive substrates 1. It is worth noting that step S200 and step S202 can be integrated into a step of "providing a conductive substrate 1 pre-formed with an internal conductive structure 2". However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0041] For example, with Figure 8 and Fig. 9 As shown, the step S200 of providing a plurality of conductive substrates 1 further includes: forming a plurality of surrounding insulating layers 5 for being respectively disposed on the plurality of conductive substrates 1 in a surrounding manner (step S2001). Fig. 9 As shown, each surrounding insulating layer 5 may be located between the first portion 101 and the second portion 102 of the corresponding conductive substrate 1. Fig.11 As shown, in step 204 of forming a plurality of connection layers 3, a plurality of surrounding insulating layers 5 can be separated from each other or sequentially connected to form an insulating barrier structure ( Fig.11 A plurality of surrounding insulating layers 5 are sequentially connected to form an insulating barrier structure as an example for explanation). Fig.11As shown, the internal conductive structure 2 and the outermost cladding structure 4 are both connected to the plurality of surrounding insulating layers 5, and the internal conductive structure 2 and the outermost cladding structure 4 are both blocked by the plurality of surrounding insulating layers 5 and separated from the second portion 102 of each conductive substrate 1. It is worth noting that when the plurality of surrounding insulating layers 5 are separated from each other, each connecting layer 3 can be configured to connect between any two adjacent surrounding insulating layers 5, so that the plurality of surrounding insulating layers 5 can be stacked in sequence through the plurality of connecting layers 3. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0042] In addition, if Fig.11 As shown, through a manufacturing method of a stacked capacitor component S provided by the second embodiment of the present invention, the second embodiment of the present invention further provides a stacked capacitor component S, which includes: a plurality of conductive substrates 1, a plurality of internal conductive structures 2, a plurality of connecting layers 3 and an outermost coating structure 4. Further, each conductive substrate 1 has a first portion 101 (or a first substrate portion) and a second portion 102 (or a second substrate portion) arranged opposite to the first portion 101. The plurality of internal conductive structures 2 are configured to respectively coat the plurality of first portions 101 of the plurality of conductive substrates 1. Each connecting layer 3 is configured to connect between any two adjacent internal conductive structures 2, so that the plurality of internal conductive structures 2 are stacked in sequence through the plurality of connecting layers 3. The outermost coating structure 4 is configured to coat the internal conductive structure 2 and the plurality of connecting layers 3. It is worth noting that the internal conductive structure 2 will not be a carbon paste material layer, a silver paste material layer or any internal conductive layer containing a carbon paste material or a silver paste material, and each connecting layer 3 will not be a silver paste layer, so there will be no silver paste material between any two adjacent conductive substrates 1.

[0043] For example, the stacked capacitor assembly S further includes a plurality of surrounding insulating layers 5, and the plurality of surrounding insulating layers 5 are configured to be respectively disposed on the plurality of conductive substrates 1 in a surrounding manner. It is worth noting that, in a feasible embodiment, Fig.11 The multiple surrounding insulating layers 5 mentioned above may be omitted. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0044] For example, if Fig.11As shown, each conductive substrate 1 can be a metal foil with an oxide layer on the surface, each internal conductive structure 2 can be a conductive polymer layer without carbon glue and silver glue, each connecting layer 3 (such as a conductive connecting layer or an insulating connecting layer) can be a polymer material layer, a carbon glue layer or an insulating glue layer (such as silicone or epoxy) (or each connecting layer 3 will not be a silver glue layer), and the outermost coating structure 4 can include at least one of a single carbon glue layer (not shown) and a single silver glue layer (not shown) (that is, the outermost coating structure 4 can be a single carbon glue layer, a single silver glue layer, or a single carbon glue layer and a single silver glue layer at the same time). In addition, when the outermost coating structure 4 includes a single carbon glue layer and a single silver glue layer at the same time, the single carbon glue layer of the outermost coating structure 4 is configured to cover the internal conductive structure 2, and the single silver glue layer of the outermost coating structure 4 is configured to cover the single carbon glue layer. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0045] Furthermore, cooperation Figures 11 to 13 As shown, when a stacked capacitor component S provided by the second embodiment of the present invention is applied to a stacked capacitor packaging structure M, the second embodiment of the present invention further provides a stacked capacitor packaging structure M, which includes: a stacked capacitor component S, an electrode component E, and an insulating packaging body B. Further, the stacked capacitor component S includes a plurality of conductive substrates 1, an internal conductive structure 2, and an outermost coating structure 4, each conductive substrate 1 has a first portion 101 and a second portion 102 arranged opposite to the first portion 101, the plurality of internal conductive structures 2 are configured to respectively coat the plurality of first portions 101 of the plurality of conductive substrates 1, each connecting layer 3 is configured to connect between any two adjacent internal conductive structures 2, so that the plurality of internal conductive structures 2 are stacked in sequence through the plurality of connecting layers 3, and the outermost coating structure 4 is configured to coat the internal conductive structure 2 and the plurality of connecting layers 3. The electrode assembly E includes a first electrode structure 7 and a second electrode structure 8 respectively electrically connected to the stacked capacitor assembly S, and the first electrode structure 7 and the second electrode structure 8 of the electrode assembly E are respectively electrically connected to the second portion 102 of each conductive substrate 1 and the outermost encapsulation structure 4. The insulating package B is configured to encapsulate the stacked capacitor assembly S and carry the electrode assembly E.

[0046] For example, with Fig.12 and Fig.13 As shown, the electrode assembly E can be a conductive pin assembly (such as Fig.12 As shown) or one end electrode assembly (as Fig.13In addition, the plurality of second portions 102 of the plurality of conductive substrates 1 can cooperate with each other (e.g., be electrically connected to each other by welding) to form a positive electrode portion P of the stacked capacitor assembly S, and the outermost coating structure 4 can be configured to serve as a negative electrode portion N of the stacked capacitor assembly S. Thus, the first electrode structure 7 and the second electrode structure 8 of the electrode assembly E can be electrically connected to the positive electrode portion P and the negative electrode portion N of the stacked capacitor assembly S, respectively. It is worth noting that in a feasible embodiment, Fig.12 and Fig.13 The multiple surrounding insulating layers 5 mentioned above may be omitted. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0047] For example, with Fig.11 and Fig.12 As shown, when the electrode assembly E is a conductive pin assembly (or when the stacked capacitor package structure M is a pin-type capacitor), the first electrode structure 7 of the electrode assembly E includes a first embedded portion 71 covered by the insulating package B and a first exposed portion 72 connected to the first embedded portion 71 and exposed outside the insulating package B, and the second electrode structure 8 of the electrode assembly E includes a second embedded portion 81 covered by the insulating package B and a second exposed portion 82 connected to the second embedded portion 81 and exposed outside the insulating package B. Further, the first embedded portion 71 of the first electrode structure 7 is electrically connected to the positive electrode portion P of the stacked capacitor assembly S, and the first exposed portion 72 of the first electrode structure 7 extends along the outer surface of the insulating package B (for example, extending from one side end of the insulating package B to the bottom end). In addition, the second embedded portion 81 of the second electrode structure 8 is electrically connected to the negative electrode portion N of the stacked capacitor assembly S, and the second exposed portion 82 of the second electrode structure 8 extends along the outer surface of the insulating package B (for example, extending from the other side end to the bottom end of the insulating package B). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0048] For example, with Fig.11 and Fig.13As shown, when the electrode component E is an end electrode component (or when the stacked capacitor package structure M is an end electrode capacitor), the first electrode structure 7 of the electrode component E includes a first internal conductive layer 73 configured to cover a first side end B1 of the insulating package body B and electrically contact the positive electrode portion P of the stacked capacitor component S (that is, electrically contacting the multiple second portions 102 of the multiple conductive substrates 1), a first intermediate conductive layer 74 configured to cover the first internal conductive layer 73, and a first external conductive layer 75 configured to cover the first intermediate conductive layer 74, and the second electrode structure 8 of the electrode component E includes a second internal conductive layer 83 configured to cover a second side end B2 of the insulating package body B and electrically contact the negative electrode portion N of the stacked capacitor component S (that is, electrically contacting the outermost encapsulation structure 4), a second intermediate conductive layer 84 configured to cover the second internal conductive layer 83, and a second external conductive layer 85 configured to cover the second intermediate conductive layer 84. Furthermore, the first inner conductive layer 73 may be one of an Ag layer and a Cu layer, the first intermediate conductive layer 74 may be a Ni layer, and the first outer conductive layer 75 may be a Sn layer. In addition, the second inner conductive layer 83 may be one of an Ag layer and a Cu layer, the second intermediate conductive layer 84 may be a Ni layer, and the second outer conductive layer 85 may be a Sn layer. However, the above example is only one possible embodiment and is not intended to limit the present invention.

[0049] It is worth noting that Fig.14 As shown, the stacked capacitor assembly S can be further supported by a conductive supporting substrate C, and the negative electrode portion N of the stacked capacitor assembly S can be electrically connected to the second electrode structure 8 of the electrode assembly E through the conductive supporting substrate C (that is, the negative electrode portion N of the stacked capacitor assembly S will not directly electrically contact the second electrode structure 8 of the electrode assembly E).

[0050] It is worth noting that Fig.15 As shown, the outermost encapsulation structure 4 is disposed on one side of each inner conductive structure 2 and is separated from the plurality of surrounding insulating layers 5 to form a vertical conductive structure. In other words, the upper surface of the uppermost inner conductive structure 2 and the lower surface of the lowermost inner conductive structure 2 are not covered by the outermost encapsulation structure 4.

[0051] It is worth noting that Fig.16 As shown, the outermost encapsulation structure 4 is disposed on one side of each inner conductive structure 2 and is separated from the plurality of surrounding insulating layers 5, thereby forming an L-shaped conductive structure. In other words, a portion of the lower surface of the inner conductive structure 2 at the bottom layer will be covered by the outermost encapsulation structure 4, but the upper surface of the inner conductive structure 2 at the top layer will not be covered by the outermost encapsulation structure 4.

[0052] [Beneficial Effects of Embodiments]

[0053] One of the beneficial effects of the present invention is that the stacked capacitor assembly S provided by the present invention can be simplified in overall structure and meet the requirements of capacitor characteristics through the technical solutions of "multiple internal conductive structures 2 are configured to respectively cover multiple first parts 101 of multiple conductive substrates 1", "each connecting layer 3 is configured to connect between any two adjacent internal conductive structures 2, so that multiple internal conductive structures 2 are stacked in sequence through multiple connecting layers 3", "the outermost covering structure 4 is configured to cover multiple internal conductive structures 2 and multiple connecting layers 3", "multiple internal conductive structures 2 are not carbon paste material layers or silver paste material layers", and "there is no silver paste material between any two adjacent conductive substrates 1". Thus, when the stacked capacitor assembly S is applied to the stacked capacitor packaging structure M, the stacked capacitor packaging structure M can still achieve the electrical characteristics and functions that the capacitor can provide while simplifying the overall structure.

[0054] Another beneficial effect of the present invention is that the manufacturing method of a stacked capacitor component S provided by the present invention can simplify the overall structure of the stacked capacitor component S and meet the capacitor characteristic requirements through the technical solutions of "providing multiple conductive substrates 1, each of which has a first portion 101 and a second portion 102 arranged opposite to the first portion 101", "forming multiple internal conductive structures 2 for respectively covering multiple first portions 101 of multiple conductive substrates 1", "forming multiple connecting layers 3, each of which is configured to connect between any two adjacent internal conductive structures 2, so that the multiple internal conductive structures 2 are stacked in sequence through the multiple connecting layers 3", "forming an outermost covering structure 4 for covering the multiple internal conductive structures 2 and the multiple connecting layers 3", "the multiple internal conductive structures 2 are not carbon paste material layers or silver paste material layers" and "there is no silver paste material between any two adjacent conductive substrates 1". Thus, when the stacked capacitor assembly S is applied to the stacked capacitor package structure M, the stacked capacitor package structure M can still achieve the electrical characteristics and functions that a capacitor can provide while simplifying the overall structure.

[0055] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the protection scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the claims of the present invention.

Claims

1. A stacked capacitor assembly, It is characterized in that The stacked capacitor assembly comprises: A plurality of conductive substrates, each of the conductive substrates having a first portion and a second portion disposed opposite to the first portion; a plurality of internal conductive structures, wherein the plurality of internal conductive structures are configured to respectively cover the plurality of first portions of the plurality of conductive substrates; a plurality of connection layers, each of the connection layers being configured to connect between any two adjacent internal conductive structures, so that the plurality of internal conductive structures are sequentially stacked through the plurality of connection layers; and an outermost encapsulating structure, the outermost encapsulating structure being configured to encapsulate a plurality of the internal conductive structures and a plurality of the connecting layers; Wherein, the plurality of internal conductive structures are not carbon paste material layers or silver paste material layers; Wherein, there is no silver paste material between any two adjacent conductive substrates.

2. The stacked capacitor assembly according to claim 1, characterized in that: in, The stacked capacitor assembly further comprises a plurality of surrounding insulating layers, the plurality of surrounding insulating layers being configured to be respectively disposed on the plurality of conductive substrates in a surrounding manner, and each of the surrounding insulating layers being located between the first portion and the second portion of the corresponding conductive substrate; Wherein, a plurality of said surrounding insulating layers are separated from each other or connected in sequence to form an insulating barrier structure; Wherein, when the plurality of surrounding insulating layers are separated from each other, each of the connecting layers is configured to be connected between any two adjacent surrounding insulating layers, so that the plurality of surrounding insulating layers are stacked in sequence through the plurality of connecting layers; Among them, the multiple internal conductive structures and the outermost covering structure are all connected to the multiple surrounding insulating layers, and the multiple internal conductive structures and the outermost covering structure are blocked by the multiple surrounding insulating layers and separated from the second part of each conductive substrate.

3. The stacked capacitor assembly according to claim 1, characterized in that: in, Each of the conductive substrates is a metal foil having an oxide layer on the surface, each of the internal conductive structures is a conductive polymer layer without carbon paste and silver paste, each of the connecting layers is a polymer material layer, a carbon paste layer or an insulating paste layer, and the outermost coating structure includes at least one of a single carbon paste layer and a single silver paste layer; Wherein, when the outermost coating structure includes the single carbon glue layer and the single silver glue layer at the same time, the single carbon glue layer of the outermost coating structure is configured to cover the plurality of the internal conductive structures, and the single silver glue layer of the outermost coating structure is configured to cover the single carbon glue layer; wherein the plurality of second portions of the plurality of conductive substrates cooperate with each other to form a positive electrode portion of the stacked capacitor assembly, and the outermost coating structure is configured to serve as a negative electrode portion of the stacked capacitor assembly; The outermost covering structure is disposed on one side of each of the inner conductive structures and is separated from the plurality of surrounding insulating layers, thereby forming a vertical conductive structure or an L-shaped conductive structure.

4. A method for manufacturing a stacked capacitor assembly, It is characterized in that The manufacturing method of the stacked capacitor assembly comprises: Providing a plurality of conductive substrates, wherein each of the conductive substrates has a first portion and a second portion disposed opposite to the first portion; forming a plurality of internal conductive structures for respectively covering a plurality of the first portions of a plurality of the conductive substrates; forming a plurality of connection layers, wherein each of the connection layers is configured to connect between any two adjacent internal conductive structures, so that the plurality of internal conductive structures are sequentially stacked through the plurality of connection layers; and forming an outermost covering structure for covering the plurality of internal conductive structures and the plurality of connecting layers; Wherein, the plurality of internal conductive structures are not carbon paste material layers or silver paste material layers; Wherein, there is no silver paste material between any two adjacent conductive substrates.

5. The method for manufacturing a stacked capacitor assembly according to claim 4, characterized in that: in, The step of providing a plurality of the conductive substrates further includes: forming a plurality of surrounding insulating layers for being respectively disposed on the plurality of the conductive substrates in a surrounding manner; Wherein, each of the surrounding insulating layers is located between the first portion and the second portion of the corresponding conductive substrate; Wherein, in the step of forming a plurality of connection layers, a plurality of said surrounding insulating layers are separated from each other or sequentially connected to form an insulating barrier structure; Wherein, when the plurality of surrounding insulating layers are separated from each other, each of the connecting layers is configured to be connected between any two adjacent surrounding insulating layers, so that the plurality of surrounding insulating layers are stacked in sequence through the plurality of connecting layers; Among them, the multiple internal conductive structures and the outermost covering structure are all connected to the multiple surrounding insulating layers, and the multiple internal conductive structures and the outermost covering structure are blocked by the multiple surrounding insulating layers and separated from the second part of each conductive substrate.

6. The method for manufacturing a stacked capacitor assembly according to claim 4, characterized in that: in, Each of the conductive substrates is a metal foil having an oxide layer on the surface, each of the internal conductive structures is a conductive polymer layer without carbon paste and silver paste, each of the connecting layers is a polymer material layer, a carbon paste layer or an insulating paste layer, and the outermost coating structure includes at least one of a single carbon paste layer and a single silver paste layer; Wherein, when the outermost coating structure includes the single carbon glue layer and the single silver glue layer at the same time, the single carbon glue layer of the outermost coating structure is configured to cover the plurality of the internal conductive structures, and the single silver glue layer of the outermost coating structure is configured to cover the single carbon glue layer; wherein the plurality of second portions of the plurality of conductive substrates cooperate with each other to form a positive electrode portion of the stacked capacitor assembly, and the outermost coating structure is configured to serve as a negative electrode portion of the stacked capacitor assembly; The outermost covering structure is disposed on one side of each of the inner conductive structures and is separated from the plurality of surrounding insulating layers, thereby forming a vertical conductive structure or an L-shaped conductive structure.

7. A stacked capacitor packaging structure, It is characterized in that The stacked capacitor packaging structure comprises: A stacked capacitor assembly, comprising a plurality of conductive substrates, a plurality of internal conductive structures, a plurality of connecting layers and an outermost coating structure; an electrode assembly, the electrode assembly comprising a first electrode structure and a second electrode structure respectively electrically connected to the stacked capacitor assembly; and an insulating package body, the insulating package body being configured to cover the stacked capacitor assembly and carry the electrode assembly; Wherein, each of the conductive substrates has a first portion and a second portion disposed opposite to the first portion; wherein the plurality of internal conductive structures are configured to respectively cover the plurality of first portions of the plurality of conductive substrates; Each of the connection layers is configured to connect between any two adjacent internal conductive structures, so that a plurality of the internal conductive structures are stacked in sequence through a plurality of the connection layers; Wherein, the outermost covering structure is configured to cover a plurality of the internal conductive structures and a plurality of the connecting layers; Wherein, the plurality of internal conductive structures are not carbon paste material layers or silver paste material layers, and there is no silver paste material between any two adjacent conductive substrates; The first electrode structure and the second electrode structure of the electrode assembly are respectively electrically connected to the second portion of each of the conductive substrates and the outermost coating structure.

8. The stacked capacitor packaging structure according to claim 7, characterized in that: in, The stacked capacitor assembly further comprises a plurality of surrounding insulating layers, the plurality of surrounding insulating layers being configured to be respectively disposed on the plurality of conductive substrates in a surrounding manner, and each of the surrounding insulating layers being located between the first portion and the second portion of the corresponding conductive substrate; Wherein, a plurality of said surrounding insulating layers are separated from each other or connected in sequence to form an insulating barrier structure; Wherein, when the plurality of surrounding insulating layers are separated from each other, each of the connecting layers is configured to be connected between any two adjacent surrounding insulating layers, so that the plurality of surrounding insulating layers are stacked in sequence through the plurality of connecting layers; Among them, the multiple internal conductive structures and the outermost covering structure are all connected to the multiple surrounding insulating layers, and the multiple internal conductive structures and the outermost covering structure are blocked by the multiple surrounding insulating layers and separated from the second part of each conductive substrate.

9. The stacked capacitor packaging structure according to claim 7, characterized in that: in, Each of the conductive substrates is a metal foil having an oxide layer on the surface, each of the internal conductive structures is a conductive polymer layer without carbon paste and silver paste, each of the connecting layers is a polymer material layer, a carbon paste layer or an insulating paste layer, and the outermost coating structure includes at least one of a single carbon paste layer and a single silver paste layer; Wherein, when the outermost coating structure includes the single carbon glue layer and the single silver glue layer at the same time, the single carbon glue layer of the outermost coating structure is configured to cover the plurality of the internal conductive structures, and the single silver glue layer of the outermost coating structure is configured to cover the single carbon glue layer; The outermost covering structure is disposed on one side of each of the inner conductive structures and is separated from the plurality of surrounding insulating layers, thereby forming a vertical conductive structure or an L-shaped conductive structure.

10. The stacked capacitor packaging structure according to claim 7, characterized in that: in, The plurality of second portions of the plurality of conductive substrates cooperate with each other to form a positive electrode portion of the stacked capacitor assembly, and the outermost encapsulating structure is configured to serve as a negative electrode portion of the stacked capacitor assembly; Wherein, the first electrode structure and the second electrode structure of the electrode assembly are electrically connected to the positive electrode portion and the negative electrode portion of the stacked capacitor assembly respectively; Wherein, the stacked capacitor assembly is supported by a conductive carrier substrate, and the negative electrode portion of the stacked capacitor assembly is electrically connected to the second electrode structure of the electrode assembly through the conductive carrier substrate; Wherein, the electrode assembly is a conductive pin assembly or an end electrode assembly; Wherein, when the electrode assembly is the conductive pin assembly, the first electrode structure of the electrode assembly includes a first embedded portion covered by the insulating package and a first exposed portion connected to the first embedded portion and exposed outside the insulating package, the first embedded portion of the first electrode structure is electrically connected to the positive electrode portion of the stacked capacitor assembly, and the first exposed portion of the first electrode structure extends along the outer surface of the insulating package; Wherein, when the electrode assembly is the conductive pin assembly, the second electrode structure of the electrode assembly includes a second embedded portion covered by the insulating package and a second exposed portion connected to the second embedded portion and exposed outside the insulating package, the second embedded portion of the second electrode structure is electrically connected to the negative electrode portion of the stacked capacitor assembly, and the second exposed portion of the second electrode structure extends along the outer surface of the insulating package; Wherein, when the electrode assembly is the end electrode assembly, the first electrode structure of the electrode assembly includes a first inner conductive layer configured to cover a first side end of the insulating package and electrically contact the positive electrode portion of the stacked capacitor assembly, a first middle conductive layer configured to cover the first inner conductive layer, and a first outer conductive layer configured to cover the first middle conductive layer, the first inner conductive layer is one of an Ag layer and a Cu layer, the first middle conductive layer is a Ni layer, and the first outer conductive layer is a Sn layer; Wherein, when the electrode assembly is the end electrode assembly, the second electrode structure of the electrode assembly includes a second internal conductive layer configured to cover a second side end portion of the insulating package and electrically contact the negative electrode portion of the stacked capacitor assembly, a second intermediate conductive layer configured to cover the second internal conductive layer, and a second external conductive layer configured to cover the second intermediate conductive layer, the second internal conductive layer is one of an Ag layer and a Cu layer, the second intermediate conductive layer is a Ni layer, and the second external conductive layer is a Sn layer.

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