Edge material removal apparatus and edge material removal method

Abstract

The edge material removing equipment comprises a base, a rotating table, a removing device and a visual processing device. The rotating table is arranged on the base, is used for bearing and horizontally rotating a semiconductor structure, and comprises a rotating shaft center. The semiconductor structure comprises a supporting substrate, a semiconductor layer and a molding body. The semiconductor layer is connected to the support surface of the support substrate, and the molding body covers the semiconductor layer and the support substrate. The removing device is arranged on the base, is located at a position opposite to the rotating table, and is used for removing a part of the mold sealing body of the semiconductor structure so as to expose the outer periphery of the supporting substrate. The visual processing device is arranged on the base, is located at a position opposite to the rotating table, and is used for obtaining a substrate circle center of the supporting substrate according to at least three positions of the outer periphery.

Description

Technical Field

[0001] The present invention relates to semiconductor manufacturing process, and in particular to an edge material removal device and an edge material removal method. Background Art

[0002] After the semiconductor packaging process is completed, the support substrate (such as a glass substrate, a metal substrate or other substrate) is covered by a mold body, and the actual range of the support substrate cannot be identified from the appearance. Currently, the mold body at the bottom of the support substrate is usually removed by grinding, but after grinding, the support substrate can no longer be recycled. Moreover, grinding requires more manpower and is not suitable for automated operations.

[0003] In practice, the molded body formed during the packaging operation may have overflow or spillover problems, resulting in uneven thickness formed around the supporting substrate. Therefore, directly calculating the center position of the supporting substrate based on the outer periphery of the molded body is prone to errors, and the molded body at the edge of the supporting substrate cannot be removed efficiently and evenly. Summary of the invention

[0004] In view of the above shortcomings, the edge material removal device of the present invention can evenly remove the packaging material at the edge of the support substrate without wearing the support substrate, thereby achieving the effect of recycling the support substrate.

[0005] The edge material removal equipment of the present invention includes a base, a rotating table, a removal device and a visual processing device. The rotating table is arranged on the base, and is used to carry and horizontally rotate a semiconductor structure, and includes a rotating shaft center. Among them, the semiconductor structure includes a supporting substrate, a semiconductor layer and a molded body. The supporting substrate includes an outer periphery, a supporting surface and a substrate center. The outer periphery surrounds the supporting surface. The substrate center is the center of the supporting surface. The semiconductor layer is connected to the supporting surface, and the molded body covers the semiconductor layer and the supporting substrate. The removal device is arranged on the base, and is located at a relative position of the rotating table, and is used to remove the molded body of a portion of the semiconductor structure to expose the outer periphery of the supporting substrate. The visual processing device is arranged on the base, and is located at a relative position of the rotating table, and is used to obtain the substrate center of the supporting substrate based on at least three positions of the outer periphery.

[0006] The edge material removal method of the present invention includes providing a semiconductor structure, including a supporting substrate, a semiconductor layer, and a molded body. The supporting substrate includes an outer periphery, a supporting surface, and a substrate center. The outer periphery is surrounded to form the supporting surface. The substrate center is the center of the supporting surface. The semiconductor layer is connected to the supporting surface of the supporting substrate. The molded body covers the semiconductor layer and the supporting substrate. Part of the molded body is removed to form at least three notches, and the notches include the outer periphery of part of the supporting substrate. The substrate center of the supporting substrate is obtained through three positions of the exposed outer periphery in at least three notches. The molded body located at the edge of the semiconductor structure is removed so that the molded body retreats a distance from the outer periphery to the substrate center, thereby exposing the outer periphery of the entire supporting substrate.

[0007] In this way, the edge material removal equipment and edge material removal method of the present invention can obtain the center of the substrate through three positions of the outer periphery of the supporting substrate, and then define the position and range of the supporting substrate. Therefore, when removing excess molding (packaging material) at the edge of the semiconductor structure, it can be removed more evenly and effectively, and will not wear the supporting substrate to achieve the effect of recycling the supporting substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 is a schematic diagram of an embodiment of an edge material removal apparatus of the present invention;

[0009] Figure 2 is a schematic diagram of another embodiment of the edge material removal apparatus of the present invention;

[0010] Figure 3 yes Figure 2 A schematic diagram of the relative positions of the semiconductor structure and the visual processing device;

[0011] Figure 4 is a flow chart of the edge material removal method of the present invention;

[0012] Figure 5 It corresponds to Figure 4 A schematic diagram of forming three gaps in the semiconductor structure in steps 53 and 55;

[0013] Figure 6 and Figure 7 They are respectively Figure 4 A side view and a top view of the molded body with the edge of the semiconductor structure removed in step 57;

[0014] Wherein, the reference numerals are:

[0015] 10: Edge material removal equipment;

[0016] 11: base;

[0017] 13: rotating table;

[0018] 15: Remove the device;

[0019] 151: first laser beam;

[0020] 151a, 151b: light spot;

[0021] 153: second laser beam;

[0022] 17: visual processing device;

[0023] 30: semiconductor structure;

[0024] 31: supporting substrate;

[0025] 311: outer periphery;

[0026] 313: support surface;

[0027] 315: center of substrate;

[0028] 33: semiconductor layer;

[0029] 35: Molded body;

[0030] 50: Edge material removal method;

[0031] Steps 51-57. DETAILED DESCRIPTION

[0032] The following will be combined with the embodiments and drawings to clearly and completely describe the structure, method and technical effects of the present invention, so as to fully understand the purpose, technology, scheme and effect of the present invention. It should be noted that the embodiments and features in the embodiments of the present invention can be combined with each other without conflict.

[0033] Unless otherwise specified, when a technical feature is referred to as being "fixed", "set", or "connected" to another feature, it may be directly fixed or connected to the other feature, or may be indirectly fixed, set, or connected to the other feature. In addition, the directional descriptions such as up, down, left, right, top, and bottom used in the present invention are only used to illustrate the relative positional relationship of the components of the present invention in the accompanying drawings.

[0034] Although the terms first, second, third, etc. may be used in the present invention to describe various technical features, these technical features should not be limited to these terms. These terms are only used to distinguish technical features of the same type from each other. For example, without departing from the scope of the present invention, the first technical feature may also be referred to as the second technical feature, and similarly, the second technical feature may also be referred to as the first technical feature.

[0035] like Figure 1As shown, the edge material removal device 10 of the present invention is used to remove the edge material of the semiconductor structure 30. The semiconductor structure 30 includes a supporting substrate 31, a semiconductor layer 33 and a molded body 35. The supporting substrate 31 includes an outer periphery 311, a supporting surface 313 and a substrate center 315. The outer periphery 311 surrounds the supporting surface 313. The substrate center 315 is the center of the supporting surface 313. In this embodiment, the supporting surface of the supporting substrate 31 is roughly circular. The semiconductor layer 33 is connected to the supporting surface 313 of the supporting substrate 31. The molded body 35 covers the semiconductor layer 33 and the supporting substrate 31, and the molded body 35 is a packaging material for the semiconductor.

[0036] The edge material removal device 10 includes a base 11, a rotating table 13, a removal device 15 and a visual processing device 17. The rotating table 13 is disposed on the base 11. The removal device 15 is disposed on the base 11 and is located at a relative position to the rotating table 13, and is used to remove a portion of the molded body 35 of the semiconductor structure 30 to expose the outer periphery 311 of the supporting substrate 31. The visual processing device 17 is disposed on the base 11 and is located at a relative position to the rotating table 13, and is used to obtain the substrate center 315 of the supporting substrate 31 based on at least three positions of the outer periphery 311.

[0037] The outer periphery 311 of the supporting substrate 31 is beyond the range of the rotating platform 13, so that the removing device 15 can more easily remove the molded body 35 from the edge of the semiconductor structure 30. After the substrate center 315 of the supporting substrate 31 is obtained, the substrate center 315 of the supporting substrate 31 can be coincident with the center of the rotating shaft 131. The method of obtaining the substrate center 315 will be described later.

[0038] The removal device 15 uses a laser process to remove the molded body 35. In this embodiment, the removal device 15 can generate a first laser beam 151 and a second laser beam 153. The first laser beam 151 is projected downward from the top of the support substrate 31 to remove the molded body 35 of the semiconductor structure 30 that exceeds the range of the rotating table 13, so that the molded body 35 retreats a distance from the outer periphery 311 to the center 315 of the substrate, and the support surface 313 of the support substrate 31 is exposed within the distance range. The second laser beam 153 is projected upward from the bottom of the support substrate 31 to remove the molded body 35 of the semiconductor structure 30 that exceeds the range of the rotating table 13.

[0039] In other embodiments, the second laser beam 153 may be omitted. In other words, the removing device 15 is not limited to generating laser beams in two directions.

[0040] The visual processing device 17 includes an image capturing unit 171 for identifying the outer periphery 311 of the supporting substrate 31 by photographing, and after identifying at least three positions (coordinates) of the outer periphery 311 , the center 315 of the substrate can be calculated based on the three positions.

[0041] like Figure 2 and Figure 3 As shown, the visual processing device 17 may also include three image capture units 171, which are arranged at fixed positions relative to the rotating table 13 and are used to identify the outer periphery 311. In this way, since the three image capture units 171 are at fixed positions, in other words, the position of identifying the outer periphery 311 is also roughly fixed. Therefore, this method can more efficiently obtain the three positions or coordinates of the outer periphery 311, and can also provide a higher precision recognition effect.

[0042] like Figure 4 As shown, the edge material removal method 50 of the present invention includes four steps. Step 51 is to provide a semiconductor structure. Step 53 is to remove a portion of the molded body of the semiconductor structure to form three gaps. The gap includes the outer periphery of a portion of the supporting substrate. Step 55 is to obtain the substrate center of the supporting substrate through three positions of the exposed outer periphery in the three gaps. Step 57 is to remove the molded body located at the edge of the semiconductor structure so that the molded body retreats a distance from the outer periphery to the substrate center, thereby exposing the outer periphery of the entire supporting substrate. In this way, through these four steps, the excess molded body can be evenly removed, that is, the distance from the periphery of the molded body to the substrate center after retreat is roughly the same.

[0043] Wherein, the semiconductor structure described in step 51 is as follows Figure 1 The removal in steps 53 and 57 includes removing the molded body by laser beam, such as Figure 1 Removal device as described in .

[0044] like Figure 5 As shown, the formation of each gap 37 in step 53 includes projecting laser light onto the mold body 35 multiple times so that the current laser light spot 151b partially overlaps with the previous laser light spot 151a. In this way, the excess mold body 35 can be removed inward one by one until the visual processing device 17 identifies the outer periphery 311 of the supporting substrate 31.

[0045] like Figure 5As shown, the three positions 317, 318, and 319 of the exposed outer periphery 315 in step 55 can be used to obtain the position of the center of the substrate 315 through the circle equation. In this embodiment, the radius of the supporting substrate 31 is a known parameter, so the coordinates of the three positions 317, 318, and 319 can be used by the visual processing device to calculate the center of the substrate 315 using the circle equation. In other embodiments, the center of the substrate 315 can also be obtained by other methods, not limited to the circle equation.

[0046] like Figure 6 and Figure 7 As shown, after the center of the substrate is obtained in step 55, the outer periphery 311 of the supporting substrate 31 can be defined and the retreat distance can be determined. Therefore, removing the molding body located at the edge of the semiconductor structure in step 57 includes rotating the semiconductor structure around the center of the substrate. In this way, the removal device can project a laser beam at a fixed position to remove excess molding body 35 until the outer periphery 35 of the entire supporting substrate 31 is exposed.

[0047] The molded body 35 has retreated a distance from the outer periphery 311 toward the center 315 of the substrate. This distance can be adjusted according to the product of the semiconductor structure, rather than being a fixed or specific parameter.

[0048] Thus, the outer periphery of the molded body 35 remaining on the support substrate 31 is roughly evenly distributed with the outer periphery 311 of the support substrate 31. Furthermore, the edge material removal technology of the present invention will not wear the structure of the support substrate 31, and is more suitable for automation. In addition, the subsequent process can easily separate the support substrate 31 from the packaged semiconductor layer 33 to achieve the effect of recycling the support substrate.

Claims

1. An edge material removal device, characterized in that: include: a base; A rotating platform is arranged on the base and used for carrying and horizontally rotating a semiconductor structure, and includes a rotating shaft center, wherein the semiconductor structure includes a supporting substrate, a semiconductor layer and a mold package, the supporting substrate includes an outer periphery, a supporting surface and a substrate center, the outer periphery surrounds the supporting surface, the substrate center is the center of the supporting surface, the semiconductor layer is connected to the supporting surface of the supporting substrate, and the mold package covers the semiconductor layer and the supporting substrate; a removing device, disposed on the base and located at a position opposite to the rotating table, and used for removing a portion of the molded body of the semiconductor structure to expose the outer periphery of the supporting substrate; and A visual processing device is arranged on the base and is located at a relative position of the rotating table, and is used to obtain the substrate center of the supporting substrate based on at least three positions of the outer periphery.

2. The edge material removal device according to claim 1, characterized in that: The supporting substrate of the semiconductor structure exceeds the range of the rotating platform.

3. The edge material removal device according to claim 2, characterized in that: The removal device is used to generate a first laser beam, which is projected downward from the top of the supporting substrate to remove the molded body of the semiconductor structure beyond the range of the rotating platform, so that the molded body retreats a distance from the outer periphery to the center of the substrate.

4. The edge material removal device according to claim 3, characterized in that The removal device is used for generating a second laser beam, which is projected upward from the bottom of the support substrate to remove the molded body of the semiconductor structure beyond the range of the rotating platform.

5. The edge material removal device according to claim 1, characterized in that: The center of the substrate circle of the supporting substrate coincides with the center of the rotating shaft.

6. The edge material removal device according to claim 1, characterized in that: The visual processing device includes a plurality of image capturing units to identify the outer periphery at a fixed position.

7. A method for removing edge material, characterized in that: include: A semiconductor structure is provided, comprising a supporting substrate, a semiconductor layer and a mold encapsulation body, wherein the supporting substrate comprises an outer periphery, a supporting surface and a substrate center, the outer periphery surrounds and forms the supporting surface, the substrate center is the center of the supporting surface, the semiconductor layer is connected to the supporting surface of the supporting substrate, and the mold encapsulation body covers the semiconductor layer and the supporting substrate; Removing a portion of the mold package to form at least three gaps, the gaps including a portion of the outer periphery of the support substrate; Obtaining the substrate center of the support substrate through three positions of the outer periphery exposed in the at least three notches; and The mold encapsulation body at the edge of the semiconductor structure is removed so that the mold encapsulation body retreats a distance from the outer periphery toward the center of the substrate to expose the outer periphery of the entire support substrate.

8. The edge material removal method according to claim 7, characterized in that: The removing includes removing the molding body by a laser process.

9. The edge material removal method according to claim 8, characterized in that: Each of the at least three openings formed by the laser process includes projecting laser light onto the mold package for multiple times so that the spot of the current laser light partially overlaps with the spot of the previous laser light.

10. The edge material removal method according to claim 7 or 8, characterized in that: Removing the molded body located at the edge of the semiconductor structure includes rotating the semiconductor structure with the center of the substrate as the axis.

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