A rapid glue coating method and system for a diode

Abstract

The present invention discloses a rapid glue coating method and system for diodes, which relates to the technical field of diodes. The method includes: collecting the distribution of diodes, the glue coating positions and the glue coating areas in the device, and constructing a distribution map, which contains position identifiers and area identifiers; identifying the size of the glue coating area according to the area identifier, and clustering according to the area size to obtain an area clustering distribution map; determining the overlapping area region, converting it into a correlation degree, and generating a correlation coefficient; calculating the total proportion of the position identifiers in the distribution map to obtain an area clustering proportion value; determining an initial region according to the proportion value, performing path configuration to obtain a glue coating control path; determining glue control parameters according to the area clustering size of the glue coating control path, establishing a mapping relationship between the glue coating control path and the glue control parameters, and generating a control instruction for glue coating control. Furthermore, the technical effects of simplifying the glue coating plan and improving the glue coating efficiency are achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of diodes, and particularly relates to a rapid glue coating method and system for diodes. Background Art

[0002] Diodes are common components in electronic devices. The glue coating process is an important part of the diode production process, which can protect the diodes from environmental factors and improve the stability and service life of the diodes.

[0003] Traditional diode glue coating methods usually include two ways: manual glue coating and machine glue coating. The manual glue coating method is simple to operate, but has low work efficiency, and the glue coating quality is greatly affected by the skill level of the operator, and it is difficult to ensure the uniformity and consistency of glue coating. Although the machine glue coating method can improve work efficiency and reduce the influence of human factors, the existing machine glue coating equipment and system are complex, costly, and the glue coating speed and efficiency still need to be improved. There are technical problems such as complex glue coating planning and low glue coating efficiency. Summary of the Invention

[0004] The present invention provides a rapid glue coating method and system for diodes to solve the technical problems of complex glue coating planning and low glue coating efficiency in the prior art, and achieve the technical effects of simplifying glue coating planning and improving glue coating efficiency.

[0005] In a first aspect, the present invention provides a rapid glue coating method for diodes, wherein the method includes:

[0006] Collect the distribution of diodes, glue coating positions and glue coating areas in the device, and construct a distribution map, where the distribution map has position identifiers and area identifiers;

[0007] Based on the area identifiers in the distribution map, perform size recognition and perform area clustering according to the area size to obtain an area clustering distribution map;

[0008] Obtain the overlapping area region of the area clustering distribution map, and perform relevance transformation according to the overlapping area region to generate a correlation coefficient;

[0009] Calculate the total proportion according to the number of distribution position identifiers in the area clustering distribution map to obtain the area clustering proportion value;

[0010] According to the area clustering proportion value, determine the initial region, where the initial region is the area clustering distribution with the largest area clustering proportion value, extract the associated area clustering distribution map of the initial region and its corresponding correlation coefficient, and perform path configuration to obtain a glue coating control path;

[0011] Determine the glue control parameters according to the area clustering size of the glue application control path, including the glue outlet pressure, the glue output, and the glue application control path, establish the mapping relationship between the glue application control path and the glue control parameters, and generate control instructions for glue application control.

[0012] In this method, by collecting the distribution of diodes, the glue application position, and the glue application area in the device, a distribution map with position identifiers and area identifiers is constructed, realizing the visual integrated display of key information during the glue application process. Size recognition is performed based on the area identifier, and clustering is carried out according to the area size to obtain an area clustering distribution map. The overlapping area region is extracted, the correlation coefficient is generated, and the category and association relationship between different glue application regions are obtained.

[0013] In a second aspect, the present invention also provides a rapid glue application system for diodes, wherein the system includes:

[0014] A distribution mapping module, which is used to collect the distribution of diodes, the glue application position, and the glue application area in the device, and construct a distribution map, where the distribution map has position identifiers and area identifiers;

[0015] An area clustering module, which is used to perform size recognition based on the area identifier in the distribution map, and perform area clustering according to the area size to obtain an area clustering distribution map;

[0016] An association analysis module, which is used to obtain the overlapping area region of the area clustering distribution map, perform relevance conversion according to the overlapping area region, and generate a correlation coefficient;

[0017] A ratio calculation module, which is used to calculate the total occupancy ratio according to the number of distribution position identifiers in the area clustering distribution map to obtain the area clustering occupancy ratio;

[0018] A path configuration module, which is used to determine the initial region according to the area clustering occupancy ratio. The initial region is the area clustering distribution with the largest area clustering occupancy ratio, extract the associated area clustering distribution map of the initial region and its corresponding correlation coefficient, perform path configuration, and obtain the glue application control path;

[0019] A glue application control module, which is used to determine the glue control parameters according to the area clustering size of the glue application control path, including the glue outlet pressure, the glue output, and the glue application control path, establish the mapping relationship between the glue application control path and the glue control parameters, and generate control instructions for glue application control.

[0020] The present invention discloses a rapid glue - coating method and system for diodes, including: collecting the positions and glue - coating areas of diodes in a device, constructing a distribution map, and marking the positions and areas. Through the area markings in the distribution map, the size of the glue - coating area is identified and clustered to generate an area - clustering distribution map. The overlapping area region is determined and converted into a correlation coefficient. The total proportion of the position markings in the area - clustering distribution map is calculated to obtain the area - clustering proportion value. According to the proportion value, the initial region is determined, the associated distribution map and correlation coefficient of the initial region are extracted, and the path is configured to obtain the glue - coating control path. According to the size of the area - clustering in the control path, the glue - control parameters are determined, the mapping relationship between the glue - coating control path and the glue - control parameters is established, and a control instruction is generated. The rapid glue - coating method and system for diodes disclosed by the present invention solve the technical problems of complex glue - coating planning and low glue - coating efficiency, and achieve the technical effects of simplifying glue - coating planning and improving glue - coating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic flow chart of a rapid glue - coating method for diodes of the present invention;

[0022] Figure 2 It is a schematic structural diagram of a rapid glue - coating system for diodes of the present invention.

[0023] Description of reference numerals: Distribution mapping module 11, area - clustering module 12, correlation analysis module 13, proportion calculation module 14, path configuration module 15, glue - coating control module 16. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] In the embodiments of the present invention, the overall idea adopted for solving the technical problems of high latency, lack of real - time performance, incomplete monitoring, and insufficient predictability existing in the prior art is as follows:

[0025] First, collect the distribution, glue - coating position, and glue - coating area data of diodes in the device, and construct a distribution map to ensure that the distribution map contains position markings and area markings. Then, based on the area markings in the distribution map, the size is identified, and area clustering is performed according to the area size to obtain an area - clustering distribution map. Next, determine the overlapping area region of the area - clustering distribution map, and perform relevance conversion according to the overlapping area region to generate a correlation coefficient. Then, according to the number of distribution position markings in the area - clustering distribution map, calculate the total proportion to obtain the area - clustering proportion value. According to the area - clustering proportion value, determine the initial region, that is, the area - clustering distribution with the largest area - clustering proportion value, and extract the associated area - clustering distribution map and its corresponding correlation coefficient of the initial region, and perform path configuration to obtain the glue - coating control path. Finally, determine the glue - control parameters according to the size of the area - clustering in the glue - coating control path, including the glue - discharging pressure, glue - discharging amount, and glue - discharging control path, establish the mapping relationship between the glue - coating control path and the glue - control parameters, and generate a control instruction for glue - coating control.

[0026] The above technical solutions will be described in detail below in combination with the accompanying drawings of the specification and specific implementation manners to better understand the above technical solutions. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments of the present invention. It should be understood that the present invention is not limited to the example embodiments only used to explain the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention. In addition, it should be noted that for the convenience of description, only the parts related to the present invention are shown in the drawings rather than all of them.

[0027] Embodiment 1

[0028] Figure 1 It is a schematic flow chart of a rapid glue application method for a diode of the present invention, which includes:

[0029] Collect the distribution of diodes, the glue application positions and the glue application areas in the device, and construct a distribution map, where the distribution map has position identifiers and area identifiers;

[0030] Specifically, applying glue to the diode is a common protection measure to protect the diode from environmental factors (such as moisture, dust, etc.), thereby extending the service life of the diode.

[0031] Optionally, the distribution map is used to display the positions of the diodes and the positions and areas of the glue application. The distribution map is a two-dimensional or three-dimensional map, depending on the complexity of the device and the required level of detail. The distribution map contains the position identifiers and area identifiers of multiple diodes in the collected device, facilitating the quick and accurate determination of the positions of each diode and the glue application and the area of the glue application.

[0032] In some embodiments, collecting the distribution of diodes, the glue application positions and the glue application areas in the device, and constructing a distribution map, where the distribution map has position identifiers and area identifiers, includes:

[0033] Obtain the design drawing of the device, decompose the diode glue application task, and determine the distribution of the diodes;

[0034] According to the structure and functional requirements of the diode, analyze the area of the glue application part and locate the glue application position of the diode;

[0035] According to the design drawing of the base, locate the glue application position and the glue application area of the base, and the glue application position and the glue application area of the base are the positions and areas in contact with the diode;

[0036] Obtain the glue application position according to the glue application position of the diode and the glue application position of the base;

[0037] Restrict the glue - applying area of the diode according to the glue - applying area of the base to obtain the glue - applying area.

[0038] Among them, the design drawing of the device is one or a set of design files based on computer - aided design programs or other types of drawings.

[0039] Optionally, decompose the diode glue - applying task based on the design drawing of the device to determine the distribution of the diodes, including parsing the design drawing based on layer settings and legend annotations in the device design drawing to extract multiple groups of diode pixels; then, based on the positions of the above - mentioned diode pixels, perform diode positioning to determine the diode pixel coordinates; finally, through stretching, rotation, and affine transformation, convert the diode pixel coordinates into device coordinates in the real - world coordinate system to determine the diode distribution.

[0040] Optionally, analyze the area of the glue - applying part according to the structure and functional requirements of the diode, and determine the glue - applying position of the diode. This includes consulting technical documents or communicating with engineers and designers to understand the structure and functional requirements of the diode, and then analyzing the area of the glue - applying part according to the structure and functional requirements of the diode, combined with the size of the diode and the thickness and coverage rate of the glue application.

[0041] Exemplarily, the glue - applying positions of the diode include fixed pin positions and auxiliary pin positions. Among them, the fixed pin position is the main contact point where the diode is connected to other electronic components or the circuit board. Applying glue at this position can help fix the diode and prevent it from moving or falling off under vibration or impact. The glue application can also provide additional electrical insulation to prevent short - circuits or current leakage. The auxiliary pin position is an additional contact point of the diode, usually used to provide additional stability or support, and at the same time provide heat - conduction ability.

[0042] Optionally, based on the design drawing of the base, combined with the corresponding relationship between the base and the diode, determine the glue - applying position and glue - applying area of the base. Among them, the glue - applying position of the base is the position in contact with the diode. The glue - applying area of the base is the area in contact with the diode. The glue - applying position and glue - applying area of the base match the position and area in contact with the diode.

[0043] Specifically, merge the glue - applying position information according to the glue - applying position of the diode and the glue - applying position of the base to obtain the complete glue - applying position. Restrict the glue - applying area of the diode according to the glue - applying area of the base to ensure that the glue - applying area is within the range of the base, without glue overflow or leakage, so as to determine the final glue - applying area. Exemplarily, establish a glue - applying area constraint with the base boundary as the constraint boundary according to the glue - applying area of the base. Among them, the base boundary includes the outer boundary of the base and the inner boundary of the base (such as openings, slots, clearances, etc. on the base).

[0044] Through the above steps, it is ensured that the glue application positions and areas of the diodes and the base can meet the design and functional requirements of the device.

[0045] Based on the area identifiers in the distribution map, size recognition is performed, and area clustering is carried out according to the area size to obtain an area clustering distribution map.

[0046] In some embodiments, based on the area identifiers in the distribution map, size recognition is performed, and area clustering is carried out according to the area size to obtain an area clustering distribution map, including:

[0047] Set a restricted interval distance based on the size of the glue application device.

[0048] Use the restricted interval distance to traverse the intervals between distribution points in the distribution map to obtain an abnormal interval area, including: configuring recognition features according to the restricted interval distance, using a convolutional kernel model to segment the distribution map in a preset segmentation manner, and traversing the features of the segmented areas using the recognition features.

[0049] Perform clustering screening according to the abnormal interval area, configure the area of the abnormal interval area, and perform combined area identification on the abnormal interval area according to the configured area.

[0050] Add the combined area identifier to the area identifiers for area clustering.

[0051] Specifically, in an actual distribution map, there may be some areas where the distribution of diodes is too dense, resulting in a situation where the glue application device cannot perform precise operations in these areas. At this time, areas with inconsistent glue application widths or overly dense diode distributions can be regarded as a whole, and glue application operations can be performed on this whole to ensure that the glue application positions and areas in these areas are all covered.

[0052] Optionally, first, set a restricted interval distance based on the size of the glue application device. Among them, the size of the glue application device refers to the diameter of the glue outlet, and this size determines the minimum glue application width of the glue application device, thereby affecting the glue application accuracy. Through the size of the glue application device, the theoretical minimum allowable distance between points in the distribution map can be determined.

[0053] Then, traverse the intervals between distribution points in the distribution map, and determine the size relationship with the restricted interval distance. If the interval between distribution points is greater than or equal to the restricted interval distance, it means that the distance between the distribution points in this group of intervals is smaller than the size of the glue application device and precise operations cannot be performed, and it is correspondingly set as an abnormal interval area. Among them, the distribution points in the distribution map refer to multiple glue application points, such as the two foot points of adjacent diodes.

[0054] Exemplarily, to obtain the abnormal interval region, first, determine the features to be recognized according to the size and capabilities of the coating equipment in use (i.e., the restricted interval distance), including the position, size, shape, etc. of the diode. Then, analyze the distribution map through a convolutional neural network. The convolutional neural network slides a convolutional kernel over the distribution map, and each slide covers a small area (i.e., the area determined by the preset segmentation method). Then, analyze the covered area to check whether each area contains a diode, whether the size of the diode and the interval meet the expectations, etc., so as to determine the abnormal interval region.

[0055] Optionally, perform combined area identification on the abnormal interval region according to the configured area, including treating the abnormal interval region as an overall coating power grid and assigning a new area identifier to the reconfigured region.

[0056] Optionally, add the new area identifier to the original area identifier, and then perform further area clustering. Ensure that the coating areas in the clustering results all adapt to the working performance of the target coating equipment and the actual requirements of the diodes, thereby improving the coating quality.

[0057] In some implementation manners, the area configuration for the abnormal interval region includes:

[0058] Obtain the coating area of the abnormal interval region. When the coating areas of the abnormal interval regions are the same, configure the original area identifier and set a combined coating trajectory, and the combined coating trajectory is a sequentially continuous trajectory;

[0059] When the coating areas of the abnormal interval regions are different, configure with the diode area identifier in the middle and set the combined coating trajectory as a trajectory that spreads outwards from the center.

[0060] Specifically, for the area configuration of the abnormal interval region, the abnormal interval region includes multiple coating areas. When the multiple coating areas in the abnormal interval region are the same, configure a single original area identifier for these regions and set a sequentially continuous combined coating trajectory. That is to say, when the multiple coating areas in the abnormal interval region are the same, the coating equipment will coat these regions in a fixed order (such as from left to right, from top to bottom). When the coating areas of the abnormal interval region are different, then use the coating area of the diode in the middle as the identifier to configure the coating parameters, including configuring the width of the coating trajectory, and set the combined coating trajectory as a trajectory that spreads outwards from the center, so as to ensure the uniform distribution of the coating.

[0061] Obtain the overlapping area region of the area clustering distribution map, perform correlation transformation according to the overlapping area region, and generate a correlation coefficient;

[0062] Optionally, perform internal connection of multiple area clusters in the area cluster distribution map to form multiple cluster area regions; then, traverse the multiple area clusters for pairwise random combination to obtain multiple cluster groups; next, identify and measure the overlapping regions of the cluster area regions corresponding to the multiple cluster groups to obtain multiple overlapping area regions, and the size or proportion of the overlapping area regions reflects the degree of association between the clusters; then, calculate the correlation coefficient according to the size or proportion of the overlapping area. The correlation coefficient is used to guide the subsequent glue application operation.

[0063] Exemplarily, calculate the ratio of the size of the overlapping area region to the total size of the cluster area region corresponding to the corresponding cluster group, perform correlation transformation, and obtain the correlation coefficient.

[0064] Calculate the total proportion according to the number of distribution position identifiers in the area cluster distribution map to obtain the area cluster proportion value;

[0065] In some embodiments, calculating the total proportion according to the number of distribution position identifiers in the area cluster distribution map to obtain the area cluster proportion value includes:

[0066] Obtain the total number of standard identifiers according to the number of distribution position identifiers in the distribution map;

[0067] Calculate the number of identifiers and the number of abnormal interval regions in the area cluster distribution map, and obtain the proportion of marked identifiers through the ratio of the number of identifiers to the total number of standard identifiers;

[0068] Use the proportion of marked identifiers as the standard value and the number of abnormal interval regions as the adjustment amount to generate the area cluster proportion value.

[0069] Wherein, the total number of standard identifiers refers to the total number of distribution position identifiers in the distribution map.

[0070] Optionally, traverse the area cluster distribution map to count the number of distribution position identifiers and the number of abnormal interval regions inside the cluster. During this statistical process, the entire abnormal interval region is regarded as a distribution position identifier.

[0071] Optionally, the area cluster proportion value includes a standard value and an adjustment amount. Among them, the standard value, that is, the proportion of marked identifiers, is the first reference index and the first selection basis for subsequent initial region determination; the adjustment amount, that is, the number of abnormal interval regions, is the second reference index and the second selection basis for subsequent initial region determination.

[0072] Determine the initial region according to the area cluster proportion value. The initial region is the area cluster distribution with the largest area cluster proportion value. Extract the associated area cluster distribution map of the initial region and its corresponding correlation coefficient, and perform path configuration to obtain the glue application control path;

[0073] Among them, the initial area is the starting point of the glue application trajectory.

[0074] Optionally, first, using the standard value in the area clustering occupancy ratio, i.e., the proportion of the marked identifier, as the first reference index, and the adjustment amount, i.e., the number of abnormal interval areas, as the second reference index, perform a descending order arrangement of multiple area clustering distributions. Then, select the area clustering distribution at the top of the sequence as the initial area. Among them, the initial area is the largest clustering area, which contains the most diodes, so glue application is performed first.

[0075] The above method provides a data-based selection strategy for determining the initial area of the glue application operation, which helps to improve the efficiency and quality of glue application.

[0076] In some embodiments, extract the associated area clustering distribution map of the initial area and its corresponding correlation coefficient, perform path configuration to obtain the glue application control path, including:

[0077] According to the correlation coefficient, start path configuration from the initial area, and set the associated area clustering distribution with the highest correlation coefficient as the subsequent node;

[0078] According to the position identifier distribution of each area clustering distribution map, construct an optimization subspace with the shortest path as the target value;

[0079] Connect each optimization subspace according to the node relationship of the path configuration to construct a full-path optimization model;

[0080] Take the combined glue application trajectory as a constraint condition and add it to the full-path optimization model for iterative optimization. When the preset number of iterations is reached or the path optimization target value is reached, output the glue application control path through the full-path optimization model.

[0081] Optionally, first, according to the correlation coefficient, start path configuration from the initial area, and select the associated area clustering distribution with the highest correlation coefficient as the next node; then, according to the position identifier distribution of each area clustering distribution map, construct an optimization subspace, where the optimization subspace takes the shortest path as the target value.

[0082] Optionally, traverse multiple associated area clustering distributions, and sequentially determine multiple subsequent nodes; then, based on the determined multiple subsequent nodes, obtain multiple optimization subspaces; then, connect the multiple optimization subspaces according to the sequence relationship of the multiple nodes in the path configuration to construct a full-path optimization model. In other words, the full-path optimization model includes multiple serialized optimization subspaces.

[0083] Optionally, during the process of finding the optimal glue application path, the existing combined glue application trajectories need to be considered. Therefore, taking the combined glue application trajectories as additional constraints, the starting point and the ending point of the combined glue application trajectories are set as waypoints, and the initial full-path optimization model is used to ensure that the glue application equipment will pass through the starting point and the ending point of the combined glue application trajectories.

[0084] Optionally, based on iterative optimization algorithms such as genetic algorithms or simulated annealing algorithms, the optimal glue application path is found. When the preset number of iterations is reached or the length of the full path reaches the target value, the full-path optimization model outputs the glue application control path as the optimal glue application path, and the glue application control path is obtained.

[0085] The glue control parameters are determined according to the area clustering size of the glue application control path, including the glue output pressure, the glue output volume, and the glue output control path. The mapping relationship between the glue application control path and the glue control parameters is established, and control instructions are generated for glue application control.

[0086] Optionally, different areas require different glue output pressures and glue output volumes. Therefore, based on the area clustering size of the glue application control path and in combination with the characteristic parameters of the target glue application equipment, the glue control parameters are determined, where the glue control parameters include the glue pressure, the glue output volume, and the glue output control path.

[0087] Optionally, based on the area clustering size of different segments in the glue application control path and the corresponding relationship between the area clustering size and the glue control parameters, the glue control parameters are mapped to the glue application control path, so as to ensure that appropriate glue control parameters are configured for different segments on the glue application control path, which helps to improve the efficiency and quality of glue application.

[0088] In some implementation manners, a fast glue application method for a diode according to the present invention further includes:

[0089] Device monitoring information is obtained through a carrier monitoring device to determine the position of the subsequent device;

[0090] Based on the control instruction, the glue application process is obtained. According to the position of the subsequent device and the glue application process, the instruction interval deviation is determined, where the instruction interval deviation is the time difference between the arrival of the subsequent device at the glue application control position and the completion of the current control instruction;

[0091] The adaptive adjustment of the glue control parameters is performed according to the instruction interval deviation, including: temperature control, where the magnitude of the temperature control corresponds to the temperature loss value and the power. When the heating time of the power is less than one-half of the instruction interval deviation, the heating is stopped; otherwise, the power is analyzed and controlled in a curve according to the instruction interval deviation through a temperature control processing model.

[0092] Optionally, when processing multiple devices, there may be deviations in the transmission speed of the devices. It is necessary to determine the instruction interval deviation based on the position of the subsequent device and the glue application process, and adaptively adjust the glue control parameters according to the instruction interval deviation.

[0093] Exemplarily, first, obtain the position information of the subsequent device. Then, obtain the glue application process through the control instruction, and determine the instruction interval deviation based on the position of the subsequent device and the glue application process. Next, based on the instruction interval deviation, adaptively adjust the glue control parameters, including temperature control. This is because temperature affects the viscosity, fluidity, and curing speed of the glue, thereby affecting the glue application process. Specifically, if the heating time of the current power is less than half of the instruction interval deviation, the heating is stopped, thereby appropriately reducing the viscosity and fluidity of the glue and improving the glue application effect; otherwise, through the temperature control processing model, the heating power is adjusted in combination with the instruction interval deviation, and on the premise of ensuring the glue application quality, the glue application efficiency is improved to ensure the normal processing of the subsequent device.

[0094] Among them, the temperature control processing model can be a mathematical model based on statistical analysis or an end-to-end processing model based on machine learning. This temperature control processing model contains the mapping relationship between the instruction interval deviation and the heating power. Specifically, the temperature control processing model takes the instruction interval deviation as the input parameter and the heating power adjustment value as the response result, realizing the adaptive adjustment of the temperature in the glue control parameters.

[0095] Through the above adaptive glue application control method, it helps to improve the efficiency and quality of glue application.

[0096] In summary, a fast glue application method for a diode provided by the present invention has the following technical effects:

[0097] By collecting the diode distribution, glue application position, and glue application area in the device, a distribution map is constructed, where the distribution map has position identifiers and area identifiers; size recognition is performed based on the area identifiers in the distribution map, and area clustering is performed according to the area size to obtain an area clustering distribution map; the overlapping area region of the area clustering distribution map is obtained, and relevance conversion is performed according to the overlapping area region to generate a correlation coefficient; according to the number of distribution position identifiers in the area clustering distribution map, the total proportion is calculated to obtain the area clustering proportion value; according to the area clustering proportion value, an initial region is determined, and the initial region is the area clustering distribution with the largest area clustering proportion value. The associated area clustering distribution map corresponding to the initial region and its corresponding correlation coefficient are extracted, and path configuration is performed to obtain a glue application control path; the glue control parameters, including the glue outlet pressure, glue outlet volume, and glue outlet control path, are determined according to the area clustering size of the glue application control path, and the mapping relationship between the glue application control path and the glue control parameters is established, and a control instruction is generated for glue application control. Furthermore, the technical effects of simplifying the glue application plan and improving the glue application efficiency are achieved.

[0098] Example 2

[0099] Figure 2 It is a schematic structural diagram of a rapid glue coating system for a diode of the present invention. For example, Figure 1 In the present invention, the flowchart of a rapid glue coating method for a diode can be implemented by a structure as shown in Figure 2 the figure.

[0100] Based on the same concept as the rapid glue coating method for a diode in the above embodiment, the present invention also provides a rapid glue coating system for a diode, including:

[0101] A distribution mapping module 11, configured to collect the distribution of diodes, the glue coating positions, and the glue coating areas in the device, and construct a distribution map, where the distribution map has position identifiers and area identifiers;

[0102] An area clustering module 12, configured to perform size recognition based on the area identifiers in the distribution map, and perform area clustering according to the area sizes to obtain an area clustering distribution map;

[0103] An association analysis module 13, configured to obtain the overlapping area region of the area clustering distribution map, perform relevance conversion according to the overlapping area region, and generate an association coefficient;

[0104] A ratio calculation module 14, configured to calculate the total occupancy ratio according to the number of distribution position identifiers in the area clustering distribution map to obtain an area clustering occupancy ratio;

[0105] A path configuration module 15, configured to determine an initial region according to the area clustering occupancy ratio, where the initial region is the area clustering distribution with the largest area clustering occupancy ratio, extract the associated area clustering distribution map of the initial region and its corresponding association coefficient, and perform path configuration to obtain a glue coating control path;

[0106] A glue coating control module 16, configured to determine glue control parameters according to the area clustering size of the glue coating control path, including glue outlet pressure, glue outlet volume, and glue outlet control path, establish a mapping relationship between the glue coating control path and the glue control parameters, and generate a control instruction for glue coating control.

[0107] Among them, the distribution mapping module 11 includes:

[0108] A task decomposition unit, configured to obtain the design drawing of the device, decompose the diode glue coating task, and determine the diode distribution;

[0109] A diode glue coating positioning unit, configured to analyze the area of the glue coating part according to the structure and function requirements of the diode, and position the diode glue coating position;

[0110] The base positioning unit is used to position the glue - applying position and area of the base according to the design drawing of the base, and the glue - applying position and area of the base are the position and area in contact with the diode;

[0111] The glue - applying position unit is used to obtain the glue - applying position according to the glue - applying position of the diode and the glue - applying position of the base;

[0112] The area constraint unit is used to constrain the area of the glue - applying part of the diode according to the glue - applying area of the base to obtain the glue - applying area.

[0113] Further, the area clustering module 12 includes:

[0114] The spacing distance limiting unit is used to set the limiting spacing distance based on the size of the glue - applying device;

[0115] The abnormal recognition unit is used to traverse the distribution points in the distribution map using the limiting spacing distance to obtain the abnormal spacing area, including: configuring recognition features according to the limiting spacing distance, segmenting the distribution map using a convolutional kernel model in a preset segmentation manner, and traversing the feature of the segmented area using the recognition features;

[0116] The combination unit is used to perform clustering and screening according to the abnormal spacing area, configure the area of the abnormal spacing area, and perform combined area identification on the abnormal spacing area according to the configured area;

[0117] The area clustering unit is used to add the combined area identification to the area identification for area clustering.

[0118] In some implementation manners, the combination unit in the area clustering module 12 includes:

[0119] The sequential continuity unit is used to obtain the glue - applying area of the abnormal spacing area. When the glue - applying areas of the abnormal spacing areas are the same, configure the original area identification and set the combined glue - applying trajectory, and the combined glue - applying trajectory is a sequential continuity trajectory;

[0120] The center diffusion unit is used to configure with the area identification of the diode in the middle when the glue - applying areas of the abnormal spacing areas are different, and set the combined glue - applying trajectory as a trajectory that diffuses outward from the center.

[0121] Further, the ratio calculation module 14 includes:

[0122] The total number obtaining unit is used to obtain the total number of standard identifications according to the number of distribution position identifications in the distribution map;

[0123] The annotation identification ratio unit is used to calculate the number of identifications and the number of abnormal interval regions for the area clustering distribution diagram, and obtain the annotation identification ratio by the ratio of the number of identifications to the total number of standard identifications;

[0124] The area clustering ratio unit is used to generate the area clustering ratio value by taking the annotation identification ratio as the standard value and the number of abnormal interval regions as the adjustment amount.

[0125] Further, the path configuration module 15 includes:

[0126] The path configuration unit is used to perform path configuration starting from the initial area according to the correlation coefficient, and set the associated area clustering distribution with the highest correlation coefficient as the subsequent node;

[0127] The optimization subspace construction unit is used to construct an optimization subspace with the shortest path as the target value according to the position identification distribution of each area clustering distribution diagram;

[0128] The space connection unit is used to connect each optimization subspace according to the node relationship of the path configuration to construct a full-path optimization model;

[0129] The path optimization unit is used to take the combined glue application trajectory as a constraint condition and add it to the full-path optimization model for iterative optimization. When the preset number of iterations is reached or the path optimization target value is reached, the glue application control path is output through the full-path optimization model.

[0130] Further, the system further includes a temperature control unit for:

[0131] Obtaining device monitoring information through a carrier monitoring device to determine the position of the subsequent device;

[0132] Obtaining the glue application process based on the control instruction, and determining the instruction interval deviation according to the position of the subsequent device and the glue application process. The instruction interval deviation is the time difference between the subsequent device reaching the glue application control position and the completion of the current control instruction;

[0133] Performing adaptive adjustment of the glue control parameters according to the instruction interval deviation, including: temperature control. The magnitude of the temperature control corresponds to the temperature loss value and the power. When the heating time of the power is less than half of the instruction interval deviation, heating is stopped; otherwise, the power is analyzed and controlled by a temperature control processing model according to the instruction interval deviation.

[0134] It should be understood that the embodiments mentioned in this specification focus on their differences from other embodiments. The specific embodiments in the first-mentioned embodiment one are equally applicable to the fast glue application system of a diode described in the second embodiment. For the sake of simplicity of the specification, no further elaboration is made here.

[0135] It should be understood that the disclosed embodiments of the present invention and the above descriptions enable those skilled in the art to implement the present invention using the present invention. At the same time, the present invention is not limited to the part of the embodiments mentioned above. It should be understood that those of ordinary skill in the art can still modify the technical solutions recorded in the foregoing embodiments or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A rapid glue coating method for a diode, characterized in that, The method includes: Collect the diode distribution, glue application position, and glue application area in the device, and construct a distribution map, where the distribution map has position identifiers and area identifiers; Based on the area identifiers in the distribution map, perform size recognition and perform area clustering according to the area size to obtain an area clustering distribution map; Obtain the overlapping area region of the area clustering distribution map, perform relevance transformation according to the overlapping area region, and generate a correlation coefficient; Calculate the total occupancy ratio according to the number of distribution position identifiers in the area clustering distribution map to obtain the area clustering occupancy ratio; According to the area clustering occupancy ratio, determine the initial region, where the initial region is the area clustering distribution with the largest area clustering occupancy ratio, extract the associated area clustering distribution map of the initial region and its corresponding correlation coefficient, perform path configuration, and obtain the glue application control path; Determine the glue control parameters according to the area clustering size of the glue application control path, including glue output pressure, glue output volume, and glue application control path, establish the mapping relationship between the glue application control path and the glue control parameters, and generate a control instruction for glue application control; The process of collecting the diode distribution, glue application position, and glue application area in the device and constructing a distribution map, where the distribution map has position identifiers and area identifiers, includes: Obtain the design drawing of the device, decompose the diode glue application task, and determine the diode distribution; According to the structure and function requirements of the diode, analyze the area of the glue application part and locate the diode glue application position; According to the design drawing of the base, locate the glue application position and glue application area of the base, where the glue application position and glue application area of the base are the positions and areas in contact with the diode; Obtain the glue application position according to the diode glue application position and the glue application position of the base; Constrain the glue application area of the diode according to the glue application area of the base to obtain the glue application area; Based on the area identifiers in the distribution map, perform size recognition and perform area clustering according to the area size to obtain an area clustering distribution map, including: Set a limit interval distance based on the size of the glue application equipment; Use the limit interval distance to traverse the distribution points in the distribution map at intervals to obtain an abnormal interval area, including: configure recognition features according to the limit interval distance, use a convolution kernel model to segment the distribution map according to a preset segmentation method, and use the recognition features to traverse the segmentation area features; Perform clustering screening according to the abnormal interval area, perform area configuration on the abnormal interval area, and perform combined area identification on the abnormal interval area according to the configured area; Add the combined area identifier to the area identifier for area clustering.

2. The method according to claim 1, characterized in that, The process of performing area configuration on the abnormal interval area includes: Obtain the glue application area of the abnormal interval area. When the glue application areas of the abnormal interval areas are the same, configure the original area identifier and set a combined glue application trajectory, where the combined glue application trajectory is a sequentially continuous trajectory; When the glue application areas of the abnormal interval areas are different, configure with the diode area identifier in the middle and set the combined glue application trajectory as a trajectory spreading outward from the center.

3. The method according to claim 2, characterized in that Calculate the total proportion based on the number of distribution position identifiers in the area clustering distribution map to obtain the area clustering proportion value, including: Obtain the total number of standard identifiers based on the number of distribution position identifiers in the distribution map; Calculate the number of identifiers and the number of abnormal interval regions in the area clustering distribution map, and obtain the proportion of labeled identifiers by the ratio of the number of identifiers to the total number of standard identifiers; Use the proportion of labeled identifiers as the standard value and the number of abnormal interval regions as the adjustment amount to generate the area clustering proportion value.

4. The method according to claim 2, wherein Extract the associated area clustering distribution map of the initial region and its corresponding correlation coefficient, and perform path configuration to obtain the glue application control path, including: Based on the correlation coefficient, perform path configuration starting from the initial region, and set the associated area clustering distribution with the highest correlation coefficient as the subsequent node; Construct an optimization subspace with the shortest path as the target value according to the position identifier distribution of each area clustering distribution map; Connect each optimization subspace according to the node relationship of the path configuration to construct a full-path optimization model; Use the combined glue application trajectory as a constraint condition and add it to the full-path optimization model for iterative optimization. When the preset number of iterations is reached or the path optimization target value is reached, output the glue application control path through the full-path optimization model.

5. The method according to claim 1, characterized in that, The method further includes: Obtain device monitoring information through a carrier monitoring device to determine the position of the subsequent device; Obtain the glue application process based on the control instruction, and determine the instruction interval deviation according to the position of the subsequent device and the glue application process. The instruction interval deviation is the time difference between the subsequent device reaching the glue application control position and the completion of the current control instruction; Perform adaptive adjustment of the glue control parameters according to the instruction interval deviation, including: temperature control. The magnitude of the temperature control corresponds to the temperature loss value and the power. When the heating time of the power is less than half of the instruction interval deviation, stop heating; otherwise, perform curve analysis control on the power according to the instruction interval deviation through a temperature control processing model.

6. A rapid glue coating system for a diode, characterized in that The system is used to implement the method described in any one of claims 1 to 5. The system includes: A distribution mapping module for collecting the diode distribution, glue application position, and glue application area in the device to construct a distribution map, where the distribution map has position identifiers and area identifiers; An area clustering module for identifying the size based on the area identifiers in the distribution map and performing area clustering according to the area size to obtain an area clustering distribution map; An association analysis module for obtaining the overlapping area region of the area clustering distribution map, and generating a correlation coefficient through correlation transformation according to the overlapping area region; A proportion calculation module for calculating the total proportion based on the number of distribution position identifiers in the area clustering distribution map to obtain the area clustering proportion value; Path configuration module, which is used to determine the initial area according to the area clustering occupancy ratio. The initial area is the area clustering distribution with the largest area clustering occupancy ratio. Extract the associated area clustering distribution map of the initial area and its corresponding correlation coefficient, perform path configuration, and obtain the glue application control path; Glue application control module, which is used to determine the glue control parameters according to the area clustering size of the glue application control path, including the glue output pressure, the glue output volume, and the glue application control path, establish the mapping relationship between the glue application control path and the glue control parameters, and generate control instructions for glue application control.

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