Positioning salient point forming device and method for IGBT module substrate soldering lug and application of positioning salient point forming device and method

Abstract

The invention discloses a positioning salient point forming device and method for an IGBT module substrate soldering lug and application. The positioning salient point forming device comprises a supporting main frame (1), and a soldering lug containing frame (2), a pressing assembly (3) and a circulation conveying belt (4) are sequentially arranged on the supporting main frame (1); a bottom frame (5) is arranged at the lower end of one side of the soldering lug containing frame (2), and a soldering lug transferring assembly (6) is arranged on the bottom frame (5). A lower die (7) is arranged at the bottom of the pressing assembly (3), a positioning pin (8) is arranged in the lower die (7), and an upper die (9) corresponding to the lower die (7) is arranged at the pressing movable end of the pressing assembly (3). The soldering lug is positioned on the die through flexible limiting pushing, deformation of the soldering lug is avoided, the positioning stability is kept, and the forming quality of convex points on the soldering lug is improved.

Description

Technical Field

[0001] The invention relates to the field of substrate processing equipment, in particular to a positioning convex point forming device, method and application of an IGBT module substrate welding piece. Background Art

[0002] In the manufacturing process of IGBT modules, it is necessary to weld the welding piece to the substrate. In order to ensure that the welding piece can be accurately covered on the substrate, it is necessary to press out a convex point on the welding piece to match the positioning point on the substrate. The formation of the convex point on the existing welding piece mainly relies on stamping equipment. For example, the Chinese invention patent with publication number CN101930752B discloses a base with a concave surface, a heating unit and a forming pin with a spherical surface. The base is arranged below the workpiece. The heating unit heats the predetermined position of the workpiece to improve the ductility of the predetermined position of the workpiece. The forming pin is arranged above the workpiece and the spherical surface of the forming pin is aligned with the predetermined position of the workpiece heated by the heating unit. The heating unit includes a beam with heating performance, and the heating unit heats the predetermined position of the workpiece by sending the beam. The base also includes a through hole adjacent to the concave surface. The main processing process is to place the metal sheet on the stamping die and press convex points on the metal sheet through hydraulic impact. The existing equipment uses a cylinder clamping mechanism or a robotic arm to place the metal sheet in the die, but this clamping and positioning method is relatively rigid, and the welding sheet body is relatively thin. The rigid clamping and positioning method can easily cause the welding sheet to deform, affecting product quality. Summary of the invention

[0003] The purpose of the present invention is to provide a device and method for forming positioning bumps of an IGBT module substrate welding piece. The present invention positions the welding piece on the mold through flexible limit pushing, avoids deformation of the welding piece, maintains positioning stability, and improves the forming quality of the bumps on the welding piece.

[0004] The technical solution of the present invention is as follows: a positioning bump forming device for the welding piece of an IGBT module substrate comprises a supporting main frame, on which a welding piece placing frame, a pressing assembly and a flow conveyor belt are sequentially arranged; the welding piece placing frame has a bottom frame at the lower end of one side, on which a welding piece transfer assembly is arranged; a lower mold is provided at the bottom of the pressing assembly, a positioning pin is provided in the lower mold, and an upper mold corresponding to the lower mold is provided at the pressing movable end of the pressing assembly; a guide feed wheel with an attached motor is symmetrically provided at the bottom of the pressing assembly and close to one end of the welding piece transfer assembly; a positioning thrust assembly is provided at the side of the pressing assembly, and a right-angle plate corresponding to the right-angle end of the lower mold is provided at the movable end of the positioning thrust assembly, and the right-angle plates on both sides are diagonally arranged; two groups of positioning motors are fixed on the inner side surface of the right-angle plate, and an elastic locator in contact with the welding piece is provided at the protruding end of the positioning motor.

[0005] In the above-mentioned positioning bump forming device for the soldering piece of the IGBT module substrate, the soldering piece placement frame includes a vertical plate symmetrically arranged on the supporting main frame, and a plurality of slots for placing the soldering pieces are arranged on the inner side of the vertical plate.

[0006] In the aforementioned IGBT module substrate welding piece positioning bump forming device, the welding piece transfer assembly includes a straight plate seat arranged on a base frame, a lifting moving part is provided on the inner side surface of the straight plate seat, a transverse moving part is provided on the movable end of the lifting moving part, a welding piece picking rack is provided on the movable end of the transverse moving part, a suction cup is provided on the upper end of the welding piece picking rack, and the welding piece picking rack moves between the welding piece placing rack and the guide feeding wheel.

[0007] In the aforementioned positioning bump forming device for the soldering piece of the IGBT module substrate, the wheel body of the guide feed wheel is provided with an annular groove, and a moving groove for moving the soldering piece is formed between the annular grooves on both sides.

[0008] In the aforementioned positioning bump forming device for the welding piece of the IGBT module substrate, the positioning thrust assembly includes a seat plate arranged on the side of the pressing assembly, and a thrust cylinder and a support block are provided on the seat plate. The protruding end of the thrust cylinder is provided with a straight rod embedded in the support block, and the right-angle plate is arranged at the end of the straight rod.

[0009] In the aforementioned positioning bump forming device for the welding piece of the IGBT module substrate, the elastic positioner includes a fixed sleeve arranged at the protruding end of the positioning motor, a spring is provided on the inner side of the tail end of the fixed sleeve, and a movable cylinder for pushing the welding piece into position is connected to the lower end of the fixed sleeve via the spring.

[0010] In the aforementioned positioning bump forming device for the soldering piece of the IGBT module substrate, the positioning pin is arranged in the lower mold in the form of insertion.

[0011] The method for forming positioning bumps based on the solder piece of the IGBT module substrate has the following specific steps:

[0012] Step 1: First, the welding pieces are stacked in the welding piece placement rack. The welding piece transfer assembly takes the welding pieces out of the placement rack. Then, the welding pieces are horizontally conveyed to the lower mold by the guide feed wheel. At the same time, the positioning thrust assembly on one side drives the elastic positioner to extend to block the welding pieces to prevent them from sliding outward.

[0013] Step 2, the elastic locator on the other side is close to the welding piece, at this time, the positioning thrust assemblies on both sides move simultaneously, the positioning motor drives the elastic locator to rotate, the two elastic locators on the right-angle plate on one side turn in opposite directions, and the right-angle plates on both sides are set diagonally relative to the welding piece on the lower mold;

[0014] Step 3: The welding piece is aligned with the lower die through the guidance of the elastic locator, and then the pressing assembly drives the lower die to move. The positioning pin on the lower die supports the welding piece, and a convex point is formed on the welding piece. After the convex point is formed, it is placed on the flow conveyor belt and flows out.

[0015] Based on the application of positioning bumps formed on the IGBT module substrate welding piece, the bumps are used to support direct bonding of the copper ceramic substrate to prevent single-side height difference, so that the overall solder thickness of the IGBT module substrate welding piece is close to avoid affecting the heat dissipation performance of the product.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. In the present invention, the welding pieces are stacked on the welding piece placement rack, and the welding piece transfer assembly takes the welding pieces out of the placement rack, and then driven by the guide feed wheel, the welding pieces are horizontally conveyed to the lower mold, and at the same time, the positioning thrust assembly on one side drives the elastic positioner to extend to block the welding piece to prevent the welding piece from sliding outward, and then the elastic positioner on the other side approaches the welding piece. At this time, the positioning thrust assemblies on both sides move at the same time, and the positioning motor drives the elastic positioner to rotate. The two elastic positioners on the single-side right-angle plate turn in opposite directions, and the right-angle plates on both sides are diagonally arranged relative to the welding piece on the lower mold. Through the guiding push of the elastic positioner, the welding piece is aligned and straightened with the lower mold, and then the pressing assembly drives the lower mold to move, and the positioning pin on the lower mold supports the welding piece, forming a convex point on the welding piece, and after the convex point is formed, it is placed on the flow conveyor belt to flow out; through the push of the elastic positioner, a flexible positioning method is realized, the welding piece is prevented from being deformed, the positioning stability is maintained, and the forming quality of the convex point on the welding piece is improved.

[0018] 2. The welding piece transfer rack sends the welding piece to the ring groove of the guide feed wheel, and the guide feed wheels on both sides send the welding piece to the lower mold, keeping the welding piece stably placed to facilitate convex point pressing.

[0019] 3. Through the combination of moving parts in two directions and suction cups, the welding pieces can be transported stably. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of the present invention;

[0021] Figure 2 A schematic diagram of a solder sheet transfer assembly;

[0022] Figure 3 is a schematic diagram of a positioning pin;

[0023] Figure 4 is a schematic diagram of positioning thrust assembly;

[0024] Figure 5 Place the first state diagram for the solder tab;

[0025] Figure 6 Place a second state diagram for the solder tab;

[0026] Figure 7 is a schematic diagram of a mobile tank;

[0027] Figure 8 is a schematic diagram of an elastic locator;

[0028] Fig. 9 A schematic diagram of a spring.

[0029] Explanation of the marks in the accompanying drawings: 1-support main frame, 2-welding sheet placement rack, 3-pressing assembly, 4-flow conveyor belt, 5-base frame, 6-welding sheet transfer assembly, 7-lower mold, 8-positioning pin, 9-upper mold, 10-guide feed wheel, 11-positioning thrust assembly, 12-right angle plate, 13-positioning motor, 14-elastic positioner, 15-vertical plate, 16-card slot, 17-ring slot, 18-moving slot, 61-straight plate seat, 62-lifting moving part, 63-lateral moving part, 64-welding sheet picking rack, 65-suction cup, 111-seat plate, 112-thrust cylinder, 113-support block, 114-straight rod, 141-fixed sleeve, 142-spring, 143-movable cylinder. DETAILED DESCRIPTION

[0030] The present invention will be further described below in conjunction with the accompanying drawings and embodiments, but they are not intended to limit the present invention.

[0031] Embodiment: A device for forming positioning bumps of an IGBT module substrate solder piece, comprising a supporting main frame 1, as shown in the attached Figure 1 As shown, a welding piece placement rack 2, a pressing assembly 3 and a flow conveyor belt 4 are sequentially installed on the supporting main frame 1; the welding piece placement rack 2 includes a vertical plate 15 symmetrically arranged on the supporting main frame 1, and the inner side of the vertical plate 15 has a plurality of slots 16 for placing welding pieces, and the welding piece rack is between the two vertical plates. The lower end of one side of the welding piece placement rack 2 has a bottom frame 5, and the bottom frame 5 is installed with a welding piece transfer assembly 6; the bottom of the pressing assembly 3 is installed with a lower mold 7, and a positioning pin 8 is installed in the lower mold 7, as shown in the attached Figure 3 As shown, the positioning pin 8 is inserted into the lower die 7. The formation of the convex point on the welding piece is mainly to place the welding piece on the lower die and press it downward through the upper die. The movement of the upper die is mainly driven by the cylinder. The pressing movable end of the pressing assembly 3 is provided with an upper die 9 corresponding to the lower die 7; the bottom of the pressing assembly 3 and one end close to the welding piece transfer assembly 6 are symmetrically installed with a guide feed wheel 10 with a motor. The wheel body of the guide feed wheel 10 has an annular groove 17, and a moving groove 18 for moving the welding piece is formed between the annular grooves 17 on both sides. As shown in the attached Figure 7As shown, the welding piece transfer rack delivers the welding piece to the annular groove of the guide feed wheel, and the guide feed wheels on both sides deliver the welding piece to the lower mold, so as to keep the welding piece stably placed and facilitate the pressing of the convex point; the side of the pressing assembly 3 is installed with a positioning thrust assembly 11, and the movable end of the positioning thrust assembly 11 is installed with a right-angle plate 12 corresponding to the right-angle end of the lower mold 7, and the right-angle plates 12 on both sides are arranged diagonally relative to the lower mold 7; two groups of positioning motors 13 are fixed on the inner side surface of the right-angle plate 12, and the protruding end of the positioning motor 13 is provided with an elastic positioner 14 in contact with the welding piece, and the elastic positioner 14 includes a fixed sleeve 141 arranged at the protruding end of the positioning motor 13, and the inner side of the tail end of the fixed sleeve 141 is provided with a spring 142, as shown in the attached Figure 8 and 9 As shown, the lower end of the fixed sleeve 141 is connected to a movable cylinder 143 for pushing the welding piece into position via a spring. The positioning motor drives the fixed sleeve and the movable cylinder to rotate, and the movable cylinder will contact the welding piece. Due to the presence of the spring, the push of the movable cylinder is a relatively flexible pushing method. The positioning thrust assembly mainly controls the push and advance of the elastic locator. The positioning motor controls the rotation of the elastic locator. The elastic locators on the single-sided right-angle plate rotate in different directions. The right angle of the welding piece is used as the center line, and the elastic locators on both sides rotate toward the center line, thereby guiding the right-angle end of the welding piece. While the elastic locator rotates, the right-angle plate moves toward the welding piece, thereby realizing the positioning of the welding piece. As shown in the attached figure Figure 3 and 4 As shown, there are mainly two states when the welding piece is placed on the lower mold.

[0032] The welding sheet transfer assembly 6 includes a straight plate seat 61 arranged on the bottom frame 5, as shown in the attached Figure 2 As shown, a lifting and moving part 62 is installed on the inner side surface of the straight plate seat 61, and a transverse moving part 63 is installed on the movable end of the lifting and moving part 62. A welding piece picking rack 64 is provided on the movable end of the transverse moving part 63, and a suction cup 65 is installed on the upper end of the welding piece picking rack 64. The welding piece picking rack 64 moves between the welding piece placement rack 2 and the guide feed wheel 10. The lifting and moving part moves the suction cup to the bottom of the welding piece placement rack and adsorbs the welding piece, and the transverse moving part moves the welding piece out. Then the lifting and moving part drives the welding piece to descend, and the welding piece is sent to the guide feed wheel. The structure is simple and the feeding and transportation are convenient.

[0033] The positioning thrust assembly 11 includes a seat plate 111 arranged on the side of the pressing assembly 3, and a thrust cylinder 112 and a support block 113 are installed on the seat plate 111. The protruding end of the thrust cylinder 112 is provided with a straight rod 114 embedded in the support block 113. The right-angle plate 12 is arranged at the end of the straight rod 114. The thrust cylinder drives the straight rod to move and controls the forward and backward movement of the right-angle plate. The support block can support the straight rod.

[0034] The positioning bumps in this embodiment are used to support the direct bonding of the copper ceramic substrate to prevent one-side height difference, so that the overall solder thickness of the IGBT module substrate welding piece is close to avoid affecting the heat dissipation performance of the product.

[0035] The working principle of the present invention is as follows: the welding pieces are stacked in the welding piece placement rack, the welding piece transfer assembly takes the welding pieces out of the placement rack, and then driven by the guide feed wheel, the welding pieces are horizontally conveyed to the lower mold, and at the same time, the positioning thrust assembly on one side drives the elastic positioner to extend to block the welding piece to prevent the welding piece from sliding outward, and then the elastic positioner on the other side approaches the welding piece, at this time, the positioning thrust assemblies on both sides move at the same time, and the positioning motor drives the elastic positioner to rotate, the two elastic positioners on the single-side right-angle plate turn in opposite directions, and the right-angle plates on both sides are diagonally arranged relative to the welding piece on the lower mold, and the welding piece is aligned and straightened with the lower mold through the guiding push of the elastic positioner, and then the pressing assembly drives the lower mold to move, and the positioning pin on the lower mold supports the welding piece, and a convex point is formed on the welding piece (the convex point can have many shapes, such as a circular ring, a circular ring + a circular convex point, a square, a rectangle or other shapes), and after the convex point is formed, it is placed on the flow conveyor belt to flow outward; through the push of the elastic positioner, a flexible positioning method is realized, the welding piece is prevented from being deformed, the positioning stability is maintained, and the forming quality of the convex point on the welding piece is improved.

Claims

1. A device for forming positioning bumps of an IGBT module substrate solder piece, comprising a supporting main frame (1), on which a solder piece placement frame (2), a pressing assembly (3) and a flow conveyor belt (4) are sequentially arranged; the device is characterized in that: The lower end of one side of the welding piece placement rack (2) has a base frame (5), and the base frame (5) is provided with a welding piece transfer assembly (6); the bottom of the pressing assembly (3) is provided with a lower mold (7), and the lower mold (7) is provided with a positioning pin (8), and the pressing movable end of the pressing assembly (3) is provided with an upper mold (9) corresponding to the lower mold (7); the bottom of the pressing assembly (3) and one end close to the welding piece transfer assembly (6) are symmetrically provided with a guide feed wheel (10) with a motor; the side of the pressing assembly (3) is provided with a positioning thrust assembly (11), and the movable end of the positioning thrust assembly (11) is provided with a right angle plate (12) corresponding to the right angle end of the lower mold (7), and the right angle plates (12) on both sides are arranged diagonally relative to the lower mold (7); two groups of positioning motors (13) are fixed on the inner side surface of the right angle plate (12), and the protruding end of the positioning motor (13) is provided with an elastic positioner (14) in contact with the welding piece.

2. The positioning bump forming device for the IGBT module substrate solder piece according to claim 1, characterized in that: The welding sheet placement rack (2) comprises a vertical plate (15) symmetrically arranged on the supporting main frame (1), and a plurality of slots (16) for placing welding sheets are arranged on the inner side of the vertical plate (15).

3. The positioning bump forming device for the IGBT module substrate solder piece according to claim 1, characterized in that: The welding sheet transfer assembly (6) comprises a straight plate seat (61) arranged on a base frame (5); a lifting moving member (62) is provided on the inner side surface of the straight plate seat (61); a transverse moving member (63) is provided on the movable end of the lifting moving member (62); a welding sheet material taking rack (64) is provided on the movable end of the transverse moving member (63); a suction cup (65) is provided at the upper end of the welding sheet material taking rack (64); and the welding sheet material taking rack (64) moves between the welding sheet placement rack (2) and the guide feeding wheel (10).

4. The positioning bump forming device for the IGBT module substrate solder piece according to claim 1, characterized in that: The wheel body of the guide feed wheel (10) is provided with an annular groove (17), and a moving groove (18) for moving the welding sheet is formed between the annular grooves (17) on both sides.

5. The positioning bump forming device for the IGBT module substrate solder piece according to claim 1, characterized in that: The positioning thrust assembly (11) comprises a seat plate (111) arranged on the side of the pressing assembly (3), the seat plate (111) being provided with a thrust cylinder (112) and a support block (113), the protruding end of the thrust cylinder (112) being provided with a straight rod (114) embedded in the support block (113), and the right-angle plate (12) being arranged at the end of the straight rod (114).

6. The positioning bump forming device for the IGBT module substrate solder piece according to claim 1, characterized in that: The elastic positioner (14) comprises a fixed sleeve (141) arranged at the protruding end of the positioning motor (13), a spring (142) is provided inside the tail end of the fixed sleeve (141), and a movable cylinder (143) for pushing the welding piece to position is connected to the lower end of the fixed sleeve (141) via the spring.

7. The positioning bump forming device for the IGBT module substrate solder piece according to claim 1, characterized in that: The positioning pin (8) is arranged in the lower mold (7) in an inserted manner.

8. The method for forming a positioning bump forming device for an IGBT module substrate solder piece according to any one of claims 1 to 7, characterized in that: The specific steps are as follows: Step 1: First, the welding pieces are stacked in the welding piece placement rack. The welding piece transfer assembly takes the welding pieces out of the placement rack. Then, the welding pieces are horizontally conveyed to the lower mold by the guide feed wheel. At the same time, the positioning thrust assembly on one side drives the elastic positioner to extend to block the welding pieces to prevent them from sliding outward. Step 2, the elastic locator on the other side is close to the welding piece, at this time, the positioning thrust assemblies on both sides move simultaneously, the positioning motor drives the elastic locator to rotate, the two elastic locators on the right-angle plate on one side turn in opposite directions, and the right-angle plates on both sides are set diagonally relative to the welding piece on the lower mold; Step 3: The welding piece is aligned with the lower die through the guidance of the elastic locator, and then the pressing assembly drives the lower die to move. The positioning pin on the lower die supports the welding piece, and a convex point is formed on the welding piece. After the convex point is formed, it is placed on the flow conveyor belt and flows out.

9. An application of positioning bumps of an IGBT module substrate solder piece, characterized in that: The positioning bumps are used to support direct bonding of the copper ceramic substrate to prevent one-side height differences, so that the overall solder thickness of the IGBT module substrate welding piece is close to avoid affecting the heat dissipation performance of the product.

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