Circuit board chip heat dissipation device
Through the combined structure of the bracket, heat dissipation part and elastic parts, the problem of interface separation caused by unreasonable gaps caused by rigid connections in the circuit board chip heat dissipation device is solved, and a more reliable and efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202310727793.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-06-19
- Publication Date
- 2024-12-20
AI Technical Summary
The existing circuit board chip heat dissipation devices have unreasonable gaps caused by rigid connections and vibrations that cause thermal grease to separate from the chip interface, reducing the heat dissipation effect.
Adopt a combined structure of bracket, heat sink and elastic parts. The elastic parts provide elastic compression effect through the stop-resisting frame and contact plate, and adaptively telescopic to keep the heat sink and the chip tightly, avoid interface separation, and ensure heat dissipation reliability and effect. .
It effectively avoids chip damage and reduced heat dissipation effect, improves the reliability and efficiency of the heat dissipation device, and adapts to different chip thicknesses and vibration environments.
Smart Images
Figure CN119170578A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of circuit board heat dissipation equipment, and in particular to a circuit board chip heat dissipation device. Background Art
[0002] Semiconductor chips will basically generate a lot of heat when working, so a heat sink is needed to dissipate the heat. The conventional chip cooling solution is to apply a layer of thermal grease on the chip and then install the heat sink. The thermal grease transfers the heat on the chip surface to the bottom of the heat sink, and then the heat pipe or water cooling pipe transfers the heat to the fins. Finally, the fan blows away the heat on the fins or the radiator.
[0003] However, in the related art, the circuit board and the housing are rigidly connected by fasteners such as screws. The rigid connection may cause the chip to be crushed during the assembly process due to unreasonable gap reservation, or cause the thermal grease to separate from the interface between the chip and the heat dissipation boss during actual use and vibration, forming a tiny air gap, further reducing the heat dissipation effect. Summary of the invention
[0004] The present invention aims to solve one of the technical problems in the related art at least to a certain extent.
[0005] To this end, an embodiment of the present invention proposes a circuit board chip heat dissipation device, which includes a bracket, a heat sink and an elastic member. The bracket includes a leg connected to the circuit board and a frame connected to the other end of the leg. The contact plate of the heat sink is located on the side of the frame facing the leg. One end of the elastic member stops at the frame, and the other end stops at the contact plate. Thus, the elastic member can press the contact plate toward the circuit board. Since the elastic member has an elastic pressing effect, when there is an unreasonable reserved gap in the rigid connection between the circuit board and the shell, the elastic member can adaptively expand and contract, so that the contact plate of the heat sink is always in close contact with the chip, avoiding crushing of the chip or separation of the chip from the heat dissipation protrusion interface, thereby ensuring heat dissipation reliability and improving heat dissipation effect.
[0006] The circuit board chip heat dissipation device of an embodiment of the present invention includes: a bracket, the bracket includes a frame and a leg, one end of the leg is connected to the circuit board and the leg extends in a direction away from the circuit board, and the frame is connected to the other end of the leg; a heat sink and an elastic member, the heat sink includes a contact plate, the contact plate is located on a side of the frame toward the leg, one end of the elastic member abuts against the contact plate, and the other end abuts against the frame, and the elastic member has a force that pushes the circuit board to move in a direction away from the frame.
[0007] In the circuit board chip heat dissipation device of the embodiment of the present invention, the bracket includes a leg connected to the circuit board and a frame connected to the other end of the leg, the contact plate of the heat sink is located on the side of the frame facing the leg, one end of the elastic member abuts the frame, and the other end abuts the contact plate, so that the elastic member can press the contact plate toward the circuit board, and because the elastic member has an elastic pressing effect, when there is an unreasonable reserved gap in the rigid connection between the circuit board and the shell, the elastic member can adaptively expand and contract, so that the contact plate of the heat sink is always in close contact with the chip, avoiding crushing of the chip or separation of the chip from the heat dissipation protrusion interface, ensuring the heat dissipation reliability, and improving the heat dissipation effect.
[0008] In some embodiments, the frame includes a main body having a guide tube protruding in a direction away from the leg, the guide tube having a guide cavity open toward the contact plate, a portion of the elastic member is engaged in the guide cavity and one end of the elastic member stops at the top of the guide cavity and the other end stops at the contact plate.
[0009] In some implementations, the leg is disposed adjacent to the guide tube.
[0010] In some implementations, the heat sink further includes a guide post connected to the contact plate and extending toward the frame, a portion of the guide post fits within the guide cavity and the elastic member is sleeved on the guide post.
[0011] In some implementations, the guide tube and the guide column are both multiple and arranged at intervals along the circumference of the body, and the multiple guide tubes and the multiple guide columns correspond one to one; and / or the support legs are multiple and the multiple support legs are arranged at intervals along the circumference of the frame.
[0012] In some implementations, the guide column is a conical column that gradually contracts in a direction away from the contact plate, the guide cavity is a conical cavity that gradually contracts in a direction away from the contact plate, and the elastic member is a conical spring that gradually contracts in a direction away from the contact plate.
[0013] In some implementations, the legs, the body, and the guide tube are integrally formed.
[0014] In some implementations, the end of the leg facing away from the frame has a plug-in piece, and the plug-in piece is used for plugging and mating with a circuit board.
[0015] In some implementations, the plug-in piece includes a limiting portion and a plug-in portion, the plug-in portion is suitable for cooperating with the plug-in hole, the limiting portion is closer to the frame relative to the plug-in portion, and the cross-sectional area of the limiting portion is larger than that of the plug-in portion.
[0016] In some implementations, the heat sink further includes a heat dissipation fin, the heat dissipation fin is disposed on a side of the contact plate facing the frame, and the frame has a central hole to avoid the heat dissipation fin. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of assembling a circuit board chip heat dissipation device and a circuit board according to an embodiment of the present invention;
[0018] Figure 2 is an exploded view of a circuit board chip heat dissipation device according to an embodiment of the present invention;
[0019] Figure 3 is a top view of the assembly of the circuit board chip heat dissipation device and the circuit board according to an embodiment of the present invention;
[0020] Figure 4 yes Figure 3 The cross-sectional view along the AA direction;
[0021] Figure 5 is a partial cross-sectional view of a circuit board chip heat dissipation device according to an embodiment of the present invention;
[0022] Figure 6 is a schematic structural diagram of a bracket of a circuit board chip heat dissipation device according to an embodiment of the present invention;
[0023] Figure 7 It is a schematic structural diagram of a heat sink of a circuit board chip heat sink according to an embodiment of the present invention.
[0024] Reference numerals:
[0025] Circuit board chip heat dissipation device 100, bracket 1, frame 11, guide tube 111, support leg 12, plug-in sheet 13, heat sink 2, contact plate 21, guide column 211, heat dissipation fin 22, elastic member 3, chip 4, circuit board 5. DETAILED DESCRIPTION
[0026] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present invention, but should not be understood as limiting the present invention.
[0027] like Figure 1-Figure 7 As shown, the circuit board chip heat dissipation device 100 according to the embodiment of the present invention includes a bracket 1 , a heat dissipation member 2 and an elastic member 3 .
[0028] Specifically, Figure 1-Figure 7As shown, the bracket 1 includes a frame 11 and a leg 12, one end of the leg 12 is connected to the circuit board 5 and the leg 12 extends in a direction away from the circuit board 5, the frame 11 is connected to the other end of the leg 12, the heat sink 2 includes a contact plate 21, the contact plate 21 is located on the side of the frame 11 facing the leg 12, one end of the elastic member 3 stops at the contact plate 21, and the other end stops at the frame 11, and the elastic member 3 has a force to push the circuit board 5 to move in a direction away from the frame 11.
[0029] It can be understood that when a single chip 4 on the circuit board 5 needs to dissipate heat, the heat dissipation device of the present application can be installed at the corresponding position of the circuit board 5. Since the elastic member 3 is stopped between the frame 11 and the contact plate 21, when the heat dissipation device is assembled, the elastic force of the elastic member 3 can automatically press the contact plate 21 onto the corresponding chip 4, thereby realizing heat transfer between the chip 4 and the heat sink 2.
[0030] In addition, since the compression of the elastic part 3 is elastic, when external factors affect the position change of the chip 4, the elastic part 3 can adaptively expand and contract to ensure that the heat sink 2 is always in contact with the chip 4, thereby ensuring the reliability of heat dissipation. Moreover, according to the thickness of the chip 4, the stiffness and compression of the elastic part 3 can be adjusted, which can ensure that the heat sink 2 is tightly pressed against the surface of the chip 4 and reduce the gap size of the thermal grease coating, and can also effectively avoid excessive stress from damaging the chip 4.
[0031] For example, when a gap appears between the chip 4 and the heat sink 2 due to external vibration, the elastic member 3 can adaptively stretch to compensate for the vibration gap, so that the heat sink 2 can maintain close contact with the chip 4 in a vibration environment.
[0032] For another example, when the reserved gap is unreasonable during assembly of the circuit board 5 and the chip 4 is relatively close to the heat sink 2 , the elastic member 3 can retract adaptively to avoid crushing the chip 4 .
[0033] The circuit board chip heat dissipation device 100 of the embodiment of the present invention, the bracket 1 includes a leg 12 connected to the circuit board 5 and a frame 11 connected to the other end of the leg 12, the contact plate 21 of the heat sink 2 is located on the side of the frame 11 facing the leg 12, one end of the elastic member 3 stops at the frame 11, and the other end stops at the contact plate 21, so that the elastic member 3 can press the contact plate 21 toward the circuit board 5, and because the elastic member 3 has an elastic pressing effect, when there is an unreasonable reserved gap in the rigid connection between the circuit board 5 and the shell, the elastic member 3 can adaptively expand and contract, so that the contact plate 21 of the heat sink 2 is always in close contact with the chip 4, avoiding crushing of the chip 4 or separation of the chip 4 from the heat dissipation protrusion interface, ensuring the heat dissipation reliability, and improving the heat dissipation effect.
[0034] Furthermore, if Figure 5 and Figure 6As described above, the frame 11 includes a body, the body has a guide tube 111 protruding in a direction away from the leg 12, the guide tube 111 has a guide cavity open toward the contact plate 21, a portion of the elastic member 3 is fitted in the guide cavity, one end of the elastic member 3 abuts against the top of the guide cavity, and the other end abuts against the contact plate 21. Thus, the guide cavity can accommodate the elastic member 3 and serve as a guide structure to ensure that the elastic member 3 does not deviate when it is extended or retracted.
[0035] Preferably, the leg 12 is disposed adjacent to the guide tube 111. Thus, the leg 12 serves as a supporting connection structure, and the guide tube 111 adjacent to the leg 12 has a stronger bearing capacity and higher stability when bearing the force of the elastic member 3.
[0036] Preferably, if Figure 4 and Figure 5 As shown, the heat sink 2 further includes a guide post 211, which is connected to the contact plate 21 and extends toward the frame 11. Part of the guide post 211 fits in the guide cavity and the elastic member 3 is sleeved on the guide post 211. Thus, the guide post 211 can serve as a limit post to prevent the elastic member 3 from being misplaced, and can also guide the expansion and contraction of the elastic member 3.
[0037] Preferably, if Figure 4-Figure 6 As shown, the guide tubes 111 and the guide posts 211 are arranged in a plurality along the circumference of the body, and the plurality of guide tubes 111 correspond to the plurality of guide posts 211. Thus, the plurality of guide structures can provide a plurality of pressing points for the contact plate 21, ensuring the reliability and stability of the contact plate 21 and the chip 4.
[0038] Preferably, if Figure 1-Figure 6 As shown, there are multiple legs 12, and the multiple legs 12 are arranged at intervals along the circumference of the frame 11. Therefore, the multiple legs 12 can improve the assembly stability of the heat sink on the circuit board 5, and the multiple legs 12 can evenly support the frame 11, and the frame 11 can stably bear the force of each elastic member 3.
[0039] Specifically, Figure 6 As shown, the main body of the frame 11 is rectangular, and a guide tube 111 and a support leg 12 are respectively provided at the four corners of the main body, and each support leg 12 includes two support plates respectively located on both sides of the corner, and the two support plates are spaced apart, that is, there are two support plates at any corner position to provide support, the support stability is high, and the support plate structure itself uses less material, is light in weight, saves cost and is easy to form.
[0040] Preferably, the legs 12, the body and the guide tube 111 are formed in one piece. Thus, the one-piece structure is easy to assemble, eliminating the need for assembly operations, and the overall structure has high strength and good stability.
[0041] Preferably, if Figure 5The guide column 211 is a conical column that gradually contracts in the direction away from the contact plate 21 , the guide cavity is a conical cavity that gradually contracts in the direction away from the contact plate 21 , and the elastic member 3 is a conical spring that gradually contracts in the direction away from the contact plate 21 .
[0042] Therefore, when the conical spring is assembled with the guide column 211 and the guide tube 111, the automatic centering function of the conical structure can be used to avoid the phenomenon of eccentric installation during spring assembly, thereby ensuring that the thrust provided by the spring acts vertically on the contact plate 21, thereby ensuring positive compression between the contact plate 21 and the chip 4.
[0043] Furthermore, if Figure 6 As shown, the end of the leg 12 away from the frame 11 has a plug-in piece 13, and the plug-in piece 13 is used to plug and match with the circuit board 5. Therefore, when the heat dissipation device of the present application is assembled with the circuit board 5, it is only necessary to press the heat dissipation device on the circuit board 5 by using the plug-in piece 13 and the plug-in hole, without the need to set up additional connectors.
[0044] Optionally, the plug-in structure on the leg 12 is not limited to being a plug-in piece 13, as long as it can satisfy the plug-in fit.
[0045] Preferably, if Figure 6 The plug-in sheet 13 includes a limiting portion and a plug-in portion, the plug-in portion is adapted to cooperate with the plug-in hole, the limiting portion is closer to the frame 11 relative to the plug-in portion, and the cross-sectional area of the limiting portion is larger than that of the plug-in portion. Therefore, when the heat dissipation device of the present application is crimped onto the circuit board 5, the limiting portion can limit the plug-in depth to avoid over-crimping.
[0046] Specifically, Figure 6 As described above, the plug-in piece 13 is a diamond-shaped structure, the acute-angle end of the diamond-shaped structure can be inserted into the plug-in hole, and the obtuse-angle end can be used as a limiting shoulder (limiting portion) to stop against the circuit board 5.
[0047] In some embodiments, Figure 7 As shown, the heat sink 2 further includes a heat sink fin 22, which is disposed on the side of the contact plate 21 facing the frame 11, and the frame 11 has a central hole to avoid the heat sink fin 22. Thus, the heat sink fin 22 can improve the heat dissipation effect, and the central hole can reduce the overall weight and material of the heat sink while avoiding the heat sink fin 22, so that the heat sink fin 22 has a larger assembly space.
[0048] Preferably, there are a plurality of heat dissipation fins 22 arranged at intervals.
[0049] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.
[0050] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0051] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0052] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0053] In the present invention, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.
[0054] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.
Claims
1. A circuit board chip heat dissipation device, characterized in that: include: A bracket, the bracket comprising a frame and a leg, one end of the leg is used to connect to the circuit board and the leg extends in a direction away from the circuit board, and the frame is connected to the other end of the leg; A heat sink and an elastic member, wherein the heat sink comprises a contact plate, the contact plate is located on a side of the frame facing the leg, one end of the elastic member abuts against the contact plate, and the other end abuts against the frame, and the elastic member has a force for pushing the contact plate to move in a direction away from the frame.
2. The circuit board chip heat dissipation device according to claim 1, characterized in that: The frame includes a main body, which has a guide tube protruding in a direction away from the leg, and the guide tube has a guide cavity open toward the contact plate, a portion of the elastic member is fitted in the guide cavity, and one end of the elastic member stops at the top of the guide cavity, and the other end stops at the contact plate.
3. The circuit board chip heat dissipation device according to claim 2, characterized in that: The legs are disposed adjacent to the guide tube.
4. The circuit board chip heat dissipation device according to claim 2, characterized in that: The heat sink also includes a guide post, which is connected to the contact plate and extends toward the frame. A portion of the guide post is fitted in the guide cavity and the elastic member is sleeved on the guide post.
5. The circuit board chip heat dissipation device according to claim 4, characterized in that: The guide tubes and the guide posts are both arranged in a plurality along the circumferential direction of the body at intervals, and the plurality of guide tubes and the plurality of guide posts correspond to each other one by one; And / or the number of the supporting legs is multiple, and the multiple supporting legs are arranged at intervals along the circumference of the frame.
6. The circuit board chip heat dissipation device according to claim 4, characterized in that: The guide column is a conical column that gradually contracts in a direction away from the contact plate, the guide cavity is a conical cavity that gradually contracts in a direction away from the contact plate, and the elastic member is a conical spring that gradually contracts in a direction away from the contact plate.
7. The circuit board chip heat dissipation device according to claim 2, characterized in that: The legs, the body and the guide tube are formed integrally.
8. The circuit board chip heat dissipation device according to any one of claim 1, characterized in that: The end of the leg facing away from the frame is provided with a plug-in piece, and the plug-in piece is used for plugging and matching with the circuit board.
9. The circuit board chip heat dissipation device according to claim 8, characterized in that: The plug-in piece includes a limiting portion and a plug-in portion, the plug-in portion is suitable for cooperating with the plug-in hole, the limiting portion is closer to the frame relative to the plug-in portion, and the cross-sectional area of the limiting portion is larger than that of the plug-in portion.
10. The circuit board chip heat dissipation device according to any one of claims 1 to 9, characterized in that: The heat sink also includes a heat dissipation fin, which is arranged on a side of the contact plate facing the frame, and the frame has a central hole to avoid the heat dissipation fin.