Chip integration structure of three-phase brushless motor

Abstract

The invention provides a chip integration structure of a three-phase brushless motor, which comprises a packaging frame, a motor driving chip and an MOS chip set, the packaging frame is provided with a first base island and pins arranged around the first base island, the motor driving chip and the MOS chip set are integrated on the first base island, and the motor driving chip and the MOS chip set are integrated on the first base island. The MOS chip set comprises a plurality of P-MOS chips and a plurality of N-MOS chips. According to the embodiment of the invention, the area of the packaging frame is fully utilized, so that a plurality of chips can be placed in the base island, and the plurality of chips are packaged in one chip, so that the space utilization rate of the PCB is improved, and the production cost is reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a chip integration structure of a three-phase brushless motor. Background Art

[0002] In the early days, integrated circuits were mainly packaged in single chip packages (SCP), that is, a single chip was packaged in a circuit board. However, as the functional requirements of electronic devices continue to increase, single chip packaging cannot meet the integration requirements of multiple different functional modules. In order to solve this problem, multi-chip packaging (MCP) technology came into being, which refers to the integration of multiple chip components with different functions in one circuit board, so that the device has a higher degree of integration and a smaller package size.

[0003] In the prior art, the three-phase brushless motor will solder the MCU chip, motor driver chip and MOS chip to the PCB circuit board separately through the above-mentioned multi-chip packaging technology. However, due to the limited space of the circuit board, this method will result in poor space utilization of the circuit board and the integration is still not high. Summary of the invention

[0004] In view of this, the present application provides a chip integration structure of a three-phase brushless motor to improve the space utilization in a PCB circuit board.

[0005] The present application provides a chip integration structure of a three-phase brushless motor, including a packaging frame, a motor driver chip and a MOS chipset, wherein the packaging frame has a first base island and pins arranged around the first base island, the motor driver chip and the MOS chipset are both integrated on the first base island, and the MOS chipset includes a plurality of P-MOS chips and a plurality of N-MOS chips.

[0006] In some embodiments, the chip integration structure further includes an MCU chip, and the MCU chip is arranged on the first base island with the motor driver chip and the MOS chipset at intervals. Three or more chips are integrated in the chip integration structure.

[0007] In some embodiments, the chip integration structure further includes a second base island and an MCU chip, the second base island is spaced apart from the first base island, the MCU chip is integrated on the second base island, and three or more chips are integrated in the chip integration structure.

[0008] In some embodiments, the MCU chip, the motor driver chip and the MOS chipset are fixed on the first base island or the second base island by conductive silver glue.

[0009] In some embodiments, the MOS chipset includes three P-MOS chips and three N-MOS chips, and the P-MOS chips and the N-MOS chips are arranged on the first base island in a tiling or stacking manner.

[0010] In some embodiments, multiple copper wires or aluminum strips are evenly laid on each P-MOS chip and N-MOS chip to realize internal connection of the MOS chipset.

[0011] In some embodiments, the chip integration structure also includes a plastic package, which covers the motor driver chip, the MOS chipset and the packaging frame, and the pins are located between the base island and the edge of the plastic package, and the distance between the base island and the edge of the plastic package is at least less than or equal to 500 μm.

[0012] In some embodiments, in the horizontal direction, the distance between the first base island and the edge of the plastic package body is at least less than or equal to 80 μm and greater than or equal to 50 μm.

[0013] In some embodiments, in a vertical direction, a distance between the first base island and an edge of the plastic package body is at least less than or equal to 300 μm and greater than or equal to 100 μm.

[0014] In some embodiments, the packaging frame further includes a grounding area, which is disposed in the base island and located between the pins and the chip.

[0015] The present application provides a chip integration structure of a three-phase brushless motor, including a packaging frame, a motor driver chip and a MOS chipset, wherein the packaging frame has a first base island and pins arranged around the first base island, the motor driver chip and the MOS chipset are both integrated and arranged on the first base island, and the MOS chipset includes a plurality of P-MOS chips and a plurality of N-MOS chips. This embodiment makes full use of the area of ​​the packaging frame so that a plurality of chips can be placed in the base island, and by packaging a plurality of chips into one chip, the space utilization rate of the PCB circuit board is improved, and the production cost is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1It is a structural schematic diagram of the chip integration structure of the three-phase brushless motor provided in this application.

[0018] Figure 2 This is another structural schematic diagram of the chip integration structure of the three-phase brushless motor provided in this application. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application are clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In the absence of conflict, the following embodiments and their technical features can be combined with each other.

[0020] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the description of the present application, the meaning of "several" is at least one, such as one, two, etc., unless otherwise clearly and specifically defined.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by a person skilled in the art to which this application belongs. The terms used herein are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more related listed items. The terms "connection", "electrical connection", and "electrical connection" used herein include any direct and indirect electrical or structural connection means. Therefore, if the text describes a first device coupled / connected / electrically connected to a second device, it means that the first device can be directly electrically / structurally connected to the second device, or indirectly electrically / structurally connected to the second device through other devices or connection means.

[0022] The present application provides a chip integration structure of a three-phase brushless motor, including a packaging frame, a motor driver chip and a MOS chipset, wherein the packaging frame has a first base island and pins arranged around the first base island, the motor driver chip and the MOS chipset are both integrated on the first base island, and the MOS chipset includes a plurality of P-MOS chips and a plurality of N-MOS chips.

[0023] Please refer to Figure 1 , Figure 1It is a structural schematic diagram of the chip integration structure of the three-phase brushless motor provided by the present application. The chip integration structure of the three-phase brushless motor in the present application may further include an MCU chip, and the MCU chip, the motor driver chip and the MOS chipset are arranged on the first base island at intervals. Through this arrangement, the MCU chip, the motor driver chip and the MOS chipset can be packaged with a high degree of integration. By packaging multiple chips into one chip, the space utilization rate of the PCB circuit board is improved, and the production cost of the semiconductor device is reduced. Through the chip integration method in this embodiment, at least three or more integrated circuit chips will be integrated in the three-phase brushless motor.

[0024] In one embodiment, when the above-mentioned multiple chips are arranged in the base island, a suitable lead frame can be selected according to the requirements of the pins, and the lead frame includes SOP, TSSOP, QFN, LQFP frame, etc. Among them, the SOP package has a small volume and a moderate number of pins, which is suitable for medium-density integrated circuits. Its pins are usually arranged on both sides of the package, which is convenient for connection with the circuit board. TSSOP is an improved version of SOP, with a thinner package thickness and a smaller pin spacing. This package form is suitable for occasions with stricter space requirements, such as portable devices. Since the pin spacing of the TSSOP package is small, its pin density is relatively high, and more pins can be provided within a limited package size. QFN is a pinless flat package, which is characterized by the absence of traditional pins, but is connected to the circuit board through the pads at the bottom of the package. This package form has a higher package density and better electrical performance, and is suitable for occasions with high performance and reliability requirements. The number of pins in the QFN package is large, and they are closely arranged, which can provide more functional pins. LQFP is a thin square flat package with a lower package height and a larger pin spacing. This package form is suitable for occasions where there are restrictions on the package height and more pins are required. The pins of the LQFP package are usually arranged on the four sides of the package to facilitate connection with the circuit board.

[0025] In one embodiment, the MOS chipset may include three P-MOS chips and three N-MOS chips, and the P-MOS chips and the N-MOS chips may be arranged on the first base island in a tiled or stacked manner. Figure 1 As shown in the figure, the MOS chipset consists of three P-MOS chips and three N-MOS chips. P-MOS and N-MOS are two basic MOS field effect transistors. The tiling method refers to placing multiple MOS chips side by side on the base island and connecting them through metal wires or other connection methods. The stacking method refers to stacking multiple MOS chips vertically and connecting them through special connection technology.

[0026] In one embodiment, since the first base island needs to integrate multiple chips, the area of ​​the selected first base island can be enlarged by etching or stamping according to the actual size of the motor driving chip and the MOS chipset.

[0027] Furthermore, for the internal wiring of the above-mentioned highly integrated chip, multiple relatively thick copper wires or copper alloy wires can be evenly spread on the surface of each P-MOS chip and N-MOS chip. This is because in highly integrated chips, the use of copper wires or copper alloy wires can provide better conductivity, which helps to reduce power consumption and increase signal transmission speed, and the selection of thicker copper wires or copper alloy wires can reduce resistance and inductance and improve signal transmission quality. Evenly spreading copper wires or copper alloy wires on the surface of the MOS chip can ensure that the current is evenly distributed inside the chip, avoiding problems such as local overheating and current congestion. In other embodiments, internal wiring can also be carried out through aluminum bars, which can provide sufficient conductivity and relatively low cost.

[0028] In another embodiment, please continue to refer to Figure 2 , wherein the chip integration structure further includes a second base island and an MCU chip, the second base island is spaced apart from the first base island, and the MCU chip is integrated and arranged on the second base island. The MCU chip, the motor driver chip, and the MOS chipset are all fixed on the first base island or the second base island by conductive silver glue. Through the chip integration method in this embodiment, at least three or more integrated circuit chips will be integrated in the three-phase brushless motor.

[0029] In one embodiment, the frame may further include a plastic package, the plastic package covers the motor driver chip, the MOS chipset and the packaging frame, the pin is located between the base island and the edge of the plastic package, and the distance between the base island and the edge of the plastic package is at least less than or equal to 500 μm. Further, the pin may include a welding area and a plurality of pins connected to the welding area, and the plurality of pins are arranged at intervals.

[0030] In one embodiment, Figure 1 or Figure 2The 3P in the motor driver chip refers to the three power output terminals, which are used to drive the three positive phases of the motor (P stands for Positive or Phase, which means "positive" or "phase"). In a three-phase motor, the three phases are U phase, V phase and W phase, which control the rotation of the motor through different current combinations. 3N refers to the negative end of the three power output terminals corresponding to 3P or the low-side drive (N stands for Negative, which means "negative"). In motor drive, each phase requires a positive end and a negative end to control the flow of current to achieve motor drive. The 3P and 3N in the motor driver chip control the motor's power-on phase sequence and phase current through internal power semiconductor switches (such as MOSFET or IGBT). When the chip receives a PWM (pulse width modulation) signal from the controller, it controls the opening and closing of these power semiconductor switches according to the duty cycle and phase of the signal, thereby achieving precise drive control of the motor.

[0031] In one embodiment, continue to refer to Figure 1 , in the horizontal direction, the distance between the first base island and the edge of the plastic package is at least less than or equal to 80μm, and greater than or equal to 50μm. For example, in the horizontal direction, the distance between the first base island and the edge of the plastic package can be 50μm, 56μm, 67μm, 70μm, 75μm or 80μm, etc. The distance between the first base island and the edge of the plastic package is set within this range to further shorten the distance between the first base island and the left and right edges of the plastic package, thereby increasing the area of ​​the first base island, so that more chips can be placed in the first base island, further improving the space utilization of the circuit board, while retaining sufficient plastic package distance to ensure the airtightness of subsequent plastic package, reducing production costs.

[0032] In one embodiment, the vertical direction is perpendicular to the horizontal direction, and in the vertical direction, the distance between the first base island and the edge of the plastic package is at least less than or equal to 300 μm, and greater than or equal to 100 μm. Specifically, in the vertical direction, the distance between the first base island and the edge of the plastic package can be 100 μm, 120 μm, 230 μm, 340 μm, 390 μm, 420 μm, 440 μm or 300 μm, etc. The distance between the first base island and the edge of the plastic package is set within this range to shorten the distance between the first base island and the edge of the plastic package, thereby increasing the area of ​​the first base island, so that more chips can be placed in the first base island, further improving the space utilization of the circuit board, while retaining sufficient plastic package distance to ensure the airtightness of subsequent plastic package, reducing production costs.

[0033] In one embodiment, in the horizontal direction and the vertical direction, the distance between the first base island and the edge of the plastic package body is equidistant, which can further improve the space utilization of the circuit board while retaining sufficient plastic packaging distance to ensure the airtightness of subsequent plastic packaging.

[0034] In one embodiment, the package frame may further include a grounding area, which is disposed in the first base island or the second base island and is located between the pins and the chip. The grounding area may be disposed around the MCU chip, the motor driver chip, and the MOS chipset.

[0035] The embodiment of the present application increases the area of ​​the base island by reducing the distance between the base island and the edge of the plastic package body, and fully utilizes the area of ​​the packaging frame so that multiple chips can be placed in the base island. At the same time, the area of ​​the packaging frame is fully utilized, and multiple chips are packaged into one chip, thereby improving the space utilization rate of the PCB circuit board and reducing the production cost.

[0036] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structural or equivalent process transformations made using the contents of the specification and drawings of the present application, such as the mutual combination of technical features between the embodiments, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A chip integrated structure of a three-phase brushless motor, characterized in that: It includes a packaging frame, a motor driving chip and a MOS chipset. The packaging frame has a first base island and pins arranged around the first base island. The motor driving chip and the MOS chipset are both integrated on the first base island. The MOS chipset includes multiple P-MOS chips and multiple N-MOS chips.

2. The chip integrated structure of the three-phase brushless motor according to claim 1, characterized in that: The chip integration structure further includes an MCU chip. The MCU chip is arranged on the first base island with the motor drive chip and the MOS chipset at intervals. Three or more chips are integrated in the chip integration structure.

3. The chip integration structure of the three-phase brushless motor according to claim 1, characterized in that: The chip integration structure further includes a second base island and an MCU chip. The second base island is spaced apart from the first base island. The MCU chip is integrated on the second base island. Three or more chips are integrated in the chip integration structure.

4. The chip integrated structure of the three-phase brushless motor according to claim 2 or 3, characterized in that: The MCU chip, the motor drive chip and the MOS chipset are fixed on the first base island or the second base island through conductive silver glue.

5. The chip integration structure of the three-phase brushless motor according to claim 1, characterized in that: The MOS chipset includes three P-MOS chips and three N-MOS chips, and the P-MOS chips and the N-MOS chips are arranged on the first base island in a tiling or stacking manner.

6. The chip integration structure of the three-phase brushless motor according to claim 1, characterized in that: A plurality of copper wires or aluminum strips are evenly laid on each P-MOS chip and N-MOS chip to realize the internal connection of the MOS chipset.

7. The chip integration structure of the three-phase brushless motor according to claim 1, characterized in that: The chip integration structure also includes a plastic package, which covers the motor driver chip, the MOS chipset and the packaging frame. The pins are located between the base island and the edge of the plastic package, and the distance between the base island and the edge of the plastic package is at least less than or equal to 500 μm.

8. The chip integration structure of the three-phase brushless motor according to claim 7, characterized in that: In the horizontal direction, the distance between the first base island and the edge of the plastic package body is at least less than or equal to 80 μm and greater than or equal to 50 μm.

9. The chip integration structure of the three-phase brushless motor according to claim 7, characterized in that: In the vertical direction, the distance between the first base island and the edge of the plastic package body is at least less than or equal to 300 μm and greater than or equal to 100 μm.

10. The chip integration structure of the three-phase brushless motor according to claim 1, characterized in that: The packaging frame further comprises a grounding area, which is arranged in the base island and located between the pins and the chip.

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