Novel packaging process

Abstract

The invention discloses a novel packaging process, and relates to the technical field of intelligent card production, the novel packaging process is used for manufacturing an intelligent card module, the intelligent card module comprises a PCB support plate and a wafer arranged above the PCB support plate, the novel packaging process comprises the following steps: preparing the PCB support plate, the wafer and a tin powder alloy material, the wafer and the PCB carrier plate with the fixed wafer are subjected to multiple times of hot pressing treatment through a reflow oven or hot pressing equipment, so that the PCB carrier plate and the wafer are connected into a whole, and after hot pressing is completed, the intelligent card module is subjected to quality detection and then put in storage treatment. According to the invention, a tin powder alloy packaging mode is adopted, the PCB metal carrier plate is combined with the wafer welding spot through the tin powder, and the wafer is coated by the epoxy resin to play a protection role, so that the problem of poor adhesion between the tin powder and the wafer can be improved, and the processing difficulty that the ACF needs to be in hot-pressing contact with the wafer is avoided; the novel packaging technology is leading the packaging technology in the industry, and has high mass production performance and reliability.

Description

Technical Field

[0001] The invention relates to the technical field of smart card production, in particular to a new packaging process. Background Art

[0002] IC card is also called smart card, wisdom card, microcircuit card or microchip card. It is a card made by embedding a microelectronic chip in a card base that conforms to the ISO 7816 standard. The communication method between the IC card and the reader can be contact or contactless. According to the communication interface, IC cards are divided into contact IC cards, contactless IC cards and dual-interface cards.

[0003] With the rapid development of smart card technology, the requirements for smart card module packaging are getting higher and higher. The traditional smart card module packaging process uses wire bonding packaging ( Figure 1 ) and flip-chip ( Figure 2 and Figure 3 ) method, wire bonding packaging uses gold wire, aluminum wire, copper wire or alloy wire to bond the chip (102) to the PCB carrier (101), but the adhesion to the chip (102) is poor, and flip-chip packaging uses ACF packaging method, using heterogeneous conductive adhesive to complete the bonding of the chip (102) to the PCB carrier (101) by hot pressing, but the ACF needs to contact the chip (102) for hot pressing, and the hot pressing process is more troublesome. The above methods all have the problem of low production efficiency and are not convenient for mass production operations.

[0004] Based on this, a new packaging process is now provided to eliminate the drawbacks of the existing technical solutions. Summary of the invention

[0005] The purpose of the present invention is to provide a new packaging process to solve the problem that the traditional packaging process in the background technology has low production efficiency and is not convenient for mass production.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A novel packaging process is used to manufacture a smart card module, wherein the smart card module comprises a PCB carrier and a chip disposed above the PCB carrier. The novel packaging process comprises the following steps:

[0008] S1. Prepare the PCB carrier, wafer and tin powder alloy material, and place the tin powder alloy material on the surface of the PCB carrier;

[0009] S2, placing the chip on the tin powder alloy material, and pre-soldering the chip on the surface of the PCB carrier through the tin powder alloy material;

[0010] S3, performing multiple hot pressing treatments on the wafer and the PCB carrier with the die fixed thereon by using a reflow furnace or hot pressing equipment, so that the tin powder alloy material and the PCB carrier are tightly combined, so that the PCB carrier and the wafer are connected as one through the tin powder alloy material;

[0011] S4. Protect and fill the wafer and capacitor on the surface of the chip by dispensing glue to enhance its impact and vibration resistance;

[0012] S5. After the hot pressing is completed, the smart card module is subjected to necessary subsequent processing, such as cleaning, curing, etc., and quality inspection is performed to ensure that the product quality meets the standards;

[0013] S6. After obtaining the flat packaging structure of the smart card module, it is put into storage.

[0014] Preferably, the upper end of the PCB carrier is connected to the wafer by hot pressing, and the tin powder alloy material is arranged between the PCB carrier and the wafer.

[0015] Preferably, an epoxy resin coating layer is provided on the outer side of the wafer.

[0016] Preferably, the tin powder alloy material is formed by mixing tin powder and flux glue in a certain proportion, and the content ratio of the tin powder to the flux glue is about 9:1.

[0017] Preferably, the soldering adhesive is made of epoxy material.

[0018] Preferably, the reflow furnace is a nitrogen-containing reflow furnace.

[0019] Preferably, the hot pressing head of the hot pressing equipment adopts a hot pressing head with a non-contact wafer structure.

[0020] Preferably, a plurality of annular anti-overflow protrusions are provided on the upper surface of the PCB carrier, and the size of the anti-overflow protrusions is adapted to the outer peripheral shape of the PCB carrier.

[0021] Preferably, the wafer and the tin powder alloy material are both arranged inside the anti-overflow protrusion.

[0022] Preferably, an overflow groove for flowing out excess glue is provided on one side of the anti-overflow protrusion.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] Compared with the traditional packaging method using solder paste (tin powder and rosin) and ACF, the present invention adopts a tin powder alloy packaging method, uses tin powder to combine the PCB metal carrier board with the chip solder joints, uses epoxy material as flux glue, and uses epoxy resin to coat the chip to protect it. Combining the advantages of both solder paste and ACF, it can improve the problem of poor adhesion between tin powder and chip, and avoids the processing difficulty of ACF needing hot pressing contact with the chip. This new packaging process has industry-leading packaging process technology and has high mass production and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of the wire bonding package in the prior art.

[0026] Figure 2 It is a structural schematic diagram of the flip-chip method in the prior art.

[0027] Figure 3 It is a schematic diagram of the structure of a hot pressing welding head and a chip in the prior art.

[0028] Figure 4 It is a schematic diagram of the packaging structure of the present invention.

[0029] Figure 5 It is a schematic diagram of the structure of tin powder and solder paste of the present invention.

[0030] Figure 6 It is a schematic diagram of the hot pressing process of the tin powder alloy material of the present invention.

[0031] Figure 7 It is a schematic diagram of the tin powder alloy material after hot pressing of the present invention.

[0032] Figure 8 It is a schematic structural diagram of the overflow prevention protrusion and the overflow groove of the present invention.

[0033] Fig. 9 It is a production flow chart of the present invention.

[0034] Fig.10 It is a schematic diagram of the steps of the present invention.

[0035] Notes on reference numerals: 100, smart card module; 101, PCB carrier board; 102, chip; 103, anti-overflow protrusion; 104, overflow groove; 200, tin powder alloy material; 201, tin powder; 202, solder paste. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0037] In this embodiment, if Figure 4-Figure 10As shown, a new packaging process is used to manufacture a smart card module 100. The smart card module 100 includes a PCB carrier 101 and a chip 102 disposed on the PCB carrier 101. The surface of the PCB carrier 101 is provided with positioning holes for ensuring that the chip 102 is disposed at a specific position. Before packaging the smart card module 100, it is first checked whether the smart card module 100 can be used normally, and then corresponding materials are placed at corresponding positions, and then the packaging operation is started. The new packaging process includes the following steps:

[0038] S1, prepare the PCB carrier 101, the wafer 102 and the tin powder alloy material 200, and place the tin powder alloy material 200 on the surface of the PCB carrier 101;

[0039] S2, placing the chip 102 on the tin powder alloy material 200, and pre-soldering the chip 102 on the surface of the PCB carrier 101 through the tin powder alloy material 200;

[0040] S3, performing multiple hot pressing treatments on the wafer 102 and the PCB carrier 101 with the die fixed thereon by a reflow furnace or hot pressing equipment, so that the tin powder alloy material 200 and the PCB carrier 101 are tightly combined, so that the PCB carrier 101 and the wafer 102 are connected as one through the tin powder alloy material 200;

[0041] S4, by dispensing glue, the wafer and capacitor on the surface of the chip 102 are protected and filled to enhance their impact resistance and vibration resistance;

[0042] S5. After the hot pressing is completed, the smart card module 100 is subjected to necessary subsequent processing, such as cleaning, curing, etc., and quality inspection is performed to ensure that the product quality meets the standards;

[0043] S6, after obtaining the flat packaging structure of the smart card module 100, storing it in a warehouse;

[0044] The novel packaging process can process the smart card module 100 in batches and efficiently, and the surface of the processed smart card module 100 is relatively flat and has good bonding adhesion, so that the PCB carrier 101 and the chip 102 are tightly combined.

[0045] Among them Figure 4-Figure 7 As shown, the upper end of the PCB carrier 101 is connected to the chip 102 by hot pressing, and the tin powder alloy material 200 is arranged between the PCB carrier 101 and the chip 102. In the actual packaging process, the hot pressing temperature is adjusted according to the actual situation, which is beneficial to prevent the chip 102 from being damaged by high temperature. At the above temperature, the tin glue material can have good fluidity and high adhesion;

[0046] Among them Figure 4-Figure 7As shown, a layer of epoxy resin coating is disposed on the outer side of the chip 102 to provide protection, thereby extending the service life of the chip 102, thereby improving the production quality and efficiency of the smart card module 100;

[0047] Among them Figure 4-Figure 7 As shown, the tin powder alloy material 200 is formed by mixing tin powder 201 and solder paste 202 in a certain proportion. The tin powder 201 is a metal powder with good conductivity and corrosion resistance, and is commonly used in manufacturing printed circuit boards and batteries. The tin powder 201 can form tiny solder joints on the metallization layer of the chip 102, and connect the electronic components inside the chip 102 through the solder joints to realize circuit functions and signal transmission. The content ratio of the tin powder 201 to the solder paste 202 is about 9:1, which can be adjusted according to the actual hot pressing environment. The tin powder alloy material 200 has a cleaning-free effect and can provide the chip 102 with better solder joint strength;

[0048] Among them Figure 4-Figure 7 As shown, the soldering glue 202 is made of epoxy material. After the hot pressing operation is completed, the soldering glue 202 will form an epoxy resin thermosetting glue and wrap the solder joints, playing a role in absorbing stress and further improving the conductive performance;

[0049] Among them Fig. 9 and Fig.10 As shown, the reflow oven adopts a nitrogen-containing reflow oven, and the type and style of the reflow oven are limited;

[0050] Among them Fig.10 As shown, the hot pressing head of the hot pressing equipment adopts a hot pressing head of a non-contact wafer structure, which limits the hot pressing method and further ensures the practicality of the new packaging process;

[0051] Among them Figure 8 As shown, a plurality of annular anti-overflow protrusions 103 are arranged on the upper surface of the PCB carrier 101. The size of the anti-overflow protrusions 103 matches the outer peripheral shape of the PCB carrier 101. The anti-overflow protrusions 103 can effectively prevent the occurrence of glue overflow during the glue injection and hot pressing process, and limit the flow range of the solder paste 202 and the solder paste material within the anti-overflow protrusions 103, which is conducive to making the plane of the smart card module 100 more flat, thereby improving the adhesion effect between the PCB carrier 101 and the chip 102;

[0052] Among them Figure 8 As shown, the wafer 102 and the tin powder alloy material 200 are both arranged inside the anti-overflow protrusion 103, and the position of the wafer 102 is limited to ensure the normal operation of the new packaging process and improve the use effect;

[0053] Among them Figure 8As shown, an overflow groove 104 for flowing out excess glue is provided on one side of the anti-overflow protrusion 103. The overflow groove 104 is provided on the side of the anti-overflow protrusion 103 away from the PCB carrier 101, which can not only realize the outflow of excess glue during the heating and pressing process, but also avoid overflow of the tin powder alloy material 200 during the hot pressing process.

[0054] When in use, tin powder 201 and solder paste 202 are first mixed in a certain proportion to form tin powder alloy material 200. Under the restriction of positioning holes and anti-overflow protrusions 103, the tin powder alloy material 200 is placed on the upper surface of PCB carrier 101, and then the solder joints of chip 102 are made to contact with tin powder alloy material 200. The above components are placed under a reflow furnace or hot pressing equipment, and the chip 102 and PCB carrier 101 are joined by a non-contact chip method. After the hot pressing operation is completed, the tin powder 201 shrinks between the chip 102 and the PCB carrier 101, which is convenient for connecting the solder joints and thus plays a role in electrical conduction and heat conduction. The hot-pressed solder paste 202 is distributed on the outside of the tin powder 201 and then solidifies to increase the insulation effect. The new packaging process is convenient for batch operation, the packaging method is relatively simple, and the practicability is good.

[0055] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A novel packaging process for manufacturing a smart card module (100), wherein the smart card module (100) comprises a PCB carrier (101) and a chip (102) disposed above the PCB carrier (101), characterized in that: The novel packaging process comprises the following steps: S1, preparing a PCB carrier (101), a chip (102) and a tin powder alloy material (200), and placing the tin powder alloy material (200) on the surface of the PCB carrier (101); S2, placing the chip (102) above the tin powder alloy material (200), and pre-soldering the chip (102) on the surface of the PCB carrier (101) through the tin powder alloy material (200); S3, performing multiple hot pressing treatments on the wafer (102) and the PCB carrier (101) with the fixed die through a reflow furnace or hot pressing equipment, so that the tin powder alloy material (200) and the PCB carrier (101) are tightly combined, so that the PCB carrier (101) and the wafer (102) are connected as a whole through the tin powder alloy material (200); S4, performing protective filling on the wafer and capacitor on the surface of the wafer (102) by dispensing glue to enhance its anti-impact and anti-vibration capabilities; S5. After the hot pressing is completed, necessary subsequent processing is performed on the smart card module (100), and quality inspection is performed to ensure that the product quality meets the standards; S6. After obtaining the flat packaging structure of the smart card module (100), it is put into storage.

2. The novel packaging process according to claim 1, characterized in that: The upper end of the PCB carrier (101) is connected to the chip (102) by means of hot pressing, and the tin powder alloy material (200) is arranged between the PCB carrier (101) and the chip (102).

3. The novel packaging process according to claim 1, characterized in that: An epoxy resin coating layer is provided on the outer side of the wafer (102).

4. The novel packaging process according to claim 1, characterized in that: The tin powder alloy material (200) is formed by mixing tin powder (201) and solder paste (202) in a certain proportion, and the content ratio of the tin powder (201) to the solder paste (202) is approximately 9:

1.

5. The novel packaging process according to claim 4 is characterized in that: The soldering glue (202) is made of epoxy material.

6. The novel packaging process according to claim 1, characterized in that: The reflow furnace is a nitrogen-containing reflow furnace.

7. The novel packaging process according to claim 1, characterized in that: The hot pressing head of the hot pressing equipment adopts a hot pressing head with a non-contact wafer structure.

8. The novel packaging process according to claim 1, characterized in that: The upper surface of the PCB carrier (101) is provided with a plurality of annular anti-overflow protrusions (103), and the size of the anti-overflow protrusions (103) is adapted to the outer peripheral shape of the PCB carrier (101).

9. The novel packaging process according to claim 8, characterized in that: The wafer (102) and the tin powder alloy material (200) are both arranged inside the anti-overflow protrusion (103).

10. The novel packaging process according to claim 9, characterized in that: An overflow groove (104) for flowing out excess glue is provided on one side of the anti-overflow protrusion (103).

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