Heat dissipation material for folding electronic equipment

Abstract

The invention discloses a heat dissipation material for folding electronic equipment. The heat dissipation material comprises a first heat dissipation material arranged on a first folding part and a second heat dissipation material arranged on a second folding part, the first heat dissipation material is used for heat dissipation of the first folding part; the second heat dissipation material is used for heat dissipation of the second folding part; a heat dissipation bridge is arranged between the first heat dissipation material and the second heat dissipation material; the heat dissipation bridge is correspondingly arranged in a bending area between the first folding part and the second folding part; the heat dissipation bridge comprises a first protective layer and a second protective layer; a graphite heat dissipation functional layer is arranged between the first protective layer and the second protective layer; the first protective layer and the second protective layer are bonded through an adhesive layer. The first protective layer and the second protective layer are respectively made of polyimide (PI) films; the adhesive layer is made of an epoxy resin material; according to the invention, the problems of edge breaking, damage and fracture do not occur in 400,000 folding experiments, the performance is more stable, and the service life is longer.

Description

Technical Field

[0001] The present invention relates to the technical field related to the improvement of heat dissipation materials for foldable electronic devices, and in particular to a heat dissipation material for foldable electronic devices that can withstand 400,000 folding tests without breaking, damage or rupture. Background Art

[0002] With the development of science and technology, the industry has higher and higher requirements for the integrated form of products such as 3C (computers, communications and consumer electronics), automobiles, aerospace, high-speed rail, sports equipment, lighting, drones, medical devices, electric bicycles, etc., especially in mobile phones and notebook applications; high-end products have released folding solutions, and the thermal management of highly integrated electronic products is also a problem that must be solved.

[0003] As attached Figure 1-2 As shown, the heat dissipation material commonly used in foldable electronic devices now includes a first heat dissipation material 10 arranged on a first folding part and a second heat dissipation material 30 arranged on a second folding part; the first folding part (not shown) can be folded relative to the second folding part (not shown); the first heat dissipation material 10 is used for heat dissipation of the first folding part; the second heat dissipation material 30 is used for heat dissipation of the second folding part; a heat dissipation bridge 20 is passed between the first heat dissipation material 10 and the second heat dissipation material 30; the heat dissipation bridge 20 is correspondingly arranged in the bending area between the first folding part and the second folding part, and is used for heat diffusion between the first heat dissipation material 10 and the second heat dissipation material 30, so as to achieve temperature uniformity and heat dissipation; the heat dissipation bridge 20 includes a first protective layer 31 and a second protective layer 33; the first protective layer A graphite heat dissipation functional layer 32 is arranged between the first protective layer 31 and the second protective layer 33; the graphite heat dissipation functional layer 32 is bonded to the first protective layer 31 and the second protective layer 33 by an adhesive layer 34; the first protective layer 31 and the second protective layer 33 are made of PET and PU; the adhesive layer 34 is made of acrylic material; after a long period of use of the heat dissipation material for folding electronic devices with such a structure and material, the bending part of the graphite heat dissipation functional layer 32 of the heat dissipation bridge 20 is prone to creases, and may even break, affecting its function; the periphery of the first protective layer 31 and the second protective layer 33 of the heat dissipation bridge 20 will fall off and contact, that is, the adhesive layer 34 can no longer bond the first protective layer 31 and the second protective layer 33, and edge breakage will occur; this will cause the performance of the heat dissipation bridge 20 to be reduced or even fail.

[0004] To overcome the above defects, we have developed a heat dissipation material for foldable electronic devices that can withstand 400,000 folding experiments without breaking, damage or cracking. Summary of the invention

[0005] In order to overcome the shortcomings of the prior art, the present invention discloses a heat dissipation material for foldable electronic devices that can withstand 400,000 folding tests without edge breakage, damage or fracture.

[0006] To achieve the above object, the present invention is implemented through the following technical solutions: The present invention discloses a heat dissipation material for a foldable electronic device, comprising a first heat dissipation material arranged on a first folding part and a second heat dissipation material arranged on a second folding part; the first folding part can be folded relative to the second folding part; the first heat dissipation material is used for heat dissipation of the first folding part; the second heat dissipation material is used for heat dissipation of the second folding part; a heat dissipation bridge is passed between the first heat dissipation material and the second heat dissipation material; the heat dissipation bridge is arranged corresponding to the bending area between the first folding part and the second folding part, and is used for heat diffusion between the first heat dissipation material and the second heat dissipation material, and plays a role in temperature uniformity and heat dissipation; the heat dissipation bridge comprises a first protective layer and a second protective layer; a graphite heat dissipation functional layer is arranged between the first protective layer and the second protective layer; the first protective layer and the second protective layer are bonded by an adhesive layer; the first protective layer and the second protective layer are respectively made of polyimide film PI; the adhesive layer is made of epoxy resin material.

[0007] Preferably, the graphite heat dissipation functional layer is bonded to the first protective layer and the second protective layer respectively by adhesive layers; the graphite heat dissipation functional layer is fully wrapped by the adhesive layer; the graphite heat dissipation functional layer is not in direct contact with the first protective layer and the second protective layer.

[0008] Preferably, the graphite heat dissipation functional layer is bonded to the first protective layer by an adhesive layer; the graphite heat dissipation functional layer is in direct contact with the second protective layer, and the graphite heat dissipation functional layer is fully wrapped by the adhesive layer and the second protective layer.

[0009] Preferably, the graphite heat dissipation functional layer is bonded to the second protective layer by an adhesive layer; the graphite heat dissipation functional layer is in direct contact with the first protective layer, and the graphite heat dissipation functional layer is fully wrapped by the adhesive layer and the first protective layer.

[0010] Preferably, the graphite heat dissipation functional layer is in direct contact with the first protective layer and the second protective layer respectively, and the graphite heat dissipation functional layer is fully wrapped by the adhesive layer, the first protective layer and the second protective layer.

[0011] Compared with the prior art, the present invention has at least the following advantages: The heat dissipation material for foldable electronic devices of the present invention can withstand 400,000 folding tests without edge damage, breakage or fracture, and has more stable performance and longer service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for describing the embodiments are briefly introduced below.

[0013] Figure 1 This is a schematic diagram of the working principle of the heat dissipation material for foldable electronic devices according to the present invention; Figure 2 It is a schematic structural diagram of a first embodiment of a heat dissipation bridge of a heat dissipation material for a foldable electronic device according to the present invention; Figure 3 A schematic structural diagram of a second embodiment of the heat dissipation bridge of the heat dissipation material for a foldable electronic device according to the present invention; Figure 4 It is a schematic structural diagram of a third embodiment of the heat dissipation bridge of the heat dissipation material for a foldable electronic device according to the present invention; Figure 5 It is a schematic structural diagram of a fourth embodiment of the heat dissipation bridge of the heat dissipation material for foldable electronic devices according to the present invention; Among them, 10, the first heat dissipation material; 20, the heat dissipation bridge; 30, the second heat dissipation material; 31, the first protective layer; 32, the graphite heat dissipation functional layer; 33, the second protective layer; 34, the adhesive layer. DETAILED DESCRIPTION

[0014] The present invention is further described in detail below in conjunction with embodiments and drawings so that those skilled in the art can implement the invention with reference to the description. Example

[0015] See also Figure 1-2As shown, embodiment 1 of the present invention discloses a heat dissipation material for a foldable electronic device, including a first heat dissipation material 10 arranged on a first folding portion and a second heat dissipation material 30 arranged on a second folding portion; the first folding portion (not shown) can be folded relative to the second folding portion (not shown); the first heat dissipation material 10 is used for heat dissipation of the first folding portion; the second heat dissipation material 30 is used for heat dissipation of the second folding portion; a heat dissipation bridge 20 is passed between the first heat dissipation material 10 and the second heat dissipation material 30; the heat dissipation bridge 20 is correspondingly arranged in the bending area between the first folding portion and the second folding portion, and is used for heat diffusion between the first heat dissipation material 10 and the second heat dissipation material 30, so as to achieve temperature uniformity and heat dissipation; the heat dissipation bridge 20 includes a first protective layer 31 and a second protective layer 33; a graphite heat dissipation functional layer 32 is arranged between the first protective layer 31 and the second protective layer 33; the first protective layer 31 and the second protective layer 33 are bonded with an adhesive layer 34; the graphite heat dissipation functional layer 32 and the first protective layer 31 and the second protective layer 33 are bonded with an adhesive layer 34; the graphite heat dissipation functional layer 32 is fully wrapped by the adhesive layer 34; the first protective layer 31 and the second protective layer 33 are respectively made of polyimide film PI; the adhesive layer 34 is made of epoxy resin material; the graphite heat dissipation functional layer 32 is made of common graphite heat dissipation material, and it is not in direct contact with the first protective layer 31 and the second protective layer 33; when this embodiment is used, it can be bent upward or downward. Example

[0016] See also Figure 1 , 3As shown, embodiment 2 of the present invention discloses a heat dissipation material for a foldable electronic device, including a first heat dissipation material 10 arranged on a first folding portion and a second heat dissipation material 30 arranged on a second folding portion; the first folding portion (not shown) can be folded relative to the second folding portion (not shown); the first heat dissipation material 10 is used for heat dissipation of the first folding portion; the second heat dissipation material 30 is used for heat dissipation of the second folding portion; a heat dissipation bridge 20 is passed between the first heat dissipation material 10 and the second heat dissipation material 30; the heat dissipation bridge 20 is correspondingly arranged in the bending area between the first folding portion and the second folding portion, and is used for heat diffusion between the first heat dissipation material 10 and the second heat dissipation material 30, so as to achieve temperature uniformity and heat dissipation; the heat dissipation bridge 20 includes a first anti- A protective layer 31 and a second protective layer 33; a graphite heat dissipation functional layer 32 is arranged between the first protective layer 31 and the second protective layer 33; the first protective layer 31 and the second protective layer 33 are bonded with an adhesive layer 34; the graphite heat dissipation functional layer 32 and the first protective layer 31 are bonded with an adhesive layer 34; the graphite heat dissipation functional layer 32 and the second protective layer 33 are in direct contact with each other, and the graphite heat dissipation functional layer 32 is fully wrapped by the adhesive layer 34 and the second protective layer 33; the first protective layer 31 and the second protective layer 33 are respectively made of polyimide film PI; the adhesive layer 34 is made of epoxy resin material; the graphite heat dissipation functional layer 32 is made of common graphite heat dissipation material; when this embodiment is used, the upward bending effect is better. Example

[0017] See also Figure 1 , 4As shown, embodiment 3 of the present invention discloses a heat dissipation material for a foldable electronic device, comprising a first heat dissipation material 10 arranged on a first folding portion and a second heat dissipation material 30 arranged on a second folding portion; the first folding portion (not shown) can be folded relative to the second folding portion (not shown); the first heat dissipation material 10 is used for heat dissipation of the first folding portion; the second heat dissipation material 30 is used for heat dissipation of the second folding portion; a heat dissipation bridge 20 is passed between the first heat dissipation material 10 and the second heat dissipation material 30; the heat dissipation bridge 20 is correspondingly arranged in the bending area between the first folding portion and the second folding portion, and is used for heat diffusion between the first heat dissipation material 10 and the second heat dissipation material 30, so as to achieve temperature uniformity and heat dissipation; the heat dissipation bridge 20 comprises a first anti- A protective layer 31 and a second protective layer 33; a graphite heat dissipation functional layer 32 is arranged between the first protective layer 31 and the second protective layer 33; the first protective layer 31 and the second protective layer 33 are bonded with an adhesive layer 34; the graphite heat dissipation functional layer 32 and the second protective layer 33 are bonded with an adhesive layer 34; the graphite heat dissipation functional layer 32 and the first protective layer 31 are in direct contact with each other, and the graphite heat dissipation functional layer 32 is fully wrapped by the adhesive layer 34 and the first protective layer 31; the first protective layer 31 and the second protective layer 33 are respectively made of polyimide film PI; the adhesive layer 34 is made of epoxy resin material; the graphite heat dissipation functional layer 32 is made of common graphite heat dissipation material; when this embodiment is used, the downward bending effect is better. Example

[0018] See also Figure 1 , 5As shown, Embodiment 4 of the present invention discloses a heat dissipation material for a foldable electronic device, comprising a first heat dissipation material 10 arranged on a first folding portion and a second heat dissipation material 30 arranged on a second folding portion; the first folding portion (not shown) can be folded relative to the second folding portion (not shown); the first heat dissipation material 10 is used for heat dissipation of the first folding portion; the second heat dissipation material 30 is used for heat dissipation of the second folding portion; a heat dissipation bridge 20 is passed between the first heat dissipation material 10 and the second heat dissipation material 30; the heat dissipation bridge 20 is correspondingly arranged in the bending area between the first folding portion and the second folding portion, and is used for heat diffusion between the first heat dissipation material 10 and the second heat dissipation material 30, so as to achieve temperature uniformity and heat dissipation; the heat dissipation bridge 20, It comprises a first protective layer 31 and a second protective layer 33; a graphite heat dissipation functional layer 32 is arranged between the first protective layer 31 and the second protective layer 33; the first protective layer 31 and the second protective layer 33 are bonded with an adhesive layer 34; the graphite heat dissipation functional layer 32 is in direct contact with the first protective layer 31 and the second protective layer 33 respectively, and the graphite heat dissipation functional layer 32 is fully wrapped by the adhesive layer 34, the first protective layer 31 and the second protective layer 33; the first protective layer 31 and the second protective layer 33 are respectively made of polyimide film PI; the adhesive layer 34 is made of epoxy resin material; the graphite heat dissipation functional layer 32 is made of common graphite heat dissipation material; when this embodiment is used, it can be bent upward or downward.

[0019] The above embodiment only mentions one bending zone. When there are two or more bending zones, they can be implemented by simply combining them according to the above embodiment, and will not be described again here.

[0020] Compared with the prior art, the present invention has at least the following advantages: The heat dissipation material for foldable electronic devices of the present invention can withstand 400,000 folding tests without edge damage, breakage or fracture, and has more stable performance and longer service life.

[0021] Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention; therefore, the present invention will not be limited to the embodiments shown herein, but will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation material for a foldable electronic device, comprising a first heat dissipation material arranged on a first folding portion and a second heat dissipation material arranged on a second folding portion; the first folding portion can be folded relative to the second folding portion; the first heat dissipation material is used for heat dissipation of the first folding portion; the second heat dissipation material is used for heat dissipation of the second folding portion; a heat dissipation bridge is provided between the first heat dissipation material and the second heat dissipation material; the heat dissipation bridge is provided in correspondence with the bending area between the first folding portion and the second folding portion, and is used for heat diffusion between the first heat dissipation material and the second heat dissipation material, and plays a role in temperature uniformity and heat dissipation; the heat dissipation bridge comprises a first protective layer and a second protective layer; a graphite heat dissipation functional layer is provided between the first protective layer and the second protective layer; the first protective layer and the second protective layer are bonded by an adhesive layer; the characteristics are as follows: The first protective layer and the second protective layer are respectively made of polyimide film PI; the adhesive layer is made of epoxy resin material.

2. The heat dissipation material for foldable electronic devices according to claim 1, characterized in that: The graphite heat dissipation functional layer is bonded to the first protective layer and the second protective layer respectively by adhesive layers; the graphite heat dissipation functional layer is fully wrapped by the adhesive layer; the graphite heat dissipation functional layer is not in direct contact with the first protective layer and the second protective layer.

3. The heat dissipation material for foldable electronic devices according to claim 1, characterized in that: The graphite heat dissipation functional layer is bonded to the first protective layer by an adhesive layer; the graphite heat dissipation functional layer is in direct contact with the second protective layer, and the graphite heat dissipation functional layer is fully wrapped by the adhesive layer and the second protective layer.

4. The heat dissipation material for foldable electronic devices according to claim 1, characterized in that: The graphite heat dissipation functional layer is bonded to the second protective layer by an adhesive layer; the graphite heat dissipation functional layer is in direct contact with the first protective layer, and the graphite heat dissipation functional layer is fully wrapped by the adhesive layer and the first protective layer.

5. The heat dissipation material for foldable electronic devices according to claim 1, characterized in that: The graphite heat dissipation functional layer is in direct contact with the first protective layer and the second protective layer respectively, and the graphite heat dissipation functional layer is fully wrapped by the adhesive layer, the first protective layer and the second protective layer.

Images