Preparation process of efficient antifouling film of AMOLED module

Abstract

The invention relates to a preparation process of an efficient antifouling film of an AMOLED (Active Matrix / Organic Light Emitting Diode) module. The preparation process specifically comprises the following steps: S1, preparing raw materials: preparing a silicon compound, a carbon element and a silane group compound according to a ratio of 9.5: 0.3: 0.2; s2, raw material mixing: mixing a silicon compound, a carbon element and a silane group compound according to a ratio, and pouring the mixture into a mixer; s3, preparing a vacuum chamber: putting the substrate into the vacuum chamber; s4, vacuumizing: vacuumizing the vacuum chamber in which the substrate is placed to be vacuum; according to the preparation process of the high-efficiency antifouling film of the AMOLED module, a completely different mechanism is used, light can easily pass through fingerprint stains without refraction through the coating, so that fingerprints are easily hidden, in addition, the material has hydrophobicity and is easy to clean, the performance of the material is matched with that of an existing anti-fingerprint solution, and the anti-fouling film has a good anti-fouling effect. Therefore, the condition of being polluted by fingerprints even if being used for multiple times for a long time is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of AMOLED module antifouling films, and in particular to a preparation process of an AMOLED module high-efficiency antifouling film. Background Art

[0002] AMOLED products have a wide range of applications in the display market, such as smart bracelets and smart watches. With the advancement of technology, more and more watches and bracelets are becoming increasingly popular. Therefore, during normal use, the oil on the fingers will cause a lot of dirt on the surface of AMOLED smart watches, which will affect the customer experience. The previous treatment method was to plate AF on the cover of the AMOLED module, but the experience of this solution is not so good. Sometimes customers will also report the problem of surface oil after plating. This is because AF relies on surface diffuse reflection to achieve no oil on the surface. According to the actual situation, fingerprints will be less obvious after AF plating than without AF plating, and the more times the plating is applied, the less obvious the fingerprints will be. This also reflects that as customers use the product, fingerprints will become more and more obvious and difficult to control. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a process for preparing an efficient antifouling film for an AMOLED module.

[0004] The objective of the present invention is achieved through the following technical solutions:

[0005] A process for preparing an efficient antifouling film for an AMOLED module specifically comprises the following steps: S1, preparing raw materials: preparing a silicon compound, a carbon element and a silane group compound in a ratio of 9.5:0.3:0.2;

[0006] S2. Mixing raw materials: mix silicon compounds, carbon elements and silane group compounds according to the proportion and pour them into the mixer; S3. Prepare the vacuum chamber: put the substrate into the vacuum chamber; S4. Evacuate: evacuate the vacuum chamber with the substrate; S5. Ion bombardment: introduce the mixed raw materials directly into the ion bombarder, and inject the atomic vapor flow into the surface of the substrate; S6. Preheating: preheat the substrate sprayed with the mixed raw materials; S7. Baking: put the preheated substrate into the baking chamber for baking; S8. Take out: take out the baked substrate and cool it; S9. Post-plating treatment: perform post-plating treatment on the surface of the substrate after the coating is completed.

[0007] In one embodiment, before step S1, a blue film needs to be screen-printed on the surface of the substrate, and then the substrate is cut, and the substrate after cutting is processed by CNC machining.

[0008] In one embodiment, before step S1, the rear substrate that has been processed by CNC machining needs to be polished, stripped and tempered, and white glass QC is performed, and silk screen printing is performed on the surface to complete step S1.

[0009] In one embodiment, the discharge port of the raw material mixing device and the feed port of the ion bombardment device used in step S2, step S3, step S4 and step S5 are interconnected, and the discharge port of the ion bombardment device is located in the vacuum chamber.

[0010] In one of the embodiments, in steps S3 and S4, a vacuum pump is connected through the vacuum chamber, and the gas pressure inside the vacuum chamber reaches below 10-2Pa when evacuating the chamber.

[0011] In one of the embodiments, in step S5, when the vacuum chamber becomes a vacuum environment, the plating material to be bombarded by ions is heated, causing its atoms or molecules to vaporize and escape from the surface to form a vapor flow, which is incident on the surface of the substrate and condensed to form a solid film.

[0012] In one embodiment, in step S7, the temperature in the baking chamber is generally maintained between 50° and 60°, and the baking time is between 1 and 2 hours.

[0013] In one of the embodiments, in step S8, when taking out the substrate from the baking chamber, it is necessary to wait for the temperature in the substrate chamber to cool down first, so that the plating vapor flow forms a solid film on the surface of the substrate and can be cooled and fixed.

[0014] In one embodiment, in step S9, the solid film formed on the surface of the substrate needs to be polished to make the surface smooth and flat.

[0015] In one embodiment, after step S9, the finished product after post-plating treatment is inspected, and those that pass the inspection are sent to the finished product transport rack.

[0016] Compared with the prior art, the present invention has at least the following advantages:

[0017] The present invention discloses a highly efficient antifouling film preparation process for an AMOLED module. Silicon compounds, carbon elements and silane group compounds are mixed in a ratio of 9.5:0.3:0.2, and sprayed on the glass cover of the AMOLED module through a coating evaporation process. The antifouling film does not contain fluorine or oil, but is actually oleophilic, so it has a very low oil contact angle. By using a completely different mechanism, the coating allows light to easily pass through fingerprint stains without refraction, so that fingerprints can be easily hidden. In addition, since the material is hydrophobic and easy to clean, its performance matches that of existing anti-fingerprint solutions, so that it will not be contaminated by fingerprints even if it is used for a long time and multiple times. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 The figure is a schematic diagram of the process for preparing the high-efficiency antifouling film for the AMOLED module of the present invention. DETAILED DESCRIPTION

[0020] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0021] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0022] Unless otherwise clearly stipulated and limited, terms such as "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0024] A process for preparing an efficient antifouling film for an AMOLED module comprises the following steps:

[0025] S1. Prepare raw materials: prepare silicon compounds, carbon elements and silane group compounds in a ratio of 9.5:0.3:0.2; before step S1, it is necessary to screen-print a blue film on the surface of the substrate, cut it, and perform CNC machining on the substrate after cutting. Before step S1, the substrate after CNC machining needs to be polished, stripped and tempered, and white glass QC is performed, and screen-printed on the surface, and then step S1 is performed after completion.

[0026] S2, mixing raw materials: mixing silicon compound, carbon element and silane group compound according to proportion and pouring into a mixer;

[0027] S3, prepare the vacuum chamber: place the substrate into the vacuum chamber;

[0028] S4, evacuating: evacuate the vacuum chamber where the substrate is placed; in steps S3 and S4, a vacuum pump is connected through the vacuum chamber, and the gas pressure inside the vacuum chamber reaches below 10-2Pa during evacuation.

[0029] S5, ion bombardment: the mixed raw materials are directly introduced into the ion bombardment device, and the atomic vapor flow is injected into the surface of the substrate; the discharge port of the raw material mixing device used in step S2, step S3, step S4 and step S5 and the feed port of the ion bombardment device are interconnected, and the discharge port of the ion bombardment device is located in the vacuum chamber. In step S5, when the vacuum chamber becomes a vacuum environment, the plating material to be bombarded by ions will be heated, so that its atoms or molecules will be vaporized and escape from the surface to form a vapor flow, which will be incident on the surface of the substrate and condensed to form a solid film.

[0030] S6, preheating: preheating the substrate sprayed with the mixed raw material;

[0031] S7, baking: placing the preheated substrate into a baking chamber for baking; in step S7, the temperature in the baking chamber is generally maintained between 50° and 60°, and the baking time is between 1 and 2 hours.

[0032] S8, take out: take out the baked substrate and cool it down; it is necessary to wait for the temperature in the substrate chamber to cool down first, so that the plating vapor can flow on the surface of the substrate to form a solid film that can be cooled and fixed.

[0033] S9, post-plating treatment: Post-plating treatment is performed on the surface of the substrate after the coating is completed. In step S9, the solid film formed on the surface of the substrate needs to be polished to make the surface smooth and flat. After step S9, the finished product after the post-plating treatment is tested, and those that pass the test are sent to the finished product transport rack.

[0034] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A process for preparing an efficient antifouling film for an AMOLED module. It is characterized in that The specific steps include: S1. Prepare raw materials: prepare silicon compound, carbon element and silane group compound in a ratio of 9.5:0.3:0.2; S2, mixing raw materials: mixing silicon compound, carbon element and silane group compound according to proportion and pouring into a mixer; S3, prepare the vacuum chamber: place the substrate into the vacuum chamber; S4, vacuuming: evacuating the vacuum chamber where the substrate is placed to a vacuum state; S5, ion bombardment: the mixed raw materials are directly introduced into the ion bombardment device, and the atomic vapor flow is injected into the surface of the substrate; S6, preheating: preheating the substrate sprayed with the mixed raw material; S7, baking: placing the preheated substrate into a baking chamber for baking; S8, taking out: taking out the substrate after baking and cooling it; S9, post-plating treatment: post-plating treatment is performed on the substrate surface after the coating is completed.

2. According to claim 1, a process for preparing an efficient antifouling film for an AMOLED module, It is characterized in that Before step S1, it is necessary to screen-print a blue film on the surface of the substrate, cut it, and perform CNC machining on the substrate after cutting.

3. The process for preparing an efficient antifouling film for an AMOLED module according to claim 1, It is characterized in that Before the S1 step, the rear substrate that has completed CNC machining needs to be polished, stripped and tempered, and white glass QC is performed, and silk screen printing is performed on its surface. After completion, the S1 step can be performed.

4. The process for preparing an efficient antifouling film for an AMOLED module according to claim 1, It is characterized in that The discharge port of the raw material mixing device and the feed port of the ion bombardment device used in step S2, step S3, step S4 and step S5 are interconnected, and the discharge port of the ion bombardment device is located in the vacuum chamber.

5. The process for preparing an efficient antifouling film for an AMOLED module according to claim 1, It is characterized in that In steps S3 and S4, a vacuum pump is connected through the vacuum chamber, and the gas pressure inside the vacuum chamber reaches below 10-2Pa when evacuating the chamber.

6. The process for preparing an efficient antifouling film for an AMOLED module according to claim 1, It is characterized in that In step S5, when the vacuum chamber becomes a vacuum environment, the plating material to be bombarded by ions will be heated, causing its atoms or molecules to vaporize and escape from the surface to form a vapor flow, which is incident on the surface of the substrate and condensed to form a solid film.

7. The process for preparing an efficient antifouling film for an AMOLED module according to claim 1, It is characterized in that In step S7, the temperature in the baking chamber is generally maintained between 50° and 60°, and the baking time is between 1 and 2 hours.

8. The process for preparing an efficient antifouling film for an AMOLED module according to claim 1, It is characterized in that In step S8, when taking out the substrate from the baking chamber, it is necessary to wait for the temperature in the substrate chamber to cool down first, so that the plating vapor can flow on the surface of the substrate to form a solid film that can be cooled and fixed.

9. The process for preparing an efficient antifouling film for an AMOLED module according to claim 1, It is characterized in that In step S9, the solid film formed on the surface of the substrate needs to be polished to make the surface smooth and flat.

10. The process for preparing an efficient antifouling film for an AMOLED module according to claim 1, It is characterized in that After step S9, the finished products after post-plating treatment are inspected, and those that pass the inspection are sent to the finished product transport rack.

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