Substrate for foreign matter adhesion inspection, foreign matter adhesion inspection device, and foreign matter adhesion inspection method

Abstract

This substrate for foreign matter adhesion inspection is provided with a first conductor layer, and an insulating layer provided on the first conductor layer, the insulating layer being thinner than a foreign matter to be inspected.

Description

Technical Field

[0001] The present disclosure relates to a substrate for inspecting foreign matter adhesion, a foreign matter adhesion inspection device, and a foreign matter adhesion inspection method. Background Art

[0002] Japanese Patent Document 1 discloses a chip moving and loading device, which includes: a workbench on which a wafer divided into a plurality of chips is loaded and which can be moved in the X direction and the Y direction; and a chuck which picks up each chip from the wafer loaded on the workbench and which can be moved in the Z direction. The chuck is monitored by an image on a monitor. Thus, it is possible to prevent damage or breakage of the chip that may be caused by damage to the chuck itself or foreign matter attached to the chuck in advance.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2008-135455

[0004] Generally, in the assembly process of semiconductor devices, after the semiconductor wafer is patterned, the semiconductor wafer is physically separated into chips in a dicing process or the like. The separated semiconductor chips are picked up by a chuck called a die chuck in the chip bonding process and mounted on a package or the like. Thereafter, in the wire bonding process, the semiconductor chip is connected to the circuit on the package. In this way, electrical connection can be made from the external terminal of the package to the semiconductor chip.

[0005] When foreign matter is attached to the surface of the die chuck that attracts the semiconductor chip, the foreign matter may damage the semiconductor chip. Specifically, there may be impurity contamination caused by the foreign matter attached to the semiconductor chip, and dislocation or defects in the surface layer caused by the stress when the foreign matter is physically pressed into the semiconductor chip.

[0006] In Patent Document 1, a camera is used to monitor foreign matter attached to a die chuck. In this case, the foreign matter may be difficult to detect due to its color. Summary of the invention

[0007] An object of the present disclosure is to obtain a foreign matter adhesion inspection substrate, a foreign matter adhesion inspection device, and a foreign matter adhesion inspection method that can alleviate the restriction due to the color of the foreign matter.

[0008] A foreign matter attachment inspection substrate disclosed in the first disclosure includes: a first conductor layer; and an insulating layer provided on the first conductor layer, wherein the insulating layer is thinner than a foreign matter to be detected.

[0009] A foreign matter attachment inspection substrate disclosed in the second disclosure includes: an insulating layer; and a linear conductor pattern provided on the insulating layer, the conductor pattern being thinner than a foreign matter to be detected.

[0010] A foreign matter attachment inspection substrate disclosed in the third disclosure includes: an insulating layer; and a plurality of conductor layers provided adjacent to each other on an upper surface of the insulating layer, wherein a distance between the plurality of conductor layers is smaller than a foreign matter to be detected.

[0011] In the fourth disclosed method for inspecting foreign matter attachment, after the picking-up surface of the die chuck is brought into contact with the upper surface of the second conductor layer in a substrate for inspecting foreign matter attachment, the physical quantity between the first conductor layer and the second conductor layer is measured. The substrate for inspecting foreign matter attachment comprises: a first conductor layer, an insulating layer arranged on the first conductor layer, and a second conductor layer arranged on the insulating layer. Whether there is foreign matter attached to the picking-up surface is determined based on the physical quantity.

[0012] In the fifth disclosed method for inspecting foreign matter attachment, a physical quantity between the conductor layer and the pick-up surface is measured while a pick-up surface formed by a conductor of a die chuck is in contact with an upper surface of an insulating layer in a substrate for inspecting foreign matter attachment. The substrate for inspecting foreign matter attachment comprises: the conductor layer, and the insulating layer arranged on the conductor layer, and whether or not foreign matter is attached to the pick-up surface is determined based on the physical quantity.

[0013] In the sixth disclosed method for inspecting foreign matter attachment, after the picking-up surface of the die chuck is brought into contact with the upper surface of a conductor pattern in a substrate for inspecting foreign matter attachment, the physical quantity between one side and the other side of the portion of the conductor pattern contacted by the die chuck is measured. The substrate for inspecting foreign matter attachment comprises: an insulating layer, and a linear conductor pattern arranged on the insulating layer, and whether there is foreign matter attached to the picking-up surface is judged based on the physical quantity.

[0014] In the seventh disclosed foreign matter attachment inspection method, after the picking-up surface of the die chuck is brought into contact with the upper surface of a plurality of conductor patterns in a substrate for foreign matter attachment inspection, the physical quantity between the plurality of conductor patterns is measured. The substrate for foreign matter attachment inspection comprises: an insulating layer, and the plurality of conductor patterns arranged on the insulating layer, and whether or not foreign matter is attached to the picking-up surface is judged based on the physical quantity.

[0015] In the eighth disclosed method for inspecting foreign matter attachment, after the picking surface of the die chuck is brought into contact with the first and second parts of a substrate for inspecting foreign matter attachment, the physical quantity between one side and the other side of the part contacted by the die chuck in the conductor pattern is measured. The substrate for inspecting foreign matter attachment comprises: an insulating layer, and the conductor pattern having a first part and a second part which are bent on the upper surface of the insulating layer and are adjacent to each other. Whether there is foreign matter attached to the picking surface is determined based on the physical quantity.

[0016] In the foreign matter adhesion inspection substrate and foreign matter adhesion inspection method disclosed in the first to eighth aspects, it is possible to determine whether foreign matter is attached to the die chuck based on the change in physical quantity caused by bringing the die chuck into contact with the foreign matter adhesion inspection substrate. Therefore, it is possible to alleviate the restriction due to the color of the foreign matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a side view of the foreign matter adhesion inspection device according to the first embodiment.

[0018] Figure 2 This is a diagram for explaining the die chuck according to the first embodiment.

[0019] Figure 3 This is a diagram for explaining the pickup surface of the first embodiment.

[0020] Figure 4 It is a side view of the foreign matter adhesion inspection device according to the second embodiment.

[0021] Figure 5 It is a top view of the foreign matter adhesion inspection device according to the second embodiment.

[0022] Figure 6 This is a diagram for explaining the pickup surface of the second embodiment.

[0023] Figure 7 It is a side view of the foreign matter adhesion inspection device according to the third embodiment.

[0024] Figure 8 It is a top view of the foreign matter adhesion inspection device according to the third embodiment.

[0025] Fig. 9 It is a side view of the foreign matter adhesion inspection device of Embodiment 4.

[0026] Fig.10 It is a top view of the foreign matter adhesion inspection device according to the fourth embodiment.

[0027] Fig.11 It is a side view of the foreign matter adhesion inspection device of Embodiment 5.

[0028] Fig.12 It is a top view of the foreign matter adhesion inspection device according to the fifth embodiment.

[0029] Fig.13 It is a top view of the foreign matter adhesion inspection device according to a modified example of the fifth embodiment. DETAILED DESCRIPTION

[0030] The foreign matter adhesion inspection substrate, foreign matter adhesion inspection device, and foreign matter adhesion inspection method according to each embodiment will be described with reference to the drawings. The same or corresponding components are denoted by the same reference numerals and repeated descriptions are omitted.

[0031] Implementation method 1.

[0032] Figure 1 1 is a side view of a foreign matter attachment inspection device 100 according to Embodiment 1. The foreign matter attachment inspection device 100 includes a foreign matter attachment inspection substrate 10 and a measuring device 40. The foreign matter attachment inspection substrate 10 includes an insulating substrate 12, a conductor layer 14 provided on the insulating substrate 12, an insulating layer 16 provided on the conductor layer 14, and a conductor layer 18 provided on the insulating layer 16. The insulating layer 16 is thinner than the foreign matter 50 to be detected. The measuring device 40 is connected to the conductor layer 14 and the conductor layer 18. The measuring device 40 measures the physical quantity between the conductor layer 14 and the conductor layer 18.

[0033] The insulating substrate 12 is, for example, a glass epoxy substrate or a ceramic substrate. The conductor layer 14 is a conductive resistor, and is a thin plate or a film. The conductor layer 14 is preferably formed of a metal such as copper, gold, or aluminum. The conductor layer 14 is not limited to these, and any conductor layer 14 may be used as long as the resistance value is known.

[0034] The conductor layer 18 is a conductive resistor. The conductor layer 18 is preferably a thin film formed of a soft metal such as copper, gold, or aluminum so that it is deformed or disconnected by the pressing of the foreign matter 50 and the die chuck 30. The conductor layer 18 is not limited to this, and the conductor layer 18 can be any as long as the resistance value is known. The thickness of the conductor layer 18 is not limited, but is, for example, several tens of μm to several hundred μm.

[0035] The insulating layer 16 is a very thin film that is easily deformed by the foreign matter 50. The conductor layer 14 and the conductor layer 18 are electrically connected due to the deformation of the insulating layer 16. The material of the insulating layer 16 is not limited, but for example, it can be a rubber-based film such as nitrile, silicone, polyurethane, a vinyl-based film, or an organic-based film such as a polyester film.

[0036] Figure 2 This is a diagram for explaining the die chuck 30 according to the first embodiment. Figure 3 This is a diagram for explaining the pickup surface 32 of Embodiment 1. The die chuck 30 has a function of adsorbing the semiconductor chip 60 picked up by the ejector pin or the like in the chip bonding process and transporting the semiconductor chip 60 to a package such as a lead frame. The die chuck 30 may also have a function of pressing and wiping the semiconductor chip 60 during chip bonding.

[0037] The die chuck 30 is formed of ceramics such as zirconium oxide or ruby. The surface of the die chuck 30 that contacts the conductor chip 60 is called the pickup surface 32. A suction port 34 is formed on the pickup surface 32. The suction port 34 passes through the inside of the die chuck 30. In the chip bonding process, vacuum is drawn from the suction port 34 in the direction indicated by the arrow 81, so that the semiconductor chip 60 is adsorbed and held by the pickup surface 32. In this way, the semiconductor chip 60 can be moved and loaded. In addition, the shape of the front end of the die chuck 30 is not limited to a truncated pyramid or a truncated cone. In addition, the shape of the pickup surface 32 is not limited to a flat one.

[0038] Next, the foreign matter adhesion inspection method of the present embodiment will be described. First, before the die chuck 30 is brought into contact with the foreign matter adhesion inspection substrate 10 , the resistance value between the conductor layer 14 and the conductor layer 18 is measured by the measuring instrument 40 .

[0039] Next, the pickup surface 32 of the female die chuck 30 is brought into contact with the upper surface of the conductor layer 18 in the foreign matter adhesion inspection substrate 10. At this time, the pickup surface 32 is pressed against the upper surface of the conductor layer 18 in parallel. Figure 1 The figure shows a state where the die chuck 30 with foreign matter 50 attached to the pickup surface 32 is pressed against the substrate 10 for foreign matter attachment inspection. At this time, the die chuck 30 is not evacuated. The relative positions of the die chuck 30 and the substrate 10 for foreign matter attachment inspection are fixed, for example, with the upper surface of the conductor layer 18 as a reference surface, and the height of the pickup surface 32 is consistent with the reference surface. As means for detecting the height of the die chuck 30 and the parallelism with the substrate surface, there are appearance inspections using current sensors, pressure sensors, cameras, etc.

[0040] After the die chuck 30 is brought into contact with the substrate 10 for inspecting foreign matter attachment, the resistance value between the conductor layer 14 and the conductor layer 18 is measured by the measuring device 40. When the foreign matter 50 is attached to the die chuck 30, a load is locally applied to the portion of the substrate 10 for inspecting foreign matter attachment that is directly below the foreign matter 50. Therefore, the conductor layer 18 is deformed by the foreign matter 50, and the insulating layer 16 is destroyed. As a result, the conductor layer 14 and the conductor layer 18 are short-circuited. Therefore, the resistance value between the conductor layer 14 and the conductor layer 18 changes before and after the contact of the die chuck 30.

[0041] As described above, the height of the die chuck 30 is controlled, so the insulating layer 16 is not damaged when the foreign matter 50 is not attached to the pickup surface 32. As a result, since there is no physical change in the foreign matter attachment inspection substrate 10 due to the contact of the die chuck 30, the resistance value between the conductor layer 14 and the conductor layer 18 does not change.

[0042] Next, the resistance values ​​of the die chuck 30 before and after the contact are compared. Whether or not a foreign object is attached to the pickup surface 32 is determined based on the resistance value between the conductor layer 14 and the conductor layer 18. In the absence of the foreign object 50, the resistance value between the conductor layer 14 and the conductor layer 18 is an open circuit, but in the presence of the foreign object 50, the resistance value between the conductor layer 14 and the conductor layer 18 becomes a short circuit. The measuring device 40 determines whether or not the conductor layer 14 and the conductor layer 18 are short-circuited.

[0043] The foreign matter 50 is a tiny fragment, such as metals such as gold, copper, platinum, or organic matter such as human body foreign matter. The size of the foreign matter 50 is not limited, but for example, it is in the range of several μm to several mm. If the semiconductor chip 60 is picked up with the foreign matter 50 attached to the pick-up surface 32, the picked-up semiconductor chip 60 may be damaged or contaminated by the foreign matter 50. Such a semiconductor chip 60 is judged to have poor characteristics or poor appearance and cannot be used as a product.

[0044] In contrast, in the present embodiment, it is possible to determine whether or not a foreign object 50 is attached to the die chuck 30 based on the change in resistance value caused by contacting the die chuck 30 with the substrate 10 for foreign object attachment inspection. In addition, compared with the case of detecting the foreign object 50 using a camera, the foreign object 50 can be detected regardless of the color of the foreign object 50, and the restriction due to the color of the foreign object 50 can be alleviated. Moreover, in the present embodiment, the foreign object 50 can be detected regardless of whether it is conductive or non-conductive. In addition, the thickness of the insulating layer 16 can be set according to the assumed foreign object 50, and the restriction due to the size of the foreign object 50 can also be alleviated.

[0045] In the present embodiment, the presence or absence of the foreign matter 50 is determined based on the resistance value. Without limitation to this, the physical quantity measured by the measuring device 40 is not limited to the resistance value as long as it can determine the short circuit between the conductor layer 14 and the conductor layer 18. In addition, the measurement of the physical quantity between the conductor layer 14 and the conductor layer 18 after the die chuck 30 is brought into contact with the substrate 10 for foreign matter adhesion inspection can be performed in a state where the die chuck 30 is separated from the substrate 10 for foreign matter adhesion inspection, or in a state where it is in contact. In addition, whether the conductor layer 14 and the conductor layer 18 are short-circuited can be determined by the measuring device 40, or it can be determined by a person based on the measured value.

[0046] The above-mentioned deformation can be appropriately applied to the foreign matter attachment inspection substrate, foreign matter attachment inspection device and foreign matter attachment inspection method of the following embodiments. In addition, since the foreign matter attachment inspection substrate, foreign matter attachment inspection device and foreign matter attachment inspection method of the following embodiments have many similarities with embodiment 1, the description will be centered on the differences from embodiment 1.

[0047] Implementation method 2.

[0048] Figure 4 It is a side view of the foreign matter adhesion inspection device 200 according to the second embodiment. Figure 5 It is a top view of the foreign matter adhesion inspection device 200 according to the second embodiment. Figure 6 1 is a diagram for explaining the pickup surface 32 of Embodiment 2. The foreign matter attachment inspection device 200 includes a foreign matter attachment inspection substrate 210 and a measuring device 40. The structure of the foreign matter attachment inspection substrate 210 is the same as that of the foreign matter attachment inspection substrate 10, except that the conductor layer 18 is not provided. The foreign matter attachment inspection substrate 210 includes an insulating substrate 12, a conductor layer 14 provided on the insulating substrate 12, and an insulating layer 16 provided on the conductor layer 14. The insulating layer 16 is thinner than the foreign matter 50 to be detected.

[0049] The die chuck 230 includes a conductor portion 236. The conductor portion 236 includes at least a pickup surface 32 and is provided at a front end portion of the die chuck 230. The other structures of the die chuck 230 are the same as those of the die chuck 30.

[0050] The measuring device 40 measures the physical quantity between the conductor layer 14 and the conductor portion 236 of the die chuck 230. The measuring device 40 has a function of measuring the electrostatic capacitance in addition to the resistance value.

[0051] First, before the die chuck 230 is brought into contact with the foreign matter adhesion inspection substrate 210 , the resistance value and the electrostatic capacitance are measured as physical quantities between the conductor layer 14 and the conductor layer 18 by the measuring device 40 .

[0052] Next, the resistance and capacitance between the conductor layer 14 and the pickup surface 32 are measured while the pickup surface 32 of the die chuck 230 is in contact with the upper surface of the insulating layer 16. The presence or absence of foreign matter attached to the pickup surface 32 is determined based on the resistance and capacitance.

[0053] When the die chuck 230 with the foreign matter 50 attached is used, the insulating layer 16 is destroyed by the foreign matter 50. As a result, the conductor layer 14 is connected to the conductor portion 236 via the foreign matter 50. When the foreign matter 50 is conductive, the conductor layer 14 and the conductor portion 236 are short-circuited. In contrast, when there is no foreign matter 50, the conductor layer 14 and the conductor portion 236 are open-circuited. The measuring device 40 measures the resistance value between the conductor layer 14 and the conductor portion 236, and compares the resistance values ​​of the die chuck 230 before and after the contact. As a result, the measuring device 40 determines whether the conductor layer 14 and the conductor portion 236 are short-circuited. Therefore, it is possible to determine whether there is a foreign matter 50 attached to the pickup surface 32.

[0054] In addition, when the foreign matter 50 is an insulator, the conductor layer 14, the insulating layer 16, the foreign matter 50, and the conductor portion 236 form a capacitor. Depending on the presence or absence of the foreign matter 50, the interval between the conductor layer 14 and the conductor portion 236 changes, and thus the capacitance value of the capacitor changes. The measuring device 40 measures the capacitance value between the conductor layer 14 and the conductor portion 236, and compares the capacitance values ​​of the die chuck 230 before and after contact. Therefore, it is possible to determine whether the foreign matter 50 is attached to the pickup surface 32.

[0055] In this embodiment, the conductor layer 18 is not provided, and the conductor portion 236 is provided on the die chuck 230. Therefore, only the conductor layer 14 of the substrate 10 for inspecting foreign matter attachment is electrically connected, and it can be single-polarized. Alternatively, the conductor layer 14 can also be electrically connected to the GND wiring provided in the housing or the like. In this way, the structure and electrical connection of the substrate 10 for inspecting foreign matter attachment can be simplified.

[0056] The physical quantity measured by the measuring device 40 is not limited to resistance and capacitance as long as it can determine whether the conductor layer 14 and the conductor part 236 are short-circuited or whether there is an insulating foreign object 50 between the conductor layer 14 and the conductor part 236. For example, the measuring device 40 may detect changes in the amount of electric charge.

[0057] Implementation method 3.

[0058] Figure 7 It is a side view of the foreign matter adhesion inspection device 300 according to the third embodiment. Figure 8 1 is a top view of a foreign matter attachment inspection device 300 according to Embodiment 3. The foreign matter attachment inspection device 300 includes a foreign matter attachment inspection substrate 310 and a measuring device 40. The foreign matter attachment inspection substrate 310 includes an insulating substrate 12, an insulating layer 16 provided on the insulating substrate 12, and a plurality of linear conductor patterns 318 provided on the insulating layer 16. The material of the insulating substrate 12 is the same as that of Embodiment 1. The die chuck 30 is the same as the die chuck 30 of Embodiment 1.

[0059] Each conductor pattern 318 is thinner than the foreign object 50 to be detected, and thinner than the foreign object 50. The interval between the plurality of conductor patterns 318 is larger than the radius of the pickup surface 32 of the female chuck 30, for example.

[0060] The measuring device 40 measures the physical quantity between one side and the other side of the portion of the conductor pattern 318 that is in contact with the die chuck 30. The measuring device 40 is connected to both ends of the conductor pattern 318, for example.

[0061] Next, the foreign matter attachment inspection method of the present embodiment is described. First, before the die chuck 30 is brought into contact with the foreign matter attachment inspection substrate 310, the resistance value of the conductor pattern 318 is measured by the measuring device 40. Next, the pick-up surface 32 of the die chuck 30 is brought into contact with the upper surface of the conductor pattern 318 in the foreign matter attachment inspection substrate 310. After that, the resistance value between one side and the other side of the portion of the conductor pattern 318 that the die chuck 30 has contacted is measured by the measuring device 40, and whether there is foreign matter attached to the pick-up surface 32 is determined based on the resistance value.

[0062] When the foreign matter 50 is attached to the die chuck 30, a load is locally applied to the portion of the conductor pattern 318 directly below the foreign matter 50, and the conductor pattern 318 is physically disconnected. As a result, the resistance value of the conductor pattern 318 changes before and after the contact of the die chuck 30. When there is no foreign matter 50, the resistance value of the conductor pattern 318 is a short circuit, but when there is a foreign matter 50, the resistance value of the conductor pattern 318 becomes an open circuit. The measuring device 40 determines whether the conductor pattern 318 is disconnected.

[0063] In this embodiment, the conductor pattern 318 only needs to be one layer, and it is not necessary to electrically connect to the die chuck 30, so the foreign matter adhesion inspection device 300 can be simplified. In addition, by forming a plurality of conductor patterns 318 at intervals wider than the radius of the pickup surface 32, it is possible to change the connection of the measuring device 40 and perform multiple inspections. Therefore, the running cost can be reduced.

[0064] In addition, by disposing a soft insulating layer 16 under the conductor pattern 318, the conductor pattern 318 can be easily broken, and the detection sensitivity can be improved. Therefore, the thickness of the insulating layer 16 of this embodiment can also be thicker than the insulating layer 16 of Embodiment 1. In addition, when the insulating substrate 12 is made flexible or elastic, the insulating layer 16 can also be omitted.

[0065] The number of conductor patterns 318 is not limited, and more than one conductor pattern may be used. In addition, in the present embodiment, the presence or absence of foreign matter 50 is determined based on the resistance value. However, the present embodiment is not limited thereto, and the physical quantity measured by the measuring device 40 is not limited to the resistance value as long as it can determine the disconnection of the conductor pattern 318. In addition, the measurement of the physical quantity of the conductor pattern 318 after the foreign matter attachment inspection substrate 310 and the die chuck 30 are brought into contact can be performed in a state where the foreign matter attachment inspection substrate 310 and the die chuck 30 are separated or in a state where they are in contact.

[0066] As a variation of this embodiment, the conductor pattern 318 only needs to be thinner than the foreign matter to be detected, and does not need to be thinner than the foreign matter 50. In this case, a hole or other defect is formed in the conductor pattern 318 due to the foreign matter 50, thereby causing a slight change in the resistance value of the conductor pattern 318. Therefore, it is possible to determine whether the foreign matter 50 is attached to the pickup surface 32.

[0067] Implementation method 4.

[0068] Fig. 9 It is a side view of the foreign matter adhesion inspection device 400 according to the fourth embodiment. Fig.10 It is a top view of a foreign matter attachment inspection device 400 of Embodiment 4. The foreign matter attachment inspection device 400 includes a foreign matter attachment inspection substrate 410 and a measuring device 40. The foreign matter attachment inspection substrate 410 includes: an insulating substrate 12, and a plurality of conductor layers disposed adjacent to each other on the upper surface of the insulating substrate 12. The plurality of conductor layers are a plurality of conductor patterns 418a, 418b disposed separately on the insulating substrate 12. The measuring device 40 measures the physical quantity between the plurality of conductor patterns 418a, 418b. The material of the insulating substrate 12 is the same as that of Embodiment 1. The die chuck 30 is the same as the die chuck 30 of Embodiment 1.

[0069] The plurality of conductor patterns 418a, 418b are, for example, strip-shaped. The intervals between the plurality of conductor patterns 418a, 418b are smaller than the foreign matter 50 to be detected. The conductor patterns 418a, 418b are thin plates or films having conductivity. The conductor patterns 418a, 418b are preferably made of metals such as copper, gold, and aluminum. The material of the conductor patterns 418a, 418b is not limited as long as the resistance value is known.

[0070] First, before the die chuck 30 is brought into contact with the substrate 410 for inspecting foreign matter adhesion, the resistance value and the electrostatic capacitance are measured by the measuring device 40 as physical quantities between the plurality of conductor patterns 418a and 418b.

[0071] Next, after the pick-up surface 32 of the die chuck 30 is brought into contact with the upper surfaces of the plurality of conductor patterns 418a, 418b in the foreign matter attachment inspection substrate 410, the resistance value and electrostatic capacitance between the plurality of conductor patterns 418a, 418b are measured by the measuring device 40. Whether or not foreign matter is attached to the pick-up surface 32 is determined based on the resistance value and electrostatic capacitance.

[0072] When the die chuck 30 with the foreign matter 50 attached is used, the plurality of conductor patterns 418a and 418b are connected due to the foreign matter 50. When the foreign matter 50 is conductive, the conductor patterns 418a and 418b are short-circuited. In contrast, when there is no foreign matter 50, the conductor patterns 418a and 418b are open-circuited. The measuring device 40 measures the resistance value between the conductor patterns 418a and 418b and compares the resistance values ​​before and after the contact of the die chuck 30. Thus, the measuring device 40 determines whether the conductor patterns 418a and 418b are short-circuited. Therefore, it is possible to determine whether there is a foreign matter 50 attached to the pickup surface 32.

[0073] In addition, when the foreign matter 50 is an insulator, the conductor pattern 418a, the foreign matter 50, and the conductor pattern 418b form a capacitor. The capacitance value of the capacitor changes according to the presence or absence of the foreign matter 50. The measuring device 40 measures the capacitance value between the conductor patterns 418a and 418b, and compares the capacitance values ​​before and after the contact of the die chuck 230. Therefore, it is possible to determine whether the foreign matter 50 is attached to the pickup surface 32.

[0074] In this embodiment, when the foreign object 50 is conductive, the measurement device 40 detects the change from an open circuit to a short circuit between the conductor patterns 418a and 418b. In contrast, in Embodiment 3, the change from a short circuit to an open circuit is detected. Compared with Embodiment 3, in this embodiment, it is possible to suppress the opening between electrodes due to poor contact of the circuit or the erroneous detection due to a voltage drop. Therefore, the detection sensitivity of the measurement device 40 can be reduced and the foreign object 50 can be detected at a high speed. Therefore, the inspection time can be shortened.

[0075] In this embodiment, the conductor patterns 418a and 418b only need to be one layer, and there is no need to electrically connect them to the die chuck 30, so that the foreign matter adhesion inspection device 400 can be simplified. In addition, by arranging the conductor patterns 418a and 418b in parallel, the conductor patterns 418a and 418b can be connected to the electrodes of the measuring device 40 on one side of the foreign matter adhesion inspection substrate 410. Therefore, the wiring of the measuring device 40 can be shortened, and the foreign matter adhesion inspection device 400 can be miniaturized.

[0076] The number of conductor patterns 418a and 418b is not limited, and may be three or more. The narrower the line width and line interval of conductor patterns 418a and 418b, the smaller the foreign matter 50 can be detected. In addition, conductor patterns 418a and 418b are not limited to linear shapes, and may be adjacently arranged at intervals smaller than the foreign matter 50.

[0077] The physical quantity measured by the measuring device 40 is not limited to the resistance value and the electrostatic capacitance as long as it can determine whether the conductor patterns 418a and 418b are short-circuited or whether there is an insulating foreign object 50 between the conductor patterns 418a and 418b. In addition, the measurement of the physical quantity between the conductor patterns 418a and 418b after the die chuck 30 and the foreign object attachment inspection substrate 410 are brought into contact can be performed in a state where the foreign object attachment inspection substrate 410 and the die chuck 30 are separated or in a state where they are in contact.

[0078] Implementation method 5.

[0079] Fig.11 It is a side view of the foreign matter adhesion inspection device 500 according to the fifth embodiment. Fig.12 1 is a top view of a foreign matter attachment inspection device 500 according to Embodiment 5. The foreign matter attachment inspection device 500 includes a foreign matter attachment inspection substrate 510 and a measuring device 40. The foreign matter attachment inspection substrate 510 includes an insulating substrate 12 and a conductor pattern 518 bent and provided on the upper surface of the insulating substrate 12. The material of the insulating substrate 12 is the same as that of Embodiment 1. The die chuck 30 is the same as the die chuck 30 of Embodiment 1.

[0080] The conductor pattern 518 is, for example, a meander shape. The conductor pattern 518 includes a first portion 518a and a second portion 518b adjacent to each other. The interval between the first portion 518a and the second portion 518b is smaller than the foreign body 50 to be detected. The interval between the first portion 518a and the second portion 518b may also be constant. The first portion 518a and the second portion 518b correspond to a plurality of conductor layers adjacent to each other on the upper surface of the insulating substrate 12.

[0081] The measuring device 40 measures a physical quantity between one side and the other side of the portion of the conductor pattern 518 that is in contact with the die chuck 30. The measuring device 40 is connected to both ends of the conductor pattern 518, for example, to measure the resistance value of the conductor pattern 518 at both ends.

[0082] Next, the foreign matter attachment inspection method of the present embodiment is described. First, before the die chuck 30 is brought into contact with the foreign matter attachment inspection substrate 510, the resistance value of the conductor pattern 518 is measured by the measuring device 40. Next, the pick-up surface 32 of the die chuck 30 is brought into contact with the first portion 518a and the second portion 518b of the foreign matter attachment inspection substrate 510. After that, the resistance value between one side and the other side of the portion of the conductor pattern 518 contacted by the die chuck 30 is measured by the measuring device 40, and whether there is foreign matter 50 attached to the pick-up surface 32 is determined based on the resistance value.

[0083] When the foreign matter 50 is attached to the die chuck 30, the first portion 518a and the second portion 518b are connected by the foreign matter 50. Thus, when the foreign matter 50 is conductive, the resistance value of the conductor pattern 518 changes before and after the contact of the die chuck 30. Therefore, it is possible to determine whether the foreign matter 50 is attached to the pickup surface 32. The resistance value of the conductor pattern 518 can be several hundred KΩ to several tens of MΩ in the absence of the foreign matter 50. Thus, it is possible to use a commonly available measuring instrument 40.

[0084] In this embodiment, the conductor pattern 518 only needs to be one layer, and it is not necessary to be electrically connected to the die chuck 30, so the foreign matter attachment inspection device 500 can be simplified. In addition, in this embodiment, since a plurality of portions adjacent to the conductor pattern 518 can be formed, the foreign matter 50 can be detected in a wider range than in Embodiment 4. In addition, even if the conductor pattern 518 is partially short-circuited by the foreign matter 50, the foreign matter 50 can be detected through other portions. Therefore, the foreign matter attachment inspection device 500 can be used over a long period of time or multiple times, and the material cost of the conductor pattern 518 can be reduced.

[0085] The conductor pattern 518 is not limited to a meander shape, as long as it has a first portion 518a and a second portion 518b adjacent to each other. The narrower the line width and line spacing of the conductor pattern 518, the smaller the foreign matter 50 can be detected. As long as the connection between the first portion 518a and the second portion 518b caused by the foreign matter 50 can be determined, the physical quantity measured by the measuring device 40 is not limited to the resistance value. In addition, the measurement of the physical quantity of the conductor pattern 518 after the foreign matter attachment inspection substrate 510 is brought into contact with the die chuck 30 can be carried out in a state where the foreign matter attachment inspection substrate 510 and the die chuck 30 are separated, or can be carried out in a state where they are in contact.

[0086] Fig.13 1 is a top view of a foreign matter adhesion inspection device 500 according to a modified example of the fifth embodiment. Fig.12 In the case where the foreign body 50 connects the first part 518a and the second part 518b, even if Fig.13 In the case where the foreign matter 50 is placed on the conductor pattern 518, the foreign matter 50 can also be detected. In this case, as in the third embodiment, the conductor pattern 518 only needs to be thinner than the foreign matter 50. In addition, the conductor pattern 518 can also be thinner than the foreign matter 50. Due to the foreign matter 50, defects such as holes or broken wires are formed in the conductor pattern 518, so that the resistance value of the conductor pattern 518 changes. Therefore, it is possible to determine whether the foreign matter 50 is attached to the pickup surface 32.

[0087] According to the modified example, the foreign matter 50 can be detected at any position on the conductor pattern 518. In this case, the position accuracy of the die chuck 30 only needs to be strictly managed in the Z direction, and the position in the X and Y directions only needs to be limited to the range that does not deviate from the conductor pattern 518. Therefore, the detection time can be shortened and the operation cost can be reduced.

[0088] In addition, the foreign matter attachment inspection substrate 510 may include an insulating layer 16 between the insulating substrate 12 and the conductive pattern 518 as in Embodiment 3. By disposing a soft insulating layer 16 under the conductive pattern 518, the conductive pattern 518 can be easily broken, and the detection sensitivity of the defect of the conductive pattern 518 can be improved.

[0089] The technical features described in each embodiment can be used in combination as appropriate. In addition, the present disclosure is not limited to the above-mentioned embodiment, and modifications can be made within the scope that does not depart from the gist of the present disclosure.

[0090] Description of reference numerals:

[0091] 10…substrate for checking foreign matter adhesion; 12…insulating substrate; 14…conductive layer; 16…insulating layer; 18…conductive layer; 30…die chuck; 32…pick-up surface; 34…suction port; 40…measuring device; 50…foreign matter; 60…semiconductor chip; 100…foreign matter adhesion inspection device; 200…foreign matter adhesion inspection device; 210…substrate for checking foreign matter adhesion; 230…die chuck; 236…conductive part; 300…foreign matter adhesion inspection device; 310…substrate for checking foreign matter adhesion; 318…conductive pattern; 400…foreign matter adhesion inspection device; 410…substrate for checking foreign matter adhesion; 418a…conductive pattern; 418b…conductive pattern; 500…foreign matter adhesion inspection device; 510…substrate for checking foreign matter adhesion; 518…conductive pattern; 518a…first part; 518b…second part.

Claims

1. A substrate for inspecting foreign matter adhesion, characterized in that: have: a first conductor layer; and an insulating layer, which is disposed on the first conductor layer, The insulating layer is thinner than the foreign matter to be detected.

2. The foreign matter attachment inspection substrate according to claim 1, characterized in that: A second conductive layer is provided on the insulating layer.

3. A substrate for inspecting foreign matter adhesion, characterized in that: have: Insulation; and A linear conductor pattern is disposed on the insulating layer, The conductor pattern is thinner than the foreign object to be detected.

4. A substrate for inspecting foreign matter adhesion, characterized in that: have: Insulation; and A plurality of conductor layers are disposed adjacent to each other on the upper surface of the insulating layer, The intervals between the plurality of conductor layers are smaller than the foreign matter to be detected.

5. The foreign matter attachment inspection substrate according to claim 4, characterized in that: The plurality of conductor layers are a plurality of conductor patterns individually provided on the insulating layer.

6. The foreign matter attachment inspection substrate according to claim 4, characterized in that: The plurality of conductor layers are first and second portions of a conductor pattern that is bent and provided on the upper surface of the insulating layer.

7. A foreign matter attachment inspection device, characterized in that: have: The foreign matter attachment inspection substrate according to claim 2; and A measuring device measures a physical quantity between the first conductive layer and the second conductive layer.

8. The foreign matter adhesion inspection device according to claim 7, characterized in that: The insulating layer is a rubber-based, vinyl-based or organic-based film.

9. The foreign matter adhesion inspection device according to claim 7 or 8, characterized in that: The measuring device measures the resistance value between the first conductor layer and the second conductor layer, and determines whether the first conductor layer and the second conductor layer are short-circuited.

10. A foreign matter adhesion inspection device, characterized in that: have: The foreign matter attachment inspection substrate according to claim 1; and a measuring device for measuring a physical quantity between the first conductor layer and the conductor portion of the die chuck, The insulating layer is thinner than the foreign matter to be detected.

11. The foreign matter adhesion inspection device according to claim 10, characterized in that: The insulating layer is a rubber-based, vinyl-based or organic-based film.

12. The foreign matter adhesion inspection device according to claim 10 or 11, characterized in that: The measuring device measures the resistance value between the first conductor layer and the conductor portion, and determines whether there is a short circuit between the first conductor layer and the conductor portion.

13. The foreign matter adhesion inspection device according to any one of claims 10 to 12, characterized in that: The measuring device measures a capacitance value between the first conductor layer and the conductor portion.

14. A foreign matter attachment inspection device, characterized in that: have: The foreign matter attachment inspection substrate according to claim 3; and A measuring device measures a physical quantity between one side and the other side of a portion of the conductor pattern that is in contact with the die chuck.

15. The foreign matter adhesion inspection device according to claim 14, characterized in that: The conductor pattern is thinner than the foreign matter.

16. The foreign matter adhesion inspection device according to claim 14 or 15, characterized in that: The measuring device measures the resistance value of the conductor pattern and determines whether the conductor pattern is broken.

17. The foreign matter adhesion inspection device according to any one of claims 14 to 16, characterized in that: A plurality of the conductor patterns are provided, The intervals between the plurality of conductor patterns are larger than the radius of the pickup surface of the die chuck.

18. A foreign matter attachment inspection device, characterized in that: have: The foreign matter attachment inspection substrate according to claim 5; and A measuring device measures a physical quantity between the plurality of conductor patterns.

19. The foreign matter adhesion inspection device according to claim 18, characterized in that: The measuring device measures the resistance value between the plurality of conductor patterns and determines whether there is a short circuit between the plurality of conductor patterns.

20. The foreign matter adhesion inspection device according to claim 18 or 19, characterized in that: The measuring device measures a capacitance value between the plurality of conductor patterns.

21. A foreign matter attachment inspection device, characterized in that: have: The foreign matter attachment inspection substrate according to claim 6; and A measuring device measures a physical quantity between one side and the other side of a portion of the conductor pattern that is in contact with the die chuck.

22. The foreign matter adhesion inspection device according to claim 21, characterized in that: The measuring device measures the resistance value of the conductor pattern.

23. The foreign matter adhesion inspection device according to claim 21 or 22, characterized in that: The conductor pattern is in a zigzag shape.

24. A method for inspecting foreign matter adhesion, characterized in that: After the pick-up surface of the die chuck is brought into contact with the upper surface of the second conductor layer in the substrate for foreign matter attachment inspection, the physical quantity between the first conductor layer and the second conductor layer is measured, wherein the substrate for foreign matter attachment inspection comprises: the first conductor layer, an insulating layer provided on the first conductor layer, and the second conductor layer provided on the insulating layer, Whether or not foreign matter is attached to the pickup surface is determined based on the physical quantity.

25. The foreign matter adhesion inspection method according to claim 24, characterized in that: The insulating layer is damaged by the foreign matter, and the first conductive layer and the second conductive layer are short-circuited.

26. A method for inspecting foreign matter adhesion, characterized in that: The physical quantity between the conductor layer and the pick-up surface is measured in a state where a pick-up surface formed by a conductor of a die chuck is brought into contact with an upper surface of an insulating layer in a substrate for inspecting foreign matter attachment, wherein the substrate for inspecting foreign matter attachment comprises: the conductor layer, and the insulating layer provided on the conductor layer, Whether or not foreign matter is attached to the pickup surface is determined based on the physical quantity.

27. The foreign matter adhesion inspection method according to claim 26, characterized in that: The insulating layer is damaged by the foreign matter.

28. A method for inspecting foreign matter adhesion, characterized in that: After the pick-up surface of the die chuck is brought into contact with the upper surface of the conductor pattern in the substrate for foreign matter attachment inspection, the physical quantity between one side and the other side of the portion of the conductor pattern contacted by the die chuck is measured, wherein the substrate for foreign matter attachment inspection comprises: an insulating layer, and the linear conductor pattern provided on the insulating layer, Whether or not foreign matter is attached to the pickup surface is determined based on the physical quantity.

29. The foreign matter adhesion inspection method according to claim 28, characterized in that: The conductor pattern is disconnected due to the foreign matter.

30. A method for inspecting foreign matter adhesion, characterized in that: After the pick-up surface of the die chuck is brought into contact with the upper surfaces of a plurality of conductor patterns in a substrate for foreign matter attachment inspection, a physical quantity between the plurality of conductor patterns is measured, wherein the substrate for foreign matter attachment inspection comprises: an insulating layer, and the plurality of conductor patterns disposed on the insulating layer, Whether or not foreign matter is attached to the pickup surface is determined based on the physical quantity.

31. The foreign matter adhesion inspection method according to claim 30, characterized in that: The plurality of conductor patterns are connected by the foreign matter.

32. A method for inspecting foreign matter adhesion, characterized in that: After the pick-up surface of the die chuck is brought into contact with the first and second parts of a substrate for inspecting foreign matter attachment, a physical quantity between one side and the other side of the part in the conductor pattern that the die chuck contacts is measured, wherein the substrate for inspecting foreign matter attachment comprises: an insulating layer, and the conductor pattern that is bent on the upper surface of the insulating layer and has the first and second parts that are adjacent to each other, Whether or not foreign matter is attached to the pickup surface is determined based on the physical quantity.

33. The foreign matter adhesion inspection method according to claim 32, characterized in that: The first portion and the second portion are connected by the foreign object.

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