Cleaning equipment and semiconductor devices

Abstract

This application relates to a cleaning device and a semiconductor device. The cleaning device can be used to clean the eutectic head of a semiconductor device. The cleaning device includes a cleaning table, a polishing component, a brush component, and a driving mechanism. The polishing component and the brush component are both disposed on the cleaning table. The driving mechanism is connected to the cleaning table and is used to move the cleaning table to a waiting position and a working position. In the working position, the cleaning table is located below the eutectic head, the polishing component is used to polish the eutectic head, and the brush component is used to brush the eutectic head.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and in particular to a cleaning device and semiconductor equipment. Background Technology

[0002] With the continuous development of semiconductor technology, chip manufacturing processes are also constantly improving. COF (Chip On Film), as an important packaging technology, is widely used in display driver chips, sensors, and other fields due to its advantages such as high density, thinness, and flexibility. In the COF production process, the die bonder head is a key component used to solder IC (integrated circuit) chips onto the COF using a thermoforming method. Because the equipment operates at a high frequency, typically completing die bonding of one product every 1.5 seconds on average, the die bonder head requires regular maintenance during production to ensure the cleanliness of the working area where it adsorbs the IC, preventing dust, particles, and foreign matter from affecting the die bonding accuracy.

[0003] However, traditional technical solutions suffer from low cleaning efficiency and unsatisfactory cleaning results when cleaning the die bonder.

[0004] The information disclosed above in the background art of this application is only used to understand the background of the concept of this application, and may contain information that does not constitute prior art. Summary of the Invention

[0005] Therefore, in order to address the above problems, it is necessary to provide a cleaning device and a semiconductor device.

[0006] A cleaning apparatus for cleaning the eutectic head of a semiconductor device, the cleaning apparatus comprising:

[0007] Cleaning station;

[0008] A grinding element, which is disposed on the cleaning table;

[0009] A brush assembly, which is disposed on the cleaning table;

[0010] A drive mechanism is connected to the cleaning table and is used to move the cleaning table to a waiting position and a working position. In the working position, the cleaning table is located below the eutectic head. The grinding component is used to grind the eutectic head, and the brush component is used to brush the eutectic head.

[0011] The cleaning device described in this application has at least the following beneficial effects: This cleaning device, through a drive mechanism, can automatically move the cleaning table to the waiting position and the working position, realizing automated cleaning of the eutectic head of semiconductor equipment, reducing manual intervention, and improving production efficiency. The drive mechanism of the cleaning device is connected to the cleaning table, allowing for flexible adjustment of the cleaning table's position to ensure that the grinding and brushing components can effectively contact and clean different parts of the eutectic head, adapting to different models and specifications of semiconductor equipment. In the waiting position, the cleaning table can remain outside the working area of ​​the eutectic head, avoiding interference with the movement and normal operation of the eutectic head. When cleaning of the eutectic head is required, the cleaning table can move to the working position. Because the cleaning table is equipped with grinding and brushing components, it can perform a two-step cleaning of the eutectic head. First, the grinding components grind the eutectic head to remove stubborn impurities from the surface; then, the brushing components further clean residual dust and particles, ensuring the cleanliness of the eutectic head surface. Regular automatic cleaning of the eutectic head effectively removes dust, particles, and foreign matter, preventing these impurities from affecting the working performance of the eutectic head, thereby improving the quality and reliability of semiconductor products. In summary, the cleaning device of this application improves cleaning efficiency and effectiveness through an automated, efficient, and precise cleaning process, thereby ensuring production efficiency and product quality.

[0012] In one embodiment, the working positions include a first working position and a second working position. The cleaning table is configured to move to the first working position and then to the second working position under the drive of the driving mechanism. In the first working position, the grinding element is located below the eutectic head and presses against the end face of the eutectic head for grinding. In the second working position, the brush element is located below the eutectic head and is used to brush the end face of the eutectic head. By dividing the cleaning process into two steps—grinding first in the first working position and then brushing in the second working position—thorough cleaning is ensured. The grinding element can effectively remove stubborn impurities from the end face of the eutectic head, while the brush element can remove fine particles and dust remaining after grinding, thereby achieving a higher cleaning effect.

[0013] In one embodiment, the top of the cleaning station is provided with a first limiting groove and a second limiting groove. The grinding component is detachably embedded in the first limiting groove, and the brush component is detachably embedded in the second limiting groove. The detachable embedding of the grinding component and brush component in the limiting grooves makes their installation and removal very convenient. The design of the limiting grooves ensures the stability and accuracy of the grinding component and brush component during the cleaning process, preventing displacement or loosening of components during cleaning, thereby ensuring the consistency and reliability of the cleaning effect. Depending on specific cleaning needs, grinding components and brush components of different materials and shapes can be selected, enhancing the adaptability and flexibility of the cleaning device. When the grinding component or brush component is worn or damaged, new components can be quickly replaced, reducing equipment downtime and improving maintenance efficiency. The detachable design allows the cleaning device to adapt to different types and specifications of grinding components and brush components. Through convenient replacement and maintenance, wear problems of grinding components and brush components can be addressed promptly, avoiding a decrease in cleaning effect and equipment damage caused by component wear, thereby extending the service life of the cleaning device and semiconductor equipment.

[0014] In one embodiment, the cleaning device further includes at least two hooks, which are detachably connected to the cleaning table and distributed on both sides of the grinding element. The hooks engage with the side of the grinding element facing away from the first limiting groove to fix the grinding element within the first limiting groove. By providing the hooks, the grinding element can be firmly fixed within the first limiting groove, preventing displacement or loosening during cleaning, ensuring the stability and consistency of the grinding process, thereby improving the cleaning effect. The detachable connection between the hooks and the cleaning table makes the installation and removal of the grinding element more convenient. When the grinding element needs to be replaced, simply loosening the hooks allows for easy removal, simplifying the operation process and saving time and labor costs.

[0015] In one embodiment, the brush assembly includes a fixing plate and multiple brush heads. The fixing plate is detachably embedded in the second limiting groove. The multiple brush heads are spaced apart and connected to the side of the fixing plate facing away from the second limiting groove. The brush heads are used to brush the end face of the eutectic head. The detachable embedding of the fixing plate in the second limiting groove makes the installation and removal of the brush assembly very convenient. When the brush heads are worn or damaged, new brush assemblies can be quickly replaced, reducing equipment downtime and improving maintenance efficiency. The spaced distribution of multiple brush heads on the side of the fixing plate facing away from the second limiting groove ensures that the brush heads are evenly distributed in the cleaning area, providing a comprehensive and effective brushing of the end face of the eutectic head, ensuring consistent and reliable cleaning results.

[0016] In one embodiment, the first limiting groove and the second limiting groove are arranged side by side, and the grinding element and the brush element are arranged side by side.

[0017] In one embodiment, the cleaning device further includes a dust-collecting assembly disposed on the cleaning table. The dust-collecting assembly includes a suction pipe and a dust-collecting frame connected to the suction pipe. A suction hole is formed within the dust-collecting frame, and the suction hole communicates with the suction pipe. The dust-collecting frame, the grinding element, and the brush are all disposed on the top of the cleaning table. The dust-collecting frame encloses a dust-blocking groove, which surrounds the grinding element and the brush. A dust-collecting channel communicating with the suction hole is formed on the wall of the dust-blocking groove. The dust-collecting channel extends along the direction surrounding the grinding element and the brush on the wall of the dust-blocking groove. By incorporating the dust-collecting assembly, dust and debris generated during grinding and brushing can be promptly sucked and collected during the cleaning process, preventing their accumulation inside and on the surface of the equipment. This reduces wear and corrosion, thereby extending the service life of the cleaning device and related equipment. It also maintains a clean working environment, reduces dust suspension in the air, lowers the risk of operators inhaling dust, and improves the safety and health of the working environment. The dust-blocking groove formed by the suction frame effectively surrounds the grinding and brush components, limiting the spread of dust. The suction channel design ensures that dust can be quickly sucked away by the suction pipe. The suction channel extends along the direction surrounding the grinding and brush components and can be adjusted according to specific cleaning needs and equipment layout, further reducing the spread of dust in the air and improving the hygiene level of the working environment.

[0018] In one embodiment, the cleaning station includes a frame, a first support, and a second support. The grinding element and the brush are disposed on top of the first support. The first support is nested within the second support, and the second support is nested within the frame. The first support is rotatable relative to the second support in a first rotational direction, and the second support is rotatable relative to the frame in a second rotational direction, thereby adjusting the grinding surface of the grinding element to be parallel to the end face of the eutectic head. The nested design of the first and second supports enables multi-directional adjustment. The first and second supports rotate relative to each other in different rotational directions, allowing the grinding surface of the grinding element to be precisely adjusted to be parallel to the end face of the eutectic head, ensuring high precision in the grinding and cleaning process. Precise adjustment ensures that the grinding element and the end face of the eutectic head always maintain optimal contact, reducing excessive wear caused by non-parallel contact and thus extending the service life of the equipment.

[0019] In one embodiment, the plane containing the first rotation direction is perpendicular to the plane containing the second rotation direction. By designing the planes containing the first and second rotation directions to be perpendicular, the cleaning device can be adjusted in both directions. This multi-dimensional adjustment capability allows the device to more precisely adjust the grinding surface of the abrasive piece to be parallel to the end face of the eutectic head.

[0020] In one embodiment, the cleaning station further includes a first rotating shaft, a first adjusting member, a second rotating shaft, and a second adjusting member. The first support is rotatably connected to the second support along the first rotation direction via the first rotating shaft, and the second support is rotatably connected to the frame along the second rotation direction via the second rotating shaft. The first adjusting member is used to adjust the rotation angle of the first support relative to the second support in the first rotation direction, and the second adjusting member is used to adjust the rotation angle of the second support relative to the frame in the second rotation direction. Through the combination of the first rotating shaft and the first adjusting member, and the second rotating shaft and the second adjusting member, multi-dimensional precise adjustment is achieved. The adjusting member can precisely control the rotation angle of the support, ensuring the parallelism between the grinding surface and the eutectic head end face. Precise angle adjustment ensures that the grinding element and the brush can work in the optimal position, avoiding cleaning dead corners and uneven cleaning, and improving the overall cleaning effect. Precise adjustment ensures the optimal contact state between the grinding element and the eutectic head end face, reducing excessive wear caused by poor contact, thereby extending the service life of the equipment.

[0021] In one embodiment, the first axis and the second axis are perpendicular to each other.

[0022] In one embodiment, the first adjusting member is an eccentric rod, comprising a first eccentric end and a first operating end that are spaced apart from each other. A first adjusting hole is provided on the first support, the first eccentric end extends into the first adjusting hole, and the first operating end is rotatably inserted through the second support and used for operation to drive the first eccentric end to rotate within the first adjusting hole. The outer circumferential surface of the first eccentric end abuts against the wall of the first adjusting hole to drive the first support to rotate around the first axis, thereby adjusting the rotation angle of the first support relative to the second support in the first rotation direction. The eccentric rod design provides precise angle adjustment. By rotating the operating end, the operator can accurately adjust the angle of the first support, ensuring that the grinding surface of the grinding element is parallel to the end face of the eutectic head. The abutment between the eccentric end and the wall of the adjusting hole provides stable support, avoiding shaking and offset during adjustment, and ensuring the stability and reliability of the grinding and cleaning process. Precise angle adjustment ensures that the grinding element and the brush can work in the optimal position, avoiding cleaning dead corners and uneven cleaning, and improving the overall cleaning effect.

[0023] In one embodiment, the second adjusting member is an eccentric rod, comprising a second eccentric end and a second operating end that are spaced apart from each other. The second support has a second adjusting hole, the second eccentric end extends into the second adjusting hole, and the second operating end is rotatably inserted through the frame and used for operation to drive the second eccentric end to rotate within the second adjusting hole. The outer circumferential surface of the second eccentric end abuts against the wall of the second adjusting hole to drive the second support to rotate around the second axis, thereby adjusting the rotation angle of the second support relative to the frame in the second rotation direction. The eccentric rod design of the second eccentric member provides precise angle adjustment. By rotating the second operating end, the operator can accurately adjust the angle of the second support, ensuring that the grinding surface of the grinding element is parallel to the end face of the eutectic head. The abutment between the second eccentric end and the wall of the adjusting hole provides stable support, avoiding shaking and offset during adjustment, and ensuring the stability and reliability of the grinding and cleaning process. Precise angle adjustment ensures that the grinding element and the brush can work in the optimal position, avoiding cleaning dead spots and uneven cleaning, and improving the overall cleaning effect.

[0024] In one embodiment, the cleaning device further includes a fastener. The frame has a first positioning hole, and the second bracket has a second positioning hole. The fastener is pluggably inserted through the first positioning hole and extends into the second positioning hole. When the fastener is pulled out of the second positioning hole, the second bracket can rotate relative to the frame. When the fastener is inserted into the second positioning hole, it restricts the rotation of the second bracket relative to the frame. The fastener design provides an additional fixing means, ensuring that the second bracket will not rotate unexpectedly due to vibration or other external forces during the operation of the cleaning device, thus improving the stability and reliability of the equipment. When the angle of the second bracket needs to be adjusted, the fastener can be pulled out for adjustment, and then inserted back in to secure it. With the fastener pulled out, the angle of the second bracket can be precisely adjusted using a second adjusting member to ensure that the grinding part is parallel to the end face of the eutectic head, improving the cleaning and grinding effect.

[0025] In one embodiment, the driving mechanism includes a first fixed frame, a first driving component, a second fixed frame, and a second driving component. The first driving component is disposed on the first fixed frame and connected to it, driving the first fixed frame to translate along a first direction. The second driving component is disposed on the second fixed frame and connected to the cleaning table, driving the cleaning table to move up and down along a second direction; wherein the first direction and the second direction are perpendicular to each other. The combination of the first and second driving components enables multi-dimensional adjustment of the cleaning device in both horizontal and vertical directions, enhancing the flexibility and adaptability of the equipment. The translational movement of the first driving component and the lifting movement of the second driving component can precisely adjust the position and height of the cleaning device, ensuring the accuracy and effectiveness of the cleaning process. Precise positioning and height adjustment ensure optimal contact between the abrasive workpiece and the surface being cleaned, improving cleaning effect and efficiency.

[0026] This application also provides a semiconductor device including a eutectic head and a cleaning apparatus as described in any of the above embodiments.

[0027] The aforementioned semiconductor equipment, because it includes the cleaning device described in any of the above embodiments, also has at least the following beneficial effects: The cleaning device of this semiconductor equipment can automatically move the cleaning table to the waiting position and the working position via a drive mechanism, realizing automated cleaning of the eutectic head of the semiconductor equipment, reducing manual intervention, and improving production efficiency. The drive mechanism of the cleaning device is connected to the cleaning table, allowing for flexible adjustment of the cleaning table's position to ensure that the grinding and brushing components can effectively contact and clean different parts of the eutectic head, adapting to different models and specifications of semiconductor equipment. In the waiting position, the cleaning table can remain outside the working area of ​​the eutectic head, avoiding interference with the movement and normal operation of the eutectic head. When cleaning of the eutectic head is required, the cleaning table can move to the working position. Since the cleaning table is equipped with grinding and brushing components, it can perform a two-step cleaning of the eutectic head. First, the grinding components grind the eutectic head to remove stubborn impurities from the surface; then, the brushing components further clean residual dust and particles, ensuring the cleanliness of the eutectic head surface. By periodically and automatically cleaning the eutectic head, dust, particles, and foreign matter can be effectively removed, preventing these impurities from affecting the working performance of the eutectic head, thereby improving the quality and reliability of semiconductor products. In summary, the cleaning device of this application improves cleaning efficiency and effectiveness through an automated, efficient, and precise cleaning process, thereby ensuring production efficiency and product quality.

[0028] In one embodiment, the semiconductor device further includes a bonding device and a third driving assembly. Both the cleaning device and the third driving assembly are mounted on the rack. The third driving assembly is connected to the bonding device and drives the eutectic head of the bonding device to translate along a third direction; wherein the first direction, the second direction, and the third direction are perpendicular to each other. The combination of the first, second, and third driving assemblies enables multi-dimensional mutual movement between the eutectic head and the cleaning station in three mutually perpendicular directions, enhancing the flexibility and adaptability of the device and ensuring that when the eutectic head needs cleaning, the cleaning station and its grinding and brushing components are accurately positioned below the eutectic head.

[0029] In one embodiment, the drive mechanism further includes a first guide rail and a second guide rail. The first guide rail is disposed on the first fixed frame and parallel to the first direction. The second fixed frame is at least partially slidably disposed on the first guide rail. The second guide rail is disposed on the second fixed frame and parallel to the second direction. The cleaning table is at least partially slidably disposed on the second guide rail. The guide rail design provides additional support and guidance, enhancing the stability of the equipment during translation and lifting, and reducing vibration and errors during movement. By enhancing stability and improving accuracy, the guide rail design improves the overall performance of cleaning and bonding operations, ensuring an efficient workflow. Attached Figure Description

[0030] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 This is a schematic diagram of a cleaning device provided in one embodiment of this application.

[0032] Figure 2 This is a partially enlarged perspective view of a cleaning apparatus provided in one embodiment of this application.

[0033] Figure 3 This is a structural schematic diagram of the cleaning table, grinding parts, brush parts, and other related components of a cleaning device provided in one embodiment of this application.

[0034] Figure 4 An exploded view of the cleaning table, grinding parts, brushes and other related components of a cleaning device provided in one embodiment of this application.

[0035] Figure 5This is another exploded view of the cleaning table, grinding parts, brush parts and other related components of the cleaning device provided in one embodiment of this application.

[0036] Figure 6 A perspective sectional view of the cleaning table of a cleaning apparatus provided in one embodiment of this application.

[0037] Figure 7 This is a schematic diagram of the structure of a cleaning station of a cleaning device provided in one embodiment of this application.

[0038] Figure 8 An exploded view of a cleaning table of a cleaning apparatus provided in one embodiment of this application.

[0039] Figure 9 This is a perspective view of a cleaning table of a cleaning device provided in one embodiment of this application.

[0040] Figure 10 A cross-sectional view of the cleaning table of a cleaning apparatus provided in one embodiment of this application.

[0041] Figure 11 This is a schematic diagram of the structure of an adjustment member provided in one embodiment of this application.

[0042] Figure 12 This is another schematic diagram of a cleaning device provided in one embodiment of this application.

[0043] Figure label:

[0044] 10. Cleaning device; 100. Cleaning table; 110. First bracket; 111. First limiting groove; 112. Second limiting groove; 113. Hook; 114. First adjusting hole; 120. Second bracket; 121. Second adjusting hole; 122. Second positioning hole; 130. Frame; 131. First positioning hole; 141. First rotating shaft; 142. Second rotating shaft; 151. First adjusting component; 1511. First eccentric end; 1512. First operating end; 152. Second adjusting component; 1521. Second eccentric end; 1522. Two operating ends; 200, grinding part; 300, brush part; 310, fixing plate; 320, brush head; 400, drive mechanism; 411, first fixing frame; 412, first drive assembly; 421, second fixing frame; 422, second drive assembly; 431, first guide rail; 432, second guide rail; 500, dust collection assembly; 510, suction pipe; 520, dust collection frame; 521, suction hole; 522, dust blocking groove; 523, dust collection channel; 600, fastener; D1, first rotation direction; D2, second rotation direction. Detailed Implementation

[0045] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0046] Please see Figure 1 and Figure 2 In some embodiments, this application provides a cleaning device 10 for cleaning the eutectic head (not shown) of a semiconductor device. The cleaning device 10 includes a cleaning table 100, a grinding element 200, a brush element 300, and a driving mechanism 400. The grinding element 200 and the brush element 300 are both disposed on the cleaning table 100. The driving mechanism is connected to the cleaning table 100 and drives the cleaning table 100 to a waiting position and a working position. In the working position, the cleaning table 100 is located below the eutectic head, the grinding element 200 is used to grind the eutectic head, and the brush element 300 is used to brush the eutectic head. The grinding element 200 may include, but is not limited to, an oilstone, and the brush element 300 may include, but is not limited to, heat-resistant silicone bristles or heat-resistant ceramic fiber bristles.

[0047] The cleaning device 10 described in this application has at least the following beneficial effects: The cleaning device 10, through the drive mechanism 400, can automatically move the cleaning table 100 to the waiting position and the working position, realizing automated cleaning of the eutectic head of semiconductor equipment, reducing manual intervention, and improving production efficiency. The drive mechanism 400 of the cleaning device 10 is connected to the cleaning table 100, allowing for flexible adjustment of the cleaning table 100's position to ensure that the grinding element 200 and the brush element 300 can effectively contact and clean different parts of the eutectic head, adapting to different models and specifications of semiconductor equipment. In the waiting position, the cleaning table 100 can remain outside the working area of ​​the eutectic head, avoiding interference with the movement and normal operation of the eutectic head. When cleaning of the eutectic head is required, the cleaning table 100 can move to the working position. Since the cleaning table 100 is equipped with the grinding element 200 and the brush element 300, it can perform a two-step cleaning of the eutectic head. First, the eutectic head is ground by the grinding element 200 to remove stubborn impurities from its surface. Then, the brush element 300 further cleans away residual dust and particles, ensuring the cleanliness of the eutectic head surface. Regular automatic cleaning of the eutectic head effectively removes dust, particles, and foreign matter, preventing these impurities from affecting the eutectic head's performance, thereby improving the quality and reliability of semiconductor products. In summary, the cleaning device 10 of this application improves cleaning efficiency and effectiveness through an automated, efficient, and precise cleaning process, thereby ensuring production efficiency and product quality.

[0048] Specifically, in some embodiments, the working position includes a first working position and a second working position. The cleaning table 100 is configured to move to the first working position and then to the second working position under the drive of the drive mechanism 400. In the first working position, the grinding element 200 is located below the eutectic head and presses against the end face of the eutectic head for grinding. In the second working position, the brush element 300 is located below the eutectic head and is used to brush the end face of the eutectic head. By dividing the cleaning process into two steps, grinding is performed first in the first working position and then brushing is performed in the second working position, thorough cleaning is ensured. The grinding element 200 can effectively remove stubborn impurities on the end face of the eutectic head, while the brush element 300 can remove fine particles and dust remaining after grinding, thereby achieving a higher cleaning effect.

[0049] Please see Figure 3 In some embodiments, the top of the cleaning table 100 is provided with a first limiting groove 111 and a second limiting groove 112. The grinding component 200 is detachably embedded in the first limiting groove 111, and the brush component 300 is detachably embedded in the second limiting groove 112. The detachable embedding of the grinding component 200 and the brush component 300 in the limiting grooves makes their installation and removal very convenient. The design of the limiting grooves ensures the stability and accuracy of the grinding component 200 and the brush component 300 during the cleaning process, preventing displacement or loosening of components during cleaning, thereby ensuring the consistency and reliability of the cleaning effect. Depending on specific cleaning needs, grinding components 200 and brush components 300 of different materials and shapes can be selected to enhance the adaptability and flexibility of the cleaning device 10. When the grinding component 200 or the brush component 300 is worn or damaged, new components can be quickly replaced, reducing equipment downtime and improving maintenance efficiency. The detachable design allows the cleaning device 10 to accommodate different types and sizes of abrasive parts 200 and brushes 300. Through convenient replacement and maintenance, wear and tear on the abrasive parts 200 and brushes 300 can be addressed promptly, preventing decreased cleaning effectiveness and equipment damage due to component wear, thereby extending the service life of the cleaning device 10 and the semiconductor equipment.

[0050] Specifically, such as Figure 3 and Figure 4As shown, in some embodiments, the cleaning device 10 further includes at least two hooks 113, which are detachably connected to the cleaning table 100 and distributed on both sides of the grinding element 200. The hooks 113 engage with the side of the grinding element 200 facing away from the first limiting groove 111 to fix the grinding element 200 within the first limiting groove 111. By providing the hooks 113, the grinding element 200 can be firmly fixed within the first limiting groove 111, preventing displacement or loosening during cleaning, ensuring the stability and consistency of the grinding process, thereby improving the cleaning effect. The detachable connection between the hooks 113 and the cleaning table 100 makes the installation and removal of the grinding element 200 more convenient. When the grinding element 200 needs to be replaced, it can be easily removed simply by loosening the hooks 113, simplifying the operation process and saving time and labor costs.

[0051] Specifically, such as Figure 3 As shown, in some embodiments, the brush component 300 includes a fixing plate 310 and a plurality of brush heads 320. The fixing plate 310 is detachably embedded in the second limiting groove 112. The plurality of brush heads 320 are spaced apart and connected to the side of the fixing plate 310 facing away from the second limiting groove 112. The brush heads 320 are used to brush the end face of the eutectic head. The detachable embedding of the fixing plate 310 in the second limiting groove 112 makes the installation and removal of the brush component 300 very convenient. When the brush head 320 is worn or damaged, a new brush component 300 can be quickly replaced, reducing equipment downtime and improving maintenance efficiency. The spaced distribution of the plurality of brush heads 320 and their connection to the side of the fixing plate 310 facing away from the second limiting groove 112 ensures that the brush heads 320 are evenly distributed in the cleaning area, providing a comprehensive and effective brushing of the end face of the eutectic head, ensuring the consistency and reliability of the cleaning effect.

[0052] Specifically, such as Figure 3 and Figure 4 As shown, in some embodiments, the first limiting groove 111 and the second limiting groove 112 are arranged side by side, and the grinding member 200 and the brush member 300 are arranged side by side.

[0053] Please see Figure 3 , Figure 4 , Figure 5 and Figure 6In some embodiments, the cleaning device 10 further includes a vacuuming assembly 500 disposed on the cleaning table 100. The vacuuming assembly 500 includes a suction pipe 510 and a vacuuming frame 520 connected to the suction pipe 510. A suction hole 521 is provided in the vacuuming frame 520, and the suction hole 521 communicates with the suction pipe 510. The vacuuming frame 520, the grinding element 200, and the brush element 300 are all disposed on the top of the cleaning table 100. The vacuuming frame 520 forms a dust-blocking groove 522, which surrounds the grinding element 200 and the brush element 300. A vacuuming channel 523 communicating with the suction hole 521 is provided on the groove wall of the dust-blocking groove 522. The vacuuming channel 523 extends along the direction surrounding the grinding element 200 and the brush element 300 on the groove wall of the dust-blocking groove 522. By incorporating the dust extraction component 500, dust and debris generated during the grinding and brushing processes can be promptly extracted and collected, preventing their accumulation inside and on the surface of the equipment. This reduces wear and corrosion, extending the service life of the cleaning device 10 and related equipment. It also maintains a clean working environment, reduces airborne dust, lowers the risk of dust inhalation for operators, and improves the safety and health of the work environment. The dust-blocking groove 522 formed by the dust extraction frame 520 effectively surrounds the grinding component 200 and the brush component 300, limiting the spread of dust. The design of the dust extraction channel 523 ensures that dust can be quickly sucked away by the suction pipe 510. The dust extraction channel 523 extends along the direction surrounding the grinding component 200 and the brush component 300, and can be adjusted according to specific cleaning needs and equipment layout, further reducing airborne dust and improving the hygiene level of the working environment.

[0054] Please see Figure 7 , Figure 8 , Figure 9 and Figure 10In some embodiments, the cleaning station 100 includes a frame 130, a first support 110, and a second support 120. The grinding element 200 and the brush 300 are disposed on top of the first support 110. The first support 110 is nested within the second support 120, and the second support 120 is nested within the frame 130. The first support 110 is rotatable relative to the second support 120 in a first rotation direction D1, and the second support 120 is rotatable relative to the frame 130 in a second rotation direction D2, so as to adjust the grinding surface of the grinding element 200 to be parallel to the end face of the eutectic head. The nested design of the first support 110 and the second support 120 achieves multi-directional adjustment capability. The first support 110 and the second support 120 rotate relative to each other in different rotation directions, allowing the grinding surface of the grinding element 200 to be precisely adjusted to be parallel to the end face of the eutectic head, ensuring high precision in the grinding and cleaning process. Through precise adjustment, the end face of the grinding part 200 and the eutectic head is always kept in optimal contact, reducing excessive wear caused by non-parallel contact and thus extending the service life of the equipment.

[0055] Specifically, in some embodiments, the plane containing the first rotation direction D1 is perpendicular to the plane containing the second rotation direction D2. By designing the planes containing the first rotation direction D1 and the second rotation direction D2 to be perpendicular to each other, the cleaning device 10 can be adjusted in two directions. This multi-dimensional adjustment capability allows the device to more precisely adjust the grinding surface of the grinding piece 200 to be parallel to the end face of the eutectic head.

[0056] Specifically, such as Figure 9 and Figure 10As shown, in some embodiments, the cleaning station 100 further includes a first rotating shaft 141, a first adjusting member 151, a second rotating shaft 142, and a second adjusting member 152. The first support 110 is rotatably connected to the second support 120 along the first rotation direction D1 via the first rotating shaft 141. The second support 120 is rotatably connected to the frame 130 along the second rotation direction D2 via the second rotating shaft 142. The first adjusting member 151 is used to adjust the rotation angle of the first support 110 relative to the second support 120 in the first rotation direction D1, and the second adjusting member 152 is used to adjust the rotation angle of the second support 120 relative to the frame 130 in the second rotation direction D2. Through the combination of the first rotating shaft 141 and the first adjusting member 151, and the second rotating shaft 142 and the second adjusting member 152, multi-dimensional precise adjustment is achieved. The adjusting members can precisely control the rotation angle of the support, ensuring the parallelism between the grinding surface and the eutectic head end face. Precise angle adjustment ensures that the grinding element 200 and the brush element 300 operate in the optimal position, avoiding cleaning dead spots and uneven cleaning, and improving the overall cleaning effect. Precise adjustment also ensures optimal contact between the grinding element 200 and the eutectic head end face, reducing excessive wear caused by poor contact and thus extending the service life of the equipment.

[0057] Specifically, such as Figure 9 and Figure 10 As shown, in some embodiments, the first rotating shaft 141 and the second rotating shaft 142 are perpendicular to each other.

[0058] Furthermore, such as Figure 9As shown, in some embodiments, the first adjusting member 151 is an eccentric rod. The first adjusting member 151 includes a first eccentric end 1511 and a first operating end 1512 that are far apart from each other. The first support 110 is provided with a first adjusting hole 114. The first eccentric end 1511 extends into the first adjusting hole 114. The first operating end 1512 is rotatably disposed through the second support 120 and is used for operation to drive the first eccentric end 1511 to rotate within the first adjusting hole 114. The outer peripheral surface of the first eccentric end 1511 abuts against the hole wall of the first adjusting hole 114 to drive the first support 110 to rotate around the first rotating shaft 141, thereby adjusting the rotation angle of the first support 110 relative to the second support 120 in the first rotation direction D1. The eccentric rod design can provide fine angle adjustment. By rotating the operating end, the operator can precisely adjust the angle of the first support 110 to ensure that the grinding surface of the grinding piece 200 is parallel to the end face of the eutectic head. The contact between the eccentric end and the wall of the adjustment hole provides stable support, preventing shaking and offset during adjustment and ensuring the stability and reliability of the grinding and cleaning process. Precise angle adjustment ensures that the grinding component 200 and the brush component 300 operate in the optimal position, avoiding cleaning dead zones and uneven cleaning, thus improving the overall cleaning effect.

[0059] Furthermore, such as Figure 10 As shown, in some embodiments, the second adjusting member 152 is an eccentric rod. The second adjusting member 152 includes a second eccentric end 1521 and a second operating end 1522 that are spaced apart from each other. The second support 120 is provided with a second adjusting hole 121. The second eccentric end 1521 extends into the second adjusting hole 121. The second operating end 1522 is rotatably inserted through the frame 130 and is used for operation to drive the second eccentric end 1521 to rotate within the second adjusting hole 121. The outer peripheral surface of the second eccentric end 1521 abuts against the hole wall of the second adjusting hole 121 to drive the second support 120 to rotate around the second rotating shaft 142, thereby adjusting the rotation angle of the second support 120 relative to the frame 130 in the second rotation direction D2. The design of the second eccentric member as an eccentric rod can provide fine angle adjustment. By rotating the second operating end 1522, the operator can precisely adjust the angle of the second support 120 to ensure that the grinding surface of the grinding piece 200 is parallel to the end face of the eutectic head. The contact between the second eccentric end 1521 and the wall of the adjustment hole provides stable support, preventing shaking and offset during adjustment and ensuring the stability and reliability of the grinding and cleaning process. Precise angle adjustment ensures that the grinding component 200 and the brush component 300 operate in the optimal position, avoiding cleaning dead zones and uneven cleaning, thus improving the overall cleaning effect.

[0060] Furthermore, such as Figure 8 and Figure 10 As shown, in some embodiments, the cleaning device 10 further includes a fastener 600. The frame 130 has a first positioning hole 131, and the second bracket 120 has a second positioning hole 122. The fastener 600 is pluggably inserted into the first positioning hole 131 and extends into the second positioning hole 122. When the fastener 600 is pulled out of the second positioning hole 122, the second bracket 120 can rotate relative to itself. When the fastener 600 is inserted into the second positioning hole 122, it restricts the rotation of the second bracket 120 relative to the frame 130. The design of the fastener 600 provides an additional fixing means, ensuring that the second bracket 120 will not rotate unexpectedly due to vibration or other external forces when the cleaning device 10 is operating, thus improving the stability and reliability of the device. When the angle of the second bracket 120 needs to be adjusted, the fastener 600 can be pulled out for adjustment, and then reinserted to secure it. With the fastener 600 pulled out, the angle of the second bracket 120 can be precisely adjusted by the second adjusting member 152 to ensure that the grinding part 200 is parallel to the end face of the eutectic head, thereby improving the cleaning and grinding effect.

[0061] Please see Figure 12 In some embodiments, the drive mechanism 400 includes a first fixed frame 411, a first drive component 412, a second fixed frame 421, and a second drive component 422. The first drive component 412 is disposed on the first fixed frame 411, connected to the first fixed frame 411, and used to drive the first fixed frame 411 to perform translational movement along a first direction. The second drive component 422 is disposed on the second fixed frame 421, connected to the cleaning table 100, and used to drive the cleaning table 100 to perform lifting and lowering movement along a second direction; wherein the first direction and the second direction are perpendicular to each other. Through the combination of the first drive component 412 and the second drive component 422, multi-dimensional adjustment of the cleaning device 10 in the horizontal and vertical directions is achieved, enhancing the flexibility and adaptability of the equipment. The translational movement of the first drive component 412 and the lifting and lowering movement of the second drive component 422 can precisely adjust the position and height of the cleaning device 10, ensuring the accuracy and effectiveness of the cleaning process. By precisely positioning and adjusting the height, optimal contact between the abrasive part 200 and the surface being cleaned is ensured, improving cleaning effectiveness and efficiency. The specific form of the drive assembly is not limited here; the first drive assembly 412 and the second drive assembly 422 may include, but are not limited to, cylinders, motors, electric actuators, etc.

[0062] Specifically, such as Figure 12As shown, in some embodiments, the drive mechanism 400 further includes a first guide rail 431 and a second guide rail 432. The first guide rail 431 is disposed on the first fixed frame 411 and parallel to the first direction. The second fixed frame 421 is at least partially slidably disposed on the first guide rail 431, and the second guide rail 432 is disposed on the second fixed frame 421 and parallel to the second direction. The cleaning table 100 is at least partially slidably disposed on the second guide rail 432. The guide rail design provides additional support and guidance, enhancing the stability of the equipment during translation and lifting, and reducing vibration and errors during movement. By enhancing stability and improving accuracy, the guide rail design improves the overall performance of cleaning and bonding operations, ensuring an efficient workflow.

[0063] In addition, this application also provides a semiconductor device (not shown) including a eutectic head and a cleaning device 10 as described in any of the above embodiments.

[0064] The aforementioned semiconductor equipment, because it includes the cleaning device 10 described in any of the above embodiments, also has at least the following beneficial effects: the cleaning device 10 of this semiconductor equipment can automatically move the cleaning table 100 to the waiting position and the working position through the drive mechanism 400, realizing automated cleaning of the eutectic head of the semiconductor equipment, reducing manual intervention, and improving production efficiency. The drive mechanism 400 of the cleaning device 10 is connected to the cleaning table 100, and the position of the cleaning table 100 can be flexibly adjusted to ensure that the grinding element 200 and the brush element 300 can effectively contact and clean different parts of the eutectic head, adapting to different models and specifications of semiconductor equipment. In the waiting position, the cleaning table 100 can stay outside the working area of ​​the eutectic head to avoid interfering with the movement and normal operation of the eutectic head. When the eutectic head needs to be cleaned, the cleaning table 100 can move to the working position. Since the cleaning table 100 is equipped with the grinding element 200 and the brush element 300, it can perform two-step cleaning of the eutectic head. First, the eutectic head is ground by the grinding element 200 to remove stubborn impurities from its surface. Then, the brush element 300 further cleans away residual dust and particles, ensuring the cleanliness of the eutectic head surface. Regular automatic cleaning of the eutectic head effectively removes dust, particles, and foreign matter, preventing these impurities from affecting the eutectic head's performance, thereby improving the quality and reliability of semiconductor products. In summary, the cleaning device 10 of this application improves cleaning efficiency and effectiveness through an automated, efficient, and precise cleaning process, thereby ensuring production efficiency and product quality.

[0065] Furthermore, in some embodiments, the semiconductor device further includes a bonding device and a third driving assembly. Both the cleaning device 10 and the third driving assembly are mounted on the rack. The third driving assembly is connected to the bonding device and drives the eutectic head of the bonding device to translate along a third direction; wherein the first direction, the second direction, and the third direction are perpendicular to each other. Through the combination of the first, second, and third driving assemblies, multi-dimensional mutual movement between the eutectic head and the cleaning station 100 in three mutually perpendicular directions is achieved, enhancing the flexibility and adaptability of the device and ensuring that when the eutectic head needs cleaning, the cleaning station 100 and its grinding components 200 and brushes 300 are accurately positioned below the eutectic head.

[0066] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0067] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

[0068] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0069] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0070] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0071] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0072] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0073] In the description of this specification, references to terms such as "an embodiment," "another implementation," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiment or example. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

Claims

1. A cleaning apparatus for cleaning the eutectic head of a semiconductor device, characterized in that, The cleaning device includes: Cleaning station; A grinding element, which is disposed on the cleaning table; A brush assembly, which is disposed on the cleaning table; A drive mechanism is connected to the cleaning table and is used to drive the cleaning table to a waiting position and a working position. In the working position, the cleaning table is located below the eutectic head. The grinding element is used to grind the eutectic head, and the brush element is used to brush the eutectic head. The cleaning station includes a frame, a first support, and a second support. The grinding element and the brush are located on top of the first support. The first support is nested inside the second support, and the second support is nested inside the frame. The first support can rotate relative to the second support in a first rotation direction, and the second support can rotate relative to the frame in a second rotation direction, so as to adjust the grinding surface of the grinding element to be parallel to the end face of the eutectic head.

2. The cleaning device according to claim 1, characterized in that, The working positions include a first working position and a second working position. The cleaning table is configured to move to the first working position and then to the second working position under the drive of the drive mechanism. In the first working position, the grinding element is located below the eutectic head and presses against the end face of the eutectic head for grinding. In the second working position, the brush is located below the eutectic head and is used to brush the end face of the eutectic head.

3. The cleaning device according to claim 1, characterized in that, The top of the cleaning table is provided with a first limiting groove and a second limiting groove. The grinding part is detachably embedded in the first limiting groove, and the brush part is detachably embedded in the second limiting groove.

4. The cleaning device according to claim 3, characterized in that, The cleaning device further includes at least two hooks, which are detachably connected to the cleaning table and distributed on both sides of the grinding element. The at least two hooks engage with the side of the grinding element facing away from the first limiting groove to fix the grinding element in the first limiting groove. And / or, the brushing component includes a fixing plate and a plurality of brush heads. The fixing plate is detachably embedded in the second limiting groove. The plurality of brush heads are spaced apart and are all connected to the side of the fixing plate facing away from the second limiting groove. The brush heads are used to brush the end face of the eutectic head. And / or, the first limiting groove and the second limiting groove are arranged side by side, and the grinding part and the brush part are arranged side by side.

5. The cleaning device according to claim 1, characterized in that, The cleaning device further includes a vacuuming assembly disposed on the cleaning table. The vacuuming assembly includes a suction pipe and a vacuuming frame connected to the suction pipe. A suction hole is provided in the vacuuming frame and the suction hole communicates with the suction pipe. The vacuuming frame, the grinding element, and the brush are all disposed on the top of the cleaning table. The vacuuming frame forms a dust-blocking groove, which surrounds the grinding element and the brush. A vacuuming channel communicating with the suction hole is provided on the groove wall of the dust-blocking groove. The vacuuming channel extends along the direction surrounding the grinding element and the brush on the groove wall of the dust-blocking groove.

6. The cleaning device according to claim 1, characterized in that, The cleaning station further includes a first rotating shaft, a first adjusting member, a second rotating shaft, and a second adjusting member. The first support is rotatably connected to the second support along the first rotation direction via the first rotating shaft, and the second support is rotatably connected to the frame along the second rotation direction via the second rotating shaft. The first adjusting member is used to adjust the rotation angle of the first support relative to the second support in the first rotation direction, and the second adjusting member is used to adjust the rotation angle of the second support relative to the frame in the second rotation direction.

7. The cleaning device according to claim 6, characterized in that, The first rotating shaft and the second rotating shaft are perpendicular to each other.

8. The cleaning device according to claim 6, characterized in that, The plane containing the first rotation direction is perpendicular to the plane containing the second rotation direction. And / or, the first adjusting member is an eccentric rod, the first adjusting member includes a first eccentric end and a first operating end that are far apart from each other, the first bracket is provided with a first adjusting hole, the first eccentric end extends into the first adjusting hole, the first operating end is rotatably inserted through the second bracket and is used for operation to drive the first eccentric end to rotate in the first adjusting hole, the outer peripheral surface of the first eccentric end abuts against the hole wall of the first adjusting hole to drive the first bracket to rotate around the first rotating shaft, so as to adjust the rotation angle of the first bracket relative to the second bracket in the first rotation direction; And / or, the second adjusting member is an eccentric rod, the second adjusting member includes a second eccentric end and a second operating end that are far apart from each other, the second bracket is provided with a second adjusting hole, the second eccentric end extends into the second adjusting hole, the second operating end is rotatably inserted through the frame and is used for operation to drive the second eccentric end to rotate in the second adjusting hole, the outer peripheral surface of the second eccentric end abuts against the hole wall of the second adjusting hole to drive the second bracket to rotate around the second rotating axis, so as to adjust the rotation angle of the second bracket relative to the frame in the second rotation direction; And / or, the cleaning device further includes a fastener, the frame is provided with a first positioning hole, the second bracket is provided with a second positioning hole, the fastener is pluggably inserted through the first positioning hole and extends into the second positioning hole, when the fastener is pulled out from the second positioning hole, the second bracket can rotate relative to the second bracket, when the fastener is inserted into the second positioning hole, the fastener can restrict the rotation of the second bracket relative to the frame.

9. The cleaning device according to claim 1, characterized in that, The driving mechanism includes a first fixed frame, a first driving component, a second fixed frame, and a second driving component. The first driving component is disposed on the first fixed frame and is connected to the first fixed frame to drive the first fixed frame to perform translational movement along a first direction. The second driving component is disposed on the second fixed frame and is connected to the cleaning table to drive the cleaning table to perform lifting and lowering movement along a second direction. The first direction and the second direction are perpendicular to each other.

10. A semiconductor device, characterized in that, It includes a eutectic head and a cleaning device as described in any one of claims 1 to 9.

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